WO2004078362A1 - 塗布装置および有機電子素子の製造方法 - Google Patents
塗布装置および有機電子素子の製造方法 Download PDFInfo
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- WO2004078362A1 WO2004078362A1 PCT/JP2004/002802 JP2004002802W WO2004078362A1 WO 2004078362 A1 WO2004078362 A1 WO 2004078362A1 JP 2004002802 W JP2004002802 W JP 2004002802W WO 2004078362 A1 WO2004078362 A1 WO 2004078362A1
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- Prior art keywords
- organic
- coating
- substrate
- layer
- magnets
- Prior art date
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Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/10—Deposition of organic active material
- H10K71/12—Deposition of organic active material using liquid deposition, e.g. spin coating
- H10K71/13—Deposition of organic active material using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing or screen printing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C13/00—Means for manipulating or holding work, e.g. for separate articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/20—Changing the shape of the active layer in the devices, e.g. patterning
- H10K71/231—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers
- H10K71/233—Changing the shape of the active layer in the devices, e.g. patterning by etching of existing layers by photolithographic etching
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/40—Thermal treatment, e.g. annealing in the presence of a solvent vapour
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/549—Organic PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Definitions
- the present invention provides a coating apparatus for coating an organic electronic material represented by an organic semiconductor material such as an organic electorescent luminescent (EL) material, an organic thin film transistor material, and a solar cell material on a surface of a substrate, and a coating device for applying the same.
- the present invention relates to a method for manufacturing an organic semiconductor element used, and more particularly, to a coating apparatus capable of obtaining an organic layer having a uniform thickness and a method for manufacturing an organic electronic element using the same.
- FPD Flat panel display
- CUT Cathode Ray Tu, be CRT
- PDP plasma display panels other than LCDs
- One of the FPD ⁇ s is the EL display, which has been under development for a relatively long time, but has problems with full color, brightness and longevity, and is not yet widely used. It is.
- '' Inorganic compound thin films were conventionally used as the light-emitting layer, which is the EL layer of the organic i! L element used as an EL display, but EL devices using inorganic compound thin films have high driving voltages. At the same time, the luminous efficiency was low, and only low-luminance display was possible. In recent years, devices using organic compound thin films having low driving voltage and high luminous efficiency have been used as light emitting layers of devices. In addition, organic EL devices (organic electroluminescent devices) using organic compound thin films had a problem in terms of life, but the development of materials for organic light-emitting layers that can extend the life has been promoted. Practical use at a competitive level It has become possible.
- Such an luminescent layer and an EL layer composed of a carrier transport layer, a carrier injection layer, and the like formed adjacent to the luminescent layer as necessary have been formed by a vacuum evaporation method.
- the organic compounds used for vacuum deposition are limited to those having low molecular weight.
- the organic layer crystallizes and aggregates over time.
- the element is deteriorated and has a great influence on the life of the element.
- an organic EL device using a high-molecular organic compound (organic EL material) for the light-emitting layer and the like has been proposed.
- a polymer is dispersed, and one in which a vinyl group is introduced into a carrier-transporting low molecular weight organic compound to polymerize it.
- a wet method using a solvent As a means for forming the EL layer from an organic EL material, a wet method using a solvent is used. As such a wet method, a spin coating method is generally used. However, the spin-coat method has a problem that the use efficiency of the solution is low, and has a problem that it is not suitable for large-area coating.
- the EL layer is manufactured by a wet method, since the thickness of the organic layer, which is the EL layer, after drying is usually about 10 nm to 200 nm, the concentration of the coating liquid is extremely low. Therefore, it is necessary to use a coating liquid having a low viscosity. Therefore, the fluidity in a wet state of the coating film is large, and the film thickness tends to be uneven.
- the coating device using the die coating method is configured to hold a die placed on a substrate in a predetermined direction.
- An organic layer is formed by ejecting the coating liquid from the die outlet onto the substrate surface while sliding along the surface of the substrate.
- an organic layer having a uniform film thickness can be formed by making the ejection amount of the coating liquid ejected from the ejection port of the die the same.
- a coating apparatus using a die coating method a coating apparatus that performs coating by moving a substrate is also known (for example, Patent Document 3 and the like).
- the coating apparatus includes a glass plate supply unit 101 as a supply unit for supplying a glass plate 100, and a substrate floating unit for floating the glass plate 100 with air.
- a coating liquid supply pump 1 07 as a coating liquid supply means, a coating liquid tank 1 08, and a glass plate discharge section 1 109 as a substrate discharge means for discharging the coated glass plate 1 0 It is what you have.
- Patent Document 1 Japanese Patent Application Laid-Open No. 200-103-0 755 (Fig. 1)
- Patent Document 2 Japanese Patent Application Laid-Open No. 2000-2015 5 3 7 9 5
- Patent Literature 3 Japanese Patent Application Laid-Open No. 2002-304 4 6 4 6 3 (001, Fig. 1)
- the above-described coating apparatus can form an organic layer having a uniform thickness when the die or the substrate is moved at a constant speed when the organic layer is formed by sliding the die or the substrate.
- the die cannot slide at a constant speed.
- the uniformity of the die or the substrate is poor (becomes non-uniform)
- the coating liquid is applied unevenly on the surface of the substrate to form an organic layer having a nonuniform film thickness.
- the EL layer is very thin, a small thickness unevenness causes a large thickness error, which may cause uneven light emission.
- it is necessary to increase the speed of the die sliding movement The higher the speed, the greater the effect of the non-uniform velocity. Also, the wider the range of application, the greater the effect of the non-uniformity would be. Disclosure of the invention
- the present invention has been made in view of the above problems, and has as its object to provide a coating apparatus capable of forming an EL layer having a uniform thickness.
- the present invention provides a gantry, a substrate stage provided on the gantry for fixing a substrate, a discharge unit provided on the gantry and discharging a coating material toward the substrate fixed to the substrate stage, a substrate stage, A motor section for sliding at least one of the discharge sections on a gantry; the motor section includes a plurality of magnets arranged linearly so that the polarities are alternately different; And a pair of holding portions for pressing and holding the coating device from above.
- a part of the motor is configured such that the adjacent magnets are alternately different in polarity, and the magnet at one end is pressed along the direction of the adjacent magnet so that the adjacent magnets are in close contact with each other. Since there is no gap between the magnets, there is no gap between the magnets, so the magnets can be moved at a uniform speed. As a result, the substrate stage section and the discharge section slide at a constant speed, and by discharging the organic EL material toward the substrate along with this movement, an organic layer (EL) having a uniform film thickness is formed on the substrate. Layer) is formed.
- a part of the motor is composed of a stay part fixed on a gantry and a movable part reciprocatingly sliding along the stay part, and a plurality of magnets are provided in the stay part. It is a coating apparatus characterized by being used.
- the present invention is the coating apparatus, wherein a plurality of coils are built in the movable section.
- the present invention is the coating apparatus, wherein each magnet has a cylindrical shape having an opening therein, and a single shaft made of a non-magnetic material is inserted into the opening of each cylindrical magnet.
- the present invention is the coating apparatus, characterized in that a non-magnetic tubular body surrounding these magnets is disposed around the plurality of magnets.
- each magnet is formed in a ring shape
- the cylindrical body is formed of a cylindrical pipe having an inner peripheral surface closely contacting an outer peripheral surface of the ring-shaped magnet. is there.
- the pair of holding members are provided such that a contact member provided at one end of the center shaft and in contact with an adjacent magnet and a magnet provided in the other end of the center shaft facing the contact member. And a pressing member for pressing.
- the present invention is the coating apparatus, wherein the pressing member is detachably attached to the other end of the single shaft.
- the present invention is the coating device, wherein the magnet is a permanent magnet made of a magnetic material such as rare earth or ferrite.
- the present invention is the coating apparatus, wherein the discharge unit has an inkjet head, a dispense nozzle, a die head, or a knife blade.
- a non-magnetic tubular body surrounding these magnets is arranged around the plurality of magnets, and the contact member is provided at one end of the central shaft and one end of the tubular body; Is a coating device characterized by being provided detachably at the other end of the shaft and the cylindrical body.
- the present invention is the coating apparatus, wherein the coating material is an organic semiconductor material such as an organic electroluminescent material, an organic thin film transistor material, and a solar cell material.
- the coating material is an organic semiconductor material such as an organic electroluminescent material, an organic thin film transistor material, and a solar cell material.
- the present invention provides a gantry, a substrate stage portion provided on the gantry for fixing a substrate, and a discharger for discharging a coating material toward the substrate provided on the gantry and fixed to the substrate stage portion. And a part of a motor that slides at least one of the substrate stage part and the discharge part on the gantry, and the part of the motor is linearly arranged so that the polarities are alternately different.
- a method of manufacturing an organic electronic device using a coating device having a magnet and a pair of holding portions for pressing and holding these magnets from both ends an organic material is applied by applying a coating material onto a substrate using the coating device.
- a method for manufacturing an organic electronic device comprising a step of forming a layer and manufacturing an organic electronic device.
- the present invention is the method for manufacturing an organic electronic device, wherein the organic electronic device is an organic semiconductor device such as an organic electroluminescent device, an organic thin film transistor, and a solar cell.
- the organic electronic device is an organic semiconductor device such as an organic electroluminescent device, an organic thin film transistor, and a solar cell.
- the present invention is the method for manufacturing an organic electronic device, wherein a thickness error of the organic layer is 2% or less.
- the present invention is the method for manufacturing an organic electronic device, wherein the thickness of the organic layer is 100 nm to 100 nm.
- FIG. 1 is a schematic configuration diagram showing an example of the coating apparatus of the present invention.
- FIG. 2 is a schematic sectional view showing another example of the coating apparatus of the present invention.
- FIG. 3 is a schematic cross-sectional view showing an example of the stay portion of the coating apparatus of the present invention.
- FIG. 4 is an explanatory diagram for explaining the principle of the linear servo motor of the present invention.
- FIG. 5A to FIG. 5C are diagrams showing examples of the connection state of the coils of the linear servo motors of the present invention.
- FIG. 6 is a schematic sectional view showing an example of the organic EL device.
- FIG. 7 is a side view showing a conventional coating apparatus.
- FIG. 8A is a plan view showing a conventional coating apparatus.
- FIG. 8B is a side view showing a conventional coating apparatus.
- FIG. 9 is a schematic sectional view showing an example of the organic thin film transistor.
- FIG. 10 is a schematic sectional view showing an example of a solar cell. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 is a schematic configuration diagram showing an example of the coating apparatus of the present invention.
- the coating apparatus 10 of the present invention includes a gantry 11, a substrate stage 22 provided on the gantry 11 to fix the substrate 1, and a gantry 11 provided on the gantry 11.
- Part 4 is provided.
- the coating apparatus having such a configuration is configured to apply an organic electronic material to the substrate 1 and form the EL layer 6 of the organic EL element 5.
- the organic electronic material in the present invention is not particularly limited as long as it is an organic material used for generally known organic electronic devices.
- organic semiconductor materials such as organic EL materials, organic thin film transistor materials, and solar cell materials Materials and the like.
- the organic electronic material application apparatus of the present invention can apply the organic EL material to the substrate 1 and form the EL layer 6 of the organic EL element 5 as shown in FIG. 6, for example.
- the organic EL element 5 has a generally known structure, and is formed by sequentially laminating a first electrode layer 7, an EL layer 6, and a second electrode layer 8 on a substrate 1.
- a substrate 1 also serves as the first electrode layer 7
- an EL layer 6 is laminated on the substrate 1
- another substrate also serving as the second electrode layer 8 is laminated on the EL layer 6.
- the substrate 1 used in the present invention is not particularly limited as long as it is generally used as the substrate 1 of the organic EL element 5, that is, as long as it supports the organic EL element 5 in a strong manner.
- the first electrode layer ⁇ may be used as long as it has the necessary strength as the layer ⁇ .
- the material of the substrate 1 may be, for example, a flexible material or a hard material, depending on the application. Examples of materials that can be specifically used include glass, quartz, polyethylene, and polypropylene. , Polyethylene terephthalate, polymethacrylate, polymethylmethacrylate, polymethylacrylate, polymethacrylate Examples include esters and polycarbonates.
- the material of the substrate 1 needs to be a transparent material such as glass. The unloading to the side is not limited to transparent materials.
- the shape of the substrate 1 may be a single-wafer shape or a continuous shape, and specific examples include a card shape, a film shape, a disk shape, a chip shape, and the like.
- the first electrode layer 7 and the second electrode layer 8 in the present invention are formed into a thin film by, for example, a method such as vacuum sputtering, vacuum deposition, or a method of forming by applying a coating liquid,
- the production method is not particularly limited, but it may be formed by applying using the coating apparatus 10 of the present invention.
- the first electrode layer 7 and the second electrode layer 8 differ depending on the direction in which light emitted from the light emitting layer is extracted, as to which of the electrode layers 7, 8 is required to have transparency.
- the first electrode layer 7 When light is extracted from the substrate 1 side, the first electrode layer 7 must be formed of a transparent material, and when light is extracted from the side opposite to the substrate 1, the first electrode layer 7 must be transparent. There is no. Further, either the first electrode layer 7 or the second electrode layer 8 may be an anode or a cathode, but usually the first electrode layer 7 is formed as an anode.
- Examples of the material of the electrode layer 7 when formed as an anode include, for example, indium tin oxide (ITO), indium oxide, a metal having a large work function such as gold, polyaniline, polyacetylene, poly'alkylthiophene derivative, A conductive polymer such as a polysilane derivative can be used.
- ITO indium tin oxide
- a metal having a large work function such as gold
- polyaniline polyaniline
- polyacetylene poly'alkylthiophene derivative
- a conductive polymer such as a polysilane derivative can be used.
- a magnesium alloy such as Mg Ag, an aluminum alloy such as AlLi, AlCa, A1 Mg, Li , C a and other metals having a low work function, such as alloys of these metals.
- the thicknesses of the first electrode layer 7 and the second electrode layer 8 vary depending on the material used and the like. For example, ⁇ ⁇ ! It is preferably about 100 nm.
- the EL layer 6 in the present invention is formed from one or more organic layers including the light emitting layer or the light emitting layer. That is, the EL layer 6 is an organic layer including at least a light emitting layer, and has a layer configuration of one or more organic layers.
- the organic layer constituting the EL layer 6 is formed into a thin film by the coating apparatus of the present invention, and it is difficult to laminate a large number of layers in relation to the solvent.
- the EL layer 6 is formed as an organic layer, but the EL layer 6 can be formed as a multi-layer of three or more layers by devising an organic material.
- organic layers formed in the EL layer 6 other than the light emitting layer include a carrier injection layer such as a hole injection layer and an electron injection layer. Further, examples of the other organic layer include a carrier transporting layer such as a hole transporting layer and an electron transporting layer. In general, these are provided by imparting a carrier transporting function to the carrier injecting layer. Often formed integrally with a layer. Examples of the other organic layer include an organic layer such as a hole blocking layer and an electron blocking layer for preventing the carriers from sticking out and for efficiently recombining the carriers.
- the thickness of each organic layer is preferably set to an appropriate thickness according to the type of the organic EL element, the type of the material constituting the organic layer, and the like. If the film thickness is too large, a large applied voltage is required to obtain a constant light output, resulting in poor efficiency. On the other hand, if the film thickness is too thin, pinholes and the like are generated, and sufficient light emission luminance cannot be obtained even when an electric field is applied. From these viewpoints, the thickness of each organic layer is, for example, 5 ⁇ ! It is preferable to arbitrarily select from a range of about to 10 zm.
- the organic EL material forming the EL layer 6 in the present invention for example, the light emitting material used for the light emitting layer 6 (organic layer) essential for the EL layer 6 is generally used as the light emitting layer of the EL layer 6.
- the material is not particularly limited as long as it is used, and examples thereof include a dye-based light emitting material, a metal complex-based rice-forming material, and a polymer-based light emitting material.
- Examples of the dye-based light-emitting material include cyclopentene derivative, tetraphenylbutadiene derivative, triphenylamine derivative, oxadiazole derivative, pyrazoloquinoline derivative, distyrylpentene derivative, distyrylarylene derivative, silole derivative, and thiophene. Ring compounds, pyridine ring compounds, perinone derivatives, perylene derivatives, oligothiophenin derivatives, trifmanilamine derivatives, oxadiazole dimers, virazoline dimers, and the like.
- metal complex-based light-emitting materials examples include aluminum quinolinol complex, benzoquinolinol beryllium complex, benzoxazole zinc complex, and benzothiazol zinc.
- Complex azomethyl zinc complex, porphyrin zinc complex, europium complex, etc. Examples thereof include thiadiazole, phenylviridine, phenylbenzimidazole, and metal complexes having a quinoline structure.
- polymer-based light emitting material examples include polyparaphenylenevinylene derivatives, polythiophene derivatives, polyparaphenylene derivatives, polysilane derivatives, polyacetylene derivatives, polyvinylcarbazole, polyfluorenone derivatives, polyfluorene derivatives, polyquinoxaline derivatives, and the like. And the like.
- An additive such as a doping agent may be added to the light emitting layer for the purpose of improving the light emitting efficiency, changing the light emitting wavelength, and the like.
- the doping agent include perylene derivatives, coumarin derivatives, ruprene derivatives, quinacridone derivatives, squaridium derivatives, porphyrin derivatives, styryl dyes, tetracene derivatives, pyrazoline derivatives, decacyclene, phenoxazone, quinoxaline derivatives, carbazole derivatives, and fluorene derivatives. And the like.
- Examples of the material (organic EL material) for forming the hole injecting layer include, in addition to the compounds exemplified as the light emitting material for the light emitting layer, phenylamine, phthalamine, phthalocyanine, vanadium oxide, and the like. And oxides such as molybdenum oxide, ruthenium oxide, and aluminum oxide; and derivatives such as amorphous carbon, polyaniline, and polythiophene.
- Examples of the material for forming the electron injection layer include aluminum, lithium fluoride, strontium, magnesium oxide, magnesium fluoride, strontium fluoride, in addition to the compounds exemplified as the light emitting material for the light emitting layer.
- Metals such as sodium fluoride, calcium fluoride, barium fluoride, aluminum oxide, strontium oxide, calcium, polyethylene methacrylate polystyrene sulfonate, lithium, cesium, cesium fluoride, etc. Examples thereof include halides of metals, organic complexes of alkali metals, and the like.
- the organic layer may also contain an oligomer material, a dendrimer-based light-emitting material, and a charge transport / injection material.
- the material (organic EL material) that forms each of these organic layers is dissolved or dispersed in a solvent such as toluene, chloroform, dichloromethane, tetrahydrofuran, or dioxane, and the material (organic EL material (organic EL material containing a solvent) is used.
- a solvent such as toluene, chloroform, dichloromethane, tetrahydrofuran, or dioxane
- organic EL material organic containing a solvent
- the coating apparatus 10 of the present invention includes the substrate stage section 2, the discharge section 3, and the motor section 4, as shown in FIGS.
- the feature of the present invention is that the motor part 4 is such that adjacent magnets are alternately different in polarity and the magnet at one end is pressed in the direction of the adjacent magnet so that the adjacent magnets are in close contact with each other. It consists of a linear servo with a plurality of magnets.
- the coating device 10 discharges and applies the organic EL material to the substrate 1 while sliding one or both of the substrate stage unit 2 and the discharge unit 3 by the linear servomotor 4.
- the slide mechanism for sliding movement is as follows. Since they are almost the same, the present embodiment describes a case where only the substrate stage unit 2 is slid.
- the gantry 11 of the coating device 10 is installed via the legs 12 so that the upper surface is horizontal. On the gantry 11, a substrate stage section 2, a discharge section 3, and a linear servomotor 4 are provided.
- a column 13 extending in the vertical direction is fixed on the gantry 11, and a discharge section 3 is provided above the moving path 15 via a moving mechanism 14 near the tip of the column 13. It is provided.
- the substrate stage 2 and the substrate 1 slide along the moving path 15.
- the moving mechanism 14 includes a vertical moving section 16 that moves the discharge section 3 in a vertical direction (a direction perpendicular to the upper surface of the gantry 11) and a discharge section 3 in a horizontal direction (vertical direction). And a left and right moving unit 17 that moves along the sliding direction of the substrate stage unit 2 and a direction orthogonal thereto. With this moving mechanism 14, the position of the discharge unit 3 (position for discharging the organic EL material) can be adjusted to an arbitrary position.
- the discharge section 3 is provided with a nozzle 18 for discharging the organic EL material.
- the nozzle 18 is not particularly limited as long as it is used as the coating device 10, and preferably, an inkjet head, a dispense nozzle, a die head, a knife blade, or the like is used.
- the discharge unit 3 is connected to a material supply device (not shown) for supplying an organic EL material discharged from the nozzle 18.
- a material supply device a pressure supply device, a pump such as a gear pump, a diaphragm pump, a plunger pump, or the like is used.
- the material supply device can adjust the supply amount, the supply amount is adjusted and a predetermined fixed amount of the organic EL material is supplied to the nozzle.
- the liquid may be discharged from the substrate 18 onto the substrate 1, or a predetermined fixed amount of organic EL may be provided downstream of the material supply device via a flow control valve (not shown) such as a solenoid valve or a pilot valve.
- the material may be discharged from the nozzle 18 onto the substrate 1.
- the substrate 1 is detachably mounted on a table 20 of the substrate stage section 2 and fixed.
- the means for fixing the substrate 1 of the table 20 may be of any configuration as long as the organic EL material can be applied to one surface of the substrate 1 by discharging.
- the template 20 is attached to the movable portion 21 of the linear servo boom 4.
- the linear servo boom 4 includes a stay part 22 fixed on the gantry 11 and a movable part 21 reciprocatingly sliding along the stay part 22.
- the stay part 22 supports a cylindrical slide part 23 serving as a guide for guiding the movable part 21 to slide, and supports both ends of the slide part 23 and a frame 1.
- 1 consists of brackets 24 and 25 fixed on top.
- the rackets 24 and 25 are each detachably fixed to an arbitrary position on the gantry 11, for example, near the opposing side by a screw member such as a bolt or the like.
- the gantry 11 is erected at a predetermined position above the upper surface.
- the ends of the slide portion 23 are detachably attached to the brackets 24 and 25 facing each other.
- the slide part 23 may be attached to the brackets 24, 25 in any manner as long as the slide part 23 does not shift due to the slide movement of the movable part 21. May be performed by You may make it perform by an engagement means.
- the brackets 24 and 25 may be fixed to the gantry 11 first, and then the slide section 23 may be attached to the brackets 24 and 25. However, preferably, the slide section 23 is connected to the brackets 24 and 25. After mounting on 25, brackets 24 and 25 may be fixed on gantry 1 together with slide part 23.
- a guide support 27 is provided near the side of the gantry 11 so as to extend the material along the direction in which the substrate stage 2 slides. As shown in FIG. 2, the guide support 27 supports a guide 26 for guiding the slide movement of the table 20 of the substrate stage 2.
- an encoder 128 as a detecting means for detecting the position of the substrate 1 (substrate stage 2) may be provided on the gantry 11.
- reference numeral 29 denotes a cable bearer for protecting a cable or the like connected to the movable portion 21.
- the movable portion 21 is formed in a rectangular box shape.
- the movable portion 21 has a substantially central portion along the longitudinal direction thereof.
- a penetrating portion 30 that penetrates is provided.
- the diameter of the through portion 30 is slightly larger than the outer diameter of the slide portion 23, and the movable portion 21 slides with the slide portion 23 inserted into the through portion 30.
- the slide is supported by the parts 23.
- the discharge section 3 nozzle 18
- the discharge section 3 is arranged above the part of the moving path 15 on which the movable section 21 slides so as to be adjustable in position.
- the table 20 of the substrate stage unit 2 is detachably attached to a surface that becomes the upper surface of the movable unit 21. Specifically, the table 20 is attached to the movable section 21 such that the application surface of the substrate 1 fixed on the table 20 is substantially parallel to a horizontal plane (for example, the upper surface of the gantry 11). ing.
- the stay portion 22 has a polarity (N) of an adjacent permanent magnet (magnet) 31.
- the plurality of permanent magnets 31 are arranged so that the poles and the S poles are alternately different.
- a plurality of coils 32 are provided in the movable part 21, and a moving magnetic field 33 is created by passing a current having an appropriate frequency and phase through these coils 32.
- the movable part 21 slides following the movement of the magnetic field 33. It has become. It is needless to say that a plurality of coils 32 may be provided in the stay portion and a plurality of permanent magnets 31 may be provided in the movable portion to slide the movable portion.
- the coil 32 is disposed, for example, on the outer periphery of the through portion 30 in the movable portion 21.
- the coils 32 are grouped into three sequences, and are arranged repeatedly in the order of U, V, and W.
- the U, V, and W phases are connected to each other, and the currents of the corresponding phases are supplied.
- the magnetic field 33 generated by the U, V, and W coils 32 and the current flowing therethrough changes depending on the phase of the current, and as a whole, as shown in FIG. A moving magnetic field 33 moving in one direction is created.
- the slide portion 23 of the stay portion 22 has a plurality of permanent magnets 31 as shown in FIGS. 3 and 4, and the adjacent permanent magnets 31 are arranged so that their polarities are alternately different. Are located.
- the permanent magnet 31 is pressed and held from both ends by a pair of holding portions 37 and 38, and the permanent magnets 31 adjacent to each other are brought into close contact with each other.
- the slide part 23 includes, for example, a plurality of permanent magnets 31 formed in the same cylindrical shape, a cylindrical body 34 of a non-magnetic material in which the permanent magnets 31 are housed, and a permanent magnet 31.
- a center shaft 36 made of a non-magnetic material used in a state inserted into the center portion 35, a contact member 37 provided at one end of the center shaft 36, and a center shaft 36 And a magnet pressing member 38 provided at the other end of the magnet.
- the contact member 37 and the magnet pressing member 38 form a pair of holding portions 37 and 38.
- the permanent magnet 31 is formed in a cylindrical shape such as a circular shape or a polygonal shape, preferably in a cylindrical shape (ring shape).
- a cylindrical shape such as a circular shape or a polygonal shape, preferably in a cylindrical shape (ring shape).
- any material may be used as long as it is used for the linear servo motor.
- a rare earth or ferrite material having a high magnetic flux density is preferable.
- the cylindrical body 34 is formed according to the shape of the permanent magnet 31.
- the cylindrical body 34 is formed by a cylindrical pipe 34.
- the inner diameter of the pipe 34 is such that when the permanent magnet 31 is housed in the pipe 34, the outer peripheral surface of the permanent magnet 31 is in close contact with the inner peripheral surface of the pipe 34, if not closely. It is preferable to form them in the following dimensions. Since the movable portion 21 is arranged outside the pipe 34, the thickness of the pipe 34 is preferably as thin as possible so as not to reduce the magnetic field 33, and is, for example, about 1 mm.
- the length of the pipe 34 is arbitrarily selected from dimensions that can accommodate a predetermined number of permanent magnets 31 in series along the axial direction.
- the center shaft 36 is inserted into the opening 35 of the permanent magnet 31 and is formed according to the shape of the opening 35 of the permanent magnet 31.
- a rod having a circular cross section is used. It is formed in a cylindrical body as shown in FIGS.
- the outer diameter of the center single shaft 36 is not particularly limited when the inner diameter of the pipe 34 is formed as described above, but preferably, the center single shaft 36 is made permanent.
- the outer circumference of the center shaft 36 should be in contact with the inner wall of the opening 35 of the permanent magnet 31, or it should be close to the inner wall of the permanent magnet 31. Is preferred.
- the length of the center shaft 36 is preferably formed to be a predetermined length longer than the length of the pipe 34 because the magnet pressing member 38 is screwed in as described later.
- Sen-Non-magnetic material such as stainless steel is used for the shaft 36.
- the contact member 37 is for preventing the permanent magnets 31a from moving due to the contact of the permanent magnets 31a at one end of the plurality of permanent magnets 31 to be arranged.
- the contact member 37 may be a bracket 24 to which the slide portion 23 is attached.
- a mounting member 39 having a thread groove formed on an outer periphery thereof is protruded from an end of the central shaft 36, and
- the bracket 24 is provided with a threaded concave portion 40 that is screwed with the mounting member 39.
- the screw groove may be formed by screwing.
- the contact member 37 can be provided on the center shaft 36 with a simple structure. At this time, it is preferable to provide the bracket 24 with a concave portion 41 so that the end of the slide portion 23 is seated.
- the magnet pressing member 38 adjoins the permanent magnet 3 lb at the other end of the plurality of permanent magnets 31 arranged such that the polarities of the adjacent permanent magnets 31 in the pipe 34 are alternately different. Press in the direction of the permanent magnet 31 to make the permanent magnets 31 adjacent to each other stick together Things.
- the magnet pressing member 38 is formed of a ring such as a nut, and is formed by a screw member in which a screw groove is threaded in a central opening.
- a screw groove is formed on the outer periphery of the end of the contact shaft 37 opposite to the contact member 37, and an opening of a screw member, such as a nut 38, is formed on the center shaft 36. It should be formed in a size to be screwed to the end.
- the magnet pressing member 38 can be attached with a simple structure with a simple structure.
- the mounting member 39 at the end of the screw shaft 36 is screwed into the screwing recess 40, and the screw shaft 36 is attached to the bracket 2.
- a pipe 34 is put on the outer circumference of the shaft 36 so as to cover the shaft 36, and the end of the pipe 34 is seated in the recess 41 of the bracket 24 so that one of the pipes 34 is formed. Close the opening of. That is, the center shaft 36 and the pipe 34 form a double pipe structure.
- a ring-shaped permanent magnet 31 is provided between the center shaft 36 and the pipe 34 from the other opening of the pipe 34 in a predetermined number so that the polarity of the adjacent permanent magnets 31 is alternately different. insert. That is, a predetermined number of permanent magnets 31 are accommodated in the pipe 34. After being accommodated, the permanent magnets 31 in the pipe 34 repel because the adjacent permanent magnets 31 have the same polarity. Against this repulsive force, while pushing the permanent magnet 31b at the other opening side end of the pipe 34 into the pipe 34, for example, screw a nut 38 into the thread groove of the center shaft 36. Combine.
- the permanent magnet 3 lb at the other opening side end of the pipe 34 is pressed in the direction of the bracket (closed).
- the polarities of the plurality of permanent magnets 31 housed in the pipe 34 are the same as the polarities of the permanent magnets 31 adjacent to each other and repel each other, but are in a state of being in close contact with each other. After the permanent magnet 31 is assembled in this way, the other opening of the pipe 34 is closed by, for example, a cap 42.
- the end of the pipe 34 (the end on the cap 42 side) is inserted into the penetrating part 30 of the movable part 2, and the movable part 21 is attached to the outer periphery of the pipe 34 (slide part 23).
- the movable part 21 attach another bracket 25 to the end of the pipe 34.
- the stay part 22 with the movable part 21 11 Place the bracket in a predetermined position, for example, insert bolts into the mounting holes 43 (see Fig. 3) of the brackets 24, 25, and move the brackets 24, 25 to the base 11 with the bolts. Fix it.
- the linear cover 4 is fixed on the gantry 11 and a part of the coater 10 is assembled.
- the substrate 1 is placed and fixed on the table 20 of the substrate stage 2.
- the position of the discharge unit 3 (the position of the nozzle 18) is determined in advance by the moving mechanism 14 in accordance with the desired organic layer to be formed.
- the linear servo motor 4 is driven to slide the substrate stage section 2 below the discharge section 3 while discharging a predetermined amount of the desired organic EL material along with the movement. It is discharged onto the substrate 1 from the nozzle 18 of the part 3.
- control is performed so that the slide moving speed of the substrate is constant and the discharge amount of the organic EL material is constant.
- This control can be performed, for example, by providing an encoder 128 mounted on the gantry 11 and a flow meter downstream of the material supply device, and using these devices 28 to control the sliding speed of the movable unit 21 and the organic EL material. F ⁇ ⁇ by controlling the discharge rate.
- an organic layer (EL layer) having a uniform film thickness can be formed.
- the linear stage 1 that slides and moves the substrate stage 2 has a plurality of permanent magnets 31 arranged in a pipe 34 so that the adjacent permanent magnets 31 have alternately different polarities. Are sequentially accommodated in a pipe 34.
- the permanent magnet 31 a at one end is pressed by the nut 38 in the direction of the bracket 24, and the adjacent magnets 31 adhere to each other, so that the substrate 1 (movable part 21) is kept constant. It can slide at the speed of.
- each organic layer constituting the EL layer has a thickness of, for example, 5 ⁇ ! Since the thickness is very thin, up to 10 zm, small unevenness of the film thickness causes a large error in the film thickness, which may cause uneven light emission. In other words, conventional linear motors cannot cope with them, and more accurate motors are required.
- the coating apparatus 10 of the present invention since the plurality of permanent magnets 31 are brought into close contact with each other by pressing force, there is no gap between the permanent magnets 31, so that the positional accuracy of the permanent magnets 31 is good, and The slide movement of the stage unit 2 can be performed with uniform speed. As a result, the substrate 1 slides at a constant speed, so that the film thickness error is 2% or less, and depending on the type of organic electronic material, it is 0.5% or less, and the organic layer (EL layer 6) having a uniform film thickness is formed. It will be formed on the substrate 1.
- the coating apparatus 10 of the present invention has excellent smoothness and uniformity even when the EL layer 6 (organic layer), which is a nano-order thin film, is formed on a relatively large substrate surface by a wet method.
- An EL layer 6 having a thickness can be formed.
- This coating device 10 has a film pressure of 1 ⁇ ⁇ ⁇ ! ⁇ 10 ⁇ O n m, especially 5 ⁇ ⁇ ⁇ !
- the present invention exerts an excellent effect in forming a layer 1 of about 200 11 111 compared to a conventional coating apparatus.
- the precision of the fixed portion is high, so that the slide movement of the substrate 1 (substrate stage portion 2) can be performed. It can be performed reliably and uniformly.
- a plurality of permanent magnets 31 are formed in a cylindrical shape, and a non-magnetic material shaft 36 is inserted into an opening 35 of the cylindrical permanent magnet 31 so that the outer periphery of the center shaft 36 is formed.
- a cylindrical body 34 made of a non-magnetic material surrounding the permanent magnets 31 is provided around the outer periphery of the plurality of permanent magnets 31, a plurality of cylindrical bodies 3 are arranged between the central shaft 36 and the cylindrical body 3.
- the permanent magnet 31 may be inserted, so that the workability in assembling is further improved.
- the permanent magnet 31 is formed in a ring shape, and a cylindrical pipe 34 having an inner diameter that is in close contact with the permanent magnet 31 is provided on the outer periphery of the ring-shaped magnet 31, a plurality of magnets are provided. Since the step of 31 can be prevented, the uniform velocity is further improved.
- the substrate 1 (substrate stage section 2) can be slid at a more constant speed, and an organic layer (EL layer 6) having a more uniform film thickness can be formed.
- the organic electronic material coating apparatus 10 of the present invention can form the EL layer 6 having excellent smoothness and a uniform film thickness by using the organic EL material as the organic electronic material. Therefore, if another organic electronic material such as an organic thin film transistor material or a solar cell material is used, for example, an organic thin film transistor has excellent smoothness, and a semiconductor layer or an insulating layer having a uniform film thickness, and a solar cell, for example.
- the electrode layer and oxide semiconductor (power generation layer (porous film)) having a smooth and uniform film thickness can be formed individually.
- Organic thin-film transistor materials include, for example, organic light-emitting device materials such as polyfluorene derivatives and polythiophene derivatives, and specific examples include polychenylenevinylene, poly3-hexylthiophene, and 9,9-dioctylfluorene-bithiophene.
- Examples of the material include a semiconductor layer material and an insulating layer material such as polyvinyl phenol and polyhydroxystyrene.
- the solar cell material, and the electrode layer material such as platinum paste, T i 0 2 generation layer material of the titanium dioxide colloids or the like dispersed in an organic solvent such as polyethylene glycol (dioxide Ji Yun) fine particles, and the like.
- T i 0 2 (titanium dioxide) fine particles preferably be used as the particle size of 1 to 1 0 0 nm.
- a film is formed on a surface of a substrate, for example, a glass substrate 1 using an electrode material, for example, transparent ITO (indium tin oxide).
- This film formation is performed by, for example, a method such as vacuum sputtering or vacuum evaporation, a method of forming by applying a coating liquid, or the like, and is also performed by applying using the coating apparatus 10 of the present invention. You may do so.
- An insulating portion is formed on the glass substrate 1 other than the stripe-shaped first electrode layer 7 using an insulating material.
- the formation of the insulating portion may be performed using photolithography technology, or may be performed using another film forming technology or the coating apparatus 10 of the present invention.
- the organic EL material is discharged onto the first electrode layer 7, and the organic EL material is coated on the stripe-shaped first electrode layer 7, respectively.
- the EL layer 6 is formed.
- the application of the organic EL material to each of the stripe-shaped first electrode layers 7 is performed, for example, so that red, green, and blue organic EL materials are sequentially arranged.
- the number of nozzles 18 of the discharge section 3 of the coating device 10 may be one, but preferably three nozzles 18 are provided, and these nozzles 18 are provided with red, green, and blue organic EL materials, respectively. May be supplied so that the organic EL material can be applied to the three first electrode layers 7 by one slide movement of the substrate 1.
- an electrode material is formed in a stripe shape facing the first electrode layer 7 so as to be orthogonal to the first electrode layer 7 using the coating apparatus 10 of the present invention.
- This film formation is performed by, for example, a method such as vacuum sputtering or vacuum evaporation, a method of forming by applying a coating liquid, or the like, and is performed by applying using the coating apparatus 10 of the present invention. You may do so.
- an organic EL element 5 capable of full-color display in which the first electrode layer 7 and the second electrode layer 8 are arranged in an XY matrix is manufactured.
- the organic EL element 5 since the first electrode layer 7, the EL layer 6, and the second electrode layer 8 are formed using the coating apparatus 10 of the present invention, a uniform film having a thickness error of 2% or less is provided.
- the first electrode layer 7, the EL layer 6, and the second electrode layer 8 having a large thickness are provided.
- each of the organic layers constituting the EL layer 6 has a thickness of, for example, 5 ⁇ ! Since the thickness is very thin, about 1 O ⁇ m, the small thickness unevenness may cause a large thickness error, which may cause uneven light emission.However, there is no fear that the organic EL device 5 having uniform light emission can be obtained. Will be. Therefore, by using the organic EL element 5, an EL display that emits light uniformly can be manufactured.
- the organic EL device which is an organic EL device, is coated using the organic electronic material coating apparatus of the present invention.
- other organic electronic devices such as an organic thin film transistor and a solar cell can be manufactured in the same manner.
- an organic thin film transistor by forming an active semiconductor layer using the coating apparatus 10 of the present invention, an active semiconductor layer having excellent thickness smoothness with a thickness error of 2% or less and having a uniform thickness can be obtained. Accordingly, an organic thin film transistor having excellent amplification characteristics can be manufactured.
- a film thickness error of 2% or less is excellent in smoothness and uniformity. Since the thin film has a back electrode layer and an oxide semiconductor film (porous film) having a large thickness, a solar cell exhibiting good photovoltaic power can be manufactured.
- Discharge part nozzle Head for ink jet
- Discharge nozzle Dispense nozzle
- Discharge nozzle Die head ''
- Discharge part nozzle knife blade
- Discharge part nozzle knife blade
- discharge unit Some moving media: discharge unit
- Discharge part nozzle knife blade
- Moving medium of motor substrate stage
- Discharge part nozzle knife blade
- the coating devices A to E are the coating devices of the present invention, and the following were used as the permanent magnet, center shaft, and pipe used in the coating device.
- Permanent magnet 11 mm inner diameter, 30 mm outer diameter, 60 mm long cylinder
- Pipe Inner diameter 30 mm, outer diameter 32 mm, length 700 mm, thickness 1 mm
- Cylindrical pipe material stainless steel
- FIG. 8A—FIG. 8B reference numeral 81 denotes a rectangular parallelepiped magnet 82.
- Magnets 8 2 indicate a stay portion which is fixed (adhered) to the fixing member 8 3 with an adhesive so that the polarities of the magnets 8 are alternately different, and reference numeral 8 4 denotes the stay portion 8 3 Magnet on top 8
- FIG. 2 shows a movable part guided by a cable 85 along an arrangement direction 2 and having a coil.
- a ball screw with a diameter of 20 mm and a screw lead of 6 mm was used as the coating device G.
- Coating device
- a transparent conductive film of indium tin oxide (ITO) was formed on a surface of a transparent glass plate having a length of 150 mm ⁇ 150 mm and a thickness of 1.1 mm by a sputtering method.
- a substrate was prepared by processing the ITO into the following pattern.
- the ITO line width 100 // m was formed in the pattern of the gap width 100 ⁇ m. Further, a resist material having a width of 120 / m was provided as an insulating material on the ITO line gap so as to cover the edges of the ITO line pattern.
- a polyvinyl carbazole having the structure shown in Chemical Formula 1, a luminescent dye, and an oxaziazole compound having the structure shown in Chemical Formula 2 are dissolved in a toluene solvent with the following composition, and a coating solution of three kinds of luminescent materials (organic EL material) ) created.
- a coating solution of three kinds of luminescent materials organic EL material
- Luminescent dye coumarin 60.1 parts by weight oxadiazole compound
- Oxadiazole compound E part Toluene 500 100 parts by weight Coating solution B-Polyvinyl carpazole
- Luminescent dye 0.1 parts by weight oxaziazole compound
- Substrate B was thoroughly washed in acetone, isopropanol, and pure water using an ultrasonic cleaner, and then the ITO surface was irradiated with UV. Next, the coating solution G of the luminescent material was applied on the ITO line using the coating device A under the following coating conditions.
- Application condition
- Substrate moving speed 5 mm / sec to 200 mm / sec
- Discharge rate of luminescent material 4 L / s ec ⁇ 300mLZs ec
- the MgAg electrode was connected to the negative electrode, and a direct current was applied through a source, light emission was observed when a potential of 10 V was applied. The light emission spectrum at that time is transferred to a spectrophotometer.
- An organic EL device was produced in the same manner as in Example 1 except that the coating device B was used.
- the thickness error was within 2% within a range of 14 Omm ⁇ 10 mm at the center of the coating surface, and the unevenness of the organic layer surface was 5 nm or less.
- uniform green emission with a peak at 501 nm derived from coumarin 6 was observed.
- An organic EL device was produced in the same manner as in Example 1 except that the coating apparatus C was used using the substrate A.
- the film thickness error was within 2% in the range of 14 Omm x 14 Omm at the center of the coating surface, and the unevenness of the organic layer surface was 5 nm or less.
- a green uniform surface emission having a peak at 50 lnm derived from coumarin 6 was observed.
- the substrate A was set on the stage, and the knife blade of the coating device D was set thereon.
- the coating solution G of the luminescent material was dropped on the substrate along the knife blade, and then the stage was moved.
- the knife blade spread the coating solution on the substrate, and the coating solution was applied on the substrate. Dry it in a clean oven at 80 ° C for 30 minutes An EL layer consisting of a 100 nm-thick light emitting layer alone was formed. Tabletop probe microscope
- the film thickness error was within 2% within a range of 14 Omm x 140 mm at the center of the coated surface.
- the MgAg electrode was connected to the negative electrode, and a direct current was applied by a source, light emission was observed when a potential of 10 V was applied.
- the light-emitting spectrum at that time is
- An organic EL device was manufactured in the same manner as in Example 4, except that the knife blade was moved using the coating device E instead of moving the stage on which the substrate was set using the coating device D in Example 4.
- the film thickness distribution of the obtained EL layer showed that the film thickness error was within 2% within a range of 14 Omm ⁇ 140 mm at the center of the coated surface.
- green uniform surface emission having a peak at 501 nm derived from coumarin 6 was observed.
- An organic EL element having an area color was prepared in the same manner as in Example 3 except that the coating liquid G, the coating liquid, and the coating liquid B of the luminescent material were sequentially applied in the traveling direction of the stage using the coating apparatus C. did.
- the film thickness distribution of the obtained EL layer was such that the film thickness error was within 2% in a range of 14 Omm x 140 mm at the center of the coated surface, Emission of three colors was obtained.
- Example 2 An organic EL device was produced in the same manner as in Example 4 except that the coating device F was used. As a result of measuring the film thickness distribution of the light emitting layer, the film thickness error was 5% in a range of 14 Omm x 14 Omm in the center of the coated surface. In addition, unevenness was visually observed in the light emission. (Comparative Example 2)
- An organic EL device was produced in the same manner as in Example 4 except that the coating device G was used.
- the film thickness error was 10% in a range of 140 mm ⁇ 140 mm at the center of the coated surface.
- stripe-shaped light emission unevenness corresponding to the feed of the ball screw was confirmed.
- a gold film is formed as a gate electrode 52 on a quartz glass substrate 51 in a patterned pattern
- silicon nitride is sputtered to a thickness of 100 OA to form an insulating film 53
- a polythiophene derivative is applied thereon as an active semiconductor layer 54 using a coating apparatus D so that the dry film thickness becomes 100 OA
- gold is used as a source electrode 55 and a drain electrode 56.
- An organic thin film transistor 50 was formed by vapor deposition at intervals of 100 ⁇ m.
- the film thickness distribution of this active semiconductor layer was measured with a tabletop probe microscope (manufactured by Seikon Sulmen Co., Ltd.) in the same manner as in Examples 1 to 6 above. It was found that the thickness error was within 2% in the range of 140 mm, and the unevenness of the organic layer surface was 5 nm or less.
- the fabricated transistor 50 is connected between the drain and the source electrode 55, 56.
- a voltage was applied from 15 V to 15 V, a clear saturation current was observed. Also, a change in the saturation current value due to the gate voltage was observed, confirming the amplification characteristics.
- a gold paste was applied in a pattern on a glass plate using a coating apparatus B and dried to form a back electrode layer 62 having a thickness of 3.
- This on the coating liquid to T i 0 2 fine particle size 1 to 1 O nm dispersed in polyethylene glycol was coated in a pattern using a coating apparatus B, after the preliminary drying, 3 ⁇ min at 4 5 0 ° C
- the oxide semiconductor film (power generation layer (porous film)) 63 with a thickness of 1 O zm was formed by drying, drying, and firing.
- the back electrode layer and the oxide semiconductor film were formed on a desktop As a result of measuring the film thickness distribution using a microscope (manufactured by Seiko Instruments Inc.), the film thickness error was within 2% in the range of 14 O mm x 140 mm at the center of the coating surface, and the It was found that the unevenness of the layer surface was 5 nm or less.
- the laminate is immersed in an ethanol solution of a ruthenium complex to impregnate the porous film, and then dried to form a ruthenium complex.
- peripheral end is sealed with an epoxy-based adhesive leaving only the electrolyte dissolving inlet, and after the adhesive is cured, an iodine electrolyte solution is injected from the inlet, and after the injection, the inlet is sealed.
- the resultant was sealed with a metal material to produce a dye-sensitized solar cell 60.
- the portions of the motor are adjacent to each other because the polarities of the adjacent magnets are alternately different and the magnets at one end are pressed in the direction of the adjacent magnet. It has a plurality of magnets in which the magnets are arranged in close contact. For this reason, the substrate stage and the discharge unit slide at a constant speed, and by discharging the organic electronic material toward the substrate together with this movement, an organic layer having a uniform thickness is formed on the substrate. Can be formed.
- an organic layer having a uniform thickness is formed on a substrate, so that an organic electronic device exhibiting good characteristics can be manufactured.
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Electroluminescent Light Sources (AREA)
- Coating Apparatus (AREA)
- Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)
- Thin Film Transistor (AREA)
- Photovoltaic Devices (AREA)
Abstract
Description
Claims
Priority Applications (1)
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US10/547,368 US7393413B2 (en) | 2003-03-07 | 2004-03-05 | Coating apparatus and organic electronic device fabricating method |
Applications Claiming Priority (4)
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JP2003-062438 | 2003-03-07 | ||
JP2003062438 | 2003-03-07 | ||
JP2003071701A JP2004335492A (ja) | 2003-03-07 | 2003-03-17 | 有機電子材料の塗布装置およびそれを使用した有機電子素子の製造方法 |
JP2003-071701 | 2003-03-17 |
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WO2004078362A1 true WO2004078362A1 (ja) | 2004-09-16 |
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PCT/JP2004/002802 WO2004078362A1 (ja) | 2003-03-07 | 2004-03-05 | 塗布装置および有機電子素子の製造方法 |
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US (1) | US7393413B2 (ja) |
JP (1) | JP2004335492A (ja) |
KR (1) | KR100776846B1 (ja) |
TW (1) | TW200421931A (ja) |
WO (1) | WO2004078362A1 (ja) |
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ES2402367T3 (es) * | 2006-12-20 | 2013-05-03 | Homag Holzbearbeitungssysteme Ag | Dispositivo y procedimiento para recubrir piezas |
ES2334393T3 (es) | 2007-03-27 | 2010-03-09 | Homag Holzbearbeitungssysteme Ag | Dispositivo y procedimiento para la impresion de un objeto tridimensional. |
PL1990204T3 (pl) * | 2007-05-10 | 2016-04-29 | Homag Holzbearbeitungssysteme Ag | Sposób i urządzenie do powlekania powierzchni |
US20090120249A1 (en) * | 2007-11-14 | 2009-05-14 | Achim Gauss | Device For Refining Workpieces |
TWI508618B (zh) * | 2009-12-28 | 2015-11-11 | Univ Nat Chiao Tung | 製備有機發光二極體之方法及其裝置 |
JP5140103B2 (ja) * | 2010-03-17 | 2013-02-06 | 株式会社日立ハイテクノロジーズ | リニアモータ対、移動ステージ、及び電子顕微鏡 |
US8629572B1 (en) * | 2012-10-29 | 2014-01-14 | Reed E. Phillips | Linear faraday induction generator for the generation of electrical power from ocean wave kinetic energy and arrangements thereof |
CN103151461A (zh) * | 2013-02-27 | 2013-06-12 | 京东方科技集团股份有限公司 | 一种有机薄膜晶体管及其制备方法和制备装置 |
DE102013216113A1 (de) | 2013-08-14 | 2015-03-05 | Homag Holzbearbeitungssysteme Gmbh | Beschichtungsaggregat |
JP5799181B1 (ja) | 2015-01-07 | 2015-10-21 | 住友化学株式会社 | 有機電子素子の製造方法 |
KR101925605B1 (ko) * | 2015-02-17 | 2018-12-05 | 주식회사 이노헨스 | 플라즈마 처리장치용 소스 |
US9962710B2 (en) | 2016-07-07 | 2018-05-08 | Bunting Magnetics Co. | Magnetic roll |
WO2018102561A1 (en) * | 2016-11-30 | 2018-06-07 | Massachusetts Institute Of Technology | High force and low noise linear fine-tooth motor |
CN109610003A (zh) * | 2019-01-02 | 2019-04-12 | 天津大学 | 一种新型可控有机晶体生长设备及其制备有机单晶的方法 |
CN113275188B (zh) * | 2021-04-08 | 2022-12-30 | 苏氏冠瑾(天津)科技有限公司 | 一种加速金属片表面纳米二氧化硅自动沉积成膜装置 |
JPWO2022244847A1 (ja) * | 2021-05-20 | 2022-11-24 | ||
CN113441305B (zh) * | 2021-07-13 | 2022-09-23 | 郑州大学 | Tcf制备用一维导电填料喷涂装置 |
CN114849965A (zh) * | 2022-04-17 | 2022-08-05 | 山东轴研精密轴承有限公司 | 一种汽车用圆锥滚子轴承的防锈装置 |
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- 2004-03-05 US US10/547,368 patent/US7393413B2/en not_active Expired - Fee Related
- 2004-03-05 TW TW093105922A patent/TW200421931A/zh not_active IP Right Cessation
- 2004-03-05 WO PCT/JP2004/002802 patent/WO2004078362A1/ja active Application Filing
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JP2001008430A (ja) * | 1999-06-16 | 2001-01-12 | Nikon Corp | モータ装置、ステージ装置、及び露光装置 |
JP2001190088A (ja) * | 1999-12-28 | 2001-07-10 | Nikon Corp | モータ装置、ステージ装置、露光装置、デバイス、モータの駆動方法、ステージ装置の駆動方法、露光方法、および、デバイスの製造方法 |
JP2003022892A (ja) * | 2001-07-06 | 2003-01-24 | Semiconductor Energy Lab Co Ltd | 発光装置の製造方法 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108701577A (zh) * | 2016-02-17 | 2018-10-23 | 伊诺恒斯股份有限公司 | 用于等离子体处理装置的阴极 |
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KR20050108488A (ko) | 2005-11-16 |
TWI330046B (ja) | 2010-09-01 |
KR100776846B1 (ko) | 2007-11-28 |
TW200421931A (en) | 2004-10-16 |
US20060162650A1 (en) | 2006-07-27 |
JP2004335492A (ja) | 2004-11-25 |
US7393413B2 (en) | 2008-07-01 |
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