US20200180069A1 - Laser processing apparatus - Google Patents
Laser processing apparatus Download PDFInfo
- Publication number
- US20200180069A1 US20200180069A1 US16/657,222 US201916657222A US2020180069A1 US 20200180069 A1 US20200180069 A1 US 20200180069A1 US 201916657222 A US201916657222 A US 201916657222A US 2020180069 A1 US2020180069 A1 US 2020180069A1
- Authority
- US
- United States
- Prior art keywords
- optical element
- region
- laser beam
- hole
- processing apparatus
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012545 processing Methods 0.000 title claims abstract description 90
- 230000003287 optical effect Effects 0.000 claims abstract description 278
- 230000000149 penetrating effect Effects 0.000 claims abstract description 16
- 230000004913 activation Effects 0.000 claims description 74
- 230000002093 peripheral effect Effects 0.000 claims description 30
- 239000002131 composite material Substances 0.000 description 106
- 230000004075 alteration Effects 0.000 description 22
- 238000010586 diagram Methods 0.000 description 9
- 239000000463 material Substances 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000000052 comparative effect Effects 0.000 description 3
- 238000012937 correction Methods 0.000 description 3
- 230000007480 spreading Effects 0.000 description 3
- 238000003892 spreading Methods 0.000 description 3
- 239000006227 byproduct Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000011109 contamination Methods 0.000 description 2
- 230000001419 dependent effect Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- 230000003595 spectral effect Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000031700 light absorption Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 230000037361 pathway Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/0006—Working by laser beam, e.g. welding, cutting or boring taking account of the properties of the material involved
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/062—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam
- B23K26/0622—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses
- B23K26/0624—Shaping the laser beam, e.g. by masks or multi-focusing by direct control of the laser beam by shaping pulses using ultrashort pulses, i.e. pulses of 1ns or less
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/08—Devices involving relative movement between laser beam and workpiece
- B23K26/082—Scanning systems, i.e. devices involving movement of the laser beam relative to the laser head
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/352—Working by laser beam, e.g. welding, cutting or boring for surface treatment
- B23K26/359—Working by laser beam, e.g. welding, cutting or boring for surface treatment by providing a line or line pattern, e.g. a dotted break initiation line
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B17/00—Systems with reflecting surfaces, with or without refracting elements
- G02B17/08—Catadioptric systems
- G02B17/0804—Catadioptric systems using two curved mirrors
- G02B17/0808—Catadioptric systems using two curved mirrors on-axis systems with at least one of the mirrors having a central aperture
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0009—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only
- G02B19/0014—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed having refractive surfaces only at least one surface having optical power
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0004—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed
- G02B19/0028—Condensers, e.g. light collectors or similar non-imaging optics characterised by the optical means employed refractive and reflective surfaces, e.g. non-imaging catadioptric systems
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B19/00—Condensers, e.g. light collectors or similar non-imaging optics
- G02B19/0033—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use
- G02B19/0047—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source
- G02B19/0052—Condensers, e.g. light collectors or similar non-imaging optics characterised by the use for use with a light source the light source comprising a laser diode
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/101—Scanning systems with both horizontal and vertical deflecting means, e.g. raster or XY scanners
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B26/00—Optical devices or arrangements for the control of light using movable or deformable optical elements
- G02B26/08—Optical devices or arrangements for the control of light using movable or deformable optical elements for controlling the direction of light
- G02B26/10—Scanning systems
- G02B26/105—Scanning systems with one or more pivoting mirrors or galvano-mirrors
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/108—Beam splitting or combining systems for sampling a portion of a beam or combining a small beam in a larger one, e.g. wherein the area ratio or power ratio of the divided beams significantly differs from unity, without spectral selectivity
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B27/00—Optical systems or apparatus not provided for by any of the groups G02B1/00 - G02B26/00, G02B30/00
- G02B27/10—Beam splitting or combining systems
- G02B27/14—Beam splitting or combining systems operating by reflection only
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B5/00—Optical elements other than lenses
- G02B5/08—Mirrors
- G02B5/10—Mirrors with curved faces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/56—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26 semiconducting
Definitions
- the central focusing hole maybe disposed within the first region, and the second region may surround the first region.
- the composite optical element 320 is disposed on the path of the laser beam 20 passing through the through hole 311 of the through-hole optical element 310 .
- the upper surface of the composite optical element 320 may be disposed to face the lower surface of the through-hole optical element 310 .
- the upper surface of the composite optical element 320 is convex upward.
- the composite optical element 320 includes a first region 321 disposed at the center of the upper surface, a second region 322 disposed at the peripheral part of the first region 321 , and a central focusing hole 323 penetrating from the upper surface of the composite optical element 320 to the lower surface.
- the object to be processed 10 may include a non-activation region 40 where the focal point of the laser beam 20 may not be disposed.
- the first region 321 of the composite optical element 320 does not transmit the laser beam 20 but reflects the laser beam 20 in the direction in which the through-hole optical element 310 is disposed.
- the focal point may not be disposed in the partial region of the object to be processed 10 corresponding to the first region 321 .
- the non-activation region 40 may have a shape corresponding to the first region 321 of the composite optical element 320 projected onto the object to be processed 10 .
- the non-activation region 40 of the object to be processed 10 may also have a long rectangular shape in the y-axis direction.
- the shape of the non-activation region 40 may not exactly coincide with the shape in which the first region 321 of the composite optical element 320 projected on the object to be processed 10 due to reflection and refraction of the laser beam 20 (i.e., it may be a distorted version of the shape of the first region 321 ). Since the region to be processed on the object to be processed 10 is not included in the non-activation region 40 , the position, the size, or the shape of the first region 321 may be determined depending on the position, the size, and the shape to be processed.
- FIG. 10 is a cross-sectional view of a composite optical element of FIG. 9 taken along a line X-X′.
- the supporting plate 332 has flat upper and lower surfaces, is disposed under the focusing lens 331 , and supports the focusing lens 331 .
- the supporting plate 332 may transmit the laser beam.
- the supporting plate 332 is shown as quadrangular in a plan view, the supporting plate 332 may be formed with any shape such as a circle, a polygon, or the like.
- the third line beam 22 - 1 and the fourth line beam 22 - 2 pass through the through-hole optical element 310 via the through hole 311 .
- the through hole 311 passes through the upper surface and the lower surface of the through-hole optical element 310 , so that the third line beam 22 - 1 and the fourth line beam 22 - 2 proceed without being refracted when passing through the through hole 311 .
- the seventh line beam 24 - 1 and the eighth line beam 24 - 2 passing through the focusing lens 331 pass the supporting plate 332 through the central hole 333 formed in the supporting plate 332 , even if the supporting plate 332 includes a different material from that of the focusing lens 331 , the influence on the path of the laser beam by the supporting plate 332 may be minimized, enabling more precise processing.
Landscapes
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- General Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Laser Beam Processing (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2018-0155533 | 2018-12-05 | ||
KR1020180155533A KR102615739B1 (ko) | 2018-12-05 | 2018-12-05 | 레이저 가공 장치 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20200180069A1 true US20200180069A1 (en) | 2020-06-11 |
Family
ID=68771535
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US16/657,222 Pending US20200180069A1 (en) | 2018-12-05 | 2019-10-18 | Laser processing apparatus |
Country Status (4)
Country | Link |
---|---|
US (1) | US20200180069A1 (ko) |
EP (1) | EP3663031A1 (ko) |
KR (1) | KR102615739B1 (ko) |
CN (1) | CN111266725B (ko) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11308695B2 (en) * | 2017-12-22 | 2022-04-19 | Lenovo (Beijing) Co., Ltd. | Optical apparatus and augmented reality device |
US11413704B2 (en) * | 2019-07-17 | 2022-08-16 | Fanuc Corporation | Adjustment assistance device and laser welding apparatus |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2730013A (en) * | 1950-09-02 | 1956-01-10 | Leitz Ernst Gmbh | Reflecting lens objective |
JPS5768811A (en) * | 1980-10-17 | 1982-04-27 | Matsushita Electric Ind Co Ltd | Beam condensing device |
US4749840A (en) * | 1986-05-16 | 1988-06-07 | Image Micro Systems, Inc. | Intense laser irradiation using reflective optics |
US20030112322A1 (en) * | 2001-11-30 | 2003-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Laser beam irradiating apparatus, laser beam irradiating method, and method of manufacturing a semiconductor device |
JP2011125905A (ja) * | 2009-12-18 | 2011-06-30 | Panasonic Corp | レーザ加工装置およびレーザ加工方法 |
JP2015166094A (ja) * | 2014-03-03 | 2015-09-24 | ビアメカニクス株式会社 | レーザ加工装置 |
US20170072506A1 (en) * | 2015-09-10 | 2017-03-16 | Kabushiki Kaisha Toshiba | Optical device and laser processing apparatus |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5221680Y2 (ko) * | 1972-10-20 | 1977-05-18 | ||
US5449882A (en) * | 1993-03-15 | 1995-09-12 | Reliant Laser Corporation | Mirror-based laser-processing system with temperature and position control of moving laser spot |
JP4959318B2 (ja) * | 2006-12-20 | 2012-06-20 | 株式会社ディスコ | ウエーハの計測装置およびレーザー加工機 |
US8294062B2 (en) * | 2007-08-20 | 2012-10-23 | Universal Laser Systems, Inc. | Laser beam positioning systems for material processing and methods for using such systems |
JP5460309B2 (ja) * | 2009-12-28 | 2014-04-02 | 株式会社東芝 | ノズル形成装置及びその形成方法 |
JP2012119098A (ja) * | 2010-11-29 | 2012-06-21 | Gigaphoton Inc | 光学装置、レーザ装置および極端紫外光生成装置 |
DE102011007176B4 (de) * | 2011-04-12 | 2015-06-25 | Trumpf Werkzeugmaschinen Gmbh + Co. Kg | Vorrichtung zur Fokussierung eines Laserstrahls und Verfahren zum Überwachen einer Laserbearbeitung |
CN105710539B (zh) * | 2014-12-02 | 2017-09-29 | 大族激光科技产业集团股份有限公司 | 一种激光切割*** |
-
2018
- 2018-12-05 KR KR1020180155533A patent/KR102615739B1/ko active IP Right Grant
-
2019
- 2019-10-18 US US16/657,222 patent/US20200180069A1/en active Pending
- 2019-12-03 CN CN201911220089.1A patent/CN111266725B/zh active Active
- 2019-12-04 EP EP19213582.0A patent/EP3663031A1/en active Pending
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2730013A (en) * | 1950-09-02 | 1956-01-10 | Leitz Ernst Gmbh | Reflecting lens objective |
JPS5768811A (en) * | 1980-10-17 | 1982-04-27 | Matsushita Electric Ind Co Ltd | Beam condensing device |
US4749840A (en) * | 1986-05-16 | 1988-06-07 | Image Micro Systems, Inc. | Intense laser irradiation using reflective optics |
US20030112322A1 (en) * | 2001-11-30 | 2003-06-19 | Semiconductor Energy Laboratory Co., Ltd. | Laser beam irradiating apparatus, laser beam irradiating method, and method of manufacturing a semiconductor device |
JP2011125905A (ja) * | 2009-12-18 | 2011-06-30 | Panasonic Corp | レーザ加工装置およびレーザ加工方法 |
JP2015166094A (ja) * | 2014-03-03 | 2015-09-24 | ビアメカニクス株式会社 | レーザ加工装置 |
US20170072506A1 (en) * | 2015-09-10 | 2017-03-16 | Kabushiki Kaisha Toshiba | Optical device and laser processing apparatus |
Non-Patent Citations (11)
Title |
---|
catadioptric Cassegrain system, Wikipedia article, 2017 (Year: 2017) * |
Catadioptric system, Wikipedia article, 2017 (Year: 2017) * |
Deppo et al., A lightweight Schmidt space telescope configuration for ultra-high energy cosmic ray detection, ICSO 2018 (Year: 2018) * |
Fortworthastro.com/beginner5.html, 2017 (Year: 2017) * |
glassdynamics (Year: 2018) * |
Machine translation of JP-2011125905-A (Year: 2011) * |
Moore, Patrick (26 June 2002). More Small Astronomical Observatories. p. 229. ISBN 9781852335724. (Year: 2002) * |
ophiropt (Year: 2018) * |
phy217 (Year: 2017) * |
plane_geometry, wikipedia article (Year: 2017) * |
thorlabs.com/newgrouppage9.cfm?objectgroup_id=6430, 2016 (Year: 2016) * |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11308695B2 (en) * | 2017-12-22 | 2022-04-19 | Lenovo (Beijing) Co., Ltd. | Optical apparatus and augmented reality device |
US11413704B2 (en) * | 2019-07-17 | 2022-08-16 | Fanuc Corporation | Adjustment assistance device and laser welding apparatus |
Also Published As
Publication number | Publication date |
---|---|
KR102615739B1 (ko) | 2023-12-19 |
CN111266725A (zh) | 2020-06-12 |
EP3663031A1 (en) | 2020-06-10 |
KR20200068811A (ko) | 2020-06-16 |
CN111266725B (zh) | 2023-12-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US11253952B2 (en) | Laser processing apparatus | |
US7616328B2 (en) | Method and system for providing a high definition triangulation system | |
JP5068271B2 (ja) | マイクロリソグラフィ照明システム、及びこの種の照明システムを含む投影露光装置 | |
US10717151B2 (en) | Laser-processing head and laser-processing machine comprising same | |
US20070153298A1 (en) | Method and apparatus for measuring interfacial positions, method and apparatus for measuring layer thickness, and method and apparatus for manufacturing optical discs | |
CN104950438B (zh) | 光照射装置与绘制装置 | |
US10422861B2 (en) | Electro-optical distance measuring instrument | |
JP6576435B2 (ja) | ビーム誘導光学系から誘導される光線を分析するためのシステム及び方法 | |
US20200180069A1 (en) | Laser processing apparatus | |
EP3514575A2 (en) | Light emission apparatus, object information detection apparatus, optical path adjustment method, object information detection method, and light modulation unit | |
US7375825B2 (en) | Light intensity ratio adjustment filter for an interferometer, interferometer, and light interference measurement method | |
JP2008134468A (ja) | 集光光学系および光加工装置 | |
US7177086B2 (en) | Optical component thickness adjustment method, optical component, and position adjustment method for optical component | |
KR20210020451A (ko) | 레이저 가공 장치 및 레이저 가공 방법 | |
US20230191533A1 (en) | Laser processing apparatus and laser processing method | |
CN110764272B (zh) | 一种利用透镜共焦点调节离轴抛物面镜***的方法 | |
US20240219699A1 (en) | High-performance euv microscope device with free-form illumination system structure | |
JP2020076649A (ja) | 分光光学系、分光計測システム、及び、半導体検査方法 | |
US20240045338A1 (en) | High-performance euv microscope device with free-form illumination system structure having elliptical mirror | |
US20070242267A1 (en) | Optical Focusing Devices | |
US20220334342A1 (en) | Optical lens, manufacturing method of optical lens, and camera module | |
CN111352304B (zh) | 调焦调平装置、光刻设备及调焦调平方法 | |
JP2018004514A (ja) | 光波距離計 | |
JP6014767B2 (ja) | レーザ光を収束するための方法および装置 | |
KR20210096849A (ko) | 라인빔 광학계 및 이를 포함하는 레이저 리프트 오프 장치 |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: SAMSUNG DISPLAY CO., LTD., KOREA, REPUBLIC OF Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:SANGU, AKIFUMI;KIM, HYOUNG-JOO;VORONOV, ALEXANDER;AND OTHERS;REEL/FRAME:050761/0039 Effective date: 20190507 |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE AFTER FINAL ACTION FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION COUNTED, NOT YET MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: RESPONSE TO NON-FINAL OFFICE ACTION ENTERED AND FORWARDED TO EXAMINER |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: FINAL REJECTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: ADVISORY ACTION MAILED |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: DOCKETED NEW CASE - READY FOR EXAMINATION |
|
STPP | Information on status: patent application and granting procedure in general |
Free format text: NON FINAL ACTION MAILED |