WO2001027978A1 - Substrat, dispositif a etage, procede d'attaque d'etage, systeme d'exposition et procede d'exposition - Google Patents

Substrat, dispositif a etage, procede d'attaque d'etage, systeme d'exposition et procede d'exposition Download PDF

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Publication number
WO2001027978A1
WO2001027978A1 PCT/JP1999/005539 JP9905539W WO0127978A1 WO 2001027978 A1 WO2001027978 A1 WO 2001027978A1 JP 9905539 W JP9905539 W JP 9905539W WO 0127978 A1 WO0127978 A1 WO 0127978A1
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WO
WIPO (PCT)
Prior art keywords
stage
exposure
wafer
substrate
mask
Prior art date
Application number
PCT/JP1999/005539
Other languages
English (en)
Japanese (ja)
Inventor
Masato Takahashi
Original Assignee
Nikon Corporation
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nikon Corporation filed Critical Nikon Corporation
Priority to KR1020017016269A priority Critical patent/KR100625625B1/ko
Priority to CNB99816934XA priority patent/CN1260772C/zh
Priority to AU60054/99A priority patent/AU6005499A/en
Priority to PCT/JP1999/005539 priority patent/WO2001027978A1/fr
Publication of WO2001027978A1 publication Critical patent/WO2001027978A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70766—Reaction force control means, e.g. countermass
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70716—Stages
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/709—Vibration, e.g. vibration detection, compensation, suppression or isolation

Definitions

  • the present invention relates to a substrate, a stage apparatus, a stage driving method, an exposure apparatus, and an exposure method.
  • the present invention relates to a substrate on which a mask pattern is exposed, such as a glass substrate or a wafer, a stage device in which a stage body holding the substrate moves in a plane on a surface plate, a driving method thereof, and a stage device.
  • the present invention relates to an exposure apparatus and an exposure method for performing an exposure process using a held mask and a substrate. Particularly, when manufacturing a device such as a semiconductor integrated circuit or a liquid crystal display, a substrate and a stage suitable for use in a lithography process are used.
  • the present invention relates to a laser device, a stage driving method, an exposure device, and an exposure method. Background art
  • a circuit pattern formed on a mask or reticle (hereinafter, referred to as a reticle) is formed on a wafer or glass plate coated with a resist (photosensitive agent).
  • a resist photosensitive agent
  • Various exposure apparatuses for transferring onto a substrate are used.
  • a pattern of a reticle is projected on a wafer using a projection optical system in accordance with the miniaturization of the minimum line width (device rule) of a pattern accompanying the high integration of an integrated circuit in recent years.
  • a reduction projection exposure apparatus that performs reduction transfer on the top is mainly used.
  • This reduction projection exposure apparatus is a step-and-repeat type static exposure reduction projection exposure apparatus (so-called stepper) that sequentially transfers a reticle pattern to a plurality of shot areas (exposure areas) on a wafer.
  • This stepper is an improvement on the reticle and wafer in a one-dimensional direction by synchronously moving the reticle and the wafer as disclosed in Japanese Patent Laid-Open No. 8-16643, etc.
  • a scanning exposure type exposure apparatus of the 'and' scan type (so-called scanning 'stepper').
  • a base plate serving as a reference for the apparatus is first installed on the floor as a stage apparatus, and a reticle stage, a wafer stage, and a projection apparatus are placed on the base plate via a vibration isolating table for isolating floor vibration.
  • Optical system projection lens
  • the one on which a main body column for supporting the like is mounted is often used.
  • Recent stage devices are equipped with an air mount that can control the internal pressure and an actuator such as a voice coil motor as the vibration isolator, and are mounted on the main body column (main frame).
  • An active anti-vibration table that controls the vibration of the main body column by controlling the voice coil module based on the measurement value of an accelerometer is employed.
  • the wafer stage in the case of a stepper
  • a reticle stage and a wafer stage The reaction force generated by the acceleration and deceleration movement (in the case of scanning 'stepper') caused vibration of the main body column, causing a relative position error between the projection optical system and the wafer.
  • the relative position error at the time of alignment and at the time of exposure may result in image blur (increase in pattern line width) when a pattern is transferred to a position different from the design value on the wafer as a result, or when the position error includes a vibration component. Or inconvenience).
  • the reaction force generated by the movement of the wafer stage is mechanically reduced by using a frame member.
  • the invention in which the reticle stage is moved to the floor (ground) the reaction force generated by the movement of the reticle stage is mechanically controlled by using a frame member.
  • the invention which escapes to the floor (ground) is known.
  • the conventional stage apparatus and exposure apparatus as described above have the following problems.
  • the present invention has been made in consideration of the above points, and has a stage device, a stage driving method, and an exposure method capable of maintaining the position controllability of a stage even when a large stage or a high-speed stage is used. It is an object to provide an apparatus and an exposure method. Another object of the present invention is to provide an exposure apparatus and an exposure method that can perform high-precision exposure while securing a certain level of throughput even when a large stage or a high-speed stage is used. Still another object of the present invention is to provide a substrate on which a pattern has been exposed with high precision. Disclosure of the invention
  • the present invention employs the following configuration corresponding to FIGS. 1 to 7 showing the embodiment.
  • the stage device of the present invention is a stage device (4, 7) including a stage body (2, 5) driven at least in one direction on a surface plate (3, 6), ), And a supporting portion (8, 10) which is arranged independently in vibration, and a reaction force generated by driving the stage body (2, 5) on the supporting portion (8, 10). And a reaction force stage (17, 37) that is movable in the direction.
  • the stage driving method of the present invention is a stage driving method including a first stage (2, 5) driven in at least one direction on a surface plate (3, 6), wherein the first stage
  • the reaction force (17, 37), which is the second stage is in the opposite direction to the stage body (2, 5) due to the reaction force accompanying the drive of the stage body (2, 5). Therefore, the law of conservation of momentum works between the stage body (2, 5) and the reaction force stage (17, 37).
  • the reaction force stage (17, 37) is connected to the surface plate (3, 6). In order to move on the vibration independent support parts (8, 10),
  • the vibration of (8, 10) is not transmitted to the surface plate (3, 6), and can prevent the position controllability of the stage body (2, 5) from being affected.
  • the exposure apparatus of the present invention exposes a pattern of a mask (R) held on a mask stage (2) to a substrate (W) held on a substrate stage (5).
  • the stage device (4, 7) according to any one of claims 1 to 9 is provided.
  • the exposure method of the present invention is a method of exposing a pattern of a mask (R) held on a mask stage (2) to a substrate (W) held on a substrate stage (5). 21.
  • the vibration caused by the drive of the mask stage (2) and the substrate stage (5) is reduced to the projection optical system (P).
  • FIG. 1 is a view showing a first embodiment of the present invention, and is a schematic configuration diagram of an exposure apparatus in which a reticle stage, a wafer stage, and a projection optical system are independently arranged with respect to vibration.
  • FIG. 2 is an external perspective view of a stage device having the reticle stage.
  • FIG. 3 is a view showing the first embodiment of the present invention, and is a side view of a stator having springs connected to both sides.
  • 114 is a partially enlarged view of a stage device having a wafer stage.
  • FIG. 5 is an enlarged view of the main part of the linear motor that drives the wafer stage.
  • FIG. 6 is a view showing the second embodiment of the present invention, and is a schematic configuration diagram of an exposure apparatus in which a reticle stage, a wafer stage, and a projection optical system are independently arranged with respect to vibration.
  • FIG. 7 is an external perspective view showing another embodiment of the stage device having the wafer stage.
  • FIG. 8 is a flowchart illustrating an example of a semiconductor device manufacturing process. BEST MODE FOR CARRYING OUT THE INVENTION
  • FIGS. 1 to 7 a description will be given using an example in which a scanning stepper is used as an exposure apparatus that transfers a circuit pattern of a semiconductor device formed on a reticle onto a wafer while simultaneously moving the reticle and the wafer. I do.
  • the stage apparatus of the present invention is applied to both a reticle stage and a wafer stage.
  • the exposure apparatus 1 shown in FIG. 1 includes an illumination optical system IU that illuminates a rectangular (or circular) illumination area on a reticle (mask) R with uniform illumination by exposure illumination light from a light source (not shown).
  • the direction of the optical axis of the projection optical system PL is defined as the Z direction
  • the direction of the synchronous movement of the reticle R and the wafer W in the direction perpendicular to the Z direction is defined as the Y direction
  • the direction of the asynchronous movement is defined as the X direction.
  • the rotation directions around each axis are ⁇ ⁇ , 6> ⁇ , 6> ⁇ .
  • the illumination optical system I U is supported by a support column 9 fixed to the upper surface of the reaction frame 8.
  • the illumination light for exposure includes, for example, ultraviolet bright lines (g-line, i-line) and KrF excimer laser light (wavelength) emitted from an ultra-high pressure mercury lamp.
  • Deep ultraviolet light such as 248 nm
  • ArF excimer laser light wavelength 19
  • the reaction frame 8 is installed on a base plate 10 placed horizontally on the floor surface, and the upper and lower sides thereof have stepped portions 8a and 8b protruding inward. Each is formed.
  • the reticle surface plate 3 is supported substantially horizontally by a step portion 8a of the reaction frame 8 at each corner via a vibration isolating unit (vibration isolating mechanism) 11 (see FIG. 1).
  • the anti-vibration unit on the back side of the drawing is not shown), and an opening 3a through which the pattern image formed on the reticle R passes is formed at the center.
  • the vibration proof unit 11 is configured such that an air mount 12 whose internal pressure is adjustable and a voice coil motor 13 are arranged in series on the step 8a. These anti-vibration units 11 allow reticulation via the base plate 10 and the reaction frame 8.
  • Micro vibration transmitted to the surface plate 3 is insulated at the micro G level.
  • a reticle stage 2 is supported on the reticle base 3 so as to be two-dimensionally movable along the reticle base 3.
  • a plurality of air bearings (air pads) 14 which are non-contact bearings are fixed to the bottom surface of the reticle stage 2, and the reticle stage 2 is mounted on the reticle surface plate 3 by the air bearings 14. It is levitated and supported through the clearance of about Kron.
  • the reticle stage 2 is driven by a pair of linear motors (driving mechanisms) 15 on the reticle surface plate 3 in the scanning direction in the Y direction within a predetermined stroke range.
  • the reticle stage 2 includes a reticle fine movement stage (not shown) that sucks and holds the reticle R and minutely drives the reticle R in the non-scanning direction (X direction) and 6> Z direction, and is connected to the fine movement stage and moves in the X and Y directions. It has a movable coarse movement stage, but these are shown here as one stage. Therefore, the reticle stage 2 is configured to be linearly driven with a long stroke in the Y direction and to be capable of minutely driving in the X and directions.
  • a pair of Y movable mirrors 18a and 18b each composed of a corner cube are fixed to one end of the reticle stage 2 in the Y direction, and the + X direction of the reticle stage 2 in the + X direction is fixed.
  • An X movable mirror 19 composed of a flat mirror extending in the Y direction is fixed to the end.
  • three laser interferometers that irradiate these movable mirrors 18a, 18b, and 19 with measuring beams measure the distance to each movable mirror, and the reticle stage The position in the X, Y, and (rotation around the ⁇ axis) direction of 2 is measured with high accuracy.
  • a movable element 16 having a built-in coil and extending in the ⁇ direction is provided integrally with the reticle stage 2 at approximately the center in the ⁇ direction on both sides in the X direction of the reticle stage 2.
  • a pair of stators 17 having a U-shaped cross section as reaction force stages (second stages) are arranged opposite to the mover 16.
  • the stator 17 is composed of a stator yoke and a large number of permanent magnets that generate an alternating magnetic field arranged at predetermined intervals along the extending direction of the stator yoke.
  • mover A moving coil type linear motor 15 is constituted by 16 and the stator 1 ⁇ , and the mover 16 is driven in the ⁇ direction (one direction) by electromagnetic interaction with the stator 17. It is supposed to be.
  • the weight ratio of the reticle stage 2 side including the mover 1 6 etc. and the stator 1 7 side is approximately 1: c that is set to 4
  • a rolling guide 20 is interposed between each stator 1 ⁇ and the upper surface of the reaction frame 8.
  • the rolling guide 20 has a configuration in which a plurality of rollers (rolling elements) 21 whose axis extends in the X direction and rotates around each axis are arranged at a certain interval in the Y direction.
  • the stator 17 is movable in the Y direction with respect to the reaction frame 8 by the rotation of the roller 21.
  • a pair of springs (biasing portions) 2 2, 2 2 constituting a return device for returning the stator 17 to the initial position are provided on both sides in the Y direction of each stator 17. One end of each is connected to T1.
  • each spring 22 has a sufficient amount of flexure to be deformed within the elastic range even when the stator 17 moves.
  • the reticle stage 2 is a guideless stage having no guide member for guiding the movement of the reticle stage 2 in the X and Y directions.
  • both the object plane (reticle R) side and the image plane (wafer W) side are telecentric and have a circular projection field, and quartz or fluorite is used as the optical glass material.
  • a 1/4 (or 1/5) refractive optical system composed of a refractive optical element (lens element) is used.
  • FIG. 4 shows an enlarged view below the projection optical system PL of the exposure apparatus 1.
  • a flange 23 integrated with the lens barrel is provided on the outer periphery of the lens barrel of the projection optical system PL.
  • the projection optical system PL is mounted on a barrel base 25 composed of an object or the like that is supported substantially horizontally on a step 8 b of the reaction frame 8 via a vibration isolating unit 24. Is inserted from above in the Z direction, and the flanges 23 are engaged.
  • the material of the flange 23 is a material having a low thermal expansion, such as Invar (reduced by Invar; nickel 36%, manganese 0.25%, and iron containing trace amounts of carbon and other elements). Expansion alloy) is used.
  • the flange 23 constitutes a so-called kinematic support mount that supports the projection optical system PL at three points with respect to the barrel base 25 via points, surfaces, and V-grooves.
  • a kinematic support structure By adopting such a kinematic support structure, it is easy to assemble the projection optical system PL to the barrel base 25, and vibration, temperature change, etc. of the assembled barrel base 25 and the projection optical system PL. It has the advantage that the stresses caused by stress can be reduced most effectively:
  • the anti-vibration unit 24 is arranged at each corner of the lens barrel base 25 (the anti-vibration unit on the back side of the drawing is not shown), and the air mount 26 and the voice coil module whose internal pressure can be adjusted.
  • the configuration is such that overnight 27 is arranged in series on step 8b.
  • These vibration isolation units 24 insulate the micro-vibrations transmitted to the lens barrel base 25 (and, consequently, the projection optical system PL) via the base plate 10 and the reaction frame 8 at the microphone opening G level. ing.
  • the stage device 7 mainly includes a wafer stage 5 for holding a wafer W, and a wafer surface plate 6 for supporting the wafer stage 5 movably in a two-dimensional direction along the XY plane.
  • a plurality of air bearings (air pads) 28, which are non-contact bearings, are fixed to the bottom surface of the wafer stage 5, and the wafer stage 5 is fixed by the air bearings 28.
  • the wafer surface plate 6 is supported substantially horizontally above a base plate (support portion) 10 via a vibration isolating unit (vibration isolating mechanism) 29.
  • the anti-vibration units 29 are arranged at each corner of the wafer surface plate 6 (the anti-vibration unit on the back side of the drawing is not shown), and the air mount 30 and the voice coil motor 3 whose internal pressure can be adjusted. 1 and 1 It is configured to be arranged in parallel on the subnote 10.
  • the wafer stage 5 includes a pair of linear motors 32 that drive the wafer stage 5 in the X direction (a linear motor closer to the paper than the wafer stage 5 is not shown) and the wafer stage 5 that drives the wafer stage 5 in the Y direction.
  • the pair of linear motors (drive mechanisms) 33 makes it possible to freely move in the XY two-dimensional direction on the wafer surface plate 6.
  • the stator of the linear motor 32 is extended along the X direction on both outer sides of the wafer stage 5 in the Y direction, and both ends are connected to each other by a pair of connecting members 34. Body 35 is composed. The movers of the linear motor 32 project from both sides in the Y direction of the wafer stage 5 so as to face the stator.
  • movers 36 and 36 composed of armature units are provided, respectively.
  • the stators (reaction force stages) 37, 37 as the second stage having magnet units corresponding to the stators 36, 36 extend in the Y direction.
  • a rolling guide 38 is interposed between each stator 37 and the base plate 10.
  • the rolling guide 38 has a configuration in which a plurality of rollers (rolling elements) 39 whose axes extend in the X direction and rotate around each axis are arranged at regular intervals in the Y direction.
  • the stator 37 is movable in the Y direction with respect to the base plate 10 as a support by the rotation of the roller 39.
  • each spring 40 is set to have a sufficient radius so as to be deformed within the elastic range even when the stator 37 moves.
  • a moving coil type linear motor 33 is constituted by the mover 36 and the stator 3 7, and the mover 36 has an electromagnetic phase between the mover 36 and the stator 37. It is driven in the Y direction (one direction) by interaction. That is, the linear stage 33 drives the wafer stage 5 integrally with the frame 35 in the ⁇ direction. As is apparent from FIG. 4, the wafer stage 5 is a guided stage having no guide member for the movement in the vertical direction. It should be noted that the movement of the wafer stage 5 in the X direction can be appropriately set as a guide stage.
  • the wafer W is fixed on the upper surface of the wafer stage 5 via a wafer holder 41 by vacuum suction or the like.
  • the position of the wafer stage 5 in the X direction is based on the reference mirror 42 fixed to the lower end of the barrel of the projection optical system PL, and the position change of the movable mirror 43 fixed to a part of the wafer stage 5 is used as a reference.
  • Laser interferometer 44 which is a position measuring device for measurement, whereby measurement is performed in real time with a predetermined resolution, for example, a resolution of about 0.5 to 1 nm.
  • the position of the wafer stage 5 in the Y direction is determined by a reference mirror, a moving mirror, and a laser interferometer (not shown) arranged so as to be substantially orthogonal to the reference mirror 42, the moving mirror 43, and the laser interferometer 44. Measured. At least one of these laser interferometers is a multi-axis interferometer having two or more measuring axes. Based on the measurement values of these laser interferometers, the XY of the wafer stage 5 (and thus the wafer W) is determined. Not only the position, but also 9 rotations or the leveling amount in addition to them can be obtained.
  • the reticle surface plate 3, the wafer surface plate 6, and the lens barrel surface plate 25 include three vibration sensors (for example, an accelerometer; not shown) for measuring the vibration in the Z direction of each surface plate, and an XY plane. Three vibration sensors (for example, accelerometers; not shown) that measure inward vibration are attached to each. Two of the latter vibration sensors measure the vibration of each surface plate in the Y direction, and the remaining vibration sensors measure the vibration in the X direction (hereinafter referred to as the vibration sensor group for convenience). ).
  • the vibrations of the six degrees of freedom ( ⁇ , ⁇ , ⁇ , 0 ⁇ , ⁇ ⁇ ⁇ ⁇ ) of the reticle surface plate 3, the wafer surface plate 6, and the lens barrel surface plate 25 are obtained. It can be sought.
  • three laser interferometers 45 which are position detecting devices, are fixed to the flanges 23 of the projection optical system PL at three different places (however, in FIG. One of the laser interferometers is typically shown).
  • Each —Apertures 25a are formed in the part of the barrel base 25 facing the interferometer 45, and each laser interferometer 45 is moved in the Z direction through these openings 25a.
  • the measurement beam is applied to the wafer surface plate 6. Reflection surfaces are formed on the upper surface of the wafer surface plate 6 at positions facing the respective measurement beams. For this reason, three different Z positions of the wafer surface plate 6 are measured by the three laser interferometers 45 with reference to the flange 23 (however, in FIG.
  • a reflection surface may be formed on the upper surface of the wafer stage 5 and an interferometer for measuring three different Z-direction positions on the reflection surface with reference to the projection optical system PL or the flange 23 may be provided.
  • stage devices 4 and 7 having the above configuration First, the operation of the stage device 4 will be described.
  • the stator 17 rolls due to the reaction force of the driving, and moves in the opposite direction on the reaction frame 8 by the rolling guide 20. (Y direction). At this time, in the rolling guide 20, since the roller 21 rotates, the stator 17 moves smoothly.
  • the stator 1 7 associated with the movement of the reticle stage 2 7 Is determined by the weight ratio of the reticle stage 2 side (including Y movable mirrors 18a and 18b, X movable mirror 19, mover 16 and reticle R) to the stator 17 side Is done.
  • the weight ratio between the reticle stage 2 side and the stator 17 side is about 1: 4, for example, a movement of 30 cm in the + Y direction of the reticle stage 2 causes the stator 17 to move one Y Move 7.5 cm in the direction.
  • the reaction force of the reticle stage 2 during acceleration / deceleration in the scanning direction is absorbed by the movement of the stator 17, and the position of the center of gravity of the stage device 4 is substantially determined in the Y direction.
  • the reaction frame 8 on which the stator 17 is supported supports the reticle surface plate 3 via the vibration isolation unit 11, so that these reaction The frame 8 and the reticle platen 3 are vibrationally independent. Therefore, even when the reticle stage 2 is driven, it is possible to effectively suppress the reticle surface plate 3 from vibrating due to the reaction force.
  • the stator 17 moves in the ⁇ Y direction, the urging force of the urging portion 22 shown in FIG.
  • stator 17 promptly returns to the position where the above-mentioned biasing force is balanced, that is, the initial position (initial position).
  • the anti-vibration unit 11 feeds a force (counter force) to cancel the influence of the change in the center of gravity due to the movement of the reticle stage 2 based on the measurement value of the laser interferometer, and generates this force.
  • the air mount 12 and the voice coil motor 13 are driven in such a manner as to operate. Also, the friction between the notch stage 2 and the '. SI constant 17 and the reticle surface 3 is not zero, or the moving direction between the reticle stage 2 and the stator 17 is slightly different. Therefore, even if minute vibrations of the reticle surface plate 3 in the directions of six degrees of freedom remain, the air mount 12 and the voice coil module 13 are used to remove the residual vibrations based on the measurement values of the vibration sensors. Feedback control.
  • stage device 7 the same operation as in the stage device 4 occurs.
  • the stator 37 When the wafer stage 5 is moved in the scanning direction (+ Y direction) by the driving of the linear motor 33, the stator 37 is rolled by the reaction force of the driving, and the guide 37 guides the stator 38 in the opposite direction on the base plate 10. (Y direction). At this time, in the rolling guide 38, since the roller 39 rotates, the stator 37 moves smoothly. When the friction between the wafer stage 5, the stator 37, and the wafer surface plate 6 is zero, the law of conservation of momentum works, and the movement of the stator 37 with the movement of the wafer stage 5 is performed. The momentum is determined by the weight ratio between the wafer stage 5 side and the stator 37 side.
  • the reaction force of the wafer stage 5 during acceleration / deceleration in the scanning direction is absorbed by the movement of the stator 37, and the position of the center of gravity of the stage device 7 is substantially fixed in the Y direction. Since the base plate 10 on which the base plate 37 is supported supports the wafer base plate 6 through the vibration isolating unit 29, the base plate 10 and the wafer base plate 6 vibrate. Become independent independently. Therefore, when the wafer stage 5 is driven, In addition, it is possible to effectively suppress the wafer surface plate 6 from vibrating due to the reaction force.
  • the stator 37 moves in the ⁇ Y direction, the balance of the urging force of the urging portion 40 shown in FIG. 3 with respect to the stator 37 is broken, and the stator 37 is urged in the + Y direction. Power increases. Therefore, the stator 37 quickly returns to the position where the urging force is balanced, that is, the initial position (initial position).
  • a count force for canceling the influence of the change in the center of gravity due to the movement of the wafer stage 5 is given in feed feed based on the measurement value of the laser interferometer 44, etc.
  • the air mount 33 and the voice coil motor 31 are driven to generate this force.
  • the friction between the three members of the wafer stage 5, the stator 37, and the wafer surface plate 6 is not zero, or the movement direction of the wafer stage 5 and the stator 37 is slightly different. Even if minute vibrations in the 6-DOF direction of the surface plate 6 remain, the air mount 30 and the voice coil motor 31 are fixed to remove the above-mentioned residual vibrations based on the measurement values of the vibration sensors. Control back.
  • the reaction frame A vibration proof unit 24 is interposed between the vibration control unit 8 and the vibration control unit 8 to be independent with respect to vibration. Also, even if a slight vibration occurs in the lens barrel base 25, vibration in six degrees of freedom is obtained based on the measurement values of the vibration sensors provided in the lens barrel base 25, and the air mount 26 and By performing feedback control on the voice coil motor 27, this minute vibration can be canceled, and the lens barrel base 25 can be constantly maintained at a stable position.
  • the projection optical system PL supported by the barrel base 25 can be maintained at a stable position, and the occurrence of displacement of the pattern transfer standing position and image blur due to the vibration of the projection optical system PL can be prevented. Exposure can be effectively prevented to improve exposure accuracy.
  • the linear motors 32 and 33 are controlled while monitoring the measurement values of the laser interferometer 44 based on the alignment results.
  • the wafer stage 5 is moved to the scanning start position for the exposure of the first shot of W.
  • the reticle stage 2 and the wafer stage 5 start scanning in the Y direction via the linear motors 15 and 33, and when both stages 2 and 5 reach their respective target scanning speeds, they are exposed.
  • the pattern area of reticle ⁇ ⁇ ⁇ ⁇ is illuminated by the illumination light, and scanning exposure is started.
  • the moving speed of the reticle stage 2 in the Y direction and the moving speed of the wafer stage 5 in the Y direction depend on the projection magnification (1/5 or 1 / 4 ⁇ ⁇ ) of the projection optical system PL.
  • the reticle stage 2 and the wafer stage 5 are synchronously controlled via the linear motors 15 and 33 so that the speed ratio is maintained.
  • different areas of the pattern area of the reticle R are sequentially illuminated with illumination light, and the illumination of the entire pattern area is completed, whereby the scanning exposure of the first shot on the wafer W is completed.
  • the pattern of the reticle R is reduced and transferred to the first shot area on the wafer W via the projection optical system PL.
  • the wafer stage 5 is stepped in the X and Y directions via the linear motors 32 and 33, and is moved to the scanning start position for the exposure of the second shot. Is done.
  • the position of the wafer stage 5 in the X, Y, and direction is measured in real time based on the measurement value of the laser interferometer 44 that detects the position of the wafer stage 5 (the position of the wafer W).
  • the linear motors 32 and 33 are controlled to control the position of the wafer stage 5 so that the X ⁇ position displacement of the wafer stage 5 is in a predetermined state.
  • the rotation of the reticle stage 2 is controlled so as to correct the error of the rotational displacement on the wafer W side based on this displacement information. Then, like the first shot area, the second shot area Scanning exposure.
  • the stators 17 and 37 move in opposite directions by the reaction force when the reticle stage 2 and the wafer stage 5 are driven.
  • the law works, and it is possible to prevent these reaction forces from being transmitted to the reaction frame 8, the base plate 10, and even the floor, and to avoid problems such as swinging back, so that the reticle R or wafer W becomes larger, Even when moving at high speed, the settling time is shortened, and the throughput and exposure accuracy can be improved.
  • the reaction frame 8 supports the reticle surface plate 3 via the vibration isolation unit 11 and the base plate 10 supports the wafer surface plate 6 via the vibration isolation unit 29. The transmission of the residual vibration of the sample 10 to the reticle platen 3 and the wafer platen 6 can be suppressed, and the standing controllability of each of the stages 2 and 5 can be maintained.
  • a part of the linear motors 15 and 33 for driving each of the stages 2 and 5 is replaced with a stator 17 and 37 for forming each of the stages 2 and 5. Since it is moved by the reaction force, there is no need to separately provide a mechanism for eliminating the reaction force, and it is possible to realize a reduction in size and cost of the device.
  • the stators 17 and 37 move by the above-described reaction force, the rollers 21 and 39 are rotated by a simple operation of rotating around the axis, so that the device can be simplified.
  • the stators 17 and 37 move by the reaction force. In this case, it can be easily returned to the initial position by a simple mechanism.
  • reticle stage 2, wafer stage 5, and projection optical system PL are vibrationally independent by anti-vibration units 11, 29, and 24. It is possible to prevent the vibration caused by the drive of the wafer stage 5 from being transmitted to the projection optical system PL, and to effectively prevent the displacement of the pattern transfer position and the occurrence of image blur due to the vibration of the projection optical system PL for exposure. Improve accuracy You can also plan.
  • FIG. 6 is a diagram showing a second embodiment of the stage apparatus and the exposure apparatus of the present invention.
  • the same elements as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and description thereof will be omitted.
  • the difference between the second embodiment and the first embodiment is the configuration of the stage device 7, which will be described below.
  • the stage device 7 mainly includes a wafer stage 5, a wafer surface plate 6, and a support plate (reaction stage) 46 for supporting these from below.
  • the stator 37 is configured to move in the Y direction with respect to the support plate 46 by a rolling guide 38 interposed between the stator 37 and the support plate 46.
  • the wafer surface plate 6 also has a configuration independent of the vibration with respect to the support plate 46 by the vibration isolating unit 29 disposed between the wafer platen 6 and the support plate 46. Therefore, the support plate 46 plays a role as a support portion with respect to the reaction force movement of the stator 37.
  • a rolling guide 48 including a plurality of rollers (rolling elements) 47 is interposed between the support plate 46 and the base plate 10.
  • the rollers 47 are respectively rotated around an axis extending in the Y direction, and are arranged at regular intervals in the X direction.
  • the support plate 46 is movable around the axis of the roller 47 in the X direction relative to the base plate 10.
  • Other configurations are the same as those of the first embodiment.
  • the same operation and effect as those of the first embodiment can be obtained, and in addition, when the wafer stage 5 moves in the + X direction, The supporting plate 46 moves in the X direction due to the reaction force accompanying the movement of stage 5, and the law of conservation of momentum works. Therefore, not only when the wafer stage 5 is moved for scanning exposure, but also when the wafer stage 5 is step-moved to change the shot area, the wafer stage 5 may be rejected due to the reaction force caused by the step movement. Since the problem can be avoided, the settling time becomes shorter, and the throughput and the exposure accuracy can be further improved. Also in this embodiment, the base spray G and the residual vibration of the support plate 46 can be suppressed from being transmitted to the wafer surface plate 6, and the position controllability of the stage 5 and the stage 5 can be maintained.
  • FIG. 7 is a view showing a third embodiment of the stage apparatus and the exposure apparatus of the present invention.
  • the same elements as those of the first embodiment shown in FIGS. 1 to 5 are denoted by the same reference numerals, and description thereof will be omitted.
  • the difference between the third embodiment and the first embodiment is the configuration of the wafer stage 5, which will be described below.
  • each wafer stage 5 is provided with a magnet unit (not shown) that forms a moving coil type linear motor mover.
  • the wafer stage 5 is independently movable along a wafer platen 6 along a linear guide 50 extending in the X direction as a stator having an armature unit. .
  • each wafer stage 5 is configured to move in the X direction along the linear guide 50 and to independently move in the ⁇ direction along the stator 37. Note that, in FIG. 7, illustration of a movable mirror, an index member, and the like installed on the wafer stage 5 is omitted.
  • the wafer W on the wafer stage 5 located on the ⁇ side is moved to the + Y side during the exposure operation through the projection optical system PL.
  • Alignment is performed on the wafer W on the wafer stage 5 located. More specifically, first, an alignment mark (not shown) formed on the index member and the wafer W is measured using the + Y-side alignment sensor 49a, and the wafer W is determined based on the measurement result. Pre-alignment. Next, the alignment of each shot area on the wafer W, for example, by using the EGA, is performed while moving the wafer stage 5.
  • the wafer stage after the exposure sequence 5 is moved in the Y direction, the wafer is replaced immediately below the alignment sensor 49b, and then the above alignment sequence is executed.
  • the wafer stage 5 that has been aligned by the alignment sensor 49a also moves in the Y direction, and the exposure sequence is executed immediately below the projection optical system PL.
  • the two wafer stages 5, 5 are moved independently, and wafer exchange and alignment are performed on one of the stages. The operation is performed, and the exposure operation is performed in parallel on the other stage, so that the throughput can be greatly improved.
  • the stator 37 used when each stage moves in the Y direction is shared by the movers 36 of both stages, the number of parts is reduced, that is, the equipment is simplified and the price is reduced. Can be realized.
  • the cocoons 21, 39, 47 are provided as means for moving the stators 17, 37 in the Y direction.
  • a non-contact bearing such as an air bearing may be provided.
  • the stators 17 and 37 move without halving the friction, so the reaction frame 8 and the base plate 1 Disturbance due to friction, such as zero vibration, can be eliminated, and more accurate exposure processing can be performed.
  • the roller air bearing may be provided on the stator, or may be provided on the reaction frame 8 or the base plate 10 supporting the stator.
  • the reticle stage 2 may have a mechanism capable of supporting a plurality of reticles R as in the third embodiment. In this case, the reticle stage 2 may be provided with a common coarse movement stage and a plurality of fine movement stages holding the reticle R may be provided independently. Thus, the entire stage 2 can be made compact.
  • the stators 17 and 37 are configured to move by the reaction force in both the reticle stage 2 and the wafer stage 5, but the stator is configured to move in only one of the stages. It goes without saying that the reaction force may be moved.
  • all of the vibration isolating units are configured to actively perform vibration isolation. All of these, any one of them, or any plural of them passively perform vibration isolation. Such a configuration may be adopted.
  • the reticle stage 2 has a two-stage configuration of a coarse movement stage and a fine movement stage, and one or both of them is provided with a member (for example, a stator) that moves by a reaction force accompanying the movement of the stage. There may be.
  • the stage apparatus of the present invention is configured to be applied to the exposure apparatus 1.
  • the present invention is not limited to this, and other than the exposure apparatus 1, a transfer mask drawing apparatus, a mask
  • the present invention is also applicable to precision measuring devices such as a pattern position coordinate measuring device.
  • the substrate of the present embodiment includes not only a semiconductor wafer W for a semiconductor device, but also a glass substrate for a liquid crystal display device, a ceramic wafer for a thin-film magnetic head, or an original mask or reticle used in an exposure apparatus. (Synthetic quartz, silicon wafer) etc. are applied.
  • the exposure apparatus 1 includes a step of scanning and exposing a pattern of the reticle R by synchronously moving the reticle R and the wafers W and PW.
  • An AND scan type scanning exposure apparatus (scanning stepper; USP5, 473, 4i0)
  • a step-and-repeat type projection exposure apparatus (stepper) that exposes the pattern of the reticle R while the reticle R and the wafer W are stationary and sequentially moves the wafer W and the PW step by step.
  • the type of the exposure apparatus 1 is not limited to an exposure apparatus for manufacturing a semiconductor device that exposes a semiconductor device pattern onto a wafer W, but may be an exposure apparatus for manufacturing a liquid crystal display element, a thin-film magnetic head, an image sensor (CCD), or the like. It can be widely applied to exposure equipment for manufacturing reticles and the like.
  • the emission lines (g-line (436 nm), h-line (404.7 nm), i-line (365 nm) :), KrF excimer laser ( 248 nm), a r F excimer one the (193 nm), not only the F 2 laser (157 nm) only, Ru can be uses charged particle beams such as X-ray or electron beam. If it is cool, thermionic emission type lanthanum hexaborite (LaB, tantalum (Ta)) can be used as an electron gun when using an electron beam, and a reticle R is used when using an electron beam. A configuration may be used, or a pattern may be directly formed on the wafer without using reticle R. A high frequency such as a YAG laser or a semiconductor laser may be used.
  • the magnification of the projection optical system PL is not limited to the reduction system, but can be either the same magnification system or the magnification system. Good.
  • a far ultraviolet ray such as an excimer laser
  • a material that transmits the far ultraviolet ray such as quartz or fluorite
  • a catadioptric system is used as a glass material
  • a refraction-type optical system may be used (the reticle R may be of a reflection type).
  • an electron optical system including an electron lens and a deflector may be used as the optical system.
  • the optical path through which the electron beam passes is in a vacuum state.
  • the present invention can be applied to an aperture exposure apparatus that exposes a reticle R pattern by bringing a reticle R and a wafer W into close contact with each other without using a projection optical system PL.
  • each of the stages 2 and 5 may be of a type that moves along a guide or a guideless type that does not have a guide.
  • the drive mechanism for each of the stages 2 and 5 is such that a magnet unit (permanent magnet) having a two-dimensionally arranged magnet and an armature unit having a two-dimensionally arranged coil are opposed to each other, and each stage 2 and 5 is driven by electromagnetic force.
  • a driven flat motor may be used.
  • one of the magnet unit and the armature unit may be connected to the stages 2 and 5, and the other of the magnet unit and the armature unit may be provided on the moving surface side (base) of the stages 2 and 5. .
  • the exposure apparatus 1 controls various subsystems including the respective components listed in the claims of the present application so as to maintain predetermined mechanical accuracy, electrical accuracy, and optical accuracy.
  • Manufactured by assembling Before and after this assembly, adjustments to achieve optical accuracy for various optical systems, adjustments to achieve mechanical accuracy for various mechanical systems, and various electrical systems before and after assembly are adjusted to achieve electrical accuracy.
  • the process of assembling the exposure apparatus from various subsystems includes mechanical connection, wiring connection of electric circuits, and piping connection of pneumatic circuits among the various subsystems. It goes without saying that there is an assembly process for each subsystem before the assembly process from these various subsystems to the exposure device. When the process of assembling the various subsystems into the exposure apparatus is completed, comprehensive adjustments are made to ensure various precisions of the entire exposure apparatus. Exposure equipment It is desirable to manufacture the equipment in a clean room where temperature and cleanliness are controlled.
  • a semiconductor device has a step 201 for designing the function and performance of the device, a step 202 for fabricating a mask (reticle) based on the design step, and a wafer made of silicon material. Manufacturing step 203, wafer processing step 204 for exposing a reticle pattern to a wafer by exposure apparatus 1 of the above-described embodiment, device assembling step (including dicing step, bonding step, package step) 2 0 5, inspection step 206, etc.
  • the present invention relates to a substrate on which a mask pattern is exposed, such as a glass substrate or a wafer, a stage device in which a stage body holding the substrate moves in a plane on a surface plate, a driving method thereof, and a stage device.
  • Exposure processing using the held mask and substrate (1) Exposure apparatus and exposure method, particularly when manufacturing devices such as semiconductor integrated circuits and liquid crystal displays, suitable substrates for use in the lithographic process.
  • TECHNICAL FIELD The present invention relates to a stage device, a stage driving method, an exposure device, and an exposure method.
  • the support unit is provided independently and vibratingly with respect to the surface plate, and the reaction force stage moves on the support unit by the reaction force accompanying the driving of the stage body. Because of this, problems such as swing back can be avoided, the settling time can be shortened, the throughput can be improved, and the residual vibration of the support can be suppressed from being transmitted to the surface plate. Position controllability can be maintained. Further, since the surface plate is supported by the support portion via the vibration isolating mechanism, it is possible to suppress the transmission of the residual vibration of the support portion to the surface plate, and to maintain the position controllability of the stage body.
  • reaction stage forms at least a part of the driving mechanism for driving the stage body in the negative direction
  • the device can be made smaller and less expensive. Pricing is realized.
  • a rolling element that rotates around the axis and moves the reaction force stage relative to the support portion is interposed between the reaction force stage and the support portion, so that when the reaction force stage moves, The rolling element rotates around the axis in a simple operation, which simplifies the equipment.
  • the non-contact bearing is interposed between the reaction stage and the support, the reaction stage moves without friction, so that disturbance due to friction such as vibration of the support can be eliminated. .
  • the stage body is movable in a direction substantially perpendicular to the direction in which it moves, and the reaction force stage is provided in each direction substantially perpendicular to the stage. Since it is possible to avoid problems such as swaying due to the accompanying reaction force, the settling time becomes shorter, and the throughput can be further improved.
  • the stage apparatus according to any one of claims 1 to 9 is used as at least one of a mask stage and a substrate stage.
  • the stage driving method described in any one of claims 17 to 20 is used, the settling time is shortened, and throughput and exposure accuracy can be improved.
  • the residual vibration of the support part can be suppressed from being transmitted to the surface plate, and the position controllability of the stage body can be maintained.
  • the mask stage, substrate stage, and projection optical system are arranged so as to be vibrationally independent of each other.

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Abstract

L'invention concerne un dispositif à étage (4) comprenant un support (8) isolé d'une plaque de surface (3) du point de vue des vibrations, et un étage de réaction (17) pouvant se déplacer sur le support (8) dans une direction, sous l'effet de la force de réaction qui s'exerce lorsque le corps de l'étage (2) est attaqué. L'élimination du mouvement de lacet dû à la réaction permet de diminuer le temps de stabilisation et d'améliorer le débit. En outre, on empêche la propagation des vibrations résiduelles depuis le support vers la plaque de surface.
PCT/JP1999/005539 1999-10-07 1999-10-07 Substrat, dispositif a etage, procede d'attaque d'etage, systeme d'exposition et procede d'exposition WO2001027978A1 (fr)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR1020017016269A KR100625625B1 (ko) 1999-10-07 1999-10-07 기판, 스테이지 장치, 스테이지 구동 방법, 노광 장치 및노광 방법
CNB99816934XA CN1260772C (zh) 1999-10-07 1999-10-07 载物台装置、载物台驱动方法和曝光装置及曝光方法
AU60054/99A AU6005499A (en) 1999-10-07 1999-10-07 Substrate, stage device, method of driving stage, exposure system and exposure method
PCT/JP1999/005539 WO2001027978A1 (fr) 1999-10-07 1999-10-07 Substrat, dispositif a etage, procede d'attaque d'etage, systeme d'exposition et procede d'exposition

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PCT/JP1999/005539 WO2001027978A1 (fr) 1999-10-07 1999-10-07 Substrat, dispositif a etage, procede d'attaque d'etage, systeme d'exposition et procede d'exposition

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