JP4759509B2 - はんだバンプ形成方法及び装置 - Google Patents
はんだバンプ形成方法及び装置 Download PDFInfo
- Publication number
- JP4759509B2 JP4759509B2 JP2006511680A JP2006511680A JP4759509B2 JP 4759509 B2 JP4759509 B2 JP 4759509B2 JP 2006511680 A JP2006511680 A JP 2006511680A JP 2006511680 A JP2006511680 A JP 2006511680A JP 4759509 B2 JP4759509 B2 JP 4759509B2
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- Prior art keywords
- solder
- substrate
- heating
- solder composition
- composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0623—Solder feeding devices for shaped solder piece feeding, e.g. preforms, bumps, balls, pellets, droplets
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27D—DETAILS OR ACCESSORIES OF FURNACES, KILNS, OVENS, OR RETORTS, IN SO FAR AS THEY ARE OF KINDS OCCURRING IN MORE THAN ONE KIND OF FURNACE
- F27D7/00—Forming, maintaining, or circulating atmospheres in heating chambers
- F27D7/02—Supplying steam, vapour, gases, or liquids
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
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- H01L24/12—Structure, shape, material or disposition of the bump connectors prior to the connecting process
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
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- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- H01L2224/04—Structure, shape, material or disposition of the bonding areas prior to the connecting process
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- H01L2224/05138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
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- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Wire Bonding (AREA)
Description
11 はんだ粒子
12 液状体(液体材料)
20 基板
21 基板の表面
22 パッド電極
23 はんだバンプ
23’ はんだ皮膜
30 受け容器(容器)
31 注ぎ容器
32 注ぎ口
40,71 加熱手段
41 熱風
50A,50B はんだバンプ形成装置
60 温調手段
61 冷風
70 リフロー装置
Claims (4)
- 複数のパッド電極が設けられた基板上のはんだ組成物を加熱及びリフローしてはんだバンプを形成するはんだバンプ形成装置において、
前記基板側から前記はんだ組成物を加熱する加熱手段と、
前記はんだ組成物の上方に位置し、前記はんだ組成物の温度制御を行う温調手段とを備え、
前記はんだ組成物は、はんだ粒子と、フラックス成分を含むとともに常温又は加熱により液状になる液体材料との混合物からなるものであり、
前記温調手段は、前記はんだ組成物を輻射熱で加熱する輻射板と、前記輻射板を加熱する加熱部とを有することを特徴とするはんだバンプ形成装置。 - 複数のパッド電極が設けられた基板上のはんだ組成物を加熱及びリフローしてはんだバンプを形成するはんだバンプ形成装置において、
前記基板側から前記はんだ組成物を加熱する加熱手段と、
前記はんだ組成物の上方に位置し、前記はんだ組成物の温度制御を行う温調手段とを備え、
前記はんだ組成物は、はんだ粒子と、フラックス成分を含むとともに常温又は加熱により液状になる液体材料との混合物からなるものであり、
前記温調手段は、前記はんだ組成物の熱を奪う熱吸収板と、前記熱吸収板を冷却する吸熱部とを有することを特徴とするはんだバンプ形成装置。 - 複数のパッド電極が設けられた基板上のはんだ組成物を加熱及びリフローしてはんだバンプを形成するはんだバンプ形成装置において、
前記基板側から前記はんだ組成物を加熱する加熱手段を備え、
前記はんだ組成物は、はんだ粒子と、フラックス成分を含むとともに常温又は加熱により液状になる液体材料との混合物からなるものであり、
前記基板は、容器内のはんだ組成物の中に浸漬され、
前記加熱手段は、前記容器を通して前記基板側から前記はんだ組成物を加熱することを特徴とするはんだバンプ形成装置。 - はんだ粒子と、フラックス成分を含むとともに常温又は加熱により液状になる液体材料との混合物からなるはんだ組成物を、複数のパッド電極を備えた基板に層状に堆積する塗布工程と、
容器内の前記はんだ組成物中に前記基板を浸漬した状態で前記基板側から前記はんだ組成物を加熱してリフローするリフロー工程とを有することを特徴とするはんだバンプ形成方法。
Priority Applications (1)
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JP2006511680A JP4759509B2 (ja) | 2004-03-30 | 2005-03-29 | はんだバンプ形成方法及び装置 |
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JP2004102407 | 2004-03-31 | ||
PCT/JP2005/005909 WO2005096367A1 (ja) | 2004-03-30 | 2005-03-29 | 加熱装置及びリフロー装置,はんだバンプ形成方法及び装置 |
JP2006511680A JP4759509B2 (ja) | 2004-03-30 | 2005-03-29 | はんだバンプ形成方法及び装置 |
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EP (1) | EP1732118B1 (ja) |
JP (1) | JP4759509B2 (ja) |
KR (1) | KR100772306B1 (ja) |
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JPH0739483Y2 (ja) * | 1990-11-15 | 1995-09-13 | 千住金属工業株式会社 | リフロー炉 |
JPH0592257A (ja) | 1990-12-15 | 1993-04-16 | Tamura Seisakusho Co Ltd | 加熱装置 |
JP2871899B2 (ja) | 1991-06-21 | 1999-03-17 | 古河電気工業株式会社 | クリーム半田 |
JP2924888B2 (ja) * | 1997-05-08 | 1999-07-26 | 松下電器産業株式会社 | 電子ユニットの半田付け装置 |
JP3996276B2 (ja) | 1998-09-22 | 2007-10-24 | ハリマ化成株式会社 | ソルダペースト及びその製造方法並びにはんだプリコート方法 |
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JP2002374063A (ja) * | 2001-06-14 | 2002-12-26 | Taichiro Sato | ハンダ吸い取り装置付噴流槽 |
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2005
- 2005-03-29 JP JP2006511680A patent/JP4759509B2/ja not_active Expired - Fee Related
- 2005-03-29 WO PCT/JP2005/005909 patent/WO2005096367A1/ja not_active Application Discontinuation
- 2005-03-29 KR KR1020067019271A patent/KR100772306B1/ko not_active IP Right Cessation
- 2005-03-29 EP EP05727854A patent/EP1732118B1/en not_active Expired - Fee Related
- 2005-03-29 US US10/598,142 patent/US8042727B2/en not_active Expired - Fee Related
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Patent Citations (4)
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JPH1168303A (ja) * | 1997-08-25 | 1999-03-09 | Nihon Dennetsu Keiki Co Ltd | リフローはんだ付け装置 |
JPH11251737A (ja) * | 1998-02-27 | 1999-09-17 | Matsushita Electric Ind Co Ltd | リフロー加熱装置 |
JP2001068848A (ja) * | 1999-08-24 | 2001-03-16 | Furukawa Electric Co Ltd:The | 半田組成物およびそれを用いた半田供給方法 |
JP2002261109A (ja) * | 2001-03-01 | 2002-09-13 | Seiko Instruments Inc | 半導体装置の製造方法 |
Also Published As
Publication number | Publication date |
---|---|
EP1732118A4 (en) | 2009-04-15 |
TWI258197B (en) | 2006-07-11 |
US20070158387A1 (en) | 2007-07-12 |
KR100772306B1 (ko) | 2007-11-02 |
TW200605245A (en) | 2006-02-01 |
WO2005096367A8 (ja) | 2005-11-17 |
EP1732118A1 (en) | 2006-12-13 |
JPWO2005096367A1 (ja) | 2008-02-21 |
EP1732118B1 (en) | 2011-05-11 |
KR20070006785A (ko) | 2007-01-11 |
WO2005096367A1 (ja) | 2005-10-13 |
US8042727B2 (en) | 2011-10-25 |
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