M342725 八、新型說明： 【新型所屬之技術領域】 本匐作係有關用以裝配電 改良，旨錢供—可增加該印刷電路板電路板結構 持電子几件卫作效能之高散熱印刷魏^、、、效果，以維 【先前技術】 報’公告第430959號之「;:㊁國專利公 括有一熱導層，具—凹凸έ ;>結構」’其包 該熱導層上 U冓的表面；—黏膠層 上’其中，部二表 ::==:r導結=== 表面：—表面全屬声，在黏膠層’在該熱導層 金屬層直接或近乎直接與=相其連中.’. 表：層上:二= 結構，但是由於該印刷;路i於製=電導之 受方式加《製成，所以必須要耗f較高之成本及層 時及工序’且該印顧路板僅鱗層作絲之傳^工 因此其導熱效果並不理想。 V ’ 而另有一台灣專利公告號第M3111i6號之「發光二 體載板之印刷電路板結構改良」，如第一圖所示:其 5 M342725 有一基板10;—第一絕緣層11，該第一絕緣層11係層疊 於上述基板10之一面上；一銅層12,該銅層12係層疊於 • 上述第一絕緣層11之一面上，且該銅層12上係具有第二 v 絕緣層121;以及表層13，該表層13係疊於上述銅層12 之一面上且鄰近於第二絕緣層121之一侧，如第二圖所 ^ 示，其中一銅層12上近一步設置有表層13以供裝配電子 元件2，再利用二條導線21構成電子元件2與另外二銅 層12之電性連接，其中該基板10可以為鋁板、鋁片等熱 • 傳導性較佳之金屬，以將電子元件2工作所產生之熱源散 去。 惟，該電子元件2與基板10之間尚設置有表層13、 銅層12以及第一絕緣層11，而該電子元件2之熱源會因 第一絕緣層11之熱傳導性不佳而累積，使得該熱源無法 有效傳導至基板10而散熱，其散熱效果並不理想。 【新型内容】 • 有鑑於此，本創作即針對用以裝配電子元件之印刷電 _路板結構加以改良，藉以提供一可增加該印刷電路板之散 熱效果，以維持電子元件工作效能。 為達上揭目的，本創作之印刷電路板係至少包含有： 散熱層、第一導體層以及設於散熱層與第一導體層間之絕 緣層，該第一導體層並設有複數第一線路；其中，該絕緣 層與散熱層間設有散熱結合層，且相對於各第一線路處設 置有盲孔，各盲孔並深及該散熱結合層且各盲孔中並設有 6 M342725 散熱結合層，使各第一線路得 或者，該絕緣層錄熱結^、散熱結合層接觸。 層，使各第-線路得以與第二=進—步設有第二導體 觸，當第-線路上裝配有電子^f層以及散熱結合層接 熱源得以由該盲孔朝散減合^而作動時，其所產生之 散熱層散去，增加該印刷電路=¥二導體層傳導，再由 【實施方式】M342725 VIII. New description: [New technical field] This series is related to the assembly of electric improvement, the purpose of money supply - can increase the printed circuit board circuit board structure to hold several pieces of electronic processing efficiency of high heat printing Wei ^ , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , , Surface; - on the adhesive layer 'where, the second table:: ==: r guide === surface: - the surface is all sound, in the adhesive layer 'directly or nearly directly with the metal layer of the thermal conductive layer = 相相中中.'. Table: Layer: 2 = structure, but due to the printing; road i in the system = conductance of the method of adding "made, so must cost a higher cost and layer time and process" Moreover, the printing road board only has a scale layer for wire transfer, so the heat conduction effect is not ideal. V ' and another Taiwan Patent Publication No. M3111i6 "Improved printed circuit board structure of the light-emitting two-body carrier board", as shown in the first figure: the 5 M342725 has a substrate 10; the first insulating layer 11, the first An insulating layer 11 is laminated on one surface of the substrate 10; a copper layer 12 laminated on one surface of the first insulating layer 11 and having a second v insulating layer on the copper layer 12 And a surface layer 13 stacked on one side of the copper layer 12 and adjacent to one side of the second insulating layer 121, as shown in the second figure, wherein a copper layer 12 is further provided with a surface layer 13 for assembling the electronic component 2, and then using the two wires 21 to form an electrical connection between the electronic component 2 and the other two copper layers 12, wherein the substrate 10 may be a metal such as an aluminum plate or an aluminum sheet, which has better heat conductivity and conductivity. The heat source generated by the operation of component 2 is dissipated. However, the surface layer 13, the copper layer 12 and the first insulating layer 11 are disposed between the electronic component 2 and the substrate 10, and the heat source of the electronic component 2 is accumulated due to poor thermal conductivity of the first insulating layer 11, so that The heat source cannot be effectively conducted to the substrate 10 to dissipate heat, and the heat dissipation effect is not satisfactory. [New content] • In view of this, the creation of the printed circuit board structure for assembling electronic components is improved to provide a heat dissipation effect of the printed circuit board to maintain the performance of the electronic components. In order to achieve the above, the printed circuit board of the present invention comprises at least: a heat dissipation layer, a first conductor layer and an insulation layer disposed between the heat dissipation layer and the first conductor layer, wherein the first conductor layer is provided with a plurality of first lines Wherein, a heat dissipating bonding layer is disposed between the insulating layer and the heat dissipating layer, and a blind hole is disposed at each of the first lines, each of the blind holes is deep and the heat dissipating bonding layer is disposed, and each of the blind holes is provided with a heat dissipation combination of 6 M342725 The layer is such that the first line is obtained or the insulating layer is in contact with the heat-dissipating layer and the heat-dissipating layer. a layer, such that each of the first line is provided with a second conductor contact with the second = step, and when the first line is equipped with an electron layer and the heat dissipation layer is connected to the heat source, the blind hole is reduced by the blind hole When actuating, the heat dissipation layer generated by it is dissipated, and the printed circuit = ¥ two conductor layer conduction is increased, and then [Embodiment]
本創作之特點，可參閱本幸_々η虫 而獲得清楚地暸解。 切實_之詳細說明 $作之印刷電路板3係至少包含有：散熱層31、 紹㈣層32以及⑤於散熱層31與第—導體層32間之 、、迕：33 ’如第二圖之第一實施例所示，該散熱層31可 以為金屬、石墨或高散熱材，該第—導體層32並設有複 數第一線路321，該第一導體層32可以為銅層；其中， 該絕緣層33與散熱層31間設有散熱結合層34，該散熱 結合層34可以為散熱結合膠或散熱膏、散熱凝膠、導電 膏（例如：銀膏、銅膏、錫膏等金屬膏）、接著劑、散熱片、 相變化材料、散熱滑油、FR4、FR5或聚亞醯胺，該散熱 結合層34可以為Laird所生產型號為ικα〇4、1ΚΑ06、 1KA08、1KA10、1KA12之散熱結合膠，或者為nrk所生產 型號為 NRA-8、NRA-E-3、NRA-E-6、NRA-E-12 之散熱結合 膠’或者為Bergquist所生產型號為TCP_1〇〇〇、 MP-06503、LTI-06005、HT-04503、ΤΗ-07006 之散熱結合 7 M342725 膠’或者為遠碩所生產型號為HTCA-60、HTCA_120之散熱 結合膠，或者為永復興所生產型號為ERNE—800H之散熱結 合膠。 μ 且相對於各第一線路321處設置有盲孔35，各盲孔 35並深及該散熱結合層34且各盲孔35中並設有散熱結 合層34，使各第一線路321得以與散熱結合層34接觸。 如第四圖所示係為本創作之第二實施例，該絕緣層 33與散熱層31間同樣設有散熱結合層34,且相對於各第 一線路321 *設置有盲孔35，各盲孔35並深及該散熱結 合層34，且各盲孔35側壁面延伸至絕緣層33與蚌 f層34之間並設有第二導體層36,而各盲孔35内; 散熱結合層34，使各第-線路321得以與第二導又 以及散熱結合層34接觸，而該散熱結合層％可以為曰 :指f各，；當然，該絕緣層33與散熱結合層3: 如第五圖之第三實施例V 數綠路361 ’ 本創作之高散熱印刷電路板使用時，以第施例 例，於該第-導體層32處可進一步設置有發光二極體4、、， 如第六圖所不’該發光二極體4係設置於其中 上而而 =他第—線路321間藉由導線41構成電性 連接’而糾光二極體4可進一步藉由黏著材α設置於 其中-第-線路321上’而與其他第一線路32 導 線架43構成電性連接，&帛+ pi & + 、s 如第七圖所不，該發光二極體4 k入電飢、、戈工作時，其所產生之熱源經由發光二極體 8 M342725 4下方之第一線路32〗i亡 結合層34，以#自㈣35科至減接觸之散熱 大，並進H辕源傳;^下3方4賴狀傳導面= 將熱《出至外界，並^^下方之散熱層31，以有效 維持電子S件之卫作^以卩觀路板之散熱效果，以The characteristics of this creation can be clearly understood by referring to this 々 々 虫 worm. </ RTI> </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> <RTIgt; </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> </ RTI> In the first embodiment, the heat dissipation layer 31 may be metal, graphite or a high heat dissipation material. The first conductor layer 32 is provided with a plurality of first lines 321 , and the first conductor layer 32 may be a copper layer. A heat dissipating bonding layer 34 is disposed between the insulating layer 33 and the heat dissipating layer 31. The heat dissipating bonding layer 34 may be a heat dissipating adhesive or a heat dissipating paste, a heat dissipating gel, or a conductive paste (for example, a metal paste such as a silver paste, a copper paste or a solder paste). , adhesive, heat sink, phase change material, heat-dissipating oil, FR4, FR5 or poly-liminamide, the heat-dissipating bonding layer 34 can be a heat-dissipating combination of the models ικα〇4, 1ΚΑ06, 1KA08, 1KA10, 1KA12 produced by Laird. Glue, or NAR-8, NRA-E-3, NRA-E-6, NRA-E-12 heat-dissipating glue produced by nrk' or manufactured by Bergquist as TCP_1〇〇〇, MP-06503 , LTI-06005, HT-04503, ΤΗ-07006 heat dissipation combined with 7 M342725 glue' or for Yuanshuo Production model HTCA-60, HTCA_120 the heat bond adhesive, or a permanent renaissance production model of heat ERNE-800H binding glue. And a blind hole 35 is disposed in each of the first lines 321 , and each of the blind holes 35 is deeper than the heat dissipation bonding layer 34 , and each of the blind holes 35 is provided with a heat dissipation bonding layer 34 , so that the first lines 321 are The heat dissipation bonding layer 34 is in contact. The fourth embodiment is a second embodiment of the present invention. The insulating layer 33 and the heat dissipation layer 31 are also provided with a heat dissipation bonding layer 34, and a blind hole 35 is provided with respect to each of the first lines 321 *, each blind The hole 35 is deeper than the heat dissipation bonding layer 34, and the sidewall surface of each blind hole 35 extends between the insulating layer 33 and the 蚌f layer 34 and is provided with the second conductor layer 36, and each of the blind holes 35; the heat dissipation bonding layer 34 The first-line 321 is brought into contact with the second conductive layer and the heat-dissipating bonding layer 34, and the heat-dissipating bonding layer % may be 曰: fingers f, and of course, the insulating layer 33 and the heat-dissipating bonding layer 3: In the third embodiment of the present invention, the number of green roads 361' is used in the case of the high heat-dissipating printed circuit board of the present invention. In the first embodiment, the light-emitting diodes 4 may be further disposed at the first conductor layer 32, such as In the sixth figure, the light-emitting diode 4 is disposed on the upper side and the other line 321 is electrically connected by the wire 41. The light-correcting diode 4 can be further disposed by the adhesive material α. Wherein - the first line 321 'and the other first line 32 lead frame 43 electrically connected, & 帛 + pi & +, s as the first In the figure, when the light-emitting diode 4 k enters the electric hunger and the ge, the heat source generated by the light-emitting diode 4 is passed through the first line 32 of the light-emitting diode 8 M342725 4 to the dead layer 34, to #自(四)35科The heat dissipation to the contact reduction is large, and the H-source transmission is carried out; ^ the lower 3 sides 4-shaped conduction surface = the heat is discharged to the outside, and the heat dissipation layer 31 below the ^^ is effective to maintain the electronic S piece of the The heat dissipation effect of the road surface
或者以第三實施例A 例，於第一導體層32處設置有 電子70件2，如第八圖所 路321間敦有錫球22 =成^子元件2可與該第1 入電流而持續工作時，1=性連接，該電子元件2通9 下方H路321 生之熱源經由電子元件2 合層34以及第二導❹3fi 35傳導至與其接觸之散熱結 第二導體層36將熱源。6 =藉由散熱結合層34 = 源傳導至下方之散熱層擴大，並進—步將該熱 並增加該印刷電路板之餘效將_散出至外界你 效能。 U果，㈣持電子元件之工作 再者，該散熱層亦可以為散熱鰭片組件31，，如第 ’九圖之第四實施例所示，該散觸片組件Μ，設有複數 、散熱鰭片31Γ :或者於該散熱層31另一表面進一步設 、有散熱鰭片組件3Γ，如第十圖之第五實施例所示。 五另外，上述各實施例中，該第一導體層與絕緣層係設 於散熱層其中一表面，亦可如第十一圖之第六實施例所 示於该散熱層31 一個相對之表面上同時設置有第一導 體層32與絕緣層33，以供散熱層31二個相對之表面皆 可裝配電子元件。 9 M342725 值得一提的是，本創作相較於習有係具有下列優點： 1、 整體第一導體層之各第一線路表面未遭破壞，係 - 為平整表面，做為電子元件或其他相關電路的電路接點 . 時，可增加其穩定性，並可大幅提升該印刷電路板的適用 性。 2、 該印刷電路板藉由各第一線路下盲孔之設置，可 將熱傳導至下層之散熱結合層或第二導體層，並透過該層 ^ 傳導至散熱層，以有效提高該印刷電路板之散熱效率，並 • 電子元件之工作效能。 縱上所述，本創作提供印刷電路板另一較佳可行之高 散熱結構，爰依法提呈新型專利之申請；再者，本創作之 技術内容及技術特點巳揭示如上，然而熟悉本項技術之人 士仍可能基於本創作之揭示而作各種不背離本案創作精 神之替換及修飾。因此，本創作之保護範圍應不限於實施 例所揭示者，而應包括各種不背離本創作之替換及修飾， 並為以下之申請專利範圍所涵蓋。 - ^【圖式簡單說明】 第一圖係為習有載板之結構示意圖。 ‘第二圖係為習有發光二極體設置於載板上之結構示意圖。 第三圖係為本創作第一實施例高散熱印刷電路板之結構 示意圖。 第四圖係為本創作第二實施例高散熱印刷電路板之結構 示意圖。 M342725 第五圖係為本創作第三實施例高散熱印刷電路板之結構 示意圖。 ί 第六圖係為本創作發光二極體裝配於高散熱印刷電路板 • 之結構示意圖。 第七圖係為本創作發光二極體裝配於高散熱印刷電路板 • 之另一結構示意圖。 第八圖係為本創作電子元件裝配於高散熱印刷電路板之 另'一結構不意圖。 馨第九圖係為本創作第四實施例高散熱印刷電路板之結構 示意圖。 第十圖係為本創作第五實施例高散熱印刷電路板之結構 示意圖。 第十一圖係為本創作第六實施例高散熱印刷電路板之結 構示意圖。 【主要元件代表符號說明】 鲁基板10 、第一絕緣層11 銅層12 第二絕緣層121 表層13 電子元件2 導線21 錫球22 M342725 印刷電路板3 散熱層31 • 散熱鰭片組件31’ . 散熱鰭片311’ 第一導體層32 、 第一線路321 絕緣層33 ~ 散熱結合層34 籲盲孔35 第二導體層36 第二線路361 發光二極體4 導線41 黏著材42 導線架43Or in the third embodiment A, an electron 70 member 2 is disposed at the first conductor layer 32, and as in the eighth diagram, the road 321 has a solder ball 22 = the sub-element 2 can be connected to the first current. During continuous operation, 1 = sexual connection, the heat source generated by the lower portion H of the electronic component 2 through 9 is conducted via the electronic component 2 layer 34 and the second via 3fi 35 to the heat sink junction with which the second conductor layer 36 is in contact with the heat source. 6 = By heat-dissipating layer 34 = source conduction to the underlying heat sink layer is expanded, and the heat is added and the residual effect of the printed circuit board is released to the outside world. U fruit, (4) The operation of holding the electronic component, the heat dissipation layer may also be the heat dissipation fin assembly 31, as shown in the fourth embodiment of the '9th figure, the dislocation piece assembly is provided with a plurality of heat dissipation The fin 31Γ: or the heat dissipating layer 31 is further provided with a heat dissipating fin assembly 3Γ as shown in the fifth embodiment of the tenth embodiment. In addition, in the above embodiments, the first conductor layer and the insulating layer are disposed on one surface of the heat dissipation layer, or may be on an opposite surface of the heat dissipation layer 31 as shown in the sixth embodiment of the eleventh embodiment. At the same time, the first conductor layer 32 and the insulating layer 33 are disposed, so that the opposite surfaces of the heat dissipation layer 31 can be assembled with electronic components. 9 M342725 It is worth mentioning that this creation has the following advantages compared to Xishang: 1. The first line surface of the whole first conductor layer is not damaged, the system is a flat surface, as an electronic component or other related The circuit's circuit contacts increase stability and greatly improve the suitability of the printed circuit board. 2. The printed circuit board can conduct heat to the lower heat dissipation bonding layer or the second conductor layer through the blind holes of the first lines, and conduct the heat through the layer to the heat dissipation layer to effectively improve the printed circuit board. Thermal efficiency, and • the performance of electronic components. In summary, the present invention provides another high-performance heat-dissipating structure of a printed circuit board, and submits a patent application in accordance with the law; further, the technical content and technical features of the present invention are disclosed above, but are familiar with the technology. The person may still make a variety of substitutions and modifications based on the disclosure of this creation without departing from the spirit of the creation of the case. Therefore, the scope of protection of this work should not be limited to those disclosed in the examples, but should include various alternatives and modifications that do not depart from the present invention and are covered by the following claims. - ^ [Simple description of the diagram] The first diagram is a schematic diagram of the structure of the carrier board. ‘The second figure is a schematic diagram of a structure in which a light-emitting diode is disposed on a carrier. The third figure is a schematic view showing the structure of the high heat dissipation printed circuit board of the first embodiment of the present invention. The fourth figure is a schematic view showing the structure of the high heat dissipation printed circuit board of the second embodiment of the present invention. M342725 The fifth figure is a schematic diagram of the structure of the high heat dissipation printed circuit board of the third embodiment of the present invention. ί The sixth figure is a schematic diagram of the structure of the light-emitting diode mounted on a high-heat-dissipation printed circuit board. The seventh picture is a schematic diagram of another structure in which the light-emitting diode is assembled on a high-heat-dissipation printed circuit board. The eighth figure is not intended to be a structure of the electronic component mounted on the high heat-dissipating printed circuit board. The ninth diagram of the present is a schematic diagram of the structure of the high heat dissipation printed circuit board of the fourth embodiment of the present invention. The tenth figure is a schematic view showing the structure of the high heat dissipation printed circuit board of the fifth embodiment of the present invention. The eleventh drawing is a schematic view showing the structure of the high heat-dissipating printed circuit board of the sixth embodiment of the present invention. [Main component representative symbol description] Lu substrate 10, first insulating layer 11 copper layer 12 second insulating layer 121 surface layer 13 electronic component 2 wire 21 solder ball 22 M342725 printed circuit board 3 heat dissipation layer 31 • heat sink fin assembly 31'. Heat sink fin 311' first conductor layer 32, first line 321 insulating layer 33 ~ heat sink layer 34, blind hole 35, second conductor layer 36, second line 361, light emitting diode 4, wire 41, adhesive material 42, lead frame 43