CN110848820A - Radiator and air conditioner - Google Patents
Radiator and air conditioner Download PDFInfo
- Publication number
- CN110848820A CN110848820A CN201911007089.3A CN201911007089A CN110848820A CN 110848820 A CN110848820 A CN 110848820A CN 201911007089 A CN201911007089 A CN 201911007089A CN 110848820 A CN110848820 A CN 110848820A
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- Prior art keywords
- heat
- heat dissipation
- side wall
- heat sink
- optionally
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Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F24—HEATING; RANGES; VENTILATING
- F24F—AIR-CONDITIONING; AIR-HUMIDIFICATION; VENTILATION; USE OF AIR CURRENTS FOR SCREENING
- F24F1/00—Room units for air-conditioning, e.g. separate or self-contained units or units receiving primary air from a central station
- F24F1/06—Separate outdoor units, e.g. outdoor unit to be linked to a separate room comprising a compressor and a heat exchanger
- F24F1/20—Electric components for separate outdoor units
- F24F1/24—Cooling of electric components
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M1/00—Details of apparatus for conversion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The application relates to the technical field of heat dissipation, discloses a radiator, includes: the heat conduction substrate comprises a first part and a second part, wherein the first part is provided with a first through hole; and the heat radiating fins are connected with the second part of the heat conducting base body. The heat conducting base body of the radiator provided by the embodiment of the disclosure comprises a first part and a second part, wherein the first part is provided with a first through hole which can be used for being connected and assembled with other radiating elements so as to improve the radiating performance of the radiator. The application also discloses an air conditioner comprising the radiator.
Description
Technical Field
The present application relates to the field of heat dissipation technologies, and for example, to a heat sink and an air conditioner.
Background
The frequency conversion module is used for converting important components in the air conditioner into frequency, the higher the frequency of the compressor is, and the more the frequency conversion module generates heat. Secondly, the chip design is more compact, the density of the components is continuously increased, and the volume of the components tends to be miniaturized. Therefore, the reliability of the air conditioner is seriously affected by the heat dissipation problem of the frequency conversion module.
At present, an extruded section radiator is generally adopted for radiating the frequency conversion module of the air conditioner external unit. In the process of implementing the embodiments of the present disclosure, it is found that at least the following problems exist in the related art:
the heat conducting base body of the existing extruded section bar radiator is connected with radiating fins, and cannot be assembled with other radiating elements.
Disclosure of Invention
The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.
The embodiment of the disclosure provides a radiator and an air conditioner, which aim to solve the technical problem that an extruded profile radiator cannot be assembled with other radiating elements.
In some embodiments, the heat sink comprises: the heat conduction substrate comprises a first part and a second part, wherein the first part is provided with a first through hole; and the heat radiating fins are connected with the second part of the heat conducting base body.
In some embodiments, the air conditioner includes a radiator as described above.
The radiator and the air conditioner provided by the embodiment of the disclosure can realize the following technical effects:
the heat conduction substrate of the radiator provided by the embodiment of the disclosure comprises a first part and a second part, wherein the first part is provided with a first through hole which can be used for being connected and assembled with other radiating elements, so that the connection stability with other radiating elements is improved.
The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.
Drawings
One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:
fig. 1 is a schematic structural diagram of a heat sink provided in an embodiment of the present disclosure;
fig. 2 is another schematic structural diagram of a heat sink provided in the embodiment of the present disclosure.
Reference numerals:
1: a first heat dissipation element; 11: a first portion; 111: a first through hole; 112: a substrate; 113: a first side wall; 114: a second side wall; 115: a boss; 12: a second portion; 121: a heat dissipating fin; 2: a second heat dissipating element; 21: an evaporation end; 22: a condensing end; 23: a first communicating pipe; 24: a second communicating conduit; 211: a groove; 212: a second through hole.
Detailed Description
So that the manner in which the features and elements of the disclosed embodiments can be understood in detail, a more particular description of the disclosed embodiments, briefly summarized above, may be had by reference to the embodiments, some of which are illustrated in the appended drawings. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.
The terms "first," "second," and the like, herein are used solely to distinguish one element from another without requiring or implying any actual such relationship or order between such elements. In practice, a first element can also be referred to as a second element, and vice versa. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a structure, apparatus, or device that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such structure, apparatus, or device. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a structure, device or apparatus that comprises the element. The embodiments are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other.
The disclosed embodiment provides a heat sink, including: the heat conduction substrate comprises a first part and a second part, wherein the first part is provided with a first through hole; and the heat radiating fins are connected with the second part of the heat conducting base body.
As shown in fig. 1, the heat-conducting base includes a first portion 11 and a second portion 12, and optionally, the first portion 11 and the second portion 12 are connected to the heat-conducting base in an operable connection manner, such as welding; optionally, the first portion 11 is integrally formed with the second portion 12 to improve the heat conduction effect between the first portion 11 and the second portion 12. The second portion 12 of the thermally conductive base is provided with heat dissipating fins 121, optionally the thermally conductive base is integrally formed with the heat dissipating fins 121. Optionally, the first portion 11 of the thermally conductive base is not provided with fins.
The first portion 11 is provided with first through holes 111, optionally the first through holes 111 penetrate through two opposite surfaces of the first portion 11 of the thermally conductive base, the first through holes 111 being configured to pass screws therethrough. Alternatively, the inner surface of the first through hole 111 is a smooth surface, or is provided with an internal thread matching the thread of the screw surface. Alternatively, the number of the first through holes 111 may be 1 or more, such as the number of the first through holes is 1-10, such as 1, 2, 3, 4, 5, 6, 7, 8, 9 or 10. Optionally, the first through holes are arranged equidistantly, as shown in fig. 1, the number of the first through holes is 4.
The heat conducting base body and the heat radiating fins 121 are defined to form the first heat radiating element 1, the first heat radiating element 1 is provided with one or more first through holes 111, and the first heat radiating element can be used for penetrating through connecting pieces such as screws and the like, and can be connected and assembled with other heat radiating elements, so that the connection stability with other heat radiating elements is improved. Optionally, the first heat dissipating element 1 is an extruded profile heat dissipating element.
After the first heat dissipation element 1 provided by the embodiment of the disclosure is connected with other heat dissipation elements, the heat dissipation performance of the heat sink is improved. Optionally, the heat dissipation element to be connected may be a non-extruded profile heat dissipation element, which improves the heat dissipation diversity of the heat sink.
Optionally, in the first heat dissipation element 1 provided in the embodiment of the present disclosure, the first portion 11 directly contacts with the chip to receive heat of the chip, and the second portion 12 may be disposed in a fan compartment of an outdoor unit of an air conditioner, so that heat of the heat dissipation fins 121 of the first heat dissipation element 1 is dissipated by wind power of a fan, thereby improving a heat dissipation effect of the heat dissipation fins 121 of the first heat dissipation element 1.
Optionally, the heat sink provided by the embodiment of the present disclosure further includes a substrate.
In order to ensure the tightness of the surface attachment of the heating component and the first heat dissipation element 1 and the installation stability of the computer board and the electric control box, the heat radiator provided by the embodiment of the disclosure further comprises an independent substrate. The mounting method of the first heat dissipation element 1 provided by the embodiment of the present disclosure includes: welding one or more chips on the computer board; the method comprises the following steps of connecting a computer board welded with a chip with a substrate to obtain a package with a sandwich structure sequentially comprising the computer board, the chip and the substrate, wherein the step can be completed on a chip welding production line, and the production line has high precision requirement relative to an assembly production line of an outdoor unit of an air conditioner, improves the attaching degree of the substrate and the chip and improves the heat conduction effect of the substrate; the mounting of the first heat radiating element 1 is completed by attaching the package, optionally attached to the first portion 11 of the thermally conductive base, to the aforementioned thermally conductive base. Optionally, the number of the chips may be 4, and optionally, a heat conducting sheet is disposed between the chip and the substrate or coated with silicone grease, so as to improve the efficiency of heat transfer between the chip and the substrate. Alternatively, the area of the substrate is the same as the area of the first portion 11 of the thermally conductive base.
Optionally, the first portion 11 of the thermally conductive matrix comprises: the light emitting device includes a substrate 112, a first sidewall 113 bent and extended along a first edge of the substrate 112, and a second sidewall 114 bent and extended along a second edge of the substrate 112, wherein the first edge is opposite to the second edge, and the first sidewall 113 and the second sidewall 114 extend in the same direction.
Optionally, the outer surface of the substrate 112 is a plane, which improves the heat conduction effect with the chip or the substrate. Optionally, the base 112, the first side wall 113 and the second side wall 114 form an accommodating groove similar to an inverted U shape, and the first side wall 113 and the second side wall 114 are configured to limit and clamp the second heat dissipation element to be connected, so as to improve the connection stability of the first portion 11 to the second heat dissipation element to be connected; optionally, the substrate 112, the first sidewall 113, and the second sidewall 114 are integrally formed, and the first sidewall 113 and the second sidewall 114 of the first portion 11 can also perform a heat conduction function, so as to transfer heat of the first portion 11 to the second heat dissipation element to be connected, thereby increasing a heat conduction area of the first portion 11, and improving a heat conduction effect of the first portion 11. Optionally, the thickness of the substrate 112 is the same as the thickness of the first and second sidewalls 113 and 114, improving uniformity of heat conduction of the first portion 11. Optionally, the thickness of the substrate 112 is greater than that of the first sidewall 113, and the thickness of the substrate 112 is greater than that of the second sidewall 114, so as to improve the heating uniformity of the second heat dissipation element to be connected. Optionally, the thickness of the first sidewall 113 is the same as the thickness of the second sidewall 114. Optionally, the first sidewall 113 is perpendicular to the substrate 112, and the second sidewall 114 is perpendicular to the substrate 112, so as to improve the limiting effect of the second heat dissipation element to be connected.
Optionally, the substrate 112 is provided with a boss 115, and the first through hole 111 is provided in the boss 115.
The base 112 includes a heat conducting surface in heat conducting contact with the chip or the aforementioned substrate, and a heat transfer surface opposite to the heat conducting surface, and the boss 115 is disposed on the heat transfer surface, that is, disposed at the bottom of the inverted U-shaped accommodating groove, and can exert a limiting effect on the second heat dissipating element to be connected, thereby improving the connection stability between the first heat dissipating element 1 and the second heat dissipating element. Optionally, the length of the boss 115 is the same as the length of the base 112. The one or more first through holes 111 are formed in the portion of the first portion 11 where the boss 115 is disposed, so that the effective depth of the first through hole 111 is increased, and the connection stability of the second heat dissipation element to be connected is improved. Optionally, the boss 115 is integrally formed with the first portion 11, which improves the heat conduction effect of the boss 115 portion. Optionally, the boss 115 is parallel to the first sidewall 113, and the boss 115 is parallel to the second sidewall 114. Optionally, the boss 115 is disposed in the middle of the heat transfer surface, that is, a first distance between the boss 115 and the first sidewall 113 is equal to a second distance between the boss 115 and the second sidewall 114, so as to improve the limit effect of the boss 115 on the second heat dissipation element to be connected and the stability of the connection.
Optionally, the height of the boss 115 is less than or equal to the height of the first sidewall 113 or the second sidewall 114.
The vertical distance between the connection end of the boss 115 and the heat transfer surface and the free end of the boss 115 is defined as the height of the boss 115, the vertical distance between the connection end of the first side wall 113 and the bent portion of the base 112 and the free end of the first side wall 113 is defined as the height of the first side wall 113, the distance between the connection end of the second side wall 114 and the bent portion of the base 112 and the connection end of the second side wall 114 and the bent portion of the second portion 12 is defined as the height of the second side wall 114, the height of the boss 115 is smaller than or equal to the height of the first side wall 113, and the height of the boss 115 is smaller than or equal to the height of the second side wall 114, so that the connection stability of the first portion 11 and the second heat dissipation element.
Optionally, the height of the first sidewall 113 is greater than or equal to the height of the second sidewall 114.
The height of the first side wall 113 is greater than or equal to the height of the second side wall 114, so that the limiting effect of the second heat dissipation element to be connected is improved. Optionally, the first side wall 113 is parallel to the second side wall 114.
Optionally, the second portion 12 of the thermally conductive base is connected with the second sidewall 114 by bending.
The second portion 12 of the heat-conducting base body is connected with the second side wall 114 in a bending manner, the first portion 11 and the second portion 12 of the heat-conducting base body form a step shape, and optionally, the first portion 11 of the heat-conducting base body is a high-order step, and the second portion 12 of the heat-conducting base body is a low-order step. One or more heat dissipation fins 121 are connected to the second portion 12, and the extending direction of the heat dissipation fins 121 is the same as the extending direction of the first and second sidewalls 113 and 114. Alternatively, the thickness of the heat dissipation fins 121 is smaller than the thickness of the first side wall 113, and the thickness of the heat dissipation fins 121 is smaller than the thickness of the second side wall 114. The vertical distance between the connection end of the heat dissipation fin 121 to the second portion 12 and the free end of the heat dissipation fin 121 is defined as the height of the heat dissipation fin 121, and the height of the heat dissipation fin 121 is greater than the heights of the first and second sidewalls 113 and 114.
Optionally, the aforementioned heat sink further comprises: the evaporation end is provided with a first working medium flow path and a second through hole corresponding to the first through hole; the condensation end is provided with a second working medium flow path; and the communication pipeline is used for communicating the first working medium flow path with the second working medium flow path.
Optionally, the communication pipeline includes a first communication pipeline and a second communication pipeline, the first communication pipeline communicates the first working medium flow path and the second working medium flow path, and the second communication pipeline communicates the first working medium flow path and the second working medium flow path. The first working medium flow path in the evaporation end, the second working medium flow path in the condensation end, the first communication pipeline and the second communication pipeline form a working medium loop, and the working medium loop is filled with a phase change working medium. The heat dissipation element composed of the evaporation end, the condensation end and the communication pipeline can be used as a second heat dissipation element and is connected with the first heat dissipation element.
As shown in fig. 2, a heat dissipation method of the second heat dissipation element 2 provided in the embodiment of the present disclosure may be: the evaporation end 21 receives heat from the first part 11 of the first heat dissipation element 1, part of the heat is dissipated through air cooling action of a fan or natural wind, the heat which is not dissipated is absorbed by working media in a first working medium flow path of the evaporation end 21, the working media are heated and quickly vaporized and take away the heat, the heat enters a second working medium flow path of the condensation end 22 through the first communication pipeline 23, the condensation end 22 can simultaneously perform air cooling heat dissipation and natural convection, gaseous working media in the second working medium flow path dissipate the heat through the condensation end 22, the working media are changed into liquid after the temperature of the working media is reduced, and the liquid working media flow back to the first working medium flow path of the evaporation end 21 through the second communication pipeline 24 to perform next cycle of absorbing heat and changing into gaseous state. Therefore, when the second heat dissipation element 2 provided by the embodiment of the present disclosure is used for heat dissipation, heat can be dissipated simultaneously through the evaporation end 21 and the condensation end 22, so that the heat dissipation capability of the second heat dissipation element 2 is improved, heat can be effectively dissipated, smooth operation of a chip is ensured, and further, the operation reliability of an air conditioner is ensured.
In the second heat dissipation element 2 provided by the embodiment of the present disclosure, the first working medium flow path, the second working medium flow path, the first communication pipeline 23, and the second communication pipeline 24 form a working medium loop, and a phase change working medium is filled in the working medium loop. Optionally, the second heat dissipation element 2 provided in the embodiment of the present disclosure may be prepared through a welding process, a vacuum pumping process, a working medium pouring process, and the like. The present embodiment is not limited to the type of the working medium, and may be, for example, a fluid capable of performing a phase change, such as a refrigerant. The embodiment does not specifically limit the filling amount of the working medium in the working medium circuit.
Alternatively, the first communicating pipe 23 is made of metal, and similarly, the second communicating pipe 24 is made of metal.
The second heat dissipation element 2 is composed of the evaporation end 21, the condensation end 22 and the communication pipeline, and can be connected with the first heat dissipation element 1, so that the heat sink simultaneously comprising the first heat dissipation element 1 and the second heat dissipation element 2 is obtained, and the heat dissipation effect of the heat sink is improved.
The evaporation end 21 of the second heat dissipation element 2 is provided with second through holes 212 corresponding to the first through holes 111, and the number of the second through holes 212 is the same as that of the first through holes 111. The first through hole 111 and the second through hole 212 are configured to be connected by a connector such as a screw, and connect the first portion 11 of the first heat dissipation element 1 and the evaporation end 21 of the second heat dissipation element 2, so as to obtain a heat sink including both the first heat dissipation element 1 and the second heat dissipation element 2. Optionally, the second through hole 212 is provided with an internal thread cooperating with the thread of the screw. Optionally, second through-hole 212 is provided in a manner offset from the first working fluid flow path. Optionally, the length of the screw is greater than the sum of the thickness of the chip and the thickness of the first portion 11 of the first heat dissipating element 1.
The evaporation end 21 is connected to the first portion 11 of the first heat dissipation element 1 through the first through hole 111, optionally, the first portion 11 is in a shape of an accommodating groove formed by the substrate 112, the first side wall 113 and the second side wall 114, and the evaporation end 21 is clamped in the accommodating groove, so that the limiting effect of the first side wall 113 and the second side wall 114 on the evaporation end is improved. Optionally, the thickness of the evaporation end 21 is less than or equal to the height of the second sidewall 114, and the thickness of the evaporation end 21 is less than or equal to the thickness of the second sidewall 114, so that the limiting effect of the first sidewall 113 and the second sidewall 114 on the evaporation end 21 is improved. Optionally, the upper surface of the evaporation end 21 is coated with silicone grease, which improves the heat conduction effect between the first portion 11 and the evaporation end 21.
Optionally, the material of the first heat dissipation element 1 is the same as the material of the evaporation end 21, so that the heat conduction effect between the evaporation ends 21 of the first heat dissipation element 1 and the second heat dissipation element 2 is improved.
Optionally, the first portion 11 of the heat conducting base includes a base 112, the base 112 is provided with a boss 115, and the evaporation end 21 is further provided with a groove 211, which is engaged with the boss 115.
The evaporation end 21 of the second heat dissipation element 2 is provided with a groove 211 matched with the boss 115 of the first portion 11 of the first heat dissipation element 1, and the boss 115 arranged at the base of the first portion 11 can be clamped in the groove 211 of the evaporation end 21 to form clamping, so that the connection stability of the evaporation end 21 of the first heat dissipation element 1 and the second heat dissipation element 2 is improved, as shown in fig. 2.
Optionally, the second through hole 212 of the evaporation end 21 is disposed at the groove 211, so that the connection stability of the evaporation end 21 of the first heat dissipation element 1 and the second heat dissipation element 2 is improved.
Optionally, the condensation end 22 of the second heat dissipation element 2 is a temperature equalization plate.
The micro-channel type second working medium flow path is arranged in the temperature-equalizing plate, so that the heat dissipation area is large, and the heat dissipation effect of the condensation end 22 is improved.
The embodiment of the present disclosure also provides an air conditioner, which includes the radiator as described above.
The radiator is arranged on an outdoor unit of the air conditioner and radiates heat for a chip on a computer board of the outdoor unit.
The first heat dissipation element 1 is in direct contact with the chip, receives heat of the chip through a contact heat conduction mode, dissipates part of the heat of the first heat dissipation element 1 through the heat dissipation fins 121, transfers the other part of the heat to the second heat dissipation element 2, and further dissipates the heat by adopting the second heat dissipation element 2. Optionally, the second portion 12 of the first heat dissipation element 1 is disposed between the evaporation end 21 and the condensation end 22 of the second heat dissipation element 2, which is beneficial to dissipating heat of the heat dissipation fins 121 by using a fan of the outdoor unit, and improves the heat dissipation effect of the first heat dissipation element 1; optionally, the condensing end 22 of the second heat dissipation element 2 is installed at a fan bracket of the outdoor unit, which is beneficial for the condensing end 22 to dissipate heat by using a fan of the outdoor unit, and improves the heat dissipation effect of the condensing end 22; optionally, the condensation end 22 of the second heat dissipation element 2 is disposed in the blower compartment of the outdoor unit; optionally, the installation height of the evaporation end 21 of the second heat dissipation element 2 in the outdoor unit is lower than the installation height of the condensation end 22 in the outdoor unit, which is beneficial to forming a loop between the evaporation end 21 and the condensation end 22 for the working medium in the second heat dissipation element 2, improving the flow rate of the working medium, and improving the heat dissipation efficiency of the second heat dissipation element 2.
Claims (10)
1. A heat sink, comprising:
the heat conduction substrate comprises a first part and a second part, wherein the first part is provided with a first through hole;
and the heat radiating fins are connected with the second part of the heat conducting base body.
2. The heat sink of claim 1, wherein the first portion of the thermally conductive base comprises:
a substrate, a first side wall extending along the first edge of the substrate in a bending way, a second side wall extending along the second edge of the substrate in a bending way,
wherein the first edge is opposite to the second edge, and the extending directions of the first side wall and the second side wall are the same.
3. The heat sink of claim 2,
the base is provided with a boss, and the first through hole is formed in the boss.
4. The heat sink of claim 3,
the height of the boss is less than or equal to the height of the first side wall or the second side wall.
5. The heat sink of claim 2,
the height of the first side wall is greater than or equal to the height of the second side wall.
6. The heat sink of claim 2,
the second part of the heat-conducting base body is connected with the second side wall in a bending mode.
7. The heat sink according to any one of claims 1-6, further comprising:
the evaporation end is provided with a first working medium flow path and a second through hole corresponding to the first through hole;
the condensation end is provided with a second working medium flow path;
and the communication pipeline is used for communicating the first working medium flow path with the second working medium flow path.
8. A heat sink according to claim 7, wherein the first portion of the thermally conductive base comprises a base provided with bosses,
the evaporation end is also provided with a groove which is clamped with the boss.
9. The heat sink of claim 7,
the condensation end is a temperature equalizing plate.
10. An air conditioner characterized by comprising the radiator according to any one of claims 1 to 9.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911007089.3A CN110848820A (en) | 2019-10-22 | 2019-10-22 | Radiator and air conditioner |
| PCT/CN2020/070823 WO2021077631A1 (en) | 2019-10-22 | 2020-01-08 | Radiator and air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911007089.3A CN110848820A (en) | 2019-10-22 | 2019-10-22 | Radiator and air conditioner |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110848820A true CN110848820A (en) | 2020-02-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911007089.3A Pending CN110848820A (en) | 2019-10-22 | 2019-10-22 | Radiator and air conditioner |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN110848820A (en) |
| WO (1) | WO2021077631A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020211489A1 (en) * | 2019-04-19 | 2020-10-22 | 青岛海尔空调器有限总公司 | Outdoor air-conditioning unit and air conditioner |
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| CN204560098U (en) * | 2015-03-30 | 2015-08-12 | 广东美的制冷设备有限公司 | For air conditioner electric-controlled box assembly and there is its air conditioner |
| CN106016507A (en) * | 2016-06-28 | 2016-10-12 | 海信（山东）空调有限公司 | Cooler used for air conditioner frequency converter and variable frequency air conditioner |
| CN208387167U (en) * | 2018-06-27 | 2019-01-15 | 厦门华联电子科技有限公司 | A kind of cooling fin |
| CN109974135A (en) * | 2019-04-19 | 2019-07-05 | 青岛海尔智能技术研发有限公司 | A kind of radiator, air-conditioner outdoor unit and air conditioner |
| CN110043972A (en) * | 2019-04-19 | 2019-07-23 | 青岛海尔空调器有限总公司 | A kind of radiator, air-conditioner outdoor unit and air conditioner |
| CN211177171U (en) * | 2019-10-22 | 2020-08-04 | 青岛海尔空调器有限总公司 | Radiator and air conditioner |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020211489A1 (en) * | 2019-04-19 | 2020-10-22 | 青岛海尔空调器有限总公司 | Outdoor air-conditioning unit and air conditioner |
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| WO2021077631A1 (en) | 2021-04-29 |
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