五、新型說明： 【新型所屬之技術領域】 一種發光二極 本創作有關於一 體之散熱模組。 種散熱模組，尤指 【先前技術】 δ夕仃動電話的指示燈、液晶電視的指示燈 c號誌燈，已普遍採用發光二極體作為發光元 口此么光一極體的發光功率必須不斷提高。對 t功率的發光二極體W，普遍都面臨到散熱效率 2的問題’因為功率的提高，也同時伴隨著產生的 二ί提高、’，量持續的累積將使得發光二極體持 、只牦Μ，而過面的溫度將造成發光二極體之質變而使 其壽命減少。 如第一圖所示，為一種習知高功率之發光二極體 散熱模組’其包含—發光二極體丄a以及—铭基板2 a。5亥發光二極體1 a包含一發光二極體晶片工工 a、一金屬製的散熱基座1 2 a、一絕緣殼體1 3 a、 正極接腳1 4 a、一負極接腳1 5 a以及一封裝膠 體1 6 a，該發光二極體晶片丄i a藉由固晶膠使其 固定於該散熱基座1 2 a之頂部，該絕緣殼體1 3 a 射出成型於該散熱基座1 2 a之外側，且散熱基座1 2 a之底部裸露於絕緣殼體1 3 a。該正極接腳1 4 a以及該負極接腳1 5 a之一端分隔地嵌設於該絕緣 妓體1 3 a中，該發光二極體晶片1 3之正極及負 極分別透過導線搞接於該正極接腳1 4 a以及該負極 M376119 接腳1 5 a裸露於絕緣殼體i 3 a之部位，至於該正· 極接腳1 4 a以及忒負極接腳1 5 a之另一端則伸出 於絕緣殼體1 3 a。該封裝膠體丄6 a包覆該發光二 極體晶片1 1 a及二條連接於正極接腳1 4 a以及节 負極接腳1 5 a之導線。 該鋁基板2 a包含有一電路表層2丄a、一絕緣 層2 2 a以及一金屬板底層2 3 a，該絕緣層22a 連接於邊金屬板底層2 3 a與該電路表層2 1 a之 間’該電路表層2 1 a設有正極導電執跡以及負 電軌跡。散熱基座1 2 a之底料接於該電路表層2 1 a，而正極接腳1 4 a以及該負極接腳工5 a ‘別 焊接於正極導電軌跡以及負極導電軌跡上。 由於發光二極體1 a的熱傳導路徑中包含了絕緣 層2 2 a ’而絕緣材料的熱傳導率低於金屬材料，所 以使得整體的散熱效率對於高功率的發光二極體晶片 上1 a而言是不；i夠的。也因為散熱效率之不足使 ，發光二極體晶片113很容易因為溫度過高而損 壞。 、 另-方面，如第二圖所示，多個發光二極體“ 因基板2 a上，假如其中一個發光二極體1 a =故P羊而必須由銘基板2 a上解焊移除時，由於銘 會降低焊錫的溫度，所以在I呂基板2a經過 解科必須採用較高的溫度，若溫度調整的不 而過高，容易造成其他良好發光二極體^產 面’由此可知，在祕發光二極體1 a方 面並不十分便利。 4 M376119 緣是，本創作人有感於上述缺失之可改善，乃特 潛心研究並配合學理之運用，終於提出一種設計合理 且有效改善上述缺失之本創作。 【新型内容】 鑒於以上之問題，本創作之主要目的為提供一種 - 發光一極體散熱模組，提升散熱效率以避免發光二極 - 體晶片的損壞。 • 為了達到上述之目的，本創作係提供一種發光二 極體散熱模組，包括：一發光二極體，該發光二極體 包含發光一極體晶片、一散熱基座、一正極接腳以 及一負極接腳，該發光二極體晶片固定於該散熱基座 之頂部，該正極接腳耦接於該發光二極體晶片之正 極，該負極接腳耦接於該發光二極體晶片之負極；一 電路基板，該電路基板設有一穿孔，該散熱基座卡接 於该穿孔中，該散熱基座之底部位於該穿孔之下方， ，而该正極接腳以及該負極接腳固定於該電路基板之上 側；以及一熱管’該熱管設於該電路基板之下側且固 定於該散熱基座之底部。 本創作具有以下有益的效果：發光二極體晶片工 作所產生的熱乃由散熱基座直接傳導至熱管，藉由熱 官内部的熱對流效應，使得熱能更有效快速地散逸至 周圍的冷空氣中’避免了發光二極體晶片因過熱而損 壞的情形發生。 【實施方式】 5 M376119 第三圖及第四圖為本創作發光二極體散熱模組之 第一實施例，包括一高功率之發光二極體丄、一電路 基板2以及一熱管3。該發光二極體1包含一發光二 極體晶片1 1、一銅材製的散熱基座i 2、一射出成 型之絕緣殼體1 3、一對導體材質的正極接腳丄4以 及負極接腳1 5，以及一封裝膠體1 6。該散熱基座 1 2之頂部具有一凹陷的晶片容置區丄2丄，該發光 二極體晶片11採用共晶融合製程以固定於該散熱基 座12之晶片容置區121。該絕緣殼體13包覆於 該散熱基座1 2之外側，且散熱基座1 2之下半部裸 露於絕緣殼體1 3。該正極接腳1 4之一端及該負極 接腳1 5之一端乃分隔兩側嵌設於該絕緣殼體工3 中，至於該發光二極體晶片i丄之正極及負極分別透 過金屬導線耗接於該正極接腳1 4以及該負極接腳1 5。至於該正極接腳1 4之相對另一端以及該負極接 腳1 5之相對另一端則伸出於絕緣殼體2 3。該封裝 膠體1 6由封裝膠材與螢光粉混合而成，該封裴膠體 1 6覆蓋於該發光二極體晶片i i及二條連接於正極 接腳1 4以及該負極接腳1 5之金屬導線。 該電路基板2可以採用印刷電路板、軟性電路 板、陶瓷基板或鋁基板，但以印刷電路板為最佳，故 本實施例之電路基板2採用印刷電路板。該電路基板 6 2設有一穿孔2 1，該發光二極體i之散熱基座丄2 卡接於該穿孔2 1中，該散熱基座1 2之底部位於該 穿孔2 1之下方。該電路基板2之上側設有一正極導 電軌跡2 2以及一負極導電執跡2 3，其中該正極導 電軌跡2 2以及該負極導電軌跡2 3為銅線路或銀線 路。該正極接腳1 4以及該負極接腳丄5採用焊錫迴 焊製程而分別與該正極導電執跡2 2以及該負極導電 轨跡2 3相固定，而使得正極接腳1 4與正極導電軌 跡2 2之間，以及負極接腳1 5與負極導電軌跡2 3 之間各形成一個金屬共晶材料之第一結合層4，第一 結合層4除了固定作用之外，亦具有導電的特性。藉 此，電流便可經由正極接腳1 4以及負極接腳1 5流 過發光二極體晶片1 1，以驅動發光二極體晶片1 1 作發光。 该熱管3之整體呈扁平狀，該熱管3位於該電路 基板2之下侧，該散熱基座1 2之底部與該熱管3之 受熱端採用共晶融合製程相互固定，而使得散熱基座 1 2之底部與該熱管3之間形成一個金屬共晶材料之 第二結合層5，而第二結合層5除了固定作用之外， 亦具有導熱的特性。發光二極體1的熱可經由散熱基 座1 2快速地傳導到熱管3，而熱管3因為内部壓力 的改變，使得位於熱管3之冷端的内部液體往受熱端 々IL動，以填補受熱端蒸發的液體所留下的空間，於是 在熱官3内便形成熱對流現象，藉此達到散熱之效 果。除此之外，該熱管3之形狀亦可有所變化，例如 該熱管3與該散熱基座χ 2接觸的部位呈扁平狀，而 該熱管3之其他部位則可以呈現為扁平狀或空心柱體 狀。 弟五圖為本創作發光二極體散熱模組之第二實施 例，與第一實施例之差異在於：該熱管3之冷端採用 ，晶融合製程與至少一金屬散熱塊7相互固定，而使 得熱管3與金屬散熱塊7之間形成一個金屬共晶材料 之第三結合層6，而第三結合層6除了固定作用之 外，亦具有導熱的特性。該金屬散熱塊7包含一底座 7 1以及一組連接於底座7 i之鰭片7 2，該金屬散 熱塊7之底座7 1透過該第三結合層6固定於該熱管 3之冷端。當熱空氣對流至熱管3之冷端時，熱會藉 =金屬散熱塊7散逸到周圍的冷空氣中。此時，熱^ 帶走的氣體會冷凝形成液體，並且再次流動至執管3 之熱端。藉由這樣的熱對流循環，使得熱散逸的速 更進一步的提升。 如第六圖所示，該電路基板2為印刷電路板，藉 板2上的數個導電連接器8 ’再搭配數“ 號傳輸線9便可將每-電路基板2上的發光二極體丄 進行串聯或並聯電路佈局（圖未示），假如發現有發光 -極體1損壞而無法正常發光’只需將插接於導^連 8 接盗8之訊號傳輸線g拔除，便可輕易地將損壞的發 光二極體1連同結合於下方的電路基板2—併移除， 相較於以往需要過迴焊爐解焊的方式簡易方便許多。 本創作發光二極體散熱模組，具有下列優點： 1、 發光二極體晶片11工作所產生的熱乃由散 熱基座1 2直接傳導至熱管3，藉由熱管3内部的熱 對流效應，使得熱能更有效快速地散逸至周圍的冷空 氣中，避免了發光二極體晶片i i因過熱而損壞的情 形發生。 2、 當電路基板2使用印刷電路板時，進行發光 二極體1的維修更換將十分方便，不需透過迴焊爐解 焊。 以上所述者，僅為本創作其中的較佳實施例而 已’並非用來限定本創作的實施範圍，即凡依本創作 申請專利範’做的均#變化與修飾，f為本創作專 利範圍所涵蓋。 【圖式簡單說明】 第-圖為習知發光二極體散熱模組之剖視圖。 ^圖為習知發光二極體散熱模組串接於域板之俯 = 光二極體散熱模組之立體分解圖。 = ί 光二極體散熱模Μ之剖視圖。 為本創作發光二極體散熱模組之第二實施例之 M376119 剖視圖。 第六圖為串接本創作發光二極體散熱模組之俯視圖。 【主要元件符號說明】 【習知】 發光二極體1 a 發光二極體晶片1 1 a 散熱基座1 2 a 絕緣殼體1 3 a 正極接腳1 4 a 負極接腳1 5 a 封裝膠體1 6 a 鋁基板2 a 電路表層2 1 a 絕緣層2 2 a 金屬板底層2 3 a 【本創作】 發光二極體1 發光二極體晶片11 散熱基座12 晶片容置區1 2 1 絕緣殼體13 正極接腳14 負極接腳1 5 封裝膠體16 M376119 電路基板2 穿孔2 1 正極導電執跡2 2 負極導電執跡2 3 熱管3 第一結合層4 第二結合層5 第三結合層6 金屬散熱塊7 底座7 1 鰭片7 2 導電連接器8 訊號傳輸線9V. New description: [New technology field] A kind of light-emitting diode This book has a heat-dissipating module for one body. The heat dissipation module, especially the [prior art], the indicator light of the δ 仃 仃 phone, the indicator light of the LCD TV, the c light, the light-emitting diode has been generally used as the light-emitting element, and the light-emitting power of the light-polar body must be keep improving. For the t-power LEDs, the problem of heat dissipation efficiency 2 is generally faced. 'Because of the increase in power, it is also accompanied by the increase in the amount of ', and the continuous accumulation of the amount will make the LEDs hold only Oh, and the temperature of the surface will cause the quality of the light-emitting diode to change and its life will be reduced. As shown in the first figure, it is a conventional high-power light-emitting diode heat-dissipating module which includes a light-emitting diode 丄a and a stencil 2a. 5 illuminating diode 1 a includes a light-emitting diode wafer worker a, a metal heat sink base 1 2 a, an insulating shell 1 3 a, a positive pole 1 4 a, a negative pole 1 5 a and a package of colloid 16 a, the light-emitting diode wafer 丄ia is fixed on the top of the heat dissipation base 12 2 a by a solid crystal glue, and the insulating shell 13 3 a is injection molded on the heat dissipation base The outer side of the seat 1 2 a, and the bottom of the heat dissipation base 12 2 a is exposed to the insulating housing 13 3 a. The positive electrode pin 14a and the negative electrode pin 15a are respectively disposed in the insulating body 1 3 a, and the positive electrode and the negative electrode of the light emitting diode chip 13 are respectively connected to the wire through the wire. The positive pole 1 4 a and the negative pole M376119 pin 15 5 a are exposed in the insulating housing i 3 a , and the other end of the positive pole pin 1 4 a and the negative pole pin 15 a protrude Insulating housing 1 3 a. The encapsulant 丄6 a covers the LED 1 1 a and two wires connected to the positive pin 14 a and the negative pin 15 a. The aluminum substrate 2a includes a circuit surface layer 2a, an insulating layer 2 2 a, and a metal plate bottom layer 2 3 a. The insulating layer 22a is connected between the edge metal plate bottom layer 2 3 a and the circuit surface layer 2 1 a . 'The circuit surface layer 2 1 a is provided with a positive conductive trace and a negative electric trace. The bottom of the heat sink base 1 2 a is connected to the surface layer 2 1 a of the circuit, and the anode pin 14 a and the negative pin 5 a 'are soldered to the positive conductive track and the negative conductive track. Since the thermal conduction path of the light-emitting diode 1 a includes the insulating layer 2 2 a ' and the thermal conductivity of the insulating material is lower than that of the metal material, the overall heat dissipation efficiency is 1 a for the high-power LED chip. Yes no; i is enough. Also, the light-emitting diode wafer 113 is easily damaged due to excessive temperature due to insufficient heat dissipation efficiency. And, in other aspects, as shown in the second figure, a plurality of light-emitting diodes "because of the substrate 2a, if one of the light-emitting diodes 1 a = then P sheep must be removed by desoldering on the substrate 2a At the time, since the temperature of the solder is lowered, it is necessary to use a higher temperature in the Ilu substrate 2a. If the temperature is not adjusted too high, it is easy to cause other good light-emitting diodes. It is not very convenient in the case of the secret light-emitting diode 1 a. 4 M376119 The reason is that the creator feels that the above-mentioned deficiency can be improved, and the research is devoted to the use of the theory, and finally a reasonable design and effective improvement is proposed. The above-mentioned missing creations [New content] In view of the above problems, the main purpose of this creation is to provide a light-emitting one-pole heat dissipation module to improve heat dissipation efficiency to avoid damage of the light-emitting diode-body wafer. The purpose of the present invention is to provide a light emitting diode heat dissipation module, comprising: a light emitting diode comprising a light emitting body chip, a heat sink base, and a positive pin; a negative electrode is fixed on the top of the heat dissipation base, the positive pin is coupled to the positive electrode of the LED, and the negative pin is coupled to the negative electrode of the LED a circuit substrate, the circuit substrate is provided with a through hole, the heat dissipation base is engaged in the through hole, the bottom of the heat dissipation base is located below the through hole, and the positive pin and the negative pin are fixed to the circuit An upper surface of the substrate; and a heat pipe disposed on the lower side of the circuit substrate and fixed to the bottom of the heat dissipation base. The present invention has the following beneficial effects: the heat generated by the operation of the LED chip is caused by the heat dissipation base. The seat is directly transmitted to the heat pipe, and the heat convection effect inside the heat official enables the heat energy to be dissipated more efficiently and quickly into the surrounding cold air. This avoids the situation that the light-emitting diode chip is damaged by overheating. [Embodiment] 5 M376119 The third and fourth figures are the first embodiment of the creative light-emitting diode heat dissipation module, comprising a high-power light-emitting diode, a circuit substrate 2 and a heat pipe. 3. The light-emitting diode 1 comprises a light-emitting diode wafer 11 , a heat-dissipating pedestal i made of a copper material, an insulative housing 13 formed by injection molding, a positive electrode pin 4 of a pair of conductor materials, and a negative electrode pin 15 and an encapsulant 16. The top of the heat dissipation base 12 has a recessed wafer receiving area 丄2丄, and the illuminating diode 11 is fused by the eutectic process to be fixed. The wafer housing area 121 of the susceptor 12. The insulating housing 13 is wrapped on the outer side of the heat dissipation base 12, and the lower half of the heat dissipation base 12 is exposed to the insulating housing 13. The positive terminal 1 One end of the fourth end and one end of the negative electrode pin 15 are embedded in the insulating case 3, and the positive electrode and the negative electrode of the light emitting diode chip are respectively connected to the positive electrode through the metal wire. Foot 14 and the negative pin 15 are. The opposite end of the positive pin 14 and the opposite end of the negative pin 15 project from the insulating housing 23. The encapsulant 66 is made of a mixture of a sealing material and a phosphor, and the encapsulant 16 covers the LED ii and two metals connected to the positive pin 14 and the negative pin 15 wire. The circuit board 2 can be a printed circuit board, a flexible circuit board, a ceramic substrate or an aluminum substrate. However, the printed circuit board is preferred. Therefore, the circuit board 2 of the present embodiment is a printed circuit board. The circuit board 6 2 is provided with a through hole 2 1 , and the heat dissipation base 丄 2 of the light emitting diode 1 is engaged in the through hole 21 , and the bottom of the heat dissipation base 12 is located below the through hole 21 . An anode conductive track 2 2 and a negative electrode conductive trace 23 are disposed on the upper side of the circuit substrate 2, wherein the positive conductive track 2 2 and the negative conductive track 23 are copper lines or silver lines. The positive pin 14 and the negative pin 5 are respectively fixed to the positive conductive trace 2 2 and the negative conductive track 23 by a solder reflow process, so that the positive pin 14 and the positive conductive track are A first bonding layer 4 of a metal eutectic material is formed between each of the two, and between the negative electrode pin 15 and the negative electrode conductive track 2 3 . The first bonding layer 4 has an electrically conductive property in addition to the fixing action. As a result, current can flow through the light-emitting diode chip 1 through the positive pin 14 and the negative pin 15 to drive the light-emitting diode chip 1 1 to emit light. The heat pipe 3 is flat in the whole, and the heat pipe 3 is located on the lower side of the circuit board 2. The bottom of the heat sink base 12 and the heat receiving end of the heat pipe 3 are fixed to each other by a eutectic fusion process, so that the heat sink base 1 is fixed. A second bonding layer 5 of a metal eutectic material is formed between the bottom of the 2 and the heat pipe 3, and the second bonding layer 5 has a heat conducting property in addition to the fixing action. The heat of the light-emitting diode 1 can be quickly transmitted to the heat pipe 3 via the heat-dissipating base 12, and the heat pipe 3 moves the internal liquid at the cold end of the heat pipe 3 to the heat-receiving end 々IL to fill the heat-receiving end due to the change of the internal pressure. The space left by the liquid, so that the heat convection phenomenon is formed in the heat official 3, thereby achieving the effect of heat dissipation. In addition, the shape of the heat pipe 3 may also be changed. For example, the portion of the heat pipe 3 that is in contact with the heat dissipation base χ 2 is flat, and the other portions of the heat pipe 3 may be flat or hollow. Body shape. The fifth embodiment of the present invention is a second embodiment of the present invention. The difference between the first embodiment and the first embodiment is that the cold end of the heat pipe 3 is used, and the crystal fusion process and the at least one metal heat sink block 7 are fixed to each other. A third bonding layer 6 of a metal eutectic material is formed between the heat pipe 3 and the metal heat dissipating block 7, and the third bonding layer 6 has a heat conducting property in addition to the fixing action. The metal heat sink block 7 includes a base 7 1 and a set of fins 7 2 connected to the base 7 i. The base 7 1 of the metal heat sink block 7 is fixed to the cold end of the heat pipe 3 through the third bonding layer 6. When hot air convects to the cold end of the heat pipe 3, the heat will be dissipated into the surrounding cold air by the metal heat sink 7. At this time, the gas taken away by the heat is condensed to form a liquid, and flows again to the hot end of the tube 3. With such a heat convection cycle, the speed of heat dissipation is further improved. As shown in the sixth figure, the circuit board 2 is a printed circuit board, and the light-emitting diodes on each of the circuit boards 2 can be replaced by a plurality of conductive connectors 8' on the board 2, together with the number of transmission lines 9. Performing a series or parallel circuit layout (not shown), if it is found that the illuminating-polar body 1 is damaged and cannot be normally illuminated, it is easy to remove the signal transmission line g plugged into the splicing 8 The damaged light-emitting diode 1 is combined with the circuit board 2 underneath and removed, which is simpler and more convenient than the conventional method of reflow soldering in the reflow oven. The present invention has the following advantages: The heat generated by the operation of the LED chip 11 is directly transmitted to the heat pipe 3 by the heat dissipation base 12, and the heat convection effect inside the heat pipe 3 enables the heat energy to be more effectively and quickly dissipated into the surrounding cold air. The occurrence of damage of the LED chip ii due to overheating is avoided. 2. When the circuit board 2 uses a printed circuit board, it is convenient to perform maintenance and replacement of the LED 2 without need to be desoldered through the reflow furnace. . as above For the sake of the preferred embodiment of the present invention, it is not intended to limit the scope of implementation of the present invention, that is, the variations and modifications made by the patent application of the present invention are covered by the scope of the patent. [Simple description of the diagram] The first picture is a cross-sectional view of a conventional light-emitting diode cooling module. ^ The figure shows a conventional three-dimensional heat dissipation module connected in series with the domain plate Exploded view. = ί A cross-sectional view of the light-emitting diode cooling module. A cross-sectional view of the M376119 of the second embodiment of the creative light-emitting diode heat-dissipating module. The sixth figure is a top view of the light-emitting diode cooling module connected in series. [Main component symbol description] [Practical] Light-emitting diode 1 a Light-emitting diode chip 1 1 a Heat sink base 1 2 a Insulating housing 1 3 a Positive pole 1 4 a Negative pin 1 5 a Package Colloid 1 6 a Aluminum substrate 2 a Circuit surface layer 2 1 a Insulation layer 2 2 a Metal plate bottom layer 2 3 a [This creation] Light-emitting diode 1 Light-emitting diode wafer 11 Heat-dissipating pedestal 12 Chip-receiving area 1 2 1 Insulating housing 13 positive pin 14 negative pin 1 5 encapsulant 16 M3761 19 Circuit board 2 Perforation 2 1 Positive conductive trace 2 2 Negative conductive trace 2 3 Heat pipe 3 First bond layer 4 Second bond layer 5 Third bond layer 6 Metal heat sink 7 Base 7 1 Fin 7 2 Conductive connector 8 signal transmission line 9