WO2003075327A1 - Exposure equipment and device manufacturing method - Google Patents
Exposure equipment and device manufacturing method Download PDFInfo
- Publication number
- WO2003075327A1 WO2003075327A1 PCT/JP2003/002374 JP0302374W WO03075327A1 WO 2003075327 A1 WO2003075327 A1 WO 2003075327A1 JP 0302374 W JP0302374 W JP 0302374W WO 03075327 A1 WO03075327 A1 WO 03075327A1
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- WO
- WIPO (PCT)
- Prior art keywords
- gas
- exposure apparatus
- stage
- mask
- reticle
- Prior art date
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70691—Handling of masks or workpieces
- G03F7/70716—Stages
Definitions
- the present invention relates to an exposure apparatus and a device manufacturing method, and more particularly, to an exposure apparatus suitable for forming a fine pattern such as a semiconductor integrated circuit and a liquid crystal display, and a device manufacturing method using the exposure apparatus.
- the exposure wavelength has been shifted to shorter wavelengths in order to realize high resolution in response to miniaturization of integrated circuits.
- the wavelength of the KrF excimer laser beam is 2488 nm, but the shorter wavelength of the ArF excimer laser beam, 193 nm, is entering the stage of practical use.
- a short wavelength of 1 5 7 nm F 2 laser light, of A r 2 laser beam having a wavelength of 1 2 6 nm a light source that emits light in a wavelength band so-called vacuum ultraviolet region using
- a projection exposure apparatus that performs the following.
- Such vacuum ultraviolet light having a wavelength of 190 nm or less is intensely absorbed by oxygen and water vapor in the atmosphere. Therefore, an exposure apparatus that uses vacuum ultraviolet light as exposure light
- the gas in that space is purged (gas purged) with a rare gas such as nitrogen or helium that does not absorb the exposure light.
- a rare gas such as nitrogen or helium that does not absorb the exposure light.
- high resolution can be realized not only by shortening the exposure wavelength, but also by increasing the numerical aperture (N.A.) of the optical system. A. It is also being developed.
- N.A. numerical aperture
- the concentration of residual oxygen and water vapor in the space near the reticle also needs to be suppressed to about 1 ppm or less.
- a method of realizing this a method of covering the entire reticle stage holding the reticle with a large airtight shielding container (reticle stage chamber) and purging the entire inside (including the reticle stage and the reticle) with a gas is also conceivable.
- the exposure apparatus becomes larger and larger.
- the installation area (footprint) per lithography tool becomes larger, and equipment costs (or running costs) increase, resulting in higher productivity of semiconductor devices. Will decrease.
- access to the vicinity of the reticle becomes difficult, workability during maintenance of the reticle stage or the like is reduced, and the time required for maintenance is increased. In this regard, the productivity of the semiconductor device is also reduced.
- a scanning projection exposure apparatus has a large reticle stage because it is necessary to scan the reticle at high speed during exposure, and the shielding container (reticle stage chamber) that covers the entire large reticle stage becomes even larger. .
- the present invention has been made under such circumstances, and a first object of the present invention is to provide an exposure apparatus capable of reducing the size and weight of the apparatus without lowering the exposure accuracy. .
- a second object of the present invention is to provide a device manufacturing method capable of improving the productivity of a highly integrated device. Disclosure of the invention
- an illumination unit for illuminating a mask with illumination light; a projection unit for projecting a pattern formed on the mask onto an object; a holding space for holding the mask Formed inside the mask stage, the mask stage being movable in at least one axial direction within a plane of movement substantially perpendicular to the optical path of the illumination light; and disposed on the illumination unit side of the mask stage via a predetermined first clearance.
- a first mask surface plate provided at a part thereof with a light transmitting portion through which the illumination light is transmitted, and having a facing surface facing the mask stage; and a first mask plate on the projection unit side of the mask stage.
- An exposure apparatus comprising: a mask surface plate; According to this, a holding space is formed inside a mask stage movable at least in one axial direction on a moving plane substantially perpendicular to the optical path of the illumination light, and the mask is held in the holding space. Then, first and second mask bases are respectively arranged on the illumination unit side and the projection unit side of the mask stage via predetermined first and second clearances, respectively. Each of the first and second mask bases has a light transmitting portion through which illumination light passes, and at least one of the surfaces facing the respective mask stages is provided with a movement guide of the mask stage. Surface.
- the illuminating light enters the holding space of the mask stage via the light transmitting portion of the first mask surface plate, illuminates the mask with the illuminating light, and transmits the light transmitted through the mask to the second mask. Emitted from the light transmitting part of the surface plate.
- the gap between each platen and the mask stage is formed by disposing the mask stage with first and second clearances between the first mask platen and the second mask platen. The outside air is effectively prevented from entering (inflowing into) the holding space through each of them. This suppression effect is good when the clearances are narrow to some extent, for example, about 1 mm or less, preferably 0.5 mm or less, and more preferably 0.1 mm or less.
- the same effect as in the case where the entire mask stage is covered with the partition wall can be obtained, and the size and weight of the entire exposure apparatus can be reduced.
- the entire mask stage is covered with a partition, and the amount of gas used is reduced as compared with the case where the inside is replaced with the gas. Therefore, it is possible to reduce costs.
- the concentration of the light absorbing substance in the space around the mask can be kept low, the exposure accuracy does not decrease as a result.
- a predetermined gas is provided on the mask stage and is injected to the facing surface of the second mask surface plate, and a gas in a space near the facing surface is sucked and exhausted to the outside.
- a differential exhaust type first gas static pressure bearing is provided on the mask stage and injects a predetermined gas onto the opposed surface of the first mask surface plate, and the
- a differential exhaust type second gas static pressure bearing for sucking gas in the clearance and exhausting the gas to the outside may be further provided.
- At least one of the first and second gas static pressure bearings is disposed on the supply side annular groove communicating with the predetermined gas injection port, and on the outer peripheral side of the supply side annular groove. And an exhaust-side annular groove communicating with the exhaust port for the predetermined gas.
- the mask stage includes: a fine movement stage in which the mask holding space is formed and holding the mask; and a fine movement stage that holds the fine movement stage so as to be finely movable in a plane parallel to the facing surface. 1 and a coarse movement stage having a surface facing the second mask surface plate, respectively.
- a predetermined gas is provided on the surface of the fine moving stage that is provided on the opposing surface on the projection unit side and opposes the opposing surface.
- a differential exhaust type first gas static pressure bearing that sucks gas near the surface of the fine movement stage and exhausts the gas to the outside may be further provided.
- a predetermined gas is provided on the surface of the fine moving stage which is provided on the opposing surface on the side of the illumination unit, and opposes the opposing surface.
- a differential exhaust type second gas static pressure bearing for absorbing a gas inside a clearance between the fine movement stage and the coarse movement stage and exhausting the gas to the outside may be further provided.
- At least one of the first and second gas static pressure bearings is disposed on the supply side annular groove communicating with the predetermined gas injection port, and on the outer peripheral side of the supply side annular groove. And an exhaust groove communicating with an exhaust port of the predetermined gas. be able to.
- the fine movement stage when the mask stage has a fine movement stage and a coarse movement stage, the fine movement stage can form the holding space.
- the fine movement stage when the fine movement stage includes a side wall that forms the holding space, the fine movement stage irradiates the reflecting member provided on the outer surface side of the side wall with laser light, and reflects the reflected light reflected on the reflecting surface of the reflecting member.
- the apparatus may further include a laser interferometer that measures the position of the fine movement stage based on the information.
- the exposure apparatus of the present invention may further include at least one of a gas supply mechanism that supplies a specific gas to the holding space and a gas exhaust mechanism that exhausts gas in the holding space. .
- the illumination light may be vacuum ultraviolet light having a wavelength of 190 nm or less, and the specific gas may be one of nitrogen and a rare gas.
- at least one of the first mask surface plate and the illumination unit is disposed via a predetermined clearance without contacting at least one of the first mask surface plate and the illumination unit.
- a shielding member for substantially shielding a space between the lighting unit and a shielding member provided on the shielding member for injecting a predetermined gas into at least one of the first mask surface plate and at least one of the lighting unit and the clearance;
- a differential exhaust type sealing mechanism for sucking the gas inside and exhausting the gas to the outside.
- the apparatus further includes at least one of a gas supply mechanism that supplies a specific gas to an optical path space that forms an optical path of the illumination light inside the shielding member, and an exhaust mechanism that exhausts gas in the optical path space. It can be.
- the illumination light may be vacuum ultraviolet light having a wavelength of 190 nm or less, and the specific gas may be one of nitrogen and a rare gas.
- a small amount of the second mask surface plate and the projection unit A shielding member that is arranged via a predetermined clearance without contacting at least one of them, and substantially shields a space between the second mask surface plate and the projection unit; and a shielding member provided on the shielding member.
- a differential exhaust type sealing mechanism for injecting a predetermined gas into at least one of the second mask surface plate and the projection unit, and for sucking the gas in the clearance to exhaust the gas to the outside. It can be done.
- the apparatus further includes at least one of a gas supply mechanism that supplies a specific gas to an optical path space that forms an optical path of the illumination light inside the shielding member, and an exhaust mechanism that exhausts gas in the optical path space. It can be.
- the illumination light may be vacuum ultraviolet light having a wavelength of 190 nm or less
- the specific gas may be one of nitrogen and a rare gas.
- the present invention can be said to be a device manufacturing method using the exposure apparatus of the present invention.
- FIG. 1 is a view schematically showing an exposure apparatus according to one embodiment of the present invention.
- FIG. 2 is a perspective view showing the reticle stage and its vicinity with a part thereof omitted.
- FIG. 3 is a longitudinal sectional view of the reticle stage.
- FIG. 4A is a sectional view taken along line AA of FIG. 3, and FIG. 4B is a sectional view taken along line BB of FIG.
- FIG. 5A is a longitudinal sectional view showing a configuration of a first shielding mechanism
- FIG. 5B is a longitudinal sectional view showing a configuration of a second shielding mechanism.
- FIG. 6 is a flowchart for explaining the device manufacturing method according to the present invention.
- FIG. 7 is a flowchart showing a specific example of step 304 of FIG. BEST MODE FOR CARRYING OUT THE INVENTION
- FIG. 1 schematically shows an exposure apparatus 100 according to one embodiment.
- the exposure apparatus 100 irradiates an exposure illumination light (hereinafter, referred to as “exposure light”) EL as illumination light to a reticle R as a mask, and the reticle R and a wafer W as an object.
- Exposure light an exposure illumination light
- a reticle R as a mask
- the reticle R and a wafer W as an object.
- Exposure light exposure illumination light
- EL exposure illumination light
- the exposure apparatus 100 emits light from a light source (not shown), an illumination unit ILU connected to the light source via a light transmission optical system, a reticle stage RST as a mask stage holding the reticle R, and a reticle R.
- a projection unit PU for projecting the exposure light EL onto the wafer W, a wafer stage WST for holding the wafer W, and control systems for them, and a support base BD for supporting each component are provided.
- a light source emitting light belonging to the vacuum ultraviolet region having a wavelength of about 120 nm to about 190 nm, for example, a fluorine laser (F 2 laser) having an output wavelength of 157 nm is used.
- the light source is connected to one end of an illumination system housing 102 constituting the illumination unit ILU via a light transmission optical system (not shown) partially including an optical axis adjustment optical system called a beam matching unit.
- the light source is actually installed in a low-clean service room different from the clean room in which the exposure apparatus body including the illumination unit I and the projection unit PU is installed, or in a utility space below the clean room floor.
- the illumination unit ILU includes an illumination system housing 102 for isolating the interior from the outside, and an illumination uniformity optical system including an optical integrator arranged in a predetermined positional relationship inside the illumination unit housing, a relay lens, a variable ND filter, An illumination optical system including a reticle plumbing, a mirror for bending the optical path, and the like (both not shown).
- an optical integrator a fly-eye lens, a rod integrator (internal reflection type integrator), a diffractive optical element, or the like is used.
- the illumination unit of the present embodiment is similar to those disclosed in, for example, Japanese Patent Application Laid-Open No. Hei 6-349701 and US Patent Nos. 5,534,970 corresponding thereto. It has a configuration. To the extent permitted by the national laws of the designated country or elected elected country specified in this international application, the disclosures in the above US patents will be incorporated herein by reference.
- a slit-shaped illumination area (a slit-shaped area elongated in the X-axis direction defined by the reticle blind) on the reticle R on which a circuit pattern or the like is formed is exposed to the exposure light E. Illuminate with almost uniform illuminance.
- a flat plate-shaped light transmission window (not shown) is provided near the reticle R side end in the illumination system housing 102. This light transmission window has a function of transmitting the exposure light EL from the illumination unit I and maintaining the interior of the illumination system housing 102 in an airtight state.
- the light-transmitting window is not limited to a flat-shaped window, but may be used instead of the above-mentioned light-transmitting window by fixing the lenses that constitute the lighting units I and U in the lighting system housing 102 in an airtight manner. It is good.
- a material of a member that transmits the exposure light EL such as a lens, an illuminance uniforming optical system, and a light transmission window a material having a high transmittance to a vacuum ultraviolet light, for example, is used. It is desirable to use fluorite. ⁇
- fluorine-doped quartz so-called modified quartz
- modified quartz which partially excludes hydroxyl groups to about 10 ppm or less and contains about 1% of fluorine.
- fluorine-doped quartz it is also possible to use ordinary quartz, quartz having only a small number of hydroxyl groups, and quartz added with hydrogen.
- fluoride crystals such as magnesium fluoride and lithium fluoride may be used.
- the support base BD includes a first base 111 provided on a floor F of a clean room, and a second base 112 supported by the first base 111.
- the first frame 1 1 1 is composed of a plurality (four in this example) of vibration isolating units 13 a to 13 d provided on the floor F of the clean room (the vibration isolating unit 13 3 c and 13 d are not shown), and a plurality of (four in this case) legs 12 a to 12 d provided through the anti-vibration units 13 a to 13 d (FIG. 1).
- the legs 12c and 12d on the far side of the drawing are not shown), and a plate-like support member 11a that is supported substantially horizontally by the two legs 12a and 12c of these legs.
- a plate-shaped support member 11b substantially horizontally supported by the remaining two legs 12b and 12d.
- the second base 1 1 2 includes a projection system side surface plate 3 as a second mask surface plate horizontally supported by support members 11 a and 11 b, and a projection system side surface plate 3 It is provided between the illumination system side surface plate 2 as the first mask surface plate and the projection system side surface plate 3 and the illumination system side surface plate 2, and the projection system side surface plate 3 and the illumination system side A plurality (four in this case) of support pillars (spacers) 26 a to 26 d that form a predetermined space between the platen 2 and the support pillar 26 c to 26 d (in FIG. 1, the support pillar 26 c 26 d is not (See Fig. 4A and Fig. 4B) You.
- the illumination system-side surface plate 2 and the projection system-side surface plate 3 will be described.
- the illumination system-side surface plate 2 and the projection system-side surface plate 3 are made of materials such as natural stone, ceramic, and stainless steel, respectively.
- the surfaces on the opposite sides that is, the lower surface of the illumination system-side surface plate 2 and the upper surface of the projection system-side surface plate 3) are polished so that the unevenness becomes a smooth plane of several meters or less.
- the surface plates 2 and 3 are made of natural stone or porous ceramic, it is desirable to coat the surface with a fluororesin or the like to prevent the adsorption and desorption of oxygen and water vapor on the surface. .
- the platens 2 and 3 are formed with rectangular openings 2a and 3a as light transmitting portions for transmitting the exposure light.
- the reticle stage RST is disposed between the illumination system-side surface plate 2 and the projection system-side surface plate 3 constituting the second frame 11 with a predetermined clearance from each surface plate, and a reticle R And can move at least in the Y-axis direction.
- the position information of the reticle stage RST is constantly measured at a resolution of, for example, about 0.5 to 1 nm by the reticle laser interferometer 9 shown in FIG. 1 via a movable mirror provided on the reticle stage RST. It has become.
- the configuration of the reticle stage R ST and the reticle laser interferometer 9 will be described later in further detail.
- the projection unit PU is a unit in which an optical system (projection optical system) including a lens made of fluoride crystals such as fluorite and lithium fluoride and a reflecting mirror is sealed with a lens barrel 109.
- an optical system projection optical system
- a refraction system having a bilateral telecentricity and a projection magnification ⁇ of, for example, 14 or 15 is used. Therefore, as described above, when the reticle R is illuminated by the exposure light EL from the illumination unit ILU, the pattern on the reticle R corresponding to the illumination area is projected onto the wafer W by the projection unit PU (projection optical system).
- a reduced image (partial image) of the pattern portion which is partially reduced and projected and illuminated with the exposure light EL is formed.
- the projection unit PU is supported in a non-contact manner by a later-described wafer-side shielding mechanism 22 via a flange FLG provided at a slightly lower portion in the center of the lens barrel 109 in the height direction.
- the projection optical system is not limited to a refraction system, and any of a catadioptric system and a reflection system can be used.
- the lower end of the projection unit PU is inserted into the wafer chamber 40 formed inside the partition wall 20 provided on the floor F via the plurality of vibration isolation units 25.
- a wafer stage WST which holds the wafer W and moves in a two-dimensional direction (XY two-dimensional direction) is provided.
- the wafer stage WST is provided inside the wafer chamber 40 by a wafer drive system (not shown) as a drive device including, for example, a magnetic levitation type or a gas levitation type linear motor that floats by static pressure of a pressurized gas.
- the wafer is freely driven in the XY plane along the upper surface of the wafer stage base BS provided via a plurality of vibration isolation units 19 in a non-contact manner.
- the wafer stage WST is actually driven freely in the XY plane (including rotation around the Z-axis (0z rotation)). It is equipped with a wafer table 135 for holding the wafer W.
- a wafer holder (not shown) is provided on the wafer table 135, and the wafer W is held by the wafer holder, for example, by vacuum suction.
- the wafer table 135 is minutely driven by a drive system (not shown) in the Z-axis direction and the tilt direction with respect to the XY plane.
- the wafer stage WS T is actually a force including a plurality of stages and tables. Below the wafer stage WS T, the wafer drive system moves the wafer stage WS T around the X, Y, Z, and X axes.
- a single stage that can be driven in six degrees of freedom, 0x for rotation, 0y for rotation about the Y axis, and 0z. The description will be made as follows.
- the position information of the wafer stage WST is, for example, about 0.5 to 1 nm by a wafer laser interferometer (hereinafter referred to as “wafer interferometer”) 18 via a moving mirror 17 provided on the upper surface of the wafer table 135. It is always measured with a resolution of.
- wafer interferometer wafer laser interferometer
- the moving mirror is provided with an X moving mirror having a reflecting surface orthogonal to the X axis and a Y moving mirror having a reflecting surface orthogonal to the Y axis.
- An X laser interferometer for measuring the directional position and a Y laser interferometer for measuring the Y direction are provided. In FIG. 1, these are representatively shown as a moving mirror 17 and a wafer interferometer 18, respectively. I have. Note that, for example, the end surface of the wafer stage may be mirror-finished to form a reflection surface (corresponding to the reflection surface of the movable mirror 17).
- the X-laser interferometer and the Y-laser interferometer are multi-axis interferometers having a plurality of measurement axes.
- the laser interferometer 18 measures the positions of the wafer table 135 in the directions of X, ⁇ , ⁇ z ⁇ y % ⁇ X in five degrees of freedom.
- the position information (or speed information) of the wafer stage WST from the above-described wafer interferometer 18 is sent to a control device (not shown), and the control device performs processing based on the position information (or speed information) of the wafer stage WS.
- the wafer stage WST is driven via the drive system.
- the illumination system housing 102, the lens barrel 109 of the projection unit PU, and the inside of the wafer chamber 40 are airtight.
- a gas having high transmittance to vacuum ultraviolet light such as nitrogen or a rare gas (hereinafter referred to as “low-absorbing gas” as appropriate)
- oxygen, water vapor, Strong absorption for light in this wavelength band such as hydrogen-based gas.
- it is necessary to exclude gases that have good absorption characteristics hereinafter referred to as “absorbent gas” as appropriate).
- the interior of the illumination system housing 102, the lens barrel 109, and the wafer chamber 40 are connected to the interior of the illumination system housing 102, the chambers 40, for example, at 22 ° C. Nitrogen or a rare gas controlled at a predetermined temperature is sent, and the inside gas is exhausted through the exhaust pipes 108, 29, and 23, thereby replacing each inside with a low-absorbent gas.
- a gap (clearance) between the illumination system housing 102 and the illumination system side platen 2 is provided with an illumination system for shielding gas entering (inflowing) from the outside into the gap.
- a side-shielding mechanism 7 is provided in a gap between the projection-system-side base 3 and the projection optical system PL.
- a projection-system-side shielding mechanism 8 that shields gas entering (inflowing) from the outside into the gap is provided in the gap between the flange FLG of the projection unit PU barrel 109 and the partition wall 20 of the wafer chamber 40.
- a wafer-side shield that shields gas from entering (inflowing) into the gap from outside.
- a mechanism 22 is provided in the gap between the flange FLG of the projection unit PU barrel 109 and the partition wall 20 of the wafer chamber 40.
- These shielding mechanisms 7, 8, and 22 are respectively held by holding mechanisms (not shown), and a predetermined clearance is formed between members located above and below. The shielding mechanisms 7, 8, and 22 will be described in more
- the control system is mainly configured by a control device (not shown).
- the control device includes a so-called microcomputer (or workstation) including a CPU (central processing unit), a ROM (read only memory), a RAM (random access memory), and the like.
- a CPU central processing unit
- ROM read only memory
- RAM random access memory
- Vw y8 ⁇ V (yS is from reticle R to wafer W
- Reticle stage RST is driven in the Y-axis direction based on the measurement values of reticle laser interferometer 9 and wafer interferometer 18 so as to scan at The position and speed of the reticle stage RS and the wafer stage WST are respectively controlled.
- FIG. 2 is a perspective view showing the reticle stage RST partially omitted
- FIG. 3 is a longitudinal sectional view of the reticle stage RST.
- FIG. 4A is a sectional view taken along line AA of FIG. 3
- FIG. 4B is a sectional view taken along line BB of FIG.
- the reticle stage RST is held in a non-contact manner with the second gantry 1 1 2 while being sandwiched between the illumination system side stool 2 and the projection system side stool 3 constituting the second gantry 1 12 as described above. Have been. As shown in FIG. 2, reticle stage RST was held in a state of being surrounded by reticle coarse movement stage 4 and three directions of soil Z direction and + Y direction by reticle coarse movement stage 4. A reticle fine movement stage 5 is provided.
- the reticle coarse movement stage 4 has an upper plate part 46a arranged at a minute interval of a few microns below the illumination system side platen 2 and a minute micron from the upper surface of the projection system side platen 3.
- a lower plate portion 46c is provided at an interval, and an intermediate portion 46b is disposed between the upper plate portion 46a and the lower plate portion 46c.
- the movers 48a and 48b of the linear motors RM1 and RM2 are provided on both side surfaces in the X-axis direction of the lower plate portion 46c via support members 47a and 47b.
- the member 47a and the mover 48a are not shown, see Fig. 4A).
- These movers 48 a and 48 b are driven in the Y-axis direction by electromagnetic interaction with stators 49 a and 49 b extending along the Y-axis direction, and thereby the reticle
- the coarse movement stage 4 is driven in the Y-axis direction.
- the above-mentioned stators 49a and 49b can be supported by the first frame 111 supporting the second frame 112, but separately from the first frame 111 on the floor F of the clean room.
- a support mechanism (not shown) may be provided via a vibration mechanism, and may be supported by this.
- the position where the movers 48a and 48b are attached is not limited to the lower plate portion 46c, but may be the intermediate portion 46b. Since the reticle coarse movement stage 4 is accelerated and decelerated by these movers 48 a and 48 b, its mounting position (position in the height direction) matches the center of gravity of the entire reticle coarse movement stage 4. It is desirable to let them.
- the reticle coarse movement stage 4 is driven in the Y-axis direction by the linear motors RM 1 and RM 2 as described above, but the opposing surfaces of the illumination system side plate 2 and the projection system side plate 3 are parallel to each other. Since the flatness of each surface is high, even if driving in the Y-axis direction, the minute spacing between the surface plates 2, 3 and the reticle coarse movement stage 4 is almost constant. Will be kept.
- the middle part 46 b has embedded therein Y-axis fine actuators AC 1 and AC 2 composed of voice coil motors and the like and an X-axis fine actuator AC 3.
- the movers of these fine actuators AC1 to AC3 are connected to a reticle fine movement stage 5 via stage holding members 42a, 42b and 42c, respectively. Accordingly, the reticle fine movement stage 5 is finely driven in the X, Y and 0 z directions (rotation around the Z axis direction) by the fine actuators AC1 to AC3.
- the reticle coarse movement stage 4 includes a differential exhaust type gas static pressure bearing for maintaining a predetermined clearance between the illumination system side surface plate 2 and the projection system side surface plate 3, and a reticle fine movement stage.
- a differential exhaust type gas static pressure bearing is provided to maintain a predetermined clearance between the bearings 5 and 5.
- the reticle holding mechanism 53 is connected to a vacuum pump (not shown) installed in the exposure apparatus via a vacuum pipe 54 introduced on the bottom member 55, and the reticle R is connected to the reticle holding mechanism.
- the vacuum pipe 54 is introduced through the reticle coarse movement stage 4 and into the reticle fine movement stage by a gas introduction terminal such as a VCR gas connector.
- the vacuum piping 44 in the reticle coarse movement stage 4 is bundled with a wiring bundle 39 together with other electric wiring connected to an actuator or the like, and connected to a vacuum pump.
- the vacuum pump may be provided in the exposure apparatus, but a vacuum pipe supplied from a vacuum pipe of a semiconductor factory or a pipe of reduced-pressure air may be used as a vacuum source. In this regard, the same applies to the vacuum pump described below.
- the partition wall 52 is provided at a side wall portion surrounding the four sides and at the upper end of the side wall portion, and has a central portion having substantially the same size as the reticle R for passing the exposure light EL as shown in FIG. And a ceiling formed with a rectangular opening 52 a having the following.
- the partition 52 and the bottom surface member 55 form a holding space SS for holding the reticle.
- the ceiling has an upper end face opposed to annular concave grooves 58, 59 described later.
- a plane mirror 91c as a reflecting member is provided outside the holding space SS of the reticle fine movement stage 5, and on the + X side surface of the partition wall 52, as shown in FIG. 4B.
- a light beam from a reticle laser interferometer 9c provided on the + X side of the flat mirror 91c is irradiated on the reflecting surface of the flat mirror 91c, and the X-axis of the reticle R is irradiated.
- the position in the direction is always detected by the reticle laser interferometer 9c with a resolution of, for example, about 0.5 to 1 nm.
- a prism-shaped corner cube (retro reflector) 9 1a, 9 as a reflecting surface is provided on the outside of the partition wall 52 (outside of the holding space SS) and near one Y-side end of the bottom member 55.
- 1b is provided via mounting members 104a and 104b (see FIG. 2).
- the corner cubes 91a and 91b are irradiated with laser beams from the reticle laser interferometers 9a and 9b.
- the position of the reticle R in the Y-axis direction is determined by the reticle laser interferometers 9a and 9b.
- it is always detected with a resolution of, for example, about 0.5 to 1 nm.
- the + X side end face and the 1Y side end face of the bottom member 55 may be mirror-finished.
- first bearing J a differential exhaust type gas static pressure bearing (hereinafter referred to as “first bearing J”) that forms a minute gap between the reticle coarse movement stage 4 and the projection system side platen 3
- first bearing J On the bottom surface of the lower plate portion 4 6 c of the reticle coarse movement stage 4, an air supply side annular groove 31 is formed slightly inside the outer edge portion thereof, and the exhaust side is formed outside the air supply side annular groove 31.
- An annular concave groove 32 is formed in the supply-side annular concave groove 31.
- the annular concave groove 31 branches off from one end of a substantially U-shaped air supply conduit 35 formed inside the reticle coarse movement stage 4.
- the other end of the air supply line 35 is connected to one end of an air supply line 37, and the other end of the air supply line 37 is connected to an unillustrated gas supply line.
- the exhaust side annular concave groove 32 is provided with an exhaust pipe branched from one end of a substantially U-shaped exhaust pipe 36 formed inside the reticle coarse movement stage 4.
- the other end of the exhaust pipe line 36 is connected to one end of an exhaust pipe 38, and the other end of the exhaust pipe 38 is connected to a vacuum pump (not shown). ing.
- the gas is sent from the gas supply device through the air supply pipe 37.
- Low-absorbing gas such as nitrogen or a rare gas is ejected from the supply-side annular groove 31 through the supply line 35 and the supply passage 13 1 formed inside the reticle coarse movement stage 4.
- the gas around the exhaust-side annular groove 32 is sucked by a vacuum pump (not shown) through the exhaust-side annular groove 32, the exhaust passage 1 32, the exhaust pipe 36, and the exhaust pipe 38. Is done.
- the reticle coarse movement stage 4 can be floated by a small distance from the projection system side platen 3 and the inside air supply side annular groove 31 from the inside air supply side annular groove 31 into the clearance (clearance) between them.
- the first bearing is substantially constituted by the entire lower plate portion 46c.
- a differential exhaust type gas static pressure bearing (hereinafter, referred to as a “second bearing”) for hermetically sealing between the reticle coarse movement stage 4 and the illumination system side platen 2 will be described.
- a supply-side annular groove 27 is formed slightly inside the outer edge portion thereof, and an exhaust-side annular groove is formed outside the supply-side annular groove 27.
- An annular concave groove 28 is formed.
- An air supply passage 133 branched from the other end of the air supply pipe 35 formed inside the reticle coarse movement stage 4 is connected to the air supply side annular concave groove 27.
- the exhaust-side annular concave groove 28 is connected to an exhaust passage 134 branched from the other end of the above-described exhaust pipe 36 formed inside the reticle coarse movement stage 4.
- a low-absorbing gas such as nitrogen or a rare gas sent from the gas supply device via the air supply pipe 37 is supplied to the air supply pipe formed inside the reticle coarse movement stage 4. 3 5 and the gas supply passage 1 3 3, gas is ejected from the gas supply side annular groove 27, and gas around the gas exhaust side annular groove 28 is exhausted into the gas exhaust side annular groove 28, the gas exhaust passage 1 34, to the vacuum pump (not shown) via the exhaust line 36 and the exhaust line 38 More sucked.
- a predetermined clearance can be maintained between the reticle coarse movement stage 4 and the illumination system side platen 2, and the gas flows from the inside to the outside of the clearance (see the dotted arrow in FIG. 3).
- the second bearing is constituted substantially by the entire upper plate portion 46a.
- a differential exhaust gas static pressure bearing (hereinafter, referred to as a “third bearing J”) that forms a minute gap between the lower plate portion 46 c of the reticle coarse movement stage 4 and the reticle fine movement stage 5. Will be described.
- an air supply-side annular groove 33 is formed outside the opening 4 b, and further on the outside of the air supply-side annular groove 33, the exhaust side is formed.
- An annular concave groove 34 is formed.
- the aforementioned air supply passage 13 1 formed inside the reticle coarse movement stage 4 is connected to the air supply side annular concave groove 33.
- the exhaust-side annular groove 34 is connected to the above-described exhaust passage 13 formed inside the reticle coarse movement stage 4.
- a low-absorbing gas such as nitrogen or a rare gas sent from the gas supply device via the air supply pipe 37 is supplied to the air supply pipe formed inside the reticle coarse movement stage 4. 3 5 and the air supply passage 13, the gas is ejected from the supply-side annular groove 33, and the gas around the exhaust-side annular groove 34 is exhausted by the exhaust-side annular groove 34, the exhaust passage 13 2. It is sucked by a vacuum pump (not shown) through the exhaust pipe 36 and the exhaust pipe 38.
- a vacuum pump not shown
- the lower end surface of the reticle fine movement stage 5 is arranged close to the annular concave grooves 33, 34, so that the gas injected from the supply side annular concave groove 33
- the fine motion stage 5 is pushed up and flows around the fine motion stage 5, and is sucked in the exhaust side annular groove 34. That is, the fuel is injected from the supply-side annular groove 33.
- the reticle fine movement stage 5 is slightly lifted from the reticle coarse movement stage 4 by the lifting action of the gas, thereby achieving the above-described close proximity arrangement (floating support) .
- the reticle coarse movement stage 4 and the reticle fine movement stage 5 A gas flow (see dotted arrows in FIG.
- the third bearing is substantially constituted by the lower plate portion 46c.
- a differential exhaust gas static pressure bearing (hereinafter, referred to as a "fourth bearing") for hermetically sealing between the upper plate portion 46a of the reticle coarse movement stage 4 and the reticle fine movement stage 5 will be described. explain.
- an air supply side annular groove 58 is formed outside the opening 4 a, and further on the air supply side annular groove 58 outside the air supply side annular groove 58.
- An annular concave groove 59 is formed.
- the above-described air supply passage 133 formed inside the reticle coarse movement stage 4 is connected to the air supply side annular concave groove 58.
- the exhaust side annular concave groove 59 is connected to the above-described exhaust passage 134 formed inside the reticle coarse movement stage 4.
- a low-absorbing gas such as nitrogen or a rare gas sent from the gas supply device via the air supply pipe 37 is supplied to the air supply pipe formed inside the reticle coarse movement stage 4. 3 5 and the air supply passage 1 3 3, gas is ejected from the air supply-side annular groove 58, and gas around the exhaust-side annular groove 59 is exhausted by the exhaust-side annular groove 59, the exhaust passage 1 34, is sucked by a vacuum pump (not shown) through the exhaust pipe 36 and the exhaust pipe 38.
- a vacuum pump not shown
- the upper end surface of reticle fine movement stage 5 is disposed below annular concave grooves 58, 59, so that reticle fine movement stage 5 and reticle coarse movement
- a predetermined clearance can be maintained between the upper plate portion 46a and the gas flow from the supply-side annular groove 58 to the exhaust-side annular groove 59 in the clearance (see FIG. 3 (see dotted arrow). Therefore, it is possible to prevent external air (oxygen and water vapor) from entering (inflowing) from the outside of the reticle fine movement stage 5 to the inside of the reticle fine movement stage 5, that is, to the space side where the reticle R is held.
- the fourth bearing is substantially constituted by the upper plate portion 46a.
- the relative movement amount between the reticle coarse movement stage 4 and the reticle fine movement stage 5 is very small enough to correct the position control of the reticle coarse movement stage 4 by the linear motors RM1 and RM2. It is an amount within a width of about jum. For this reason, the differential exhaust performed by the reticle coarse moving stage 4 (ie, the differential exhaust by the third and fourth bearings) with respect to the upper and lower end surfaces of the reticle fine moving stage 5 described above Even small amounts may not be a problem. In addition, when the end faces of the two arranged close to each other have sufficient stiffness and airtightness, the bearing between the reticle coarse movement stage 4 and the reticle fine movement stage 5 (ie, the third And the fourth bearing) may not be required.
- Each stage is supported in a non-contact manner by the first to fourth bearings described above, and the reticle coarse movement stage 4 and the illumination system side surface plate 2 are projected into the space where the reticle R is held. Gas inflow from the outside via the gap (clearance) between the system side platen 3 and the gap (clearance) between the reticle coarse movement stage 4 and the reticle fine movement stage 5 is almost completely prevented. Will be.
- the gas supply mechanism and the gas exhaust mechanism it is possible to replace the inside of the space holding the reticle R with nitrogen or a rare gas that absorbs little exposure light, in addition to the above airtightness.
- the supply branch pipes 22 1 a and 22 1 b are placed between the supply side annular groove 58 and the opening 4 a, and between the supply side annular groove 33 and the opening 4 b. It may be provided.
- the illumination system side shielding mechanism 7 is held by a holding mechanism (not shown) via a predetermined clearance between the illumination system housing 102 and the illumination system side platen 2. As shown in A, it is configured to include a cylindrical shielding member 7a having an internal space IS and the like.
- a first air supply groove 89 having an annular shape and an annular first exhaust groove 87 having a larger diameter than the first air supply groove 89 are formed on the upper end surface of the shielding member 7a.
- a second air supply groove 88 having an annular shape and a second exhaust groove 86 having a larger diameter than the second air supply groove 88 are formed on the lower end surface of the shielding member 7a. I have.
- the first air supply groove 89 and the second air supply groove 88 are connected to a plurality (for example, three) of air supply lines 85 formed in the shielding member 7a, and are connected to the first exhaust groove 89.
- the grooves 87 and the second exhaust grooves 86 are connected to a plurality (for example, three) of exhaust pipes 84 formed in the shielding member 7a.
- Each of the air supply pipes 85 is connected to the other end of the air supply pipe 81 whose one end is connected to a gas supply device (not shown) from the outside of the shielding member 7a.
- the exhaust pipe 8 4 from the outside of the shielding member 7 a, also c other end of the exhaust pipe 82 in which one end thereof is connected to a vacuum pump (not shown) are connected, and these Separately, the shielding member 7a is formed with a gas supply pipe 118 and a gas exhaust pipe 117 so as to communicate from the outside to the internal space IS.
- One end of 18 is connected to a gas supply device (not shown).
- the other end of the gas supply pipe 83 is connected, and the other end is connected to a nozzle 119.
- the other end of the gas exhaust pipe 90 whose one end is connected to a vacuum pump (not shown) is connected to one end on the outside of the gas exhaust pipe 117.
- nitrogen is supplied from the gas supply mechanism to the internal space IS through the gas supply pipe 83, the gas supply pipe 118, and the nozzle 119.
- the rare gas are supplied, and the gas in the internal space IS is exhausted by the vacuum pump through the gas exhaust pipes 117 and the gas exhaust pipe 90. In this way, the gas in the internal space IS is replaced with nitrogen or a rare gas.
- the lower end of the lighting system housing 102 is supplied from the air supply groove 89, the above gas is supplied into the gap (clearance) between the upper end of the shielding member 7a, and the gas in the gap is vacuum suctioned by the vacuum pump via the exhaust pipe 84 and the exhaust pipe 82.
- a gas flow from the inside to the outside is formed in the gap.
- the above gas flows into the gap (clearance) between the air supply groove 88 and the lower end surface of the shielding member 7 b and the upper end surface of the lighting system side platen 2.
- the gas is supplied and the gas in the gap is exhausted from the exhaust groove 86, a gas flow from the inside to the outside is formed in the gap.
- the illumination system side shielding mechanism 7 since the illumination system side shielding mechanism 7 is not in contact with the illumination system housing 102 and the illumination system surface plate 2, the vibration of the illumination system surface plate 2 is transmitted to the illumination system housing 102. However, the performance of the lighting unit ILU does not deteriorate. However, in practice, the illumination system side shielding mechanism 7 is provided by the illumination system housing 102 or the illumination system side platen 2 Vibration is not transmitted to the other even if it is in contact with either one of them, so that either one of the end faces may be contacted and fixed. In this case, it is desirable to provide an O-ring or the like on the contact surface to improve airtightness.
- the holding mechanism for holding the illumination system side shielding mechanism 7 be provided separately from the support base BD.
- expansion and contraction and tilt adjustment are possible so that the distance between the illumination system side shielding mechanism 7 and the object (illumination system housing 102 or illumination system side platen 3) placed in close proximity can be adjusted optimally.
- the bellows and the drive mechanism may be provided.
- the projection system-side shielding mechanism 8 is configured similarly to the illumination system-side shielding mechanism 7.
- the projection system-side shielding mechanism 8 is disposed between the projection system-side platen 3 and the projection unit PU, and a predetermined clearance is provided for each of them. It has a cylindrical shielding member 8a and the like having an internal space s P held by the holding mechanism.
- Nitrogen or a rare gas is supplied to the internal space SP of the shielding member 8a from a gas supply device (not shown) via a gas supply pipe 183, a gas supply pipe 218, and a nozzle 219.
- the gas in the internal space SP is exhausted by a vacuum suction mechanism (not shown) through the gas exhaust pipes 2 17 and the gas exhaust pipe 190, thereby performing gas replacement in the internal space SP.
- Nitrogen or a rare gas is supplied from the air supply grooves 188, 189 to the gap (clearance) above and below the shielding member 8 a, and the exhaust grooves 186, 1 89 are also provided.
- a gas flow from the inside to the outside of the shielding member 8a is formed in each gap, so that the gas flows from the outside of the shielding member 8a to the space SP. It is possible to prevent the inflow of gas. That is, with such a configuration, the second sealing mechanism on the upper and lower end surfaces of the shielding member 8a is realized.
- the projection system side shielding mechanism 8 since the projection system side shielding mechanism 8 is not in contact with the projection system side platen 3 and the projection unit PU, the vibration of the projection system side platen 3 is transmitted to the projection unit PU, and the thread; None do. However, in practice, even if the projection system side shielding mechanism 8 is in contact with either the projection system side surface plate 3 or the projection unit PU, no vibration is transmitted to the other, so that either end face is It may be fixed by contact. In this case, it is desirable to provide an O-ring or the like on the contact surface to improve airtightness.
- the wafer-side shielding mechanism 22 is disposed between the upper surface of the third shielding mechanism 22 and the lower surface of the flange FLG, and between the lower surface of the third shielding mechanism 22 and the partition wall 20 of the wafer chamber 40.
- a predetermined clearance is formed between the upper surface and the upper surface.
- the wafer-side shielding mechanism 22 is also configured in the same manner as the first and second shielding mechanisms 7 and 8 described above, and the upper and lower end faces of the wafer-side shielding mechanism 22 are directed from inside to outside. A gas flow is formed. This makes it possible to prevent gas outside the wafer-side shielding mechanism 22 from flowing into the interior space of the third shielding mechanism 22.
- the wafer-side shielding mechanism 22 By providing the wafer-side shielding mechanism 22 in this manner, the inflow of outside air into the wafer chamber 40 can be suppressed as much as possible.
- the gas supply mechanism of the illumination system side shielding mechanism 7 is constituted by the gas supply mechanism (not shown), the gas supply pipe 83, the gas supply pipe 118, and the nozzle 119.
- a vacuum pump (not shown), a gas exhaust pipe 90, and a gas exhaust pipe 117 constitute an exhaust mechanism of the illumination system side shielding mechanism 7.
- Gas not shown The supply mechanism, gas supply pipe 18 3, gas supply pipe 2 18, and nozzle 2 19 constitute the gas supply mechanism of the projection system side shielding mechanism 8, and a vacuum pump (not shown), gas exhaust pipe 190,
- An exhaust mechanism of the projection system side shielding mechanism 8 is constituted by the gas exhaust pipes 21.
- the holding space SS is provided inside the reticle stage RST that can move at least in the Y-axis direction on a moving plane that is substantially perpendicular to the optical path of the exposure light EL. Is formed, and the reticle R is held in the holding space SS.
- An illumination system side surface plate 2 and a projection system side surface plate 3 are arranged on the illumination unit ILU side and the projection unit PU side of the reticle stage RST with a predetermined clearance therebetween.
- the illumination system-side surface plate 2 and the projection system-side surface plate 3 have openings 2a and 3a, respectively, as passages for the exposure light E. Is the moving guide surface of the reticle stage RST.
- the exposure light EL enters the holding space SS of the reticle stage RST through the opening 2a of the illumination system side plate 2, and the exposure light EL illuminates the reticle R and transmits the reticle R.
- Light is emitted from the opening 3 a of the projection system side surface plate 3.
- the reticle stage is arranged with a predetermined clearance between the illumination system side surface plate 2 and the projection system side surface plate 3, thereby increasing the gap (clearance) between each surface plate and the reticle stage RST. The outside air is effectively prevented from entering (inflowing into) the holding space SS through the space.
- the first bearing and the second bearing allow the reticle stage RST (more specifically, the reticle coarse movement stage 4) and the illumination system side plate 2 and the projection system side plate 3 to move from inside to outside. Since a gas flow toward the holding space SS is formed, the inflow of outside air into the holding space SS can be prevented, and the airtightness of the holding space SS can be further improved.
- the third bearing and the fourth bearing make it possible to prevent the outside air from flowing into the holding space SS via the gap between the reticle coarse movement stage 4 and the reticle fine movement stage 5.
- reticle fine movement stage 5 can be reduced in weight, and the position control accuracy of reticle fine movement stage can be improved, and, consequently, exposure. Accuracy can be improved.
- the optical path of the exposure light from the illumination unit ILU (illumination system housing 102) to the projection unit PU (lens tube 109) is protected from outside air. It is possible to shield from. Then, by replacing the space in which the optical path of the exposure light is disposed with a low-absorbing gas such as nitrogen or a rare gas, absorption of the exposure light is suppressed, and highly accurate exposure can be realized. Further, in the present embodiment, a reflection mirror used for measuring the position of the reticle fine movement stage 5 is provided outside the holding space of the reticle fine movement stage 5, and the laser light from the laser interferometer is applied to the reflection mirror.
- a reflection mirror used for measuring the position of the reticle fine movement stage 5 is provided outside the holding space of the reticle fine movement stage 5, and the laser light from the laser interferometer is applied to the reflection mirror.
- Irradiation measures the position of the reticle fine-movement stage, so the interferometer optical path is not located in the purge space, and is not affected by measurement errors due to fluctuations in gas purge accuracy. No. Therefore, the position control performance of the reticle stage is improved, and the exposure accuracy can be improved.
- the reticle stage RST and the wafer stage WST which are vibration sources, and the other parts are separately supported, and the vibration is hardly transmitted to an optical system or the like.
- the effect of vibration on the vehicle is reduced as much as possible.
- the openings are formed as the light transmitting portions of the illumination system side surface plate 2 and the projection system side surface plate 3.
- the present invention is not limited to this.
- the portion through which the exposure light is transmitted may be constituted by a transparent member.
- the transparent member in this case, fluorite or modified quartz can be used similarly to the projection optical system and the illumination optical system.
- a low-absorbing gas such as nitrogen or a rare gas is used as the gas used for the differential exhaust gas static pressure bearing and the seal mechanism.
- the present invention is not limited to this. If the amount of exhaust air is larger than the amount of air supplied by the gas supply device, air or the like may be adopted.
- the projection unit PU is provided with a straight cylindrical lens barrel.
- the lens barrel is bent in the middle.
- the present invention can be applied at all by arranging a differential pumping type air seal mechanism on the reticle-side end surface or the wafer-side end surface of the lens barrel.
- the upper plate portion 46a and the lower plate portion 46c constituting the reticle coarse movement stage 4 are connected only by the intermediate portion 46b.
- the gas supplied to each bearing and the gas supplied to the holding space SS where the reticle is held are controlled to a predetermined temperature (for example, 22 ° C.) It is desirable to use one from which foreign substances such as organic substances, water vapor and the like have been sufficiently removed.
- each bearing has a double structure having an annular groove for air supply and an annular groove for exhaust has been described.
- the present invention is not limited to this.
- the same air-tightness effect can be obtained by supplying gas from a groove located in the middle of them and sucking gas from two grooves sandwiching the middle groove.
- a bearing having a quadruple structure in which the above-described double structure is formed in a double manner can be employed. That is, the number of grooves can be arbitrarily selected for each bearing.
- the present invention is not limited to this, and the exposure method of the step 'and' repeat method is not limited to this.
- the present invention can also be suitably applied to an apparatus (so-called stepper).
- an exposure light source F 2 laser, K r 2 laser, A r 2 laser, A r F excimer laser, such as K r F excimer laser
- a laser light source for example, when vacuum ultraviolet light is used as the illumination light for exposure, for example, a single-wavelength laser beam in the infrared or visible region oscillated from a DFB semiconductor laser or a fiber laser is irradiated with, for example, erbium (or erbium and It is also possible to use harmonics that are amplified by a fiber amplifier doped with both ytterbium) and wavelength-converted to ultraviolet light using a nonlinear optical crystal.
- the magnification of the projection unit may be not only a reduction system but also any one of an equal magnification and an enlargement system.
- the illumination unit and projection unit which consist of multiple lenses, are incorporated into the main body of the exposure apparatus, optically adjusted, and a wafer stage (or reticle stage in the case of a scan type) consisting of many mechanical parts is installed in the main body of the exposure apparatus. Attach and connect the wiring and piping, assemble the partitions that compose the reticle chamber and wafer chamber, connect the gas piping system, connect each part to the control system, and make comprehensive adjustments (electric adjustment, operation check
- the exposure apparatus according to the present invention such as the exposure apparatus 100 of the above embodiment, can be manufactured. It is desirable that the exposure apparatus be manufactured in a clean room where the temperature, cleanliness, etc. are controlled.
- the present invention also provides an exposure apparatus for transferring a device pattern onto a glass plate, which is used not only for an exposure apparatus used for manufacturing a semiconductor element, but also for a display including a liquid crystal display element, a plasma display, or an organic EL.
- Applicable to the exposure equipment used in the manufacture of thin-film magnetic heads such as exposure equipment used to transfer device patterns onto ceramic wafers, imaging devices (such as CCDs), micromachines, and the production of DNA chips. be able to.
- micro devices such as semiconductor elements, glass substrates or silicon are used to manufacture reticles or masks used in optical exposure equipment, EUV exposure equipment, X-ray exposure equipment, electron beam exposure equipment, etc.
- the present invention can be applied to an exposure apparatus that transfers a circuit pattern onto a wafer or the like.
- FIG. 6 shows a flowchart of an example of manufacturing devices (semiconductor chips such as IC and LSI, liquid crystal panels, CCDs, thin-film magnetic heads, micromachines, and the like).
- a device function and performance design for example, circuit design of a semiconductor device
- a pattern design for realizing the function is performed.
- step 302 mask manufacturing step
- step 303 wafer manufacturing step
- a wafer is manufactured using a material such as silicon.
- step 304 wafer processing step
- step 304 wafer processing step
- step 304 device assembling step
- step 305 includes processes such as a dicing process, a bonding process, and a packaging process (chip encapsulation) as necessary.
- step 360 inspection step
- inspections such as an operation confirmation test and a durability test of the device created in step 305 are performed. After these steps, the device is completed and shipped.
- FIG. 7 shows a detailed flow example of step 304 in the semiconductor device.
- step 311 oxidation step
- step 312 CVD step
- step 3 13 electrode formation step
- step 3 1 4 ion implantation step
- ions are implanted into the wafer. Steps 3 1 1 through Each of the steps 314 constitutes a pre-processing step in each stage of the wafer processing, and is selected and executed according to a necessary process in each stage.
- the post-processing step is executed as follows.
- step 315 resist forming step
- step 316 exposure step
- step 317 development step
- Step 318 etching step
- step 319 resist removing step
- the exposure apparatus of the above embodiment is used in the exposure step (step 316), so that the exposure apparatus is miniaturized with almost no reduction in exposure accuracy. Providing a large number of devices in a semiconductor factory can improve the productivity of highly integrated devices. Industrial applicability
- the exposure apparatus of the present invention is suitable for transferring a device pattern onto an object such as a wafer. Further, the device manufacturing method of the present invention is suitable for producing a highly integrated device.
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
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AU2003211556A AU2003211556A1 (en) | 2002-03-01 | 2003-02-28 | Exposure equipment and device manufacturing method |
JP2003573686A JPWO2003075327A1 (ja) | 2002-03-01 | 2003-02-28 | 露光装置及びデバイス製造方法 |
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JP2002055380 | 2002-03-01 | ||
JP2002-55380 | 2002-03-01 | ||
JP2002/220103 | 2002-07-29 | ||
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PCT/JP2003/002374 WO2003075327A1 (en) | 2002-03-01 | 2003-02-28 | Exposure equipment and device manufacturing method |
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JP (1) | JPWO2003075327A1 (ja) |
AU (1) | AU2003211556A1 (ja) |
TW (1) | TW200305065A (ja) |
WO (1) | WO2003075327A1 (ja) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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JP2001118783A (ja) * | 1999-10-21 | 2001-04-27 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
JP2001272488A (ja) * | 2000-03-27 | 2001-10-05 | Toshiba Corp | ステージ装置 |
JP2001319873A (ja) * | 2000-02-28 | 2001-11-16 | Nikon Corp | 投影露光装置、並びにその製造方法及び調整方法 |
EP1172698A2 (en) * | 2000-07-14 | 2002-01-16 | Asm Lithography B.V. | Lithographic projection apparatus, device manufacturing method, device manufactured thereby and gas composition |
-
2003
- 2003-02-27 TW TW92104169A patent/TW200305065A/zh unknown
- 2003-02-28 WO PCT/JP2003/002374 patent/WO2003075327A1/ja active Application Filing
- 2003-02-28 AU AU2003211556A patent/AU2003211556A1/en not_active Abandoned
- 2003-02-28 JP JP2003573686A patent/JPWO2003075327A1/ja active Pending
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001118783A (ja) * | 1999-10-21 | 2001-04-27 | Nikon Corp | 露光方法及び装置、並びにデバイス製造方法 |
JP2001319873A (ja) * | 2000-02-28 | 2001-11-16 | Nikon Corp | 投影露光装置、並びにその製造方法及び調整方法 |
JP2001272488A (ja) * | 2000-03-27 | 2001-10-05 | Toshiba Corp | ステージ装置 |
EP1172698A2 (en) * | 2000-07-14 | 2002-01-16 | Asm Lithography B.V. | Lithographic projection apparatus, device manufacturing method, device manufactured thereby and gas composition |
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AU2003211556A1 (en) | 2003-09-16 |
TW200305065A (en) | 2003-10-16 |
JPWO2003075327A1 (ja) | 2005-06-30 |
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