US20090057156A1 - Production method for wiring and vias - Google Patents
Production method for wiring and vias Download PDFInfo
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- US20090057156A1 US20090057156A1 US12/190,610 US19061008A US2009057156A1 US 20090057156 A1 US20090057156 A1 US 20090057156A1 US 19061008 A US19061008 A US 19061008A US 2009057156 A1 US2009057156 A1 US 2009057156A1
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- wiring
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- VNUWMMGQKKIMQY-UHFFFAOYSA-N CN1C(=CC=CC2=[N+](C)C3=CC=CC=C3C2(C)C)C(C)(C)C2=C1C=CC=C2 Chemical compound CN1C(=CC=CC2=[N+](C)C3=CC=CC=C3C2(C)C)C(C)(C)C2=C1C=CC=C2 VNUWMMGQKKIMQY-UHFFFAOYSA-N 0.000 description 2
- 0 CC1(C)c(cccc2)c2N(C)C1=CC=*C(C1(C)C)=[N+](C)c2c1cccc2 Chemical compound CC1(C)c(cccc2)c2N(C)C1=CC=*C(C1(C)C)=[N+](C)c2c1cccc2 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/42—Plated through-holes or plated via connections
- H05K3/423—Plated through-holes or plated via connections characterised by electroplating method
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1603—Process or apparatus coating on selected surface areas
- C23C18/1607—Process or apparatus coating on selected surface areas by direct patterning
- C23C18/1608—Process or apparatus coating on selected surface areas by direct patterning from pretreatment step, i.e. selective pre-treatment
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1633—Process of electroless plating
- C23C18/1646—Characteristics of the product obtained
- C23C18/165—Multilayered product
- C23C18/1653—Two or more layers with at least one layer obtained by electroless plating and one layer obtained by electroplating
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1806—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by mechanical pretreatment, e.g. grinding, sanding
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/1803—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces
- C23C18/1824—Pretreatment of the material to be coated of metallic material surfaces or of a non-specific material surfaces by chemical pretreatment
- C23C18/1837—Multistep pretreatment
- C23C18/1844—Multistep pretreatment with use of organic or inorganic compounds other than metals, first
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/18—Pretreatment of the material to be coated
- C23C18/20—Pretreatment of the material to be coated of organic surfaces, e.g. resins
- C23C18/22—Roughening, e.g. by etching
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/31—Coating with metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/02—Electroplating of selected surface areas
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/04—Electroplating with moving electrodes
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/10—Electroplating with more than one layer of the same or of different metals
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/12—Semiconductors
- C25D7/123—Semiconductors first coated with a seed layer or a conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/107—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by filling grooves in the support with conductive material
Definitions
- the present invention relates to a technique which produces fine wiring and vias on a substrate by means of electroplating.
- a demand for miniaturization of a wiring pitch of copper wiring to 20 or less ⁇ m has strongly increased also in chip-on-films (COF) and semiconductor package substrates due to downsizing of electronic devices. It has been difficult to keep good ion migration resistance according to the progress in the miniaturization of the wiring pitch.
- COF chip-on-films
- an electroplating method has been used as a method for producing fine wiring and via holes (vias) on a substrate.
- the electroplating method has advantages such as lower cost, higher throughput and more excellent mass productivity than a physical vapor deposition (PVD) method and a chemical vapor deposition (CVD) method.
- Various known methods for producing wiring and vias on a substrate using the electroplating include a Damascene method.
- the Damascene method first of all trenches and vias are formed on a substrate using a suitable method.
- the trenches and vias, which are concave section, are produced in a shape corresponding to a wiring pattern and via holes, and are formed on a position where a wirings and via holes should be arranged.
- metal is deposited on the surface of the substrate by electroplating.
- the deposited metal fills the trenches and the vias.
- the deposited metal which fills the trench and the vias forms wirings and via holes.
- CMP chemical mechanical polishing
- an additive is added to a plating solution to be used for electroplating.
- the additive has a plating reaction suppressing capability and has a characteristic that the plating reaction suppressing capability is reduced as the plating reaction progresses.
- metal can be deposited selectively in a trench and a via formed on the substrate.
- a current density abruptly increases.
- the polarization curve at 1000 rpm crosses the polarization curve at the 0 rpm.
- a trench and a via having a predetermined surface roughness are formed on the substrate.
- the wiring and the via hole are formed on the substrate by electroplating, a work for removing an unnecessary metal layer can be reduced.
- FIGS. 1A to 1G are diagrams explaining a production method for wiring according to the present invention.
- FIGS. 2A to 2G are diagrams explaining a production method for vias according to the present invention.
- FIGS. 3A to 3G are diagrams explaining the production method for the vias according to the present invention.
- FIGS. 4A to 4E are diagrams explaining the production method for wiring according to the present invention.
- FIGS. 5A to 5G are diagrams explaining the production method for the wiring and the vias according to the present invention.
- FIG. 6 is a cross-sectional view illustrating evaluation positions of copper plated film thicknesses of the wiring and a via plate according to the present invention
- FIG. 7 is a diagram explaining a characteristic of a plating solution according to the present invention.
- FIG. 8 is a diagram illustrating plating conditions of the production method for the wiring and the vias according to examples of the present invention.
- an additive is added to a plating solution to be used for electroplating.
- An acid copper sulfate solution may be used as the plating solution.
- the acid copper sulfate solution to be used for the electroplating is publicly known, and its details are not described here.
- wiring and via holes are produced by copper.
- Wiring and via holes may be produced by metal other than copper. For example, nickel, aluminum and the like can be used. In this case, a metal solution whose metal is a raw material of the wiring and the vias is used as the plating solution.
- Metal to be used for a conductive layer as a seed layer for the electroplating may be copper, but other metals than copper, such as nickel, cobalt, chromium, tungsten, palladium, titanium and metal alloy containing at least one of these metals may be used.
- the additive has a capability for suppressing plating reaction, but has a characteristic such that the plating reacting suppressing capability is reduced as the plating reaction progresses.
- Any additive may be used as long as it has such a capability and a characteristic.
- cyanine dye and its derivative have such a capability and a characteristic.
- the cyanine dye is expressed by the following formula, where n is any one of 0, 1, 2 and 3.
- the additive to be used for copper plating a substance which seppress the plating reaction and loses a plating reaction suppressing effect simultaneously with the progression of the plating reaction is suitable.
- the effect of the additive for suppressing the plating reaction can be checked by seeing if deposition overpotential of metal becomes higher when the additive is added to the plating solution.
- the effect that the additive loses the plating reaction suppressing effect simultaneously with the progression of the plating reaction can be checked by the fact that as a flow rate of the plating solution is higher, the deposition overpotential of the metal to be plated becomes higher. This means that as a supply speed of the additive to a first metal layer surface is higher, the plating reaction suppressing effect becomes higher.
- the additive loses the plating reaction suppressing effect, the additive is decomposed and is changed into another substance or is reduced so as to be changed into a substance having a different oxidation number.
- plating can be deposited in the concave section (the trench and the via) approximately selectively by carrying out plating using the plating solution containing such an additive.
- the additive loses its effect on the surface of the first metal layer simultaneously with the progression of the plating reaction.
- an effective additive concentration relating to the plating reaction is reduced on the surface of the first metal layer.
- the concentration of the additive is reduced, the additive is supplied by diffusion from the solution.
- the reduction speed of the additive concentration differs between the concave section and the substrate surface. Since unevenness is formed on the first metal layer in the concave section, its surface area is comparatively larger than that of the substrate surface.
- the reduction speed of the additive concentration is high in the concave section.
- a distance from an bulk plating solution in the concave section is longer than that in the substrate surface. Therefore, the supply of the additive is slow in the concave section, and the increase speed of the additive concentration due to diffusion is low. For this reason, a state that its additive concentration is lower than that in the substrate surface is maintained in the concave section. Since this additive has the plating reaction suppressing effect, the plating reaction in the concave section where the additive concentration is low is not suppressed, and a plating film can be grown selectively in the concave section.
- a rotating disk electrode has a potential area where a current value at 1000 rpm is 1/100 or less than that at the time of rest in a polarization curve obtained by measurement on the rotating disk electrode.
- current density B at 1000 rpm is 1/100 or less than current density A at 0 rpm at a certain electric potential E′.
- the plating solution having such a polarization curve enables metal to be deposited selectively in the trench and the via on the substrate.
- wiring and via holes are produced on the substrate by the Damascene method.
- Surface roughness in the trench and the via formed on the substrate is described together with the Damascene method.
- a guidepost of the roughness arithmetic average roughness Ra defined by JISB0601, and an average length RSm of a roughness curvilinear element defined by JISB0601 are known.
- a trench and a via are formed on the substrate by a suitable method.
- the trench is formed in a shape corresponding to a wiring, and the via is formed on a position where the via holes are arranged.
- the trench and the via are formed so as to have a predetermined surface roughness.
- the first metal layer as a seed layer for electroplating is formed on the substrate with the trench and the via formed thereon.
- a second metal layer is formed on the substrate surface by electroplating.
- the surface roughness of the substrate with the first metal layer formed thereon was measured.
- the arithmetic average roughness Ra is 0.01 to 4 ⁇ m, and preferably 0.01 to 1.0 ⁇ m, in the trench and the via.
- the average length RSm of the rough curvilinear element is 0.005 to 8 ⁇ m, and preferably 0.01 to 2.0 ⁇ m.
- the arithmetic average roughness Ra on the area other than the trench and the via, namely, the substrate surface is preferably 0.001 to 0.002 ⁇ m.
- the average length RSm of the roughness curvilinear element is 10 to 50 ⁇ m, and preferably 20 to 40 ⁇ m.
- the arithmetic average roughness Ra in the trench and the concave section is larger than the arithmetic average roughness Ra of the area other than the trench and the concave section, namely, the substrate surface.
- the arithmetic average roughness Ra in the trench and the via is ten or more times as large as the arithmetic average roughness Ra of the area other than the trench and the via.
- the average length RSm of the roughness curvilinear element in the trench and the via is smaller than the average length RSm of the roughness curvilinear element on the area other than the trench and the via, namely, the substrate surface.
- the average length RSm of the roughness curvilinear element in the trench and the via is 1/10 or less of the average length RSm of the roughness curvilinear element on the area other than the trench and the via.
- the surface roughness in the trench and the via on the substrate hardly changes before and after the first metal layer is formed. Therefore, by forming the trench and the via having a desired surface roughness on the substrate previously, the trench and the via having a desired surface roughness can be obtained after the first metal layer is formed.
- the trench and the via having a desired surface roughness are formed on the substrate, and the first metal layer is formed thereon. Further, the electroplating is carried out by using the plating solution to which the additive is added according to the present invention, so that metal can be precipitated selectively in the trench and the via on the substrate.
- the metal is not deposited on the area of the substrate other than the trench and the via, namely, the substrate surface. Therefore, the work for removing the metal deposited on the substrate surface can be alleviated.
- the present invention can be applied to formation of a copper wiring and a through silicon via technology in 3D packages.
- the inventors of this application conducted experiments of the electroplating in examples 1 to 8 and a comparative example 1.
- the examples 1 to 8 are electroplating experiments using the plating solution of the present invention to which the additive is added.
- the comparative example 1 is the electroplating experiment using a conventional plating solution.
- the plating solution was prepared by adding sulfuric acid with a concentration of 180 g/dm 3 to copper sulfate pentahydrate with a concentration of 150 g/dm 3 .
- the additive of the present invention was added to this plating solution so that the plating solution of the present invention was prepared.
- FIG. 8 illustrates experimental conditions and experimental results of the examples 1 to 8 and the comparative example 1. Symbols described in a column of additive type represent the following chemical substances.
- the arithmetic average roughness Ra defined by JISB0601 and the average length RSm of the roughness curvilinear element defined by JISB0601 are measured values of the surface roughness in the trench and the via on the substrate, which values were measured after the first metal layer being formed.
- FIGS. 1A to 1G A production method for the wiring according to the present invention is described with reference to FIGS. 1A to 1G .
- the example 1 by the inventors of this application is described.
- a polyimide film Kapton EN made by DuPont-Toray Co., Ltd.
- a thickness of 25 ⁇ m was prepared as the substrate 1 .
- the surface of the substrate 1 was subject to a surface roughening treatment.
- a sandblast treatment for spraying alumina fine particulates to the surface of the substrate 1 was used for the surface roughening treatment.
- One of a chemical surface roughening treatment, an electric surface roughening treatment and a mechanical surface roughening treatment, or their combinations may be used as the surface roughening treatment.
- the chemical surface roughening treatment includes an alkali etching treatment using an alkali solution such as a NaOH aqueous solution, an oxidation treatment using acid salt such as permanganate, bichromate, persulfate, hypochlorite, chlorite or chlorate, and etching using hydrazine.
- the electric surface roughening treatment includes a plasma treatment in vacuum, a corona treatment in the atmosphere, and like.
- the mechanical roughening treatment includes brushing using a wire brush, and like.
- the surface roughness on the surface of the substrate 1 was measured by a surface roughness measuring device. As shown in FIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 ⁇ m, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.1 ⁇ m.
- a resist film 2 was formed on the roughened surface of the substrate 1 .
- V-259PA made by Nippon Steel Chemical Co., Ltd. was used as the resist.
- RY-3219 made by Hitachi Chemical Co., Ltd., or SPG-202 made by Asahikasei EMD corporation can be used.
- the thickness of the resist film was 10 ⁇ m.
- trenches 2 a with widths of 7 to 100 ⁇ m were formed along the wiring pattern on the resist film 2 by a photolithography method.
- a first metal layer 3 as a seed layer for electroplating was formed.
- the metal layer 3 was formed on the substrate surface, namely, in the trenches 3 a and on areas 3 c other than the trenches 3 a .
- the first metal layer 3 is a nickel film formed by electroless nickel plating.
- TOP CHEMI ALLOY 66 made by Okuno Chemical Industries was used.
- the film thickness of the nickel was 200 nm.
- the seed layer forming method not only the electroless nickel plating method but also an evaporation method, a sputtering method or a chemical vapor deposition (CVD) method may be used.
- As the first metal layer not only the nickel film but also a chromium film, a tungsten film, a palladium film or a titanium film, or their alloy film can be used.
- the surface roughness in the trenches 3 a and the surface roughness of the areas 3 c other than the trenches 3 a were measured by the surface roughness measuring device.
- the surface roughness in the trenches 3 a were the same as the surface roughness on the surface of the substrate 1 measured after the surface roughening treatment.
- the arithmetic average roughness Ra defined by JISB0601 was 0.001 ⁇ m
- average length RSm of the roughness curvilinear element defined by JISB0601 was 34 ⁇ m on the areas 3 c other than the trenches 3 a.
- a second metal layer 4 was formed by electrolytic copper plating.
- the second metal layer 4 is a copper plating film.
- the plating conditions are as shown in FIG. 8 .
- Plating time was 10 minutes, current density was 1.0 A/dm 2 , and temperature of the plating solution was 25° C.
- the thickness of the copper plating film in the trenches 3 a is represented by T 1
- the thickness of the copper plating film on the areas 3 c other than the trenches 3 a is represented by T 3 .
- the thickness T 1 of the copper plating film in the trenches 3 a was 10 m.
- the thickness T 3 of the copper plating film on the areas 3 c other than the trenches 3 a was not more than 0.001 ⁇ m.
- the first metal layer 3 on the surface of the resist film 2 namely, the nickel film was removed.
- CH-1935 made by MEC was used for removing the nickel film.
- Melstrip made by Meltex, Inc., or SEEDLON process made by Ebara-Udylite may be used for removing the nickel film.
- a slight copper plating film formed on the surface of the resist film 2 could be removed simultaneously with the nickel film.
- the surface of the resist film 2 namely, the copper plating film on the areas 3 c other than the trenches 3 a does not have to be removed, and thus the production of a wiring plate having a copper wiring with a depth of 10 ⁇ m and widths of 7 to 100 ⁇ m became easy.
- Example 2 by the inventors of this application is described.
- a polyimide film with a thickness of 25 ⁇ m (Kapton EN made by DuPont-Toray Co., Ltd.) was prepared as the substrate 1 , and a copper foil 5 with a thickness of 12 ⁇ m was stuck to its surface.
- the surface of the copper foil 5 was subject to the surface roughening treatment.
- the surface roughening treatment is similar to that in the example 1.
- the surface roughness of the copper foil 5 was measured by the surface roughness measuring device. As shown in FIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 ⁇ m, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 0.8 ⁇ m.
- the resist film 2 was formed on the roughened surface of the copper foil 5 .
- V-259PA made by Nippon Steel Chemical Co., Ltd. was used as the resist.
- the thickness of the resist film was 10 ⁇ m.
- concave sections 2 a with diameters of 20 to 200 ⁇ m were formed on positions on the resist film 2 where the vias should be arranged, by the photolithography method.
- the first metal layer 3 as a seed layer for the electroplating was formed.
- the metal layer 3 was formed on the substrate surface, namely, in the concave sections 3 b and the areas 3 c other than the concave sections 3 b .
- the first metal layer 3 is a nickel film formed by electroless nickel plating.
- TOP CHEMI ALLOY 66 made by Okuno Chemical Industries was used.
- the film thickness of the nickel was 200 nm.
- the surface roughness in the concave sections 3 b and the surface roughness on the areas 3 c other than the concave sections 3 b were measured by the surface roughness measuring device.
- the surface roughness in the concave sections 3 b was the same as the surface roughness on the surface of the substrate 1 measured after the surface roughening treatment.
- the arithmetic average roughness Ra defined by JISB0601 was 0.002 ⁇ m and the average length RSm of the roughness curvilinear element defined by JISB0601 was 27 ⁇ m on the areas 3 c other than the concave section 3 b.
- the second metal layer 4 was formed by electrolytic copper plating.
- the second metal layer 4 is a copper plating film.
- the plating conditions are as shown in FIG. 8 .
- the plating time was 10 minutes, the current density was 1.0 A/dm 2 , and the temperature of the plating solution was 25° C.
- the first metal layer 3 on the surface of the resist film 2 namely, the nickel film was removed.
- the nickel film was removed by the method similar to that in the example 1.
- the removal of the copper plating film is not necessary on the surface of the resist film 2 , namely, the areas 3 c other than the concave sections 3 b .
- the production of the wiring plate having the vias with diameters of 20 to 200 ⁇ m became easy.
- the production method for the vias according to the present invention is described with reference to FIGS. 3A to 3G .
- the example 3 by the inventors of this application is described.
- the example 3 is similar to the example 2 except that the roughening treatment step for copper foil is executed after the resist concave section is formed.
- a polyimide film with a thickness of 25 ⁇ m was prepared as the substrate 1 , and a copper foil 5 with a thickness of 12 ⁇ m was stuck to its surface.
- the resist film 2 was formed on the surface of the copper foil 5 .
- V-259PA made by Nippon Steel Chemical Co., Ltd. was used as the resist.
- the thickness of the resist film was 10 ⁇ m.
- the concave sections 2 a with diameters of 20 to 200 ⁇ m were formed on positions on the resist film 2 where the vias should be arranged, by the photolithography method.
- FIG. 3D the surface of the copper foil 5 was subject to the surface roughening treatment. That is to say, the copper foil 5 exposed in the concave sections 2 of the resist film 2 was subject to the surface roughening treatment.
- the surface roughening treatment is similar to that in the example 1.
- FIGS. 3E to 3G are similar to FIGS. 2E to 2G . That is to say, as shown in FIG. 3E , the first metal layer 3 as a seed layer for electroplating was formed.
- the second metal layer 4 was formed by electrolytic copper plating.
- the second metal layer 4 is the copper plating film.
- the plating conditions are as shown in FIG. 8 .
- the copper plating film thickness in the concave sections 3 b is represented by T 2 .
- the copper plating film thickness T 2 in the concave sections 3 b was 10 ⁇ m.
- the copper plating film thickness T 3 on the areas 3 c other than the concave sections 3 b was not more than 0.001 ⁇ m. In the example 3, therefore, it was found that the copper plating film grew selectively in the concave sections 3 b on the substrate, and that the copper is hardly precipitated on the areas 3 c other than the concave sections 3 b , namely, on the surface of the substrate.
- the first metal layer 3 on the surface of the resist film 2 namely, the nickel film was removed.
- the removal of the copper plating film is not necessary on the surface of the resist film 2 , namely, the areas 3 c other than the concave sections 3 b .
- the production of the wiring plate having the vias with diameters of 20 to 200 ⁇ m became easy.
- Example 4 by the inventors of this application is described.
- a polyimide film (UPILEX made by Ube Industries) with a thickness of 50 ⁇ m was prepared as the substrate 1 .
- the trenches 1 a with a depth of 7 ⁇ m and widths of 7 to 100 ⁇ m were formed along the wiring pattern on the surface of the substrate 1 by using excimer laser.
- the surface roughness in the trenches 1 a on the substrate 1 was measured by the surface roughness measuring device. As shown in FIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.05 ⁇ m, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 0.2 ⁇ m.
- the first metal layer 3 was formed by the sputtering method.
- the metal layer 3 was formed on the surface of the substrate, namely, in the trenches 3 a and on the areas 3 c other than the trenches 3 a .
- the first metal layer is a nickel film containing 25% of chromium. The film thickness was 100 nm.
- the surface roughness in the trenches 3 a and the surface roughness on the areas 3 c other than the trenches 3 a were measured by the surface measuring device.
- the surface roughness in the trenches 3 a was the same as the surface roughness before the first metal layer 3 was formed.
- the arithmetic average roughness Ra defined by JISB0601 was 0.001 ⁇ m
- the average length RSm of the roughness curvilinear element defined by JISB0601 was 34 ⁇ m.
- the second metal layer 4 was formed by electrolytic copper plating.
- the second metal layer 4 is a copper plating film.
- the plating conditions are as shown in FIG. 8 .
- the plating time was 5 minutes, the current density was 2.0 A/dm 2 , and the temperature of the plating solution was 25° C.
- the wiring cross-section was observed after the electrolytic copper plating.
- the thickness T 1 of the copper plating film in the trenches 3 a was 7 ⁇ m.
- the thickness T 3 of the copper plating film on the areas 3 c other than the trenches 3 a was not more than 0.001 ⁇ m. In the example 4, therefore, it was found that the copper plating film grew selectively in the trenches 3 a on the substrate, and that the copper was hardly precipitated on the areas 3 c other than the trenches 3 a , namely, on the substrate surface.
- the first metal layer 3 on the surface of the substrate 1 namely, the nickel film was removed.
- CH-1935 made by MEC was used for removing the nickel film.
- a slight copper plating film formed on the resist surface could be removed simultaneously along with the nickel film.
- the removal of the copper plating film on the surface of the substrate 1 , namely, on the areas 3 c other than the trenches 3 a was not necessary.
- the production for the wiring plate having the copper wiring with a depth of 7 ⁇ m and widths of 7 to 100 ⁇ m became easy.
- FIGS. 5A to 5G The production method for the wiring and the vias according to the present invention is described with reference to FIGS. 5A to 5G .
- the example 5 by the inventors of this application is described.
- a polyethylene terephthalate film with a thickness of 100 ⁇ m (TEFLEX made by Teijin DuPont Films) was used as the substrate 1 .
- This film contains the copper foil 5 .
- a trench 7 with a depth of 5 ⁇ m and widths of 5 to 100 ⁇ m was formed on the surface of the substrate 1 by a nanoimprint treatment using a nickel die 6 .
- a concave section 8 with a depth of 5 ⁇ m and a diameter of 5 ⁇ m was formed on a bottom surface of the trench 7 .
- the trench 7 was formed along the wiring pattern, and the concave section 8 was formed on a position where the vias should be formed.
- the surface roughness of the trench 7 and the concave section 8 was measured by the surface roughness measuring device. As shown in FIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 ⁇ m and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.1 ⁇ m.
- the resin on the bottom of the concave section 8 was removed by etching, so that the copper foil 5 was exposed.
- the surface of the exposed copper foil 5 was subject to the surface roughening treatment.
- the surface roughening treatment is similar to that in the example 1.
- the surface roughness of the exposed copper foil 5 was measured by the surface roughness measuring device. As shown in FIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 ⁇ m, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.1 ⁇ m.
- the first metal layer 3 was formed by the sputtering method.
- the metal layer 3 was formed on the surface of the substrate, namely, in the trench 3 b and the concave section 3 a and on the other areas 3 c .
- the first metal layer 3 in the example 5 was a titanium film, and its thickness was 50 nm.
- the surface roughness in the concave section 3 a and the trench section 3 b and on the other areas 3 c was measured by the surface roughness measuring device.
- the surface roughness of the copper foil in the trench section 3 b and the concave section 3 a was the same as the surface roughness measured before the first metal layer 3 was formed.
- the arithmetic average roughness defined by JISB0601 was 0.001 ⁇ m
- the average length RSm of the roughness curvilinear element defined by JISB0601 was 30 ⁇ m.
- the second metal layer 4 was formed by electrolytic copper plating.
- the second metal layer 4 was a copper plating film.
- the plating conditions are as shown in FIG. 8 .
- the plating time was 20 minutes, the current density was 0.5 A/dm 2 , and the temperature of the plating solution was 25° C.
- the wiring cross-section was observed after the electrolytic copper plating.
- the thickness T 1 of the copper plating film in the trench 3 a was 5 ⁇ m
- the thickness T 2 of the copper plating film in the concave section was 10 ⁇ m
- the thickness T 3 of the copper plating film on the areas which were not subject to the nanoimprint treatment, namely, the substrate surface was not more than 0.001 ⁇ m. Therefore, in the example 5, it was found that the copper plating film grew selectively in the trench 3 a on the substrate, and that the copper is hardly precipitated on the areas 3 c other than the trench 3 a , namely, the substrate surface.
- the first metal layer 3 on the substrate 1 namely, the nickel film was removed.
- CH-1935 made by MEC was used for removing the nickel film.
- a slight copper plating film formed on the resist surface could be removed simultaneously along with the nickel film.
- the removal of the copper plating film was not necessary on the surface of the substrate 1 , namely, the areas 3 c other than the trench 3 a .
- the production of the wiring plate collectively having the copper wiring with a depth of 5 ⁇ m and widths of 5 to 100 ⁇ m and the vias with a diameter of 5 ⁇ m became easy.
- FIG. 1A a liquid crystal polymer film with a thickness of 50 ⁇ m (BIAC made by Japan Gore-Tex, Inc.) was prepared as the substrate 1 .
- the surface of the substrate 1 was subject to the surface roughening treatment.
- a sandblast treatment which sprays alumina fine particles to the surface of the substrate 1 was used as the surface roughening treatment.
- the surface roughness on the surface of the substrate 1 was measured by the surface roughness measuring device. As shown in FIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.6 ⁇ m, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.5 ⁇ m.
- the resist film 2 was formed on the surface of the roughened substrate 1 .
- RY-3219 made by Hitachi Chemical Co., Ltd. was used as the resist.
- the thickness of the resist film was 5 ⁇ m.
- trenches 2a with widths of 5 to 100 ⁇ m were formed on the resist film 2 by the photolithography method.
- a first metal layer 3 as a seed layer for electroplating was formed.
- the first metal layer 3 was a copper film formed by the electroless plating.
- CUST-201 made by Hitachi Chemical Co., Ltd. was used as an electroless plating solution.
- the film thickness of the copper was 100 nm.
- the surface roughness in the trenches 3 a and the surface roughness on the areas 3 c other than the trenches 3 a were measured by the surface roughness measuring device.
- the surface roughness in the trenches 3 a was the same as the surface roughness on the surface of the substrate 1 measured after the surface roughening treatment.
- the arithmetic average roughness Ra defined by JISB0601 was 0.001 ⁇ m
- the average length RSm of the roughness curvilinear element defined by JISB0601 was 31 ⁇ m.
- the second metal layer 4 was formed by electrolytic copper plating.
- the second metal layer 4 is a copper plating film.
- the plating conditions are as shown in FIG. 8 .
- the plating time was 10 minutes, the current density was 1.0 A/dm 2 , and the temperature of the plating solution was 25° C.
- the wiring cross-section was observed after the electrolytic copper plating.
- the thickness T 1 of the copper plating film in the trenches 3 a was 10 ⁇ m.
- the thickness T 3 of the copper plating film on the areas 3 c other than the trenches 3 a was not more than 0.001 ⁇ m. In the example 6, therefore, it was found that the copper plating film grew selectively in the trenches 3 a on the substrate, and that the copper was hardly precipitated on the areas 3 c other than the trenches 3 a , namely on the substrate surface.
- the first metal layer 3 on the surface of the resist film 2 namely, the copper film was removed.
- CH-1935 made by MEC was used for removing the copper film.
- MECBRITE VE-7 100 series made by MEC was used for removing the nickel film. The slight copper plating film formed on the resist surface could be removed simultaneously along with the nickel film.
- the removal of the copper plating film was not necessary on the surface of the resist film 2 , namely, the areas 3 c other than the trenches 3 a .
- the production of the wiring plate having copper wiring with a depth of 10 ⁇ m and widths of 5 to 100 ⁇ m became easy.
- the production method for wiring according to the present invention is described with reference to FIGS. 1A to 1G .
- the examples 7 and 8 by the inventors of this application are described.
- the type of additive, the concentration of the additive and the plating current density in the examples 7 and 8 are different from those in the example 1. However, all the other things are similar to those in the example 1.
- the plating conditions are as shown in FIG. 8 .
- the wiring cross-section was observed after the electrolytic copper plating.
- the thickness T 1 of the copper plating film in the trenches 3 a was 10 m.
- the thickness T 3 of the copper plating film on the areas 3 c other than the trenches 3 a was not more than 0.001 ⁇ m. In the examples 7 and 8, therefore, it was found that the copper plating film grew selectively in the trenches 3 a on the substrate, and that the copper was hardly precipitated on the areas 3 c other than the trenches 3 a , namely, the substrate surface.
- the removal of the copper plating film was not necessary on the surface of the resist film 2 , namely, on the areas 3 c other than the trenches 3 a .
- the production for the wiring plate having copper wiring with a depth of 10 ⁇ m and widths of 7 to 100 ⁇ m became easy.
- Comparative example 1 is similar to the example 1 except that the plating solution does not contain an additive.
- the plating conditions are as shown in FIG. 8 .
- the wiring cross-section was observed after the electrolytic copper plating.
- the thickness T 1 of the copper plating film in the trenches 3 a was 2.1 ⁇ m.
- the thickness T 3 of the copper plating film on the areas 3 c other than the trenches 3 a was 2.2 ⁇ m.
- the copper plating film grew approximately uniformly in the trenches 3 a on the substrate and on the areas 3 c other than the trenches 3 a . That is to say, it was found that the copper with approximately the same thickness as that in the trenches 3 a was precipitated on the substrate surface.
- the removal of the copper plating film on the surface of the resist film 2 , namely, on the areas 3 c other than the trenches 3 a was necessary.
- the production for the wiring plate having copper wiring with a depth of 10 ⁇ m and widths of 7 to 100 ⁇ m became difficult.
Abstract
It is an object of the present invention to alleviate a work for removing an unnecessary metal layer when wiring and vias are formed on a substrate by electroplating.
An additive is added to a plating solution to be used for electroplating. The additive has a plating reaction suppressing capability, but has a characteristic that the plating reaction suppressing capability is reduced as the plating reaction progresses. The additive has a capability for increasing a metal deposition overpotential and has a characteristic that the metal deposition overpotential is reduced as the reaction progresses. As a result, the metal can be deposited selectively in a trench and a via formed on the substrate. When a wiring and a via are formed on the substrate, the trench and the via having a predetermined surface roughness are formed on the substrate.
Description
- 1. Field of the Invention
- The present invention relates to a technique which produces fine wiring and vias on a substrate by means of electroplating.
- 2. Description of the Related Art
- A demand for miniaturization of a wiring pitch of copper wiring to 20 or less μm has strongly increased also in chip-on-films (COF) and semiconductor package substrates due to downsizing of electronic devices. It has been difficult to keep good ion migration resistance according to the progress in the miniaturization of the wiring pitch.
- In recent years, as a method for producing fine wiring and via holes (vias) on a substrate, an electroplating method has been used. The electroplating method has advantages such as lower cost, higher throughput and more excellent mass productivity than a physical vapor deposition (PVD) method and a chemical vapor deposition (CVD) method. Various known methods for producing wiring and vias on a substrate using the electroplating include a Damascene method. In the Damascene method, first of all trenches and vias are formed on a substrate using a suitable method. The trenches and vias, which are concave section, are produced in a shape corresponding to a wiring pattern and via holes, and are formed on a position where a wirings and via holes should be arranged. Next, metal is deposited on the surface of the substrate by electroplating. The deposited metal fills the trenches and the vias. The deposited metal which fills the trench and the vias forms wirings and via holes.
- Japanese Patent Application Laid-Open No. 2006-210565
- Japanese Patent Application Laid-Open No. 2006-206950
- Japanese Patent Application Laid-Open No. 2002-155390
- The metal deposited by electroplating, however, covers not only the trenches and the vias on the substrate but also portions other than the trench and the vias After the electroplating is carried out, therefore, a process of removing an unnecessary metal layer is necessary. This metal removing process called chemical mechanical polishing (CMP). CMP process is complicated and high cost because it is difficult to accurately remove this unnecessary metal layer.
- It is an object of the present invention to alleviate a work for removing an unnecessary metal layer when wiring and vias are produced on a substrate by electroplating.
- According to the present invention, an additive is added to a plating solution to be used for electroplating. The additive has a plating reaction suppressing capability and has a characteristic that the plating reaction suppressing capability is reduced as the plating reaction progresses. As a result, metal can be deposited selectively in a trench and a via formed on the substrate.
- According to the present invention, in a polarization curve of the plating solution to be used for the electroplating, when an electric potential shifts a first electric potential E1 to a more negative second electric potential E2 at 1000 rpm of rotational speed, a current density abruptly increases. In a potential region between the first electric potential E1 and the second electric potential E2, the polarization curve at 1000 rpm crosses the polarization curve at the 0 rpm.
- According to the present invention, when a wiring and a via are formed on the substrate by a Damascene method, a trench and a via having a predetermined surface roughness are formed on the substrate.
- According to the present invention, when the wiring and the via hole are formed on the substrate by electroplating, a work for removing an unnecessary metal layer can be reduced.
-
FIGS. 1A to 1G are diagrams explaining a production method for wiring according to the present invention; -
FIGS. 2A to 2G are diagrams explaining a production method for vias according to the present invention; -
FIGS. 3A to 3G are diagrams explaining the production method for the vias according to the present invention; -
FIGS. 4A to 4E are diagrams explaining the production method for wiring according to the present invention; -
FIGS. 5A to 5G are diagrams explaining the production method for the wiring and the vias according to the present invention; -
FIG. 6 is a cross-sectional view illustrating evaluation positions of copper plated film thicknesses of the wiring and a via plate according to the present invention; -
FIG. 7 is a diagram explaining a characteristic of a plating solution according to the present invention; and -
FIG. 8 is a diagram illustrating plating conditions of the production method for the wiring and the vias according to examples of the present invention. -
- 1: substrate
- 2: resist
- 3: first metal layer (seed layer)
- 4: second metal layer (copper plating film)
- 5: copper foil
- 6: mold
- 7: trench
- 8: via
- An outline of the present invention is described. According to the present invention, an additive is added to a plating solution to be used for electroplating. An acid copper sulfate solution may be used as the plating solution. The acid copper sulfate solution to be used for the electroplating is publicly known, and its details are not described here. When the acid copper sulfate solution is used, wiring and via holes are produced by copper. Wiring and via holes may be produced by metal other than copper. For example, nickel, aluminum and the like can be used. In this case, a metal solution whose metal is a raw material of the wiring and the vias is used as the plating solution. Metal to be used for a conductive layer as a seed layer for the electroplating may be copper, but other metals than copper, such as nickel, cobalt, chromium, tungsten, palladium, titanium and metal alloy containing at least one of these metals may be used.
- According to the present invention, the additive has a capability for suppressing plating reaction, but has a characteristic such that the plating reacting suppressing capability is reduced as the plating reaction progresses. Any additive may be used as long as it has such a capability and a characteristic. Inventors of this application find out that cyanine dye and its derivative have such a capability and a characteristic. The cyanine dye is expressed by the following formula, where n is any one of 0, 1, 2 and 3.
- As the additive to be used for copper plating, a substance which seppress the plating reaction and loses a plating reaction suppressing effect simultaneously with the progression of the plating reaction is suitable. The effect of the additive for suppressing the plating reaction can be checked by seeing if deposition overpotential of metal becomes higher when the additive is added to the plating solution. The effect that the additive loses the plating reaction suppressing effect simultaneously with the progression of the plating reaction can be checked by the fact that as a flow rate of the plating solution is higher, the deposition overpotential of the metal to be plated becomes higher. This means that as a supply speed of the additive to a first metal layer surface is higher, the plating reaction suppressing effect becomes higher. When the additive loses the plating reaction suppressing effect, the additive is decomposed and is changed into another substance or is reduced so as to be changed into a substance having a different oxidation number.
- The reason why plating can be deposited in the concave section (the trench and the via) approximately selectively by carrying out plating using the plating solution containing such an additive is described below. When plating is carried out by using such an additive, the additive loses its effect on the surface of the first metal layer simultaneously with the progression of the plating reaction. As a result, an effective additive concentration relating to the plating reaction is reduced on the surface of the first metal layer. When the concentration of the additive is reduced, the additive is supplied by diffusion from the solution. At this time, the reduction speed of the additive concentration differs between the concave section and the substrate surface. Since unevenness is formed on the first metal layer in the concave section, its surface area is comparatively larger than that of the substrate surface. Therefore, the reduction speed of the additive concentration is high in the concave section. A distance from an bulk plating solution in the concave section is longer than that in the substrate surface. Therefore, the supply of the additive is slow in the concave section, and the increase speed of the additive concentration due to diffusion is low. For this reason, a state that its additive concentration is lower than that in the substrate surface is maintained in the concave section. Since this additive has the plating reaction suppressing effect, the plating reaction in the concave section where the additive concentration is low is not suppressed, and a plating film can be grown selectively in the concave section.
- In the plating solution having such a characteristic, it is preferably that a rotating disk electrode has a potential area where a current value at 1000 rpm is 1/100 or less than that at the time of rest in a polarization curve obtained by measurement on the rotating disk electrode. In such a plating solution, as shown in
FIG. 7 , current density B at 1000 rpm is 1/100 or less than current density A at 0 rpm at a certain electric potential E′. - The plating solution having such a polarization curve enables metal to be deposited selectively in the trench and the via on the substrate.
- According to the present invention, wiring and via holes are produced on the substrate by the Damascene method. Surface roughness in the trench and the via formed on the substrate is described together with the Damascene method. As a guidepost of the roughness, arithmetic average roughness Ra defined by JISB0601, and an average length RSm of a roughness curvilinear element defined by JISB0601 are known. According to the Damascene method, a trench and a via are formed on the substrate by a suitable method. The trench is formed in a shape corresponding to a wiring, and the via is formed on a position where the via holes are arranged. According to the present invention, the trench and the via are formed so as to have a predetermined surface roughness. The first metal layer as a seed layer for electroplating is formed on the substrate with the trench and the via formed thereon. A second metal layer is formed on the substrate surface by electroplating.
- Before the electroplating is carried out, the surface roughness of the substrate with the first metal layer formed thereon was measured. As a result, the arithmetic average roughness Ra is 0.01 to 4 μm, and preferably 0.01 to 1.0 μm, in the trench and the via. The average length RSm of the rough curvilinear element is 0.005 to 8 μm, and preferably 0.01 to 2.0 μm. The arithmetic average roughness Ra on the area other than the trench and the via, namely, the substrate surface is preferably 0.001 to 0.002 μm. The average length RSm of the roughness curvilinear element is 10 to 50 μm, and preferably 20 to 40 μm.
- The arithmetic average roughness Ra in the trench and the concave section is larger than the arithmetic average roughness Ra of the area other than the trench and the concave section, namely, the substrate surface. The arithmetic average roughness Ra in the trench and the via is ten or more times as large as the arithmetic average roughness Ra of the area other than the trench and the via. The average length RSm of the roughness curvilinear element in the trench and the via is smaller than the average length RSm of the roughness curvilinear element on the area other than the trench and the via, namely, the substrate surface. The average length RSm of the roughness curvilinear element in the trench and the via is 1/10 or less of the average length RSm of the roughness curvilinear element on the area other than the trench and the via.
- The surface roughness in the trench and the via on the substrate hardly changes before and after the first metal layer is formed. Therefore, by forming the trench and the via having a desired surface roughness on the substrate previously, the trench and the via having a desired surface roughness can be obtained after the first metal layer is formed.
- The trench and the via having a desired surface roughness are formed on the substrate, and the first metal layer is formed thereon. Further, the electroplating is carried out by using the plating solution to which the additive is added according to the present invention, so that metal can be precipitated selectively in the trench and the via on the substrate. The metal is not deposited on the area of the substrate other than the trench and the via, namely, the substrate surface. Therefore, the work for removing the metal deposited on the substrate surface can be alleviated. The present invention can be applied to formation of a copper wiring and a through silicon via technology in 3D packages.
- An example of the electroplating carried out by the inventors of this application is described below. The inventors of this application conducted experiments of the electroplating in examples 1 to 8 and a comparative example 1. The examples 1 to 8 are electroplating experiments using the plating solution of the present invention to which the additive is added. The comparative example 1 is the electroplating experiment using a conventional plating solution. The plating solution was prepared by adding sulfuric acid with a concentration of 180 g/dm3 to copper sulfate pentahydrate with a concentration of 150 g/dm3. The additive of the present invention was added to this plating solution so that the plating solution of the present invention was prepared.
-
FIG. 8 illustrates experimental conditions and experimental results of the examples 1 to 8 and the comparative example 1. Symbols described in a column of additive type represent the following chemical substances. - A-1:
- 2-[(1,3-Dihydro-1,3,3-trimethyl-2H-indol-2-ylidene)-methyl]-1,3,3-trimethyl-3H-indolium perchlorate
- A-2:
- 2-[3-(1,3-Dihydro-1,3,3-trimethyl-2H-indol-2-ylidene)-1-propenyl]-1,3,3-trimethyl-3H-indolium chloride
- A-3:
- 2-[5-(1,3-Dihydro-1,3,3-trimethyl-2H-indol-2-ylidene)-1,3-pentadienyl]-1,3,3-trimethyl-3H-indolium iodide
- A-4:
- 2-[7-(1,3-Dihydro-1,3,3-trimethyl-2H-indol-2-ylidene)-1,3,5-heptatrienyl]-1,3,3-trimethyl-3H-indolium iodide
- B: 3-Ethyl-2-[5-(3-ethyl-2(3H)-benzothiazolylidene)-1,3-pentadienyl]benzothiazolium iodide
- C: Janus Green B
- The arithmetic average roughness Ra defined by JISB0601 and the average length RSm of the roughness curvilinear element defined by JISB0601 are measured values of the surface roughness in the trench and the via on the substrate, which values were measured after the first metal layer being formed.
- A production method for the wiring according to the present invention is described with reference to
FIGS. 1A to 1G . The example 1 by the inventors of this application is described. As shown inFIG. 1A , a polyimide film (Kapton EN made by DuPont-Toray Co., Ltd.) having a thickness of 25 μm was prepared as thesubstrate 1. - As shown in
FIG. 1B , the surface of thesubstrate 1 was subject to a surface roughening treatment. A sandblast treatment for spraying alumina fine particulates to the surface of thesubstrate 1 was used for the surface roughening treatment. One of a chemical surface roughening treatment, an electric surface roughening treatment and a mechanical surface roughening treatment, or their combinations may be used as the surface roughening treatment. The chemical surface roughening treatment includes an alkali etching treatment using an alkali solution such as a NaOH aqueous solution, an oxidation treatment using acid salt such as permanganate, bichromate, persulfate, hypochlorite, chlorite or chlorate, and etching using hydrazine. The electric surface roughening treatment includes a plasma treatment in vacuum, a corona treatment in the atmosphere, and like. The mechanical roughening treatment includes brushing using a wire brush, and like. - After the surface roughening treatment, the surface roughness on the surface of the
substrate 1 was measured by a surface roughness measuring device. As shown inFIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.1 μm. - As shown in
FIG. 1C , a resistfilm 2 was formed on the roughened surface of thesubstrate 1. V-259PA made by Nippon Steel Chemical Co., Ltd. was used as the resist. As the resist, RY-3219 made by Hitachi Chemical Co., Ltd., or SPG-202 made by Asahikasei EMD corporation can be used. The thickness of the resist film was 10 μm. - As show in
FIG. 1D ,trenches 2 a with widths of 7 to 100 μm were formed along the wiring pattern on the resistfilm 2 by a photolithography method. - As shown in
FIG. 1E , afirst metal layer 3 as a seed layer for electroplating was formed. Themetal layer 3 was formed on the substrate surface, namely, in thetrenches 3 a and onareas 3 c other than thetrenches 3 a. In this example, thefirst metal layer 3 is a nickel film formed by electroless nickel plating. As an electroless nickel plating solution, TOP CHEMI ALLOY 66 made by Okuno Chemical Industries was used. The film thickness of the nickel was 200 nm. As the seed layer forming method, not only the electroless nickel plating method but also an evaporation method, a sputtering method or a chemical vapor deposition (CVD) method may be used. As the first metal layer, not only the nickel film but also a chromium film, a tungsten film, a palladium film or a titanium film, or their alloy film can be used. - After the
first metal layer 3 was formed, the surface roughness in thetrenches 3 a and the surface roughness of theareas 3 c other than thetrenches 3 a were measured by the surface roughness measuring device. The surface roughness in thetrenches 3 a were the same as the surface roughness on the surface of thesubstrate 1 measured after the surface roughening treatment. The arithmetic average roughness Ra defined by JISB0601 was 0.001 μm, and average length RSm of the roughness curvilinear element defined by JISB0601 was 34 μm on theareas 3 c other than thetrenches 3 a. - As shown in
FIG. 1F , asecond metal layer 4 was formed by electrolytic copper plating. Thesecond metal layer 4 is a copper plating film. The plating conditions are as shown inFIG. 8 . Plating time was 10 minutes, current density was 1.0 A/dm2, and temperature of the plating solution was 25° C. - After the electrolytic copper plating, a wiring cross-section was observed. As shown in
FIG. 6 , the thickness of the copper plating film in thetrenches 3 a is represented by T1, and the thickness of the copper plating film on theareas 3 c other than thetrenches 3 a is represented by T3. In the example 1, the thickness T1 of the copper plating film in thetrenches 3 a was 10 m. The thickness T3 of the copper plating film on theareas 3 c other than thetrenches 3 a was not more than 0.001 μm. In the example 1, therefore, it was found that the copper plating film grew selectively in thetrenches 3 a on the substrate, but that the copper was hardly precipitated on theareas 3 c other than thetrenches 3 a, namely, the substrate surface. - As shown in
FIG. 1G , thefirst metal layer 3 on the surface of the resistfilm 2, namely, the nickel film was removed. CH-1935 made by MEC was used for removing the nickel film. Melstrip made by Meltex, Inc., or SEEDLON process made by Ebara-Udylite may be used for removing the nickel film. A slight copper plating film formed on the surface of the resistfilm 2 could be removed simultaneously with the nickel film. - In the example 1, the surface of the resist
film 2, namely, the copper plating film on theareas 3 c other than thetrenches 3 a does not have to be removed, and thus the production of a wiring plate having a copper wiring with a depth of 10 μm and widths of 7 to 100 μm became easy. - The production method for the vias according to the present invention is described with reference to
FIGS. 2A to 2G . Example 2 by the inventors of this application is described. As shown inFIG. 2A , a polyimide film with a thickness of 25 μm (Kapton EN made by DuPont-Toray Co., Ltd.) was prepared as thesubstrate 1, and acopper foil 5 with a thickness of 12 μm was stuck to its surface. - As shown in
FIG. 2B , the surface of thecopper foil 5 was subject to the surface roughening treatment. The surface roughening treatment is similar to that in the example 1. - After the surface roughening treatment, the surface roughness of the
copper foil 5 was measured by the surface roughness measuring device. As shown inFIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 0.8 μm. - As shown in
FIG. 2C , the resistfilm 2 was formed on the roughened surface of thecopper foil 5. V-259PA made by Nippon Steel Chemical Co., Ltd. was used as the resist. The thickness of the resist film was 10 μm. - As shown in
FIG. 2D ,concave sections 2 a with diameters of 20 to 200 μm were formed on positions on the resistfilm 2 where the vias should be arranged, by the photolithography method. - As shown in
FIG. 2E , thefirst metal layer 3 as a seed layer for the electroplating was formed. Themetal layer 3 was formed on the substrate surface, namely, in theconcave sections 3 b and theareas 3 c other than theconcave sections 3 b. In this example, thefirst metal layer 3 is a nickel film formed by electroless nickel plating. As an electroless nickel plating solution, TOP CHEMI ALLOY 66 made by Okuno Chemical Industries was used. The film thickness of the nickel was 200 nm. - After the
first metal layer 3 was formed, the surface roughness in theconcave sections 3 b and the surface roughness on theareas 3 c other than theconcave sections 3 b were measured by the surface roughness measuring device. The surface roughness in theconcave sections 3 b was the same as the surface roughness on the surface of thesubstrate 1 measured after the surface roughening treatment. The arithmetic average roughness Ra defined by JISB0601 was 0.002 μm and the average length RSm of the roughness curvilinear element defined by JISB0601 was 27 μm on theareas 3 c other than theconcave section 3 b. - As shown in
FIG. 2F , thesecond metal layer 4 was formed by electrolytic copper plating. Thesecond metal layer 4 is a copper plating film. The plating conditions are as shown inFIG. 8 . The plating time was 10 minutes, the current density was 1.0 A/dm2, and the temperature of the plating solution was 25° C. - As show in
FIG. 2G , thefirst metal layer 3 on the surface of the resistfilm 2, namely, the nickel film was removed. The nickel film was removed by the method similar to that in the example 1. - In the example 2, the removal of the copper plating film is not necessary on the surface of the resist
film 2, namely, theareas 3 c other than theconcave sections 3 b. As a result, the production of the wiring plate having the vias with diameters of 20 to 200 μm became easy. - The production method for the vias according to the present invention is described with reference to
FIGS. 3A to 3G . The example 3 by the inventors of this application is described. The example 3 is similar to the example 2 except that the roughening treatment step for copper foil is executed after the resist concave section is formed. As shown inFIG. 3A , a polyimide film with a thickness of 25 μm (Kapton EN made by DuPont-Toray Co., Ltd.) was prepared as thesubstrate 1, and acopper foil 5 with a thickness of 12 μm was stuck to its surface. - As shown in
FIG. 3B , the resistfilm 2 was formed on the surface of thecopper foil 5. V-259PA made by Nippon Steel Chemical Co., Ltd. was used as the resist. The thickness of the resist film was 10 μm. - As shown in
FIG. 3C , theconcave sections 2 a with diameters of 20 to 200 μm were formed on positions on the resistfilm 2 where the vias should be arranged, by the photolithography method. - As shown in
FIG. 3D , the surface of thecopper foil 5 was subject to the surface roughening treatment. That is to say, thecopper foil 5 exposed in theconcave sections 2 of the resistfilm 2 was subject to the surface roughening treatment. The surface roughening treatment is similar to that in the example 1.FIGS. 3E to 3G are similar toFIGS. 2E to 2G . That is to say, as shown inFIG. 3E , thefirst metal layer 3 as a seed layer for electroplating was formed. As shown inFIG. 3F , thesecond metal layer 4 was formed by electrolytic copper plating. Thesecond metal layer 4 is the copper plating film. The plating conditions are as shown inFIG. 8 . - The wiring cross-section was observed after the electrolytic copper plating. As shown in
FIG. 6 , the copper plating film thickness in theconcave sections 3 b is represented by T2. In the example 3, the copper plating film thickness T2 in theconcave sections 3 b was 10 μm. The copper plating film thickness T3 on theareas 3 c other than theconcave sections 3 b was not more than 0.001 μm. In the example 3, therefore, it was found that the copper plating film grew selectively in theconcave sections 3 b on the substrate, and that the copper is hardly precipitated on theareas 3 c other than theconcave sections 3 b, namely, on the surface of the substrate. - As shown in
FIG. 3G , thefirst metal layer 3 on the surface of the resistfilm 2, namely, the nickel film was removed. In the example 3, the removal of the copper plating film is not necessary on the surface of the resistfilm 2, namely, theareas 3 c other than theconcave sections 3 b. As a result, the production of the wiring plate having the vias with diameters of 20 to 200 μm became easy. - The production method for wiring according to the present invention is described with reference to
FIGS. 4A to 4E . Example 4 by the inventors of this application is described. As shown inFIG. 4A , a polyimide film (UPILEX made by Ube Industries) with a thickness of 50 μm was prepared as thesubstrate 1. - As shown in
FIG. 4B , the trenches 1 a with a depth of 7 μm and widths of 7 to 100 μm were formed along the wiring pattern on the surface of thesubstrate 1 by using excimer laser. - The surface roughness in the trenches 1 a on the
substrate 1 was measured by the surface roughness measuring device. As shown inFIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.05 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 0.2 μm. - As shown in
FIG. 4C , thefirst metal layer 3 was formed by the sputtering method. Themetal layer 3 was formed on the surface of the substrate, namely, in thetrenches 3 a and on theareas 3 c other than thetrenches 3 a. The first metal layer is a nickel film containing 25% of chromium. The film thickness was 100 nm. - After the
first metal layer 3 was formed, the surface roughness in thetrenches 3 a and the surface roughness on theareas 3 c other than thetrenches 3 a were measured by the surface measuring device. The surface roughness in thetrenches 3 a was the same as the surface roughness before thefirst metal layer 3 was formed. On theareas 3 c other than thetrenches 3 a, the arithmetic average roughness Ra defined by JISB0601 was 0.001 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 34 μm. - As shown in
FIG. 4D , thesecond metal layer 4 was formed by electrolytic copper plating. Thesecond metal layer 4 is a copper plating film. The plating conditions are as shown inFIG. 8 . The plating time was 5 minutes, the current density was 2.0 A/dm2, and the temperature of the plating solution was 25° C. - The wiring cross-section was observed after the electrolytic copper plating. In the example 4, the thickness T1 of the copper plating film in the
trenches 3 a was 7 μm. The thickness T3 of the copper plating film on theareas 3 c other than thetrenches 3 a was not more than 0.001 μm. In the example 4, therefore, it was found that the copper plating film grew selectively in thetrenches 3 a on the substrate, and that the copper was hardly precipitated on theareas 3 c other than thetrenches 3 a, namely, on the substrate surface. - As shown in
FIG. 4E , thefirst metal layer 3 on the surface of thesubstrate 1, namely, the nickel film was removed. CH-1935 made by MEC was used for removing the nickel film. A slight copper plating film formed on the resist surface could be removed simultaneously along with the nickel film. - In the example 4, the removal of the copper plating film on the surface of the
substrate 1, namely, on theareas 3 c other than thetrenches 3 a was not necessary. As a result, the production for the wiring plate having the copper wiring with a depth of 7 μm and widths of 7 to 100 μm became easy. - The production method for the wiring and the vias according to the present invention is described with reference to
FIGS. 5A to 5G . The example 5 by the inventors of this application is described. As shown inFIG. 5A , a polyethylene terephthalate film with a thickness of 100 μm (TEFLEX made by Teijin DuPont Films) was used as thesubstrate 1. This film contains thecopper foil 5. - As shown in
FIG. 5B , atrench 7 with a depth of 5 μm and widths of 5 to 100 μm was formed on the surface of thesubstrate 1 by a nanoimprint treatment using anickel die 6. At the same time, aconcave section 8 with a depth of 5 μm and a diameter of 5 μm was formed on a bottom surface of thetrench 7. Thetrench 7 was formed along the wiring pattern, and theconcave section 8 was formed on a position where the vias should be formed. - After the nanoimprint treatment, the surface roughness of the
trench 7 and theconcave section 8 was measured by the surface roughness measuring device. As shown inFIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 μm and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.1 μm. - As shown in
FIG. 5C , the resin on the bottom of theconcave section 8 was removed by etching, so that thecopper foil 5 was exposed. As shown inFIG. 5D , the surface of the exposedcopper foil 5 was subject to the surface roughening treatment. The surface roughening treatment is similar to that in the example 1. - After the surface roughening treatment, the surface roughness of the exposed
copper foil 5 was measured by the surface roughness measuring device. As shown inFIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.4 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.1 μm. - As shown in
FIG. 5E , thefirst metal layer 3 was formed by the sputtering method. Themetal layer 3 was formed on the surface of the substrate, namely, in thetrench 3 b and theconcave section 3 a and on theother areas 3 c. Thefirst metal layer 3 in the example 5 was a titanium film, and its thickness was 50 nm. - After the
first metal layer 3 was formed, the surface roughness in theconcave section 3 a and thetrench section 3 b and on theother areas 3 c was measured by the surface roughness measuring device. The surface roughness of the copper foil in thetrench section 3 b and theconcave section 3 a was the same as the surface roughness measured before thefirst metal layer 3 was formed. On theareas 3 c other than the trench section and the concave section, namely, the substrate surface, the arithmetic average roughness defined by JISB0601 was 0.001 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 30 μm. - As shown in
FIG. 5F , thesecond metal layer 4 was formed by electrolytic copper plating. Thesecond metal layer 4 was a copper plating film. The plating conditions are as shown inFIG. 8 . The plating time was 20 minutes, the current density was 0.5 A/dm2, and the temperature of the plating solution was 25° C. - The wiring cross-section was observed after the electrolytic copper plating. In the example 5, the thickness T1 of the copper plating film in the
trench 3 a was 5 μm, the thickness T2 of the copper plating film in the concave section was 10 μm. The thickness T3 of the copper plating film on the areas which were not subject to the nanoimprint treatment, namely, the substrate surface was not more than 0.001 μm. Therefore, in the example 5, it was found that the copper plating film grew selectively in thetrench 3 a on the substrate, and that the copper is hardly precipitated on theareas 3 c other than thetrench 3 a, namely, the substrate surface. - As shown in
FIG. 5G , thefirst metal layer 3 on thesubstrate 1, namely, the nickel film was removed. CH-1935 made by MEC was used for removing the nickel film. A slight copper plating film formed on the resist surface could be removed simultaneously along with the nickel film. - In the example 5, the removal of the copper plating film was not necessary on the surface of the
substrate 1, namely, theareas 3 c other than thetrench 3 a. As a result, the production of the wiring plate collectively having the copper wiring with a depth of 5 μm and widths of 5 to 100 μm and the vias with a diameter of 5 μm became easy. - The production method for wiring according to the present invention is described again with reference to
FIGS. 1A to 1G . The example 6 by the inventors of this application is described. As shown inFIG. 1A , a liquid crystal polymer film with a thickness of 50 μm (BIAC made by Japan Gore-Tex, Inc.) was prepared as thesubstrate 1. - As shown in
FIG. 1B , the surface of thesubstrate 1 was subject to the surface roughening treatment. A sandblast treatment which sprays alumina fine particles to the surface of thesubstrate 1 was used as the surface roughening treatment. - After the surface roughening treatment, the surface roughness on the surface of the
substrate 1 was measured by the surface roughness measuring device. As shown inFIG. 8 , the arithmetic average roughness Ra defined by JISB0601 was 0.6 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 1.5 μm. - As shown in
FIG. 1C , the resistfilm 2 was formed on the surface of the roughenedsubstrate 1. RY-3219 made by Hitachi Chemical Co., Ltd. was used as the resist. The thickness of the resist film was 5 μm. - As show in
FIG. 1D ,trenches 2a with widths of 5 to 100 μm were formed on the resistfilm 2 by the photolithography method. - As shown in
FIG. 1E , afirst metal layer 3 as a seed layer for electroplating was formed. Thefirst metal layer 3 was a copper film formed by the electroless plating. CUST-201 made by Hitachi Chemical Co., Ltd. was used as an electroless plating solution. The film thickness of the copper was 100 nm. - After the
first metal layer 3 was formed, the surface roughness in thetrenches 3 a and the surface roughness on theareas 3 c other than thetrenches 3 a were measured by the surface roughness measuring device. The surface roughness in thetrenches 3 a was the same as the surface roughness on the surface of thesubstrate 1 measured after the surface roughening treatment. On theareas 3 c other than thetrenches 3 a, the arithmetic average roughness Ra defined by JISB0601 was 0.001 μm, and the average length RSm of the roughness curvilinear element defined by JISB0601 was 31 μm. - As shown in
FIG. 1F , thesecond metal layer 4 was formed by electrolytic copper plating. Thesecond metal layer 4 is a copper plating film. The plating conditions are as shown inFIG. 8 . The plating time was 10 minutes, the current density was 1.0 A/dm2, and the temperature of the plating solution was 25° C. - The wiring cross-section was observed after the electrolytic copper plating. In the example 6, the thickness T1 of the copper plating film in the
trenches 3 a was 10 μm. The thickness T3 of the copper plating film on theareas 3 c other than thetrenches 3 a was not more than 0.001 μm. In the example 6, therefore, it was found that the copper plating film grew selectively in thetrenches 3 a on the substrate, and that the copper was hardly precipitated on theareas 3 c other than thetrenches 3 a, namely on the substrate surface. - As shown in
FIG. 1G , thefirst metal layer 3 on the surface of the resistfilm 2, namely, the copper film was removed. CH-1935 made by MEC was used for removing the copper film. MECBRITE VE-7 100 series made by MEC was used for removing the nickel film. The slight copper plating film formed on the resist surface could be removed simultaneously along with the nickel film. - In the example 6, the removal of the copper plating film was not necessary on the surface of the resist
film 2, namely, theareas 3 c other than thetrenches 3 a. As a result, the production of the wiring plate having copper wiring with a depth of 10 μm and widths of 5 to 100 μm became easy. - The production method for wiring according to the present invention is described with reference to
FIGS. 1A to 1G . The examples 7 and 8 by the inventors of this application are described. The type of additive, the concentration of the additive and the plating current density in the examples 7 and 8 are different from those in the example 1. However, all the other things are similar to those in the example 1. The plating conditions are as shown inFIG. 8 . - The wiring cross-section was observed after the electrolytic copper plating. In the examples 7 and 8, the thickness T1 of the copper plating film in the
trenches 3 a was 10 m. The thickness T3 of the copper plating film on theareas 3 c other than thetrenches 3 a was not more than 0.001 μm. In the examples 7 and 8, therefore, it was found that the copper plating film grew selectively in thetrenches 3 a on the substrate, and that the copper was hardly precipitated on theareas 3 c other than thetrenches 3 a, namely, the substrate surface. - In the examples 7 and 8, the removal of the copper plating film was not necessary on the surface of the resist
film 2, namely, on theareas 3 c other than thetrenches 3 a. As a result, the production for the wiring plate having copper wiring with a depth of 10 μm and widths of 7 to 100 μm became easy. - Comparative example 1 is similar to the example 1 except that the plating solution does not contain an additive. The plating conditions are as shown in
FIG. 8 . The wiring cross-section was observed after the electrolytic copper plating. In the comparative example, the thickness T1 of the copper plating film in thetrenches 3 a was 2.1 μm. The thickness T3 of the copper plating film on theareas 3 c other than thetrenches 3 a was 2.2 μm. In the comparative example, the copper plating film grew approximately uniformly in thetrenches 3 a on the substrate and on theareas 3 c other than thetrenches 3 a. That is to say, it was found that the copper with approximately the same thickness as that in thetrenches 3 a was precipitated on the substrate surface. - In the comparative example, the removal of the copper plating film on the surface of the resist
film 2, namely, on theareas 3 c other than thetrenches 3 a was necessary. As a result, the production for the wiring plate having copper wiring with a depth of 10 μm and widths of 7 to 100 μm became difficult. - The examples of the present invention were described, but the present invention is not limited to the above examples, and various modifications within the scope of the present invention described in claims can be easily understood by those skilled in the art.
Claims (14)
1. A production method for wiring and vias, comprising:
trenches and vias forming step for forming trenches corresponding to a wiring on a surface of a substrate and forming a vias on a position where the via holes should be formed;
a seed layer forming step for forming a first metal layer as a seed layer for electroplating on the substrate surface with the trench and the via formed thereon; and an electroplating step for forming a second metal layer in the trench and the via by electroplating,
wherein an additive, which has a plating reaction suppressing capability and a characteristic such that the plating reaction suppressing capability is reduced as the plating reaction progresses, is added to a plating solution to be used at the electroplating step.
3. The production method for wiring and vias according to claim 1 , wherein the additive has a capability for increasing a metal deposition overpotential.
4. The production method for wiring and vias according to claim 1 , wherein the plating solution has a characteristic that when a polarization curve representing a relationship between an electric potential of a disk electrode and a current density is obtained per rotational speed of the disk electrode, the current density at the time when the rotational speed of the disk electrode is 1000 rpm is lower than the current density at the time when the rotational speed of the disk electrode is zero in an area of a first electric potential, and the current density at the time when the rotational speed of the disk electrode is 1000 rpm is higher than the current density at the time when the rotational speed of the disk electrode is zero in an area of a second applied potential which is more negative than the first electric potential.
5. The production method for wiring and vias according to claim 1 , wherein the plating solution has a characteristic that when a polarization curve representing a relationship between an electric potential of a disk electrode and a current density is obtained per rotational speed of the disk electrode, the current density at the time when the rotational speed of the disk electrode is 1000 rpm is not more than 1/100 of the current density at the time when the rotational speed of the disk electrode is zero in a range where the electric potential is +100 to 200 mV with respect to a standard hydrogen electrode potential, and the current density at the time when the rotational speed of the disk electrode is 1000 rpm is higher than the current density at the time when the rotational speed of the disk electrode is zero in a range where the electric potential is more negative than −100 mV with respect to the standard hydrogen electrode potential.
6. The production method for wiring and vias according to claim 1 , wherein the plating solution is an acid copper sulfate solution, and the second metal layer is made by copper.
7. The production method for wiring and vias according to claim 1 , wherein the first metal layer is formed by copper, nickel, cobalt, chromium, tungsten, palladium and titanium, or nickel, cobalt, chromium, tungsten, palladium and titanium, or alloy which contains at least one of them.
8. The production method for wiring and vias according to claim 1 , wherein only the trench and the via are subject to surface roughening treatment.
9. The production method for wiring and vias according to claim 1 , wherein after the seed layer forming step and before the electroplating step, arithmetic average roughness Ra defined by JISB0601 in the trench and the via is larger than arithmetic average roughness Ra defined by JISB0601 on areas other than the trench and the via.
10. The production method for wiring and vias according to claim 1 , wherein after the seed layer forming step and before the electroplating step, an average length RSm of a roughness curvilinear element defined by JISB0601 in the trench and the via is smaller than an average length RSm of a roughness curvilinear element defined by JISB0601 on areas other than the trench and the via.
11. The production method for wiring and vias according to claim 1 , wherein after the seed layer forming step and before the electroplating step, arithmetic average roughness Ra defined by JISB0601 in the trench and the via is not less than 10 times as large as arithmetic average roughness Ra defined by JISB0601 on areas other than the trench and the via, and an average length RSm of a roughness curvilinear element defined by JISB0601 in the trench and the via is not more than 1/10 times as large as an average length RSm of a roughness curvilinear element defined by JISB0601 on areas other than the trench and the via.
12. The production method for wiring and vias according to claim 1 , wherein after the seed layer forming step and before the electroplating step, arithmetic average roughness Ra defined by JISB0601 in the trench and the via is 0.01 to 4 μm, and an average length RSm of a roughness curvilinear element defined by JISB0601 in the trench and the via is 0.005 to 8 μm.
13. The production method for wiring and vias according to claim 1 , wherein at the trench and the via forming step, the trench and the via are formed simultaneously on the substrate.
14. The production method for wiring and vias according to claim 1 , wherein the trench and the via are formed by any one of a photolithography method, a laser radiation method and a nanoimprint method.
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JP2007223617A JP4682285B2 (en) | 2007-08-30 | 2007-08-30 | Method of forming wiring and interlayer connection via |
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JP (1) | JP4682285B2 (en) |
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Citations (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4725339A (en) * | 1984-02-13 | 1988-02-16 | International Business Machines Corporation | Method for monitoring metal ion concentrations in plating baths |
US20020084191A1 (en) * | 2000-11-16 | 2002-07-04 | Toshio Haba | Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same |
US6709568B2 (en) * | 2002-06-13 | 2004-03-23 | Advanced Technology Materials, Inc. | Method for determining concentrations of additives in acid copper electrochemical deposition baths |
US6858123B1 (en) * | 1999-09-01 | 2005-02-22 | Merck Patent Gesellschaft Mit Beschrankter Haftung | Galvanizing solution for the galvanic deposition of copper |
US20060009026A1 (en) * | 2004-07-07 | 2006-01-12 | Shinko Electric Industries Co., Ltd. | Method of fabricating wiring board |
US20060163725A1 (en) * | 2005-01-27 | 2006-07-27 | Toshio Haba | Wiring board and production method thereof |
US20060180472A1 (en) * | 2005-01-27 | 2006-08-17 | Toshio Haba | Metal structure and method of its production |
US7220347B2 (en) * | 2004-07-23 | 2007-05-22 | C. Uyemura & Co., Ltd. | Electrolytic copper plating bath and plating process therewith |
Family Cites Families (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH11335888A (en) * | 1998-05-25 | 1999-12-07 | Hitachi Ltd | Plating liquid and plating |
JP3897936B2 (en) * | 1999-08-31 | 2007-03-28 | 株式会社荏原製作所 | Leveler concentration measurement method in copper sulfate plating solution |
JP2002076633A (en) * | 2000-08-25 | 2002-03-15 | Toshiba Corp | Manufacturing method of multilayer interconnection board and plating method |
JP2002167689A (en) * | 2000-11-28 | 2002-06-11 | Hitachi Ltd | Plating method, plating solution, semi-conductor device, and manufacturing method thereof |
CN1280452C (en) * | 2001-05-09 | 2006-10-18 | 荏原优莱特科技股份有限公司 | Copper plating bath and method for plating substrate by using the same |
JP3939124B2 (en) * | 2001-10-15 | 2007-07-04 | 株式会社荏原製作所 | Wiring formation method |
JP4644447B2 (en) * | 2004-06-25 | 2011-03-02 | 株式会社日立製作所 | Method for manufacturing printed wiring board |
TW200613586A (en) * | 2004-07-22 | 2006-05-01 | Rohm & Haas Elect Mat | Leveler compounds |
JP2006152421A (en) * | 2004-12-01 | 2006-06-15 | Ebara Corp | Electroplating device and electroplating method |
JP4816901B2 (en) * | 2005-11-21 | 2011-11-16 | 上村工業株式会社 | Electro copper plating bath |
-
2007
- 2007-08-30 JP JP2007223617A patent/JP4682285B2/en not_active Expired - Fee Related
-
2008
- 2008-08-06 TW TW097129857A patent/TWI358980B/en not_active IP Right Cessation
- 2008-08-13 US US12/190,610 patent/US20090057156A1/en not_active Abandoned
- 2008-08-19 KR KR1020080080830A patent/KR101030688B1/en not_active IP Right Cessation
- 2008-08-20 CN CN2008102110975A patent/CN101378632B/en not_active Expired - Fee Related
Patent Citations (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4725339A (en) * | 1984-02-13 | 1988-02-16 | International Business Machines Corporation | Method for monitoring metal ion concentrations in plating baths |
US6858123B1 (en) * | 1999-09-01 | 2005-02-22 | Merck Patent Gesellschaft Mit Beschrankter Haftung | Galvanizing solution for the galvanic deposition of copper |
US20020084191A1 (en) * | 2000-11-16 | 2002-07-04 | Toshio Haba | Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same |
US20050087447A1 (en) * | 2000-11-16 | 2005-04-28 | Toshio Haba | Electric copper plating liquid and process for manufacturing semiconductor integrated circuit device using same |
US6709568B2 (en) * | 2002-06-13 | 2004-03-23 | Advanced Technology Materials, Inc. | Method for determining concentrations of additives in acid copper electrochemical deposition baths |
US20060009026A1 (en) * | 2004-07-07 | 2006-01-12 | Shinko Electric Industries Co., Ltd. | Method of fabricating wiring board |
US7220347B2 (en) * | 2004-07-23 | 2007-05-22 | C. Uyemura & Co., Ltd. | Electrolytic copper plating bath and plating process therewith |
US20060163725A1 (en) * | 2005-01-27 | 2006-07-27 | Toshio Haba | Wiring board and production method thereof |
US20060180472A1 (en) * | 2005-01-27 | 2006-08-17 | Toshio Haba | Metal structure and method of its production |
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US9603257B2 (en) * | 2010-10-22 | 2017-03-21 | Sony Corporation | Pattern substrate, method of producing the same, information input apparatus, and display apparatus |
US20130220680A1 (en) * | 2010-10-22 | 2013-08-29 | Sony Corporation | Pattern substrate, method of producing the same, information input apparatus, and display apparatus |
US20140131075A1 (en) * | 2011-06-15 | 2014-05-15 | Mirae Nano Technologies Co., Ltd. | Wired electrode of touch screen panel |
US9395830B2 (en) * | 2011-06-15 | 2016-07-19 | Mirae Nano Technologies Co., Ltd. | Wired electrode of touch screen panel |
US20140284084A1 (en) * | 2013-03-20 | 2014-09-25 | Ronald Steven Cok | Optically diffuse micro-channel |
CN104582296A (en) * | 2014-12-26 | 2015-04-29 | 上海蓝沛新材料科技股份有限公司 | Double-layer circuit board based on micro-nano imprinting and addition process technology and manufacturing method for double-layer circuit board |
US20160289840A1 (en) * | 2015-04-02 | 2016-10-06 | Toyota Jidosha Kabushiki Kaisha | Method of forming wiring pattern and etching apparatus for forming wiring pattern |
US10161055B2 (en) * | 2015-04-02 | 2018-12-25 | Toyota Jidosha Kabushiki Kaisha | Method of forming wiring pattern and etching apparatus for forming wiring pattern |
KR20180122462A (en) * | 2016-03-31 | 2018-11-12 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser seeding for electro-conductive plating |
US20190019736A1 (en) * | 2016-03-31 | 2019-01-17 | Electro Scientific Industries, Inc. | Laser-seeding for electro-conductive plating |
US10957615B2 (en) * | 2016-03-31 | 2021-03-23 | Electro Scientific Industries, Inc | Laser-seeding for electro-conductive plating |
KR102437034B1 (en) * | 2016-03-31 | 2022-08-29 | 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 | Laser Seeding Method for Electrically Conductive Plating |
US11869866B2 (en) | 2020-03-12 | 2024-01-09 | Kioxia Corporation | Wiring formation method, method for manufacturing semiconductor device, and semiconductor device |
Also Published As
Publication number | Publication date |
---|---|
CN101378632B (en) | 2011-02-16 |
CN101378632A (en) | 2009-03-04 |
TW200917921A (en) | 2009-04-16 |
TWI358980B (en) | 2012-02-21 |
JP2009057582A (en) | 2009-03-19 |
JP4682285B2 (en) | 2011-05-11 |
KR101030688B1 (en) | 2011-04-22 |
KR20090023126A (en) | 2009-03-04 |
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