WO1998001821A1 - Carte a puce et son procede de fabrication - Google Patents
Carte a puce et son procede de fabrication Download PDFInfo
- Publication number
- WO1998001821A1 WO1998001821A1 PCT/DE1997/001301 DE9701301W WO9801821A1 WO 1998001821 A1 WO1998001821 A1 WO 1998001821A1 DE 9701301 W DE9701301 W DE 9701301W WO 9801821 A1 WO9801821 A1 WO 9801821A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- chip
- recess
- card
- induction coil
- base body
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
- G06K19/0775—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card arrangements for connecting the integrated circuit to the antenna
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07749—Constructional details, e.g. mounting of circuits in the carrier the record carrier being capable of non-contact communication, e.g. constructional details of the antenna of a non-contact smart card
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4912—Layout
- H01L2224/49171—Fan-out arrangements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01079—Gold [Au]
Definitions
- one conductor track end is preferably routed on the outside to the semiconductor chip and all other conductor track sections are routed on the inside to the semiconductor chip.
- the terms indoor and the outside are to be understood taking into account the semiconductor chip position on the overall chip card.
- This arrangement of the induction coil ends allows contacting to be made with relatively short bond wires. If the conductor tracks are run along the outside of the semiconductor chip, the area of the induction coil and thus also the sensitivity increases. On the other hand, when the conductor tracks are guided along the inside of the semiconductor chip, it lies outside the main magnetic field, so that undesired couplings can be avoided.
- the method is characterized by the direct mounting and wiring of the semiconductor chip 4 in the card base body 1, as a result of which the connection to the induction coil 14 in the region of the recess 3 can be established in a simple manner and without protrusion on the chip card surface.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
Abstract
L'invention concerne une carte à puce et son procédé de fabrication. Une bobine d'induction (14) imprimée ou appliquée par galvanisation sur le corps de base (1) d'une carte est amenée dans la zone de la puce jusqu'à des points de raccordement situés plus en bas dans un évidement (3), à la hauteur de la puce, et y est mise en contact avec la puce au moyen de fils électriques.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19627827.9 | 1996-07-10 | ||
DE19627827A DE19627827A1 (de) | 1996-07-10 | 1996-07-10 | Chipkarte und Verfahren zu ihrer Herstellung |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1998001821A1 true WO1998001821A1 (fr) | 1998-01-15 |
Family
ID=7799462
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/DE1997/001301 WO1998001821A1 (fr) | 1996-07-10 | 1997-06-23 | Carte a puce et son procede de fabrication |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19627827A1 (fr) |
WO (1) | WO1998001821A1 (fr) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE60110906T2 (de) * | 2000-04-04 | 2006-04-27 | Toray Engineering Co., Ltd. | Verfahren zur herstellung eines cof-gehäuses |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0376062A1 (fr) * | 1988-12-27 | 1990-07-04 | Eta SA Fabriques d'Ebauches | Module électronique pour un objet portatif de petite dimension, tel qu'une carte ou une clef, à circuit intégré, et procédé de fabrication de tels modules |
FR2716022A1 (fr) * | 1994-02-04 | 1995-08-11 | Mitsubishi Electric Corp | Module à semi-conducteur sans contact. |
EP0671705A2 (fr) * | 1994-02-14 | 1995-09-13 | Gemplus Card International | Procédé de fabrication d'une carte sans contact et carte sans contact |
EP0682321A2 (fr) * | 1994-05-11 | 1995-11-15 | Giesecke & Devrient GmbH | Porteur d'information à puce |
EP0688051A1 (fr) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Procédé de fabrication et d'assemblage de carte à circuit intégré et carte ainsi obtenue |
DE4441122C1 (de) * | 1994-11-19 | 1995-12-21 | Karl Heinz Wendisch | Kontaktlose Ausweis-Chipkarte |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE4431605C2 (de) * | 1994-09-05 | 1998-06-04 | Siemens Ag | Verfahren zur Herstellung eines Chipkartenmoduls für kontaktlose Chipkarten |
-
1996
- 1996-07-10 DE DE19627827A patent/DE19627827A1/de not_active Withdrawn
-
1997
- 1997-06-23 WO PCT/DE1997/001301 patent/WO1998001821A1/fr active Application Filing
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0376062A1 (fr) * | 1988-12-27 | 1990-07-04 | Eta SA Fabriques d'Ebauches | Module électronique pour un objet portatif de petite dimension, tel qu'une carte ou une clef, à circuit intégré, et procédé de fabrication de tels modules |
FR2716022A1 (fr) * | 1994-02-04 | 1995-08-11 | Mitsubishi Electric Corp | Module à semi-conducteur sans contact. |
EP0671705A2 (fr) * | 1994-02-14 | 1995-09-13 | Gemplus Card International | Procédé de fabrication d'une carte sans contact et carte sans contact |
EP0682321A2 (fr) * | 1994-05-11 | 1995-11-15 | Giesecke & Devrient GmbH | Porteur d'information à puce |
EP0688051A1 (fr) * | 1994-06-15 | 1995-12-20 | Philips Cartes Et Systemes | Procédé de fabrication et d'assemblage de carte à circuit intégré et carte ainsi obtenue |
DE4441122C1 (de) * | 1994-11-19 | 1995-12-21 | Karl Heinz Wendisch | Kontaktlose Ausweis-Chipkarte |
Also Published As
Publication number | Publication date |
---|---|
DE19627827A1 (de) | 1998-01-22 |
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