CN1148465C - Method for preparing composite conductive material - Google Patents
Method for preparing composite conductive material Download PDFInfo
- Publication number
- CN1148465C CN1148465C CNB011352965A CN01135296A CN1148465C CN 1148465 C CN1148465 C CN 1148465C CN B011352965 A CNB011352965 A CN B011352965A CN 01135296 A CN01135296 A CN 01135296A CN 1148465 C CN1148465 C CN 1148465C
- Authority
- CN
- China
- Prior art keywords
- chemical fibre
- present
- conductive material
- platinum
- copper
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000004020 conductor Substances 0.000 title claims abstract description 12
- 239000002131 composite material Substances 0.000 title claims abstract description 11
- 238000000034 method Methods 0.000 title abstract description 10
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000000835 fiber Substances 0.000 claims abstract description 26
- 239000000126 substance Substances 0.000 claims abstract description 24
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 238000007747 plating Methods 0.000 claims abstract description 15
- BASFCYQUMIYNBI-UHFFFAOYSA-N platinum Chemical compound [Pt] BASFCYQUMIYNBI-UHFFFAOYSA-N 0.000 claims abstract description 14
- 238000004544 sputter deposition Methods 0.000 claims abstract description 11
- XKRFYHLGVUSROY-UHFFFAOYSA-N Argon Chemical compound [Ar] XKRFYHLGVUSROY-UHFFFAOYSA-N 0.000 claims abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052802 copper Inorganic materials 0.000 claims abstract description 7
- 239000010949 copper Substances 0.000 claims abstract description 7
- 229910052697 platinum Inorganic materials 0.000 claims abstract description 7
- 239000004744 fabric Substances 0.000 claims abstract description 6
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- 229910052786 argon Inorganic materials 0.000 claims abstract description 4
- 238000005406 washing Methods 0.000 claims abstract description 4
- 239000011159 matrix material Substances 0.000 claims description 12
- 239000000463 material Substances 0.000 claims description 10
- 238000005516 engineering process Methods 0.000 claims description 8
- 238000002360 preparation method Methods 0.000 claims description 7
- 239000006260 foam Substances 0.000 claims description 5
- 229920000768 polyamine Polymers 0.000 claims description 5
- 239000004033 plastic Substances 0.000 claims description 4
- -1 polypropylene Polymers 0.000 claims description 4
- 239000004677 Nylon Substances 0.000 claims description 3
- 239000004743 Polypropylene Substances 0.000 claims description 3
- 229920004933 Terylene® Polymers 0.000 claims description 3
- 239000004619 high density foam Substances 0.000 claims description 3
- 229920001778 nylon Polymers 0.000 claims description 3
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 2
- 210000003934 vacuole Anatomy 0.000 claims description 2
- 238000001035 drying Methods 0.000 abstract 1
- 229920002635 polyurethane Polymers 0.000 abstract 1
- 239000004814 polyurethane Substances 0.000 abstract 1
- 238000005096 rolling process Methods 0.000 abstract 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract 1
- 238000007772 electroless plating Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004568 cement Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 229910052987 metal hydride Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M4/00—Electrodes
- H01M4/02—Electrodes composed of, or comprising, active material
- H01M4/64—Carriers or collectors
- H01M4/66—Selection of materials
- H01M4/661—Metal or alloys, e.g. alloy coatings
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
- C23C14/20—Metallic material, boron or silicon on organic substrates
- C23C14/205—Metallic material, boron or silicon on organic substrates by cathodic sputtering
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/10—Energy storage using batteries
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Metallurgy (AREA)
- Mechanical Engineering (AREA)
- Electrochemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Electroplating Methods And Accessories (AREA)
- Chemically Coating (AREA)
- Laminated Bodies (AREA)
- Chemical Or Physical Treatment Of Fibers (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
- Physical Vapour Deposition (AREA)
Abstract
The present invention discloses a method for preparing composite conductive material, which relates to a method for preparing composite conductive material by processing an insulating object in a conduction way. The present invention belongs to the technical field of electroplating. The present invention comprises the following steps: using a polyurethane high density foamed sheet, a chemical fiber mesh grid, chemical fiber fabric braided, or a chemical fiber felt as a base; plating nickel, copper, or platinum by a vacuum ion sputtering method under argon protection, wherein temperature is 170 (+/-) 5 DEG C, and ion sputtering concentration is within 2 to 2.5 gram / square meter; continuously plating nickel, copper, or platinum on the composite conductive material by the existing electroplating technique; finally, washing by water, drying and rolling. The method of the present invention has the advantage that the conduction of the composite conducting material is good; the composite conducting material can be continuously produced in mechanization, so cost is reduced; products are coiled, which is convenient to store and transport. The method of the present invention also overcomes the problem of chemical plating pollution of the prior art.
Description
(1) technical field
The present invention relates to a kind of method, belong to plating insulating bodies conduction Processing of Preparation composite conducting material
Technical field.
(2) technical background
Along with popularizing that nickel foam is used on nickel metal hydride battery, development in pluralism has substantially also appearred in the required conducting base of preparation nickel foam.Mostly existing in addition shielding material is conductive fabric, and cost height, thin, plastic cement are in conjunction with difficult.At present the electroless plating that the preparation conducting base extensively adopts on non-metallic material, be coated with the requirement that technology such as conductive resin obviously can not satisfy environmental protection and quality product.Electroless plating cost height, seriously polluted, conductive resin technology can not solve quality problems well.The general easy oxidation of vacuum plated product.And the demand of the electromagnetic shielding that rises at present is very low to the requirement of resistance value, and about 0.2～5 Ω, traditional technology can't satisfy the requirement of modern industry.
(3) summary of the invention
The present invention is directed to the deficiency of prior art, a kind of preparation method of composite conducting material of good conductivity is provided.
Method of the present invention comprises:
1. matrix: polyamine fat high-density foam sheet, the mesh grid of chemical fibre silk, chemical fibre woven cloth or chemical fibre felt.
Described chemical fibre is terylene, polyester, polypropylene fibre or nylon.
Described polyamine fat vacuole foam aperture 300～500 μ m, thick 1.5～3.0mm, chemical fibre silk mesh grid mesh is a sexangle, square or circular, aperture 0.5～2.0mm, hexagon ring, square hole are the aperture with the length of diagonal angle, via hole center line, chemical fibre silk footpath 0.1～0.2mm.
2. above-mentioned matrix is used the nickel plating of vacuum ion sputtering method, copper or platinum, 170 ± 5 ℃ of temperature, vacuum tightness 1～9 * 10 under argon shield
-8KPa, 1.5～2.5 meters/minute of matrix translational speeds, ion sputtering concentration 2～2.5 grams/square metre.
This moment, material electroconductibility was R=5～35K Ω.
3. adopt technology nickel plating continuously, copper or platinum on above-mentioned materials of existing plastic electroplating technology and deep hole plating then.
This moment, the electroconductibility of material was R=0.1～8 Ω.
4. with above-mentioned materials washing, oven dry or airing, clot.
Compared with the prior art the present invention has following excellent results, the composite conducting material good conductivity that 1. obtains thus, and the conducting base that nickel foam is required also can be used as shielding material, is applied to computer, household electrical appliances or military electronic product field.2. continuous mechanized production makes human factor reduce, and quality product guaranteed, personnel reduce and production efficiency can improve.3. the inventive method can be produced the lengthy motion picture product, and it is rolled into youngster, is convenient to storage, transportation, is convenient to cutting.4. method of the present invention has overcome the pollution problem of electroless plating in the prior art, has reduced production cost.
(4) specific embodiments
Below in conjunction with embodiment the present invention is being further specified.
The preparation of embodiment 1. nickel plating electro-conductive materials, step is as follows:
1. matrix: polyamine fat high-density foam sheet.
2. ion nickel plating: matrix is used the nickel plating of vacuum ion sputtering method, 170 ℃ of temperature, vacuum tightness 8 * 10 under argon shield
-8KPa, 2 meters/minute of matrix translational speeds, ion sputtering concentration 2 grams/square metre.
3. adopt the nickel plating continuously on above-mentioned materials of existing plastic electroplating technology then.
4. with above-mentioned materials washing, oven dry, clot.
Copper facing on the embodiment 2. chemical fibre woven cloth, step such as embodiment 1, different is:
Matrix is a terylene chemical fibre woven cloth, ion sputtering concentration 2.2 grams/square metre.
Platinum plating in the embodiment 3. chemical fibre silk mesh grids, step such as embodiment 1, different is:
Matrix is the mesh grid of nylon chemical fibre silk, ion sputtering concentration 1.8 grams/square metre.Chemical fibre silk mesh grid mesh is a sexangle, and aperture 1.0mm is the aperture with the length of diagonal angle, via hole center line, chemical fibre silk footpath 0.2mm.
Nickel plating on embodiment 4. chemical fibre felts, step such as embodiment 2, different is:
Matrix is the polypropylene fibre chemical fibre felt, ion sputtering concentration 2.4 grams/square metre.
Claims (1)
1. the preparation method of a composite conducting material comprises that step is as follows:
(1) matrix: polyamine fat high-density foam sheet, the mesh grid of chemical fibre silk, chemical fibre woven cloth or chemical fibre felt; Described chemical fibre is terylene, polyester, polypropylene fibre or nylon; Described polyamine fat vacuole foam aperture 300～500 μ m, thick 1.5～3.0mm, chemical fibre silk mesh grid mesh is a sexangle, square or circular, aperture 0.5～2.0mm, hexagon ring, square hole are the aperture with the length of diagonal angle, via hole center line, chemical fibre silk footpath 0.1～0.2mm;
(2) above-mentioned matrix is used the nickel plating of vacuum ion sputtering method, copper or platinum, 170 ± 5 ℃ of temperature, vacuum tightness 1～9 * 10 under argon shield
-8KPa, 1.5～2.5 meters/minute of matrix translational speeds, ion sputtering concentration 2～2.5 grams/square metre;
(3) technology nickel plating continuously, copper or the platinum on above-mentioned materials that adopts existing plastic electroplating technology and deep hole to plate then;
(4) with above-mentioned materials washing, oven dry or airing, clot.
Priority Applications (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011352965A CN1148465C (en) | 2001-12-24 | 2001-12-24 | Method for preparing composite conductive material |
| PCT/CN2002/000908 WO2003056058A1 (en) | 2001-12-24 | 2002-12-24 | A method of producing a composite electroconductive material |
| AU2002357554A AU2002357554A1 (en) | 2001-12-24 | 2002-12-24 | A method of producing a composite electroconductive material |
| JP2002372627A JP2003286588A (en) | 2001-12-24 | 2002-12-24 | Process for preparing composite conductive material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB011352965A CN1148465C (en) | 2001-12-24 | 2001-12-24 | Method for preparing composite conductive material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1359110A CN1359110A (en) | 2002-07-17 |
| CN1148465C true CN1148465C (en) | 2004-05-05 |
Family
ID=4673103
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB011352965A Expired - Lifetime CN1148465C (en) | 2001-12-24 | 2001-12-24 | Method for preparing composite conductive material |
Country Status (4)
| Country | Link |
|---|---|
| JP (1) | JP2003286588A (en) |
| CN (1) | CN1148465C (en) |
| AU (1) | AU2002357554A1 (en) |
| WO (1) | WO2003056058A1 (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101928920B (en) * | 2010-08-25 | 2012-01-11 | 北京航空航天大学 | Multilayer composite wire rotary preparation device and preparation method |
| CN103434210A (en) * | 2013-08-05 | 2013-12-11 | 盐城工学院 | Preparation method of high molecular material-metal film composite conducting stably |
| CN104513980A (en) * | 2014-11-12 | 2015-04-15 | 惠州建邦精密塑胶有限公司 | Metal layer structure formed on plastic surface and surface treatment technology |
| CN105350045A (en) * | 2015-10-30 | 2016-02-24 | 浙江理工大学 | Preparing method of electro-coppering conductive fiber |
| CN108103506A (en) * | 2017-12-18 | 2018-06-01 | 常德力元新材料有限责任公司 | A kind of preparation method of foam metal shielding material |
| CN108707935A (en) * | 2018-05-30 | 2018-10-26 | 信利光电股份有限公司 | A method of preparing copper film on the insulating material |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03100197A (en) * | 1989-09-12 | 1991-04-25 | Nippon G Ii Plast Kk | Method for plating molded product of polymer blend |
| DE69012271T2 (en) * | 1989-09-22 | 1995-03-16 | Minnesota Mining & Mfg | Process for electroplating electroactive polymers and articles obtained therewith. |
| JPH03274261A (en) * | 1990-03-26 | 1991-12-05 | Hitachi Chem Co Ltd | Formation of metal layer on polymer film |
| JPH05222578A (en) * | 1992-02-14 | 1993-08-31 | Electroplating Eng Of Japan Co | Production of noble metal plated product |
| CN1040237C (en) * | 1995-03-11 | 1998-10-14 | 吉林大学 | Process for preparing spongy foam nickel |
-
2001
- 2001-12-24 CN CNB011352965A patent/CN1148465C/en not_active Expired - Lifetime
-
2002
- 2002-12-24 AU AU2002357554A patent/AU2002357554A1/en not_active Abandoned
- 2002-12-24 WO PCT/CN2002/000908 patent/WO2003056058A1/en not_active Application Discontinuation
- 2002-12-24 JP JP2002372627A patent/JP2003286588A/en active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| CN1359110A (en) | 2002-07-17 |
| WO2003056058A1 (en) | 2003-07-10 |
| AU2002357554A1 (en) | 2003-07-15 |
| JP2003286588A (en) | 2003-10-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C06 | Publication | ||
| PB01 | Publication | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SHANDONG TIANNUO PHOTOELECTRIC MATERIALS CO., LTD Free format text: FORMER OWNER: XIA DENGFENG Effective date: 20040514 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20040514 Address after: High tech Zone Xinyu South Road Ji'nan city Shandong province 250101 first Qilu Software building room 212 Patentee after: Shandong Tiannuo Photovoltaic Material Co., Ltd. Address before: 274700 No. 407, Wang Xiang Road, Yucai Road, Yuncheng County, Shandong Province, Shahe Patentee before: Xia Dengfeng |
|
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Bao Guangming Document name: Notice of conformity |
|
| DD01 | Delivery of document by public notice |
Addressee: Limited by Share Ltd responsible for collecting Tiannuo photoelectric material Document name: Notification that Application Deemed not to be Proposed |
|
| C56 | Change in the name or address of the patentee | ||
| CP03 | Change of name, title or address |
Address after: Yuxing Road Flyover District of Ji'nan city in Shandong province 250119 New Material Industrial Park No. 517 Patentee after: Tiannuo Photoelectric Material Co., Ltd. Address before: High tech Zone Xinyu South Road Ji'nan city Shandong province 250101 first Qilu Software building room 212 Patentee before: Shandong Tiannuo Photovoltaic Material Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20040505 |