US8215534B2 - Wave soldering tank - Google Patents

Wave soldering tank Download PDF

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Publication number
US8215534B2
US8215534B2 US10/573,449 US57344904A US8215534B2 US 8215534 B2 US8215534 B2 US 8215534B2 US 57344904 A US57344904 A US 57344904A US 8215534 B2 US8215534 B2 US 8215534B2
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US
United States
Prior art keywords
partition
impeller
tank
tank body
soldering tank
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US10/573,449
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English (en)
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US20080093417A1 (en
Inventor
Akira Takaguchi
Issaku Sato
Noboru Hashimoto
Junichi Okamura
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Senju Metal Industry Co Ltd
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Senju Metal Industry Co Ltd
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Publication date
Priority claimed from JP2003352160A external-priority patent/JP4136887B2/ja
Application filed by Senju Metal Industry Co Ltd filed Critical Senju Metal Industry Co Ltd
Assigned to SENJU METAL INDUSTRY CO., LTD. reassignment SENJU METAL INDUSTRY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: OKAMURA, JUNICHI, TAKAGUCHI, AKIRA, HASHIMOTO, NOBORU, SATO, ISSAKU
Publication of US20080093417A1 publication Critical patent/US20080093417A1/en
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Publication of US8215534B2 publication Critical patent/US8215534B2/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/08—Auxiliary devices therefor

Definitions

  • This invention relates to a wave soldering tank having a pump for supplying molten solder within the tank to a nozzle.
  • a wave soldering tank typically includes a pump submerged within molten solder in the tank.
  • molten solder is sucked into an inlet of the pump and then discharged from a nozzle communicating with an outlet of the pump.
  • the solder discharged from the nozzle can be formed into a wave through which electronic parts can be passed for soldering.
  • FIG. 1 is a schematic plan view of a conventional wave soldering tank disclosed in Japanese Published Unexamined Patent Application 2003-136233.
  • a solder feed chamber 94 which is disposed in a soldering tank 90 includes a casing 92 in which a multiple-blade centrifugal pump 91 (such as a sirocco pump) is provided.
  • the solder feed chamber 94 communicates with a nozzle 93 from which molten solder can be discharged.
  • the present inventors found that such demands can be met by improving the structure of a soldering tank.
  • one object of the present invention is to provide a wave soldering tank which can supply molten solder to a nozzle with good efficiency, which can eliminate undulations in solder discharged from the nozzle, and which can prevent oxidized coarse dross from being mixed into solder discharged from the nozzle.
  • Another object of the present invention is to provide a soldering tank which can more smoothly transport molten solder within a solder feed chamber and which can pressurize the interior of the solder feed chamber without the occurrence of turbulence.
  • the present invention provides a wave soldering tank comprising a soldering tank body for housing molten solder and a solder feed chamber disposed within the soldering tank body.
  • the solder feed chamber has an inlet disposed below the level of molten solder in the soldering tank body and an outlet disposed above the level of molten solder in the soldering tank body.
  • An axial-flow, multiple-blade screw-type pump is disposed in the soldering tank body so as to draw molten solder into the solder feed chamber through the inlet and discharge the molten solder through the outlet.
  • the pump includes an impeller having a rotatable hub and a plurality of helical blades secured to the hub at equal intervals in the circumferential direction of the hub. Each of the blades overlaps an adjoining one of the blades when the blades are viewed in the axial direction of the impeller.
  • the hub may be a cylinder or a solid shaft.
  • the pump is an axial-flow pump, so solder does not flow radially outwards from the pump but is transported in the axial direction of the pump.
  • pressure is efficiently and uniformly applied to the interior of the solder feed chamber. If the rotation of the pump causes solder to be sent straight downwards, i.e., towards the bottom surface of the tank, when the bottom surface is horizontal, the solder is reflected and rises immediately beneath the pump. However, because the helical blades overlap each other as viewed in the axial direction of the impeller, solder cannot pass in a straight line through the pump, so solder is prevented from rising towards the pump.
  • each of the blades overlaps an adjoining one of the blades when the blades are viewed in the axial direction of the impeller means that when, for example, the pump impeller has two helical blades spaced from each other around the hub by 180°, each helical blade spirals by at least 180° around the hub between the first and second ends of the blade.
  • the pump impeller has three helical blades disposed at intervals of 120°, each helical blade spirals around the hub by at least 120° between its first and second ends. This is the same for the case wherein four helical blades are provided.
  • the pump impeller includes N blades disposed at intervals of 360/N degrees around the hub, each blade spirals around the hub by at least 360/N degrees between its first and second ends.
  • FIG. 1 is a schematic plan view of a conventional wave soldering tank.
  • FIG. 2( a ) is a front cross-sectional elevation of an embodiment of a wave soldering tank according to the present invention
  • FIG. 2( b ) is a side cross-sectional elevation thereof as viewed from the right in FIG. 2( a ).
  • FIG. 3 is a cutaway perspective view of the pump of the embodiment of FIGS. 2( a ) and 2 ( b ).
  • FIG. 4( a ) is a plan view of the impeller of the pump of FIG. 3
  • FIG. 4( b ) is an elevation of the impeller.
  • FIG. 5 is a front cross-sectional view of another embodiment of a wave soldering tank according to the present invention.
  • FIG. 6( a ) is a bottom plan view of a pump used in the present invention
  • FIG. 6( b ) is a bottom view of a conventional pump for a wave soldering tank.
  • FIG. 7 is a front view of another embodiment of a pump used in the present invention.
  • FIGS. 2( a ) and 2 ( b ) which are cross-sectional elevations of a first embodiment of a wave soldering tank according to the present invention
  • this embodiment includes a soldering tank body 1 which is open at its upper end and a solder feed chamber 2 disposed in the tank body 1 .
  • the solder feed chamber 2 has an inlet 3 which is disposed lower than the liquid level L and an outlet 4 which is disposed higher than the liquid level L of molten solder in the tank body 1 .
  • a pump 5 is installed at the inlet 3 .
  • the solder feed chamber 2 includes a partition 6 which is disposed beneath the liquid level L in the tank body 1 and divides the interior of the tank body 1 into an upper and lower portion.
  • the inlet 3 comprises a through hole formed in the partition 6 .
  • Another through hole 7 which communicates with the outlet 4 is formed in the partition 6 in a location spaced from the inlet 3 .
  • a duct 8 is secured to and extends upwards from the partition 6 at through hole 7 .
  • the upper end of the duct 8 is partially closed off by a lid 9 having a through hole 10 with an area smaller than the horizontal cross-sectional area of the duct 8 .
  • a nozzle 11 is installed in the through hole 10 and extends upwards from the lid 9 to above the liquid level L in the tank body 1 .
  • the outlet 4 of the solder feed chamber 2 comprises the upper end of the nozzle 11 , from which molten solder can be discharged to form a wave.
  • the solder feed chamber 2 may be an independent structure which is installed on the bottom of the soldering tank body 1 , but taking into consideration the buoyancy of molten solder, the above-described structure using a partition 6 is simpler and therefore preferable.
  • the axial-flow pump 5 used in the present embodiment includes a cylindrical casing 12 having a cylindrical interior 13 , and a multiple-blade screw-shaped impeller 14 disposed in the casing 12 for rotation about its longitudinal axis inside the casing 12 .
  • the impeller 14 shown in the Figures has four blades.
  • the impeller 14 may have two or more blades 21 . Preferably it has at least four blades 21 .
  • the length of the casing 12 is usually such as to surround the impeller 14 over its entire length. Therefore, the length of the casing 12 may be the same as or a little shorter than the overall length of the impeller 14 .
  • the end of the impeller 14 extends 5-10 mm ahead of the end of the casing so that the molten solder can be smoothly and uniformly supplied to the solder feed chamber 2 .
  • the impeller 14 may be rotated about its axis by any suitable drive mechanism.
  • the impeller 14 is secured to the lower end of a drive shaft 18 which is rotatably supported by a bearing 19 .
  • the drive shaft 18 can be rotated by an electric motor 15 which is drivingly connected to the drive shaft 18 by gears 16 and 17 .
  • the drive mechanism including the motor 15 and the gears 16 and 17 may be supported in any suitable manner, such as by an unillustrated support secured to the tank body 1 or the partition 6 .
  • the illustrated impeller 14 includes a cylindrical hub 20 and a plurality of helical blades 21 (four in this embodiment) mounted on the hub 20 at equal intervals around the circumference of the hub 20 .
  • the upper and lower end surfaces 28 of the blades 21 are preferably flush with the upper and lower surfaces of the hub 20 .
  • Each of the helical blades 21 extends helically around the hub 20 between the first and second lengthwise ends of the hub 20 .
  • the angle of spiral i.e., the angle between the first and second ends of each blade 21 as measured from the center of the hub 20 is such that when the impeller 14 is viewed in its axial direction, each of the blades 21 overlaps an adjoining one of the blades 21 in the circumferential direction of the impeller 14 .
  • the angle of spiral is at least 90°, preferably at least 120°, and ideally at least 180°. As shown in FIG. 4( a ), in the illustrated embodiment, the angle of spiral of each blade 21 is 210°.
  • the impeller 14 may be secured to the drive shaft 18 in any convenient manner.
  • the hub 20 ( FIG. 3 ) fits over the lower end of the drive shaft 18 , with the upper end of the hub 20 pressed against a step portion 22 formed on the drive shaft 18 and the lower end of the hub 20 pressed by a flange 23 secured to the lower end of the drive shaft 18 beneath the hub 20 .
  • the hub 20 is sandwiched from above and below.
  • FIG. 5 illustrates another embodiment of a wave soldering tank according to the present invention.
  • a dish-shaped guide 25 for smoothly guiding solder between the inlet 3 and the outlet 4 is secured to the lower side of the partition 6 .
  • the portions of the guide 25 immediately below the inlet 3 and the through hole 7 in the partition 6 have curved surfaces 26 and 27 , such as surfaces described by an arc of a circle.
  • Solder which is discharged by the pump 5 proceeds straight downwards from the pump 5 and then strikes curved surface 26 and is led in the horizontal direction. The solder then strikes against the other curved surface 27 and is led straight upwards. In this manner, the efficiency of transport of molten solder in the solder feed chamber 2 is improved.
  • the structure of this embodiment is otherwise the same as that of the preceding embodiment.
  • molten solder in the tank is sucked through the upper end of the casing 12 and is then discharged downwards through four blades into the lower end of the casing 12 , i.e., into the solder feed chamber 2 .
  • the impeller 14 rotates, the location where the solder is discharged by the impeller 14 also rotates, so by uniformly discharging solder along the entire periphery of the lower end of the pump 5 except for the region immediately beneath the hub 20 , the efficiency of the pump 5 is increased, and the pressure applied to the interior of the solder feed chamber 2 is the same in any location.
  • the rotational speed of the impeller 14 is maintained constant, the height of the solder which is discharged from the outlet 4 can be always maintained constant.
  • the rotational speed of the impeller 14 by adjusting the rotational speed of the impeller 14 , the height of the solder within the outlet 4 can be adjusted.
  • the height of the molten solder in the outlet 4 can be adjusted by controlling the rotational speed of the impeller 14 .
  • FIG. 6( a ) and FIG. 6( b ) are bottom plan views of a pump used in the present invention, i.e., a pump 5 having a impeller 14 having a plurality of helical blades 21 , and of a comparative example of a pump 95 , i.e., a pump using a impeller 14 having a single helical blade 21 , respectively.
  • solder is most efficiently discharged from the vicinity of the lower end surface 28 of each helical blade 21 . See FIG. 6( b ). Therefore, in the case of a pump 95 having a single helical blade 21 , solder is thought to be discharged from a single location.
  • the impeller 14 When the impeller 14 is rotating at a low speed, the location from which solder is discharged slowly rotates by 360° in the circumferential direction of the impeller, and this produces undulations in the discharged solder. In order to prevent such undulations and discharge solder uniformly around the entire circumference of the lower end of the impeller 14 , it is necessary to rotate the impeller 14 at a high speed.
  • solder is charged from a plurality of locations around the circumference of the impeller, and the locations from which solder is discharged are well balanced in the circumferential direction, so even at a lower rotational speed than in the comparative example, solder can be discharged uniformly around the circumference of the lower end of the impeller. Because a low rotational speed can be used, fine adjustment of the height of the solder which is discharged from the outlet can be easily carried out.
  • FIG. 7 illustrates an arrangement of the casing and the pump, in which in a preferred embodiment the distance T, i.e., the length by which the impeller extends beyond the end of the casing is defined as 5-10 mm so that the molten solder can be charged uniformly to the solder feed chamber 2 . Furthermore, according to another preferred embodiment, clearance C between the inner wall of the casing 12 and the screw, i.e., helical blades are defined as 0.1-1 mm so as to supply molten solder uniformly without formation of pulsating flow.
  • molten solder is uniformly discharged from the lower end of a pump over the entirety of the bottom surface of the pump except for the region immediately beneath the hub of he pump, so compared to a wave soldering tank using a conventional pump in which molten solder is discharged from a region of only 1 ⁇ 4 of the entire periphery of the pump, the efficiency of transport of solder is improved.
  • molten solder is uniformly discharged from most of the entire bottom surface of the pump, so turbulence is eliminated, and the pressure applied to the solder feed chamber becomes the same in any position.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Structures Of Non-Positive Displacement Pumps (AREA)
  • Piezo-Electric Or Mechanical Vibrators, Or Delay Or Filter Circuits (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
US10/573,449 2003-10-10 2004-10-08 Wave soldering tank Active 2026-09-20 US8215534B2 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2003352160A JP4136887B2 (ja) 2003-06-17 2003-10-10 半田槽用ポンプ及びそれを使用する半田槽
JP2003-352160 2003-10-10
PCT/JP2004/014936 WO2005035176A1 (ja) 2003-10-10 2004-10-08 噴流半田槽

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
PCT/JP2004/014936 A-371-Of-International WO2005035176A1 (ja) 2003-10-10 2004-10-08 噴流半田槽

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/527,532 Continuation US9956633B2 (en) 2003-10-10 2012-06-19 Wave soldering tank

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US20080093417A1 US20080093417A1 (en) 2008-04-24
US8215534B2 true US8215534B2 (en) 2012-07-10

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US13/527,532 Active US9956633B2 (en) 2003-10-10 2012-06-19 Wave soldering tank

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US (2) US8215534B2 (pl)
EP (1) EP1676662B1 (pl)
KR (1) KR100820621B1 (pl)
CN (1) CN100503118C (pl)
AT (1) ATE468194T1 (pl)
DE (1) DE602004027279D1 (pl)
ES (1) ES2346061T3 (pl)
MX (1) MXPA06003903A (pl)
MY (1) MY137398A (pl)
PL (1) PL1676662T3 (pl)
TW (1) TWI364341B (pl)
WO (1) WO2005035176A1 (pl)

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CN101112139B (zh) * 2005-02-07 2012-01-25 千住金属工业株式会社 喷流焊料槽
ATE524266T1 (de) * 2006-04-05 2011-09-15 Senju Metal Industry Co Wellenlötbehälter
JP4720905B2 (ja) * 2006-04-26 2011-07-13 千住金属工業株式会社 噴流はんだ槽
JP4375491B1 (ja) * 2008-06-23 2009-12-02 日本ジョイント株式会社 電子部品のはんだ付け装置およびはんだ付け方法
EP2413677B1 (en) * 2009-03-24 2013-07-31 Senju Metal Industry Co., Ltd. Localized jet soldering device and partial jet soldering method
US8764399B1 (en) * 2010-05-03 2014-07-01 Robert W Linscott Spiral plane drag turbine
JP5601342B2 (ja) * 2012-04-27 2014-10-08 千住金属工業株式会社 偏流板及び噴流装置
CN104339063B (zh) * 2013-07-23 2016-06-29 深圳市堃琦鑫华股份有限公司 一种喷流焊焊炉
CN107243201B (zh) * 2017-07-13 2023-07-11 蔡志文 空气净化模组和空气净化器
KR102126822B1 (ko) * 2019-01-03 2020-06-26 왕 에릭 변압기 회로 기판의 제조 방법 및 변압기
JP6590232B1 (ja) * 2019-04-22 2019-10-16 千住金属工業株式会社 はんだ付け装置及びはんだ付け方法
CN113941749A (zh) * 2021-11-29 2022-01-18 珠海飞创智能科技有限公司 一种用于波峰焊的液态锡供给设备

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JPS513632A (ja) 1974-06-28 1976-01-13 Kenkoo Kk Ingayakitsukeho
JPS5623371A (en) * 1979-07-31 1981-03-05 Koki:Kk Soldering device
JPS5813470A (ja) * 1981-07-16 1983-01-25 Tamura Seisakusho Co Ltd 噴流式はんだ槽
US4447001A (en) * 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
JPS62168663A (ja) 1986-01-20 1987-07-24 Asahi Kagaku Kenkyusho:Kk 噴流式半田槽及びその製造方法
US4700878A (en) 1985-08-09 1987-10-20 Dolphin Machinery Limited Soldering apparatus
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JPH02205257A (ja) * 1989-02-02 1990-08-15 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
US5301862A (en) * 1991-10-07 1994-04-12 Fuji Seiki Machine Works, Ltd. Solder coating apparatus
JPH08284885A (ja) 1995-04-07 1996-10-29 Akio Kako 遠心ポンプ
US5769305A (en) * 1995-08-02 1998-06-23 Nihon Den-Netsu Keiki Co., Ltd. Apparatus for wave soldering printed wiring boards
US5961212A (en) * 1994-08-24 1999-10-05 Aquasystems International N.V. Screw with continuous and discontinuous blades for water processing apparatus
WO2001033923A2 (de) 1999-11-05 2001-05-10 Ltc Laserdienstleistungen Gmbh Lötanlage und verwendung einer lotförderpumpe mit förderschnecke in einer lötanlage
JP2003136233A (ja) 2001-11-02 2003-05-14 Matsushita Electric Ind Co Ltd 噴流式自動半田付け装置
WO2003048579A2 (en) 2001-12-04 2003-06-12 Kag Holding A/S Screw pump for transporting emulsions susceptible to mechanical handling
US20040211816A1 (en) * 2002-06-11 2004-10-28 Tadamichi Ogawa Wave soldering apparatus

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Publication number Priority date Publication date Assignee Title
US3407984A (en) * 1965-04-28 1968-10-29 British Aircraft Corp Ltd Solder flow reversing apparatus
JPS513632A (ja) 1974-06-28 1976-01-13 Kenkoo Kk Ingayakitsukeho
JPS5623371A (en) * 1979-07-31 1981-03-05 Koki:Kk Soldering device
US4447001A (en) * 1980-12-11 1984-05-08 Banner/Technical Devices Company, Inc. Adjustably dimensioned uniformly distributed solder wave apparatus
JPS5813470A (ja) * 1981-07-16 1983-01-25 Tamura Seisakusho Co Ltd 噴流式はんだ槽
US4700878A (en) 1985-08-09 1987-10-20 Dolphin Machinery Limited Soldering apparatus
US4773583A (en) * 1985-08-19 1988-09-27 Tamura Kaken Co., Ltd. Soldering device
JPS62259665A (ja) 1986-01-20 1987-11-12 Asahi Chem Res Lab Ltd 溶融半田の噴流方法及び装置
JPS62168663A (ja) 1986-01-20 1987-07-24 Asahi Kagaku Kenkyusho:Kk 噴流式半田槽及びその製造方法
JPH02205257A (ja) * 1989-02-02 1990-08-15 Tamura Seisakusho Co Ltd 噴流式はんだ付け装置
US5301862A (en) * 1991-10-07 1994-04-12 Fuji Seiki Machine Works, Ltd. Solder coating apparatus
US5961212A (en) * 1994-08-24 1999-10-05 Aquasystems International N.V. Screw with continuous and discontinuous blades for water processing apparatus
JPH08284885A (ja) 1995-04-07 1996-10-29 Akio Kako 遠心ポンプ
US5769305A (en) * 1995-08-02 1998-06-23 Nihon Den-Netsu Keiki Co., Ltd. Apparatus for wave soldering printed wiring boards
WO2001033923A2 (de) 1999-11-05 2001-05-10 Ltc Laserdienstleistungen Gmbh Lötanlage und verwendung einer lotförderpumpe mit förderschnecke in einer lötanlage
JP2003136233A (ja) 2001-11-02 2003-05-14 Matsushita Electric Ind Co Ltd 噴流式自動半田付け装置
WO2003048579A2 (en) 2001-12-04 2003-06-12 Kag Holding A/S Screw pump for transporting emulsions susceptible to mechanical handling
US7165933B2 (en) * 2001-12-04 2007-01-23 Kag Holding A/S Screw pump for transporting emulsions susceptible to mechanical handling
US20040211816A1 (en) * 2002-06-11 2004-10-28 Tadamichi Ogawa Wave soldering apparatus

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Publication number Publication date
US20080093417A1 (en) 2008-04-24
TW200528224A (en) 2005-09-01
CN100503118C (zh) 2009-06-24
MY137398A (en) 2009-01-30
US20120255987A1 (en) 2012-10-11
ES2346061T3 (es) 2010-10-08
MXPA06003903A (es) 2006-12-15
ATE468194T1 (de) 2010-06-15
TWI364341B (en) 2012-05-21
EP1676662B1 (en) 2010-05-19
WO2005035176A1 (ja) 2005-04-21
PL1676662T3 (pl) 2010-10-29
KR20060121892A (ko) 2006-11-29
DE602004027279D1 (de) 2010-07-01
KR100820621B1 (ko) 2008-04-08
US9956633B2 (en) 2018-05-01
EP1676662A1 (en) 2006-07-05
EP1676662A4 (en) 2008-10-01
CN1867417A (zh) 2006-11-22

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