TWI585022B - Grain sorting methods and equipment - Google Patents
Grain sorting methods and equipment Download PDFInfo
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Description
本發明係與晶粒選取製程有關，特別是關於一種晶粒分選方法及晶粒分選設備，係用以挑檢不良晶粒或者按晶粒分類等級挑選晶粒以便進一步分類儲存。 The present invention relates to a die selection process, and more particularly to a die sorting method and a grain sorting apparatus for picking up defective grains or selecting grains according to grain classification levels for further classification and storage.
在晶粒之壞晶(bad die)選取或分類選取製程中，晶圓(wafer)係先黏貼於俗稱藍膜(blue tape)的軟性薄膜上，再被切割成多數晶粒(die)。然後，就壞晶選取作業而言，可利用影像擷取裝置(例如CCD camera)檢測晶粒外觀進行晶粒良莠判斷及位置確認，再將不良品自軟性薄膜上挑除，最後，可將剩餘之晶粒同時自軟性薄膜取下，以便進一步進行諸如封裝之類的後續製程。其次，就晶粒分類選取作業而言，可利用影像擷取裝置對已經分類的晶粒進行位置確認，並利用選取置放裝置(pick-and-place arm)將該等晶粒依據其規格或等級分別取下並分類放置。 In the bad die selection or sorting process of the die, the wafer is first adhered to a soft film commonly known as blue tape, and then cut into a plurality of die. Then, in the case of the bad crystal selection operation, the image capturing device (for example, a CCD camera) can be used to detect the appearance of the crystal grain to perform the grain good judgment and the position confirmation, and then the defective product is removed from the soft film, and finally, The remaining grains are simultaneously removed from the flexible film for further processing such as packaging. Secondly, in the case of the die sorting operation, the image picking device can be used to confirm the position of the classified crystal grains, and the picking-and-place arm is used to select the crystal grains according to the specifications or Levels are removed and sorted separately.
習用之選取置放裝置包含有單取放頭模式及雙取放頭模式，其作動方式皆係利用旋轉驅動器及線性驅動器驅動一擺臂垂直移動及水平擺動，以使設置於該擺臂且具有真空吸引功能的吸頭能向下移動而吸取晶粒，再向上移動，然後將晶粒帶往另一軟性薄膜上方，再向下移動而將晶粒分類放置於該軟性薄膜。 The conventional pick-and-place device includes a single pick-and-place mode and a dual pick-and-place mode, wherein the driving method uses a rotary driver and a linear driver to drive a swing arm to vertically move and horizontally swing so as to be disposed on the swing arm and have The suction function of the vacuum suction function can move downward to suck the crystal grains, move up, and then take the crystal grains over the other soft film, and then move down to classify the crystal grains on the soft film.
單取放頭模式之選取置放裝置係利用一線性驅動器驅動一設有一擺臂及一吸頭之旋轉驅動器，或者，亦可利用一旋轉驅動器驅動一設有一擺臂及一吸頭之線性驅動器；不論前述何種形式，其中一該驅動器必須帶動另一該驅動器、該擺臂及該吸頭，因負載重而使其作動速度有限，造成晶粒分選效率難以提升。 The single pick-and-place mode selection device uses a linear driver to drive a rotary actuator having a swing arm and a suction head, or a rotary driver can be used to drive a linear actuator having a swing arm and a suction head. Regardless of the above-mentioned form, one of the drivers must drive the other of the driver, the swing arm and the suction head, and the operating speed is limited due to the heavy load, which makes the grain sorting efficiency difficult to increase.
雙取放頭模式之選取置放裝置係利用一旋轉驅動器同時驅轉二線性驅動器，且該二線性驅動器分別設有一擺臂及一吸頭，雖然該二 吸頭能同時分別執行吸取晶粒及放置晶粒之動作，以提升晶粒分選效率，然而，該旋轉驅動器必須帶動二線性驅動器、二擺臂及二吸頭，其負載係較單取放頭模式更重，因而作動速度更低，造成其晶粒分選效率之提升仍有限。 The dual pick-and-place mode selection device uses a rotary driver to simultaneously drive the two linear actuators, and the two linear actuators respectively have a swing arm and a suction head, although the two The suction head can simultaneously perform the action of sucking the die and placing the die to improve the efficiency of the grain sorting. However, the rotary drive must drive the two-linear actuator, the second swing arm and the two-tip, and the load is relatively single-handed. The head mode is heavier and therefore the actuation speed is lower, resulting in a limited increase in the efficiency of grain sorting.
另外，在前述之雙取放頭模式之選取置放裝置中，以及線性驅動器受旋轉驅動器帶動之形式的單取放頭模式之選取置放裝置中，線性驅動器之電線容易在擺動時受到拉扯而產生斷線問題。 In addition, in the above-mentioned dual pick and place mode selection and placement device, and the linear drive is driven by the rotary drive in the form of a single pick and place mode, the linear drive wire is easily pulled during the swing. A disconnection problem has occurred.
有鑑於上述缺失，本發明之主要目的在於提供一種晶粒分選方法，適用於壞晶挑除或晶粒分類選取作業中，用以將黏設於軟性薄膜之晶粒取離，且其效率高並可避免電線扯斷之問題。 In view of the above-mentioned deficiencies, the main object of the present invention is to provide a method for sorting crystal grains, which is suitable for use in bad crystal picking or grain sorting operations, for removing crystal grains adhered to a soft film, and the efficiency thereof. High and can avoid the problem of wire breakage.
為達成上述目的，本發明所提供之一種晶粒分選方法，係用以將一黏設於一軟性薄膜之晶粒自該軟性薄膜上取離，該晶粒選取方法包含有以下步驟：a)提供一吸頭、一具有真空吸引功能之頂推座以及一頂針，該頂針係可沿其軸向滑移地穿設於該頂推座；b)使該吸頭平移至一問隔對應一待選取晶粒之第一位置；c)使該具有真空吸引功能之頂推座連同該頂針自一隔著該軟性薄膜而間隔對應該待選取晶粒之預備位置朝該吸頭的方向移動，以頂推該軟性薄膜及該待選取晶粒直到該待選取晶粒吸附於該吸頭；d)使該頂推座吸附住該軟性薄膜並朝遠離該吸頭的方向移動至該預備位置；e)使該頂針朝遠離該吸頭的方向移動至該預備位置；以及f)使該吸頭自該第一位置平移離開至一用以置放晶粒之第二位置。 In order to achieve the above object, a grain sorting method provided by the present invention is for removing a die adhered to a flexible film from the flexible film. The die selection method comprises the following steps: a Providing a suction head, a pusher having a vacuum suction function, and a thimble, the thimble being slidably disposed along the axial direction of the ejector; b) translating the tip to a spacing a first position of the selected die; c) causing the vacuum attraction function ejector and the thimble to be spaced apart from the preparation position of the die to be selected from the soft film Pushing the soft film and the die to be selected until the die to be selected is adsorbed to the tip; d) causing the pusher to adsorb the soft film and moving away from the tip to the preparatory position e) moving the thimble away from the tip to the preparatory position; and f) translating the tip from the first position to a second position for placing the die.
藉此，該晶粒分選方法在進行晶粒選取作業時，由於用以吸附晶粒之吸頭僅作平移動作，因此本方法不需設置用以作動該吸頭沿晶粒頂推方向位移的線性驅動器，因此用以作動該吸頭之驅動器將具有較小的負載而可使該吸頭相當快速地移動，且即使該驅動器為旋轉驅動器亦可避免電線扯斷之問題。 Therefore, when the grain sorting method is performed, since the tip for adsorbing the crystal grains only performs the translational action, the method does not need to be arranged to actuate the tip to be displaced along the grain pushing direction. The linear actuator, so that the actuator used to actuate the tip, will have a lower load to allow the tip to move relatively quickly, and even if the drive is a rotary drive, the problem of wire tearing can be avoided.
較佳地，在前述之晶粒分選方法中，該吸頭係設置於一擺臂，且該擺臂係受一驅動器驅動而擺動，使該吸頭可在該第一位置與該第二位置之間平移。藉此，該驅動器僅需驅動該擺臂及該吸頭，因負載小而作動效率高。 Preferably, in the foregoing grain sorting method, the tip is disposed on a swing arm, and the swing arm is driven to be swung by a driver, so that the tip can be in the first position and the second Pan between positions. Thereby, the driver only needs to drive the swing arm and the suction head, and the operation efficiency is high due to the small load.
較佳地，在前述之晶粒分選方法中，該擺臂設置有二該吸 頭，其中一該吸頭位於該第一位置時，另一該吸頭係位於該第二位置，反之亦然。 Preferably, in the foregoing method of grain sorting, the swing arm is provided with two suctions. The head, wherein one of the tips is in the first position, the other of the tips is in the second position, and vice versa.
本發明之另一目的在於提供一種以上述方法為基礎之晶粒 分選方法，適用於壞晶挑除或晶粒分類選取作業中，用以將黏設於一第一軟性薄膜之晶粒取離，再將該晶粒放置於一第二軟性薄膜，且其效率高並可避免電線扯斷之問題。 Another object of the present invention is to provide a die based on the above method The sorting method is suitable for the bad crystal picking or grain sorting operation, and is used for removing the crystal grains adhered to a first soft film, and then placing the crystal grains on a second soft film, and High efficiency and avoid the problem of wire breakage.
為達成上述目的，本發明所提供之晶粒分選方法係用以將 一黏設於一第一軟性薄膜之晶粒自該第一軟性薄膜上取離，再將該晶粒放置於一第二軟性薄膜，該第一軟性薄膜及該第二軟性薄膜分別具有一第一表面，以及一與該第一表面朝向相反方向之第二表面，該晶粒係位於該第一軟性薄膜之第一表面；該晶粒分選方法之步驟包含有：a)提供一吸取裝置、一能產生真空吸引功能之頂推座、一實質上沿一垂直於該第一軟性薄膜及該第二軟性薄膜之頂推軸向地穿設於該頂推座之頂針，以及一置晶台；該吸取裝置包含有至少一能產生真空吸引功能之吸頭，該吸頭能實質上垂直於該頂推軸向地移動，並能與該第一軟性薄膜之第一表面相對，亦能與該第二軟性薄膜之第一表面相對；該頂推座及該頂針係與該第一軟性薄膜之第二表面相對，且能分別實質上沿該頂推軸向移動；該置晶台係與該第二軟性薄膜之第二表面相對，且能實質上沿該頂推軸向移動；b)使該吸取裝置之吸頭、該頂推座及該頂針位於對應該晶粒之位置；c)使該頂推座及該頂針朝該吸取裝置之吸頭的方向移動而頂推該第一軟性薄膜及該晶粒，進而使該晶粒吸附於該吸頭；d)使該頂推座朝遠離該吸取裝置之吸頭的方向移動，同時使該第一軟性薄膜之第二表面吸附於該頂推座，進而使該第一軟性薄膜之第一表面與該晶粒分離；e)使該頂針朝遠離該吸取裝置之吸頭的方向移動；f)使該吸取裝置之吸頭連同該晶粒移動而使該晶粒與該第二軟性薄膜之第一表面相對且對應於該置晶台；g)使該置晶台朝該吸取裝置之吸頭的方向移動而頂推該第二軟性薄膜，進而使該晶粒黏附於該第二軟性薄膜之第一表面；以及h)使該置晶台朝遠離該吸取裝置之吸頭的方向移動。 In order to achieve the above object, the grain sorting method provided by the present invention is used to A die adhered to a first flexible film is removed from the first flexible film, and the die is placed on a second flexible film, wherein the first flexible film and the second flexible film respectively have a first a surface, and a second surface facing the first surface opposite to the first surface, the die is located on the first surface of the first flexible film; the step of the grain sorting method comprises: a) providing a suction device a ejector capable of generating a vacuum suction function, a thimble axially extending through the ejector seat substantially perpendicular to the first flexible film and the second flexible film, and a seeding The suction device comprises at least one suction head capable of generating a vacuum suction function, the suction head being axially movable substantially perpendicular to the thrust, and capable of being opposite to the first surface of the first flexible film, Opposite the first surface of the second flexible film; the ejector pin and the thimble are opposite to the second surface of the first flexible film, and are respectively movable substantially along the thrust axis; the crystal system is Opposite the second surface of the second flexible film And moving substantially along the thrust axial direction; b) positioning the suction head of the suction device, the ejector and the ejector at a position corresponding to the die; c) causing the pusher and the ejector toward the suction Moving in the direction of the tip of the device to push the first flexible film and the die, thereby adsorbing the die to the tip; d) moving the pusher toward the tip away from the suction device, Simultaneously adsorbing the second surface of the first flexible film to the ejector, thereby separating the first surface of the first flexible film from the die; e) moving the thimble away from the tip of the suction device Moving; f) moving the tip of the suction device together with the die to make the die opposite the first surface of the second flexible film and corresponding to the crystallizing table; g) causing the crystal plate to face the suction Moving in the direction of the tip of the device to push the second flexible film to adhere the die to the first surface of the second flexible film; and h) moving the crystal plate away from the tip of the suction device Move in direction.
藉此，該晶粒分選方法能用於晶粒分類選取作業，意即將 該第一軟性薄膜上黏設之多數晶粒分類放置於該第二軟性薄膜，其中該吸取裝置不需設有能產生實質上沿該頂推軸向之位移動作的線性驅動器，因此該吸取裝置之驅動器的負載小而可使該吸頭相當快速地移動，且即使該吸取裝置之驅動器為旋轉驅動器亦可避免電線扯斷之問題。 Thereby, the grain sorting method can be used for grain sorting operation, meaning A plurality of crystal grains adhered on the first flexible film are classified and placed on the second flexible film, wherein the suction device does not need to be provided with a linear actuator capable of generating a displacement action substantially along the thrust axis, and thus the suction device The load of the driver is small to allow the tip to move relatively quickly, and the problem of the wire being torn off can be avoided even if the driver of the suction device is a rotary drive.
較佳地，在前述之晶粒分選方法中，該步驟f)、該步驟g) 及該步驟h)執行的過程中，另一黏設於該第一軟性薄膜之第一表面的晶粒係相對該頂推座及該頂針位移至對應該頂推座及該頂針之位置；藉此，該晶粒分選方法可連續且快速地對多數晶粒逐一進行分類。 Preferably, in the foregoing grain sorting method, the step f), the step g) And the step of performing the step h), the other die attached to the first surface of the first flexible film is displaced relative to the ejector and the thimble to a position corresponding to the pusher and the ejector; Thus, the grain sorting method can continuously and quickly classify a plurality of crystal grains one by one.
本發明之又一目的在於提供一種晶粒分選設備，能用以執 行前述之能用於晶粒分類選取作業之晶粒分選方法。 Another object of the present invention is to provide a die sorting device that can be used to perform The foregoing method of grain sorting which can be used for grain sorting selection operations.
為達成上述目的，本發明所提供之晶粒分選設備，係用以 將一黏設於一第一軟性薄膜之晶粒自該第一軟性薄膜上取離，再將該晶粒放置於一第二軟性薄膜，該第一軟性薄膜及該第二軟性薄膜分別具有一第一表面，以及一與該第一表面朝向相反方向之第二表面，該晶粒係位於該第一軟性薄膜之第一表面；該晶粒分選設備包含有一吸取裝置、一頂推座、一頂針，以及一置晶台；該吸取裝置包含有至少一能產生真空吸引功能之吸頭，該吸頭能實質上平行於該第一軟性薄膜及該第二軟性薄膜地移動，並能與該第一軟性薄膜之第一表面相對，亦能與該第二軟性薄膜之第一表面相對；該頂推座係能產生真空吸引功能，且係與該第一軟性薄膜之第二表面相對，並能實質上沿一垂直於該第一軟性薄膜及該第二軟性薄膜之頂推軸向移動；該頂針係實質上沿該頂推軸向地穿設於該頂推座，且係與該第一軟性薄膜之第二表面相對，並能實質上沿該頂推軸向移動；該置晶台係與該第二軟性薄膜之第二表面相對，且能實質上沿該頂推軸向移動。 In order to achieve the above object, the die sorting device provided by the present invention is used for A die that is adhered to a first flexible film is removed from the first flexible film, and the die is placed on a second flexible film, and the first flexible film and the second flexible film respectively have a a first surface, and a second surface facing the first surface opposite to the first surface, the die is located on the first surface of the first flexible film; the die sorting device comprises a suction device, a pusher, a thimble, and a crystal setting table; the suction device comprises at least one suction head capable of generating a vacuum suction function, the suction head being movable substantially parallel to the first flexible film and the second soft film, and capable of The first surface of the first flexible film is opposite to the first surface of the second flexible film; the push-pull seat can generate a vacuum suction function and is opposite to the second surface of the first flexible film. And moving substantially along an axial direction perpendicular to the first flexible film and the second flexible film; the thimble is substantially axially disposed along the thrusting axis of the ejector, and Second surface phase of the first soft film , And to substantially axially along the pushing movement; of the die table surface of the second system with a second film of relatively flexible, substantially along the pushing capable of axial movement.
較佳地，在前述之晶粒分選方法及晶粒分選設備中，該吸 取裝置更包含有一驅動器，以及一設置於該驅動器之擺臂，該吸頭係設置於該擺臂，該驅動器能驅動該擺臂繞該頂推軸向擺動，藉以將該吸頭帶動至可達成該步驟b)之一第一位置，以及將該吸頭帶動至可達成該步驟f)之一第二位置；藉此，該驅動器僅需驅動該擺臂及該吸頭，因負載小而作動效率高。 Preferably, in the foregoing grain sorting method and grain sorting apparatus, the sucking The picking device further includes a driver, and a swing arm disposed on the driver, the nozzle is disposed on the swing arm, and the driver can drive the swing arm to swing around the jacking direction, thereby driving the nozzle to A first position of the step b) is reached, and the suction head is driven to reach a second position of the step f); thereby, the driver only needs to drive the swing arm and the suction head, because the load is small The efficiency of the operation is high.
較佳地，在前述之晶粒分選方法及晶粒分選設備中，該吸 取裝置包含有二該吸頭，其中一該吸頭位於該第一位置時，另一該吸頭係位於該第二位置；藉此，該二吸頭能同時分別吸取晶粒及放置晶粒，因此可更加提升晶粒分選效率。 Preferably, in the foregoing grain sorting method and grain sorting apparatus, the sucking The picking device comprises two nozzles, wherein one of the picking heads is located at the first position, and the other of the picking heads is located at the second position; thereby, the two picking heads can simultaneously pick up the crystal grains and place the crystal grains respectively Therefore, the efficiency of grain sorting can be further improved.
有關本發明所提供之晶粒分選方法及設備的詳細構造、特 點、組裝或使用方式，將於後續的實施方式詳細說明中予以描述。然而，在本發明領域中具有通常知識者應能瞭解，該等詳細說明以及實施本發明所列舉的特定實施例，僅係用於說明本發明，並非用以限制本發明之專利申請範圍。 Detailed construction and method of the grain sorting method and apparatus provided by the present invention The manner of point, assembly or use will be described in the detailed description of the subsequent embodiments. However, it should be understood by those of ordinary skill in the art that the present invention is not limited by the scope of the invention.
10‧‧‧晶粒分選設備 10‧‧‧Grading sorting equipment
11、12‧‧‧承載台 11, 12‧‧‧ Carrying platform
13‧‧‧吸取裝置 13‧‧‧ suction device
132‧‧‧驅動器 132‧‧‧ drive
134‧‧‧擺臂 134‧‧‧ swing arm
136‧‧‧吸頭 136‧‧‧ tips
14‧‧‧頂推座 14‧‧‧ 推座
142‧‧‧穿孔 142‧‧‧Perforation
15‧‧‧頂針 15‧‧‧ thimble
16‧‧‧置晶台 16‧‧‧ crystal table
21‧‧‧第一軟性薄膜 21‧‧‧First soft film
211‧‧‧第一表面 211‧‧‧ first surface
212‧‧‧第二表面 212‧‧‧ second surface
22‧‧‧第二軟性薄膜 22‧‧‧Second soft film
221‧‧‧第一表面 221‧‧‧ first surface
222‧‧‧第二表面 222‧‧‧ second surface
23、24‧‧‧環形框架 23, 24‧‧‧ ring frame
30、31、32、33、34‧‧‧晶粒 30, 31, 32, 33, 34‧‧ ‧ grains
40‧‧‧晶粒分選設備 40‧‧‧Grad sorting equipment
43‧‧‧吸取裝置 43‧‧‧ suction device
432‧‧‧驅動器 432‧‧‧ drive
434‧‧‧擺臂 434‧‧‧ swing arm
436、438‧‧‧吸頭 436, 438‧‧ ‧ tips
P1‧‧‧第一位置 P1‧‧‧ first position
P2‧‧‧第二位置 P2‧‧‧ second position
第1圖為本發明一第一較佳實施例所提供之晶粒分選設備的頂視示意圖；第2圖至第8圖為本發明該第一較佳實施例所提供之晶粒分選設備的前視示意圖，並顯示本發明所提供之晶粒分選方法的各步驟；第9圖為本發明一第二較佳實施例所提供之晶粒分選設備的頂視示意圖；以及第10圖至第13圖為本發明該第二較佳實施例所提供之晶粒分選設備的前視示意圖，並顯示本發明所提供之晶粒分選方法的各步驟。 1 is a top plan view of a die sorting apparatus according to a first preferred embodiment of the present invention; FIGS. 2 to 8 are graphs of grain sorting provided by the first preferred embodiment of the present invention; A front view of the device and showing the steps of the grain sorting method provided by the present invention; FIG. 9 is a top plan view of the die sorting apparatus provided by a second preferred embodiment of the present invention; 10 to 13 are front views of the die sorting apparatus provided by the second preferred embodiment of the present invention, and show the steps of the grain sorting method provided by the present invention.
申請人首先在此說明，在以下將要介紹之實施例以及圖式中，相同之參考號碼，表示相同或類似之元件或其結構特徵。其次，當述及一元件與另一元件相對時，代表前述元件係直接面對該另一元件，或者前述元件係隔著其他元件而間接地面對該另一元件。 The Applicant first describes the same or similar elements or structural features thereof in the embodiments and the drawings which will be described below. In the following, when an element is referred to as the other element, it is meant that the element is directly facing the other element, or the element is indirectly connected to the other element.
請參閱第1圖至第8圖，第1圖為本發明一第一較佳實施例所提供之晶粒分選設備10的頂視示意圖，第2圖至第8圖為該晶粒分選設備10的前視示意圖，並顯示本發明所提供之晶粒分選方法的各步驟。該晶粒分選設備10包含有二承載台11、12、一吸取裝置13、一頂推座14、一頂針15，以及一置晶台16。該晶粒分選設備10係用以將黏設於一第一軟 性薄膜21之晶粒30(包含有晶粒31、32、33)自該第一軟性薄膜21上取離，再將晶粒30放置於一第二軟性薄膜22。 Please refer to FIG. 1 to FIG. 8. FIG. 1 is a top plan view of a die sorting apparatus 10 according to a first preferred embodiment of the present invention, and FIG. 2 to FIG. 8 show the die sorting. A front schematic view of apparatus 10 and showing the various steps of the grain sorting method provided by the present invention. The die sorting apparatus 10 includes two carrying stages 11, 12, a suction device 13, a pusher 14, a thimble 15, and a crystal stage 16. The die sorting device 10 is used to be glued to a first soft The crystal grains 30 of the film 21 (including the crystal grains 31, 32, and 33) are separated from the first flexible film 21, and the crystal grains 30 are placed on a second flexible film 22.
該第一軟性薄膜21及該第二軟性薄膜22可為習用之藍膜(blue tape)或者其他具有黏性之不透明、半透明或透明之薄膜，且係分別受一環形框架23、24框住，該二環形框架23、24係分別固設於該二承載台11、12。該第一軟性薄膜21及該第二軟性薄膜22分別具有一第一表面211、221，以及一與該第一表面211、221朝向相反方向之第二表面212、222，該第一軟性薄膜21之第一表面211黏設有多數晶粒30。值得一提的是，該等晶粒30係由一黏設於該第一軟性薄膜21之第一表面211的晶圓(wafer)切割而成，因此，該等晶粒30係間隔很小的距離地排列成圓形，第1圖係簡化地以一圓形表示該第一軟性薄膜21所黏設之所有晶粒30，第2圖至第8圖僅顯示該等晶粒30中的三晶粒31、32、33以便說明。 The first flexible film 21 and the second flexible film 22 may be a conventional blue tape or other viscous opaque, translucent or transparent film, and are respectively framed by an annular frame 23, 24. The two annular frames 23 and 24 are respectively fixed to the two carriers 11 and 12. The first flexible film 21 and the second flexible film 22 respectively have a first surface 211, 221, and a second surface 212, 222 opposite to the first surface 211, 221, the first flexible film 21 The first surface 211 is adhered to a plurality of crystal grains 30. It is worth mentioning that the crystal grains 30 are cut by a wafer adhered to the first surface 211 of the first flexible film 21, and therefore, the crystal grains 30 are closely spaced. The distance is arranged in a circular shape. In the first drawing, all the crystal grains 30 to which the first flexible film 21 is adhered are shown in a circular shape. FIGS. 2 to 8 show only three of the crystal grains 30. The grains 31, 32, 33 are for illustration.
該二承載台11、12係分別受一雙軸向位移機構(圖中未示)驅動而能沿圖式中所示之X軸及Y軸位移，以分別帶動該二軟性薄膜21、22位移；藉此，該第一軟性薄膜21上之一受選取之晶粒可被移動至可受該吸取裝置13吸取之位置，且該第二軟性薄膜22用以供該受選取之晶粒放置的部位可位移至特定位置，以使該吸取裝置13能將該受選取之晶粒放置於該部位。由於前述之雙軸向位移機構為一般自動化機械中常見之可產生沿一平面(X-Y平面)往復位移動作的機構，且並非本創作之技術特徵所在，因此容申請人在此不贅述其詳細結構且不於圖式中顯示。 The two stages 11 and 12 are respectively driven by a pair of axial displacement mechanisms (not shown) to be displaced along the X-axis and the Y-axis as shown in the drawings to respectively drive the displacement of the two flexible films 21 and 22. Thereby, the selected one of the first flexible film 21 can be moved to a position absorbable by the suction device 13, and the second flexible film 22 is used for the selected die to be placed. The portion can be displaced to a particular position to enable the suction device 13 to place the selected die at the location. Since the aforementioned biaxial displacement mechanism is a mechanism commonly used in general automation machinery to generate a reciprocating displacement motion along a plane (XY plane), and is not a technical feature of the present invention, the applicant will not repeat the detailed structure here. It is not shown in the drawing.
該吸取裝置13包含有一驅動器132、一設置於該驅動器132之擺臂134，以及一設置於該擺臂134且能產生真空吸引功能之吸頭136。該驅動器132可為一般伺服旋轉馬達，以驅動該擺臂134繞一垂直於該第一軟性薄膜21及該第二軟性薄膜22之頂推軸向(亦即圖式中所示之Z軸)擺動，藉以使該吸頭136能被平移帶動至一與該第一軟性薄膜21之第一表面211相對而間隔對應一待選取晶粒32之第一位置P1(如第2圖至第5所示)，亦能被帶動至一與該第二軟性薄膜22之第一表面221相對而用以置放晶粒之第二位置P2(如第6圖至第8所示)。 The suction device 13 includes a driver 132, a swing arm 134 disposed on the driver 132, and a suction head 136 disposed on the swing arm 134 and capable of generating a vacuum suction function. The driver 132 can be a general servo rotation motor to drive the swing arm 134 around an axial direction perpendicular to the first flexible film 21 and the second flexible film 22 (ie, the Z axis shown in the drawing). Swinging, so that the tip 136 can be translated to be opposite to the first surface 211 of the first flexible film 21 and spaced corresponding to a first position P1 of the die 32 to be selected (as shown in Figures 2 to 5) It can also be driven to a second position P2 (as shown in FIGS. 6 to 8) opposite to the first surface 221 of the second flexible film 22 for placing the die.
值得一提的是，該吸取裝置13之構造及該吸頭136受帶動之方式並不以本實施例所提供者為限，只要該吸頭136能實質上垂直於該 頂推軸向(Z軸)地移動(亦即沿X-Y平面移動)，並能在與該二軟性薄膜21、22之第一表面211、221相對之第一、二位置P1、P2之間往復平移即可。 It should be noted that the configuration of the suction device 13 and the manner in which the suction head 136 is driven are not limited to those provided in the embodiment, as long as the suction head 136 can be substantially perpendicular to the The thrusting axis (Z-axis) moves (i.e., moves along the XY plane) and can reciprocate between the first and second positions P1, P2 opposite to the first surfaces 211, 221 of the two flexible films 21, 22. Panning it.
該頂針15係實質上沿該頂推軸向(Z軸)地穿設於該頂推 座14，亦即可沿其軸向滑移地穿設於該頂推座14，且該頂推座14具有多數平行該頂推軸向(Z軸)之穿孔142，該等穿孔142係用以與一真空吸引裝置(圖中未示)連通而使該頂針座14產生真空吸引功能。該頂推座14及該頂針15係與該第一軟性薄膜21之第二表面212相對，且係分別受一線性驅動器(圖中未示)驅動而能實質上沿該頂推軸向(Z軸)移動，各該線性驅動器可為一音圈馬達(voice coil motor；簡稱VCM)，但不以此為限。 The ejector pin 15 is disposed substantially in the thrusting axial direction (Z axis) The seat 14 is also slidably disposed along the axial direction of the pedestal 14 and has a plurality of perforations 142 parallel to the thrust axis (Z-axis). The perforations 142 are used. The ejector pin 14 is caused to have a vacuum suction function in communication with a vacuum suction device (not shown). The ejector 14 and the ejector pin 15 are opposite to the second surface 212 of the first flexible film 21, and are respectively driven by a linear actuator (not shown) to substantially follow the thrust axis (Z). Each of the linear actuators may be a voice coil motor (VCM), but is not limited thereto.
該置晶台16係與該第二軟性薄膜22之第二表面222相對， 且亦受一線性驅動器(圖中未示)驅動而能實質上沿該頂推軸向(Z軸)移動。該置晶台16亦可(但不限於)設有多數穿孔，以與一真空吸引裝置連通而產生真空吸引功能。 The crystal stage 16 is opposite to the second surface 222 of the second flexible film 22, It is also driven by a linear actuator (not shown) to move substantially along the thrust axis (Z-axis). The crystal stage 16 can also, but is not limited to, be provided with a plurality of perforations to communicate with a vacuum suction device to create a vacuum suction function.
以下將以利用該晶粒分選設備10將晶粒32自第一軟性薄膜21移置到第二軟性薄膜22為例說明本發明所提供之一種晶粒分選方法，該晶粒分選方法之步驟包含有： Hereinafter, a grain sorting method provided by the present invention will be described by taking the grain sorting apparatus 10 to displace the crystal grain 32 from the first flexible film 21 to the second flexible film 22 as an example, and the grain sorting method is provided. The steps include:
a)提供一吸頭136、一具有真空吸引功能之頂推座14以及一頂針15，該頂針15係可沿其軸向滑移地穿設於該頂推座14。前述構件之具體實施態樣，可參酌上述之晶粒分選設備10。 a) A suction head 136, a push-pull seat 14 having a vacuum suction function, and a ejector pin 15 are provided. The ejector pin 15 is slidably disposed along the ejector seat 14 along its axial direction. For the specific implementation of the foregoing components, the above-described grain sorting apparatus 10 can be considered.
b)使吸頭136平移至間隔對應一待選取晶粒32之第一位置P1。詳而言之，如第2圖所示，使該吸取裝置13之吸頭136、該頂推座14及該頂針15位於對應該晶粒32之位置。在本實施例中，該頂推座14及該頂針15只會沿該頂推軸向(Z軸)移動，而不會沿X軸或Y軸移動，此步驟係由該承載台11及該擺臂134分別將該晶粒32及該吸頭136帶動至對應該頂推座14及該頂針15之位置，此時，該吸頭136係位於如前述之第一位置P1。然而，該第一軟性薄膜21及該晶粒32亦可固定不動，而採用能產生X軸及Y軸位移之吸取裝置及頂推座來達成此步驟。 b) Translating the tip 136 to a first position P1 corresponding to a die 32 to be selected. In detail, as shown in FIG. 2, the suction head 136 of the suction device 13, the ejector 14 and the ejector pin 15 are located at positions corresponding to the die 32. In this embodiment, the ejector 14 and the ejector pin 15 are only moved along the thrust axis (Z-axis) without moving along the X-axis or the Y-axis. This step is performed by the carrier 11 and the The swing arm 134 respectively drives the die 32 and the tip 136 to a position corresponding to the pusher 14 and the ejector pin 15. At this time, the tip 136 is located at the first position P1 as described above. However, the first flexible film 21 and the die 32 can also be fixed, and the suction device and the ejector for generating X-axis and Y-axis displacement can be used to achieve this step.
c)如第3圖所示，使該頂推座14連同該頂針15自一隔著該軟性薄膜21而間隔對應該待選取晶粒32之預備位置(如第2圖所示)朝 該吸取裝置13之吸頭136的方向移動，而頂推該第一軟性薄膜21及該晶粒32，直到該晶粒32接觸並吸附於該吸頭136為止，在第3圖中，該頂推座14及該頂針15係位於一頂推位置。 c) as shown in Fig. 3, the ejector 14 and the ejector pin 15 are spaced apart from each other by the flexible film 21, corresponding to the preliminary position of the die 32 to be selected (as shown in Fig. 2) The direction of the suction head 136 of the suction device 13 is moved, and the first flexible film 21 and the die 32 are pushed up until the die 32 contacts and is adsorbed to the tip 136. In FIG. 3, the top is The pusher 14 and the ejector pin 15 are located in an thrust position.
d)使該頂推座14吸附住該軟性薄膜21並朝遠離該吸頭136 的方向移動復歸至原有的、如第2圖所示的預備位置。詳而言之，如第4圖所示，使該頂推座14朝遠離該吸取裝置13之吸頭136的方向移動，在此同時，該第一軟性薄膜21之第二表面212係被吸附於該頂推座14，進而使該第一軟性薄膜21之第一表面211與該晶粒32分離。在此步驟中，藉由該吸頭136對該晶粒32之吸力、該頂推座14對該第一軟性薄膜21之吸力，以及該頂針15對該晶粒32之頂持力，可確保該晶粒32與該第一軟性薄膜21快速分離，以避免發生頂推座14下降但第一軟性薄膜21未隨之下降或該晶粒32跟著下降之情況。 d) causing the ejector 14 to adsorb the flexible film 21 and away from the tip 136 The direction of movement is reset to the original preparatory position as shown in Fig. 2. In detail, as shown in FIG. 4, the ejector 14 is moved away from the tip 136 of the suction device 13, while the second surface 212 of the first flexible film 21 is adsorbed. The pedestal 14 further separates the first surface 211 of the first flexible film 21 from the die 32. In this step, the suction force of the die 32 by the tip 136, the suction force of the ejector 14 against the first flexible film 21, and the urging force of the ejector pin 15 on the die 32 ensure The die 32 is quickly separated from the first flexible film 21 to avoid a situation in which the pusher 14 is lowered but the first flexible film 21 is not lowered or the die 32 is lowered.
e)如第5圖所示，使該頂針15朝遠離該吸取裝置13之吸 頭136的方向移動復歸至原有的預備位置。必須加以說明的是，在上述頂推座14自頂推位置移動至預備位置的復歸過程中，該頂針15可以實質上保持不動，直等到該頂推座14復歸至前述預備位置之後，該頂針才進行復歸的動作，以確保頂推座14復歸時，晶粒32仍受頂針15頂持，使晶粒可以確實脫離軟性薄膜21：或者，該頂推座14開始離開頂推位置並朝向預備位置移動但尚未停定於前述預備位置之時，該頂針15即離開該頂推位置以進行此步驟中之頂針復歸動作(亦即，頂針15實質上保持不動之時間相當短)，如此可以提高效率。此外，如第4、5圖所示，在上述頂推座14移動復歸的過程中，該頂針15實質上係刺破該軟性薄膜21而直接頂抵於晶粒32，然而，此並非必要之限制條件，因為只要適當地設計該吸頭136停定於該第一位置P1時與待選取晶粒之間的間隔距離，則頂推座14連同頂針15向上頂推該軟性薄膜21之行程可以適當地縮小，以致頂推座14在移動復歸的過程中，該頂針15仍然可以保持在隔著該軟性薄膜21而間接頂抵住晶粒32之狀況下(亦即，不刺破軟性薄膜21)，而進行後續的頂針15復歸動作。 e) as shown in Fig. 5, the ejector pin 15 is attracted away from the suction device 13 The direction of movement of the head 136 is reset to the original preparatory position. It should be noted that the ejector pin 15 may remain substantially stationary during the resetting process of the ejector 14 from the push-up position to the preparatory position until the ejector 14 is returned to the aforementioned preparatory position. The returning action is performed to ensure that when the ejector 14 is reset, the die 32 is still held by the ejector pin 15 so that the die can be surely detached from the flexible film 21: alternatively, the ejector 14 begins to move away from the push position and toward the preparation. When the position moves but has not stopped at the aforementioned preparatory position, the ejector pin 15 leaves the push-pull position to perform the ejector reset operation in this step (that is, the time during which the thimble 15 remains substantially stationary is relatively short), which can be improved. effectiveness. In addition, as shown in FIGS. 4 and 5, during the movement of the ejector 14 to move back, the ejector pin 15 substantially pierces the flexible film 21 and directly abuts against the die 32. However, this is not necessary. The limitation condition is that, as long as the spacing distance between the suction head 136 and the die to be selected when the suction head 136 is stopped at the first position P1 is properly designed, the urging seat 14 and the thimble 15 can push up the stroke of the flexible film 21 upward. Appropriately reduced so that the ejector pin 15 can remain in the condition of indirectly abutting against the die 32 via the flexible film 21 during the movement reset (i.e., the flexible film 21 is not pierced). ), and the subsequent ejector 15 reset operation is performed.
一般來說，吸頭對晶粒之吸力係小於軟性薄膜對晶粒之黏 力，因此，習知技術才會利用頂針隔著軟性薄膜而頂推晶粒，意即，藉由截面積很小的頂針將軟性薄膜及晶粒頂推一段距離，使得晶粒與軟性薄膜 之接觸面積減小，進而減小軟性薄膜對晶粒之黏力。然而，對於本發明所提供的吸頭不沿該頂推軸向(Z軸)移動的晶粒分選方法及設備中，頂針頂推軟性薄膜及晶粒之距離會較長(等同於習用頂針頂推晶粒的距離加上習用吸頭下降的距離)，若只使用頂針而不同時使用頂推座頂推晶粒，則可能因軟性薄膜及晶粒受頂推之距離較長而造成晶粒位置容易偏移，進而影響後續放置晶粒之精度，例如，在本實施例後續之步驟中，晶粒在第二軟性薄膜22的排列精度就會受到影響。換言之，本發明利用頂推座及頂針同時隔著軟性薄膜而頂推晶粒，可有效地避免習知技術因頂針頂推距離較長而造成晶粒位置偏移之問題，進而保持後續放置晶粒之位置精度，而且，使用頂推座及頂針頂推晶粒到定位後，還能藉由使頂推座及頂針先後離開頂推之位置，進而使晶粒確實吸附於吸頭。 In general, the suction force of the tip on the grain is less than the adhesion of the soft film to the grain. Therefore, the conventional technology uses the thimble to push the die through the soft film, that is, the soft film and the die are pushed a distance by the thimble having a small cross-sectional area, so that the die and the soft film The contact area is reduced, thereby reducing the adhesion of the soft film to the grains. However, in the method and apparatus for grain sorting in which the tip of the present invention does not move along the thrust axis (Z-axis), the distance between the ejector pin pushing soft film and the die may be longer (equivalent to the conventional thimble). The distance between the top die and the drop distance of the conventional tip). If only the thimble is used instead of pushing the die with the pusher, the crystal may be caused by the long distance between the soft film and the die. The position of the particles is easily offset, which in turn affects the accuracy of subsequent placement of the grains. For example, in the subsequent steps of this embodiment, the arrangement accuracy of the crystal grains in the second flexible film 22 is affected. In other words, the present invention utilizes the urging seat and the thimble to push the die through the soft film at the same time, which can effectively avoid the problem that the prior art is caused by the ejector pin pushing distance and the grain position shifting, thereby maintaining the subsequent placement of the crystal. The positional accuracy of the granules, and further, after the ejector pin and the thimble are used to push the dies to the position, the ejector pin and the thimble can be separated from the pushing position, so that the crystal grains are surely adsorbed to the suction head.
f)使該吸頭136自該第一位置P1平移離開至用以置放晶粒 之第二位置P2。詳而言之，如第6圖所示，使該吸取裝置13之吸頭136連同該晶粒32移動而使該晶粒32與該第二軟性薄膜22之第一表面221相對且對應於該置晶台16。此時，該吸頭136係位於如前述之第二位置P2。 f) translating the tip 136 from the first position P1 to place the die The second position P2. In detail, as shown in FIG. 6, the suction head 136 of the suction device 13 is moved along with the die 32 so that the die 32 is opposite to the first surface 221 of the second flexible film 22 and corresponds to the The crystal stage 16 is placed. At this time, the tip 136 is located at the second position P2 as described above.
g)如第7圖所示，使該置晶台16朝該吸取裝置13之吸頭 136的方向移動而頂推該第二軟性薄膜22，進而使該晶粒32黏附於該第二軟性薄膜22之第一表面221。 g) as shown in Fig. 7, the crystal table 16 is directed toward the suction head of the suction device 13 The second flexible film 22 is pushed up by the direction of the 136, and the die 32 is adhered to the first surface 221 of the second flexible film 22.
h)如第8圖所示，使該置晶台16朝遠離該吸取裝置13之 吸頭136的方向移動。此時，只要該吸頭136解除其真空吸引功能，即可使該晶粒32順利地黏附於該第二軟性薄膜22，但若該置晶台16更具有真空吸引功能，則可更加確保該第二軟性薄膜22及該晶粒32會隨該置晶台16下降。 h) as shown in Fig. 8, the crystal stage 16 is moved away from the suction device 13 The direction of the tip 136 moves. At this time, as long as the suction head 136 releases the vacuum suction function, the die 32 can be smoothly adhered to the second flexible film 22. However, if the crystal plate 16 has a vacuum suction function, the film can be further ensured. The second flexible film 22 and the die 32 are lowered with the crystal stage 16.
藉此，該晶粒分選方法能用於壞晶挑選作業或晶粒分類選 取作業，意即將該第一軟性薄膜21上黏設之晶粒30分類放置於該第二軟性薄膜22。如第6圖至第8圖所示，在該步驟f)、該步驟g)及該步驟h)執行的過程中，另一黏設於該第一軟性薄膜21之第一表面211的晶粒(例如晶粒33)可相對該頂推座14及該頂針15位移至對應該頂推座14及該頂針15之位置，如此一來，該晶粒分選設備10利用前述之晶粒分選方法將該晶粒32移置到該第二軟性薄膜22後，即可馬上再重複該晶粒分選方法之步驟b) 至步驟h)而將該晶粒33移置到該第二軟性薄膜22，進而可連續且快速地完成所有晶粒30之分類作業。 Thereby, the grain sorting method can be used for bad crystal picking operation or grain sorting selection The operation is performed by dividing the die 30 adhered on the first flexible film 21 into the second flexible film 22. As shown in FIG. 6 to FIG. 8 , another film adhered to the first surface 211 of the first flexible film 21 during the step f), the step g) and the step h) are performed. (for example, the die 33) is displaceable relative to the ejector 14 and the ejector pin 15 to a position corresponding to the ejector 14 and the ejector pin 15, such that the die sorting apparatus 10 utilizes the aforementioned die sorting After the die 32 is displaced to the second flexible film 22, the step b) of the grain sorting method can be repeated immediately. The die 33 is displaced to the second flexible film 22 to the step h), so that the sorting operation of all the crystal grains 30 can be completed continuously and quickly.
另外，前述該晶粒分選方法主要係用以將黏設於第一軟性 薄膜(21)之晶粒(32)自該第一軟性薄膜上取離，再將該晶粒32放置於第二軟性薄膜(22)上，然而，前述方法若僅係應用於將黏設於軟性薄膜之晶粒取離，例如應用於將壞晶或特定分類等級之晶粒挑除並移至一特定位置丟棄或置放，上述之晶粒分選方法實質上可僅進行步驟a)至步驟f)，即可達成目的，意即僅將該第一軟性薄膜21上的晶粒移除，而不再進一步地將晶粒設置於該第二軟性薄膜22之步驟。 In addition, the foregoing grain sorting method is mainly used to adhere to the first softness. The die (32) of the film (21) is removed from the first flexible film, and the die 32 is placed on the second flexible film (22). However, the foregoing method is only applied to be adhered to The grain of the flexible film is taken away, for example, to remove and move the grain of the bad crystal or the specific classification grade to a specific position for discarding or placing. The above grain sorting method can substantially only perform step a) to In the step f), the object is achieved, that is, only the crystal grains on the first flexible film 21 are removed without further placing the crystal grains on the second flexible film 22.
上述二種晶粒分選方法，不論是應用於晶粒分類選取作 業，或是壞晶挑除作業，由於該吸取裝置13不需設有能產生實質上沿該頂推軸向(Z軸)(亦即頂針15之軸向)之位移動作的線性驅動器，該吸取裝置13之驅動器132僅需帶動該擺臂134及該吸頭136，因此不會有驅動器之電線因擺動而扯斷的問題，而且，該吸取裝置13之驅動器132負載小而可使該吸頭136相當快速地移動，因此前述之晶粒分選設備10及晶粒分選方法的效率係較習用者更高。 The above two kinds of grain sorting methods, whether applied to grain classification or not Or the bad crystal picking operation, since the suction device 13 does not need to be provided with a linear actuator capable of generating a displacement action substantially along the thrust axis (Z axis) (ie, the axial direction of the ejector pin 15), The driver 132 of the suction device 13 only needs to drive the swing arm 134 and the suction head 136, so that there is no problem that the wire of the driver is broken by the swing, and the load of the driver 132 of the suction device 13 is small, so that the suction can be performed. The head 136 moves relatively quickly, so the efficiency of the aforementioned grain sorting apparatus 10 and the grain sorting method is higher than that of the conventional one.
請參閱第9圖至第13圖，第9圖為本發明一第二較佳實施例所提供之晶粒分選設備40的頂視示意圖，第10圖至第13圖為該晶粒分選設備40的前視示意圖，並顯示本發明所提供之晶粒分選方法的各步驟。該晶粒分選設備40係類同於前述該晶粒分選設備10，惟該晶粒分選設備40之吸取裝置43中，其驅動器432係帶動一較長之擺臂434，以及二分別設置於該擺臂434二端之吸頭436、438，其中，該吸頭436位於該第一位置P1時，該吸頭438係位於該第二位置P2，反之亦然。 Referring to FIG. 9 to FIG. 13 , FIG. 9 is a top plan view of a die sorting apparatus 40 according to a second preferred embodiment of the present invention, and FIGS. 10 to 13 show the die sorting. A front schematic view of apparatus 40 and showing the various steps of the grain sorting method provided by the present invention. The die sorting device 40 is similar to the foregoing grain sorting device 10. However, in the picking device 43 of the die sorting device 40, the driver 432 drives a longer swing arm 434, and two separate The tips 436, 438 disposed at the two ends of the swing arm 434, wherein the tip 436 is located at the first position P1, the tip 438 is located at the second position P2, and vice versa.
該晶粒分選設備40亦可執行前述之晶粒分選方法，而且，當該吸頭436執行步驟b)至步驟e)時，該吸頭438可同時執行步驟f)至步驟h)，舉例而言，在該吸頭436自該第一軟性薄膜21吸取該晶粒32的過程中，該吸頭438可將其先前已吸取之晶粒34放置於該第二軟性薄膜22。如此一來，該晶粒分選設備40不但具有如前述之該晶粒分選設備10的功效，且該晶粒分選設備40之效率更高。 The die sorting device 40 can also perform the foregoing grain sorting method, and when the nozzle 436 performs the steps b) to e), the nozzle 438 can simultaneously perform steps f) to h). For example, in the process in which the tip 436 draws the die 32 from the first flexible film 21, the tip 438 can place the previously sucked die 34 on the second flexible film 22. As a result, the die sorting device 40 not only has the efficacy of the die sorting device 10 as described above, but the grain sorting device 40 is more efficient.
最後，必須再次說明，本發明於前揭實施例中所揭露的構成元件，僅為舉例說明，並非用來限制本案之範圍，其他等效元件的替代或變化，亦應為本案之申請專利範圍所涵蓋。 Finally, it is to be noted that the constituent elements disclosed in the foregoing embodiments are merely illustrative and are not intended to limit the scope of the present invention, and alternative or variations of other equivalent elements should also be the scope of the patent application of the present application. Covered.
10‧‧‧晶粒分選設備 10‧‧‧Grading sorting equipment
13‧‧‧吸取裝置 13‧‧‧ suction device
132‧‧‧驅動器 132‧‧‧ drive
134‧‧‧擺臂 134‧‧‧ swing arm
136‧‧‧吸頭 136‧‧‧ tips
14‧‧‧頂推座 14‧‧‧ 推座
142‧‧‧穿孔 142‧‧‧Perforation
15‧‧‧頂針 15‧‧‧ thimble
16‧‧‧置晶台 16‧‧‧ crystal table
21‧‧‧第一軟性薄膜 21‧‧‧First soft film
211‧‧‧第一表面 211‧‧‧ first surface
212‧‧‧第二表面 212‧‧‧ second surface
22‧‧‧第二軟性薄膜 22‧‧‧Second soft film
221‧‧‧第一表面 221‧‧‧ first surface
222‧‧‧第二表面 222‧‧‧ second surface
32‧‧‧晶粒 32‧‧‧ grain
P1‧‧‧第一位置 P1‧‧‧ first position
Claims (17)
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| TW102118119A TWI585022B (en) | 2013-05-22 | 2013-05-22 | Grain sorting methods and equipment |
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| TWI585022B true TWI585022B (en) | 2017-06-01 |
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| TWI796750B (en) * | 2021-08-05 | 2023-03-21 | 梭特科技股份有限公司 | Method for fixing chips with central contact without impact force |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200536037A (en) * | 2004-03-15 | 2005-11-01 | Asm Tech Singapore Pte Ltd | Die ejector system using linear motor |
| US6984533B1 (en) * | 2001-10-09 | 2006-01-10 | Xilinx, Inc. | Method of sorting dice by speed during die bond assembly and packaging to customer order |
| TW201025475A (en) * | 2008-12-31 | 2010-07-01 | Cheng Mei Instr Technology Co Ltd | System and method for separating defective dies from a wafer |
| TWM448050U (en) * | 2012-11-06 | 2013-03-01 | Yolo New Technology Co Ltd | Device for picking off defective dices to prevent sticking back |
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Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6984533B1 (en) * | 2001-10-09 | 2006-01-10 | Xilinx, Inc. | Method of sorting dice by speed during die bond assembly and packaging to customer order |
| TW200536037A (en) * | 2004-03-15 | 2005-11-01 | Asm Tech Singapore Pte Ltd | Die ejector system using linear motor |
| TW201025475A (en) * | 2008-12-31 | 2010-07-01 | Cheng Mei Instr Technology Co Ltd | System and method for separating defective dies from a wafer |
| TWM448050U (en) * | 2012-11-06 | 2013-03-01 | Yolo New Technology Co Ltd | Device for picking off defective dices to prevent sticking back |
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