TWM448050U - Device for picking off defective dices to prevent sticking back - Google Patents
Device for picking off defective dices to prevent sticking back Download PDFInfo
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- TWM448050U TWM448050U TW101221483U TW101221483U TWM448050U TW M448050 U TWM448050 U TW M448050U TW 101221483 U TW101221483 U TW 101221483U TW 101221483 U TW101221483 U TW 101221483U TW M448050 U TWM448050 U TW M448050U
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Description
本創作係有關於一種已測試晶粒之晶圓黏膜中對不良晶粒的移除裝置，尤指一種防止回沾之不良晶粒剔除裝置。This creation is about a device for removing defective grains in a wafer film of a tested die, especially a bad grain reject device for preventing back-dipping.
已知電子微小元件是大量製造在一半導體晶圓上再予以切割多個黏附於一晶圓黏膜上的微小晶粒，故難免會有不良晶粒的產生，必須經過測試才會知道不良晶粒在晶圓黏膜上的正確位置，再予以移除之，而留上在晶圓黏膜上的已知良好晶粒，目前發光二極體晶粒皆是採用此一處理模式。It is known that electronic micro-components are mass-produced on a semiconductor wafer and then cut into a plurality of fine crystal grains adhered to a wafer film, so that it is inevitable that bad crystal grains will be generated, and it is necessary to test to know the bad crystal grains. The correct position on the wafer mucosa is removed, leaving a known good grain on the wafer's mucus, which is currently used in the light-emitting diode die.
我國發明專利公開第201025475號揭示一種「缺陷晶粒揀出系統及其方法」，缺陷晶粒揀出系統包含一擴張環平台及一取放裝置。該擴張環平台包含一承載座及鄰近該承載座之一平台表面，該承載座用以承載一貼片晶圓，該平台表面用於設置一儲箱。該取放裝置係以線性移動之方式移動於該承載座與該平台表面間。頂針機構將位於膠膜上之缺陷晶粒以頂針上頂之方式使其脫離，以利取放裝置取出。利用控制取放裝置之吸嘴之正負壓力與吸嘴的上下位置，以完成缺陷晶粒之取放動作。習知頂針機構通常會施加超音波震盪並接觸到缺陷晶粒下方的膠膜，這將會造成膠膜的傷害與良好晶粒在黏性薄膜上的位移，特別是膠膜會有高低位差變形。China Patent Publication No. 201025475 discloses a "defective grain picking system and method thereof". The defective grain picking system comprises an expanding ring platform and a pick-and-place device. The expansion ring platform includes a carrier and a platform surface adjacent to the carrier, the carrier is configured to carry a patch wafer, and the surface of the platform is used to set a tank. The pick and place device moves in a linear movement between the carrier and the surface of the platform. The thimble mechanism disengages the defective dies on the film from the top of the thimble to facilitate the removal of the pick-up device. The positive and negative pressure of the nozzle of the pick-and-place device and the upper and lower positions of the nozzle are controlled to complete the pick-and-place operation of the defective die. Conventional thimble mechanism usually applies ultrasonic shock and contacts the film under the defect crystal, which will cause damage to the film and displacement of good grains on the viscous film, especially the film will have high and low difference. Deformation.
以上述習知處理方式當不良晶粒被移除之後，良好晶粒在黏性薄膜上的位移與晶圓黏膜的高低位差變形等問題將使得良好晶粒無法由原本承載但已變形的黏性薄膜上順利地被拾取出，故已知良好晶粒需要經過以一暫時轉貼黏膜與另一完整新晶圓黏膜的兩道轉貼操作，相當的浪費耗材。In the above conventional treatment method, after the defective crystal grains are removed, the displacement of the good crystal grains on the adhesive film and the deformation of the high and low dispersion of the wafer mucosa will make the good crystal grains unable to be carried by the original but deformed adhesive. The film is smoothly picked up, so it is known that a good grain needs to pass through two transfer operations of temporarily suspending the film and another complete new film mucus, which is quite wasteful of consumables.
我國新型專利第M386595號揭示一種「半導體晶粒檢測脫離結構」，半導體晶粒黏附於軟性薄膜上，並藉由檢測單元予以檢測，當確認有不良品之半導體晶粒時，利用軟性薄膜底側之頂針單元予以頂出，使其與軟性薄膜之間的接觸面積減小，然後，藉由上方的黏性薄膜予以黏附固定而完全脫離軟性薄膜，因此，此一習知結構的不良晶粒剔除方式係為由下往上的頂出與由上往下的沾黏操作，雖無須將下方軟性薄膜予以戳破，但除了需要浪費一上方黏性薄膜之外，軟性薄膜底側之頂針單元頂出不良晶粒時乃接觸到下方軟性薄膜，頂針單元通常會施加超音波震盪，故容易造成良好晶粒在黏性薄膜上的位移與下方軟性薄膜的高低位差變形，並且上方黏性薄膜乃緊鄰於下方軟性薄膜的上方，易造成無法準確定位晶粒位置以及難以進行外觀檢測的問題。China's new patent No. M386595 discloses a "semiconductor die detection and detachment structure" in which a semiconductor die adheres to a flexible film and is detected by a detecting unit. When a semiconductor die having a defective product is confirmed, the bottom side of the flexible film is utilized. The thimble unit is ejected to reduce the contact area with the flexible film, and then adhered and fixed by the upper adhesive film to completely detach from the soft film. Therefore, the poor grain removal of the conventional structure The method is the bottom-up and the top-down adhesive operation. Although it is not necessary to puncture the lower soft film, in addition to wasting an upper adhesive film, the thimble unit top of the soft film bottom side When the bad crystal grains are in contact with the soft film below, the thimble unit usually applies ultrasonic vibration, so it is easy to cause the displacement of the good crystal grains on the adhesive film and the high and low positional deformation of the lower soft film, and the upper adhesive film is Adjacent to the top of the lower flexible film, it is easy to cause problems in that the crystal grain position cannot be accurately positioned and the appearance detection is difficult.
為了解決上述之問題，本創作之主要目的係在於提供一種防止回沾之不良晶粒剔除裝置，能實施直接對不良晶粒的鏟飛與吸塵式收集操作，藉以取代習知對缺陷晶 粒之取放動作，被剔除後不良晶粒不會回沾黏附到良好晶粒，更可有效避免晶圓黏膜的永久變形或/與穿刺等傷害，並能防止良好晶粒在晶圓黏膜上的位移，同時不良晶粒的剔除效率亦大幅提高。In order to solve the above problems, the main purpose of the present invention is to provide a bad grain rejecting device for preventing back-dipping, which can perform a shovel flying and vacuum collecting operation directly on a bad grain, thereby replacing the conventional defective crystal. After the particles are removed, the bad grains will not stick back to the good grains, and the permanent deformation of the wafer mucosa or/and the puncture can be effectively avoided, and the good grains can be prevented from being on the wafer mucosa. The displacement, while the rejection efficiency of bad grains is also greatly improved.
本創作的目的及解決其技術問題是採用以下技術方案來實現的。本創作揭示一種防止回沾之不良晶粒剔除裝置，主要包含一膜吸附平台、一斜向剷晶機構以及一吸塵式晶粒收集機構。該膜吸附平台係具有一真空吸孔，該真空吸孔內係設置有一晶粒頂出座。該斜向剷晶機構係非縱向對準地設置於該膜吸附平台之上方並具有一斜向往下伸出之剷晶棒。該吸塵式晶粒收集機構係非縱向對準地設置於該膜吸附平台之上方並具有一朝向該剷晶棒之吸附口。The purpose of this creation and solving its technical problems are achieved by the following technical solutions. The present invention discloses a defective grain rejecting device for preventing back-dipping, which mainly comprises a film adsorption platform, a diagonal shovel mechanism and a vacuum-type die collecting mechanism. The membrane adsorption platform has a vacuum suction hole, and the vacuum suction hole is provided with a crystal ejector. The oblique shovel mechanism is disposed non-longitudinally aligned above the film adsorption platform and has a shovel bar extending obliquely downward. The vacuuming die collection mechanism is disposed non-longitudinally aligned above the membrane adsorption platform and has an adsorption port facing the shovel.
本創作的目的及解決其技術問題還可採用以下技術措施進一步實現。The purpose of this creation and solving its technical problems can be further realized by the following technical measures.
在前述之不良晶粒剔除裝置中，該吸附口係可為中間內凹之形狀。In the foregoing defective grain rejecting device, the adsorption port may have a shape of an intermediate recess.
在前述之不良晶粒剔除裝置中，所述中間內凹之形狀係較佳可為半圓弧形。In the foregoing defective grain rejecting device, the shape of the intermediate recess is preferably a semicircular arc shape.
前述之不良晶粒剔除裝置係可安裝在一晶粒外觀檢測機內，其中該膜吸附平台係可設置於一擴膜環中，該斜向剷晶機構與該吸塵式晶粒收集機構之間係可保持一不遮蔽該晶粒頂出座之間隙，以不影響該晶粒外觀檢測機之一光學檢測裝置之縱向檢測路徑。The foregoing bad grain rejecting device can be installed in a grain appearance detecting machine, wherein the film adsorption platform can be disposed in a film expanding ring, and the oblique chip removing mechanism and the dust collecting die collecting mechanism The gap of the die ejector can be kept unobstructed so as not to affect the longitudinal detection path of the optical detecting device of one of the die appearance detectors.
在前述之不良晶粒剔除裝置中，該擴膜環係可相對於該膜吸附平台為可水平移動。In the foregoing defective grain rejecting device, the film expanding ring system is horizontally movable with respect to the film adsorption platform.
在前述之不良晶粒剔除裝置中，該剷晶棒係可連接至一超音波震盪頭。In the aforementioned defective grain rejecting device, the shovel bar can be connected to an ultrasonic oscillating head.
以下將配合所附圖示詳細說明本創作之實施例，然應注意的是，該些圖示均為產品之示意圖，所顯示者為實際實施之形狀及尺寸比例，僅作為一種選置性之具體設計，以提供更清楚的描述。在不同應用的等效性實施例中，元件的形狀、尺寸與數量皆可進行縮小、放大或是簡化。The embodiments of the present invention will be described in detail below with reference to the accompanying drawings. However, it should be noted that the drawings are schematic diagrams of the products, and the actual shapes and sizes are shown as an alternative. Specific design to provide a clearer description. In an equivalent embodiment of the different applications, the shape, size and number of components can be reduced, enlarged or simplified.
依據本創作之一具體實施例，一種防止回沾之不良晶粒剔除裝置100舉例說明於第1圖裝設於一晶粒外觀檢測機200之立體示意圖、第2圖之立體示意圖、第3圖之側面示意圖、第4圖之上視示意圖、以及第5A至5C圖使一不良晶粒21被剔除與收集之過程示意圖。本創作之不良晶粒剔除裝置100係可安裝在一晶粒外觀檢測機200內，該晶粒外觀檢測機200係具有一擴膜環210與一光學檢測裝置220，其中該擴膜環210係拉張一晶圓黏膜10，使得該晶圓黏膜10上的晶粒20之間的間隔變大(如第5A圖所示)。該光學檢測裝置220係包含光學鏡頭(如CCD攝影器)，可由上往下檢測該些晶粒20的外觀是否良好(如第5A圖所示)。According to a specific embodiment of the present invention, a defective die culling device 100 for preventing back smearing is illustrated in a first perspective view of a die appearance inspection machine 200, a perspective view of FIG. 2, and a third diagram. The side schematic view, the top view of Fig. 4, and the schematic diagrams of the process of culling and collecting a defective die 21 are shown in Figs. 5A to 5C. The defective die rejecting device 100 of the present invention can be installed in a grain appearance detecting machine 200. The die appearance detecting machine 200 has a film expanding ring 210 and an optical detecting device 220, wherein the film expanding ring 210 is The wafer 10 is stretched to increase the spacing between the dies 20 on the wafer 10 (as shown in Figure 5A). The optical detecting device 220 includes an optical lens (such as a CCD camera), and it is possible to detect whether the appearance of the crystal grains 20 is good from the top down (as shown in FIG. 5A).
該防止回沾之不良晶粒剔除裝置100係主要包含一 膜吸附平台110、一斜向剷晶機構120以及一吸塵式晶粒收集機構130。The bad grain rejection device 100 for preventing back-dipping mainly comprises one The membrane adsorption platform 110, an oblique chamfering mechanism 120, and a vacuuming die collection mechanism 130.
該膜吸附平台110係具有一真空吸孔111，該真空吸孔111內係設置有一晶粒頂出座112(如第5A至5C圖所示)。該真空吸孔111係用以吸附固定一被拉張晶圓黏膜10使其被判定為不良晶粒21下方之周邊黏膜部位緊貼於該膜吸附平台110(如第5A圖所示)。該晶粒頂出座112係用以頂高一不良晶粒21下方之黏膜部位(如第5A圖所示)，使得該不良晶粒21略高於其它鄰近晶粒20。該晶粒頂出座112的頂端係可為一平面，使得該晶粒頂出座112或可稱之為一平面頂針，該晶粒頂出座112頂端之頂觸面積可趨近於該不良晶粒21之黏膜表面積，或以多點頂觸該晶圓黏膜10之方式，以避免對該晶圓黏膜10造成穿刺破壞。該晶粒頂出座112亦不連接至習知頂針結構之超音波震盪裝置。該晶粒頂出座112之設置用意僅在於提高該不良晶粒21之高度，儘可能不影響該不良晶粒21及其鄰近晶粒20被該晶圓黏膜10黏著之強度，該晶粒頂出座112之頂昇高度亦控制在不會造成該晶圓黏膜10產生永久變形之範圍內。The film adsorption platform 110 has a vacuum suction hole 111. The vacuum suction hole 111 is provided with a die ejector 112 (as shown in FIGS. 5A to 5C). The vacuum suction hole 111 is configured to adsorb and fix a stretched wafer mucosa 10 so as to be determined to be in close contact with the film adsorption platform 110 (as shown in FIG. 5A). The die ejector 112 is used to raise the portion of the mucosa below the defective die 21 (as shown in FIG. 5A) such that the defective die 21 is slightly higher than the other adjacent die 20. The top end of the die ejector 112 can be a plane, such that the die ejector 112 can be referred to as a planar ejector pin, and the top contact area of the top end of the die ejector 112 can approach the defect. The surface area of the die of the die 21, or the multi-point touch of the wafer film 10, to avoid puncture damage to the wafer mucosa 10. The die ejector 112 is also not connected to the ultrasonic oscillating device of the conventional ejector structure. The die ejector 112 is only intended to increase the height of the defective die 21, and does not affect the strength of the defective die 21 and its adjacent die 20 adhered by the wafer die 10 as much as possible. The top elevation of the socket 112 is also controlled within a range that does not cause permanent deformation of the wafer film 10.
此外，在本實施例中，該膜吸附平台110係可設置於一擴膜環210中(如第1圖所示)。並以利用一水平移動機構211移動該擴膜環210與該晶圓黏膜10，使該擴膜環210係可相對於該膜吸附平台110為可水平移動，而令不良晶粒可對準該真空吸孔111的上方。In addition, in this embodiment, the film adsorption platform 110 can be disposed in a film expansion ring 210 (as shown in FIG. 1). And moving the film expansion ring 210 and the wafer mucosa 10 by using a horizontal moving mechanism 211, so that the film expansion ring 210 can be horizontally movable relative to the film adsorption platform 110, so that the defective crystal grains can be aligned. Above the vacuum suction hole 111.
該斜向剷晶機構120係非縱向對準地設置於該膜吸附平台110之上方並具有一斜向往下伸出之剷晶棒121。在本實施例中，該剷晶棒121係可連接至一超音波震盪頭122，藉此形成為一棒狀之超音波震動源。當驅動該剷晶棒121往斜下方伸出，將能直接接觸到不良晶粒21予以剷飛(如第5B圖所示)。The oblique shovel mechanism 120 is disposed above the film adsorption platform 110 in a non-longitudinal alignment and has a shovel bar 121 extending obliquely downward. In the present embodiment, the shovel bar 121 is connectable to an ultrasonic oscillating head 122, thereby forming a rod-shaped ultrasonic vibration source. When the shovel bar 121 is driven to extend obliquely downward, it will be able to directly contact the defective die 21 for scooping (as shown in Fig. 5B).
該吸塵式晶粒收集機構130係非縱向對準地設置於該膜吸附平台110之上方並具有一朝向該剷晶棒121之吸附口131，用以吸塵式收集不良晶粒21於其內部(如第5C圖所示)。較佳地，該吸附口131係可為中間內凹之形狀，以使該吸附口131能更接近該剷晶棒121並且被該剷晶棒121剷飛之不良晶粒即使有偏斜飛出亦能被該吸塵式晶粒收集機構130吸入收集。其中，所述中間內凹之形狀係較佳可為半圓弧形。此外，該斜向剷晶機構120與該吸塵式晶粒收集機構130之間係可保持一不遮蔽該晶粒頂出座112之間隙140，以不影響該晶粒外觀檢測機200之一光學檢測裝置220之縱向檢測路徑。The dust collecting die collection mechanism 130 is disposed above the film adsorption platform 110 in a non-longitudinally aligned manner and has a suction port 131 facing the shovel bar 121 for vacuum collecting the defective die 21 therein. As shown in Figure 5C). Preferably, the adsorption port 131 can be in the shape of an intermediate recess, so that the adsorption port 131 can be closer to the shovel bar 121 and the defective die shoveled by the shovel bar 121 can fly out even if it is deflected. It can also be collected by the vacuum type die collecting mechanism 130. Wherein, the shape of the intermediate recess is preferably semi-circular. In addition, the oblique shovel mechanism 120 and the vacuuming die collecting mechanism 130 can maintain a gap 140 that does not cover the die ejector 112 so as not to affect the optical of the die appearance detector 200. The longitudinal detection path of the detection device 220.
因此，本創作之防止回沾之不良晶粒剔除裝置100能夠實施直接對不良晶粒21的鏟飛與吸塵式收集操作，藉以取代習知對缺陷晶粒之取放動作，被剔除後不良晶粒不會回沾黏附到良好晶粒20，更可有效避免該晶圓黏膜10的永久變形或/與穿刺等傷害，並能防止良好晶粒20在晶圓黏膜10上的位移，同時不良晶粒21的剔除效率亦大幅提高。Therefore, the defective grain rejecting apparatus 100 of the present invention can perform the shovel flying and vacuum collecting operation directly on the defective crystal grain 21, thereby replacing the conventional pick and place operation of the defective crystal grain, and the defective crystal is removed. The particles do not stick back to the good crystal grains 20, and the permanent deformation or/puncture damage of the wafer mucosa 10 can be effectively avoided, and the displacement of the good crystal grains 20 on the wafer mucosa 10 can be prevented, and the crystal grains are poor. The rejection efficiency of the pellet 21 is also greatly improved.
以上所述，僅是本創作的較佳實施例而已，並非對本創作作任何形式上的限制，雖然本創作已以較佳實施例揭露如上，然而並非用以限定本創作，任何熟悉本項技術者，在不脫離本創作之申請專利範圍內，所作的任何簡單修改、等效性變化與修飾，皆涵蓋於本創作的技術範圍內。The above description is only a preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Although the present invention has been disclosed above in the preferred embodiment, it is not intended to limit the present invention, and any familiar technology. Any simple modifications, equivalent changes and modifications made without departing from the scope of the present invention are covered by the technical scope of the present invention.
10‧‧‧晶圓黏膜10‧‧‧ wafer mucosa
20‧‧‧晶粒20‧‧‧ grain
21‧‧‧不良晶粒21‧‧‧bad grains
100‧‧‧防止回沾之不良晶粒剔除裝置100‧‧‧Don't bad grain rejecting device
110‧‧‧膜吸附平台110‧‧‧ Membrane adsorption platform
111‧‧‧真空吸孔111‧‧‧Vacuum suction holes
112‧‧‧晶粒頂出座112‧‧‧Grain ejector
120‧‧‧斜向剷晶機構120‧‧‧ oblique shovel mechanism
121‧‧‧剷晶棒121‧‧‧Shovel
122‧‧‧超音波震盪頭122‧‧‧Supersonic shock head
130‧‧‧吸塵式晶粒收集機構130‧‧‧Dust-type grain collecting mechanism
131‧‧‧吸附口131‧‧‧ adsorption port
140‧‧‧間隙140‧‧‧ gap
200‧‧‧晶粒外觀檢測機200‧‧‧ grain appearance inspection machine
210‧‧‧擴膜環210‧‧‧Drawing ring
211‧‧‧水平移動機構211‧‧‧ horizontal moving mechanism
220‧‧‧光學檢測裝置220‧‧‧ optical inspection device
第1圖：依據本創作之一具體實施例的一種防止回沾之不良晶粒剔除裝置裝設於一晶粒外觀檢測機之立體示意圖。1 is a perspective view of a die-removing device for preventing back-dipping according to a specific embodiment of the present invention.
第2圖：依據本創作之一具體實施例的防止回沾之不良晶粒剔除裝置之立體示意圖。Figure 2 is a perspective view of a defective grain rejecting device for preventing back-dipping according to a specific embodiment of the present invention.
第3圖：依據本創作之一具體實施例的防止回沾之不良晶粒剔除裝置之側面示意圖。Figure 3 is a side elevational view of a defective grain rejecting device for preventing back-dipping according to a specific embodiment of the present invention.
第4圖：依據本創作之一具體實施例的防止回沾之不良晶粒剔除裝置之上視示意圖。Figure 4 is a top plan view of a defective grain rejecting device for preventing back-dipping according to a specific embodiment of the present invention.
第5A至5C圖：利用依據本創作之一具體實施例的防止回沾之不良晶粒剔除裝置使一不良晶粒被剔除與收集之過程示意圖。5A to 5C are views showing a process of rejecting and collecting a defective crystal grain by using a defective grain rejecting device for preventing back-dipping according to an embodiment of the present invention.
10‧‧‧晶圓黏膜10‧‧‧ wafer mucosa
20‧‧‧晶粒20‧‧‧ grain
21‧‧‧不良晶粒21‧‧‧bad grains
100‧‧‧防止回沾之不良晶粒剔除裝置100‧‧‧Don't bad grain rejecting device
110‧‧‧膜吸附平台110‧‧‧ Membrane adsorption platform
111‧‧‧真空吸孔111‧‧‧Vacuum suction holes
112‧‧‧晶粒頂出座112‧‧‧Grain ejector
121‧‧‧剷晶棒121‧‧‧Shovel
130‧‧‧吸塵式晶粒收集機構130‧‧‧Dust-type grain collecting mechanism
131‧‧‧吸附口131‧‧‧ adsorption port
140‧‧‧間隙140‧‧‧ gap
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101221483U TWM448050U (en) | 2012-11-06 | 2012-11-06 | Device for picking off defective dices to prevent sticking back |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW101221483U TWM448050U (en) | 2012-11-06 | 2012-11-06 | Device for picking off defective dices to prevent sticking back |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TWM448050U true TWM448050U (en) | 2013-03-01 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW101221483U TWM448050U (en) | 2012-11-06 | 2012-11-06 | Device for picking off defective dices to prevent sticking back |
Country Status (1)
| Country | Link |
|---|---|
| TW (1) | TWM448050U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI585022B (en) * | 2013-05-22 | 2017-06-01 | Grain sorting methods and equipment | |
| CN112885749A (en) * | 2021-02-05 | 2021-06-01 | 苏州日月新半导体有限公司 | Integrated circuit film expanding device and integrated circuit film expanding method |
-
2012
- 2012-11-06 TW TW101221483U patent/TWM448050U/en not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI585022B (en) * | 2013-05-22 | 2017-06-01 | Grain sorting methods and equipment | |
| CN112885749A (en) * | 2021-02-05 | 2021-06-01 | 苏州日月新半导体有限公司 | Integrated circuit film expanding device and integrated circuit film expanding method |
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