CN218243947U - Heat radiation structure for flat surface-mounted packaged power device and electronic circuit thereof - Google Patents
Heat radiation structure for flat surface-mounted packaged power device and electronic circuit thereof Download PDFInfo
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- CN218243947U CN218243947U CN202222115810.4U CN202222115810U CN218243947U CN 218243947 U CN218243947 U CN 218243947U CN 202222115810 U CN202222115810 U CN 202222115810U CN 218243947 U CN218243947 U CN 218243947U
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Abstract
The utility model provides a heat radiation structure for flat table pastes encapsulation power device locates the PCB board, flat table pastes encapsulation power device includes the power device unit, the power device unit is located the first surface of PCB board, this heat radiation structure includes: a first heat sink member and a second heat sink member; the first heat dissipation part comprises a first heat dissipation sheet and a second heat dissipation sheet, and the first heat dissipation sheet is arranged on the first surface of the PCB and is electrically connected with the heating part of the power device unit; the second heat radiating fin is arranged on the second surface of the PCB and is connected with a first electrical point, and the first electrical point is characterized as an electrical point for reducing noise voltage; the second heat dissipation part is embedded in the PCB, a first end of the second heat dissipation part is connected with the heating part of the power device unit, and a second end of the second heat dissipation part is connected with the second heat dissipation plate so as to transmit heat to the second heat dissipation plate.
Description
Technical Field
The utility model relates to a semiconductor field especially relates to a heat radiation structure and electronic circuit that is used for flat table to paste encapsulation power device.
Background
The good heat dissipation of the power tube is an important condition for ensuring the normal operation of the power device.
At present, for a power device of a flat surface-mount package, a pad of a heat sink of the power device is generally directly connected to a Drain/Source pole of the power device, and heat dissipation is mainly performed by enlarging the area of the Drain/Source pole, but when the pad is used in a flyback topology for being used as a primary main switch tube or used in a down tube position in a half-bridge topology, a large dv/dt noise voltage exists between the Drain/Source pole and the ground, and the larger the pad area is, the larger the coupling capacitance between the pad and the ground is, the larger the common mode current generated by the pad is, and the worse the EMI will be. Therefore, enlarging the Drain/Source electrode area has better heat dissipation effect but poor EMI performance.
SUMMERY OF THE UTILITY MODEL
The utility model provides a heat radiation structure and electronic circuit for flat table pastes encapsulation power device to solve through increaseing the relatively poor EMI performance that source electrode or drain electrode area heat dissipation lead to and great dv/dt noise voltage's problem.
According to the utility model discloses an aspect provides a heat radiation structure for flat table pastes encapsulation power device locates the PCB board, flat table pastes encapsulation power device includes the power device unit, the power device unit is located the first surface of PCB board, this heat radiation structure includes: a first heat sink member and a second heat sink member;
the first heat dissipation part comprises a first heat dissipation sheet and a second heat dissipation sheet, and the first heat dissipation sheet is arranged on the first surface of the PCB and is electrically connected with the heating part of the power device unit; the second radiating fin is arranged on the second surface of the PCB and connected with a first electrical point, and the first electrical point is characterized as an electrical point for reducing noise voltage;
the second heat dissipation part is embedded in the PCB, a first end of the second heat dissipation part is connected with the heating part of the power device unit, and a second end of the second heat dissipation part is connected with the second heat dissipation plate so as to transmit heat to the second heat dissipation plate.
Optionally, the first electrical point is a ground.
Optionally, the first electrical point is an electrical point with dv/dt noise voltage to ground less than 10V/uS.
Optionally, the PCB includes a plurality of grooves therein, the shape of the second heat sink is matched with the shape of the grooves, and the second heat sink is embedded in each groove.
Optionally, the PCB includes a plurality of slots, the second heat sink is shaped to match the slots, and the second heat sink is embedded in each slot.
Optionally, the first heat sink member includes copper.
Optionally, the second heat sink part includes a thermally conductive paste.
Optionally, the power device unit includes a MOS transistor and/or a GAN transistor.
Optionally, the heat generating portion of the power device unit includes a heat dissipation pad of a source and/or a drain of the power device unit.
According to a second aspect of the present invention, there is provided an electronic circuit comprising the heat dissipation structure for a flat surface mount packaged power device according to the first aspect and its optional aspects.
The utility model provides a heat radiation structure and electronic circuit for flat table pastes encapsulation power device, through set up in the PCB of flat table pastes encapsulation power device the second radiating part, and the second surface of PCB board sets up the second fin, will the heat of the portion of generating heat of power device unit is led the second fin has realized under the condition that does not influence its EMI performance, has strengthened its heat radiation characteristic.
In a preferred embodiment, the second heat dissipation part is made of heat-conducting glue, so that the heat dissipation effect is further enhanced.
In addition, the second cooling fin is also connected with an electrical point for reducing noise voltage, and the influence of dv/dt noise voltage is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the description below are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without inventive labor.
Fig. 1 is a schematic view of a heat dissipation structure for a flat surface mount package power device according to the prior art in an embodiment of the present invention;
fig. 2 is a schematic diagram of a heat dissipation structure for a flat surface mount package power device according to an example of the present invention;
fig. 3 is a schematic diagram of a heat dissipation structure for a flat surface mount package power device according to an embodiment of the present invention.
Description of reference numerals:
101-a power device unit;
1011-a heat-generating portion;
201-a first heat sink;
202-a second heat sink;
3-a second heat sink portion;
4-PCB board.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
In the description of the present invention, it should be understood that the terms "upper portion", "lower portion", "upper end", "lower surface", "upper surface", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the description of the present invention, "plurality" means a plurality, such as two, three, four, etc., unless specifically limited otherwise.
In the description of the present invention, unless explicitly stated or limited otherwise, the terms "connected" and the like are to be understood broadly, and may for example be fixedly connected, detachably connected, or integrated; can be mechanically connected, electrically connected or can communicate with each other; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood according to specific situations by those of ordinary skill in the art.
The technical solution of the present invention will be described in detail with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Before the present application is proposed, the applicant has made a sufficient study on the heat dissipation structure for the flat surface mount package power device, and based on the study, has proposed the heat dissipation structure for the flat surface mount package power device shown in fig. 1 and 2, and it is necessary to increase the pad area for heat dissipation in the heat dissipation structure for the flat surface mount package power device shown in fig. 1 and 2. Specifically, as shown in fig. 1, the power management structure includes: the power device comprises a power device unit, a PCB and a top copper sheet; the top layer copper sheet is arranged on the upper surface of the PCB so as to lead out heat of the power device unit.
For the heat dissipation structure for the flat surface mount package power device shown in fig. 2, specifically, the heat dissipation structure includes: power device unit, PCB board, top layer copper sheet, bottom copper sheet and PCB via hole, the top layer copper sheet is located the first surface of PCB board, the bottom copper sheet is located the second surface of PCB board, PCB adopts the copper facing technology in the via hole, in order to follow the heat top layer copper sheet is derived extremely the second surface.
In the heat dissipation structure in the scheme, heat dissipation is performed only by increasing the area of the pad, the Drian pole heat dissipation device is used in the flyback topology structure and the half-bridge lower tube position, the Source pole heat dissipation device is used in the half-bridge upper tube position, and due to the fact that a large dv/dt noise voltage exists between the heat dissipation pad and the ground, if the area of the heat dissipation pad is directly increased, the heat dissipation effect is increased, but the negative influence of EMI can be brought.
In view of this, the utility model provides a new heat radiation structure need not to increase the pad area and just can realize the increase of radiating effect and avoided EMI's negative effects.
The scheme of the utility model is specifically explained as follows:
referring to fig. 3, the utility model provides a heat radiation structure for flat table pastes encapsulation power device locates PCB board 4, flat table pastes encapsulation power device includes power device unit 101, power device unit 101 is located the first surface of PCB board 4, and this heat radiation structure includes: a first heat sink member and a second heat sink member 3.
The first heat dissipation part comprises a first heat dissipation sheet 201 and a second heat dissipation sheet 202, wherein the first heat dissipation sheet 201 is arranged on the first surface of the PCB 4 and is electrically connected with a heating part 1011 of the power device unit 101; the second heat sink 202 is disposed on the second surface of the PCB 4, and the second heat sink 202 is connected to a first electrical point, which is characterized as an electrical point for reducing noise voltage.
Wherein the second surface of the PCB 4 is characterized as the back surface of the PCB, i.e. the first heat sink and the second heat sink are disposed on two different surfaces of the PCB.
The second heat sink member 3 is embedded in the PCB 4, a first end of the second heat sink member 3 is connected to the heat generating portion 1011 of the power device unit 101, and a second end of the second heat sink member 3 is connected to the second heat sink 202, so as to transfer heat to the second heat sink 202.
In one example, the area of the second heat sink 202 is larger than the area of the first heat sink 201, wherein the second heat sink 202 takes the most heat away during heat dissipation.
The heat sink may be any material and structure capable of dissipating heat. In a specific example, the material of the heat sink may be metal (e.g., copper), ceramic, or a high thermal conductive material such as a graphene block.
With respect to the first electrical point, in a specific embodiment, the first electrical point is an electrical point with a dv/dt noise voltage to ground of less than 10V/uS.
Regarding the second heat sink member 3, in a preferred embodiment, the PCB board 4 includes a plurality of grooves therein, the shape of the second heat sink member 3 matches the shape of the grooves, and the second heat sink member 3 is embedded in each groove.
In other preferred embodiments, the PCB 4 includes a plurality of slots therein, the shape of the second heat sink member 3 matches the shape of the slots, and the second heat sink member 3 is inserted into each slot.
In one example, the second heat sink member 3 includes a thermally conductive paste.
Of course, the present invention is not limited thereto, and other heat dissipation materials of the second heat dissipation portion 3 are all within the protection scope of the present invention.
Regarding the rate device unit, in a specific embodiment, the power device unit 101 includes a MOS transistor and/or a GAN transistor.
In the implementation, the number of the power device units 101 may be one as illustrated, or may be plural.
In other embodiments, the heat generating portion 1011 of the power device unit 101 includes a heat dissipating pad of the source and/or the drain of the power device unit 101.
In the above scheme, the utility model provides a heat radiation structure is two-sided heat radiation structure (or can understand two-sided cooling structure), utilizes first fin 201 is right the portion 1011 that generates heat of power device unit 101 tentatively dispels the heat to transmit most heat extremely through second heat dissipation portion 3 second fin 202 realizes two-sided heat dissipation, is convenient for more high-efficiently will in the heat of power device dispels the environment rapidly, has effectively improved the heat dispersion of flat table subsides encapsulation power device.
In addition, the utility model discloses realize the increase of radiating effect, and then need not to increase the area of the heating portion 1011 (i.e. the pad) of power device unit 101, avoided increasing the negative effects of EMI that the pad brought; and the second heat sink 202 is connected to an electrical point for reducing noise voltage, further reducing noise voltage.
The utility model also provides an electronic circuit, including above a heat radiation structure that is used for flat table to paste encapsulation power device.
In the description of the present specification, reference to the terms "an embodiment," "an example," "implementation," "an example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; such modifications and substitutions do not depart from the spirit and scope of the present invention.
Claims (10)
1. The utility model provides a heat radiation structure for flat table pastes encapsulation power device locates the PCB board, flat table pastes encapsulation power device includes the power device unit, the power device unit is located the first surface of PCB board, its characterized in that, this heat radiation structure includes: a first heat sink member and a second heat sink member;
the first radiating part comprises a first radiating fin and a second radiating fin, and the first radiating fin is arranged on the first surface of the PCB and electrically connected with the heating part of the power device unit; the second radiating fin is arranged on the second surface of the PCB and connected with a first electrical point, and the first electrical point is characterized as an electrical point for reducing noise voltage;
the second heat dissipation part is embedded in the PCB, a first end of the second heat dissipation part is connected with the heating part of the power device unit, and a second end of the second heat dissipation part is connected with the second heat dissipation plate so as to transmit heat to the second heat dissipation plate.
2. The heat dissipation structure of claim 1, wherein the first electrical point is ground.
3. The heat dissipation structure of claim 1, wherein the first electrical point is an electrical point with dv/dt noise voltage to ground less than 10V/uS.
4. The heat dissipation structure for a flat surface mount package power device as claimed in claim 1, wherein the PCB board includes a plurality of grooves therein, the shape of the second heat dissipation portion matches the shape of the grooves, and the second heat dissipation portion is embedded in each groove.
5. The heat dissipation structure for a flat surface mount package power device as claimed in claim 1, wherein the PCB board includes a plurality of slots therein, the shape of the second heat dissipation portion matches the shape of the slots, and the second heat dissipation portion is embedded in each slot.
6. The heat dissipation structure for a flat surface mount package power device according to any one of claims 1 to 5, wherein the first heat dissipation part comprises copper.
7. The heat dissipation structure for a flat surface-mounted package power device according to any one of claims 1 to 5, wherein the second heat dissipation part comprises a thermally conductive paste.
8. The heat dissipation structure for flat surface mount package power devices as claimed in any one of claims 1 to 5, wherein the power device unit comprises a MOS tube and/or a GAN tube.
9. The heat dissipation structure for flat surface mount package power devices of claim 8, wherein the heat generating portion of the power device unit comprises heat dissipation pads of the source and/or drain of the power device unit.
10. An electronic circuit comprising the heat dissipating structure for a flat surface mount package power device as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222115810.4U CN218243947U (en) | 2022-08-10 | 2022-08-10 | Heat radiation structure for flat surface-mounted packaged power device and electronic circuit thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202222115810.4U CN218243947U (en) | 2022-08-10 | 2022-08-10 | Heat radiation structure for flat surface-mounted packaged power device and electronic circuit thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN218243947U true CN218243947U (en) | 2023-01-06 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202222115810.4U Active CN218243947U (en) | 2022-08-10 | 2022-08-10 | Heat radiation structure for flat surface-mounted packaged power device and electronic circuit thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN218243947U (en) |
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2022
- 2022-08-10 CN CN202222115810.4U patent/CN218243947U/en active Active
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