TWM635953U

TWM635953U - Die sorter

Info

Publication number: TWM635953U
Application number: TW111207281U
Authority: TW
Inventors: 徐敏
Original assignee: 大陸商京隆科技（蘇州）有限公司
Priority date: 2022-06-30
Filing date: 2022-07-07
Publication date: 2023-01-01
Also published as: CN217562526U

Abstract

本新型公開了一種晶粒分類機，包括架體、晶粒吸取裝置、晶圓承載盤、視覺檢測裝置以及控制裝置。晶粒吸取裝置可旋轉設置於架體上，晶粒吸取裝置包括吸嘴；晶圓承載盤設置於架體上且可被控制得能在yz平面內移動，晶圓承載盤具有一晶圓承載槽；視覺檢測裝置與晶粒吸取裝置並列排設於架體上，視覺檢測裝置用於獲取晶粒吸取裝置中吸嘴的圖像資訊，以及用於獲取吸嘴吸取目標晶粒後的圖像資訊；控制裝置連接晶粒吸取裝置、晶圓承載盤以及視覺檢測裝置，至少用於控制晶圓承載盤的移動，控制晶粒吸取裝置以及視覺檢測裝置的運作。本新型的晶粒分類機能夠準確地且無損的挑起並吸取晶粒，提高晶粒的挑選良率。The present invention discloses a grain classifier, which comprises a frame body, a grain suction device, a wafer carrying plate, a visual detection device and a control device. The crystal grain suction device can be rotatably arranged on the frame, and the crystal grain suction device includes a suction nozzle; the wafer carrier is arranged on the frame and can be controlled to move in the yz plane, and the wafer carrier has a wafer carrier Slot; the visual detection device and the grain suction device are arranged side by side on the frame, and the visual detection device is used to obtain image information of the suction nozzle in the grain suction device, and to obtain the image after the suction nozzle sucks the target grain Information; the control device is connected to the die suction device, the wafer carrier and the visual inspection device, and is at least used to control the movement of the wafer carrier and control the operation of the die suction device and the visual inspection device. The new type of grain sorting machine can accurately and non-destructively pick up and absorb the grains, and improve the selection yield of the grains.

Description

晶粒分類機Grain Sorter

本新型是關於一種晶粒分類機，特別是關於一種具有自動矯正功能的晶粒分類機。The present invention relates to a grain sorting machine, in particular to a grain sorting machine with automatic correction function.

晶圓是指矽半導體機體電路製作所用的矽晶片，由於其形狀為圓形，故稱為晶圓，在矽晶片上可加工製作成各種電路元件結構，進而對其進行切割以形成具有特定電性功能的若干晶粒。Wafer refers to the silicon wafer used in the production of silicon semiconductor body circuits. Because of its circular shape, it is called a wafer. It can be processed into various circuit element structures on the silicon wafer, and then cut to form a specific electrical circuit. several grains of sexual function.

晶粒分類機是用於將切割後晶圓上損壞的晶粒（或者完好的晶粒）分揀挑選出來的一種設備，一般採用頂針將晶圓上的晶粒挑起，再用吸嘴對該晶粒吸取並移動，由於每顆晶粒上均具有可以實現特定功能的感應區或功能區，且該區域不能有一點損壞，因此對晶粒的挑起以及吸取均有一定的技術要求。現有的晶粒分類機，其上吸嘴和頂針之間的位置關係，通常是採用人工對位的方式，人工對位時，僅憑肉眼裸視進行判斷，頂針和吸嘴之間會存在對位偏差或者漏對位的可能，對晶粒挑起或者吸取時，造成晶粒功能區或感應區損壞，影響晶粒的挑選良率。Die sorting machine is a kind of equipment used to sort out the damaged dies (or intact dies) on the wafer after dicing. Generally, thimbles are used to pick up the dies on the wafer, and then the suction nozzle is used to clean the dies. The crystal grains are picked up and moved. Since each grain has a sensing area or functional area that can realize a specific function, and this area cannot be damaged at all, there are certain technical requirements for the provocation and absorption of the grains. In the existing grain sorting machine, the positional relationship between the suction nozzle and the thimble is usually manually aligned. During the manual alignment, it is only judged by the naked eye, and there will be alignment between the thimble and the suction nozzle. Possibility of bit deviation or missing alignment, when the chip is provoked or sucked, it will cause damage to the functional area or sensing area of the chip, which will affect the selection yield of the chip.

公開於該背景技術部分的資訊僅僅旨在增加對本新型的總體背景的理解，而不應當被視為承認或以任何形式暗示該資訊構成已為該技術領域中具有通常知識者所公知的現有技術。The information disclosed in this background technology section is only intended to increase the understanding of the general background of the present invention, and should not be considered as an acknowledgment or any form of suggestion that the information constitutes the prior art known to those with ordinary knowledge in the technical field .

本新型的目的在於提供一種晶粒分類機，其能夠準確地且無損的挑起並吸取晶粒，本新型的目的在於提供一種晶粒分類機，其能夠準確地且無損的挑起並吸取晶粒，提高晶粒的挑選良率。The purpose of this model is to provide a grain sorter, which can accurately and non-destructively pick up and suck the grains. grains to improve the selection yield of grains.

為實現上述目的，本新型提供了一種晶粒分類機，包括架體、晶粒吸取裝置、晶圓承載盤、視覺檢測裝置以及控制裝置。In order to achieve the above purpose, the present invention provides a grain sorter, which includes a frame, a grain suction device, a wafer carrier, a visual inspection device and a control device.

該晶粒吸取裝置可旋轉設置於該架體上，該晶粒吸取裝置包括吸嘴，用於吸取目標晶粒；該晶圓承載盤設置於該架體上且可被控制得能在yz平面內移動，該晶圓承載盤具有一晶圓承載槽，該晶圓承載槽用於放置切割後的晶圓；該視覺檢測裝置與該晶粒吸取裝置並列排設於該架體上，該視覺檢測裝置用於獲取該晶粒吸取裝置中吸嘴的圖像資訊，以及用於獲取該吸嘴吸取目標晶粒後的圖像資訊；該控制裝置連接該晶粒吸取裝置、晶圓承載盤以及視覺檢測裝置，至少用於控制該晶圓承載盤的移動，控制該晶粒吸取裝置以及該視覺檢測裝置的運作。The die suction device can be rotatably arranged on the frame, and the die suction device includes a suction nozzle for picking up the target die; the wafer carrier is set on the frame and can be controlled to be able to The wafer carrying tray has a wafer holding slot, which is used to place the cut wafers; the visual detection device and the crystal grain suction device are arranged side by side on the frame, and the visual detection device is arranged side by side on the frame. The detection device is used to obtain the image information of the suction nozzle in the die suction device, and to obtain the image information after the suction nozzle has sucked the target die; the control device is connected to the die suction device, the wafer carrier and The visual inspection device is at least used to control the movement of the wafer carrier, and control the operation of the die suction device and the visual inspection device.

在一個或多個實施方式中，該晶粒分類機還包括挑起結構，用於挑起位於該晶圓承載槽內、經切割後的晶圓內的目標晶粒；該挑起結構設置於該架體上且位於該晶圓承載槽內，該挑起結構連接該控制裝置，該挑起結構可被控制得能在yz平面內移動，以調整其在該晶圓承載槽內的相對位置。In one or more embodiments, the grain sorter further includes a provoking structure for provoking the target grains located in the wafer holding groove and in the diced wafer; the provoking structure is disposed on On the frame and located in the wafer carrying tank, the provoking structure is connected to the control device, and the provoking structure can be controlled to move in the yz plane to adjust its relative position in the wafer carrying tank .

在一個或多個實施方式中，該挑起結構包括頂針，該頂針可沿該晶圓承載盤的軸向移動，以頂起目標晶粒。In one or more embodiments, the lifting structure includes ejector pins, and the ejector pins can move along the axial direction of the wafer susceptor to lift target dies.

在一個或多個實施方式中，該頂針的數量為四個，每個該頂針均具有一頂起部，四個該頂起部呈方形排設。In one or more embodiments, the number of the thimbles is four, each of the thimbles has a jacking portion, and the four jacking portions are arranged in a square shape.

在一個或多個實施方式中，該視覺檢測裝置包括圖像獲取鏡頭，該吸嘴的中心與該圖像獲取鏡頭的中心位於同一水平面上。In one or more embodiments, the visual detection device includes an image capturing lens, and the center of the suction nozzle and the center of the image capturing lens are located on the same horizontal plane.

在一個或多個實施方式中，該晶圓承載盤的數量有兩個，對稱設置於該架體上；該晶粒吸取裝置位於兩個該晶圓承載盤之間，該吸嘴可隨該晶粒吸取裝置的轉動而於兩個該晶圓承載盤之間來回移動，以將其中一個該晶圓承載槽內晶圓上的目標晶粒吸取至另一晶圓承載槽內的晶圓上。In one or more embodiments, there are two wafer carriers, which are symmetrically arranged on the frame; the die suction device is located between the two wafer carriers, and the suction nozzle can follow the The rotation of the die suction device moves back and forth between the two wafer carrying trays to suck the target die on the wafer in one of the wafer carrying grooves to the wafer in the other wafer carrying groove .

在一個或多個實施方式中，該挑起結構的數量有兩個，對稱設置於該架體上，一個該挑起結構對應一個該晶圓承載盤設置。In one or more embodiments, there are two lifting structures, which are arranged symmetrically on the frame, and one lifting structure corresponds to one wafer carrier.

在一個或多個實施方式中，該晶粒吸取裝置包括相背設置的兩個吸嘴，每個吸嘴對應一個該晶圓承載盤設置。In one or more embodiments, the die suction device includes two suction nozzles disposed opposite to each other, and each suction nozzle is disposed corresponding to one of the wafer susceptors.

在一個或多個實施方式中，該晶粒吸取裝置還包括抽吸管和負壓結構，該負壓結構透過抽吸管連接該吸嘴，為該吸嘴提供吸力。In one or more embodiments, the crystal particle suction device further includes a suction pipe and a negative pressure structure, and the negative pressure structure is connected to the suction nozzle through the suction pipe to provide suction for the suction nozzle.

在一個或多個實施方式中，該吸嘴具有一抽吸口，該抽吸口周圍設置有柔性吸附墊。In one or more embodiments, the suction nozzle has a suction port, and a flexible suction pad is arranged around the suction port.

與現有技術相比，本新型的晶粒分類機，透過設置視覺檢測裝置獲取吸嘴圖像資訊以及獲取吸嘴吸取目標晶粒後的圖像資訊，並確定吸嘴中心以及當下吸取的目標晶粒的中心，根據兩中心的誤差調整晶圓承載盤與吸嘴之間的相對位置關係，使得吸嘴的中心能與下次需要吸取的晶粒的中心對準，使得能夠準確且無損的吸取晶粒，提高晶粒的挑選良率。Compared with the prior art, the new type of grain sorting machine obtains the image information of the suction nozzle and the image information after the suction nozzle picks up the target grain by setting the visual inspection device, and determines the center of the suction nozzle and the target crystal currently picked up. According to the error between the two centers, adjust the relative positional relationship between the wafer carrier plate and the suction nozzle, so that the center of the suction nozzle can be aligned with the center of the next chip to be picked up, so that it can be picked up accurately and without damage Die, improve the selection yield of die.

本新型的晶粒分類機，透過控制裝置控制晶圓承載盤與吸嘴的位置調整，更加精確且自動化。The new type of grain sorting machine controls the position adjustment of the wafer carrier plate and the suction nozzle through the control device, which is more accurate and automatic.

本新型的晶粒分類機，透過將挑起結構可移動的設置在架體上，並連接控制結構，自動調整挑起結構相對吸嘴的位置關係，使得挑起結構能夠作用於晶粒的邊緣區域，準確且無損的挑起晶粒供吸嘴吸取，進一步提高晶粒的挑選良率。This new type of grain sorting machine automatically adjusts the position of the lifting structure relative to the suction nozzle by setting the lifting structure movably on the frame and connecting the control structure, so that the lifting structure can act on the edge of the grain Area, accurately and non-destructively pick up the die for the suction nozzle to further improve the selection yield of die.

以下結合附圖，對本新型的具體實施方式進行詳細描述，但應當理解本新型的保護範圍並不受具體實施方式的限制。The specific embodiments of the present invention will be described in detail below in conjunction with the accompanying drawings, but it should be understood that the protection scope of the present invention is not limited by the specific embodiments.

除非另有其它明確表示，否則在整個說明書和申請專利範圍中，術語「包括」或其變換如「包含」或「包括有」等等將被理解為包括所陳述的元件或組成部分，而並未排除其它元件或其它組成部分。Unless otherwise expressly stated otherwise, throughout the specification and scope of the patent application, the term "comprise" or its transformations such as "comprises" or "comprises", etc. will be understood as including the stated elements or components, and Other elements or other components are not excluded.

如圖1至圖2所示，本新型一實施方式提供了一種晶粒分類機，包括架體10以及分別設置於架體10上的晶圓承載盤20、挑起結構30、晶粒吸取裝置40、視覺檢測裝置50以及控制裝置。As shown in Figures 1 to 2, one embodiment of the present invention provides a grain sorter, including a frame body 10, a wafer carrier tray 20 respectively arranged on the frame body 10, a lifting structure 30, and a crystal grain suction device 40. A visual detection device 50 and a control device.

架體10用於支撐上述各部件，使其可以配合以完成晶粒的分揀。The frame body 10 is used to support the above-mentioned components so that they can cooperate to complete the sorting of the crystal grains.

晶圓承載盤20可移動設置於架體10上，其可在控制裝置的作用下在yz平面內上下左右移動。晶圓承載盤20大體為一圓形結構，其中部開設有一晶圓承載槽21，晶圓承載槽21貫穿晶圓承載盤20設置，晶圓承載槽21用於放置切割後的晶圓。晶圓放置於晶圓承載槽21內後，為了保持晶圓的穩定性，晶圓承載槽21邊緣還可設置有固定結構，因該結構不是本申請的保護重點，在此不做詳細闡述。The wafer carrier tray 20 is movably arranged on the frame body 10 , and it can move up, down, left, and right in the yz plane under the action of the control device. The wafer carrier tray 20 is generally a circular structure, with a wafer carrier slot 21 defined in its center, the wafer carrier slot 21 is set through the wafer carrier tray 20, and the wafer carrier slot 21 is used to place the wafer after dicing. After the wafer is placed in the wafer holding tank 21, in order to maintain the stability of the wafer, the edge of the wafer holding tank 21 can also be provided with a fixed structure, because this structure is not the protection focus of this application, so it will not be described in detail here.

挑起結構30可移動設置於架體10上且位於晶圓承載槽21所在區域內，用於挑起位於晶圓承載槽21內、經切割後的晶圓內的目標晶粒。挑起結構30連接控制裝置，挑起結構30可被控制得能在yz平面內移動，以調整其在晶圓承載槽21內的相對位置（為了與晶粒吸取裝置40相對設置）。挑起結構30與晶圓承載盤20之間不連接設置，以使晶圓承載盤20在yz平面內移動時，挑起結構30不動，以挑起晶圓承載槽21內晶圓上的不同晶粒。挑起結構30包括頂針31，頂針31可沿晶圓承載盤20的軸向移動，以頂起目標晶粒。在一具體實施例中，頂針31的數量可以為四個，每個頂針31均具有一頂起部，四個頂起部呈方形排設，作用於目標晶粒的四周，可防止頂起時對目標晶粒的功能區造成損壞，同時，呈方形排設的頂針，四個頂針的中心更容易被定位。The lifting structure 30 is movably disposed on the frame body 10 and located in the area of the wafer holding slot 21 , and is used to lift the target die in the wafer holding slot 21 after dicing. The provocation structure 30 is connected with the control device, and the provocation structure 30 can be controlled to move in the yz plane to adjust its relative position in the wafer carrying tank 21 (to be arranged opposite to the die suction device 40 ). The provocation structure 30 is not connected to the wafer carrier 20, so that when the wafer carrier 20 moves in the yz plane, the provocation structure 30 does not move, so as to provoke the difference on the wafer in the wafer carrier groove 21. grain. The lifting structure 30 includes a thimble 31 , which can move along the axial direction of the wafer carrier 20 to lift the target die. In a specific embodiment, the number of thimbles 31 can be four, and each thimble 31 has a jacking part, and the four jacking parts are arranged in a square shape, acting on the surroundings of the target crystal grain, preventing the jacking up from The functional area of the target die is damaged, and at the same time, the center of the four thimbles is easier to be located due to the thimbles arranged in a square shape.

在本實施例中，頂針31的數量可以為一個，同時為了便於定位頂針的中心，頂針可以被構造成方形或圓形結構。In this embodiment, the number of the thimble 31 can be one, and at the same time, in order to facilitate the positioning of the center of the thimble, the thimble can be configured as a square or circular structure.

如圖2所示，晶粒吸取裝置40可轉動設置於架體10上，其包括吸嘴41、抽吸管和負壓結構，負壓結構通過抽吸管連接吸嘴41，為吸嘴41提供吸力。吸嘴41正對晶圓承載盤20上的挑起結構30設置，以對經挑起結構30挑起後的目標晶粒進行吸取。具體地，吸嘴41的中心具有透過真空線與真空源（圖未顯示）連接的抽吸孔42，抽吸孔42與真空線形成真空通路。吸嘴41能夠產生吸附力。為了防止吸嘴41對目標晶粒造成破壞，吸嘴41的抽吸孔42處設置有吸附墊，吸附墊可以是多孔橡膠片。為了便於控制裝置配合視覺檢測裝置對吸嘴41中心的定位，吸附墊可以為正多邊形結構，優選的，可以為正方形或者長方形結構。或者，為了防止吸嘴41對目標晶粒造成破壞，吸嘴41可以由矽膠等具有一定柔性的材質製成，同時，同樣為了便於控制裝置配合視覺檢測裝置50對吸嘴41中心的定位，吸嘴41優選為矩形或圓形吸嘴。As shown in Figure 2, the grain sucking device 40 is rotatably arranged on the frame body 10, and it includes a suction nozzle 41, a suction pipe and a negative pressure structure, and the negative pressure structure is connected to the suction nozzle 41 through the suction pipe, which is the suction nozzle 41 Provides suction. The suction nozzle 41 is set facing the lifting structure 30 on the wafer carrier 20 , so as to suck the target dies lifted by the lifting structure 30 . Specifically, the center of the suction nozzle 41 has a suction hole 42 connected to a vacuum source (not shown) through a vacuum line, and the suction hole 42 and the vacuum line form a vacuum passage. The suction nozzle 41 can generate suction force. In order to prevent the suction nozzle 41 from damaging the target grain, an adsorption pad is provided at the suction hole 42 of the suction nozzle 41, and the adsorption pad may be a porous rubber sheet. In order to facilitate the positioning of the center of the suction nozzle 41 by the control device and the visual detection device, the adsorption pad can be a regular polygon, preferably a square or a rectangle. Alternatively, in order to prevent the suction nozzle 41 from damaging the target grain, the suction nozzle 41 can be made of a flexible material such as silicon rubber. The nozzle 41 is preferably a rectangular or circular suction nozzle.

如圖1和圖2所示，視覺檢測裝置50與晶粒吸取裝置40並列排設於架體10上，視覺檢測裝置50用於獲取晶粒吸取裝置40中吸嘴41的圖像資訊，以及用於獲取吸嘴41吸取目標晶粒後的圖像資訊。視覺檢測裝置50包括圖像獲取鏡頭51，圖像獲取鏡頭51的高度和吸嘴41的高度相一致，優選的，吸嘴41的中心與圖像獲取鏡頭51的中心位於同一水平面上，以使得吸嘴41在旋轉取放晶粒過程中，可旋轉至一個特定位置，使得圖像獲取鏡頭51能夠獲取到吸嘴41的圖像資訊。視覺檢測裝置50還可以用於監控吸嘴的安裝方向以及吸嘴的型號，若安裝的吸嘴皆為長方形吸嘴，視覺檢測裝置50還可用於吸嘴尺寸檢測；同時，視覺檢測裝置50可以用於檢查吸嘴41是否破損或存在表面異物。As shown in Figures 1 and 2, the visual inspection device 50 and the crystal grain suction device 40 are arranged side by side on the frame body 10, and the visual detection device 50 is used to obtain the image information of the suction nozzle 41 in the crystal grain suction device 40, and It is used to obtain the image information after the suction nozzle 41 picks up the target die. The visual detection device 50 includes an image acquisition lens 51, the height of the image acquisition lens 51 is consistent with the height of the suction nozzle 41, preferably, the center of the suction nozzle 41 is located on the same level as the center of the image acquisition lens 51, so that During the process of rotating the suction nozzle 41 to pick and place the die, it can rotate to a specific position, so that the image capture lens 51 can capture the image information of the suction nozzle 41 . The visual detection device 50 can also be used to monitor the installation direction of the suction nozzle and the model of the suction nozzle. If the installed suction nozzles are all rectangular suction nozzles, the visual detection device 50 can also be used for the size detection of the suction nozzle; meanwhile, the visual detection device 50 can It is used to check whether the suction nozzle 41 is damaged or there are foreign objects on the surface.

控制裝置連接晶粒吸取裝置40、晶圓承載盤20以及視覺檢測裝置50，用於控制晶圓承載盤20的移動，控制晶粒吸取裝置40以及視覺檢測裝置50的運作，在晶粒吸取裝置40旋轉使吸嘴41到達預設位置時（與視覺檢測裝置50正對），控制視覺檢測裝置50獲取吸嘴41圖像資訊，並根據軟體程序判斷吸嘴41的中心；控制吸嘴41吸取目標晶粒，在其再次旋轉至預設位置時，獲取吸嘴41吸附的目標晶粒的圖像資訊，並根據軟體程序判斷吸嘴41吸取的目標晶粒的中心；判斷兩者中心是否處於對位狀態（是否重疊），若是，則控制晶粒吸取裝置40繼續運作吸取晶粒，若否，則根據兩中心的誤差調整晶圓承載盤20與吸嘴41之間的相對位置關係，使得吸嘴41的中心能與下次需要吸取的晶粒的中心對準。The control device is connected to the die suction device 40, the wafer carrier 20 and the visual detection device 50, and is used to control the movement of the wafer carrier 20, and to control the operation of the die suction device 40 and the visual detection device 50. 40 rotates to make the suction nozzle 41 reach the preset position (facing the visual detection device 50), control the visual detection device 50 to obtain the image information of the suction nozzle 41, and judge the center of the suction nozzle 41 according to the software program; control the suction nozzle 41 to suck The target crystal grain, when it rotates to the preset position again, obtains the image information of the target grain absorbed by the suction nozzle 41, and judges the center of the target crystal grain sucked by the suction nozzle 41 according to the software program; judges whether the centers of the two are in the Alignment state (whether overlapping), if so, then control the crystal grain suction device 40 to continue to operate to pick up the crystal grains, if not, then adjust the relative positional relationship between the wafer carrier tray 20 and the suction nozzle 41 according to the error between the two centers, so that The center of the suction nozzle 41 can be aligned with the center of the crystal grain to be sucked next time.

更進一步的，為了獲取一個頂針或多個頂針組的中心，還可在與挑起結構30相對位置加裝用於獲取頂針圖像資訊的攝像頭，該攝像頭同樣與控制裝置相連。控制裝置可根據吸嘴中心，晶粒中心以及頂針中心，控制相關部件進行位置調整，使得三者中心可重疊。Furthermore, in order to obtain the center of one thimble or multiple thimble groups, a camera for obtaining image information of the thimble can also be installed at a position opposite to the provoking structure 30, and the camera is also connected to the control device. The control device can adjust the positions of related components according to the center of the suction nozzle, the center of the grain and the center of the thimble, so that the centers of the three can overlap.

為了提高晶粒的分揀效率，在本實施例中，晶圓承載盤20的數量為兩個，對稱設置於架體10上，且兩個晶圓承載盤20均可相對架體10在垂直於吸嘴41的吸取方向上移動。對應的，挑起結構30的數量也為兩個，對稱設置於架體10上，一個挑起結構30對應一個晶圓承載盤20設置。晶粒吸取裝置40可轉動設置於架體10上，且位於兩個晶圓承載盤20之間，吸嘴41可隨晶粒吸取裝置40的轉動而於兩個晶圓承載盤20之間來回移動，以將其中一個晶圓承載槽21內晶圓上的目標晶粒吸取至另一晶圓承載槽21內的晶圓上。In order to improve the sorting efficiency of the crystal grains, in this embodiment, the number of the wafer carrying trays 20 is two, which are symmetrically arranged on the frame body 10, and the two wafer carrying trays 20 can be vertical to the frame body 10. Move in the suction direction of the suction nozzle 41. Correspondingly, the number of provocation structures 30 is also two, which are symmetrically arranged on the frame body 10 , and one provocation structure 30 is provided corresponding to one wafer carrier tray 20 . The die suction device 40 is rotatably arranged on the frame body 10, and is located between the two wafer carrying trays 20. The suction nozzle 41 can move back and forth between the two wafer carrying trays 20 as the die suction device 40 rotates. moving to suck the target die on the wafer in one of the wafer holding slots 21 to the wafer in the other wafer holding slot 21 .

此狀態下，視覺檢測裝置50設置於兩個晶圓承載盤20之間且對應於吸嘴41相對其中一個晶圓承載盤20旋轉90°之後所對應位置處。分揀機初運行時，控制裝置控制晶粒吸取裝置40以每次90°的旋轉角度經晶粒的旋轉運輸，當吸嘴中心與需要吸取的晶粒中心誤差矯正完成後，控制晶粒吸取裝置40以每次180°的旋轉角度經晶粒的旋轉運輸。In this state, the visual inspection device 50 is disposed between the two wafer susceptors 20 and corresponds to the corresponding position after the suction nozzle 41 rotates 90° relative to one of the wafer susceptors 20 . When the sorter is initially running, the control device controls the grain suction device 40 to rotate and transport the grains at a rotation angle of 90° each time. The device 40 is transported through the rotation of the die with each rotation angle of 180°.

同時，為了進一步提高晶粒的分揀效率，晶粒吸取裝置40包括相背設置的兩個吸嘴41，每個吸嘴41對應一個晶圓承載盤20設置。此設計使得，晶粒吸取裝置40每轉動180度即可實現一次目標晶粒的分揀切換（相比於一個吸嘴完成一次目標晶粒的分揀切換需要轉動360度，分揀效率提高了2倍）。At the same time, in order to further improve the sorting efficiency of the die, the die suction device 40 includes two suction nozzles 41 arranged opposite to each other, and each suction nozzle 41 is arranged corresponding to a wafer carrier tray 20 . This design makes it possible for the grain suction device 40 to achieve a sorting switch of the target grain every time it rotates 180 degrees (compared with a suction nozzle that needs to rotate 360 degrees to complete a sorting switch of the target grain, the sorting efficiency is improved. 2 times).

本新型的晶粒分類機，依靠軟體透過視覺檢測裝置自動獲取吸嘴中心、獲取目標晶粒的中心，並自動矯正，使得吸嘴能夠吸附晶粒的中心，避免吸嘴吸歪，壓到晶粒的功能區，造成晶粒功能區的損壞使得產品異常。This new type of grain sorting machine relies on software to automatically obtain the center of the suction nozzle and the center of the target grain through the visual inspection device, and automatically corrects it so that the suction nozzle can absorb the center of the grain, avoiding the suction of the nozzle and pressing it to the grain. The functional area of the grain, causing damage to the functional area of the grain makes the product abnormal.

前述對本新型的具體示例性實施方案的描述是為了說明和例證的目的。這些描述並非想將本新型限定為所公開的精確形式，並且很顯然，根據上述教導，可以進行很多改變和變化。對示例性實施例進行選擇和描述的目的在於解釋本新型的特定原理及其實際應用，從而使得所屬技術領域中具有通常知識者能夠實現並利用本新型的各種不同的示例性實施方案以及各種不同的選擇和改變。本新型的範圍意在由申請專利範圍及其均等物所限定。The foregoing descriptions of specific exemplary embodiments of the present invention have been presented for purposes of illustration and description. These descriptions are not intended to limit the invention to the precise form disclosed, and obviously many modifications and variations are possible in light of the above teaching. The exemplary embodiments were chosen and described in order to explain the specific principles of the invention and its practical application, thereby enabling those skilled in the art to make and use various exemplary embodiments of the invention, as well as various choices and changes. It is intended that the scope of the present invention be defined by claims and their equivalents.

10:架體10: frame body

20:晶圓承載盤20:Wafer carrier tray

21:晶圓承載槽21: Wafer holding tank

30:挑起結構30: Provoking Structure

31:頂針31: Thimble

40:晶粒吸取裝置40: Grain suction device

41:吸嘴41: Nozzle

42:抽吸孔42: suction hole

50:視覺檢測裝置50: Visual inspection device

51:吹氣管51: Blowing tube

x:方向x: direction

y:方向y: direction

z:方向z: direction

圖1是本新型一實施方式的晶粒分類機的結構示意圖。圖2是本新型一實施方式的晶粒分類機的主視圖。圖3是本新型一實施方式的晶粒分類機的晶粒吸取裝置結構示意圖。 Fig. 1 is a schematic structural view of a grain classifier according to an embodiment of the present invention. Fig. 2 is a front view of a grain sorter according to an embodiment of the present invention. Fig. 3 is a schematic structural diagram of a grain suction device of a grain sorter according to an embodiment of the present invention.

10:架體 10: frame body

20:晶圓承載盤 20:Wafer carrier tray

21:晶圓承載槽 21: Wafer holding tank

30:挑起結構 30: Provoking Structure

31:頂針 31: Thimble

40:晶粒吸取裝置 40: Grain suction device

50:視覺檢測裝置 50: Visual inspection device

Claims

一種晶粒分類機，其特徵在於，包括：架體；晶粒吸取裝置，可旋轉設置於該架體上，該晶粒吸取裝置包括吸嘴，用於吸取目標晶粒；晶圓承載盤，設置於該架體上且可被控制得能在yz平面內移動，該晶圓承載盤具有一晶圓承載槽，該晶圓承載槽用於放置切割後的晶圓；視覺檢測裝置，該視覺檢測裝置與該晶粒吸取裝置並列排設於該架體上，該視覺檢測裝置用於獲取該晶粒吸取裝置中吸嘴的圖像資訊，以及用於獲取該吸嘴吸取目標晶粒後的圖像資訊；控制裝置，連接該晶粒吸取裝置、晶圓承載盤以及視覺檢測裝置，至少用於控制該晶圓承載盤的移動，控制該晶粒吸取裝置以及該視覺檢測裝置的運作。 A grain classifier, characterized in that it includes: a frame; a grain suction device, which can be rotatably arranged on the frame, and the grain suction device includes a suction nozzle for suctioning target grains; a wafer carrying tray, It is arranged on the frame and can be controlled to move in the yz plane. The wafer carrying tray has a wafer carrying groove, which is used to place the cut wafers; the visual inspection device, the visual The detection device and the die suction device are arranged side by side on the frame, and the visual detection device is used to obtain the image information of the suction nozzle in the die suction device, and to obtain the image information of the suction nozzle after the target die is sucked. Image information; a control device, connected to the die suction device, wafer carrier and visual inspection device, at least used to control the movement of the wafer carrier, and control the operations of the die suction device and the visual inspection device.

如請求項1的晶粒分類機，其特徵在於，該晶粒分類機還包括挑起結構，用於挑起位於該晶圓承載槽內、經切割後的晶圓內的目標晶粒；該挑起結構設置於該架體上且位於該晶圓承載槽內，該挑起結構連接該控制裝置，該挑起結構可被控制得能在yz平面內移動，以調整其在該晶圓承載槽內的相對位置。 The grain sorting machine according to claim 1, characterized in that the grain sorting machine also includes a provoking structure for provoking target grains located in the wafer carrying groove and in the cut wafer; the The provocation structure is arranged on the frame and located in the wafer carrying slot, the provocation structure is connected to the control device, and the provocation structure can be controlled to move in the yz plane to adjust its position on the wafer support relative position within the slot.

如請求項2的晶粒分類機，其特徵在於，該挑起結構包括頂針，該頂針可沿該晶圓承載盤的軸向移動，以頂起目標晶粒。 The grain sorter according to claim 2, wherein the lifting structure includes a thimble, and the thimble can move along the axial direction of the wafer carrier to lift the target grain.

如請求項3的晶粒分類機，其特徵在於，該頂針的數量為四個，每個該頂針均具有一頂起部，四個該頂起部呈方形排設。 The grain sorting machine according to claim 3 is characterized in that the number of the thimbles is four, and each of the thimbles has a jacking part, and the four jacking parts are arranged in a square shape.

如請求項1的晶粒分類機，其特徵在於，該視覺檢測裝置包括圖像獲取鏡頭，該吸嘴的中心與該圖像獲取鏡頭的中心位於同一水平面上。 The grain sorting machine according to claim 1, wherein the visual inspection device includes an image capturing lens, and the center of the suction nozzle and the center of the image capturing lens are located on the same horizontal plane.

如請求項2的晶粒分類機，其特徵在於，該晶圓承載盤的數量有兩個，對稱設置於該架體上；該晶粒吸取裝置位於兩個該晶圓承載盤之間，該吸嘴可隨該晶粒吸取裝置的轉動而於兩個該晶圓承載盤之間來回移動，以將其中一個該晶圓承載槽內晶圓上的目標晶粒吸取至另一晶圓承載槽內的晶圓上。 For example, the grain sorting machine of claim 2 is characterized in that there are two wafer carrying trays, which are symmetrically arranged on the frame; The die suction device is located between the two wafer carrying trays, and the suction nozzle can move back and forth between the two wafer carrying trays with the rotation of the die suction device to carry one of the wafers The target grains on the wafer in the slot are picked up to the wafer in another wafer holding slot.

如請求項6的晶粒分類機，其特徵在於，該挑起結構的數量有兩個，對稱設置於該架體上，一個該挑起結構對應一個該晶圓承載盤設置。The grain sorter according to claim 6 is characterized in that there are two lifting structures, which are arranged symmetrically on the frame, and one lifting structure corresponds to one wafer carrier.

如請求項6的晶粒分類機，其特徵在於，該晶粒吸取裝置包括相背設置的兩個吸嘴，每個吸嘴對應一個該晶圓承載盤設置。The grain sorting machine according to claim 6 is characterized in that the grain suction device includes two suction nozzles arranged opposite to each other, and each suction nozzle is set corresponding to one of the wafer carrier trays.

如請求項1的晶粒分類機，其特徵在於，該晶粒吸取裝置還包括抽吸管和負壓結構，該負壓結構透過抽吸管連接該吸嘴，為該吸嘴提供吸力。The grain sorter according to claim 1, wherein the grain suction device further includes a suction pipe and a negative pressure structure, and the negative pressure structure is connected to the suction nozzle through the suction pipe to provide suction for the suction nozzle.

如請求項9的晶粒分類機，其特徵在於，該吸嘴具有一抽吸口，該抽吸口周圍設置有柔性吸附墊。The grain sorter according to claim 9 is characterized in that the suction nozzle has a suction port, and a flexible suction pad is arranged around the suction port.