WO2001082315A1 - Compositions et procede permettant l'impression de resistances, de condensateurs et de bobines d'inductance - Google Patents

Compositions et procede permettant l'impression de resistances, de condensateurs et de bobines d'inductance Download PDF

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Publication number
WO2001082315A1
WO2001082315A1 PCT/US2000/010618 US0010618W WO0182315A1 WO 2001082315 A1 WO2001082315 A1 WO 2001082315A1 US 0010618 W US0010618 W US 0010618W WO 0182315 A1 WO0182315 A1 WO 0182315A1
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WIPO (PCT)
Prior art keywords
composition
printing
substrate
mixture
oxide
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Application number
PCT/US2000/010618
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English (en)
Inventor
Paul H. Kydd
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Parelec, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Parelec, Inc. filed Critical Parelec, Inc.
Priority to AU2000244738A priority Critical patent/AU2000244738A1/en
Priority to US10/258,160 priority patent/US6824603B1/en
Priority to PCT/US2000/010618 priority patent/WO2001082315A1/fr
Publication of WO2001082315A1 publication Critical patent/WO2001082315A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/10—Metal-oxide dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • H01B1/22—Conductive material dispersed in non-conductive organic material the conductive material comprising metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
    • H01C17/06—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base
    • H01C17/065—Apparatus or processes specially adapted for manufacturing resistors adapted for coating resistive material on a base by thick film techniques, e.g. serigraphy
    • H01C17/06506—Precursor compositions therefor, e.g. pastes, inks, glass frits
    • H01C17/06513—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component
    • H01C17/06533—Precursor compositions therefor, e.g. pastes, inks, glass frits characterised by the resistive component composed of oxides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01C—RESISTORS
    • H01C7/00—Non-adjustable resistors formed as one or more layers or coatings; Non-adjustable resistors made from powdered conducting material or powdered semi-conducting material with or without insulating material
    • H01C7/003—Thick film resistors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/167—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed resistors

Definitions

  • the invention relates to the production of electronic circuits, more particularly to compositions and processes for the production of passive components such as resistors, capacitors and inductors for rigid and flexible printed circuits on polymer-based substrates using print-and-heat technology
  • Electric resistors, capacitors and inductors are now almost uniformly produced with oxide ceramic active elements, even for discrete components, which are assembled to circuits by soldering.
  • oxide ceramic active elements include: silver-palladium oxide resistors; ruthenium oxide resistors; barium ruthenate resistors; barium titanate ferroelectric capacitors and piezoelectric elements; lead titanate/zirconate ferroelectrics; spinel-type ferrites such as magnetite; hexafe ⁇ tes; and garnet-type ferrites.
  • Thick film inks and pastes consist of a suspension of particulate material with the desired electrical properties in an organic vehicle.
  • the vehicle consists of a viscous liquid such as ⁇ -terpinol with a resin such as ethyl cellulose for viscosity modifications and minor additions of other constituents to improve printability. Glass frit is added to the mixture to improve bondability to the substrate.
  • a hybrid circuit consists of metallic circuit traces, screen printed on ceramic substrates and fired at temperatures in the neighborhood of 1000 °C to sinter the metal and fuse the glass to bond the metal and the ceramic. During the firing process, the organic constituents of the inks volatilize and disappear. Their function is strictly to facilitate printing. Silicon integrated circuits are usually bonded to the traces creating a hybrid between the silicon circuitry and the ceramic circuitry.
  • Thick film resistor inks can be used to print resistors rather than bonding discrete components to the circuit.
  • Silver-palladium mixtures which can be oxidized to silver- palladium metal and semiconducting palladium oxide, have been widely used as resistive films as described by Larry, J.R.;Rosenberg, R.M.; Uhler, R.O.; in Trans IEEE, CHMT-3, (2), 211-225, 1980.
  • semiconducting ruthenium oxide compositions have become dominant.
  • Thick film capacitors have been prepared by printing a metallic plate, printing a layer of thick film ferroelectric dielectric, such as barium titanate, and printing another metallic plate to complete the capacitor.
  • barium titanate sinters into monolithic ceramic and grain growth occurs, improving its dielectric properties.
  • Ferrite inductive cores for transformers, chokes and antennas can be printed with inks containing ferrite particles, which sinter to monolithic ceramics at the high processing temperatures of thick film technology.
  • Polymer Thick Film materials are widely used to print silver conductive traces on polymer substrates such as membrane touch switches and keyboards. These "polymer thick film” materials are similar to conventional thick film inks, except the organic vehicle is an epoxy resin which is not volatilized and remains as an integral part of the finished circuit component. The electrical conductivity of these materials is less than one tenth that of conventional thick film conductors because the conductivity depends on adventitious contact between the individual silver flalces in the epoxy matrix rather than on the monolithic sintered structure achieved in high temperature thick film processing. There have been attempts to create polymer thick film capacitor dielectrics and inductive cores, however; these problems are even more severe in these materials which depend for their electrical properties on the creation of void-free recrystalized structures. Since the particles are isolated by organic matrix, even though each particle in the polymer thick film ink may have a high dielectric constant or magnetic permeability, the properties of the deposit are closer to those of the matrix than to those of the particles.
  • ParmodTM A new class of compositions now known as ParmodTM have been used in a low temperature process for producing high conductivity electrical conductors on temperature sensitive substrates.
  • Examples of such ParmodTM compositions are disclosed in U.S. Patent 5,882,722 (the disclosures of which are here by incorporated in full by reference hereto) and US Application Serial Numbers 09/034,069; 09/484,882; and 09/367,783 (the disclosures of which are here by incorporated in full by reference hereto).
  • ParmodTM compositions contain a Reactive Organic Medium (ROM) and metal flakes and/or metal powders.
  • ROM Reactive Organic Medium
  • the ROM consists of either a Metallo-Organic Decomposition (MOD) compound or an organic reagent, which can form such a MOD compound upon heating in the presence of the metal constituents.
  • the ingredients are blended together with rheology modifying organic vehicles well known in the art, if necessary, to produce printing inks or pastes. These inks can be printed on a temperature sensitive substrate and cured to well-consolidated, well-bonded electrical conductors at a temperature low enough so that the substrate is not damaged. The curing process occurs at temperatures far below those used for conventional sintering of thick film inks and pastes.
  • ParmodTM compositions can also be formulated into liquid toners capable of being printed using electrostatic printing methods. Examples of such toners are disclosed in US Application Serial Number 09/369,571 (the disclosure of which is hereby incorporated in full by reference hereto).
  • ParmodTM materials are producing printed circuits by a fully additive process in which the ParmodTM mixtures are printed on the polymer-based circuit substrate and cured to well-bonded, pure metal conductors by heating to a temperature in a range that the substrate can stand, for example, about 200-350°C.
  • This process eliminates the steps of laminating copper to the substrate, laminating a photoresist to the copper, exposing the resist through a mask, developing the resist, etching away the unwanted copper and stripping the resist that comprise conventional subtractive processing.
  • the ParmodTM process and materials make use of the unexpected property that mixtures of metal powders with metal-containing reactive organic materials can be decomposed to well-consolidated metal traces in which the metal particles appear to be "chemically welded" together into a continuous metallic phase.
  • This chemical process takes place at temperatures that are hundreds of degrees lower than those required for conventional metallic sintering, and in times that can be measured in seconds rather than minutes or hours.
  • the result is the ability to produce the equivalent of "thick film" circuits which are produced by screen printing sinterable metallic pastes on ceramic substrates and firing at temperatures of 500°C to more than 1000°C, but to do it on much less expensive polymer-based substrates and cure them in much less time at much lower temperatures.
  • ParmodTM technology is used to create continuous oxide phases from printable inks and pastes by mixing high performance powders with a reactive organic medium, which can weld them together into a continuous phase at low temperature by decomposing into the same chemical composition as the powder phase.
  • ParmodTM mixtures of this invention function by deposition of material from the decomposition of the MOD compound which "chemically welds" the powder constituents of the mixture together into a monolithic solid.
  • the resulting passive components can be produced and connected as part of the printed circuit fabrication process, rather than being separately produced and assembled onto the printed circuit by soldering.
  • Thick film circuits typically contain oxide resistors, capacitors and inductors that are printed on ceramic substrates and fired prior to or simultaneously with the metallic conductors. It would be desirable to extend ParmodTM technology to print nonmetallic oxide materials with electrically useful properties on polymer substrates.
  • the present invention combines an oxide powder or powders with the appropriate electrical properties with a reactive organic medium (ROM) which produces additional oxide to bond the powder into a continuous phase, resulting in compositions having superior performance.
  • ROM reactive organic medium
  • the performance of ParmodTM oxides of the present invention are better than mixtures of active powders with orgamc binders which are available for ferroelectric capacitors and ferrite inductors.
  • ParmodTM technology is applied to oxides of metals to accomplish the objective of producing a continuous solid phase of high electrical performance by printing and heating an ink or paste.
  • ROMs exist for many elements, and most of them deposit oxides when decomposed in air.
  • the main problem has been to prevent oxidation when depositing metallic conductors of copper and other metals.
  • the present application has to do with mixtures of oxide powders with a ROM, which will deposit additional oxide to weld the powder particles together into a monolithic solid with desirable electrical properties.
  • Silver-palladium oxide resistive mixtures are a standard in thick film technology for achieving resistivity values of a few tens to a few tens of thousands of ohms per square. Higher resistance can be achieved by printing serpentine patterns.
  • Silver-palladium resistors function by forming a network of silver-palladium particles coated with silver oxide, which conduct very well, separated by a film of semiconducting palladium oxide which conducts poorly. The proportions of the two metals and the oxygen content of the finished film determine the resistivity. The oxygen content is controlled by the firing conditions of temperature and time in an air atmosphere.
  • Metallo-Organic Decomposition (MOD) compounds were synthesized as constituents of the Reactive Organic Medium for preparing ParmodTM silver palladium inks: silver neodecanoate Ag(nd) palladium 2-ethylhexanoate Pd(eh) 2 Manganese neodecanoate Mn(nd) 2 Examples of silver palladium resistor ink formulations were prepared for as shown in Table 1.
  • Ag powders A) Alfa, 0.7-1.3 ⁇ m; B) Aldrich, nanosize activated; C) Degussa, 0.32 ⁇ m; D)Degussa silver flake ** Pd powders: A) Aldrich, 1.0-1.5 ⁇ m; B) Aldrich, submicron. *** PdO powder: A) Degussa, 0.95 ⁇ m.
  • the inks were prepared by weighing out the powder constituents individually and adding the indicated amount of MOD com ⁇ ound(s) and neodecanoic acid (NDA). The mixture was blended by hand to obtain a smooth, screen printable ink.
  • a quartz tube furnace was fitted with an Illinois Instruments Oxygen Analyzer Model 6000 to provide well-controlled atmospheric compositions for curing resistor inks.
  • Several formulations of Ag/Pd/PdO ParmodTM type inks were made by varying the silver to palladium ratios, the silver, palladium, and palladium oxide powder particle sizes, and the metallo- organic decomposition (MOD) compound ratios.
  • MOD metallo- organic decomposition
  • the ability of the silver ParmodTM to consolidate into well-bonded traces is much greater than that of palladium. Certain amounts of silver powder and silver neodecanoate were used to provide good consolidation of the resulting film.
  • the ratio of silver to palladium or palladium oxide has an effect on the electrical resistivity, as shown in Figure 1. h general, as the palladium or palladium oxide concentration is increased, the resistivity increases. The amount of silver can be limited in order to get high resistivities, but this has to be balanced with the consolidation ability of the ink composition. A high achievable resistivity brings these mixtures into the desired range at 25 ohms per square at 25 microns (0.001-inch) thickness.
  • a preferred range of silver to palladium is 0.05 : 1 to 1 : 1. This range produces a range of desired resistivity of 0.0001 ohm cm to 0.25 ohm cm or 0.4 to 100 ohm per square at a desired thickness of 0.0025 cm (1 mil) +50%.
  • Oxygen concentration of the curing atmosphere can be used to control the resistivity of the resistor film.
  • a higher oxygen partial pressure promotes oxidation of the palladium and provides a higher resistivity.
  • palladium oxide powder was used rather than palladium metal powder, as in inks Sample 3, 4, 5, 6 and 7 (Table 1), the atmosphere effect is in the expected direction - higher oxygen concentration results in an increase of resistivity. This effect is shown in Figure 2.
  • the use of PdO increased the resistivity of Ag/Pd resistor compositions, but with the silver MOD producing the binding matrix, the resistivity can remain low. Adding a metal that can bind the Ag and PdO particles into a film and has a much higher resistivity will further increase resistivity.
  • the resistivity of manganese metal is 144 ⁇ -cm compared to 1.6 ⁇ -cm for silver. We have shown that the manganese MOD works well with silver to form well-consolidated films. Using manganese neodecanoate as the MOD "cement" to hold the silver and PdO particles together creates a much less conductive binding matrix. It also creates the possibility of resistivity variability, since the resistivity of the binding matrix can be controlled by varying the ratio of the silver and manganese MOD compounds in the ink.
  • Ink Sample 8 (Table 1) was made containing 75% PdO powder (25% Ag powder) and only the Mn MOD. This ink had fair consolidation. When cured at 350°C in air the resistivity was 21 ohms per square per mil.
  • ParmodTM ruthenate mixtures consist of ruthenium oxide powder or barium ruthenate powder and the ROM, for example ruthenium 2- ethylhexanoate which has a decomposition temperature of less than 300°C.
  • a significant problem in making ruthenium ParmodTM mixtures is that ruthenium oxide itself is a powerful oxidant, and in the presence of organic material in the ROM it can ignite spontaneously.
  • indium, tin and titanium MODs Mixtures of the semiconducting oxides of indium and tin have been used as the resistive phase with indium, tin and titanium MODs. Titanium oxide powder has been used as a nonconductive diluent to adjust the resistivity. Resistivities of 100 to 10,000 ohms per square per mil have been achieved. Examples of indium, tin and titanium MOD compounds, indium 2-ethylhexanoate, tin 2-ethylhexanoate and titanium dimethoxy dineodecanoate were synthesized as known in the art, and ink formulations were made as shown in Table 2 below.
  • the electrical properties of the ITO-based inks can be controlled through variations in the ink composition.
  • the resistivity can be varied over 3 orders of magnitude between ⁇ 100 and 10,000 ⁇ /sq/mil.
  • the lower resistivity ink (Sample 13), contains the ITO 95/5 powder with only the titanium MOD.
  • the addition of increasing amounts of T1O2 powder to the composition gradually increases the resistivity up to 10,000 ⁇ /sq/mil.
  • Higher values can be achieved with higher amounts of Ti ⁇ 2- At 10,000 ⁇ /sq/mil these compounds can furnish resistors which cover 75% of the required components in a square format and 98+% of the requirement in a 1x10 format.
  • Ti MOD compound means that a temperature of >350°C may be necessary for complete decomposition.
  • the application of laser annealing can reduce the required temperature.
  • the ferroelectric class of ceramic oxide materials are piezoelectric. They change shape when an electric charge is placed upon them, and they generate an electric charge when they are mechanically distorted. They also have dielectric constants in the thousands compared to familiar polymers and glasses that have dielectric constants less than ten.
  • the ferroelectrics typified by barium titanate and lead zirconate/titanate (PZT), are used as the dielectric in ceramic capacitors because they can provide high capacitance values in a small area. They are also used for nonlinear optics devices and display birefringence.
  • the sol gel approach starts with alkoxides of barium and titanium which are synthesized and mixed in the appropriate proportions under completely anhydrous conditions. The mixture is then hydrolyzed to a sol with a trace of moisture and an acid or basic catalyst as needed. The sol can be mixed with barium titanate powder, printed to form capacitor dielectrics or other ferroelectric devices, and cured thermally to bond the powder together into a monolithic device. Attempts to use this approach have produced thin and blistered films. The cure temperature required to produce good dielectric films is too high for the bulk of polymer substrates.
  • barium titanate powder is mixed with barium neodecanoate and titanium dimethoxy dineodecanoate, printed on a polymer substrate and thermally cured.
  • Such mixtures of MOD compounds have been successfully cured to provide dielectric constants of 2000-3000 at a temperature of 350°C.
  • the compositions of sample ferroelectric inks are shown in Table 3.
  • BTO Barium titranate
  • a suspension of BTO powder in a polyester resin was tested as a standard against which to compare the ParmodTM dielectrics such as Sample 20.
  • the resin suspension was found to be as good a dielectric as a MOD matrix of BTO.
  • Recent data on other resin-based dielectric systems have suggested that a dielectric constant of 60 can be achieved with such polymer thick film materials.
  • Ink Sample 21 was formulated with a 4:1 ratio of Degussa barium titanate powder to lead titanate MOD mixture. It provided improved performance vs. barium titanate/lead titanate mixtures.
  • Lead titranate (PTO) MODs increased the resulting dielectric constant to more than 100 compared to 60 for BTO MODs. Because PTO crystallizes at about 470°C versus 750°C for BTO, it is easier to get it to provide a matrix with a high K. The only drawback is that PTO has a maximum K of about 300. The majority of the decomposition of the BTO MODs is completed by 400°C, but weight loss is seen up to 600°C. The PTO MODs decompose completely by about 300°C.
  • the lower decomposition and crystallization temperatures of the PTO material means that at 350-400°C, the PTO material formed have "longer range order" than the deposited BTO material, and thus have better properties.
  • Electrostatically Printed Silver Capacitors were made using PTO/BTO ink Sample 21 as the dielectric and electrostatically printed silver as the top and bottom electrodes on a glass substrate. The capacitors worked well giving capacitance's in the range of 1-10 nF. The example capacitor was made completely from ParmodTM materials. Data on the dielectric constant and dissipation factor from 1-100 kHz are shown below. Dielectric properties as a function of cure conditions are shown in Figure 3.
  • Breakdown voltages were greater than 24 Volts for films of approximately 25 microns thickness, but in thinner films approaching 10 microns, the values were about 5 V.
  • Ink Sample 21 with a PTO MOD system and a BTO powder meets the target requirement of a dielectric constant greater than 100 at a temperature low enough to be compatible with commonly used flex circuit substrates.
  • Ferrites are oxides with high magnetic permeabilities like iron and nickel metal but with no electrical conductivity. The corresponding lack of eddy current losses makes them suitable for magnetic components used at high frequencies.
  • the general crystallographic classes of ferrites are spinels, hexaferrites and garnets.
  • the hexaferrites and garnets are magnetically "hard” materials with high coercivities used as permanent magnets.
  • the spinels, typified by magnetite Fe 3 O 4 are soft magnetic materials used in transformers, chokes and antennas.
  • Ferrites are made by decomposing the appropriate oxalates which are MOD compounds.
  • a printable ParmodTM magnetite composition was made by mixing magnetite powder with iron oxalate. Finished ferrite components are then made by printing the mixture and decomposing the oxalate. The same general process can be followed to create other ferrite compositions with MOD compounds of iron, nickel and zinc.
  • ferric neodeacanoate as the MOD compound.
  • the Fe(neo) 3 itself decomposes in an appropriate mixture of nitrogen, hydrogen and water vapor to a tightly adherent, well-bonded thin film.
  • the atmosphere consisted of up to 10% hydrogen, at least 20 % water vapor and the balance nitrogen in which magnetite is the sole stable iron species.
  • the resulting black film is magnetic and electrically insulating.
  • Fe 3 O 4 powder When mixed with Fe 3 O 4 powder, a poorly-bonded thick film results with limited permeability. If the powder is prereduced in hydrogen, or if metallic iron powder is added, a well-bonded magnetic deposit is obtained but it is electrically conducting.
  • a preferred composition uses a mixture of Fe 3 O 4 powder, ferric neodecanoate and neodecanoic acid cured in an atmosphere that proceeds through stages which are slightly oxidizing, reducing, neutral and slightly oxidizing.
  • the processing sequence involved heating in wet nitrogen-hydrogen and then in nitrogen-hydrogen for a total of approximately 15 minutes to achieve consolidation by partial reduction to iron (stages 1 and 2 in Table 6). This was followed in some cases by heating in nitrogen and in all cases by a finishing step in a wet nitrogen-hydrogen mixture in which Fe 3 O 4 is stable (stage 3 and Oxid. Gas). In some cases the oxidizing gas was air to oxidize the deposit to magnetite and hematite. The bulk of the results show consolidated deposits with magnetic properties and electrical conductivity somewhat less than handbook values for magnetite, in line with the porous nature of the deposits.
  • Example 32-1 Treatment at 390° C results in somewhat higher electrical resistivity and somewhat lower magnetic permeability than treatment at 540°C (Sample 32-2).
  • Micron sized magnetite powder was slurried with amyl acetate and deposited on a lxlO-cm test strip the inductance change was measured at 0.26.
  • the best results with consolidated ParmodTM mixtures are a little short of twice as high, showing that, as with the ferroelectrics, the ParmodTM approach provides better performance than the same powder with an organic binder.
  • Ink Sample 32 was formulated with larger particle size magnetite (Alfa -325 mesh, 91%). When the coarser powder was tested as a deposited slurry, the inductance change was 0.75, but after consolidation, the inductance change was only half as great, suggesting that the heat treatment may have damaged the powder.
  • Ink Sample 33 used Yttrium Iron Garnet (YIG) powder.
  • the powder consisted of spherical 1-2 micron particles and was supplied by Particle Technologies Inc.
  • the mechanical and magnetic properties of the deposited and processed films were no better than magnetite-based inks but the electrical conductivity was far lower, which should provide lower losses at high frequency.
  • Ink Sample 34 used -325 mesh Trans-Tech Ba 2 Zn 2 Fe O 12 powder. The magnetic properties were not a s god as Sample 33, and the electrical conductivity was higher. Printing Technology
  • Any convenient printing technology can be used to apply the mixtures of this invention. Screen printing and stenciling, as used with conventional thick film materials are good for limited production of high quality rigid circuits. Individual components such as capacitors, resistors and inductive cores can be conveniently applied by dispensing with a hypodermic needle or the MicroPen. Gravure printing is suitable for roll to roll printing on flexible substrates at high speeds and with high resolution. Inkjet printing is suitable for computer controlled printing with moderate resolution and speed. Electrographic printing can provide higher resolution and higher speed. All of these methods can be used with ParmodTM compositions, including conductors and oxides.

Abstract

La présente invention concerne une composition de matière comprenant un mélange d'une/de poudre(s) d'oxyde et d'une substance organique réactive (Reactive Organic Medium / ROM), ladite composition pouvant être utilisée pour produire des composants électroniques sur un substrat approprié. Les substances sont appliquées sur des substrats de circuit de type polymères conventionnels, grâce à un processus d'impression quelconque facile à mettre en oeuvre, et traitées à la chaleur pour donner des composants oxydiques bien consolidés, la température n'excédant pas la limite supportée par le substrat. Cette invention concerne également des mélanges destinés à différents composants, y compris les résistances, les diélectriques de capacité, et les noyaux magnétiques, et des procédés permettant de les appliquer.
PCT/US2000/010618 2000-04-20 2000-04-20 Compositions et procede permettant l'impression de resistances, de condensateurs et de bobines d'inductance WO2001082315A1 (fr)

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AU2000244738A AU2000244738A1 (en) 2000-04-20 2000-04-20 Compositions and method for printing resistors, capacitors and inductors
US10/258,160 US6824603B1 (en) 2000-04-20 2000-04-20 Composition and method for printing resistors, capacitors and inductors
PCT/US2000/010618 WO2001082315A1 (fr) 2000-04-20 2000-04-20 Compositions et procede permettant l'impression de resistances, de condensateurs et de bobines d'inductance

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Cited By (8)

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US7141185B2 (en) 2003-01-29 2006-11-28 Parelec, Inc. High conductivity inks with low minimum curing temperatures
US7211205B2 (en) 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
AU2002300130B2 (en) * 2001-07-19 2007-09-06 Sumitomo Chemical Company, Limited Ceramics dispersion liquid, method for producing the same, and hydrophilic coating agent using the same
US7749299B2 (en) 2005-01-14 2010-07-06 Cabot Corporation Production of metal nanoparticles
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8597397B2 (en) 2005-01-14 2013-12-03 Cabot Corporation Production of metal nanoparticles
EP2565044A4 (fr) * 2010-04-28 2015-10-21 Konica Minolta Holdings Inc Procédé pour produire une matière imprimée

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US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds

Patent Citations (2)

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Publication number Priority date Publication date Assignee Title
US5882722A (en) * 1995-07-12 1999-03-16 Partnerships Limited, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decompositions compounds
US6036889A (en) * 1995-07-12 2000-03-14 Parelec, Inc. Electrical conductors formed from mixtures of metal powders and metallo-organic decomposition compounds

Cited By (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002300130B2 (en) * 2001-07-19 2007-09-06 Sumitomo Chemical Company, Limited Ceramics dispersion liquid, method for producing the same, and hydrophilic coating agent using the same
US7141185B2 (en) 2003-01-29 2006-11-28 Parelec, Inc. High conductivity inks with low minimum curing temperatures
US7211205B2 (en) 2003-01-29 2007-05-01 Parelec, Inc. High conductivity inks with improved adhesion
US7749299B2 (en) 2005-01-14 2010-07-06 Cabot Corporation Production of metal nanoparticles
US8167393B2 (en) 2005-01-14 2012-05-01 Cabot Corporation Printable electronic features on non-uniform substrate and processes for making same
US8334464B2 (en) 2005-01-14 2012-12-18 Cabot Corporation Optimized multi-layer printing of electronics and displays
US8597397B2 (en) 2005-01-14 2013-12-03 Cabot Corporation Production of metal nanoparticles
EP2565044A4 (fr) * 2010-04-28 2015-10-21 Konica Minolta Holdings Inc Procédé pour produire une matière imprimée

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