WO2003056058A1 - A method of producing a composite electroconductive material - Google Patents

A method of producing a composite electroconductive material Download PDF

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Publication number
WO2003056058A1
WO2003056058A1 PCT/CN2002/000908 CN0200908W WO03056058A1 WO 2003056058 A1 WO2003056058 A1 WO 2003056058A1 CN 0200908 W CN0200908 W CN 0200908W WO 03056058 A1 WO03056058 A1 WO 03056058A1
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WIPO (PCT)
Prior art keywords
substrate
chemical fiber
nickel
conductive material
composite conductive
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PCT/CN2002/000908
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French (fr)
Chinese (zh)
Inventor
Pan Ting Hsueh
Dengfeng Xia
Xianghua Xia
Jieping Zhao
Weizhen Hao
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72G International Company Limited
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Application filed by 72G International Company Limited filed Critical 72G International Company Limited
Priority to AU2002357554A priority Critical patent/AU2002357554A1/en
Publication of WO2003056058A1 publication Critical patent/WO2003056058A1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
    • H01M4/00—Electrodes
    • H01M4/02—Electrodes composed of, or comprising, active material
    • H01M4/64—Carriers or collectors
    • H01M4/66—Selection of materials
    • H01M4/661—Metal or alloys, e.g. alloy coatings
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
    • C23C14/14—Metallic material, boron or silicon
    • C23C14/20—Metallic material, boron or silicon on organic substrates
    • C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
    • Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
    • Y02E60/10—Energy storage using batteries

Definitions

  • the invention relates to a method for preparing a composite conductive material by conducting a conductive treatment on an insulating object, and belongs to the technical field of electroplating. Background technique
  • the conductive substrates required for preparing foamed nickel have basically diversified.
  • most of the existing shielding materials are conductive cloths, which are costly, thin, and difficult to combine with plastics.
  • the widely used processes such as electroless plating and coating of conductive adhesives to prepare conductive substrates on non-metallic materials have clearly failed to meet environmental protection and product quality requirements.
  • the cost of electroless plating is high, the pollution is serious, and the conductive adhesive process cannot solve the quality problem well.
  • General vacuum plating products are susceptible to oxidation.
  • the current demand for electromagnetic shielding has very low requirements for resistance values, for example, about 0.25 ⁇ , and traditional processes cannot meet the requirements of modern industry. Summary of invention
  • the present invention addresses the shortcomings of the prior art, and provides a method for preparing a composite conductive material with good electrical conductivity.
  • the method includes: under the protection of argon, plating a substrate by vacuum ion sputtering on a substrate selected from nickel , Copper or platinum metal, used at 170 to 355 during plating. C ⁇ 5 ° C, vacuum degree 1. 1 ⁇ 3. 8 ⁇ — 1 to — 8 Kpa, especially 1 to
  • the substrate moving speed is about 0.4 ⁇ 4 m / min, preferably about 1.5 ⁇ 2.5 m / min
  • the ion sputtering concentration is about 0.1 ⁇ 2.5 g / Square meters, especially about 2 ⁇ 2.5 g / m2; then the existing plastic plating technology (such as continuous plating technology) and deep hole plating process are used to continuously plate metal on the above-mentioned plated substrate, the metal can be Selected from nickel, nickel + copper, nickel + copper + nickel, nickel + copper + gold, copper or pure gold or platinum; Wash, dry or cool the above materials and roll.
  • the invention also provides a composite conductive material prepared by the method of the invention. Detailed description of the invention
  • the method for preparing a composite conductive material of the present invention includes the following steps:
  • the first step is a first step:
  • a substrate is plated with a metal selected from nickel, copper or platinum by vacuum ion sputtering.
  • the temperature used during the plating is 170 to 355O ⁇ 5 C, and the degree of vacuum is 1.1 to 3.8 xlO— 1 to -8 Kpa, especially 1 to 9 ⁇ - 8 Kpa, the substrate moving speed is about 0.4 to 4 m / min, preferably about 1.5 to 2.5 m / min, and the ion sputtering concentration is about 0.1 to 2.5 g / square Meters, especially about 2 to 2.5 g / m2.
  • the amount of plated metal is about 0.3-0.53 g / m2.
  • the substrate may be various insulating materials.
  • the substrate is an insulating substrate selected from a polyurethane high-density foam sheet, a chemical fiber woven mesh, a chemical fiber woven cloth, or a chemical fiber felt.
  • the substrate may be a reticulated 12-hedron reticulated polyester polyurethane foam, a polyether polyurethane foam, a chemical fiber woven mesh, a chemical fiber woven cloth, a chemical fiber felt, or a polyester film of different thickness.
  • the chemical fiber is polyester, polyester, polypropylene or nylon.
  • the substrate is a pore size ranging from 440 to 5200 microns, preferably 300 to 500 ⁇ , and having a thickness of about 1 to 6 mm, especially about 1.0 to 3.5 mm, and more particularly
  • the substrate is a chemical fiber woven mesh, the mesh of which is hexagonal, square, or circular, and the diameter is 0.5 to
  • the diameter of the hexagonal hole and square hole is the length of the diagonal line of the center of the via hole, and the diameter of the chemical fiber is 0.1 ⁇ 0.2mm.
  • the second step Then, the existing plastic plating technology (such as continuous plating technology) and deep hole plating are used to continuously plate a metal on the above-mentioned plated substrate.
  • the metal may be selected from nickel, nickel + copper, nickel + copper + nickel, nickel + Copper + Gold, Copper or Pure Gold or Platinum.
  • the third step Wash, dry or cool the above materials and roll.
  • the present invention has the following excellent effects: 1.
  • the composite conductive material thus obtained has good electrical conductivity, and can be directly used as a conductive substrate required for nickel foam, and allows a substrate having a width of 1.02 meters to 1 Rapid electroplating at a speed of meters per minute. Since no electroless plating process is used, there is no problem of phosphorus pollution, and no sewage treatment is required, which directly reduces costs. 2.
  • the obtained composite conductive material has extremely low resistance value, it can be directly used as electromagnetic shielding, electromagnetic compatibility (EMI / EMC) material, used in mobile phone reception, plasma TV, TFT-LCD screen, TV Equipment, appliances, computers or military anti-magnetic interference equipment, medical and precision electronic equipment such as notebook computers and various power interfaces.
  • EMI / EMC electromagnetic compatibility
  • the method of the present invention can produce long film products and roll them into rolls, which is convenient for storage, transportation, and cutting.
  • blasted open-cell 12-hedral reticulated polyester foam with a pore diameter greater than or equal to 4500 microns is treated with a composite conductive process and then plated with 30-250g / m 2 of pure gold, and sintered at a temperature below 1300 ° F to reduce about 45-60 In minutes, continuous production of pure gold mesh carrier material for fuel cells can be realized, thereby replacing the existing hanging production method.
  • Example 1 Preparation of nickel-plated conductive material, the steps are as follows:
  • Matrix Polyurethane high-density foam sheet.
  • Ion nickel plating The substrate is nickel-plated by vacuum ion sputtering under the protection of argon gas at a temperature of 8 x 10- 8 KPa, the substrate moving speed is 2 m / min, and the ion sputtering concentration is 2 g / m2.
  • Embodiment 2 Copper plating is performed on a chemical fiber woven cloth, the steps are the same as those in Embodiment 1, except that:
  • the substrate is a polyester chemical fiber woven cloth with an ion sputtering concentration of 2.2 g / m 2.
  • Example 3 Platinum plating on a chemical fiber silk braided net, the steps are the same as in Example 1, except that:
  • the substrate is a nylon chemical fiber woven mesh with an ion sputtering concentration of 1.8 g / m 2.
  • the chemical fiber woven mesh has a hexagonal mesh with a hole diameter of 1.0 mm. The length of the diagonal line of the center of the via hole is used as the hole diameter.
  • the chemical fiber diameter is 0.2 mm.
  • Example 4 The steps of plating nickel on the chemical fiber felt are the same as in Example 2, except that the substrate is a polypropylene fiber felt and the ion sputtering concentration is 2.4 g / m2.
  • Example 5 Single-sided flame-composite polyester chemical fiber woven cloth and blasted open-cell polyester foam nickel plating, the steps are the same as in Example 2, except that the substrate is a polyester chemical fiber woven cloth and blasted open-cell polyester foam, and ion sputtering.
  • the concentration is 0.35 g / m2.
  • Example 6 Double-sided flame composite polyester chemical fiber woven fabric, non-woven fabric and blasted open-cell polyester foam nickel-plated, the steps are the same as in Example 2, except that the matrix is a polyester chemical fiber woven fabric, non-woven fabric and blasted open 5gram / square 45 ⁇ / m2 ⁇ Example 7. Polyester film double-sided nickel plating, the steps are the same as in Example 2, the different substrate is a polyester film, ion sputtering concentration of 0.45 g / square meter.

Abstract

This invention relates to a method of producing a composite electroconductive material by electroconducted treating an insulated substrate, in which applying a metal coat on the substrate by vacuum ion supttering under Ar, wherein the coating metal is selected from Ni, Cu or Pt, the temperature is 170 ~ 355 °C±5 °C, the degree of vacuum is 1.1 ~ 3.8 X 10-1 to-8 Kpa, the moving rate of the substrate is about 0.4 ~ 4 m/min., and the density of ion supttering is about 0.1 ~ 2.5 g/m2; then continuously applying a further metal(s) coat on the above coated substrate by on-plastics plating (e.g continuous plating technique) and dip-hole plating techniques known in the art, the metal(s) may be selected from Ni, Ni+Cu, Ni+Cu+Ni, Ni+Cu+Au, Cu or pure Au or Pt; then washing the obtained material by water, drying by baking or standing, and then winding. The composite electroconductive material obtained from the method of the present invention has good electroconductivity, and because of the continuous mechanization producing method, the cost can be cutted down, and the winded production made it more convenience for storing and conveying. The method of the present invention also overcomes the problem of pollution in the prior art.

Description

一种复合导电材料的制备方法  Preparation method of composite conductive material
技术领域 Technical field
本发明涉及一种对绝缘物体进行导电化处理制备复合导电 材料的方法， 属于电镀技术领域。 背景技术  The invention relates to a method for preparing a composite conductive material by conducting a conductive treatment on an insulating object, and belongs to the technical field of electroplating. Background technique
随着泡沫镍在镍氢电池上使用的普及， 制备泡沫镍所需的导 电基体基本也出现了多元化发展， 另外现有的屏蔽材料多是导电 布， 成本高、 薄、 塑胶结合较难。 目前在非金属材料上制备导电 基体广泛采用的化学镀、 涂导电胶等工艺已明显不能满足环保及 产品质量的要求。 化学镀成本高， 污染严重， 导电胶工艺不能很 好地解决质量问题。 一般真空镀产品易氧化。 而目前兴起的电磁 屏蔽的需求对电阻值的要求非常低， 例如在 0. 2 5Ω左右， 传统 工艺无法满足现代工业的要求。 发明概述  With the popularization of foamed nickel in nickel-metal hydride batteries, the conductive substrates required for preparing foamed nickel have basically diversified. In addition, most of the existing shielding materials are conductive cloths, which are costly, thin, and difficult to combine with plastics. At present, the widely used processes such as electroless plating and coating of conductive adhesives to prepare conductive substrates on non-metallic materials have clearly failed to meet environmental protection and product quality requirements. The cost of electroless plating is high, the pollution is serious, and the conductive adhesive process cannot solve the quality problem well. General vacuum plating products are susceptible to oxidation. However, the current demand for electromagnetic shielding has very low requirements for resistance values, for example, about 0.25Ω, and traditional processes cannot meet the requirements of modern industry. Summary of invention
本发明针对已有技术的不足， 提供一种导电性好的复合导电 材料的制备方法， 该方法包括： 在氩气保护下， 对一种基体用真 空离子溅射法镀覆一种选自镍、 铜或铂的金属， 镀覆期间使用的 温度 170至 355。C±5°C ,真空度 1. 1 ~ 3. 8 χΐθ— 1至— 8 Kpa,尤其是 1 ~The present invention addresses the shortcomings of the prior art, and provides a method for preparing a composite conductive material with good electrical conductivity. The method includes: under the protection of argon, plating a substrate by vacuum ion sputtering on a substrate selected from nickel , Copper or platinum metal, used at 170 to 355 during plating. C ± 5 ° C, vacuum degree 1. 1 ~ 3. 8 χΐθ— 1 to — 8 Kpa, especially 1 to
9 xl O"8 Kpa, 基体移动速度约为 0. 4 ~ 4米 /分钟， 优选约为 1. 5 ~ 2. 5米 /分钟， 离子溅射浓度约为 0. 1 ~ 2. 5克 /平方米， 尤其是约 2 ~ 2. 5 克 /平方米; 然后采用现有塑料电镀技术（例如连续电镀 技术） 和深孔镀的工艺在上述已镀覆基体上连续镀覆金属， 该金 属可选自镍、 镍 +铜、 镍 +铜 +镍、 镍 +铜 +金、 铜或纯金或铂； 将上述材料水洗、 烘干或凉干， 打卷。 9 xl O " 8 Kpa, the substrate moving speed is about 0.4 ~ 4 m / min, preferably about 1.5 ~ 2.5 m / min, the ion sputtering concentration is about 0.1 ~ 2.5 g / Square meters, especially about 2 ~ 2.5 g / m2; then the existing plastic plating technology (such as continuous plating technology) and deep hole plating process are used to continuously plate metal on the above-mentioned plated substrate, the metal can be Selected from nickel, nickel + copper, nickel + copper + nickel, nickel + copper + gold, copper or pure gold or platinum; Wash, dry or cool the above materials and roll.
本发明还提供由本发明方法制备的复合导电材料。 发明详述  The invention also provides a composite conductive material prepared by the method of the invention. Detailed description of the invention
本发明一种复合导电材料的制备方法包括以下步骤：  The method for preparing a composite conductive material of the present invention includes the following steps:
第一步骤：  The first step:
在氩气保护下， 对一种基体用真空离子溅射法镀覆一种选自 镍、 铜或铂的金属， 镀覆期间使用的温度 170至 355O±5 C, 真 空度 1.1~3.8 xlO— 1至— 8 Kpa, 尤其是 1~9 χΐθ— 8 Kpa, 基体移动 速度约为 0.4~4米 /分钟， 优选约为 1.5 ~ 2.5米 /分钟， 离子溅 射浓度约为 0.1 ~ 2.5克 /平方米， 尤其是约 2 ~ 2.5克 /平方米。 在材料导电性为 R=5~35KQ时，镀覆金属的量为约 0.3- 0.53克 /平方米。 Under the protection of argon, a substrate is plated with a metal selected from nickel, copper or platinum by vacuum ion sputtering. The temperature used during the plating is 170 to 355O ± 5 C, and the degree of vacuum is 1.1 to 3.8 xlO— 1 to -8 Kpa, especially 1 to 9 χΐθ- 8 Kpa, the substrate moving speed is about 0.4 to 4 m / min, preferably about 1.5 to 2.5 m / min, and the ion sputtering concentration is about 0.1 to 2.5 g / square Meters, especially about 2 to 2.5 g / m2. When the material conductivity is R = 5 ~ 35KQ, the amount of plated metal is about 0.3-0.53 g / m2.
上述基体可以是各种绝缘材料。 在一个实施方案中， 上述基 体是选自聚氨酯高密度泡沫片、 化纤丝编织网、 化纤编织布或化 纤毡的绝缘基体。此外，该基体还可以是***开孔（ reticulated) 12面体网状结构聚酯聚氨酯泡沫、 聚醚聚氨酯泡沫、 化纤丝编织 网、 化纤编织布、 化纤毡或不同厚度聚酯薄膜。 在-^个具体实施 方案中， 所述化纤是涤纶、 聚酯、 丙纶或尼龙。 在另一个具体实 施方案中， 所述基体是一种孔径范围为 440 5200 微米， 优选 300~500μ， 厚约为 l~6mm， 尤其是约为 1.0 ~ 3.5mm、 更尤其是 The above-mentioned substrate may be various insulating materials. In one embodiment, the substrate is an insulating substrate selected from a polyurethane high-density foam sheet, a chemical fiber woven mesh, a chemical fiber woven cloth, or a chemical fiber felt. In addition, the substrate may be a reticulated 12-hedron reticulated polyester polyurethane foam, a polyether polyurethane foam, a chemical fiber woven mesh, a chemical fiber woven cloth, a chemical fiber felt, or a polyester film of different thickness. In one embodiment, the chemical fiber is polyester, polyester, polypropylene or nylon. In another specific embodiment, the substrate is a pore size ranging from 440 to 5200 microns, preferably 300 to 500 μ, and having a thickness of about 1 to 6 mm, especially about 1.0 to 3.5 mm, and more particularly
1.5 ~ 3.0mm的聚氨酯泡沫。 在又另一个具体实施方案中， 所述基 体是一种化纤丝编织网，其网孔是六角形、方形或圆形，孔径 0.5 ~1.5 ~ 3.0mm polyurethane foam. In yet another specific embodiment, the substrate is a chemical fiber woven mesh, the mesh of which is hexagonal, square, or circular, and the diameter is 0.5 to
2.0mm, 六角孔、 方孔以过孔中心对角连线的长为孔径， 化纤丝径 0.1 ~ 0.2mm。 2.0mm, the diameter of the hexagonal hole and square hole is the length of the diagonal line of the center of the via hole, and the diameter of the chemical fiber is 0.1 ~ 0.2mm.
第二步骤： 然后采用现有塑料电镀技术（例如连续电镀技术）和深孔镀 的工艺在上述已镀覆基体上连续镀覆金属， 该金属可选自镍、 镍 +铜、 镍 +铜 +镍、 镍 +铜 +金、 铜或纯金或铂。 此时材料的导 电性为 R = 0. 1 ~ 8Q。 其中， "镍 +铜" 表示先镀覆镍， 然后电镀 铜。 其它类似表示方法可以类推。 The second step: Then, the existing plastic plating technology (such as continuous plating technology) and deep hole plating are used to continuously plate a metal on the above-mentioned plated substrate. The metal may be selected from nickel, nickel + copper, nickel + copper + nickel, nickel + Copper + Gold, Copper or Pure Gold or Platinum. The conductivity of the material at this time is R = 0.1 to 8Q. Among them, "nickel + copper" means that nickel is plated first, and then copper is plated. Other similar representations can be deduced by analogy.
第三步骤： 将上述材料水洗、 烘干或凉干， 打卷。 本发明与已有技术相比， 具有以下优良效果： 1.由此得到的 复合导电材料导电性好， 可直接作为泡沫镍所需的导电基体， 并 容许 1. 02米幅宽的基体以 1米 /分钟的速度快速电镀， 由于不使 用化学镀工艺， 因此没有磷污染的问题， 也无需污水处理， 直接 降低成本。 2.由于所得复合导电材料具有极低的电阻值， 因此可 直接用作电磁屏蔽、 电磁兼容（EMI/EMC )材料， 应用于手机的收 接话处、 等离子体电视、 TFT - LCD屏幕、 电视机、 家电用品、 计 算机或军事防磁干扰设备、 医疗及精密电子仪器如笔记本计算机 和各种电源接口等领域。 3.因为其中使用透气的***开孔 12面体 网状结构，并且可以调整使用由 440-5200微米气孔直径的聚合泡 沫作为基体导电材料 因此可充分解决过去因电磁屏蔽、 电磁兼 容（ EMI/EMC )材料不透气而造成笔记本计算机故障。 4.连续机械 化生产使得人为因素減少， 产品质量得以保证， 人员減少而生产 效率可提高。 5.本发明方法可生产长片产品， 将其卷成卷儿， 便 于存储、 运输， 便于裁剪。 其中使用气孔直径大于等于 4500微米 的***开孔 12 面体网状结构聚酯泡沫经复合导电工艺处理再镀 上 30 - 250g/m2纯金， 并以低于 1300Ό的温度烧结还原约 45 - 60 分钟， 即可实现连续生产用于燃料电池（fuel- cell )的纯金网状 载体材料， 从而取代现有的吊挂生产方式。 具体实施方案 The third step: Wash, dry or cool the above materials and roll. Compared with the prior art, the present invention has the following excellent effects: 1. The composite conductive material thus obtained has good electrical conductivity, and can be directly used as a conductive substrate required for nickel foam, and allows a substrate having a width of 1.02 meters to 1 Rapid electroplating at a speed of meters per minute. Since no electroless plating process is used, there is no problem of phosphorus pollution, and no sewage treatment is required, which directly reduces costs. 2. Because the obtained composite conductive material has extremely low resistance value, it can be directly used as electromagnetic shielding, electromagnetic compatibility (EMI / EMC) material, used in mobile phone reception, plasma TV, TFT-LCD screen, TV Equipment, appliances, computers or military anti-magnetic interference equipment, medical and precision electronic equipment such as notebook computers and various power interfaces. 3.Because of the use of breathable blast hole 12-hedron mesh structure, and the use of polymer foam with 440-5200 micron pore diameter as the base conductive material, it can fully solve the past electromagnetic shielding and electromagnetic compatibility (EMI / EMC) The material is impermeable and can cause the computer to malfunction. 4. Continuous mechanized production reduces human factors, guarantees product quality, reduces personnel and improves production efficiency. 5. The method of the present invention can produce long film products and roll them into rolls, which is convenient for storage, transportation, and cutting. Among them, blasted open-cell 12-hedral reticulated polyester foam with a pore diameter greater than or equal to 4500 microns is treated with a composite conductive process and then plated with 30-250g / m 2 of pure gold, and sintered at a temperature below 1300 ° F to reduce about 45-60 In minutes, continuous production of pure gold mesh carrier material for fuel cells can be realized, thereby replacing the existing hanging production method. Specific implementation plan
下面结合实施例对本发明再进一步说明。  The present invention will be further described with reference to the following embodiments.
实施例 1. 镀镍导电材料的制备， 步骤如下：  Example 1. Preparation of nickel-plated conductive material, the steps are as follows:
1.基体: 聚氨酯高密度泡沫片。  1. Matrix: Polyurethane high-density foam sheet.
2.离子镀镍： 将基体在氩气保护下用真空离子溅射法镀镍， 温度 真空度 8 xlO— 8 KPa, 基体移动速度 2米 /分钟， 离子 溅射浓度 2克 /平方米。 2. Ion nickel plating: The substrate is nickel-plated by vacuum ion sputtering under the protection of argon gas at a temperature of 8 x 10- 8 KPa, the substrate moving speed is 2 m / min, and the ion sputtering concentration is 2 g / m2.
3. 然后采用现有塑料电镀技术在上述材料上连续镀镍 。 4- 将上迷材料水洗、 烘干， 打卷。  3. Then use the existing plastic plating technology to continuously nickel plate the above materials. 4- Wash, dry, and roll the above materials.
实施例 2. 化纤编织布上镀铜， 步骤如实施例 1, 所不同的 是：  Embodiment 2. Copper plating is performed on a chemical fiber woven cloth, the steps are the same as those in Embodiment 1, except that:
基体为涤纶化纤编织布， 离子溅射浓度 2. 2克 /平方米。 实施例 3. 化纤丝编织网上镀铂， 步骤如实施例 1, 所不同 的是：  The substrate is a polyester chemical fiber woven cloth with an ion sputtering concentration of 2.2 g / m 2. Example 3. Platinum plating on a chemical fiber silk braided net, the steps are the same as in Example 1, except that:
基体为尼龙化纤丝编织网， 离子溅射浓度 1. 8克 /平方米。 化纤丝编织网网孔是六角形， 孔径 1. 0mm, 以过孔中心对角连线 的长为孔径， 化纤丝径 0. 2mm。  The substrate is a nylon chemical fiber woven mesh with an ion sputtering concentration of 1.8 g / m 2. The chemical fiber woven mesh has a hexagonal mesh with a hole diameter of 1.0 mm. The length of the diagonal line of the center of the via hole is used as the hole diameter. The chemical fiber diameter is 0.2 mm.
实施例 4. 化纤毡上镀镍， 步骤如实施例 2, 所不同的是： 基体是丙纶化纤毡， 离子溅射浓度 2. 4克 /平方米。  Example 4. The steps of plating nickel on the chemical fiber felt are the same as in Example 2, except that the substrate is a polypropylene fiber felt and the ion sputtering concentration is 2.4 g / m2.
实施例 5.单面火焰复合涤纶化纤编织布及***开孔聚酯泡 沫镀镍， 步骤如实施例 2, 所不同的是： 基体是涤纶化纤编织布 及***开孔聚酯泡沫， 离子溅射浓度 0. 35克 /平方米。  Example 5. Single-sided flame-composite polyester chemical fiber woven cloth and blasted open-cell polyester foam nickel plating, the steps are the same as in Example 2, except that the substrate is a polyester chemical fiber woven cloth and blasted open-cell polyester foam, and ion sputtering. The concentration is 0.35 g / m2.
实施例 6，双面火焰复合涤纶化纤编织布，无纺布及***开孔 聚酯泡沫镀镍， 步骤如实施例 2, 所不同的是： 基体是涤纶化纤 编织布， 无纺布及***开孔聚酯泡沫， 离子溅射浓度 0. 5克 /平方 实施例 7. 聚酯薄膜双面镀镍， 步骤如实施例 2， 所不同的 基体是聚酯薄膜， 离子溅射浓度 0. 45克 /平方米。 鉴于可作许多变化和改变而不背离本发明的原则， 应参考所 附的权利要求书以理解本发明所要保护的范围。 Example 6: Double-sided flame composite polyester chemical fiber woven fabric, non-woven fabric and blasted open-cell polyester foam nickel-plated, the steps are the same as in Example 2, except that the matrix is a polyester chemical fiber woven fabric, non-woven fabric and blasted open 5gram / square 45 克 / ㎡。 Example 7. Polyester film double-sided nickel plating, the steps are the same as in Example 2, the different substrate is a polyester film, ion sputtering concentration of 0.45 g / square meter. In view of the many changes and modifications that can be made without departing from the principles of the invention, reference should be made to the appended claims to understand the scope of protection of the invention.

Claims

权 利 要 求 Rights request
1. 一种复合导电材料的制备方法， 包括： 1. A method for preparing a composite conductive material, comprising:
在氩气保护下， 对一种基体用真空离子溅射法镀覆一种选自 镍、 铜或铂的金属， 镀覆期间使用的温度 170至 355 ±5 , 真 空度 1.1~3.8 xlO— ^―8 Kpa, 尤其是 1~9 ><10— 8 Kpa, 基体移动 速度约为 0.4-4米 /分钟， 优选约为 1.5 ~ 2.5米 /分钟， 离子溅 射浓度约为 0.1 ~ 2.5克 /平方米， 尤其是约 2 ~ 2.5克 /平方米； 然后采用现有塑料电镀技术（例如连续电镀技术）和深孔镀 的工艺在上述已镀覆基体上连续镀覆金属， 该金属可选自镍、 镍 +铜、 镍 +铜 +镍、 镍 +铜 +金、 铜或纯金或铂； Under the protection of argon, a substrate is plated with a metal selected from nickel, copper or platinum by vacuum ion sputtering. The temperature used during the plating is 170 to 355 ± 5, and the degree of vacuum is 1.1 to 3.8 xlO— ^ ― 8 Kpa, especially 1 ~ 9><10— 8 Kpa, the substrate moving speed is about 0.4-4 m / min, preferably about 1.5 to 2.5 m / min, and the ion sputtering concentration is about 0.1 to 2.5 g / square M, especially about 2 to 2.5 g / m2; and then use the existing plastic plating technology (such as continuous plating technology) and deep hole plating process to continuously plate metal on the above-mentioned plated substrate, the metal may be selected from nickel , Nickel + copper, nickel + copper + nickel, nickel + copper + gold, copper or pure gold or platinum;
将上述材料水洗、 烘干或凉干， 打卷。  Wash, dry or cool the above materials and roll.
2. 如权利要求 1所述的复合导电材料的制备方法，其特征在于， 所述基体是选自聚氨酯高密度泡沫片、 化纤丝编织网、 化纤编织 布或化纤毡的绝缘基体，该基体还尤其是***开孔 12面体网状结 构聚酯聚氨酯泡沫、 聚醚聚氨酯泡沫、 化纤丝编织网、 化纤编织 布、 化纤毡或不同厚度聚酯薄膜。  2. The method for preparing a composite conductive material according to claim 1, wherein the substrate is an insulating substrate selected from a polyurethane high-density foam sheet, a chemical fiber woven mesh, a chemical fiber woven cloth, or a chemical fiber felt, and the substrate is further Especially blasted open-cell 12-hedron mesh structure polyester polyurethane foam, polyether polyurethane foam, chemical fiber silk woven mesh, chemical fiber woven cloth, chemical fiber felt or polyester films of different thicknesses.
3. 如权利要求 1或 2所述的复合导电材料的制备方法， 其特征 在于， 所迷化纤是涤纶、 聚酯、 丙纶或尼龙。  3. The method for preparing a composite conductive material according to claim 1 or 2, wherein the chemical fiber is polyester, polyester, polypropylene or nylon.
4. 如权利要求 1― 3中任一项所迷的复合导电材料的制备方法， 其特征在于， 所述基体是一种孔径范围为 440 ~ 5200微米， 优选 300 - 500μ, 厚约为 1~6匪， 尤其是约为 1.0 ~ 3.5mm, 更尤其是 约为 1.5~ 3.0mm的聚氨酯泡沫。  4. The method for preparing a composite conductive material as claimed in any one of claims 1 to 3, characterized in that the substrate is a pore size ranging from 440 to 5200 microns, preferably 300 to 500 μ, and a thickness of about 1 to 4. 6 bandits, especially about 1.0 ~ 3.5mm, more especially about 1.5 ~ 3.0mm polyurethane foam.
5. 如权利要求 1-3中任一项所迷的复合导电材料的制备方法， 其特征在于， 所述基体是一种化纤丝编织网， 其网孔是六角形、 方形或圆形， 孔径 0.5~2.0mm， 化纤丝径 0.1 ~ 0.2mm。 5. The method for preparing a composite conductive material according to any one of claims 1 to 3, wherein the matrix is a chemical fiber woven mesh, and the mesh is hexagonal, square, or circular, and has an aperture 0.5 ~ 2.0mm, chemical fiber diameter 0.1 ~ 0.2mm.
6. 由权刮要求 1 - 5 中任一项所述的复合导电材料的制备方法 制备的复合导电材料。 6. A composite conductive material prepared by the method for preparing a composite conductive material according to any one of claims 1 to 5.
PCT/CN2002/000908 2001-12-24 2002-12-24 A method of producing a composite electroconductive material WO2003056058A1 (en)

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CN101928920B (en) * 2010-08-25 2012-01-11 北京航空航天大学 Multilayer composite wire rotary preparation device and preparation method
CN103434210A (en) * 2013-08-05 2013-12-11 盐城工学院 Preparation method of high molecular material-metal film composite conducting stably
CN104513980A (en) * 2014-11-12 2015-04-15 惠州建邦精密塑胶有限公司 Metal layer structure formed on plastic surface and surface treatment technology
CN105350045A (en) * 2015-10-30 2016-02-24 浙江理工大学 Preparing method of electro-coppering conductive fiber
CN108103506A (en) * 2017-12-18 2018-06-01 常德力元新材料有限责任公司 A kind of preparation method of foam metal shielding material
CN108707935A (en) * 2018-05-30 2018-10-26 信利光电股份有限公司 A method of preparing copper film on the insulating material

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