WO1987000486A1 - Printed wiring board for ic cards - Google Patents
Printed wiring board for ic cards Download PDFInfo
- Publication number
- WO1987000486A1 WO1987000486A1 PCT/JP1986/000356 JP8600356W WO8700486A1 WO 1987000486 A1 WO1987000486 A1 WO 1987000486A1 JP 8600356 W JP8600356 W JP 8600356W WO 8700486 A1 WO8700486 A1 WO 8700486A1
- Authority
- WO
- WIPO (PCT)
- Prior art keywords
- card
- bump
- circuit board
- printed circuit
- contact terminal
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
- B42D25/30—Identification or security features, e.g. for preventing forgery
- B42D25/36—Identification or security features, e.g. for preventing forgery comprising special materials
- B42D25/373—Metallic materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B42—BOOKBINDING; ALBUMS; FILES; SPECIAL PRINTED MATTER
- B42D—BOOKS; BOOK COVERS; LOOSE LEAVES; PRINTED MATTER CHARACTERISED BY IDENTIFICATION OR SECURITY FEATURES; PRINTED MATTER OF SPECIAL FORMAT OR STYLE NOT OTHERWISE PROVIDED FOR; DEVICES FOR USE THEREWITH AND NOT OTHERWISE PROVIDED FOR; MOVABLE-STRIP WRITING OR READING APPARATUS
- B42D25/00—Information-bearing cards or sheet-like structures characterised by identification or security features; Manufacture thereof
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07743—External electrical contacts
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/4007—Surface contacts, e.g. bumps
- H05K3/4015—Surface contacts, e.g. bumps using auxiliary conductive elements, e.g. pieces of metal foil, metallic spheres
-
- B42D2033/46—
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0335—Layered conductors or foils
- H05K2201/0347—Overplating, e.g. for reinforcing conductors or bumps; Plating over filled vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0367—Metallic bump or raised conductor not used as solder bump
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/03—Conductive materials
- H05K2201/0332—Structure of the conductor
- H05K2201/0364—Conductor shape
- H05K2201/0376—Flush conductors, i.e. flush with the surface of the printed circuit
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09845—Stepped hole, via, edge, bump or conductor
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/15—Position of the PCB during processing
- H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
- H05K3/243—Reinforcing the conductive pattern characterised by selective plating, e.g. for finish plating of pads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/281—Applying non-metallic protective coatings by means of a preformed insulating foil
Definitions
- the invention applies to a printed circuit board built in or attached to an Ic card used as a bank card, accusation card or diagnostic card, especially for IC cards Processing and accumulating various types of information from lead writers, so-called
- Ic-card stell plate having an IC chip and external contact terminals for transmitting and receiving the above various information to and from the IC chip by electric signals. Is the thing.
- the format for sending and receiving information to and from the IC reader is as follows: a contact-type system that sends and receives electric signals via wires, and electromagnetic waves, magnets,
- the present invention is broadly divided into a non-contact type using a wireless signal such as light, and the present invention is particularly open to the former.
- This type of printed circuit board for Ic power which is internally or internally mounted on the IC card, is mounted on the IC chip and mounted on the IC card.
- Send information from writer It has an external connector required for reception, and a conductor circuit for electrically connecting the external contact terminal to an IC chip or the like.
- an IC module with an IC chip mounted on the IC card printing wiring ⁇ and a built-in or mounted IC module The following describes the Ic card itself. This kind of IC card requires the following conditions in consideration of its reliability and convenience in use.
- This kind of IC card is not appropriately small and thin as a whole so that it can be easily carried, managed, and inserted into the above-mentioned IC card lead / writer. must not.
- the thickness of the IC card in particular is about 0.78 earthquakes in order to match the size of the bank card and the like conventionally used. Since the thickness of the IC chip placed in the IC card is 0.25 or more at present, the thickness of the IC module excluding the external connection terminals must be 0.3 or more. Currently. (2) This type of Ic card must be electrically and frequently contacted with an IC card lead / writer by an external contact element exposed on its surface. In order to do so, the external connection terminal must be durable and have good electrical contact at all times.
- the conductor circuit for the IC chip built in or mounted on the IC card may be disconnected, or the IC module provided with the IC chip may be disconnected from the IC card. must not.
- this kind of IC card is basically * vinyl chloride It is composed of a sheet-like card material, which is a base material formed of plastic such as metal, and an IC module including an Ic chip and a printed wiring slope.
- a contact type IC card it is necessary to expose an external contact terminal for transmitting and receiving an electrical signal to the IC card surface as described above.
- progress has been made in a stepwise manner, but this historical extension has been made on March 13 and 14
- the training conducted by the Nissan Industrial Technology Center on a daily basis, ⁇ Development trends and new fields in multifunctional card systems, '' and Figs. 18 to 20 based on this are shown in FIG. Thus, they are roughly classified into three types.
- FIGS. 18 to 20 are longitudinal sectional views of the structure of the IC card joined by the respective joining methods, and the development stage of the IC card is shown in ⁇ of these figures. Has been.
- FIG. 18 is a partially enlarged cross-sectional view of an IC card in which a predetermined through-hole is formed in a sheet-like card material (31) and an IC module (12) is bonded in the through-hole.
- This shows a state in which the bonding between the IC module (12) and the sheet-like card material (31) is performed only on the side wall. Therefore, this 18
- the IC card shown in the figure may easily come off the sheet-like card material (31), and although the above condition (2) is sufficient, the condition (3) is not satisfied. Not only that, but the IC card has a thickness of 1 or less, resulting in poor bonding strength and a narrow practical range.
- FIG. 19 is a partial cross-sectional view of an IC card disclosed in, for example, JP-A-57-210494.
- the card is formed with a recess in the sheet-like card material (31), the IC module (12) is mounted in the recess, and the underside of the IC module (12) is overseaed. It is laminated according to (32).
- the IC module (12) has an external contact terminal (the conductor circuit (13) on the IC module (12) itself) corresponding to the external connection terminal formed on the upper surface of the IC module (12). It is fitted into the recess of the sheet-like card material (31) so as to be exposed on the card surface. That is, according to the above-mentioned Japanese Patent Application Laid-Open No.
- this IC card is provided with an IC module (12) in a recess formed by a blade in a sheet-like card material (31). It is disclosed to insert and bond.
- this type of IC card is bent so that the card is convex upward. In this case, the IC module (12) pops out, and there is still a drawback, and the condition (3) cannot be satisfied.
- FIG. 20 is a partial cross-sectional view of an IC card disclosed in Japanese Patent Application Laid-Open No. 56-26541, for example, and the IC card shown in FIG. Let's say “do a laminating type”.
- This laminated type IC card has oversheets (32) bonded to the upper and lower surfaces of the IC module (12) to expose the conductor circuit (13) that will be the external connection terminal part. An opening is formed in the upper oversheet (32).
- the IC card shown in FIG. 20 has an oversheet (32) in which only the portion corresponding to the external contact terminal is cut off. It is disclosed that it adheres onto the module (12).
- the condition of (3) can be satisfied to some extent. It is still not enough for the following reasons.
- the oversheet (32) is made of vinyl chloride (this material is generally used). Ah ), The thickness must be at least 0.1 'or more, and the thickness of this oversheet (32) must be 0.15 ⁇ or more if it can be found. It is. This is supported by the bend test in the interim report of IS0 / TC 97 / SC 17 IDENTIFICATION AND CREDIT CARDS J S / 1984.
- the oversheet (32) used for this IC card needs to have a thickness of at least 0.1 g / m2 and is covered by this oversheet (32).
- the thickness of the external connection terminal of the IC module (12) must be at least 0.1 fiber or more.
- the external contact terminals are not set to such a thickness, the external contact terminals will be recessed from the IC card surface by the thickness of the oversheet (32). This is because, when the IC card is used frequently, the surroundings such as garbage collection in the recesses that have been created often decrease the electrical connection of the external connection terminals. is there .
- the IC module (12) will ultimately be used.
- the amount of external contact terminals formed on the IC module (12) protruding from the surface of the IC module (12) must be more than a predetermined value (at least 0.1 This is necessary).
- a predetermined value at least 0.1 This is necessary.
- the total thickness allowed for this type of IC card is 0.76 Fiber. Since the thickness of the IC chip is usually 0.25 or more, the thickness of the IC module (12) excluding the external connection terminal must be 0.3 mm or more. For this reason, in the case of a type of IC card that laminates an oversheet (32) on both sides, the thickness of the oversheet (32) is 0.46 on both sides. It is as follows. The oversheets (32) on the front and back sides should have approximately the same thickness to prevent warpage. As a result, the thickness of the oversheet (32) on the external contact terminal side is less than 0.23 Satoshi, and the thickness of the corresponding external contact terminal is also less than 0.23 recommendation.
- the conductor circuit (32) When simultaneously forming the external connection terminal and the conductor circuit (13), the conductor circuit (32) must be laminated by an oversheet (32) so as not to be exposed to the outside. Taking into account the fact that the thickness of (13) is 0.025 to 0.07, the thickness of the external contact terminals must be reduced to about 0.3. It is.
- the identification card with an IC chip for processing electrical signals, and the IC chip is mounted on a separate support member, and the support member is provided in a window of the identification card.
- the thickness of the support member should be almost equal to that of the fledgling card
- the I c chip is placed inside the support member, and the shape of the window is made similar to the shape of the support member, and the window is made larger than the support member, so that the support member has a gap.
- An identification card characterized in that the support member is basically supported in the window by an elastic connecting member.
- FIG. 2 There is a description of “contact * surface 20” which seems to correspond to the external contact terminal to which the invention is based. However, there is no specific description of the conditions for this "working surface 20 J” or how it was formed.
- an IC card in which an IC chip is fitted to a substrate, an IC card having at least a conductive layer provided around the IC chip.
- JP-A-56-26451 and JP-A-59-2294Q0 disclose “contact surface 20 j” which seems to correspond to the external connection terminal to which the present invention is directed.
- “External terminal 6 J There is no specific description of how the layer was formed, for example, because it was very difficult in the technical district at that time to form the layer so as to satisfy the thickness restrictions described above. It is.
- the conductor circuit (13) and the external connection terminal are formed on the surface of the IC module (12), usually, the conductor foil on the IC module (12) is formed by etching. Is done. That is, as shown in FIG. 21, an etching mask (14) is applied to the surface of the conductor foil on the surface of the IC module (12), and the etching mask (14) is interposed therebetween. Then, the area shown by the two-dot chain line is left.
- the number of etching factors is about two.
- the angle of the side surface of the external contact terminal is not a right angle but 60.
- the slope is of the order of magnitude.
- the width of this slope reaches 0.05 to 0.15.
- the purpose is to provide a blind slope for Ic card, which is indispensable for this purpose.
- the present invention is applied to a printed circuit board (10) for an IC card which is built in or mounted on an IC card (30).
- the IC card (30) to which the IC card printed wiring board (10) according to the present invention is applied has an external contact terminal, and the IC chip (11) is not used.
- the IC chip (11) is not used.
- Built-in IC When bonding the module (12) to the sheet card material (31), the sheet (32) should be laminated on both sides of the sheet card (31). Therefore, it is of the so-called “laminate type J” that protects the IC module (12).
- the present invention also relates to a printed circuit board (10) for an IC card having a »terminal which is attached to a part of the IC card (30) intimately and has an external connection) terminal.
- An electrically conductive material is provided on the conductor circuit (13) of the IC card print wiring ⁇ ⁇ (10) and on the surface of the portion corresponding to the external contact terminal.
- An IC characterized by providing bumps (20) formed by plating, bonding, fitting, or the like, and using the bumps (20) as external connection terminals with excellent dimensional accuracy. It is a printed wiring board for cards (10).
- the * development occurs on the surface of the conductive circuit (13) on the IC card blind line (10) applied to this type of IC card (30).
- the bump (20) is formed separately from the conductor circuit (13) by using the material, and the bump (20) is used as an external contact terminal.
- a plastic surface whose child is the surface of the IC card (30) In other words, the IC card print wiring slope (10) is the same level as the surface of the oversheet (32) and only the contact surfaces of the external contact terminals are exposed on the surface of the IC guard (30). It is.
- the printed circuit board (10) for an IC card as described above, it is possible to completely prevent the built-in or mounted IC module (12) from jumping out.
- the thickness of the overseat (32) allows the use of bumps (20) that serve as external contact terminals even when the IC card (30) is bent by this. ) Does not become concave on the surface of the IC card (30), so that the electrical contact of the bump (20) as an external contact terminal can be improved. It is.
- FIGS. 1 and 2 are perspective views showing an embodiment of a print line slope for an IC card according to the present invention.
- FIG. 3 is a perspective view of an IC card having a built-in blind wiring slope for the IC card shown in FIG. 1 or FIG.
- FIG. 4 is a partial perspective view showing a plurality of IC card print S wire plates formed arbitrarily in a long strip shape.
- FIG. 4 is a view showing an Ic card formed by using the same, and is a partial longitudinal cross-sectional view in a case where a print wiring slope for an Ic card incorporating an IC chip is used.
- FIG. 6 is a view corresponding to Fig. 5 showing an IC card formed by using the IC card printed wiring slope according to the present invention.
- FIG. 4 is a partial enlarged cross-sectional view when a printed wiring board for use is used.
- FIG. 7 is a partial longitudinal sectional view showing the vicinity of each external connection terminal shown in FIGS. 5 and 6.
- FIG. 8 to Fig. 11 are longitudinal cross-sectional views showing the procedure for forming a printed S-wire board for IC card according to Takiki by the plating method. Is a section showing the state where the mask is sealed in a conductor circuit on the IC module. The large loose cross-sectional view.Fig. 9 shows a predetermined pattern that becomes a bump on the conductor circuit.
- FIG. 10 is an enlarged longitudinal sectional view showing an enlarged state
- FIG. 10 is a partially enlarged sectional view showing a state in which a plating portion is ground and a plating portion is ground
- FIG. 11 is an exterior view of a plating mask.
- FIG. 4 is a partially enlarged, gentle cross-sectional view showing a state in which the bumps are exposed. .
- FIGS. 12 to 14 are longitudinal sectional views in which a bump serving as an external connection terminal is formed by bonding.
- the figure is an enlarged vertical section showing the state where the bump is directly adhered to the conductor circuit.
- Fig. 13 is the section showing the state where the bump is fitted and adhered to the location of the conductor circuit.
- FIG. 14 is a longitudinal sectional view showing a state where a bump having a flange portion is adhered to a conductor circuit.
- FIGS. 15 to 17 show a bump formed as an external contact pin by fitting; ⁇ : a longitudinal section, and FIG. 15 shows a projection formed on the lower surface of the bump.
- FIG. 16 is a partially enlarged longitudinal sectional view showing a state in which the bump is fitted in the through hole.
- FIG. 16 shows a flange formed in the bump by fitting the bump into a predetermined hole.
- FIG. 17 is a partially enlarged longitudinal sectional view showing a state in which the metal serving as a bump is divided into upper and lower parts, and these are fitted from both the upper and lower sides.
- FIG. 18 to Fig. 20 are large vertical sectional views showing a conventional IC card.
- Fig. 18 shows the IC module placed in a hole formed in a sheet-like card material.
- FIG. 19 is a partially enlarged longitudinal sectional view showing a state where an oversheet is adhered to the lower side of the one shown in FIG. 18, and FIG. Part showing the state where the oversheet is also adhered to the upper side of the one shown in the figure. .
- FIG. 21 and FIG. 22 is a partially enlarged longitudinal sectional view for explaining a problem when the external contact terminal is formed by the etching method.
- FIG. 1 and 2 are perspective views showing an IC card print line (10) according to the present invention.
- the printed circuit board (10) for an IC card shown in FIG. 1 is provided with an electronic component such as an IC chip (11) and an IC module (12). ).
- These IC card printed S-wire plates (10) are made of a bumper of any thickness formed of a material capable of electrical conduction.
- the step (20) is provided on a part of the surface of the conductive circuit (13) formed on the surface of the IC module (12).
- electronic components such as an IC chip (11) are mounted on the printed circuit board (10) for an IC card.
- the IC module (12) Since the IC module (12) is mounted on the surface of the IC module (12), the IC module (12) can be made thinner and thinner, and an oversheet (32) with a greater thickness can be used when manufacturing the IC card (30). Therefore, the printed circuit board for an IC card (10) can improve reliability when the IC card (30) is bent.
- the printed circuit board for IC card (10) shown in FIG. 2 has electronic components such as an IC chip (11) as shown in FIG. It will be embedded into an IC module (12).
- These printed circuit boards for IC cards (10) are provided with bumps (20) of an arbitrary thickness formed of a material capable of electrical conduction, and the IC module (12). This is provided on a part of the surface of the conductor circuit (13) formed on the surface of ()).
- the IC chip (U) is inside the printed circuit board for IC card (10).
- the back of the IC module (12) Becomes a flash, so that when the IC card (30) is made using the printed wiring slope (10) for the IC card, the sheet-shaped card material is used.
- the advantage of (31) is that processing is easy and carding is easy.
- the bump refers to a portion protruding from a certain surface, and is different from the one constituting the surface. .
- the above-mentioned arbitrary thickness means that the thickness of the bump (20) that becomes an external connection j »terminal when the IC module (12) is mounted on the IC card (30) is the fifth thickness. As shown in the figure and sixth, the thickness is at least on the same plane as the oversheet (32) surface. As described above, the thickness of the bump (20) is, for example, vinyl chloride to prevent the IC module (12) from popping out when the IC card (30) is bent. When using an overseat (32) made of stainless steel, at least the thickness of this overseat (32) must be 0.1 mm or more, and if necessary, 0.15 a_h is required.
- the thickness of the bump (20), which is the external connection terminal, is small, as reported from the bending standard test in the interim report of June 1384. In particular, more than 0.1 weight is required.
- this bump (20) is made to be at least flush with the surface of the oversheet (32) depends on this bump (20).
- the surface of the bump (20) must be the same as or protrude from the surface of the oversheet (32) to make electrical contact with the IC card lead. It is preferable that the surface of the bump (20) be the same as the surface of the oversheet (32).
- any material may be used as the material constituting the bump (20) as long as it allows electrical conduction.
- ⁇ , nickel and these materials may be used. Alloys are desirable.
- the contact surface is made of gold, platinum, silver, palladium, iridium, osmium, tungsten, copper, or the like. , Chromium, nickel, carbon and their alloys.
- the bumps (20) having a flat contact surface and a thickness of about 0.1 to 0.3 are formed into an IC module (12).
- the surface of the bump (20) which will be an external connection * terminal, becomes flush with the surface of the oversheet (32). Only the contact surface of (20) is exposed on the surface of the IC card (30).
- the bump (20) is formed on the surface of the IC module (12). It is formed separately from the conductor circuit (13) formed in the above.
- the bumps (20) are formed on the conductor circuit (13) of the printed circuit board (10) for the IC card and on the surface of the portion corresponding to the external contact and the other terminal. It has been done.
- a through hole (13b) as shown in Fig. 7 can be formed in the portion of the conductor circuit (13) that is laminated by the oversheet (32).
- this makes it possible to make the thickness of the conductor circuit (13) as thin as possible, and the over-sheet (32) is applied on the conductor circuit (13).
- the method of forming the bumps (20) constituting the IC card blind line slope (10) is not limited at all, but there are typically three types of methods as follows. There is a method.
- a method of forming bumps (20) by plating 1.
- a method for forming the bumps (20) by plating the methods shown in FIGS. 8 to 11 are employed.
- a mask mask (14) having a window corresponding to the required size of the bump (20) is formed in advance, and the mask mask (14) is formed as shown in FIG. Affix to the required part of (13) and attach it to the conductor circuit (13) exposed from the window of this mask (14).
- a plating object (15) can be formed by traveling through various electroless and electrolytic plating.
- the film mask (14) used here is a plastic film such as a polyester, vinyl chloride or polypropylene with an adhesive, and is used as an external connection terminal.
- a window is formed by hitting only the external contact terminal portion with a mold or the like in advance on the film corresponding to a predetermined position of the conductor circuit (13) where the bump (20) is to be provided. You can use it for massaging.
- a photosensitive resist film, an ink or the like used in the manufacture of a normal printed wiring board is used as a mask mask (14) to a required thickness, and this is used as a mask. Use immediately after the bath.
- an electroless plating is used when the thickness of the bump (20) is relatively small, and an electrolytic plating is used when the thickness of the bump (20) is relatively large.
- Tin and nickel are preferred as types of metal and metal.
- the plating solution is sprayed onto the plating portion, and a predetermined portion of the plating mask (14) is automatically coated with an elastic film such as rubber attached to the machine.
- the method of covering the surface and partially plating can provide the required plating thickness in a short time, and the thickness varies. This is an effective method because there are few keys.
- the surface of the metal body (15) thus formed is subjected to a surface treatment, so that a contact surface of the bump (20) formed by the metal body (15) is formed. Ensure flattening.
- surface treatment methods include chemical polishing, electrolytic polishing, and physical polishing.
- the metal object (15) obtained as described above is applied to only the upper surface while the metal mask (14) is formed as shown in FIG.
- the mask mask (14) can utilize the smoothness of the body itself and reduce the thickness variation of the mask. Eliminates grinding burrs and sagging.
- connection terminal component (21) By bonding or fitting the connection terminal component (21) to be the bump (20) to a predetermined position on the printed wiring board (10a)
- the method of forming the part for indirect connection terminal (21) For example, when the contact terminal component (21) is formed by the breath forming method, there is no restriction on the material, but when it is desired to use a material having good punching workability, it is preferable to use a Fe-Ni-based material. Cu based sealant is good.
- the contact terminal part (21) is formed by an injection molding method, aluminum and magnesium alloy die casts, which are relatively low in processing S, are preferably made of metal. good.
- the conductivity may be provided by electroless and electrolytic plating after injection molding of the terminal parts.
- FIGS. 12 to 14 there is no particular limitation on the method of fixing the contact terminal component (21) to the IC module (12) side.
- FIGS. 12 to 14 there is a method shown in FIGS. 12 to 14 as an example of a method of bonding and fixing
- FIG. 12 shows a method of directly studying a predetermined place surface of a conductor circuit (13).
- FIG. 13 shows a method of bonding the terminal component (21).
- FIG. 13 shows a method of forming a recess (13a) for the contact terminal portion S (21) at a predetermined position of the conductor circuit (13). It shows a method of adhesively fixing the contact terminal component (21) to the recess (13a).
- the bump (20) shown in FIG. 14 is a type having a flange (22) below the contact terminal component (21) shown in FIG.
- the oversheet (32) is used.
- the lid (22) is laminated and fixed, so that the bonding reliability of the bump (20) is improved.
- the adhesive for bonding the contact terminal component (21) formed in this way to the IC module (12) is not limited at all, and is an organic * inorganic liquid adhesive. And an adhesive film, or a molten metal such as a solder may be used. If a non-conductive material is used for bonding and fixing, it is necessary to secure conductivity with an electroless plating after fixing.
- FIGS. 15 to 17 show that a protrusion (23) is provided on the mating surface side of the contact terminal component (21), and this protrusion (23) is attached to the printed wiring board.
- (10a) shows a method of positioning and fixing by fitting into a hole (13b) previously drilled.
- Fig. 16 shows that a brim-shaped part (24) is attached to the entire periphery of the lower surface of the part for connecting terminal (21), and this brim-shaped part (24) is attached to a printed wire board (10a). ) Position it from below in the hole (13b) previously drilled and fix it.
- FIG. 15 shows that a protrusion (23) is provided on the mating surface side of the contact terminal component (21), and this protrusion (23) is attached to the printed wiring board.
- (10a) shows a method of positioning and fixing by fitting into a hole (13b) previously drilled.
- Fig. 16 shows that a brim-shaped part (24) is attached to the entire periphery of
- a fitting projection (25) is formed on the contact terminal component (21) separately formed on the upper and lower sides, and both contact terminal components (21) are connected to the printed wiring board. Insert into the hole (13b) previously drilled in (10a) from above and below, and fix the positioning by fitting the mating projections (25) to each other. . In this case, it is also preferable that each of the connecting terminal parts (21) 'be fixed after bonding.
- the real shape 1 is an example in which the bump (20) is formed by plating.
- the necessary wiring pattern (conductive circuit (13)) is obtained by the usual sub-active method.
- the die mask (14) is used as a plating mask (Dynachem).
- NA TA 2 «ils were laminated and laminated.
- the film was exposed to oak type 201B type light at 300 «j / cn, and then a 2% aqueous solution of sodium carbonate was added. Development was carried out.
- the exposed portion of the contact terminal is exposed, and after performing the necessary plating process, using a copper sulfate plating solution, the plating time is about 3.5 hours with a density of 4A / dn.
- the enamel was enlarged to form a plating (15).
- This plating product (15) was wet-polished with a belt sander (made by Kikukawa Iron Works Co., Ltd., sander number # 600) to set the thickness. Then, the mask mask (14) was coated with methylene chloride. Furthermore, nickel plating and gold plating were encroached on the conductor circuit (13) and the bumps (20). As a result, the thickness of the bump (20) is 150 ⁇ 20 fm thicker than the conductor thickness of the conductor circuit (13), and the (2.5 soil 0.025) terror X (1.9 soil 0.025) beautiful interview A bump (20) having a smooth surface was formed.
- the printed S-wire board for IC card (10) having such bumps (20) was as shown in FIG.
- This giant ⁇ 2 is an example of forming a bamboo (20) by plating.
- Example 2 After forming a print S-shaped pattern in the same manner as in Example 1 above, use a 200-itini Bolester film having an adhesive adhered to one side, and use a mold to mold it. A hole corresponding to the size of the pump (20) was punched. Then, the film was aligned on a printed wiring board (10a) and pressure-bonded. Then, using an electrolytic Ni plating solution (sulfamic acid bath), an electrolytic plating of 180 m was performed to form a plating product (15). The current density and time at this time were lOA / dn-100 min.
- This plating product (15) was wet-polished with a metal pad P # ⁇ 00. Then, when the thickness of the bump (20) was measured by swording the polyester film, the bump (20) having a flat surface that was 130 ⁇ 20 jtm thicker than the thickness of the other conductor wires was obtained. was gotten.
- Example 3 is an example in which the bump (20) is formed by bonding.
- the necessary wiring patterns were formed by the usual sub-tractive method.
- the copper was also removed from the fixing place of the contact terminal component (21) so as to conform to the shape of the component (2.1 ⁇ 0.05 micron size 1.8 ⁇ 0.05 micron angle).
- a blue steel sheet roll (Rose 50 Kasumi a , thickness 0.2 «) was roughened by blast polishing, and the other surface was mirror-polished by buff polishing.
- a conductive ink (E-Kote 3080 manufactured by ACME CHEMICA LS Co.) is coated on the rough surface with a roll coater so as to have a thickness force of 0.01 to 0.1 Fuji Shige. Heated for 20 minutes to make it tack-free. In this state, a punch was punched out with a breathing machine (2.1 person, 0G5 double weight x 1.8 ⁇ 0.05 square angle).
- This chip (this is the contact terminal part (21), which will later become a bump (20)) is attached to the printed
- the coating surface was placed at the fixed point of I! ⁇ (10a) with the bluff ffi line slope (10a) side. From above, place a jig slope (Stainless slope, thickness 0.2 tsubo) with perforated holes only at the fixing points, and set the breath condition (breath pressure 400 kgi / cn, 90 ° C x 20 bacteria in +120). 0 GX 20 ⁇ in + 15 (TG x 20 ⁇ in), mature crimping breathing, and having a bump (20) in cross section as shown in Fig. 12
- the printed wiring board (10) was obtained.
- the height of the bump (20) from the base material was 0.21 ⁇ 0.01 mm, and the surface was smooth and the IC
- the conduction resistance between the conductor circuit (13) on the card printed wiring board (10) and the bump (20) was ⁇ .03 ⁇ .
- the bump (20) is formed by fitting.
- a fitting hole (0.45 ⁇ 0.05 dia.) That fits the protrusion of this part was drilled in the base material to be used as the bleach sensitive plate (10b) and subjected to sulfur plating, as shown in Fig. 4.
- a flexible printed wiring board (10b) in the form of a long strip was created.
- This blind S-wire plate (10b) has sprocket holes on both sides. From these, the long strip-shaped printed wiring slope (10b) was conveyed by an air feeder, aligned in the positioning holes in the sub-block holes, and fixed by suction.
- the contact terminal parts aligned with the screwing part feeder are fitted into the fitting holes of this Blind S wire plate (10b) using an NC controlled manipulator.
- the fitting state was confirmed by the displacement sensor.
- the contact terminal part (21), which becomes the bump (20) is continuously read to the predetermined position with respect to the long printed wiring board (10b). It could be fitted.
- the printed wiring board for an IC card (10) is built in or mounted on a part of the IC card.
- This printed circuit board for IC card (10) can be used for various purposes such as cash withdrawal card, credit card, accusation card, medical chart, and telephony card. Used for code.
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Credit Cards Or The Like (AREA)
Description
Claims
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE86904376T DE3689147T2 (de) | 1985-07-17 | 1986-07-14 | Ein Verfahren zum Herstellen einer gedruckten Schaltungsplatte für Halbleiterschaltungen. |
AT86904376T ATE95468T1 (de) | 1985-07-17 | 1986-07-14 | Ein verfahren zum herstellen einer gedruckten schaltungsplatte fuer halbleiterschaltungen. |
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP60/159192 | 1985-07-17 | ||
JP60159192A JPS6218787A (ja) | 1985-07-17 | 1985-07-17 | Icカ−ド用プリント配線板 |
JP60253324A JPH0634436B2 (ja) | 1985-11-11 | 1985-11-11 | Icカ−ド用プリント配線板 |
JP60/253324 | 1985-11-11 |
Publications (1)
Publication Number | Publication Date |
---|---|
WO1987000486A1 true WO1987000486A1 (en) | 1987-01-29 |
Family
ID=26486064
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
PCT/JP1986/000356 WO1987000486A1 (en) | 1985-07-17 | 1986-07-14 | Printed wiring board for ic cards |
Country Status (3)
Country | Link |
---|---|
EP (1) | EP0231384B1 (ja) |
DE (1) | DE3689147T2 (ja) |
WO (1) | WO1987000486A1 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297991A1 (fr) * | 1987-07-02 | 1989-01-04 | CP8 Transac | Procédé de fabrication d'une carte à microcircuits électroniques |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0360971A3 (en) * | 1988-08-31 | 1991-07-17 | Mitsui Mining & Smelting Co., Ltd. | Mounting substrate and its production method, and printed wiring board having connector function and its connection method |
GB9014545D0 (en) * | 1990-06-29 | 1990-08-22 | Gec Avery Ltd | Circuit substrate for flexible card |
JPH07117385A (ja) * | 1993-09-01 | 1995-05-09 | Toshiba Corp | 薄型icカードおよび薄型icカードの製造方法 |
DE19618103C2 (de) * | 1996-05-06 | 1998-05-14 | Siemens Ag | Chipkartenmodul mit Beschichtung aus leitfähigem Kunststoff und Verfahren zu dessen Herstellung |
DE19630049A1 (de) * | 1996-07-25 | 1998-01-29 | Siemens Ag | Chipkarte mit einer Kontaktzone und Verfahren zum Herstellen einer solchen Kontaktzone |
JP4303282B2 (ja) * | 2006-12-22 | 2009-07-29 | Tdk株式会社 | プリント配線板の配線構造及びその形成方法 |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188849A (en) * | 1981-04-30 | 1982-11-19 | Cii | Device for protecting electronic circuit against static charge |
Family Cites Families (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3464855A (en) * | 1966-09-06 | 1969-09-02 | North American Rockwell | Process for forming interconnections in a multilayer circuit board |
US3838984A (en) * | 1973-04-16 | 1974-10-01 | Sperry Rand Corp | Flexible carrier and interconnect for uncased ic chips |
DE3051195C2 (de) * | 1980-08-05 | 1997-08-28 | Gao Ges Automation Org | Trägerelement zum Einbau in Ausweiskarten |
US4417393A (en) * | 1981-04-01 | 1983-11-29 | General Electric Company | Method of fabricating high density electronic circuits having very narrow conductors |
-
1986
- 1986-07-14 DE DE86904376T patent/DE3689147T2/de not_active Expired - Lifetime
- 1986-07-14 EP EP86904376A patent/EP0231384B1/en not_active Expired - Lifetime
- 1986-07-14 WO PCT/JP1986/000356 patent/WO1987000486A1/ja active IP Right Grant
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS57188849A (en) * | 1981-04-30 | 1982-11-19 | Cii | Device for protecting electronic circuit against static charge |
Non-Patent Citations (1)
Title |
---|
See also references of EP0231384A4 * |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP0297991A1 (fr) * | 1987-07-02 | 1989-01-04 | CP8 Transac | Procédé de fabrication d'une carte à microcircuits électroniques |
FR2617666A1 (fr) * | 1987-07-02 | 1989-01-06 | Bull Cp8 | Carte a microcircuits electroniques et son procede de fabrication |
WO1989000340A1 (fr) * | 1987-07-02 | 1989-01-12 | Bull Cp8 | Carte a microcircuits electroniques et son procede de fabrication |
US5097117A (en) * | 1987-07-02 | 1992-03-17 | Bull Cp8 | Electronic microcircuit card and method for its manufacture |
Also Published As
Publication number | Publication date |
---|---|
EP0231384A4 (en) | 1989-02-16 |
EP0231384B1 (en) | 1993-10-06 |
DE3689147T2 (de) | 1994-03-24 |
DE3689147D1 (de) | 1993-11-11 |
EP0231384A1 (en) | 1987-08-12 |
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