US20230137402A1 - Substrate treating apparatus and substrate treating method using the same - Google Patents

Substrate treating apparatus and substrate treating method using the same Download PDF

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Publication number
US20230137402A1
US20230137402A1 US17/945,056 US202217945056A US2023137402A1 US 20230137402 A1 US20230137402 A1 US 20230137402A1 US 202217945056 A US202217945056 A US 202217945056A US 2023137402 A1 US2023137402 A1 US 2023137402A1
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United States
Prior art keywords
substrate
stage
separation distance
displacement sensor
head module
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Abandoned
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US17/945,056
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English (en)
Inventor
Dong Yun Lee
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Semes Co Ltd
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Semes Co Ltd
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Publication of US20230137402A1 publication Critical patent/US20230137402A1/en
Assigned to SEMES CO., LTD. reassignment SEMES CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: LEE, DONG YUN
Abandoned legal-status Critical Current

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J3/00—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed
    • B41J3/407—Typewriters or selective printing or marking mechanisms characterised by the purpose for which they are constructed for marking on special material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/36—Blanking or long feeds; Feeding to a particular line, e.g. by rotation of platen or feed roller
    • B41J11/42—Controlling printing material conveyance for accurate alignment of the printing material with the printhead; Print registering
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41M—PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES; COLOUR PRINTING
    • B41M7/00—After-treatment of prints, e.g. heating, irradiating, setting of the ink, protection of the printed stock
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/008—Controlling printhead for accurately positioning print image on printing material, e.g. with the intention to control the width of margins
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J11/00—Devices or arrangements  of selective printing mechanisms, e.g. ink-jet printers or thermal printers, for supporting or handling copy material in sheet or web form
    • B41J11/48—Apparatus for condensed record, tally strip, or like work using two or more papers, or sets of papers, e.g. devices for switching over from handling of copy material in sheet form to handling of copy material in continuous form and vice versa or point-of-sale printers comprising means for printing on continuous copy material, e.g. journal for tills, and on single sheets, e.g. cheques or receipts
    • B41J11/54—Apparatus for condensed record, tally strip, or like work using two or more papers, or sets of papers, e.g. devices for switching over from handling of copy material in sheet form to handling of copy material in continuous form and vice versa or point-of-sale printers comprising means for printing on continuous copy material, e.g. journal for tills, and on single sheets, e.g. cheques or receipts in which one paper or set is fed towards printing position from the front of the apparatus
    • B41J11/55—Apparatus for condensed record, tally strip, or like work using two or more papers, or sets of papers, e.g. devices for switching over from handling of copy material in sheet form to handling of copy material in continuous form and vice versa or point-of-sale printers comprising means for printing on continuous copy material, e.g. journal for tills, and on single sheets, e.g. cheques or receipts in which one paper or set is fed towards printing position from the front of the apparatus with means for adjusting a paper or set
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04505—Control methods or devices therefor, e.g. driver circuits, control circuits aiming at correcting alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04526—Control methods or devices therefor, e.g. driver circuits, control circuits controlling trajectory
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/015—Ink jet characterised by the jet generation process
    • B41J2/04—Ink jet characterised by the jet generation process generating single droplets or particles on demand
    • B41J2/045—Ink jet characterised by the jet generation process generating single droplets or particles on demand by pressure, e.g. electromechanical transducers
    • B41J2/04501—Control methods or devices therefor, e.g. driver circuits, control circuits
    • B41J2/04556—Control methods or devices therefor, e.g. driver circuits, control circuits detecting distance to paper
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
    • B41J2/005—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by bringing liquid or particles selectively into contact with a printing material
    • B41J2/01—Ink jet
    • B41J2/135—Nozzles
    • B41J2/14—Structure thereof only for on-demand ink jet heads
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J25/00—Actions or mechanisms not otherwise provided for
    • B41J25/001—Mechanisms for bodily moving print heads or carriages parallel to the paper surface
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
    • B41J29/00—Details of, or accessories for, typewriters or selective printing mechanisms not otherwise provided for
    • B41J29/38—Drives, motors, controls or automatic cut-off devices for the entire printing mechanism
    • B41J29/393—Devices for controlling or analysing the entire machine ; Controlling or analysing mechanical parameters involving printing of test patterns
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67784—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations using air tracks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68707—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a robot blade, or gripped by a gripper for conveyance
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
    • H05K3/1241—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing
    • H05K3/125—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns by ink-jet printing or drawing by dispensing by ink-jet printing

Definitions

  • the present disclosure relates to a substrate processing or treating apparatus and a substrate processing or treating method using the same.
  • manufacturing an electronic circuit component or a flat panel display (FPD) such as a liquid crystal display panel involves the formation of certain patterns such as electrodes or dots on a glass surface or a printed circuit board (PCB) by using a photoresist (PR) liquid or a paste of metal such as copper (Cu), silver (Ag), and aluminum (Al).
  • FPD flat panel display
  • PR photoresist
  • Cu copper
  • Ag silver
  • Al aluminum
  • Available methods of forming a certain pattern on a PCB or substrate include taking an offset printing method using two rolls to obtain a predetermined pattern through direct patterning and a method of discharging ink droplets.
  • an inkjet printing system works similar to an ordinary inkjet printer and uses a method of utilizing a nozzle for obtaining a predetermined pattern on the substrate through direct patterning.
  • the inkjet printing system ejects ink droplets on the substrate while moving the substrate in a predetermined direction.
  • the substrate needs to move by a constant amount of lift.
  • ink droplets could not be accurately ejected to the desired target position.
  • aspects of the present disclosure provide a substrate processing or treating apparatus having improved efficiency and productivity.
  • Another aspect of the present disclosure provides a substrate treating method with improved efficiency and productivity.
  • an apparatus for treating a substrate including a stage, a gantry, a head module, and a displacement sensor.
  • the stage extends in the first direction, is configured to move a substrate in the first direction, and has an air floating system.
  • the gantry is arranged on the stage to extend in a second direction crossing the first direction.
  • the head module is installed on the gantry and movable in the second direction.
  • the displacement sensor is installed in the head module and configured to measure the separation distance between the substrate and the stage.
  • the head module ejects ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage
  • the head module ejects ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage.
  • the substrate treating apparatus is configured to perform maintenance and/or repair of the stage when the first separation distance differs from the second separation distance by a difference that exceeds a preset value.
  • the head module includes a nozzle unit configured to discharge the ink toward the substrate, and a distance in height direction between the stage and the nozzle unit is equal to a distance in height direction between the stage and the displacement sensor.
  • the substrate treating apparatus may further include a gripper installed on one side of the stage and configured to grip the substrate.
  • the displacement sensor is configured to measure the flatness of the gripper.
  • the first position and the second position are spaced apart from each other in the second direction.
  • the substrate treating apparatus may further include a control module capable of monitoring the first separation distance and the second separation distance in real time.
  • the stage includes two first regions and a second region between the first regions, of which the second region of the stage is overlapped by the first position and the second position.
  • the first regions each constitute an area configured to eject air toward the substrate
  • the second region constitutes an area configured to eject air toward the substrate and suck air between the substrate and the stage.
  • an apparatus for treating a substrate including a stage, a gripper, a gantry, a head module, and a displacement sensor.
  • the stage extends in the first direction, is configured to move a substrate in the first direction, and has an air floating system.
  • the gripper is installed on one side of the stage to grip the substrate.
  • the gantry is arranged on the stage to extend in a second direction crossing the first direction.
  • the head module is installed on the gantry and movable in the second direction.
  • the displacement sensor is installed in the head module and configured to measure the separation distance between the substrate and the stage.
  • the head module ejects ink to the substrate and the displacement sensor measures a first separation distance between the substrate and the stage
  • the head module ejects ink to the substrate and the displacement sensor measures a second separation distance between the substrate and the stage
  • the displacement sensor measures the flatness of the gripper
  • the first position and the second position are spaced apart from each other in the second direction.
  • the substrate treating apparatus may further include a control module capable of monitoring the first separation distance and the second separation distance in real time.
  • the stage includes two first regions and a second region between the first regions, of which the second region of the stage is overlapped by the first position and the second position.
  • the first regions each constitute an area configured to eject air toward the substrate
  • the second region constitutes an area configured to eject air toward the substrate and suck air between the substrate and the stage.
  • the head module includes a nozzle unit configured to discharge the ink toward the substrate, and a distance in height direction between the stage and the nozzle unit is equal to a distance in height direction between the stage and the displacement sensor.
  • a method of treating a substrate including providing a stage extending in a first direction and moving a substrate in the first direction, providing a head module arranged on the stage to be movable in a second direction crossing the first direction, causing, at a first position, a displacement sensor that is installed in the head module to measure a first separation distance between the substrate and the stage, causing, at a second position different from the first position, the displacement sensor to measure a second separation distance between the substrate and the stage, and monitoring a difference between the first separation distance and the second separation distance.
  • the substrate treating method may further include causing, at a third position different from the first position and the second position, the displacement sensor to measure a third separation distance between the substrate and the stage.
  • the substrate treating method may further include monitoring differences between the first separation distance, the second separation distance, and the third separation distance.
  • the head module includes a nozzle unit configured to discharge the ink toward the substrate, and a distance in height direction between the stage and the nozzle unit is equal to a distance in height direction between the stage and the displacement sensor.
  • FIG. 1 is a schematic plan view of a substrate treating apparatus according to some embodiments of the present disclosure.
  • FIG. 2 is a diagram for illustrating a stage of FIG. 1 .
  • FIG. 3 is a cross-sectional view taken along line A-A and line B-B of FIG. 2 .
  • FIGS. 4 and 5 are cross-sectional views of an example substrate treating apparatus taken along a second direction, according to some embodiments.
  • FIG. 6 is a cross-sectional view of an example substrate treating apparatus taken along a first direction, according to some embodiments.
  • FIG. 7 is a flowchart for describing an example substrate treating method according to some embodiments.
  • FIGS. 8 to 13 are diagrams for explaining a method of operating a substrate treating apparatus according to some embodiments.
  • spatially relative terms such as “below,” “beneath,” “lower,” “above,” “upper,” and the like, may be used herein for ease of description to convey one element's or feature's relationship to another element(s) or feature(s) as illustrated in the drawings. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the drawings. For example, when a device in the drawings is turned over, elements described as “below” or “beneath” other elements or features would then be oriented “above” the other elements or features. Thus, the illustrative term “below” can encompass both an orientation of above and below. The device may be otherwise oriented (rotated 90 degrees or at other orientations), and the spatially relative descriptors used herein may be interpreted accordingly.
  • first, second, etc. may be used herein to describe various elements, components, and/or sections, these elements, components, and/or sections should not be limited by these terms. These terms are only used to distinguish one element, component, or section from another element, component, or section. Thus, a first element, first component, or first section discussed below could be termed a second element, second component, or second section without departing from the teachings of the present disclosure.
  • the substrate treating apparatus may be an inkjet printing system.
  • FIG. 1 is a schematic plan view of a substrate treating apparatus according to some embodiments of the present disclosure.
  • FIG. 2 is a diagram for illustrating a stage 110 of FIG. 1 .
  • FIG. 3 is a cross-sectional view taken along line A-A and line B-B of FIG. 2 .
  • a substrate treating apparatus may include a stage 110 , a gantry 200 , a head module 300 , a gripper 400 , a transfer rail 500 , and a controller or control module 600 .
  • the stage 110 is an area for supporting and moving the substrate 150 .
  • a method of moving the substrate 150 on the stage 110 is not limited to a specific one.
  • the present specification illustrates a substrate treating apparatus in which the gripper 400 holds and moves the substrate 150 , but the present disclosure is not limited thereto.
  • the substrate 150 may be moved by a plate moving in a roll-to-roll manner.
  • the stage 110 may extend in a first direction X.
  • the stage 110 may include a short side extending in a second direction Y and a long side extending in the first direction X.
  • the first direction X and the second direction Y may be directions crossing each other.
  • a third direction Z may be crossing the first direction X and the second direction Y.
  • the first direction X, the second direction Y, and the third direction Z may be substantially perpendicular to each other.
  • the substrate 150 may be moved along the first direction X.
  • the substrate 150 may be a transparent substrate (e.g., a glass substrate) used in a display device.
  • the substrate 150 may be a glass substrate for mass production.
  • the stage 110 may include two first regions I and a second region II.
  • the second region II may be interposed between the first regions I.
  • the first regions I may each be disposed in an edge region of the stage 110
  • the second region II may be disposed in a central region of the stage 110 .
  • the second region II of the stage 110 may be a region adapted to eject air in the third direction Z while sucking air on the second region II.
  • the second region II of the stage 110 may be a region that sucks air between the substrate 150 and the stage 110 while ejecting air toward the substrate 150 .
  • the second region II may be a region in which a printing process is performed.
  • the second region II may be a region in which the head module 300 discharges ink toward the substrate 150 .
  • the stage 110 may include a plurality of holes 110 H.
  • the hole 110 H may be a hole for ejecting air or a hole for sucking air.
  • the first regions I of the stage 110 may have just the holes for ejecting air.
  • the second region II of the stage 110 may have an alternate arrangement of holes for ejecting air and holes for sucking air.
  • the hole 110 H of the stage 110 may include first holes 110 H_ 1 and second holes 110 H_ 2 .
  • the first holes 110 H_ 1 may be holes for ejecting air.
  • the second holes 110 H_ 2 may be the holes for sucking air.
  • the second region II of the stage 110 may include the first holes 110 H_ 1 for ejecting air upward and the second holes 110 H_ 2 for sucking air. Although the first holes 110 H_ 1 and the second holes 110 H_ 2 are illustrated as being alternately arranged, the present disclosure is not limited thereto.
  • the first regions I of the stage 110 may include only the first holes 110 H_ 1 for ejecting air upward.
  • the transport rail 500 may be disposed on one side of the stage 110 .
  • the transfer rail 500 may extend lengthwise in the first direction X.
  • the transfer rail 500 allows moving the substrate 150 in the first direction X.
  • the gripper 400 may grip one side of the substrate 150 and move along the transfer rail 500 . With the gripper 400 holding the substrate 150 and moving in the first direction X along the transfer rail 500 , the substrate 150 moves in the first direction X along the transfer rail 500 .
  • the gripper 400 may be disposed on one side of the substrate 150 to grip the substrate 150 .
  • the gripper 400 may be coupled to the transfer rail 500 to move in the first direction X.
  • the gripper 400 may grip and transfer the substrate 150 .
  • the gripper 400 may hold the substrate 150 by suction.
  • the substrate 150 may include a grip portion 150 a that is adhered by suction to the gripper 400 .
  • the grip portion 150 a may be on one side of the substrate 150 .
  • the grip portion 150 a may be one of the long sides of the substrate 150 .
  • the gripper 400 may hold by suction one of the long sides of the substrate 150 .
  • the gantry 200 may be disposed on the stage 110 to cross thereof.
  • the gantry 200 may extend lengthwise in the second direction Y, for example.
  • the gantry 200 may be disposed on the second region II of the stage 110 .
  • FIGS. 4 and 5 are cross-sectional views of an example substrate treating apparatus taken along the second direction, according to some embodiments.
  • FIG. 6 is a cross-sectional view of an example substrate treating apparatus taken along the first direction, according to some embodiments.
  • the following describes a substrate treating apparatus and an exemplary operation method of the substrate treating apparatus according to some embodiments in more detail with reference to FIGS. 4 to 6 .
  • the nozzle unit 320 may include multiple nozzles.
  • the ink discharged by the head module 300 may be, for example, Quantum Dot (QD) ink, but is not limited thereto.
  • QD Quantum Dot
  • the multiple nozzles of the nozzle unit 320 may eject a plurality of ink droplets to the substrate 150 as indicated by an arrow 325 .
  • the displacement sensor 330 may measure the amount of floating of the substrate 150 as indicated by an icon 335 .
  • the floating amount of the substrate 150 may represent a separation distance d of the substrate 150 from the stage 110 in the third direction Z.
  • the displacement sensor 330 may measure and transmit the amount of floating of the substrate 150 to the control module 600 .
  • the control module 600 may monitor the amount of floating of the substrate 150 in real time.
  • the control module 600 may monitor the amount of floating of the substrate 150 to determine whether to perform maintenance and/or repair of the substrate treating apparatus according to some embodiments.
  • the present disclosure in some embodiments measures, in a first position, the floating amount of the substrate 150 , measures, in a second position, the floating amount of the substrate 150 , and monitors a difference between the two floating amounts.
  • the substrate treating apparatus may maintain and/or repair the stage 110 .
  • the stage 110 having an air floating system may include a precision floating area.
  • a region where the head module 300 discharges ink toward the substrate 150 may be a precision floating region (e.g., the second region of FIG. 2 ).
  • the amount of floating of the substrate 150 needs to be constant for allowing ink to be accurately discharged.
  • the displacement sensor 330 may measure the amount of floating of the board 150 in real time and transmit the measured floating amount to the control module 600 which may then monitor the floating amount in real time.
  • the substrate treating apparatus may perform the maintenance and/or repair work.
  • ejecting ink to the substrate 150 by the nozzle unit 320 and measuring the floating amount of the substrate 150 by the displacement sensor 330 may be simultaneously performed. Additionally, the distance in the third direction Z from the substrate 150 to the displacement sensor 330 may be equal to the distance in the third direction Z from the substrate 150 to the head module 300 or the substrate 150 or equal to the distance in the third direction Z from the substrate 150 to the nozzle unit 320 . Accordingly, the conditions for discharging ink to the substrate 150 may be the same as the conditions for measuring the floating amount of the substrate 150 .
  • the displacement sensor 330 may measure the flatness of the gripper 400 .
  • Measuring the flatness of the gripper 400 may mean measuring the flatness of the substrate 150 held by the gripper 400 , but is not limited thereto.
  • the displacement sensor 330 when the displacement sensor 330 is positioned to overlap the substrate 150 in the third direction Z, the displacement sensor 330 may measure the separation distance d between the substrate 150 and the stage 110 .
  • the displacement sensor 330 when the displacement sensor 330 is positioned to overlap the grip portion 150 a of the substrate 150 in the third direction Z, the displacement sensor 330 may measure the flatness of the gripper 400 .
  • the following describes a substrate treating method according to some embodiments with reference to FIGS. 7 to 13 .
  • FIG. 7 is a flowchart for describing an example substrate treating method according to some embodiments.
  • FIGS. 8 to 13 are diagrams for explaining a method of operating a substrate treating apparatus according to some embodiments.
  • the substrate treating method may include loading a substrate onto the stage (S 100 ), measuring, in a first position, a first separation distance between the substrate and the stage (S 200 ), moving the head module to a second position (S 300 ), measuring, in a first second, a second separation distance between the substrate and the stage (S 400 ), and monitoring the difference the first separation distance and the second separation distance (S 500 ).
  • the substrate 150 may be moved from the first region Ito the second region II as indicated by arrow 151 .
  • the substrate 150 may include first to fourth positions P 1 , P 2 , P 3 , and P 4 .
  • the second, third, and fourth positions P 2 , P 3 , P 4 in the substrate 150 may represent positions occupied by the displacement sensor 330 (in FIG. 4 ) when moving in the second direction Y to measure the amount of floating of the substrate 150 .
  • the first position P 1 may represent a position occupied by the displacement sensor 330 when moving in the second direction Y to measure the flatness of the gripper 400 .
  • the substrate treating apparatus may maintain and/or repair the stage 110 responsive to when the difference between the first separation distance d 1 and the second separation distance d 2 exceeds a preset value.
  • the present disclosure in some embodiments can provide a substrate treating apparatus with improved efficiency and reliability by monitoring the amount of floating of the substrate 150 in real time, and a substrate treating method using the same.

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JP4349528B2 (ja) 2005-01-25 2009-10-21 大日本印刷株式会社 基板搬送装置、基板制御方法、カラーフィルタ製造方法、電子回路製造方法
JP4673180B2 (ja) 2005-10-13 2011-04-20 東京エレクトロン株式会社 塗布装置及び塗布方法
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ITVI20120278A1 (it) 2012-10-22 2014-04-23 New System Srl Gruppo di stampa del tipo perfezionato e dispositivo di stampa a getto d'inchiostro comprendente il suddetto gruppo di stampa
JP6016683B2 (ja) 2013-03-21 2016-10-26 ヤマハ発動機株式会社 電子部品装着装置における装着ヘッドの高さ検出方法及び電子部品装着装置
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JP6890438B2 (ja) 2017-03-03 2021-06-18 株式会社Ｓｃｒｅｅｎホールディングス 浮上量算出装置、塗布装置および塗布方法
JP6738373B2 (ja) 2018-05-31 2020-08-12 株式会社Ｓｃｒｅｅｎホールディングス 基板処理装置および基板処理方法
KR20230062138A (ko) * 2021-10-29 2023-05-09 세메스 주식회사 기판 처리 장치 및 이를 이용한 기판 처리 방법

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