WO2000033377A1 - Dispositif de transfert de plaquettes - Google Patents

Dispositif de transfert de plaquettes Download PDF

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Publication number
WO2000033377A1
WO2000033377A1 PCT/JP1999/006660 JP9906660W WO0033377A1 WO 2000033377 A1 WO2000033377 A1 WO 2000033377A1 JP 9906660 W JP9906660 W JP 9906660W WO 0033377 A1 WO0033377 A1 WO 0033377A1
Authority
WO
WIPO (PCT)
Prior art keywords
cassette
cassettes
transfer device
substrate
wafer
Prior art date
Application number
PCT/JP1999/006660
Other languages
English (en)
Japanese (ja)
Inventor
Tomoo Kato
Tatsuo Nirei
Original Assignee
Olympus Optical Co., Ltd.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Olympus Optical Co., Ltd. filed Critical Olympus Optical Co., Ltd.
Priority to AU14118/00A priority Critical patent/AU1411800A/en
Publication of WO2000033377A1 publication Critical patent/WO2000033377A1/fr

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67271—Sorting devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67769—Storage means

Definitions

  • the present invention relates to a glass substrate for a wafer or a flat display.
  • the present invention relates to a substrate transfer device used for transferring a throat from a cassette to a predetermined position.
  • the desired wafer is taken out from the cassette cassette and the wafer is taken out.
  • the cassette Change the picking pitch of the wafer to prevent damage to the wafer when taking out the wafer.
  • a first cassette member that accommodates cassettes of different sizes and a first cassette member that is turned on when one of the second cassette members is attached is mounted.
  • a second push switch that is turned on when the second cassette is mounted, and the first switch is turned on according to the ON state of these push switches. Some of them detect a second cassette member and a second cassette member.
  • the second push switch is outside the first area where the first cassette is mounted and inside the second area where the second cassette is mounted.
  • the cassette for accommodating the substrate generally has various shapes depending on the manufacturer, and the cassette of the same substrate size is generally used.
  • the size of the cassette does not change much, the shape of the peripheral portion at the bottom of the cassette often differs. For this reason, when cassettes of different manufacturers are used together, the second push switch may not be pressed and the cassette size may be erroneously identified. There was also a risk that, if it was performed, the board would be damaged when the board was taken out.
  • the present invention has been made in view of the above circumstances, and an object of the present invention is to provide a substrate transfer device capable of surely identifying a substrate size. Disclosure of the invention
  • a cassette mounting portion capable of selectively mounting a plurality of types of cassettes having different sizes which hold substrates in a stacking direction;
  • a plurality of non-contact sensors which are arranged outside an area occupied when a cassette having a maximum size out of a plurality of kinds of force sets is mounted and which detects a selected cassette; and
  • a board size detecting section for detecting a board size according to a detection output of the non-contact sensor.
  • the non-contact sensor has a light emitting element and a light receiving element, and the selected cassette is mounted on the cassette mounting portion.
  • the power set can be detected based on whether the light emitted from the light emitting element is received by the light receiving element without being blocked by a part of the selected cassette.
  • the non-contact sensor includes a cassette selected by detecting a reflection signal from the selected cassette. It is characterized by being a reflection-type sensor that detects noise.
  • a substrate removing device for removing a substrate held by the cassette mounted on the cassette mounting portion.
  • a changing unit for changing the take-out interval of the substrate held at It is characterized by being prepared for.
  • the change of the take-out interval by the change section is performed by changing the cassette installed in the cassette section. It is characterized by being performed by changing the movement interval.
  • the change of the take-out interval by the change portion is performed by changing a moving interval of the substrate take-out portion. It is characterized by being performed by
  • the plurality of types of cassettes are attached to the cassette mounting portion such that the front surfaces having the opening surfaces coincide with each other. It is characterized by being installed.
  • the plurality of types of cassettes are arranged so that a center of a substrate held by each of the plurality of types of cassettes coincides with each other. It is characterized in that it is attached to
  • a ninth invention of the present invention is the invention according to the first invention, wherein the plurality of kinds of cassettes are mounted on the cassette mounting portion such that rear ends thereof coincide with each other. It is characterized by being carried out.
  • FIG. 1 is a diagram showing a substrate transfer device according to one embodiment of the present invention.
  • FIGS. 2A, 28 and 2 are diagrams for explaining the positional relationship between first and second sensors of the same embodiment.
  • FIG. 3 is a diagram showing a wafer size detection circuit used in the same embodiment.
  • FIG. 4 is a flowchart for explaining an automatic detection operation of the same embodiment.
  • FIG. 5 is a flowchart for explaining the manual detection operation of the same embodiment.
  • FIG. 1 shows a schematic configuration of a wafer transfer device to which the present invention is applied.
  • 1 is a c E c conveying apparatus main body, and have a elevators mechanism 1 a and Macros test ⁇ 3 described later Rereru.
  • the wafer inspection device is arranged by arranging the micro inspection unit 2 for performing the micro inspection of the wafer 8 (8 ') selectively supplied adjacent to the wafer transport device main body 1. Is configured.
  • the wafer transfer device main body 1 has a cassette 41 or 8 inches containing a substrate of different size, for example, a 6-inch wafer 8 adjacent to the macro inspection section 3.
  • Elevator mechanism 1a is provided as a cassette mounting portion that allows cassette 42, in which the eno and 8 'are stored, to be selectively mounted.
  • This relay mechanism la is a predetermined moving pitch corresponding to the cassettes 41 and 42 in which a plurality of wafers 8 (8 ') of each size are held at a predetermined pitch in the stacking direction. It is movable.
  • the cassettes 41 and 42 are mounted on the elevator mechanism la as shown in Fig. 2A.
  • the center alignment method is adopted so that the centers of the ink nozzles 8 and 8 'coincide.
  • the elevator mechanism 1a includes a first sensor 10 and cassettes 41, 42 for detecting whether the cassettes 41, 42 are correctly set. Set up a second sensor 11 to identify this.
  • the first sensor 10 serves as, for example, a push switch force, and is indicated by a hatched area in the figure, which is occupied in common when the cassettes 41 and 42 are mounted. It is located in B, and when any of these cassettes 41 and 42 is attached, cassettes 41 and 42 are detected. In this case, if the position of the connecting member provided on the bottom surface of the cassettes 41 and 42 is detected, all the cassettes can be detected by one sensor 10. Can be done.
  • the second sensor 11 is a transmission type sensor having a light emitting element 11a and a light receiving element 11b, and is occupied only when the 8-inch cassette 42 is attached. It is arranged so as to cross the area A indicated by hatching in the figure at a predetermined height, and when the 8-inch cassette 42 is attached, the light emitting element 11a to the light receiving element 11 The light transmitted to b is blocked, and cassette 42- is detected.
  • the second sensor As shown in FIG. 2A, the support 11 is positioned in front of the cassette 41 and across the area A that is occupied only when the cassette 42 is mounted.
  • the apparatus body 1 is provided with a hopper, a wafer take-out Z return arm 5 and a center table 6 facing the cassette 41 (42) as a transport means, facing the cassette 41 (42).
  • the wafer take-out Z return arm 5 has a linear moving mechanism that moves forward and backward with respect to the cassette 41 (42) along a guide (not shown), and an upper and lower arm that moves vertically at the retracted position. It has a moving mechanism, and when it moves forward in the direction of the cassette 41 (42) and sucks and holds the uno, 8 (8,) in the cassette 41 (42).
  • the eno, 8 (8 ') is transferred to the center table 6 by downward movement at the retreat position, and the cue on the center table 6 is transferred.
  • the wafer 8 (8 ') While holding the wafer 8 (8 ') by suction, it temporarily moves upward, and further moves forward in the direction of the cassette 41 (42) to cause the cassette 41 (42) to move forward. It allows a series of movements such as returning wafer 8 (8 ').
  • the center table 6 that constitutes the macro inspection unit 3 sucks and holds the placed wafer 8 (8 '), and enables the wafer 8 to rotate.
  • the turning operation of the center table 6 is performed by an operating mechanism (not shown) when observing the surface of the wings 8 (8 ') placed on the center table 6. By this turning operation, the surface of wafer 8 (8,) can be observed from various angular angles.
  • the wafer holding arm 7 for observing the rear surface of the mouth is arranged so as to surround the center table 6 to constitute the macro inspection part 3.
  • This The wafer holding arm 7 has a plurality of wafer holding portions 700 extending in the direction of the center of the eno, 8 (8 ').
  • the suction part of the center tape sucks and holds the fins 8 (8 ') on the center tape 6 from the back side.
  • Such a wafer holding arm 7 is rotatably supported by a rotating shaft 9, and is rotated by a predetermined angle about the rotating shaft 9 to hold the wafer.
  • C Turn over 8 (8,) to enable observing the back side of the mouth.
  • FIG. 3 shows a wafer size detection circuit in the wafer transfer device configured as described above.
  • reference numeral 12 denotes a CPU incorporated in the transport device main body 1 of the hopper, and the CPU 12 is connected to the first sensor 10 and the second sensor 11 described above. Then, the electronic drive unit 13 is connected, and further, the display unit 15 is connected via the display drive unit 14.
  • the CPU 12 is in charge of controlling the entire apparatus.
  • the 6-inch cassette 41 1 Or, the 8 inch cassette for 42 is selected and the wafer size is determined.
  • the elevator drive section 13 sets the pitch of the movement amount of the elevator mechanism section 1a with respect to the cassettes 41 and 42 based on the judgment result of the CPU 12.
  • the display unit 15 displays a command, a determination result, and the like in the CPU 12.
  • step 401 when the cassette 41 (42) is attached to the relay mechanism 1a of the device body 1 in step 401, the process proceeds to step 402. Automatic detection of wafer size is started, and in step 403, it is determined whether or not the first sensor 10 has detected the cassette 41 (42). If the cassette 41 (42) is not detected here, it is determined that the cassette 41 (42) has been forgotten to be mounted or that it is not completely mounted. An error is displayed on the display unit 15 in step 4 04.
  • step 403 the process proceeds to step 405 and the second sensor 11 Judge whether cassette 42 has been detected.
  • the cassette 42 is not detected, the cassette attached to the erasure mechanism 1a of the device body 1 is the same as the one for the 6-inch horn and the 8 inch.
  • Judgment proceeds to step 406, and the pitch of the amount of movement of the elevator mechanism 1a with respect to the 6-inch cassette and cassette 41 is set in the elevator drive unit 13
  • step 407 the mask opening inspection section 3 and the mouth opening inspection section 2 for the wafers 8 stored in the cassette 41 in the mask opening section 8. A mouth inspection is performed.
  • step 405 the cassette mounted on the cassette mounting portion 1a of the device body 1 is Judging that it is for an in-wafer, proceed to step 408, The pitch of the movement amount of the elevator mechanism 1a with respect to the cassette for the wafer 42 is set, and then, in step 407, the cassette for the 8-inch cassette 4 is set.
  • the macro inspection performed by the macro inspection unit 3 and the micro inspection performed by the micro opening inspection unit 2 are performed on the uno and 8 'stored in 2.
  • step 501 the force set 41 (42) is attached to the elevator mechanism 1a, and in step 502, the force set 41 is set on the operation panel 91. Operate the setting switch (not shown) for setting the wafer size of 8 inches or 8 inches. Then, in step 503, the wafer size set on the display unit 15 is displayed, and the cassette of the wafer size set on the elevator drive unit 13 is displayed. The pitch of the movement amount of the elevator mechanism 1a with respect to 41 (42) is set.
  • step 504 the detection of the noise and the size is started, and at step 505, the first sensor 10 is set to the cassette 4 1 (4 2 ) Is detected. If cassette 4 1 (4 2) is not detected, it is determined that cassette 4 1 (4 2) has been forgotten to be mounted or that it is incompletely mounted. At 0 6, an error is displayed on the display unit 15.
  • step 505 when the first sensor 10 detects the cassette 41 (42), the process proceeds to step 507, where the second sensor 110 is activated.
  • the cassette 4 1 Internal power, etc., supplied 6 inches, 8 is the step 509, the macro mouth inspection in the macro inspection part 3
  • the micro mouth inspection The mouth inspection in Part 2 is performed. If they do not match in step 508, a message indicating that the cassette sizes are different is displayed on the display section 15 in step 510.
  • step 507 the cassette mounted on the elevator mechanism 1a is the same as the one for the 8-inch nozzle. It is determined, but in step 511 it is determined whether or not it matches the wafer size set by a setting switch (not shown) in advance. If this is the case, the drive signal corresponding to the 8-inch cassette 41 from the elevator drive unit 13 is sent to the elevator mechanism 1a, and the wafer is taken out and returned to the return arm 5.
  • the 8 inch uno, 8 ' which is selectively supplied from the internal force, is the step 5 12, and the macro inspection and the micro mouth in the macro inspection section 3 are performed. The micro inspection is performed in the inspection part 2. In step 411, if they do not match, in step 513, an indication that the cassette size is different is displayed on the display section 15.
  • a second sensor composed of a transmissive sensor having a light emitting element 11a and a light receiving element 11b arranged so as to cross the second area A occupied only by the cassette 42. Since the use of 1 was used, the size of the cassette was the same as that of the same eno and size cassettes, but the size of the cassette did not change much. In many cases, the shape of the parts is different, and if the force sets of different manufacturers are used in a mixed manner, the cassette size is often mistakenly identified. However, even for cassettes of the same wafer size, even those with different shapes at the bottom of the set, it is possible to reliably identify the wafer size for each cassette.
  • the arrangement of the second sensor 11 can be reduced. Since it can be set at any position in the height direction of the slot 42, the space on the device body 1 can be used effectively.
  • Non-contact sensors such as ultrasonic reflection sensors and optical reflection sensors that send detection signals to the selected cassette instead of this transmission sensor and receive the reflection signals from this cassette You can also use a sensor.
  • the second sensor 11 is arranged in front of the cassette 41 so as to cross the area A occupied only when the cassette 42 is mounted.
  • an elevator function is provided to raise and lower the cassette side.
  • the cassette mounting portion is provided with a cassette mounting portion. It suffices if it has a function to place the kit.
  • the shape of the bottom of the set is different, and the substrate size of each cassette is different. Can be reliably identified. Industrial applicability
  • the substrate transfer device is suitable for transferring a glass substrate of a wafer display to a predetermined position from a cassette. RU

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Abstract

L'invention concerne un dispositif de transfert de plaquettes dans lequel des types multiples de support (41 (42)) ayant différentes tailles et contenant des plaquettes dans le sens de la pile peuvent être fixés sélectivement à un mécanisme élévateur (1a), un second capteur (11), comprenant un capteur de transmission présentant un élément photoémetteur (11a) et un élément photorécepteur (11b), est disposé à l'extérieur de la zone occupée lorsque le support (42) d'une taille maximum est fixé au mécanisme élévateur (1a), un support sélectionné étant détecté, puis la taille de la plaquette est mesurée sur la base de la sortie de détection du second capteur (11).
PCT/JP1999/006660 1998-11-30 1999-11-29 Dispositif de transfert de plaquettes WO2000033377A1 (fr)

Priority Applications (1)

Application Number Priority Date Filing Date Title
AU14118/00A AU1411800A (en) 1998-11-30 1999-11-29 Wafer transfer device

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP10/339332 1998-11-30
JP33933298A JP3573634B2 (ja) 1998-11-30 1998-11-30 基板搬送装置

Publications (1)

Publication Number Publication Date
WO2000033377A1 true WO2000033377A1 (fr) 2000-06-08

Family

ID=18326458

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP1999/006660 WO2000033377A1 (fr) 1998-11-30 1999-11-29 Dispositif de transfert de plaquettes

Country Status (4)

Country Link
JP (1) JP3573634B2 (fr)
AU (1) AU1411800A (fr)
TW (1) TW445564B (fr)
WO (1) WO2000033377A1 (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4091380B2 (ja) 2002-08-29 2008-05-28 東京エレクトロン株式会社 被処理体基板を収容した複数種類のカセットに対応可能なロードポート
JP2018107312A (ja) * 2016-12-27 2018-07-05 株式会社ディスコ 加工装置
JP7105629B2 (ja) * 2018-06-20 2022-07-25 東京エレクトロン株式会社 自動教示方法及び制御装置

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6467933A (en) * 1987-09-08 1989-03-14 Tel Sagami Ltd Wafer transfer system
JPH0424936A (ja) * 1990-05-15 1992-01-28 Tokyo Electron Ltd プローブ装置
JPH0870029A (ja) * 1994-06-21 1996-03-12 Toshiba Mach Co Ltd ウェハ搬送装置
JPH09139415A (ja) * 1995-11-14 1997-05-27 Nikon Corp ウエハ収納装置

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6467933A (en) * 1987-09-08 1989-03-14 Tel Sagami Ltd Wafer transfer system
JPH0424936A (ja) * 1990-05-15 1992-01-28 Tokyo Electron Ltd プローブ装置
JPH0870029A (ja) * 1994-06-21 1996-03-12 Toshiba Mach Co Ltd ウェハ搬送装置
JPH09139415A (ja) * 1995-11-14 1997-05-27 Nikon Corp ウエハ収納装置

Also Published As

Publication number Publication date
JP2000164676A (ja) 2000-06-16
JP3573634B2 (ja) 2004-10-06
AU1411800A (en) 2000-06-19
TW445564B (en) 2001-07-11

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