WO2002041677A3 - Kühlvorrichtung und verfahren zu deren herstellung sowie vorrichtung zur durchführung des verfahrens - Google Patents

Kühlvorrichtung und verfahren zu deren herstellung sowie vorrichtung zur durchführung des verfahrens Download PDF

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Publication number
WO2002041677A3
WO2002041677A3 PCT/EP2001/012718 EP0112718W WO0241677A3 WO 2002041677 A3 WO2002041677 A3 WO 2002041677A3 EP 0112718 W EP0112718 W EP 0112718W WO 0241677 A3 WO0241677 A3 WO 0241677A3
Authority
WO
WIPO (PCT)
Prior art keywords
cooling device
carrying
production
cooling
base plate
Prior art date
Application number
PCT/EP2001/012718
Other languages
English (en)
French (fr)
Other versions
WO2002041677A2 (de
Inventor
Werner J Graf
Erich Buck
Original Assignee
Corus Aluminium Profiltechnick
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Corus Aluminium Profiltechnick filed Critical Corus Aluminium Profiltechnick
Priority to EP01989436A priority Critical patent/EP1364564A2/de
Publication of WO2002041677A2 publication Critical patent/WO2002041677A2/de
Publication of WO2002041677A3 publication Critical patent/WO2002041677A3/de

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4882—Assembly of heatsink parts
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
    • H01L21/4814—Conductive parts
    • H01L21/4871—Bases, plates or heatsinks
    • H01L21/4878—Mechanical treatment, e.g. deforming
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Shaping Metal By Deep-Drawing, Or The Like (AREA)

Abstract

Bei einer Kühlvorrichtung für insbesondere elektronische Bauelemente mit einer Grundplatte und mit in Nuten derselben verankerten kühlrippen ist jeweils nur eine Seitenwand (2b) jeder Nut (2) bleibend verformbar bzw. bleibend verformt, während die andere Seitenwand (2a) der betreffenden Nut (2) im wesentlichen unverformt bleibt und die definierte Lage der kühlrippen (3) garantiert.
PCT/EP2001/012718 2000-11-14 2001-11-02 Kühlvorrichtung und verfahren zu deren herstellung sowie vorrichtung zur durchführung des verfahrens WO2002041677A2 (de)

Priority Applications (1)

Application Number Priority Date Filing Date Title
EP01989436A EP1364564A2 (de) 2000-11-14 2001-11-02 Kühlvorrichtung und verfahren zu deren herstellung sowie vorrichtung zur durchführung des verfahrens

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE2000156387 DE10056387B4 (de) 2000-11-14 2000-11-14 Kühlvorrichtung und Verfahren zu deren Herstellung sowie Vorrichtung zur Durchführung des Verfahrens
DE10056387.2 2000-11-14

Publications (2)

Publication Number Publication Date
WO2002041677A2 WO2002041677A2 (de) 2002-05-23
WO2002041677A3 true WO2002041677A3 (de) 2003-09-12

Family

ID=7663252

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/EP2001/012718 WO2002041677A2 (de) 2000-11-14 2001-11-02 Kühlvorrichtung und verfahren zu deren herstellung sowie vorrichtung zur durchführung des verfahrens

Country Status (3)

Country Link
EP (1) EP1364564A2 (de)
DE (1) DE10056387B4 (de)
WO (1) WO2002041677A2 (de)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE10229532B4 (de) * 2002-07-01 2008-06-19 Alcan Technology & Management Ag Kühlvorrichtung für Halbleiterbauelemente
DE10240848B4 (de) * 2002-09-04 2004-07-22 Seifert Electronic Gmbh & Co. Kg Kühlkörper aus Leichtmetall in Blockform und Verfahren zu dessen Herstellung
US7497013B2 (en) * 2005-04-15 2009-03-03 R-Theta Thermal Solutions Inc. Method and apparatus for coupling fins in a high-fin density heatsink to dual heat-dissipating base plates
TW200934361A (en) * 2008-01-16 2009-08-01 Neng Tyi Prec Ind Co Ltd Method of manufacturing heat dissipater and structure thereof
CN102668066B (zh) * 2009-11-17 2015-04-29 三菱电机株式会社 散热设备及散热设备的制造方法

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1100057B (de) * 1958-01-29 1961-02-23 Siemens Ag Waermeabgebender metallischer Koerper mit vergroesserter Oberflaeche
EP0206980A2 (de) * 1985-05-22 1986-12-30 Alusuisse-Lonza Services Ag Kühlkörper für Halbleiterbauelemente und Verfahren zu seiner Herstellung
DE29601776U1 (de) * 1996-02-02 1996-06-13 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl.
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
DE19841911A1 (de) * 1998-09-14 2000-03-16 Joachim Glueck Kühlkörper für im wesentlichen L-förmige oder T-förmige Kühlrippen

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2502472C2 (de) * 1975-01-22 1982-09-02 Siemens AG, 1000 Berlin und 8000 München Kühlkörper für Thyristoren
US5038858A (en) * 1990-03-13 1991-08-13 Thermalloy Incorporated Finned heat sink and method of manufacture
DE9412460U1 (de) * 1994-08-02 1995-12-14 Hoogovens Aluminium Profiltechnik Gmbh, 88267 Vogt Kühlvorrichtung für elektrische bzw. elektronische Bauelemente mit einer Grundplatte und mit Kühlelementen
DE29602366U1 (de) * 1995-08-17 1996-05-02 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl.
WO1997021506A1 (de) * 1995-12-14 1997-06-19 Attlington Investments Limited Verfahren zur herstellung eines metallprofils
DE29715585U1 (de) * 1997-08-28 1998-12-24 Hoogovens Aluminium Profiltechnik Bonn GmbH, 53117 Bonn Kühlvorrichtung für elektrische bzw. elektronische Bauelemente
DE19814368A1 (de) * 1998-03-31 1999-10-07 Siemens Ag Kühlkörper und Verfahren zu seiner Herstellung

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1100057B (de) * 1958-01-29 1961-02-23 Siemens Ag Waermeabgebender metallischer Koerper mit vergroesserter Oberflaeche
EP0206980A2 (de) * 1985-05-22 1986-12-30 Alusuisse-Lonza Services Ag Kühlkörper für Halbleiterbauelemente und Verfahren zu seiner Herstellung
US5542176A (en) * 1992-09-21 1996-08-06 Hideaki Serizawa Radiation plate and method of producing the same
DE29601776U1 (de) * 1996-02-02 1996-06-13 Alusuisse-Lonza Services AG, Neuhausen am Rheinfall Kühlkörper für Halbleiterbauelemente o.dgl.
DE19841911A1 (de) * 1998-09-14 2000-03-16 Joachim Glueck Kühlkörper für im wesentlichen L-förmige oder T-förmige Kühlrippen

Also Published As

Publication number Publication date
EP1364564A2 (de) 2003-11-26
DE10056387B4 (de) 2008-11-13
WO2002041677A2 (de) 2002-05-23
DE10056387A1 (de) 2002-05-23

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