JPS5623371A - Soldering device - Google Patents

Soldering device

Info

Publication number
JPS5623371A
JPS5623371A JP9855679A JP9855679A JPS5623371A JP S5623371 A JPS5623371 A JP S5623371A JP 9855679 A JP9855679 A JP 9855679A JP 9855679 A JP9855679 A JP 9855679A JP S5623371 A JPS5623371 A JP S5623371A
Authority
JP
Japan
Prior art keywords
solder
level
chamber
jet port
fall
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9855679A
Other languages
Japanese (ja)
Inventor
Hisao Nakagawa
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Koki Co Ltd
Original Assignee
Koki Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Koki Co Ltd filed Critical Koki Co Ltd
Priority to JP9855679A priority Critical patent/JPS5623371A/en
Publication of JPS5623371A publication Critical patent/JPS5623371A/en
Pending legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)

Abstract

PURPOSE:To make possible sure soldering work by holding the solder liquid level in the chamber provided in a solder cell higher than the jet port part and uniformly jetting the solder through the jet port by making use of a fall. CONSTITUTION:Solder in a solder cell 2 sucked by a screw pump mechanism 5 is passed through a duct 6 and is supplied gently into a chamber 1 through a supply trough 7. The solder in the chamber 1 is held at a predetermined solder level and the excess solder overflows into the cell 2. Since in this way the solder level in the chamber is always maintained at a level higher than the jet port 3 level, the solder is jetted to the height corresponding to a fall from the jet port 3 owing to the fall l thereof. Since the jet surface thereof does not receive flowing pulsation action of the pump mechanism 5 at all, it becomes extremely gentle and smooth. Hence, the sure soldering work may be performed.
JP9855679A 1979-07-31 1979-07-31 Soldering device Pending JPS5623371A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9855679A JPS5623371A (en) 1979-07-31 1979-07-31 Soldering device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9855679A JPS5623371A (en) 1979-07-31 1979-07-31 Soldering device

Publications (1)

Publication Number Publication Date
JPS5623371A true JPS5623371A (en) 1981-03-05

Family

ID=14222956

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9855679A Pending JPS5623371A (en) 1979-07-31 1979-07-31 Soldering device

Country Status (1)

Country Link
JP (1) JPS5623371A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP2012570A1 (en) * 2006-04-26 2009-01-07 Senju Metal Industry Co., Ltd. Jet solder tank
EP2022590A1 (en) * 2006-04-05 2009-02-11 Senju Metal Industry Co., Ltd. Wave soldering tank
US8215534B2 (en) * 2003-10-10 2012-07-10 Senju Metal Industry Co., Ltd. Wave soldering tank

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4410237Y1 (en) * 1967-12-01 1969-04-24
JPS5357157A (en) * 1976-11-04 1978-05-24 Kondo Kenji Solder jet device
JPS53138953A (en) * 1977-05-11 1978-12-04 Matsushita Electric Ind Co Ltd Soldering apparatus

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4410237Y1 (en) * 1967-12-01 1969-04-24
JPS5357157A (en) * 1976-11-04 1978-05-24 Kondo Kenji Solder jet device
JPS53138953A (en) * 1977-05-11 1978-12-04 Matsushita Electric Ind Co Ltd Soldering apparatus

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8215534B2 (en) * 2003-10-10 2012-07-10 Senju Metal Industry Co., Ltd. Wave soldering tank
US9956633B2 (en) 2003-10-10 2018-05-01 Senju Metal Industry Co., Ltd. Wave soldering tank
EP2022590A1 (en) * 2006-04-05 2009-02-11 Senju Metal Industry Co., Ltd. Wave soldering tank
EP2022590A4 (en) * 2006-04-05 2009-06-10 Senju Metal Industry Co Wave soldering tank
US7959055B2 (en) 2006-04-05 2011-06-14 Senju Metal Industry Co., Ltd. Wave soldering tank
JP4893738B2 (en) * 2006-04-05 2012-03-07 千住金属工業株式会社 Jet solder bath
EP2012570A1 (en) * 2006-04-26 2009-01-07 Senju Metal Industry Co., Ltd. Jet solder tank
EP2012570A4 (en) * 2006-04-26 2009-07-29 Senju Metal Industry Co Jet solder tank
US7905382B2 (en) 2006-04-26 2011-03-15 Senju Metal Industry Co., Ltd. Wave soldering tank

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