US8341827B2 - Device for placing a component on a substrate - Google Patents

Device for placing a component on a substrate Download PDF

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Publication number
US8341827B2
US8341827B2 US12/759,478 US75947810A US8341827B2 US 8341827 B2 US8341827 B2 US 8341827B2 US 75947810 A US75947810 A US 75947810A US 8341827 B2 US8341827 B2 US 8341827B2
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Prior art keywords
component
pick
substrate
place
measuring system
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US12/759,478
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US20100257731A1 (en
Inventor
Johannes Hubertus Antonius Van De Rijdt
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Assembleon BV
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Assembleon BV
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Assigned to ASSEMBLEON B.V. reassignment ASSEMBLEON B.V. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: VAN DE RIJDT, JOHANNES HUBERTUS ANTONIUS
Publication of US20100257731A1 publication Critical patent/US20100257731A1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P19/00—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes
    • B23P19/04—Machines for simply fitting together or separating metal parts or objects, or metal and non-metal parts, whether or not involving some deformation; Tools or devices therefor so far as not provided for in other classes for assembling or disassembling parts
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
    • H05K13/08—Monitoring manufacture of assemblages
    • H05K13/081—Integration of optical monitoring devices in assembly lines; Processes using optical monitoring devices specially adapted for controlling devices or machines in assembly lines
    • H05K13/0815—Controlling of component placement on the substrate during or after manufacturing
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49131—Assembling to base an electrical component, e.g., capacitor, etc. by utilizing optical sighting device
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49133—Assembling to base an electrical component, e.g., capacitor, etc. with component orienting
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49002—Electrical device making
    • Y10T29/49117—Conductor or circuit manufacturing
    • Y10T29/49124—On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913—Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49139—Assembling to base an electrical component, e.g., capacitor, etc. by inserting component lead or terminal into base aperture
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49764—Method of mechanical manufacture with testing or indicating
    • Y10T29/49778—Method of mechanical manufacture with testing or indicating with aligning, guiding, or instruction
    • Y10T29/4978—Assisting assembly or disassembly
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/53022—Means to assemble or disassemble with means to test work or product
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53178—Chip component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53174—Means to fasten electrical component to wiring board, base, or substrate
    • Y10T29/53183—Multilead component
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/53—Means to assemble or disassemble
    • Y10T29/5313—Means to assemble electrical device
    • Y10T29/53191—Means to apply vacuum directly to position or hold work part

Definitions

  • the invention relates to a device suitable for placing a component on a substrate, which device is provided with a component feeding device, a component pick-and-place device comprising a nozzle, a substrate carrier, means for moving the component pick-and-place device from the component feeding device to the substrate carrier and vice versa, as well as a global measuring system for determining the position of the component pick-and-place device during movement of the component pick-and-place device from the component feeding device to the substrate carrier and vice versa.
  • the invention also relates to such a method.
  • the component pick-and-place device is moved in X-direction over an X-slide, the ends of the X-slide being movable in Y-direction over two parallel extending Y-slides.
  • the position of the component pick-and-place device in Y-direction is determined by the position of the X-slide with respect to the Y-slides.
  • the position of the component pick-and-place device in X-direction is determined by the position of the component pick-and-place device with respect to the X-slide.
  • the accuracy with which a component carried by the nozzle of the component pick-and-place device can be placed on a substrate dependents on the accuracy with which the position of the component pick-and-place device with respect to the X- and Y-slides can be determined. Due to, amongst others, the relatively large number of parts between the Y-slides and the nozzle, the rigidity between the nozzle and the Y-slides is relatively low, so that the accuracy with which the nozzle can be moved with relatively high accelerations and the associated acceleration forces to a desired position is also relatively low. At the same time the known device is relatively sensitive to thermal effects, drift, creep as a function of time, for example, due to slip between the various parts etc. Moreover, due to the relatively great distance between the global measuring system and the nozzle, geometrical deviations can be transmitted enlarged, which is disadvantageous for the accuracy of positioning.
  • the object of the invention is to provide a device with which a component can be placed on a substrate in a relatively accurately way.
  • the device is further provided with a local measuring system, remote from the global measuring system, for almost continually determining, in the proximity of a desired position of the component on the substrate, the position of the component pick-and-place device with respect to the substrate, which local measuring system is located closer to the substrate carrier than the global measuring system.
  • the number of parts present between the local measuring system and the nozzle is substantially lower, so that a higher rigidity and stability is achieved. Moreover geometrical deviations because of the shorter distance between the local measuring system and the substrate carrier have less or no impact. Therefore the accuracy with which the component can be moved to the desired position is higher.
  • the local measuring system includes a grid located in the proximity of the substrate carrier, as well as at least one sensor that is connected to the component pick-and-place device, by means of which sensor the position of the component pick-and-place device can be determined with respect to the grid.
  • a grid includes a number of parallel extending reference lines, the distance of two adjacent reference lines defining the accuracy with which by means of the sensor the position of the component pick-and-place device can be determined.
  • Such a grid can be positioned relatively easily near the substrate carrier. As soon as the component pick-and-place device, and accordingly the connected sensor is brought into the proximity of the substrate supported by the substrate carrier, the grid can be perceived by means of the sensor. As soon as the position of the component pick-and-place device is determined with respect to the grid, the component pick-and-place device can be moved accurately with respect to the grid.
  • the grid can also include a different X-, Y-pattern that is recognizable to the sensor, like, for example, a kind of draught board.
  • Another embodiment of the device according to the invention is characterized in that the nozzle is at least moveable with respect to the component pick-and-place device in a plane extending parallel to the substrate carrier, wherein the sensor is connected to the nozzle.
  • Yet another embodiment of the device according to the invention is characterized in that the component pick-and-place device is provided with a first imaging device for determining the desired position of the component on the substrate with respect to the grid.
  • both the first imagining device and the sensor are connected to the component pick-and-place device, is it possible to calculate the position of the substrate with respect to the grid by determining the position of the first imaging device with respect to the substrate and the position of the sensor with respect to the grid.
  • Yet another embodiment of the device according to the invention is characterized in that the device is provided with a second imaging device for determining the position of the component picked up by the nozzle of the component pick-and-place device with respect to the nozzle.
  • the position of the component with respect to the nozzle can easily be determined.
  • By also determining the position of the substrate with respect to the grid it is subsequently possible to move the component accurately to the desired position on the substrate, using the sensor and the grid.
  • Yet another embodiment of the device according to the invention is characterized in that the device includes a reference element provided with one of at least a first and second marker, wherein during creation of an image of the component by means of the second imaging device at the same time images of the first and second marker are created by the first and second imaging device respectively.
  • the position of the component can easily be determined with respect to the first imaging device, and subsequently with respect to the nozzle.
  • the reference element includes at least a third marker that is perceptible by means of the sensor during the creation of images by means of the first and second imaging devices.
  • the position of the first imaging device with respect to the sensor can be verified at the same time. If for instance, because of a rise in temperature and the subsequent expansions, the distance between the first imaging device and the sensor has changed, the distance between the sensor and the nozzle will have changed as well. By measuring this change, it can be taken into account while placing the component on the substrate.
  • the invention further relates to a method that is characterized in that during movement of the component pick-and-place device from the component feeding device to the substrate supported by the substrate carrier, the position of the component pick-and-place device is determined by means of the global measuring system, whereas in the proximity of the desired position of the component on the substrate, the position of the component pick-and-place device is almost continually determined by means of a local measuring system that is located closer to the substrate carrier than the global measuring system.
  • the local measuring system As the local measuring system is located closer to the substrate carrier, less parts need to be present between the local measuring system and the nozzle, as a result of which the nozzle and consequently also the component carried by the nozzle can be accurately moved to the desired position on the substrate.
  • FIG. 1 shows a schematic plan view of an embodiment of a device according to the invention
  • FIG. 2 shows a side view of the right section of the device shown in FIG. 1 ,
  • FIGS. 3 a and 3 b respectively show a side view and a plan view of the device shown in FIG. 1 , where the component pick-and-place device is located above the reference element.
  • FIGS. 1 and 2 show a device 1 according to the invention, which is provide with a component pick-and-place device 2 that is moveable from a component feeding device 3 to a substrate 5 supported by a substrate carrier 4 and vice versa.
  • the right section of FIG. 1 shows a plan view in the direction indicated by arrows A-A in FIG. 2 .
  • the substrate carrier is provided with a grid 7 on a side avert from the component feeding device 3 .
  • the grid 7 includes a first series of parallel extending reference lines 8 .
  • the grid 7 further includes a second series parallel extending reference lines 9 , which extend perpendicular to the first series of reference lines.
  • the reference lines 8 , 9 are located at a distance of, for example, 20 microns from each other. In the figures only some of these reference lines are denoted.
  • the component pick-and-place device 2 includes a slide 10 that is moveable with respect to a frame 11 in the directions indicated by the double arrows X 1 and Y 1 over, for example, 400 mm and 1000 mm respectively.
  • the position of the component pick-and-place device 2 with respect to the frame 11 is determined by means of a generally known global measuring system, which, for example, is combined with the drive of the component pick-and-place device 2 .
  • slide 10 an L-shaped frame 12 is supported, which is moveable with respect to the slide 10 by means of a Lorentz-actuator in the directions indicated by the double arrow X 2 .
  • the holding device 13 comprises a first imaging device 14 , a nozzle 15 and a sensor unit 16 .
  • the nozzle 15 is moveable with respect to the holding device 13 in the directions indicated by the double arrow Z.
  • the nozzle 15 is further rotatable about the axis 17 in the directions indicated by the double arrow R.
  • the sensor unit 16 comprises two encoders 18 , spaced apart from each other in X-direction, by means of which the reference lines of the grid 7 can be perceived.
  • the encoders 18 are located relatively close to the nozzle 15 .
  • the sensor unit 16 is rigidly connected to the holding device 13 .
  • the encoders 16 and the grid 7 together form a local measuring system.
  • the 20-micron spacing between the reference lines provides a sine-shaped signal in the encoders 18 with a period of 20 micron. By interpolation of the sine-shaped signal a measuring resolution of 5 nanometres can be realized.
  • the device 1 is provided with the plate-shaped reference element 6 that is located in Z-direction at about the same level as the top of the substrate 5 and the grid 7 .
  • the plate-shaped reference element 6 is preferably transparent and provided with a first marker 20 , a second set of markers 21 and a third set of markers 22 .
  • the second set of markers 21 is located about an opening 23 in the plate-shaped reference element 6 .
  • the third markers 22 are provided with reference lines in the same way as the grid 7 .
  • the distances between the first marker 20 , the centre 24 of the opening 23 and the third markers 22 are almost equal to the distances between the first imaging device 14 , the axis 17 and the encoders 18 (see FIGS. 3A and 3B ).
  • the device 1 On a side of the plate-shaped reference element 6 that is averted from the component pick-and-place device 2 , the device 1 is provided with a second imaging device 25 , the axis 26 of which coincides with the centre 24 of the opening 23 . In the image field of the second imaging device 25 , two markers 21 are located next to the opening 23 as well. The relative positions of the markings 20 , 21 and 22 are measured accurately, and are consequently known.
  • Device 1 is operated as follows.
  • the component pick-and-place device 2 is moved in the directions indicated by the double arrows X 1 , Y 1 to a position denoted above the component feeding device 3 . Then the nozzle 15 is moved in a downward direction, so that by means of the underpressure applied in the nozzle 15 a component 27 can be picked up. The component pick-and-place device 2 is then moved to a position located above the plate-shaped reference element 6 . Such a position is denoted in FIGS. 3A and 3B . By means of the first imaging device 14 an image of the first marker 20 is created. At the same time, by means of the second imaging device 25 , an image is created of the second markers 21 , the component 27 and the connection points 28 that are mounted on the bottom side of the component 27 .
  • the third markers 22 can be perceived as well. Because the relative positions of the markers 20 , 21 and 22 are known, the orientation of the component 27 in X-, Y- and Rz-direction with respect to the encoders 18 can be determined from the images created by the first and second imaging devices 14 , 25 and from the grid lines perceived by the encoders 18 .
  • the component pick-and-place device 2 is moved to a position denoted above the substrate 5 .
  • the substrate 5 is provided with markers, also known as fiducials, in respect of which the desired position of the component to be placed is known.
  • the fiducials are perceived by means of the first imaging device 14 .
  • the position of the first imaging device 14 with respect to the grid 7 is determined by means of the encoders 18 . From the obtained information the position of the fiducials is known and consequently of the desired position of the component 27 to be placed with respect to the grid 7 .
  • the component pick-and-place device 2 is moved to the desired position, while the movement is accurately measured by means of the encoders 18 and the grid 7 .
  • the component pick-and-place device 2 In the proximity of the desired position the component pick-and-place device 2 is put to a halt. Now the Lorentz actuators of the holding device 13 are controlled by the encoders 18 , as a result of which the holding device 13 , the nozzle 15 and the component 27 , supported by the nozzle 15 are moved with respect to the component pick-and-place device 2 in X 2 - and Y 2 -direction to the desired position above the substrate 5 .
  • the component 27 may be rotated in Rz-direction into the desired orientation as well. As soon as the component 27 is located above the desired position, the nozzle 15 is moved downward in Z-direction and the component 27 is placed on the substrate.
  • the position of the holding device 13 with respect to the component pick-and-place device 2 is measured by means of, for example, the sensors (not indicated) that are located between the component pick-and-place device 2 and the holding device 13 .
  • Such sensors can be more inaccurate than the encoders 18 and the grid 7 .
  • the grid can also have a reference marker that is used as a point of departure for the encoders.
  • the grid may have a different spacing between the reference lines.
  • the grid may also include a different regular X, Y-pattern of planes, for example.
  • interferometers instead of encoders and a grid, also interferometers, induction measuring systems etc. can be used as local measuring system.

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Operations Research (AREA)
  • Mechanical Engineering (AREA)
  • Supply And Installment Of Electrical Components (AREA)
  • Length Measuring Devices With Unspecified Measuring Means (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
US12/759,478 2009-04-14 2010-04-13 Device for placing a component on a substrate Active 2030-08-19 US8341827B2 (en)

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Application Number Priority Date Filing Date Title
US13/713,539 US9009957B2 (en) 2009-04-14 2012-12-13 Method for placing a component on a substrate

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
NL1036851 2009-04-14
NL1036851A NL1036851C2 (nl) 2009-04-14 2009-04-14 Inrichting geschikt voor het plaatsen van een component op een substraat alsmede een dergelijke werkwijze.

Related Child Applications (1)

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US8341827B2 true US8341827B2 (en) 2013-01-01

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CN (1) CN101868140B (de)
DE (1) DE102010013164A1 (de)
NL (1) NL1036851C2 (de)

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US9009957B2 (en) 2009-04-14 2015-04-21 Assembleon B.V. Method for placing a component on a substrate

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DE102015101759B3 (de) * 2015-02-06 2016-07-07 Asm Assembly Systems Gmbh & Co. Kg Bestückmaschine und Verfahren zum Bestücken eines Trägers mit ungehäusten Chips

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CN101868140A (zh) 2010-10-20
CN101868140B (zh) 2015-05-06
US9009957B2 (en) 2015-04-21

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