US20150176877A1 - Motor-driven compressor - Google Patents

Motor-driven compressor Download PDF

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Publication number
US20150176877A1
US20150176877A1 US14/578,753 US201414578753A US2015176877A1 US 20150176877 A1 US20150176877 A1 US 20150176877A1 US 201414578753 A US201414578753 A US 201414578753A US 2015176877 A1 US2015176877 A1 US 2015176877A1
Authority
US
United States
Prior art keywords
housing
motor
circuit board
casing
driven compressor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US14/578,753
Other languages
English (en)
Inventor
Shogo Mori
Yuri Otobe
Shinsuke Nishi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toyota Industries Corp
Original Assignee
Toyota Industries Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toyota Industries Corp filed Critical Toyota Industries Corp
Assigned to KABUSHIKI KAISHA TOYOTA JIDOSHOKKI reassignment KABUSHIKI KAISHA TOYOTA JIDOSHOKKI ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: MORI, SHOGO, NISHI, SHINSUKE, OTOBE, YURI
Publication of US20150176877A1 publication Critical patent/US20150176877A1/en
Abandoned legal-status Critical Current

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B31/00—Compressor arrangements
    • F25B31/02—Compressor arrangements of motor-compressor units
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
    • F04B39/06—Cooling; Heating; Prevention of freezing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
    • F04B39/06—Cooling; Heating; Prevention of freezing
    • F04B39/064—Cooling by a cooling jacket in the pump casing
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04B—POSITIVE-DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS
    • F04B39/00—Component parts, details, or accessories, of pumps or pumping systems specially adapted for elastic fluids, not otherwise provided for in, or of interest apart from, groups F04B25/00 - F04B37/00
    • F04B39/12—Casings; Cylinders; Cylinder heads; Fluid connections
    • F04B39/121—Casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B31/00—Compressor arrangements
    • F25B31/006—Cooling of compressor or motor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2400/00—General features or devices for refrigeration machines, plants or systems, combined heating and refrigeration systems or heat-pump systems, i.e. not limited to a particular subgroup of F25B
    • F25B2400/07—Details of compressors or related parts
    • F25B2400/077—Compressor control units, e.g. terminal boxes, mounted on the compressor casing wall containing for example starter, protection switches or connector contacts
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B2600/00—Control issues
    • F25B2600/02—Compressor control
    • F25B2600/021—Inverters therefor
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F25—REFRIGERATION OR COOLING; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS; MANUFACTURE OR STORAGE OF ICE; LIQUEFACTION SOLIDIFICATION OF GASES
    • F25B—REFRIGERATION MACHINES, PLANTS OR SYSTEMS; COMBINED HEATING AND REFRIGERATION SYSTEMS; HEAT PUMP SYSTEMS
    • F25B49/00—Arrangement or mounting of control or safety devices
    • F25B49/02—Arrangement or mounting of control or safety devices for compression type machines, plants or systems
    • F25B49/025—Motor control arrangements
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
    • Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
    • Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating

Definitions

  • the present invention relates to a motor-driven compressor including a semiconductor device that drives a motor of the motor-driven compressor.
  • Japanese Patent Application Publication No. 2003-322082 discloses a motor-driven compressor having a compression mechanism, a motor driving the compression mechanism, and a semiconductor device including a drive circuit driving the motor.
  • the semiconductor device has transistor modules that are fixed to a housing of the motor-driven compressor by bolts through a resin insulation sheet.
  • a semiconductor device generates heat during its operation.
  • the heat may cause thermal stress which in turn causes peeling at a connection part between a semiconductor element and a circuit board.
  • effective measures need to be taken to ensure reliability of the semiconductor device that drives the motor of the motor-driven compressor.
  • the present invention which has been made in light of the above problems, is directed to providing a motor-driven compressor including a semiconductor device that improves its reliability.
  • a motor-driven compressor including a semiconductor device that comprises a compression mechanism, a motor, a housing, a wall, an electronic component, and a resin member.
  • the motor drives the compression mechanism.
  • the housing accommodates therein the compression mechanism and the motor.
  • the wall extends from an outer surface of the housing so as to surround a part thereof and have an opened end and cooperates with the outer surface of the housing to form a casing.
  • the electronic component is accommodated in the casing and includes a semiconductor module that includes a circuit board connected to the outer surface of the housing and a semiconductor element mounted to the circuit board.
  • the resin member seals an entirety of the electronic component in the casing.
  • FIG. 1 is a perspective view of a motor-driven compressor having a semiconductor device according to an embodiment of the present invention.
  • FIG. 2 is a longitudinal sectional view of the compressor of FIG. 1 .
  • the motor-driven compressor that is designated by reference numeral 10 includes a housing 11 .
  • the housing 11 accommodates therein a compression mechanism 12 compressing refrigerant and discharging refrigerant and a motor 13 driving the compression mechanism 12 .
  • the housing 11 is formed with an inlet 14 through which refrigerant is flowed into the housing 11 .
  • the motor-driven compressor 10 further includes a semiconductor device 15 for driving the motor 13 .
  • the semiconductor device 15 serves as an inverter for converting DC power to AC power and supplying the AC power to the motor 13 .
  • the housing 11 has a wall 17 formed integrally with the housing 11 and extending from the outer surface 16 of the housing 11 .
  • the wall 17 is formed annularly at one end of the housing 11 adjacent to the motor 13 .
  • the wall 7 has an opened end 18 . Therefore, a circular recess is formed at a part of the outer surface 16 of the housing 11 by the wall 17 and has a bottom that is formed by a part of the outer surface 16 at the one end of the housing 11 .
  • the electronic component 19 includes a semiconductor module 20 .
  • the semiconductor module 20 includes a semiconductor element 21 and a circuit board 22 mounting thereon the semiconductor element 21 .
  • the semiconductor element 21 includes a switching element such as an IGBT (Insulated Gate Bipolar Transistor) and a diode.
  • the circuit board 22 includes a ceramic board 23 that serves as an insulating layer, a first metal plate 24 that is connected on the first surface of the ceramic board 23 and serves as a wiring layer, and a second metal plate 25 that is connected on the second surface of the ceramic board 23 that is located on the side of the ceramic board 23 opposite to the first surface and serves as a connection layer.
  • the semiconductor element 21 is soldered to the first metal plate 24 and the second metal plate 25 is connected by brazing directly on the outer surface 16 of the housing 11 of the recess surrounded by the wall 17 .
  • the second metal plate 25 is brazed to the outer surface 16 of the housing 11 .
  • the ceramic board 23 is made of, for example, aluminum nitride.
  • the first metal plate 24 and the second metal plate 25 are made of, for example, pure aluminum such as aluminum for industrial use having 99.0% purity or higher, or copper.
  • the second metal plate 25 serves as a stress reducing member reducing the stress applied to the connection between the circuit board 22 and the semiconductor element 21 and the connection between the circuit board 22 and the housing 11 .
  • the stress reducing member disperses the thermal stress caused by the difference of linear thermal expansion coefficient among the ceramic board 23 , the first metal plate 24 , the second metal plate 25 , and the housing 11 thereby to reduce thermal stress applied to the above connections, namely the connection between the circuit board 22 and the semiconductor element 21 and the connection between the circuit board 22 and the housing 11 .
  • the second metal plate 25 has therein a space in the form of a step, a groove, or a recess forming a part of the second metal plate 25 that is not connected to the housing 11 and hence helps reduce or relieve the thermal stress.
  • the wall 17 of the housing 11 forms a casing 26 housing the electronic components 19 including a semiconductor module 20 .
  • a space that is defined by the wall 17 and a part of the outer surface 16 of the housing 11 surrounded by the wall 17 serve as a casing for the semiconductor device 15 .
  • the casing 26 is sealed by a resin member 27 with the electronic components 19 housed in the casing 26 .
  • the resin member 27 sealing the casing 26 is made of epoxy resin.
  • the resin member 27 fills the space surrounded by the wall 17 to the opened end 18 of the wall 17 .
  • the electronic components 19 housed in the casing 26 are covered entirely by the resin member 27 .
  • the resin member 27 is not covered, but exposed to the atmosphere at the opened end 18 of the wall 17 .
  • the semiconductor device 15 for the motor-driven compressor 10 The semiconductor module 20 housed in the casing 26 is cooled by refrigerant flowing in the housing 11 of the motor-driven compressor 10 .
  • the circuit board 22 of the semiconductor module 20 is brazed directly to the outer surface 16 of the housing 11 .
  • heat exchange is performed easily between the refrigerant flowing in the housing 11 and the circuit board 22 .
  • the casing 26 is sealed by the resin member 27 , thermal deformation at the connection between the semiconductor element 21 and the circuit board 22 and between the circuit board 22 and the housing 11 is suppressed and hence reduced.
  • the present embodiment offers the following advantageous effects.
  • sealing the casing 26 by the resin member 27 improves the connection between the housing 11 and the semiconductor module 20 , so that heat radiation of the semiconductor device 15 is improved.
  • the reliability in the strength of the connection between the semiconductor element 21 and the circuit board 22 and the connection between the circuit board 22 and the housing 11 is improved, with the result that the reliability of the semiconductor device 15 is improved and, therefore, the deterioration of the semiconductor device 15 is suppressed.
  • the configuration in which the wall 17 forms a casing for the semiconductor device 15 allows the motor-driven compressor 10 to be simplified in structure and be made smaller in size as compared to a case in which a separate semiconductor device having therein the electronic component 19 is mounted on the housing 11 .
  • the second metal plate 25 of the circuit board 22 serves as stress reducing member.
  • the provision of this stress reducing member in addition to the resin member 27 helps prevent the connection from being peeled.
  • the circuit board 22 is brazed to the housing 11 and therefore the connection between the circuit board 22 and the housing 11 is improved. As a result, heat radiation of the semiconductor device 15 is improved.
  • the present embodiment may be modified as follows.
  • a bolt, pressure welding and so on may be used for connecting the semiconductor module 20 to the housing 11 .
  • the layout and the number of the casing 26 may be changed.
  • the casing 26 may be formed extending from the outer peripheral surface of the housing 11 and a plurality of the casings 26 may be disposed.
  • the wall 17 is not limited to an annular or a circular shape, but it may be of a rectangular shape. That is, as far as the wall 17 serves as a jig that regulates the flow of resin when sealing by a resin member, the wall 17 may be formed in any shape.
  • the second metal plate 25 may be made of a metal plate that simply serves as a connection layer. That is, the second metal plate may dispense with thermal stress relieving part such as the aforementioned step, groove or recess.

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Compressor (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
US14/578,753 2013-12-25 2014-12-22 Motor-driven compressor Abandoned US20150176877A1 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2013266720A JP2015121196A (ja) 2013-12-25 2013-12-25 電動圧縮機用の半導体装置
JP2013-266720 2013-12-25

Publications (1)

Publication Number Publication Date
US20150176877A1 true US20150176877A1 (en) 2015-06-25

Family

ID=53275533

Family Applications (1)

Application Number Title Priority Date Filing Date
US14/578,753 Abandoned US20150176877A1 (en) 2013-12-25 2014-12-22 Motor-driven compressor

Country Status (5)

Country Link
US (1) US20150176877A1 (ja)
JP (1) JP2015121196A (ja)
KR (1) KR20150075381A (ja)
CN (1) CN104747400A (ja)
DE (1) DE102014119197A1 (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10999919B2 (en) * 2019-07-11 2021-05-04 Toyota Motor Engineering & Manufacturing North America, Inc. Flexible electronic assembly for placement on a vehicle motor assembly

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020025265A1 (en) * 2000-08-29 2002-02-28 Hideo Ikeda Motor-driven compressors
US20110217191A1 (en) * 2008-11-10 2011-09-08 Eisuke Fujimra Inverter-Integrated Electric Compressor
US20110217190A1 (en) * 2008-11-10 2011-09-08 Jun Mizuno Inverter-Integrated Electric Compressor
US20110256002A1 (en) * 2008-12-18 2011-10-20 Hideo Ikeda Electric Compressor Having Drive Circuit Integrated Thereinto
US8939739B2 (en) * 2010-12-02 2015-01-27 Kabushiki Kaisha Toyota Jidoshokki Electric compressor

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002369549A (ja) * 2001-06-06 2002-12-20 Mitsubishi Electric Corp 電力用半導体装置
JP3786356B2 (ja) 2002-04-26 2006-06-14 株式会社デンソー 車両用インバータ一体型電動コンプレッサ
JP2006121861A (ja) * 2004-10-25 2006-05-11 Fuji Electric Fa Components & Systems Co Ltd 電力変換装置
JP4697148B2 (ja) * 2006-04-28 2011-06-08 パナソニック株式会社 電動圧縮機
JP2008057425A (ja) * 2006-08-31 2008-03-13 Daikin Ind Ltd 流体機械及びヒートポンプ装置
JP2008312413A (ja) * 2007-06-18 2008-12-25 Shindengen Electric Mfg Co Ltd 液冷電力変換装置
JP2009187742A (ja) * 2008-02-05 2009-08-20 Hitachi Maxell Ltd 電池パック
JP5730176B2 (ja) * 2011-11-11 2015-06-03 三菱重工業株式会社 インバータ一体型電動圧縮機

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020025265A1 (en) * 2000-08-29 2002-02-28 Hideo Ikeda Motor-driven compressors
US20110217191A1 (en) * 2008-11-10 2011-09-08 Eisuke Fujimra Inverter-Integrated Electric Compressor
US20110217190A1 (en) * 2008-11-10 2011-09-08 Jun Mizuno Inverter-Integrated Electric Compressor
US20110256002A1 (en) * 2008-12-18 2011-10-20 Hideo Ikeda Electric Compressor Having Drive Circuit Integrated Thereinto
US8939739B2 (en) * 2010-12-02 2015-01-27 Kabushiki Kaisha Toyota Jidoshokki Electric compressor

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10999919B2 (en) * 2019-07-11 2021-05-04 Toyota Motor Engineering & Manufacturing North America, Inc. Flexible electronic assembly for placement on a vehicle motor assembly

Also Published As

Publication number Publication date
DE102014119197A1 (de) 2015-06-25
CN104747400A (zh) 2015-07-01
JP2015121196A (ja) 2015-07-02
KR20150075381A (ko) 2015-07-03

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Legal Events

Date Code Title Description
AS Assignment

Owner name: KABUSHIKI KAISHA TOYOTA JIDOSHOKKI, JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:MORI, SHOGO;OTOBE, YURI;NISHI, SHINSUKE;REEL/FRAME:034566/0303

Effective date: 20141222

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION