US20120086535A1 - Method for making a high current low profile inductor - Google Patents

Method for making a high current low profile inductor Download PDF

Info

Publication number
US20120086535A1
US20120086535A1 US13/109,576 US201113109576A US2012086535A1 US 20120086535 A1 US20120086535 A1 US 20120086535A1 US 201113109576 A US201113109576 A US 201113109576A US 2012086535 A1 US2012086535 A1 US 2012086535A1
Authority
US
United States
Prior art keywords
inductor
coil
electrical
compressed body
resin
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US13/109,576
Inventor
Timothy M. Shafer
Brett W. Jelkin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Vishay Dale Electronics LLC
Original Assignee
Vishay Dale Electronics LLC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=38698763&utm_source=***_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=US20120086535(A1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Priority claimed from US08/963,224 external-priority patent/US6204744B1/en
Priority claimed from US09/271,748 external-priority patent/US6198375B1/en
Priority claimed from US11/038,880 external-priority patent/US7034645B2/en
Priority claimed from US11/609,165 external-priority patent/US7263761B1/en
Priority to US13/109,576 priority Critical patent/US20120086535A1/en
Application filed by Vishay Dale Electronics LLC filed Critical Vishay Dale Electronics LLC
Publication of US20120086535A1 publication Critical patent/US20120086535A1/en
Priority to US13/720,618 priority patent/US20130106562A1/en
Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY AGREEMENT Assignors: SILICONIX INCORPORATED, VISHAY DALE ELECTRONICS, INC., VISHAY INTERTECHNOLOGY, INC.
Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY AGREEMENT Assignors: VISHAY DALE ELECTRONICS, LLC
Assigned to JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT reassignment JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT SECURITY INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: DALE ELECTRONICS, INC., SILICONIX INCORPORATED, SPRAGUE ELECTRIC COMPANY, VISHAY DALE ELECTRONICS, INC., VISHAY DALE ELECTRONICS, LLC, VISHAY EFI, INC., VISHAY GENERAL SEMICONDUCTOR, INC., VISHAY INTERTECHNOLOGY, INC., VISHAY SPRAGUE, INC., VISHAY-DALE, INC., VISHAY-SILICONIX, VISHAY-SILICONIX, INC.
Assigned to DALE ELECTRONICS, INC., VISHAY DALE ELECTRONICS, INC., VISHAY-DALE, VISHAY DALE ELECTRONICS, LLC reassignment DALE ELECTRONICS, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Assigned to VISHAY INTERTECHNOLOGY, INC., VISHAY DALE ELECTRONICS, INC., SILICONIX INCORPORATED reassignment VISHAY INTERTECHNOLOGY, INC. RELEASE BY SECURED PARTY (SEE DOCUMENT FOR DETAILS). Assignors: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
Abandoned legal-status Critical Current

Links

Images

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F5/00Coils
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/003Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor characterised by the choice of material
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C43/00Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor
    • B29C43/02Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles
    • B29C43/18Compression moulding, i.e. applying external pressure to flow the moulding material; Apparatus therefor of articles of definite length, i.e. discrete articles incorporating preformed parts or layers, e.g. compression moulding around inserts or for coating articles
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F41/00Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties
    • H01F41/02Apparatus or processes specially adapted for manufacturing or assembling magnets, inductances or transformers; Apparatus or processes specially adapted for manufacturing materials characterised by their magnetic properties for manufacturing cores, coils, or magnets
    • H01F41/0206Manufacturing of magnetic cores by mechanical means
    • H01F41/0246Manufacturing of magnetic circuits by moulding or by pressing powder
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2303/00Use of resin-bonded materials as reinforcement
    • B29K2303/04Inorganic materials
    • B29K2303/06Metal powders, metal carbides or the like
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29KINDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0003Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular electrical or magnetic properties, e.g. piezoelectric
    • B29K2995/0008Magnetic or paramagnetic
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F17/00Fixed inductances of the signal type 
    • H01F17/04Fixed inductances of the signal type  with magnetic core
    • H01F2017/048Fixed inductances of the signal type  with magnetic core with encapsulating core, e.g. made of resin and magnetic powder
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • H01F2027/2861Coil formed by folding a blank
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/02Casings
    • H01F27/027Casings specially adapted for combination of signal type inductors or transformers with electronic circuits, e.g. mounting on printed circuit boards
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/2847Sheets; Strips
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F27/00Details of transformers or inductances, in general
    • H01F27/28Coils; Windings; Conductive connections
    • H01F27/29Terminals; Tapping arrangements for signal inductances
    • H01F27/292Surface mounted devices
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01FMAGNETS; INDUCTANCES; TRANSFORMERS; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES
    • H01F37/00Fixed inductances not covered by group H01F17/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49073Electromagnet, transformer or inductor by assembling coil and core
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/4902Electromagnet, transformer or inductor
    • Y10T29/49075Electromagnet, transformer or inductor including permanent magnet or core
    • Y10T29/49076From comminuted material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/4913Assembling to base an electrical component, e.g., capacitor, etc.
    • Y10T29/49146Assembling to base an electrical component, e.g., capacitor, etc. with encapsulating, e.g., potting, etc.
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49124On flat or curved insulated base, e.g., printed circuit, etc.
    • Y10T29/49155Manufacturing circuit on or in base
    • Y10T29/49158Manufacturing circuit on or in base with molding of insulated base
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49169Assembling electrical component directly to terminal or elongated conductor
    • Y10T29/49171Assembling electrical component directly to terminal or elongated conductor with encapsulating
    • Y10T29/49172Assembling electrical component directly to terminal or elongated conductor with encapsulating by molding of insulating material
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/49002Electrical device making
    • Y10T29/49117Conductor or circuit manufacturing
    • Y10T29/49174Assembling terminal to elongated conductor
    • Y10T29/49176Assembling terminal to elongated conductor with molding of electrically insulating material

Definitions

  • the present invention relates to an inductor coil structure and method for making same.
  • the coil structure of the present invention is preferably for use in a high current low profile inductor commonly referred to by the designation IHLP.
  • IHLP high current low profile inductor
  • the particular coil structure may be used in other types of inductors.
  • Inductor coils have in the prior art been constructed from various shapes of materials formed into various helical shapes. However, there is a need for an improved inductor coil structure which is simple to manufacture and which provides an efficient and reliable inductance coil.
  • a primary object of the present invention is the provision of an improved inductor coil structure and method for making same.
  • a further object of the present invention is the provision of an inductor coil structure which can be used in a high current low profile inductor having no air spaces in the inductor, and which includes a magnetic material completely surrounding the coil.
  • a further object of the present invention is the provision of an inductor coil structure which includes a closed magnetic system which has self-shielding capability.
  • a further object of the present invention is the provision of an inductor coil structure which maximizes the utilization of space needed for a given inductance performance so that the inductor can be of a minimum size.
  • a further object of the present invention is the provision of an improved inductor coil structure which is smaller, less expensive to manufacture, and is capable of accepting more current without saturation than previous inductor coil structures.
  • a further object of the present invention is the provision of an inductor coil structure which lowers the series resistance of the inductor.
  • a high current low profile inductor comprising a conductor coil having first and second coil ends.
  • a magnetic material surrounds the conductor coil to form an inductor body.
  • the inductor coil comprises a plurality of coil turns extending around a longitudinal coil axis in an approximately helical path which progresses axially along the coil axis.
  • the coil turns are formed from a flat plate having first and second opposite flat surfaces, at least a portion of each of the flat surfaces of the coil turns facing in a axial direction with respect to the coil axis.
  • the method for making the inductor includes taking an elongated plate conductor having a first end, a second end, opposite side edges, opposite flat surfaces, and a longitudinal plate axis.
  • a plurality of slots are cut in each of the opposite side edges of the plate conductor so as to form the plate conductor into a plurality of cross segments extending transversely with respect to the plate axis and a plurality of connecting segments extending approximately axially with respect to the plate axis.
  • the connecting segments connect the cross segments together into a continuous conductor which extends in a sine shaped path.
  • sine shaped refers to any shape which generally conforms to a sine curve, but which is not limited to a continuous curve and may include apexes, squared off corners or other various shapes.
  • the connecting segments After cutting the slots in the opposite side edges of the plate conductor the connecting segments are bent along one or more bend axes extending transversely with respect to the plate axis so as to form the plate conductor into a plurality of accordion folds, each of which comprise one of the cross segments and a portion of one of the connecting segments.
  • the cross segments and the connecting segments form a continuous conductor coil of approximate helical shape having first and second opposite ends.
  • FIG. 1 is a perspective view of the inductor constructed in accordance with the present invention and mounted upon a circuit board.
  • FIG. 2 is a pictorial view of the coil of the inductor before the molding process.
  • FIG. 3 is a pictorial view of the inductor of the present invention after the molding process is complete, but before the leads have been formed.
  • FIG. 4 is an end elevational view taken along line 4 - 4 of FIG. 2 .
  • FIG. 5 is an elevational view taken along lines 5 - 5 of FIG. 4 .
  • FIG. 6 is a perspective view of an elongated conductor blank from which the inductor coil is formed.
  • FIG. 7 shows the blank of FIG. 6 after the formation of slots extending inwardly from the opposite edges thereof.
  • FIG. 8 is a view similar to FIG. 7 , showing the first folding step in the formation of the inductor coil of the present invention.
  • FIG. 9 is a side elevational view showing the same folding step shown in FIG. 8 .
  • FIG. 10 is a view similar to 8 and showing a second folding step in the process for making the inductor coil of the present invention.
  • FIG. 11 is an inverted pictorial view of the inductor after it has been pressed, but before the leads have been formed.
  • FIG. 12 is a view similar to FIG. 11 showing the inductor after partial forming of the leads.
  • FIG. 13 is a view similar to FIGS. 11 and 12 showing the final forming of the leads.
  • Inductor 10 generally designates an inductor of the present invention mounted upon a circuit board 12 .
  • Inductor 10 includes an inductor body 14 having a first lead 16 and a second lead 18 extending therefrom and being folded over the opposite ends of body 14 . Leads 16 , 18 are soldered or otherwise electrically connected on the circuit board 12 .
  • the inductor coil of the present invention is generally designated by the numeral 20 .
  • Leads 16 , 18 form the ends of coil 22 .
  • Between leads 16 , 18 are a plurality of L-shaped coil segments 26 each comprising a horizontal leg 28 and a vertical leg 30 .
  • Vertical leg 30 terminates at a connecting segment 32 which is folded over at approximately 180° so as to create an accordion like configuration for inductor coil 20 .
  • the L-shaped coil segments are connected together to form a helical coil having an open coil center 34 extending along a longitudinal coil axis 36 .
  • FIGS. 6-10 show the process for making the coil 20 .
  • a blank flat conductor plate 50 formed of copper or other electrically conductive material includes: first and second ends 52 , 54 ; a pair of opposite flat surfaces 56 ; and a pair of opposite side edges 58 , 60 .
  • FIG. 7 shows the first step in forming the coil 20 .
  • a plurality of slots 62 , 64 are cut in the opposite edges 58 , 60 respectively of the blank flat plate 50 .
  • Various cutting methods may be used such as stamping or actual cutting by laser or other cutting tools known in the art.
  • the blank 50 Upon completion of the cutting operation, the blank 50 is transformed into an elongated sine shaped body formed from a plurality of cross segments 66 extending transversely to the longitudinal axis of plate 50 and a plurality of connecting segments 67 extending axially with respect to the longitudinal axis of plate 50 .
  • the segments 66 , 67 form a continuous sine shaped configuration as shown in FIG. 7 .
  • FIG. 8 shows the next step in forming the coil 20 .
  • the end 52 is folded over at an angle of 180° to form the 180° angle bend 63 in the first connecting segment 67 .
  • FIG. 10 shows a second bend 65 which is in the next connecting segment 67 . Bends 63 , 65 are in opposite directions, and are repeated until an accordion like structure is provided similar to that shown in FIG. 5 .
  • the coil 20 includes opposite ends 16 , 18 which are formed from the opposite ends 52 , 54 of blank 50 .
  • the cross segments 66 of blank 50 form the first horizontal legs 28 of coil 20
  • the connecting segments 67 of blank 50 form the second vertical legs 30 and the connecting segments 32 of coil 20 .
  • An example of a preferred material for coil 20 is a copper flat plate made from OFHC copper 102, 99.95% pure.
  • the magnetic molding material of body 14 is comprised of a powdered iron, a filler, a resin, and a lubricant.
  • the preferred powdered material is manufactured by BASF Corporation, 100 Cherryhill Road, Parsippany, N.J. under the trade designation Carbonyl Iron, Grade SQ. This SQ material is insulated with 0.875% mass fraction with 75% H 3 P04.
  • An epoxy resin is also added to the mixture, and the preferred resin for this purpose is manufactured by Morton International, Post Office Box 15240 , Reading, Pa. under the trade designation Corvel Black, Number 10-7086.
  • the lubricant is a zinc stearate manufactured by Witco Corporation, Box 45296 , Houston Tex. under the product designation Lubrazinc W.
  • the above materials are mixed together and then acetone is added to wet the material to a mud-like consistency. The material is then permitted to dry and is screened to a particle size of ⁇ 50 mesh. The lubricant is then added to complete the material. The material is then ready for pressure molding.
  • the next step in the process involves compressing the material completely around the coil 20 so that it has a density produced by exposure to pressure of from 15 to 25 tons per square inch. This causes the powdered material to be compressed and molded tightly completely around the coil so as to form the inductor body 14 shown in FIG. 1 and in FIGS. 11-13 .
  • the molded assembly is in the form which is shown in FIG. 11 .
  • the leads 16 , 18 are formed or bent as shown in FIGS. 12 and 13 .
  • the molded assemblies are then baked at 325° F. for one hour and forty-five minutes to set the resin.
  • the IHLP inductor of the present invention has several unique attributes.
  • the conductive coil, lead frame, magnetic core material, and protective enclosure are molded as a single integral low profile unitized body that has termination leads suitable for surface mounting.
  • the construction allows for maximum utilization of available space for magnetic performance and is magnetically self-shielding.
  • the unitary construction eliminates the need for two core halves as was the case with prior art E cores or other core shapes, and also eliminates the associated assembly labor.
  • the unique conductor winding of the present invention allows for high current operation and also optimizes magnetic parameters within the inductor's footprint.
  • the manufacturing process of the present invention provides a low cost, high performance package without the dependence on expensive, tight tolerance core materials and special winding techniques.
  • the magnetic core material has high resistivity (exceeding 3 mega ohms) that enables the inductor as it is manufactured to perform without a conductive path between the surface mount leads.
  • the magnetic material also allows efficient operation up to 1 MHz.
  • the inductor package performance yields a low DC resistance to inductance ratio of two milliOhms per microHenry. A ratio of 5 or below is considered very good.
  • Coil 20 reduces its cost of manufacture. Coil 20 may be used in various inductor configurations other than IHLP inductors.

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Coils Or Transformers For Communication (AREA)

Abstract

A high current, low profile inductor includes a conductor coil surrounded by magnetic material to form an inductor body. An inductor body is formed around the inductor coil and includes a resin and a magnetic material compressed while it is dry and surrounding the inside and the outside of the coil.

Description

    CROSS REFERENCE TO RELATED APPLICATION(S)
  • This application is a continuation of U.S. application Ser. No. 12/535,757 filed Aug. 5, 2009, which is a divisional application of U.S. application Ser. No. 12/013,725 filed Jan. 14, 2008, which is a divisional application of U.S. application Ser. No. 11/782,020 filed Jul. 24, 2007, now U.S. Pat. No. 7,345,562, which is a divisional application of U.S. application Ser. No. 11/609,165 filed Dec. 11, 2006, now U.S. Pat. No. 7,263,761, which is a divisional application of U.S. application Ser. No. 11/409,651 filed Apr. 24, 2006, now U.S. Pat. No. 7,221,249, which is a divisional application of U.S. application Ser. No. 11/038,880 filed Jan. 20, 2005, now U.S. Pat. No. 7,034,645, which is a divisional application of U.S. application Ser. No. 10/244,777, filed Sep. 16, 2002, now U.S. Pat. No. 6,946,944, which is a continuation of U.S. application Ser. No. 09/546,859 filed Apr. 10, 2000, now U.S. Pat. No. 6,449,829, which is a divisional of U.S. application Ser. No. 09/271,748, filed Mar. 18, 1999, now U.S. Pat. No. 6,198,375. U.S. application Ser. No. 10/244,777, filed Sep. 16, 2002, now U.S. Pat. No. 6,946,944, is also a continuation of U.S. application Ser. No. 09/547,155, filed Apr. 11, 2000, now U.S. Pat. No. 6,460,244, which is a divisional of U.S. application Ser. No. 08/963,224, filed Nov. 3, 1997, now U.S. Pat. No. 6,204,744, which is a continuation of U.S. application Ser. No. 08/503,655 filed Jul. 18, 1995, now abandoned.
  • BACKGROUND
  • The present invention relates to an inductor coil structure and method for making same. The coil structure of the present invention is preferably for use in a high current low profile inductor commonly referred to by the designation IHLP. However, the particular coil structure may be used in other types of inductors.
  • Inductor coils have in the prior art been constructed from various shapes of materials formed into various helical shapes. However, there is a need for an improved inductor coil structure which is simple to manufacture and which provides an efficient and reliable inductance coil.
  • Therefore, a primary object of the present invention is the provision of an improved inductor coil structure and method for making same.
  • A further object of the present invention is the provision of an inductor coil structure which can be used in a high current low profile inductor having no air spaces in the inductor, and which includes a magnetic material completely surrounding the coil.
  • A further object of the present invention is the provision of an inductor coil structure which includes a closed magnetic system which has self-shielding capability.
  • A further object of the present invention is the provision of an inductor coil structure which maximizes the utilization of space needed for a given inductance performance so that the inductor can be of a minimum size.
  • A further object of the present invention is the provision of an improved inductor coil structure which is smaller, less expensive to manufacture, and is capable of accepting more current without saturation than previous inductor coil structures.
  • A further object of the present invention is the provision of an inductor coil structure which lowers the series resistance of the inductor.
  • SUMMARY OF THE INVENTION
  • The foregoing objects may be achieved by a high current low profile inductor comprising a conductor coil having first and second coil ends. A magnetic material surrounds the conductor coil to form an inductor body. The inductor coil comprises a plurality of coil turns extending around a longitudinal coil axis in an approximately helical path which progresses axially along the coil axis. The coil turns are formed from a flat plate having first and second opposite flat surfaces, at least a portion of each of the flat surfaces of the coil turns facing in a axial direction with respect to the coil axis.
  • The method for making the inductor includes taking an elongated plate conductor having a first end, a second end, opposite side edges, opposite flat surfaces, and a longitudinal plate axis. A plurality of slots are cut in each of the opposite side edges of the plate conductor so as to form the plate conductor into a plurality of cross segments extending transversely with respect to the plate axis and a plurality of connecting segments extending approximately axially with respect to the plate axis. The connecting segments connect the cross segments together into a continuous conductor which extends in a sine shaped path. As used herein the term “sine shaped” refers to any shape which generally conforms to a sine curve, but which is not limited to a continuous curve and may include apexes, squared off corners or other various shapes.
  • After cutting the slots in the opposite side edges of the plate conductor the connecting segments are bent along one or more bend axes extending transversely with respect to the plate axis so as to form the plate conductor into a plurality of accordion folds, each of which comprise one of the cross segments and a portion of one of the connecting segments. In the resulting structure, the cross segments and the connecting segments form a continuous conductor coil of approximate helical shape having first and second opposite ends.
  • BRIEF DESCRIPTION OF THE DRAWING(S)
  • FIG. 1 is a perspective view of the inductor constructed in accordance with the present invention and mounted upon a circuit board.
  • FIG. 2 is a pictorial view of the coil of the inductor before the molding process.
  • FIG. 3 is a pictorial view of the inductor of the present invention after the molding process is complete, but before the leads have been formed.
  • FIG. 4 is an end elevational view taken along line 4-4 of FIG. 2.
  • FIG. 5 is an elevational view taken along lines 5-5 of FIG. 4.
  • FIG. 6 is a perspective view of an elongated conductor blank from which the inductor coil is formed.
  • FIG. 7 shows the blank of FIG. 6 after the formation of slots extending inwardly from the opposite edges thereof.
  • FIG. 8 is a view similar to FIG. 7, showing the first folding step in the formation of the inductor coil of the present invention.
  • FIG. 9 is a side elevational view showing the same folding step shown in FIG. 8.
  • FIG. 10 is a view similar to 8 and showing a second folding step in the process for making the inductor coil of the present invention.
  • FIG. 11 is an inverted pictorial view of the inductor after it has been pressed, but before the leads have been formed.
  • FIG. 12 is a view similar to FIG. 11 showing the inductor after partial forming of the leads.
  • FIG. 13 is a view similar to FIGS. 11 and 12 showing the final forming of the leads.
  • DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT(S)
  • Referring to the drawings the numeral 10 generally designates an inductor of the present invention mounted upon a circuit board 12. Inductor 10 includes an inductor body 14 having a first lead 16 and a second lead 18 extending therefrom and being folded over the opposite ends of body 14. Leads 16, 18 are soldered or otherwise electrically connected on the circuit board 12.
  • Referring to FIG. 2, the inductor coil of the present invention is generally designated by the numeral 20. Leads 16, 18 form the ends of coil 22. Between leads 16, 18 are a plurality of L-shaped coil segments 26 each comprising a horizontal leg 28 and a vertical leg 30. Vertical leg 30 terminates at a connecting segment 32 which is folded over at approximately 180° so as to create an accordion like configuration for inductor coil 20. The L-shaped coil segments are connected together to form a helical coil having an open coil center 34 extending along a longitudinal coil axis 36.
  • FIGS. 6-10 show the process for making the coil 20. Initially as shown in FIG. 6 a blank flat conductor plate 50 formed of copper or other electrically conductive material includes: first and second ends 52, 54; a pair of opposite flat surfaces 56; and a pair of opposite side edges 58, 60.
  • FIG. 7 shows the first step in forming the coil 20. In this step a plurality of slots 62, 64 are cut in the opposite edges 58, 60 respectively of the blank flat plate 50. Various cutting methods may be used such as stamping or actual cutting by laser or other cutting tools known in the art.
  • Upon completion of the cutting operation, the blank 50 is transformed into an elongated sine shaped body formed from a plurality of cross segments 66 extending transversely to the longitudinal axis of plate 50 and a plurality of connecting segments 67 extending axially with respect to the longitudinal axis of plate 50. The segments 66, 67 form a continuous sine shaped configuration as shown in FIG. 7.
  • FIG. 8 shows the next step in forming the coil 20. The end 52 is folded over at an angle of 180° to form the 180° angle bend 63 in the first connecting segment 67. FIG. 10 shows a second bend 65 which is in the next connecting segment 67. Bends 63, 65 are in opposite directions, and are repeated until an accordion like structure is provided similar to that shown in FIG. 5.
  • In FIG. 5 the coil 20 includes opposite ends 16, 18 which are formed from the opposite ends 52, 54 of blank 50. The cross segments 66 of blank 50 form the first horizontal legs 28 of coil 20, and the connecting segments 67 of blank 50 form the second vertical legs 30 and the connecting segments 32 of coil 20.
  • An example of a preferred material for coil 20 is a copper flat plate made from OFHC copper 102, 99.95% pure.
  • The magnetic molding material of body 14 is comprised of a powdered iron, a filler, a resin, and a lubricant. The preferred powdered material is manufactured by BASF Corporation, 100 Cherryhill Road, Parsippany, N.J. under the trade designation Carbonyl Iron, Grade SQ. This SQ material is insulated with 0.875% mass fraction with 75% H3P04.
  • An epoxy resin is also added to the mixture, and the preferred resin for this purpose is manufactured by Morton International, Post Office Box 15240, Reading, Pa. under the trade designation Corvel Black, Number 10-7086.
  • In addition a lubricant is added to the mixture. The lubricant is a zinc stearate manufactured by Witco Corporation, Box 45296, Houston Tex. under the product designation Lubrazinc W.
  • Various combinations of the above ingredients may be mixed together, but the preferred mixture is as follows:
  • 1,000 grams of the powdered iron.
  • 3.3% by weight of the resin.
  • 0.3% by weight of the lubricant.
  • The above materials (other than the lubricant) are mixed together and then acetone is added to wet the material to a mud-like consistency. The material is then permitted to dry and is screened to a particle size of −50 mesh. The lubricant is then added to complete the material. The material is then ready for pressure molding.
  • The next step in the process involves compressing the material completely around the coil 20 so that it has a density produced by exposure to pressure of from 15 to 25 tons per square inch. This causes the powdered material to be compressed and molded tightly completely around the coil so as to form the inductor body 14 shown in FIG. 1 and in FIGS. 11-13.
  • At this stage of the production the molded assembly is in the form which is shown in FIG. 11. After baking, the leads 16, 18 are formed or bent as shown in FIGS. 12 and 13. The molded assemblies are then baked at 325° F. for one hour and forty-five minutes to set the resin.
  • When compared to other inductive components the IHLP inductor of the present invention has several unique attributes. The conductive coil, lead frame, magnetic core material, and protective enclosure are molded as a single integral low profile unitized body that has termination leads suitable for surface mounting. The construction allows for maximum utilization of available space for magnetic performance and is magnetically self-shielding.
  • The unitary construction eliminates the need for two core halves as was the case with prior art E cores or other core shapes, and also eliminates the associated assembly labor.
  • The unique conductor winding of the present invention allows for high current operation and also optimizes magnetic parameters within the inductor's footprint.
  • The manufacturing process of the present invention provides a low cost, high performance package without the dependence on expensive, tight tolerance core materials and special winding techniques.
  • The magnetic core material has high resistivity (exceeding 3 mega ohms) that enables the inductor as it is manufactured to perform without a conductive path between the surface mount leads. The magnetic material also allows efficient operation up to 1 MHz. The inductor package performance yields a low DC resistance to inductance ratio of two milliOhms per microHenry. A ratio of 5 or below is considered very good.
  • The unique configuration of the coil 20 reduces its cost of manufacture. Coil 20 may be used in various inductor configurations other than IHLP inductors.
  • In the drawings and specification there has been set forth a preferred embodiment of the invention, and although specific terms are employed these are used in a generic and descriptive sense only and not for purposes of limitation. Changes in the form and the proportion of parts as well as in the substitution of equivalents are contemplated as circumstances may suggest or render expedient without departing from the spirit or scope of the invention as further defined in the following claims.

Claims (29)

1. An inductor comprising:
an electrical coil having an open center;
terminals for connecting the electrical coil to an electrical circuit; and
a compressed body comprised of insulated conductive particles that tightly and completely surround and magnetically shield the coil.
2. The inductor of claim 1 wherein the coil comprises copper.
3. The inductor of claim 2 wherein the copper is greater than approximately 99% pure.
4. The inductor of claim 1 wherein the electrical coil comprises a plurality of L-shaped coil segments.
5. The inductor of claim 4 wherein each of the plurality of L-shaped coil segments comprises at least one vertical leg and at least one horizontal leg.
6. The inductor of claim 1 wherein the electrical coil is helical.
7. The inductor of claim 1 wherein the magnetic shielding prevents electrical shorting of the terminals.
8. The inductor of claim 1 wherein the insulated conductive particles comprise iron.
9. The inductor of claim 1 wherein the insulated conductive particles are dry.
10. The inductor of claim 1 wherein the inductor is substantially devoid of air spaces.
11. The inductor of claim 1 wherein the electrical coil and the compressed body provides a closed magnetic system.
12. The inductor of claim 1 wherein the compressed body comprises at least powdered iron, a filler, a resin and a lubricant.
13. The inductor of claim 12 wherein the resin comprises an epoxy resin.
14. The inductor of claim 12 wherein the lubricant comprises zinc stearate.
15. The inductor of claim 1 wherein the compressed body is pressed with a pressure within the range of 15 to 25 tons per square inch.
16. The inductor of claim 1 wherein the series resistance of the inductor is reduced.
17. An inductor comprising:
an electrical coil having an open center;
terminals for connecting the electrical coil to an electrical circuit; and
a compressed body comprised entirely of insulated magnetic materials that tightly and completely surround and shield the coil.
18. The inductor of claim 17 wherein the coil comprises copper.
19. The inductor of claim 18 wherein the copper is greater than approximately 99% pure.
20. The inductor of claim 17 wherein the electrical coil is helical.
21. The inductor of claim 17 wherein the magnetic shielding prevents electrical shorting of the terminals.
22. The inductor of claim 17 wherein the insulated magnetic materials comprise iron.
23. The inductor of claim 17 wherein the insulated magnetic materials are dry.
24. The inductor of claim 17 wherein the inductor is substantially devoid of air spaces.
25. The inductor of claim 17 wherein the compressed body comprises at least powdered iron, a filler, a resin and a lubricant.
26. The inductor of claim 25 wherein the resin comprises an epoxy resin.
27. The inductor of claim 25 wherein the lubricant comprises zinc stearate.
28. The inductor of claim 17 wherein the compressed body is pressed with a pressure within the range of 15 to 25 tons per square inch.
29. The inductor of claim 17 further comprising a reduced series resistance.
US13/109,576 1995-07-18 2011-05-17 Method for making a high current low profile inductor Abandoned US20120086535A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
US13/109,576 US20120086535A1 (en) 1995-07-18 2011-05-17 Method for making a high current low profile inductor
US13/720,618 US20130106562A1 (en) 1995-07-18 2012-12-19 Method for making inductor coil structure

Applications Claiming Priority (13)

Application Number Priority Date Filing Date Title
US50365595A 1995-07-18 1995-07-18
US08/963,224 US6204744B1 (en) 1995-07-18 1997-11-03 High current, low profile inductor
US09/271,748 US6198375B1 (en) 1999-03-16 1999-03-16 Inductor coil structure
US09/546,859 US6449829B1 (en) 1999-03-16 2000-04-10 Method for making inductor coil structure
US09/547,155 US6460244B1 (en) 1995-07-18 2000-04-11 Method for making a high current, low profile inductor
US10/244,777 US6946944B2 (en) 1995-07-18 2002-09-16 Inductor coil and method for making same
US11/038,880 US7034645B2 (en) 1999-03-16 2005-01-20 Inductor coil and method for making same
US11/409,651 US7221249B2 (en) 1995-07-18 2006-04-24 Inductor coil
US11/609,165 US7263761B1 (en) 1995-07-18 2006-12-11 Method for making a high current low profile inductor
US11/782,020 US7345562B2 (en) 1995-07-18 2007-07-24 Method for making a high current low profile inductor
US12/013,725 US7921546B2 (en) 1995-07-18 2008-01-14 Method for making a high current low profile inductor
US12/535,757 US7986207B2 (en) 1995-07-18 2009-08-05 Method for making a high current low profile inductor
US13/109,576 US20120086535A1 (en) 1995-07-18 2011-05-17 Method for making a high current low profile inductor

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
US12/535,757 Continuation US7986207B2 (en) 1995-07-18 2009-08-05 Method for making a high current low profile inductor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
US13/720,618 Continuation US20130106562A1 (en) 1995-07-18 2012-12-19 Method for making inductor coil structure

Publications (1)

Publication Number Publication Date
US20120086535A1 true US20120086535A1 (en) 2012-04-12

Family

ID=38698763

Family Applications (4)

Application Number Title Priority Date Filing Date
US12/013,725 Expired - Fee Related US7921546B2 (en) 1995-07-18 2008-01-14 Method for making a high current low profile inductor
US12/535,757 Expired - Fee Related US7986207B2 (en) 1995-07-18 2009-08-05 Method for making a high current low profile inductor
US13/109,576 Abandoned US20120086535A1 (en) 1995-07-18 2011-05-17 Method for making a high current low profile inductor
US13/720,618 Abandoned US20130106562A1 (en) 1995-07-18 2012-12-19 Method for making inductor coil structure

Family Applications Before (2)

Application Number Title Priority Date Filing Date
US12/013,725 Expired - Fee Related US7921546B2 (en) 1995-07-18 2008-01-14 Method for making a high current low profile inductor
US12/535,757 Expired - Fee Related US7986207B2 (en) 1995-07-18 2009-08-05 Method for making a high current low profile inductor

Family Applications After (1)

Application Number Title Priority Date Filing Date
US13/720,618 Abandoned US20130106562A1 (en) 1995-07-18 2012-12-19 Method for making inductor coil structure

Country Status (1)

Country Link
US (4) US7921546B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9318251B2 (en) 2006-08-09 2016-04-19 Coilcraft, Incorporated Method of manufacturing an electronic component

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7791445B2 (en) 2006-09-12 2010-09-07 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8378777B2 (en) 2008-07-29 2013-02-19 Cooper Technologies Company Magnetic electrical device
US9589716B2 (en) 2006-09-12 2017-03-07 Cooper Technologies Company Laminated magnetic component and manufacture with soft magnetic powder polymer composite sheets
US8310332B2 (en) 2008-10-08 2012-11-13 Cooper Technologies Company High current amorphous powder core inductor
US8466764B2 (en) * 2006-09-12 2013-06-18 Cooper Technologies Company Low profile layered coil and cores for magnetic components
US8941457B2 (en) 2006-09-12 2015-01-27 Cooper Technologies Company Miniature power inductor and methods of manufacture
US8659379B2 (en) 2008-07-11 2014-02-25 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9859043B2 (en) 2008-07-11 2018-01-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US9558881B2 (en) 2008-07-11 2017-01-31 Cooper Technologies Company High current power inductor
US8279037B2 (en) 2008-07-11 2012-10-02 Cooper Technologies Company Magnetic components and methods of manufacturing the same
US20100271159A1 (en) * 2009-03-10 2010-10-28 Nikon Corporation Electromagnetic Coil Design for Improved Thermal Performance
US20100277267A1 (en) * 2009-05-04 2010-11-04 Robert James Bogert Magnetic components and methods of manufacturing the same
DE102014100119B4 (en) 2014-01-07 2022-07-14 Infineon Technologies Ag Magnet package and method for producing a magnet package
US20150279548A1 (en) 2014-04-01 2015-10-01 Virginia Tech Intellectual Properties, Inc. Compact inductor employing redistrubuted magnetic flux
CN105390246B (en) * 2014-08-21 2019-03-12 乾坤科技股份有限公司 Inductance and the method for manufacturing inductance
US20160225514A1 (en) * 2015-02-04 2016-08-04 Astec International Limited Power transformers and methods of manufacturing transformers and windings
US10446309B2 (en) 2016-04-20 2019-10-15 Vishay Dale Electronics, Llc Shielded inductor and method of manufacturing
EP3507816A4 (en) * 2016-08-31 2020-02-26 Vishay Dale Electronics, LLC Inductor having high current coil with low direct current resistance
CN108615601B (en) * 2018-05-28 2024-05-10 保定天威保变电气股份有限公司 Double continuous internal shielding type network side winding structure of UPFC engineering series transformer
US11948724B2 (en) 2021-06-18 2024-04-02 Vishay Dale Electronics, Llc Method for making a multi-thickness electro-magnetic device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283238A (en) * 1992-03-31 1993-10-29 Sony Corp Transformer

Family Cites Families (103)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE1370019U (en) 1900-01-01
DE364451C (en) 1917-07-12 1922-11-24 Bell Telephone Mfg Company Process for the production of magnetic cores from iron particles
US1994534A (en) 1932-04-23 1935-03-19 Rca Corp Inductance coil and method of manufacture thereof
CH179582A (en) 1934-03-06 1935-09-15 Bosch Robert Ag High frequency interference suppression choke.
US2154730A (en) 1935-12-30 1939-04-18 Associated Electric Lab Inc Magnetic material
US2118291A (en) 1936-05-06 1938-05-24 Commw Mfg Company Arc welding unit
US2391563A (en) 1943-05-18 1945-12-25 Super Electric Products Corp High frequency coil
US2457806A (en) 1946-06-11 1949-01-04 Eugene R Crippa Inductance coil
US2568169A (en) 1949-05-11 1951-09-18 Zenith Radio Corp Stamped helical coil
US2850707A (en) 1954-04-15 1958-09-02 Sylvania Electric Prod Electromagnetic coils
US3235675A (en) 1954-12-23 1966-02-15 Leyman Corp Magnetic material and sound reproducing device constructed therefrom
US2966704A (en) 1957-01-22 1961-01-03 Edward D O'brian Process of making a ferrite magnetic device
US3380004A (en) 1959-01-20 1968-04-23 Mcmillan Corp Of North Carolin Aperiodic low-pass filter
US3201729A (en) 1960-02-26 1965-08-17 Blanchi Serge Electromagnetic device with potted coil
US3255512A (en) 1962-08-17 1966-06-14 Trident Engineering Associates Molding a ferromagnetic casing upon an electrical component
US3554797A (en) 1967-05-26 1971-01-12 Hughes Aircraft Co Method of producing an encapsulated inductor with a high value of permeability
DE1764087A1 (en) 1968-03-30 1971-04-22 Ibm Deutschland Process for the production of folding windings for electrical devices
US3653986A (en) * 1969-06-27 1972-04-04 Western Electric Co Method for controlling the eddy-current loss and increasing the permeability of magnetic alloys
DE2013943A1 (en) 1969-07-14 1971-02-04 Bregante Castella, Jose Maria, Cassa de la Selva, Gerona (Spanien) Magnetic circuit component in the manner of a magnetic core or solenoid
US3678345A (en) 1970-01-23 1972-07-18 Wicon Kondenstorfabrik As Capacitor impregnated with electrolyte and oil containing depolarizer
DE2132378A1 (en) 1971-06-30 1973-01-18 Siemens Ag GLOWING THROTTLE
US3953251A (en) 1974-03-25 1976-04-27 Bell Telephone Laboratories, Incorporated Method for the production of carbonyl iron containing magnetic devices with selected temperature variation
US4177089A (en) 1976-04-27 1979-12-04 The Arnold Engineering Company Magnetic particles and compacts thereof
JPS5636163Y2 (en) 1976-08-19 1981-08-26
DK148400C (en) 1977-03-15 1985-12-30 Arma Ved Adam Ruttkay MAGNETIC CORE FOR INDUCTION COILS AND PROCEDURE FOR ITS MANUFACTURING
JPS5577113A (en) 1978-12-05 1980-06-10 Hitachi Ltd Magnetic part
GB2044550A (en) 1979-03-09 1980-10-15 Gen Electric Case inductive circuit components
DE3104270A1 (en) 1981-02-07 1982-09-02 Vacuumschmelze Gmbh, 6450 Hanau RADIO INTERFERENCE ARRANGEMENT AND PRODUCTION METHOD
JPS58188108A (en) 1982-04-28 1983-11-02 Tdk Corp Transmission device
JPS59185809A (en) 1983-04-05 1984-10-22 Honda Motor Co Ltd Four-cycle internal-combustion engine
US4601765A (en) * 1983-05-05 1986-07-22 General Electric Company Powdered iron core magnetic devices
JPS6034008A (en) 1983-08-05 1985-02-21 Tohoku Metal Ind Ltd Manufacture of ferrite bead inductor
US4601756A (en) * 1983-10-19 1986-07-22 Canon Kabushiki Kaisha Recording liquid
JPS6118480A (en) 1984-07-05 1986-01-27 井関農機株式会社 Flow regulating plate in pothole type cylinder rotary systemcereal selector
JPS61184806A (en) 1985-02-12 1986-08-18 Tokyo Kosumosu Denki Kk Spiral coil
US4696100A (en) 1985-02-21 1987-09-29 Matsushita Electric Industrial Co., Ltd. Method of manufacturing a chip coil
JPS625618A (en) 1985-07-02 1987-01-12 Matsushita Electric Ind Co Ltd Chip inductor
JPS6213005A (en) 1985-07-11 1987-01-21 Toshiba Corp Manufacture of magnetic substance
FR2587537B1 (en) 1985-09-19 1987-10-30 Cit Alcatel MINIATURE INDUCTANCE AND MANUFACTURING METHOD THEREOF
FR2593320B1 (en) 1986-01-21 1988-03-04 Europ Composants Electron METHOD FOR MANUFACTURING AN INDUCTIVE COMPONENT FOR FLAT CARRYING
JPH0766751B2 (en) 1986-06-30 1995-07-19 ソニー株式会社 Electron gun device
JPS6316160A (en) 1986-07-07 1988-01-23 Nissan Motor Co Ltd Fuel pressure control device
JPS63104407A (en) 1986-10-22 1988-05-09 Nippon Kinzoku Kk Dust core of amorphous alloy
JPS63161602A (en) 1986-12-25 1988-07-05 Kawasaki Steel Corp Dust core having excellent high-frequency magnetic characteristic
US4776980A (en) 1987-03-20 1988-10-11 Ruffini Robert S Inductor insert compositions and methods
JPH0642433B2 (en) 1987-05-11 1994-06-01 富士電機株式会社 Stationary induction equipment
JPS6379306A (en) 1987-06-19 1988-04-09 Murata Mfg Co Ltd Manufacture of inductor
JPS6427305A (en) 1987-07-22 1989-01-30 Murata Manufacturing Co Lc filter
US5023578A (en) 1987-08-11 1991-06-11 Murata Manufacturing Co., Ltd. Filter array having a plurality of capacitance elements
US4791968A (en) 1987-12-14 1988-12-20 Signode Corporation Head for sealless strapping machine
JPH01199415A (en) 1988-02-04 1989-08-10 Matsushita Electric Ind Co Ltd Inductance element and manufacture thereof
US5160447A (en) 1988-02-29 1992-11-03 Kabushiki Kaisha Sankyo Seiki Seisakusho Compressed powder magnetic core and method for fabricating same
JP2709068B2 (en) 1988-03-09 1998-02-04 株式会社三協精機製作所 Dust core
JPH01266705A (en) 1988-04-18 1989-10-24 Sony Corp Coil part
JPH0262012A (en) 1988-08-29 1990-03-01 Matsushita Electric Ind Co Ltd Inductance element and its manufacture
JPH02118919A (en) 1988-10-27 1990-05-07 Nippon Columbia Co Ltd Optical disk device
DE69021689T2 (en) 1989-10-26 1996-04-04 Takeshi Ikeda LC noise filter.
JPH03169002A (en) 1989-11-29 1991-07-22 Tokin Corp Inductor
FR2657454B1 (en) 1990-01-23 1995-07-13 Aerospatiale PROCESS FOR THE PRODUCTION OF ELECTROMAGNETIC WINDINGS.
JPH0411507A (en) 1990-04-30 1992-01-16 Sumitomo Rubber Ind Ltd Studless tire
JPH0794976B2 (en) 1990-05-10 1995-10-11 松下電器産業株式会社 Method for detecting lead floating in electronic components
JPH062251Y2 (en) 1990-05-11 1994-01-19 東光株式会社 Bobbin for multiple inductors
JPH0462804A (en) 1990-06-25 1992-02-27 Toshiba Corp Compound magnetic core
JPH0470712A (en) 1990-07-11 1992-03-05 Seiko Epson Corp Galvanomirror
DE4023141A1 (en) 1990-07-20 1992-01-30 Siemens Matsushita Components Encapsulating prismatic inductance - has fixing contact ends in off=centre split plane of mould and injecting resin asymmetrically to inductance
DE4024507A1 (en) 1990-08-02 1992-02-06 Bodenseewerk Geraetetech HIGH FREQUENCY WINDING
JP2700713B2 (en) 1990-09-05 1998-01-21 株式会社トーキン Inductor
JPH04129206A (en) 1990-09-19 1992-04-30 Toshiba Corp Thin type transformer
WO1992005568A1 (en) 1990-09-21 1992-04-02 Coilcraft, Inc. Inductive device and method of manufacture
JPH04196507A (en) 1990-11-28 1992-07-16 Tokin Corp Thin type transformer
JPH04215412A (en) 1990-12-13 1992-08-06 Sony Corp Inductor and molded inductor
JPH04358003A (en) 1990-12-20 1992-12-11 Kobe Steel Ltd Powder magnetic core material and its production
JP3108931B2 (en) 1991-03-15 2000-11-13 株式会社トーキン Inductor and manufacturing method thereof
JPH04373112A (en) 1991-06-21 1992-12-25 Tokin Corp Inductor and manufacturing method thereof
JP2958821B2 (en) 1991-07-08 1999-10-06 株式会社村田製作所 Solid inductor
US5363080A (en) 1991-12-27 1994-11-08 Avx Corporation High accuracy surface mount inductor
US5414401A (en) 1992-02-20 1995-05-09 Martin Marietta Corporation High-frequency, low-profile inductor
US5291173A (en) 1992-02-21 1994-03-01 General Electric Co. Z-foldable secondary winding for a low-profile, multi-pole transformer
JP3160685B2 (en) 1992-04-14 2001-04-25 株式会社トーキン Inductor
JPH0661059A (en) 1992-08-10 1994-03-04 Tdk Corp Inductor and its manufacture
US5446428A (en) 1992-10-12 1995-08-29 Matsushita Electric Industrial Co., Ltd. Electronic component and its manufacturing method
US5338617A (en) * 1992-11-30 1994-08-16 Motorola, Inc. Radio frequency absorbing shield and method
US5381124A (en) 1993-12-29 1995-01-10 General Electric Company Multi-turn z-foldable secondary winding for a low-profile, conductive film transformer
JPH07320938A (en) 1994-05-24 1995-12-08 Sony Corp Inductor device
FR2721431B1 (en) 1994-06-20 1996-09-06 Ies Method for producing magnetic components with simplified windings, and components thus produced.
SE9402497D0 (en) 1994-07-18 1994-07-18 Hoeganaes Ab Iron powder components containing thermoplastic resin and methods of making the same
US6198375B1 (en) 1999-03-16 2001-03-06 Vishay Dale Electronics, Inc. Inductor coil structure
US7263761B1 (en) * 1995-07-18 2007-09-04 Vishay Dale Electronics, Inc. Method for making a high current low profile inductor
US7034645B2 (en) * 1999-03-16 2006-04-25 Vishay Dale Electronics, Inc. Inductor coil and method for making same
CA2180992C (en) 1995-07-18 1999-05-18 Timothy M. Shafer High current, low profile inductor and method for making same
JP2978117B2 (en) 1996-07-01 1999-11-15 ティーディーケイ株式会社 Surface mount components using pot type core
US5793272A (en) 1996-08-23 1998-08-11 International Business Machines Corporation Integrated circuit toroidal inductor
JPH10199415A (en) 1997-01-07 1998-07-31 Matsushita Electric Ind Co Ltd Forming method for internal film of cathode-ray tube front panel, and device therefor
JP3651529B2 (en) 1997-02-13 2005-05-25 富士通株式会社 Photosensitive resin composition
TW428183B (en) 1997-04-18 2001-04-01 Matsushita Electric Ind Co Ltd Magnetic core and method of manufacturing the same
JP3169002B2 (en) 1998-12-18 2001-05-21 日本電気株式会社 Transmission output control circuit
US6305755B1 (en) * 2000-04-17 2001-10-23 General Motors Corporation Noise inhibiting wheel cover
EP1291794A4 (en) 2000-04-26 2004-08-18 Applic Co Ltd Comp Method of managing transaction and settlement, and method of informing information on consumption trends
DE10024824A1 (en) 2000-05-19 2001-11-29 Vacuumschmelze Gmbh Inductive component and method for its production
TW501150B (en) 2000-08-14 2002-09-01 Delta Electronics Inc Super thin inductor
FR2837783B1 (en) 2002-03-26 2004-05-28 Alstom PLANT FOR THE SUPPLY OF GAS FUEL TO AN ENERGY PRODUCTION ASSEMBLY OF A LIQUEFIED GAS TRANSPORT VESSEL
JP3800540B2 (en) 2003-01-31 2006-07-26 Tdk株式会社 Inductance element manufacturing method, multilayer electronic component, multilayer electronic component module, and manufacturing method thereof
JP4115507B2 (en) 2007-08-27 2008-07-09 三洋電機株式会社 Level detection circuit

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05283238A (en) * 1992-03-31 1993-10-29 Sony Corp Transformer

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9318251B2 (en) 2006-08-09 2016-04-19 Coilcraft, Incorporated Method of manufacturing an electronic component
US10319507B2 (en) 2006-08-09 2019-06-11 Coilcraft, Incorporated Method of manufacturing an electronic component
US11869696B2 (en) 2006-08-09 2024-01-09 Coilcraft, Incorporated Electronic component

Also Published As

Publication number Publication date
US20080110014A1 (en) 2008-05-15
US20100007455A1 (en) 2010-01-14
US20130106562A1 (en) 2013-05-02
US7921546B2 (en) 2011-04-12
US7986207B2 (en) 2011-07-26

Similar Documents

Publication Publication Date Title
US7221249B2 (en) Inductor coil
US7986207B2 (en) Method for making a high current low profile inductor
US7345562B2 (en) Method for making a high current low profile inductor
US6946944B2 (en) Inductor coil and method for making same
US6204744B1 (en) High current, low profile inductor
US8063728B2 (en) Inductive component for high currents and method for the production thereof
US5875541A (en) Method of manufacturing an electronic component
JP3316560B2 (en) Bead inductor
MXPA00010812A (en) Inductor coil structure and method for making same

Legal Events

Date Code Title Description
AS Assignment

Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT, ILLINOIS

Free format text: SECURITY AGREEMENT;ASSIGNORS:VISHAY INTERTECHNOLOGY, INC.;VISHAY DALE ELECTRONICS, INC.;SILICONIX INCORPORATED;REEL/FRAME:031170/0001

Effective date: 20130808

Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT

Free format text: SECURITY AGREEMENT;ASSIGNORS:VISHAY INTERTECHNOLOGY, INC.;VISHAY DALE ELECTRONICS, INC.;SILICONIX INCORPORATED;REEL/FRAME:031170/0001

Effective date: 20130808

STCB Information on status: application discontinuation

Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION

AS Assignment

Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT, NEW YORK

Free format text: SECURITY AGREEMENT;ASSIGNOR:VISHAY DALE ELECTRONICS, LLC;REEL/FRAME:037261/0616

Effective date: 20151210

Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT

Free format text: SECURITY AGREEMENT;ASSIGNOR:VISHAY DALE ELECTRONICS, LLC;REEL/FRAME:037261/0616

Effective date: 20151210

AS Assignment

Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT

Free format text: SECURITY INTEREST;ASSIGNORS:VISHAY DALE ELECTRONICS, INC.;DALE ELECTRONICS, INC.;VISHAY DALE ELECTRONICS, LLC;AND OTHERS;REEL/FRAME:049440/0876

Effective date: 20190605

Owner name: JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT, ILLINOIS

Free format text: SECURITY INTEREST;ASSIGNORS:VISHAY DALE ELECTRONICS, INC.;DALE ELECTRONICS, INC.;VISHAY DALE ELECTRONICS, LLC;AND OTHERS;REEL/FRAME:049440/0876

Effective date: 20190605

AS Assignment

Owner name: DALE ELECTRONICS, INC., NEBRASKA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:049772/0898

Effective date: 20190716

Owner name: VISHAY DALE ELECTRONICS, INC., NEBRASKA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:049772/0898

Effective date: 20190716

Owner name: VISHAY-DALE, NEBRASKA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:049772/0898

Effective date: 20190716

Owner name: VISHAY DALE ELECTRONICS, LLC, NEBRASKA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:049772/0898

Effective date: 20190716

Owner name: VISHAY INTERTECHNOLOGY, INC., PENNSYLVANIA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:049785/0771

Effective date: 20190716

Owner name: SILICONIX INCORPORATED, CALIFORNIA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:049785/0771

Effective date: 20190716

Owner name: VISHAY DALE ELECTRONICS, INC., NEBRASKA

Free format text: RELEASE BY SECURED PARTY;ASSIGNOR:JPMORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT;REEL/FRAME:049785/0771

Effective date: 20190716