CN107134423B - Flip chip bonding device and bonding method thereof - Google Patents
Flip chip bonding device and bonding method thereof Download PDFInfo
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- CN107134423B CN107134423B CN201610113379.6A CN201610113379A CN107134423B CN 107134423 B CN107134423 B CN 107134423B CN 201610113379 A CN201610113379 A CN 201610113379A CN 107134423 B CN107134423 B CN 107134423B
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
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- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
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Abstract
In the flip chip bonding device and the bonding method thereof provided by the invention, the chips are adsorbed one by one through the chip forks, the chips on the chip forks are temporarily placed by using the transfer support plate, and then the chips on the transfer support plate are bonded on the substrate at one time, so that the batch bonding of the chips is realized, and the efficiency of the flip chip bonding process is effectively improved.
Description
Technical Field
The invention relates to the technical field of chip packaging, in particular to a flip chip bonding device and a bonding method thereof.
Background
With the development of scientific technology, electronic products are increasingly developed towards lightness, thinness and miniaturization. The flip chip bonding technology has many advantages such as reducing the chip packaging area and shortening the signal transmission path, and thus has been widely used in the field of chip packaging.
Fig. 1 is a schematic diagram illustrating a flip chip bonding apparatus for chip bonding according to the prior art. As shown in fig. 1, the conventional flip chip bonding process mainly includes the following steps: firstly, providing a chip 2 and a substrate 4 to be bonded, wherein the chip 2 is provided with a device surface 3; then, the chip 2 is placed on the bearing table 1 in a manner that the device surface 3 faces upwards; then, the chip 2 is grasped and turned over by the first manipulator 5; then, the chip 2 is transferred to a second manipulator 6 by the first manipulator 5, and after the second manipulator 6 moves the chip 2 above the substrate 4, the alignment mark of the chip 2 is aligned with the alignment mark of the substrate 4 by a CCD image sensor 7; finally, the chip 2 is pressed down by the second robot 6 to complete bonding.
In the flip chip bonding process, the chip 2 is inverted by using a flip chip bonding device (flip chip bonding device), and the chip 2 is directly bonded to the substrate 4, so that the chip 2 and the substrate 4 form an interconnection structure. However, since the conventional flip chip bonding apparatus can bond only one chip at a time (about 30 seconds), the entire process flow is performed in series, and thus the yield is very low, which is difficult to meet the requirement of mass production.
Therefore, how to improve the problem that the yield of the flip chip bonding device in the prior art is low and the requirement of mass production is difficult to meet becomes a technical problem that needs to be solved by the technical personnel in the field.
Disclosure of Invention
The invention aims to provide a flip chip bonding device and a bonding method thereof, which aim to solve the problems that the existing flip chip bonding device is low in yield and difficult to meet the requirement of mass production.
In order to solve the above technical problem, the present invention provides a flip chip bonding apparatus, including: the device comprises a first manipulator, a piece fork, a bonding table, a first base station, a second base station, an alignment system, a fine adjustment manipulator, a transfer support plate and a control system;
the first base station is used for bearing a chip, the second base station is used for bearing the transfer support plate, and the transfer support plate is used for temporarily placing the chip;
the bonding table is used for bearing a substrate, and the substrate is used for being finally bonded with the chip;
the chip fork is arranged on the first manipulator and used for adsorbing a plurality of chips;
the alignment system measures the positions of the chip, the substrate and the transfer carrier plate according to the instruction of the control system, so as to realize the alignment of the chip and the chip fork, the chip fork and the transfer carrier plate and the substrate;
the fine adjustment mechanical arm is arranged on the first base station or the second base station and is used for being matched with the piece fork to adjust the position of the chip;
the first mechanical arm, the piece fork, the bonding table, the first base station, the alignment system, the fine tuning mechanical arm and the second base station are controlled by the control system in a unified mode, and the first base station, the second base station and the first mechanical arm can move in multiple degrees of freedom.
Preferably, in the flip chip bonding apparatus, the alignment system includes: a first image detector, a second image detector and a third image detector;
the first image detector is installed on the first mechanical arm, and the second image detector and the third image detector are both fixedly arranged below the bonding table.
Preferably, the flip chip bonding device further comprises an ejector pin mechanism, wherein the ejector pin mechanism is connected with the first base platform and used for matching the first manipulator to pick up the chip.
Preferably, in the flip chip bonding device, the ejector pin mechanism comprises an ejector pin head, an adsorption structure and a Y-direction movement mechanism, and the ejector pin head and the adsorption structure are both fixed above the Y-direction movement mechanism.
Preferably, flip-chip bonding device in, the fine tuning manipulator include supporting mechanism, Z to motion and be used for adsorbing the precision sucking disc of chip, Z is fixed to the motion one side of supporting mechanism, the precision sucking disc is fixed Z is to the top of motion.
Preferably, the flip chip bonding apparatus further includes: the system comprises a slide library, a substrate library, a second manipulator and a third manipulator;
the slide glass warehouse is close to the first base station and used for placing slide glasses; the substrate library is close to the third base station and used for placing the substrate with the bonded chip and the bonded base; the second mechanical arm realizes the grabbing and transmission of the slide glass through the control system, and the third mechanical arm realizes the grabbing and transmission of the substrate through the control system.
Preferably, in the flip chip bonding apparatus, the external dimension of the interposer carrier is smaller than or equal to the external dimension of the substrate.
The invention also provides a flip chip bonding method, which comprises the following steps:
providing a slide glass, wherein a group of chips are distributed on the slide glass;
picking up the chips on the carrier one by using a chip fork;
adjusting the position of the chip on the chip fork;
temporarily placing the chip with the adjusted position on a transfer support plate at one time;
providing a substrate; and
and bonding the chip temporarily placed on the transfer carrier plate to the substrate at one time.
Preferably, in the flip chip bonding method, the picking up the chips on the carrier one by using a fork and the adjusting the chip positions on the fork include:
moving the pre-bonded chip to the position right below the first manipulator through the first base station, and jacking up the chip by using a thimble mechanism;
moving a first image detector and a chip fork to a pickup position of the chip, and picking up the chip by using the chip fork;
acquiring the position information of the chip through the first image detector, and adjusting the position of the chip on the film fork according to the position information; and
and repeating the process until the number and the arrangement mode of the chips on the chip fork meet the process requirements.
Preferably, in the flip chip bonding method, the process of temporarily placing the chip after the position adjustment on the interposer carrier at one time includes:
moving the piece fork to the upper part of the second base platform through the first mechanical arm;
temporarily placing the chips on the chip forks on a transfer support plate at one time; and
and moving the piece fork back to the position above the first base platform through the first manipulator.
Preferably, in the flip chip bonding method, the process of bonding the chip temporarily placed on the interposer carrier onto the substrate at one time includes:
moving the transfer support plate to the lower part of the bonding table through a second base station;
respectively measuring the positions of the substrate and the transfer carrier plate;
adjusting the posture of the bonding table according to the measurement result to align the substrate with the transfer support plate;
bonding the chip on the transfer carrier plate to a substrate at one time;
separating the transfer support plate from the chip, and moving the transfer support plate back to the original position through the second base station; and
and repeating the steps until the number and the layout of the chips on the substrate meet the process requirements.
Preferably, in the flip chip bonding method, after providing a carrier before picking up chips on the carrier one by using a fork, the method further includes: and grabbing the slide glass from the slide glass library by using a second mechanical arm, and placing the slide glass on the first base station.
Preferably, in the flip chip bonding method, after the chip temporarily placed on the interposer carrier is bonded to the substrate at one time, the method further includes: and grabbing the substrate by a third mechanical arm, and placing the substrate into a substrate library.
In the flip chip bonding device and the bonding method thereof provided by the invention, the chips are adsorbed one by one through the chip forks, the chips on the chip forks are temporarily placed by using the transfer support plate, and then the chips on the transfer support plate are bonded on the substrate at one time, so that the batch bonding of the chips is realized, and the efficiency of the flip chip bonding process is effectively improved.
Drawings
FIG. 1 is a schematic diagram of a flip chip bonding apparatus for chip bonding according to the prior art;
fig. 2 is a schematic structural diagram of a flip chip bonding apparatus according to a first embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a thimble mechanism according to a first embodiment of the present invention;
fig. 4 is a schematic structural diagram of a fine adjustment robot according to a first embodiment of the present invention;
FIG. 5 is a flowchart of a flip chip bonding method according to a first embodiment of the invention;
FIG. 6 is a rear side view of a chip adsorbed by a chip fork according to a first embodiment of the present invention;
FIG. 7 is a bottom view of a chip adsorbed by a chip fork according to a first embodiment of the present invention;
fig. 8 is a schematic structural view of a flip chip bonding apparatus according to a first embodiment of the present invention during temporary placement;
FIG. 9 is a schematic structural diagram of a flip chip bonding apparatus according to a first embodiment of the present invention during final bonding
Fig. 10 is a schematic structural view of a flip chip bonding apparatus according to a second embodiment of the present invention.
Detailed Description
The flip chip bonding apparatus and the bonding method thereof according to the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. Advantages and features of the present invention will become apparent from the following description and from the claims. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
[ EXAMPLES one ]
Fig. 2 is a schematic structural diagram of a flip chip bonding apparatus according to a first embodiment of the invention. As shown in fig. 2, the flip chip bonding apparatus 1000 includes: a first robot 206, a wafer fork 208, a bonding station 209, a first base station 110, a second base station 200, an alignment system, a fine tuning robot 213, a transfer carrier plate 214, and a control system 500; the first base platform 110 is used for carrying the chip 203, the second base platform 200 is used for carrying the interposer carrier 214, and the interposer carrier 214 is used for temporarily placing the chip 203; the bonding table 209 is used for bearing a substrate 210, and the substrate 210 is used for final bonding with the chip 203; the chip fork 208 is mounted on the first robot 206, and the chip fork 208 is used for adsorbing a plurality of chips; the alignment system measures the positions of the chip 203, the substrate 210 and the interposer carrier 214 according to the instruction of the control system 500, so as to align the chip 140 with the blade fork 208, the blade fork 208 with the interposer carrier 214 and the interposer carrier 214 with the substrate 210; the fine adjustment robot 213 is disposed above the first base 110, and is configured to cooperate with the blade fork 208 to adjust the position of the chip 203; the first robot 206, the wafer fork 208, the bonding stage 209, the first base 110, the second base 200, the alignment system, and the fine robot 213 are controlled by the control system 500, and the first base 110, the second base 200, and the first robot 206 can be moved in multiple degrees of freedom.
Specifically, the flip chip bonding apparatus 1000 includes a separation fine tuning region 100 and a bonding region 400, where the separation fine tuning region 100 is used for separation and fine tuning of a chip, and the bonding region 400 is used for bonding the chip and a substrate. The first robot 206 and the first base 110 are disposed in the fine separation adjustment area 100, and the bonding stage 209 is disposed in the bonding area 400. The second base 200 moves back and forth between the separation fine adjustment region 100 and the bonding region 400, the transfer carrier 214 is fixedly mounted on the second base 200, and the second base 200 can drive the transfer carrier 214 to perform multi-degree-of-freedom motion simultaneously.
The transfer carrier 214 is temporarily placed on the chip 203 by an adsorption manner. The specific adsorption method is not limited herein, and may be vacuum adsorption, electrostatic adsorption or other methods as long as the chip 203 can be effectively adsorbed.
In this embodiment, the size of the adapting chip 170 can be adjusted according to the size requirement of the actual chip. Preferably, the size of the interposer carrier 214 is smaller than or equal to that of the substrate 210, so as to improve process adaptability.
Before the chip is temporarily placed on the interposer carrier, the chip 203 and the interposer carrier 214 need to be aligned. Interposer carrier 214 and substrate 210 need to be aligned before final bonding of the chip and substrate. In order to achieve accurate alignment, a chip mark 150 is disposed on the device surface of each chip 203, a substrate mark is disposed on the substrate 210, and a carrier mark is disposed on the transfer carrier 214.
Correspondingly, the flip chip bonding apparatus 1000 further includes an alignment system, and the alignment system performs position measurement on the chip mark 150, the substrate mark and the carrier mark according to the instruction of the control system 500, so as to achieve alignment of the chip 203.
With continued reference to fig. 2, the alignment system includes a first image detector 207, a second image detector 211 and a third image detector 212, the first image detector 207 is mounted on the first robot 206, and the second image detector 211 and the third image detector 212 are both fixedly disposed below the bonding stage 209. Wherein the relative positions of the second image detector 211 and the third image detector 212 have been calibrated offline.
Referring to fig. 2, the first robot 206 picks up a plurality of chips through the film fork 208, and the first robot 206 carries the chips to perform a multi-degree-of-freedom motion while driving the first image detector 207 and the film fork 208 to perform a multi-degree-of-freedom motion. The chip fork 208 is made of a semiconductor material having light transmittance. When the first image detector 207 scans a single chip and a chip mark, image information of the chip and the chip mark is acquired through the sheet fork 208.
Referring to fig. 2, the fine tuning robot 213 is disposed above the first base 110 and spaced apart from the transfer carrier 214, and the fine tuning robot 213 is controlled by the control system 500 to realize multiple degrees of freedom. The fine adjustment robot 213 is used to cooperate with the blade fork 208 to adjust the position of the chip.
Please refer to fig. 3, which is a schematic structural diagram of a fine tuning robot according to an embodiment of the present invention. As shown in fig. 3, the fine robot 213 includes a support mechanism 221, a Z-direction movement mechanism 222, and a precision chuck 223 for sucking a chip, the Z-direction movement mechanism 222 is fixed to one side of the support mechanism 221, and the precision chuck 223 is fixed above the Z-direction movement mechanism 222. Wherein, the Z-direction movement mechanism 222 performs a vertical movement according to the instruction of the control system 500.
With continued reference to fig. 2, the flip chip bonding apparatus 1000 further includes a pin mechanism (Z-pin)120, wherein the pin mechanism (Z-pin)120 is fixedly connected to the first base 110, and is configured to cooperate with the first manipulator 206 to pick up the chip 203.
Please refer to fig. 4, which is a schematic structural diagram of a thimble mechanism according to a first embodiment of the present invention. As shown in fig. 4, the ejector pin mechanism 120 includes: the ejection needle head 111, the adsorption structure 112 and the Y-direction movement mechanism 113, the ejection needle head 111 and the adsorption structure 112 are fixed above the Y-direction movement mechanism 113, the adsorption structure 112 is used for adsorbing a slide, the ejection needle head 111 is used for ejecting a pre-bonded chip, and the Y-direction movement mechanism 113 carries out Y-direction movement according to an instruction of the control system 500. Since the ejector pin 111 and the suction structure 112 are fixedly connected to the Y-direction moving mechanism 113, the Y-direction movement can be synchronized with the Y-direction moving mechanism 113. In this embodiment, the adsorption structure 112 adopts a vacuum adsorption manner to adsorb the slide.
With continued reference to fig. 2, the flip chip bonding apparatus 1000 further includes a slide magazine 000, a substrate magazine 030, a second manipulator 010, and a third manipulator 040, where the slide magazine 000 is used to place a slide 202, the substrate magazine 030 is used to place a substrate on which the chip 203 and the substrate 210 are bonded, the second manipulator 010 captures and transmits the slide 202 through the control system 500, and the third manipulator 040 captures and transmits the substrate 210 through the control system 500.
In this embodiment, the first robot 206, the blade fork 208, the bonding stage 209, the first base 110, the second base 200, the ejector mechanism 120, the fine adjustment robot 213, the second robot 010, and the third robot 040 are all controlled by the control system 500.
In this embodiment, the flip chip bonding apparatus 1000 adsorbs the plurality of chips 203 through the chip fork 208, and temporarily places the plurality of chips 203 on the transfer carrier 214, and further bonds the plurality of chips 203 temporarily placed on the transfer carrier 214 to the substrate 210 at one time, so as to implement batch bonding of the chips and effectively improve the efficiency of the flip chip bonding process.
Correspondingly, the embodiment also provides a flip chip bonding method. With continued reference to fig. 2, the flip chip bonding method includes the following steps:
step S10: providing a slide 202, wherein a group of chips 203 are distributed on the slide 202;
step S11: picking up chips 203 on the slide 202 one by one with a fork 208;
step S12: adjusting the position of the chip on the chip fork 208;
step S13: temporarily placing the chip 203 after the position adjustment on the transfer carrier plate 214 at one time;
step S14: providing a substrate 210;
step S15: the chip 203 temporarily placed on the interposer carrier 214 is bonded to the substrate 210 at one time.
Specifically, first, a carrier 202 is provided, and the carrier 202 is placed in the carrier library 000 of the flip chip bonding apparatus 20, wherein a group of chips 203 is arranged on the carrier 202.
Next, the slide 202 is grasped from the slide magazine 000 using the second robot 010 and the slide 202 is placed on the first stage 110. At this time, the pre-bonded chip 203 is placed on the first stage 110 with the device side up.
The chips 203 on the slide 202 are then picked up one by one using a fork 208. The specific processes of picking up the chips 203 on the slide 202 one by one and adjusting the chip positions on the chip fork 208 include:
step S111: moving the pre-bonded chip 203 through the first base 110 to a position directly below the first robot 206, and lifting up the chip 203 by the ejector mechanism 120;
step S112: the first robot 206 carries the first image detector 207 and the chip fork 208 to a pickup position of the chip 203, and picks up the chip 203 using the chip fork 208;
step S113: acquiring the position information of the chip 203 through the first image detector 207, and adjusting the position of the chip 203 on the chip fork 208 according to the position information acquired by the first image detector 207;
step S114: the above process is repeated until the number and arrangement of the chips on the chip fork 208 meet the process requirements.
Specifically, in step S111, the suction structure 112 of the ejector mechanism 120 sucks the slide sheet 202, and the ejector pin 111 of the ejector mechanism 120 lifts up the chip 203 to wait for the first manipulator 206 to grasp the chip 203.
In step S112, the first robot 206 carries the first image detector 207 and the chip fork 208 to a position directly above the chip 203, and scans the chip 203 through the first image detector 207, that is, the first image detector 207 reads image information of the chip 203 through the chip fork 208.
If the scanning result shows that the chip 203 is defective or there is no chip, the first manipulator 206 moves to the position of the next chip, and the ejector pin mechanism 120 moves to the position of the next chip accordingly. If the scanning result shows that the chip 203 satisfies the pick-up condition, the first robot 206 drives the first image detector 207 to align the chip mark 150 of the chip 203 downward (at this time, the chip mark 150 of the chip 203 faces the blade fork 208), and then the first robot 206 moves vertically to a pick-up position while keeping the chip 203 stationary in the horizontal direction, and sucks the chip 203 through the blade fork 208 at the pick-up position, so that the chip 203 is separated from the slide 202, and then the first robot 206 moves upward to an initial position.
In step S113, after the first image detector 207 acquires the position information of the chip 203, if the position of the chip 203 needs to be adjusted, the first robot 206 moves with the chip 203 to the upper side of the fine robot 213 to perform a first transfer (the chip 203 is transferred to the precision chuck 223 of the fine robot 213 by the blade fork 208 of the first robot 206), and the fine robot 213 descends with the chip 203 to the next transfer position. At the same time, the position of the film fork 208 on the first robot 206 is adjusted based on the position information obtained by the first image detector 207. After the adjustment, the fine robot 213 and the first robot 206 are handed over for a second time (the chip 203 is handed over from the precision chuck 223 of the fine robot 213 to the blade fork 208 of the first robot 206), so that the precise adjustment of the chip position is completed.
The chip pick-up and position adjustment process is repeated until the number and arrangement of the chips on the chip fork 208 meet the process requirements. Please refer to fig. 6 and fig. 7, which are schematic structural diagrams of a chip adsorbed by a chip fork according to a first embodiment of the invention. As shown in fig. 6 and 7, after the chip 203 is sucked by the chip fork 208, the chip 203 is arranged on the chip fork 208 according to the process requirements, and the device surface of the chip 203 faces the chip fork 208, that is, the chip mark 150 on the chip 203 is close to the chip fork 208.
After that, the chip 203 after the position adjustment is temporarily placed on the transfer carrier 214 at one time. The specific process of temporarily placing the picked chip 203 on the interposer carrier 214 at one time includes:
step S121: moving the blade fork 208 over the second base 200 by the first robot 206;
step S122: temporarily placing all the chips 203 on the chip fork 208 on the transfer carrier plate 214;
step S123: the blade fork 208 is moved back over the first base 110 by the first robot 206.
Specifically, in step S122, the interposer carrier 214 temporarily places the chips by suction, and all the chips 203 on the fork 208 are transferred onto the interposer carrier 214.
As shown in fig. 8, after the chip 203 is temporarily placed on the interposer carrier 214, the device surface of the chip 203 faces away from the interposer carrier 214, i.e., the chip mark 150 of the chip 203 faces upward.
The size, number and position of the chips 203 temporarily placed on the interposer carrier 214 can be adjusted according to actual process requirements.
Thereafter, a substrate 210 is provided and the substrate 210 is secured to the bonding stage 209 of the flip chip bonding apparatus 20. In this embodiment, the substrate 210 may be made of a metal material, a semiconductor material, or an organic material.
Finally, the chip 203 temporarily placed on the interposer carrier 214 is bonded to the substrate 210 at one time. The specific process of bonding the chip 203 temporarily placed on the interposer carrier 214 to the substrate 210 at one time includes:
step S151: moving the transfer carrier plate 214 to the lower part of the bonding table 209 through the second base 200;
step S152: measuring the positions of the substrate 210 and the interposer carrier 214 respectively;
step S153: adjusting the posture of the bonding table 209 according to the measurement result, so that the substrate 210 on the bonding table 209 is aligned with the transfer carrier plate 214;
step S154: bonding the chip 203 on the transfer carrier plate 214 to the substrate 210 at one time;
step S155: separating the transfer carrier plate 214 from the chip 203, and moving the transfer carrier plate 214 back to the original position through the second base station 200;
step S156: the above steps are repeated until the number and layout of the chips on the substrate 210 meet the process requirements.
Specifically, in step S151, the relay carrier plate 214 is moved to the bonding area 400 by the second base 200 and positioned below the bonding stage 209. As shown in fig. 9, the interposer carrier 214 is opposite to the substrate 210, the chip 203 on the interposer carrier 214 faces the substrate 210, and the chip mark 150 of the chip 203 is located between the chip 203 and the substrate 210.
In step S152, the second image detector 211 and the third image detector 212 are used to detect the carrier plate mark and the substrate mark, respectively, and since the relative positions of the second image detector 211 and the third image detector 212 are calibrated offline, the positional relationship between the substrate 210 and the transfer carrier plate 214 can be obtained according to the detection results of the second image detector 211 and the third image detector 212.
In step S153, the control system 500 adjusts the posture of the bonding stage 209 according to the measurement result of the image probe, so that the substrate 210 is aligned with the transfer carrier 214.
In step S154, the chip 203 on the relay carrier plate 214 is bonded to the substrate 210 at one time by the second base 200. Subsequently, the interposer carrier 214 is separated from the chip 203, and the interposer carrier 214 is moved back to the separation fine adjustment region 300 by the second stage 200. And the first robot 206 starts to pick up the chips 203 on the carrier 202 one by one again, and the number and the arrangement of the chips on the substrate 210 meet the process requirements, or the chips 203 on the carrier 202 are all bonded to the substrate 210.
To this end, a substrate is formed. The substrate comprises a base 210 and a plurality of chips 203 bonded on the base 210, and the plurality of chips 203 and the base 430 form an interconnection structure.
Finally, the substrate is grasped by the third robot 040 and placed into the substrate magazine 030.
The flip chip bonding method provided in this embodiment includes a temporary placement and a final bonding, where the device surface (upward) of the chip 203 faces away from the interposer carrier 214 during the temporary placement, and the device surface (upward) of the chip 203 faces the substrate 430 during the final bonding. It can be seen that the chip 203 is facing up on the device side (front side) during the temporary placement process and during the final bonding process, and the flip chip bonding process does not require flipping the chip.
[ example two ]
Fig. 7 is a schematic structural diagram of a flip chip bonding apparatus according to a second embodiment of the invention. As shown in fig. 7, the flip chip bonding apparatus 2000 includes: the flip chip bonding apparatus 1000 includes: a first robot 206, a wafer fork 208, a bonding station 209, a first base station 110, a second base station 200, an alignment system, a fine tuning robot 213, a transfer carrier plate 214, and a control system 500; the first base platform 110 is used for carrying the chip 203, the second base platform 200 is used for carrying the interposer carrier 214, and the interposer carrier 214 is used for temporarily placing the chip 203; the bonding table 209 is used for bearing a substrate 210, and the substrate 210 is used for final bonding with the chip 203; the chip fork 208 is mounted on the first robot 206, and the chip fork 208 is used for adsorbing a chip; the alignment system measures the positions of the chip 203, the substrate 210 and the interposer carrier 214 according to the instruction of the control system 500, so as to align the chip 140 with the blade fork 208, the blade fork 208 with the interposer carrier 214 and the interposer carrier 214 with the substrate 210; the fine adjustment robot 213 is disposed on the second base 200, and is configured to cooperate with the blade fork 208 to adjust the position of the chip 203; the first robot 206, the wafer fork 208, the bonding stage 209, the first base 110, the second base 200, the alignment system, and the fine robot 213 are controlled by the control system 500, and the first base 110, the second base 200, and the first robot 206 can be moved in multiple degrees of freedom.
Specifically, the first image detector 207 and the film fork 208 are mounted on the first manipulator 206, and the first manipulator 206 can drive the first image detector 207 and the film fork 208 to perform multi-degree-of-freedom motion. The transfer carrier plate 214 is fixedly mounted on the second base 200, and the second base 200 can drive the transfer carrier plate 214 to perform multi-degree-of-freedom motion simultaneously.
In this embodiment, the fine robot 213 is disposed above the second base 200 and spaced apart from the transfer carrier 214, and the fine robot 213 has a suction function to suck the chip.
The present embodiment is different from the first embodiment in that the fine adjustment robot 213 is disposed above the second base 200, and the fine adjustment robot 213 of the first embodiment is disposed above the first base 110.
Specifically, when the first robot 206 moves above the fine adjustment robot 213 with the chip 203, the fine adjustment robot 213 lifts up and holds the chip 203. Thereafter, the fine robot 213 lowers the chip 203 with it to the next transfer position. After the chip fork 208 has adjusted its position on the first robot 206 according to the position information, the fine manipulator 213 lifts up and transfers the chip 203 to the chip fork 208 of the first robot 206.
In summary, in the flip chip bonding apparatus and the bonding method thereof provided by the embodiments of the present invention, the chip forks are used to adsorb the chips one by one, the chip on the chip forks is temporarily placed on the transfer carrier plate, and then the chip on the transfer carrier plate is bonded to the substrate at one time, so that batch bonding of the chips is realized, and the efficiency of the flip chip bonding process is effectively improved.
The above description is only for the purpose of describing the preferred embodiments of the present invention, and is not intended to limit the scope of the present invention, and any variations and modifications made by those skilled in the art based on the above disclosure are within the scope of the appended claims.
Claims (13)
1. A flip chip bonding apparatus, comprising: the device comprises a first manipulator, a piece fork, a bonding table, a first base station, a second base station, a transfer support plate, an alignment system, a fine tuning manipulator and a control system;
the first base station is used for bearing a chip, the second base station is used for bearing the transfer support plate, and the transfer support plate is used for temporarily placing the chip;
the bonding table is used for bearing a substrate, and the substrate is used for being finally bonded with the chip;
the chip fork is arranged on the first manipulator and used for adsorbing a plurality of chips;
the alignment system carries out position measurement on the chip, the substrate and the transfer carrier plate according to the instruction of the control system, so as to realize the alignment of the chip and the chip fork, the chip fork and the transfer carrier plate and the substrate;
the fine adjustment mechanical arm is arranged on the first base station or the second base station and is used for being matched with the piece fork to adjust the position of the chip;
the first manipulator, the piece fork, the bonding table, the first base station, the second base station, the alignment system and the fine adjustment manipulator are uniformly controlled by the control system, and the first base station, the second base station and the first manipulator can realize multi-degree-of-freedom motion;
wherein, a chip mark is arranged on the chip, a substrate mark is arranged on the substrate, and a carrier plate mark is arranged on the transfer carrier plate;
when on the first base station, when the first manipulator carries out the alignment operation, when the fine tuning manipulator carries out handing-over alignment and when bonding with the base, the device face of chip is always dorsad the switching support plate, the device face of chip is towards the base.
2. The flip chip bonding apparatus of claim 1, wherein the alignment system comprises: a first image detector, a second image detector and a third image detector;
the first image detector is installed on the first mechanical arm, and the second image detector and the third image detector are both fixedly arranged below the bonding table.
3. The flip chip bonding apparatus of claim 1, further comprising a pin mechanism coupled to the first stage for engaging the first robot to pick up a chip.
4. The flip chip bonding apparatus of claim 3, wherein the ejector mechanism includes an ejector pin, a suction structure, and a Y-motion mechanism, and the ejector pin and the suction structure are fixed above the Y-motion mechanism.
5. The flip chip bonding apparatus of claim 1, wherein the fine adjustment robot comprises a support mechanism, a Z-direction movement mechanism fixed to one side of the support mechanism, and a precision chuck for sucking the chip, the precision chuck being fixed above the Z-direction movement mechanism.
6. The flip chip bonding apparatus of claim 1, further comprising: the system comprises a slide library, a substrate library, a second manipulator and a third manipulator;
the slide glass warehouse is close to the first base station and used for placing slide glasses; the substrate library is close to the bonding table and used for placing the substrate with the chip and the substrate bonded completely; the second mechanical arm realizes the grabbing and transmission of the slide glass through the control system, and the third mechanical arm realizes the grabbing and transmission of the substrate through the control system.
7. The flip chip bonding apparatus of claim 1, wherein the interposer carrier has a physical dimension less than or equal to a physical dimension of the substrate.
8. A flip chip bonding method using the flip chip bonding apparatus according to any one of claims 1 to 7, comprising:
providing a slide glass, wherein a group of chips are distributed on the slide glass;
picking up the chips on the carrier one by using a chip fork;
adjusting the position of the chip on the chip fork;
temporarily placing the chip with the adjusted position on a transfer support plate at one time; providing a substrate; and
bonding the chip temporarily placed on the transfer carrier plate to the substrate at one time;
wherein, a chip mark is arranged on the chip, a substrate mark is arranged on the substrate, and a carrier plate mark is arranged on the transfer carrier plate;
when temporarily placed, the device surface of the chip faces away from the interposer carrier, and the device surface of the chip faces the substrate when finally bonded.
9. The flip chip bonding method of claim 8, wherein picking up chips on the carrier one by one with a chip fork and adjusting chip positions on the chip fork comprises:
moving the pre-bonded chip to the position right below the first manipulator through the first base station, and jacking up the chip by using a thimble mechanism;
moving a first image detector and a chip fork to a pickup position of the chip, and picking up the chip by using the chip fork;
acquiring the position information of the chip through the first image detector, and adjusting the position of the chip on the film fork according to the position information; and
and repeating the process until the number and the arrangement mode of the chips on the chip fork meet the process requirements.
10. The flip chip bonding method of claim 8, wherein the process of temporarily placing the chip after the position adjustment on the interposer carrier at one time comprises:
moving the piece fork to the upper part of the second base platform through the first mechanical arm;
temporarily placing the chips on the chip forks on a transfer support plate at one time; and
and moving the piece fork back to the position above the first base platform through the first manipulator.
11. The flip chip bonding method of claim 8, wherein the process of bonding the chip temporarily placed on the interposer carrier onto the substrate at one time comprises:
moving the transfer support plate to the lower part of the bonding table through a second base station;
respectively measuring the positions of the substrate and the transfer carrier plate;
adjusting the posture of the bonding table according to the measurement result to align the substrate with the transfer support plate;
bonding the chip on the transfer carrier plate to a substrate at one time;
separating the transfer support plate from the chip, and moving the transfer support plate back to the original position through the second base station; and
and repeating the steps until the number and the layout of the chips on the substrate meet the process requirements.
12. The flip chip bonding method of claim 8, wherein after providing a carrier before picking up chips on the carrier one by one with a chip fork, further comprising: and grabbing the slide glass from the slide glass library by using a second mechanical arm, and placing the slide glass on the first base station.
13. The flip chip bonding method of claim 8, further comprising, after bonding the chip temporarily placed on the interposer carrier onto the substrate at one time: and grabbing the substrate by a third mechanical arm, and placing the substrate into a substrate library.
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| CN109037135B (en) * | 2018-06-07 | 2021-11-12 | 无锡思锐电子设备科技有限公司 | Silicon wafer turnover mechanism |
| CN109037420B (en) * | 2018-07-02 | 2021-01-08 | 惠州雷通光电器件有限公司 | Flip chip die bonding device and method |
| CN114628240A (en) * | 2020-12-10 | 2022-06-14 | 武汉新芯集成电路制造有限公司 | Chip wafer stacking method |
| CN117096064A (en) * | 2023-09-21 | 2023-11-21 | 恩纳基智能科技无锡有限公司 | Double-station high-precision flip packaging equipment |
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