CN101159300B - Copper base high power LED packaging - Google Patents
Copper base high power LED packaging Download PDFInfo
- Publication number
- CN101159300B CN101159300B CN2007100190487A CN200710019048A CN101159300B CN 101159300 B CN101159300 B CN 101159300B CN 2007100190487 A CN2007100190487 A CN 2007100190487A CN 200710019048 A CN200710019048 A CN 200710019048A CN 101159300 B CN101159300 B CN 101159300B
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- copper
- led
- circuit board
- printed circuit
- copper base
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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Abstract
The invention relates to a high-power LED light source lamp with copper base, which can be widely used in various lighting fields. In the background technology, a patent application 'electric elements encapsulation aluminum substrate' published on the website of the State Intellectual Property Office of China and having application No. 200620108149.2. This patent provides an insulating oxidizing circuit board with direct heat radiation and aluminum base for electric elements or LED chip, wherein an insulating oxidizing layer is equipped on the surface of the aluminum base, and a metallized circuit layer with thermal conductivity and weldability is formed on the aluminum base using magnetron sputtering method. The invention aims to provides a high-power LED with copper base, in which, a LED tube core (1) is directly welded in the middle of the surface of a copper base (3), printed circuit boards (5) are sequentially adhered at the periphery of the surface of the copper base (3), and LED positive and negative electrodes (2) are welded on a copper coating layer (6) of the printed circuit board (5). The invention is used for improving heat radiation effect and prolonging service life.
Description
One, technical field
The present invention relates to a kind of copper base high power LED encapsulation, this luminescent device can be widely used in all kinds of lighting fields.
Two, background technology
Disclose " high-power LED encapsulation " patent application of application number 200510075355.8 on the net in State Intellectual Property Office, open (bulletin) number be CN1707823, and disclosing (bulletin) day is 2005.12.14, and the high-power LED encapsulation technology is to comprise LED; The silicon submount of LED flip-chip bonded; Be formed on the silicon submount and be electrically connected to the reflective film of LED; Be connected to the electric wire of reflective film; Be formed on the insulator under the silicon submount; Be formed on the fin under the insulator; Be formed on the insulating substrate on the fin; Be formed on the insulating substrate and be connected to the metallic circuit of electric wire.In this LED encapsulation, silicon submount is connected directly to fin, and the heat that produces during LED work is distributed effectively.Great power LED can be applied to back light unit or the general lighting equipment of LCD, also can be applicable to the back light unit of conventional P CS phone or the LED matrix of keyseat, has improved the light characteristic of LED.Especially, this LED encapsulating structure is simple and two or more arrays that have the base of LED flip-chip bonded on it are separately arranged, and therefore, can be applied to the back light unit module of LCD.
Also disclosing application number in addition is 200620108149.2, " electronic devices and components encapsulation aluminium base " patent application, open (bulletin) number be CN200956685, disclosing (bulletin) day is 2007.10.03.Its content relates to a kind of direct heat-radiating aluminum insulating oxide circuit board that is used for electronic devices and components or led chip, the surface of aluminium base is the oxide layer of insulation property, on insulating oxide, form designed circuitous pattern with mask or photoetching etc., method with magnetron sputtering forms the metallization circuit layer with thermal conductivity and solderability on aluminium base, and packaging electronic parts or led chip in the above.This structure is as the base plate for packaging of thick film circuit and led chip.
Three, summary of the invention
In order to improve the radiating effect of LED pipe better, the invention provides a kind of copper base high power LED encapsulation, can improve radiating effect, prolong LED useful life.
The technical solution adopted for the present invention to solve the technical problems is:
The copper base high power LED encapsulation, form by fixed printed circuit board on the pedestal 5 and ceramic packaging LED pipe 1, it is characterized in that: pedestal is made with copper material, the bonding printed circuit board (PCB) 5 that has square hole on copper pedestal 3 surfaces, ceramic packaging LED manages this square hole of 1 underrun and directly is welded on middle part, copper pedestal 4 surface, and the positive and negative electrode 2 of ceramic packaging LED pipe 1 is welded on the printed circuit board (PCB) 5.
Advantage of the present invention and effect:
1, because pedestal adopts brass or red copper material, conductive coefficient can reach 380～400, than aluminium base conductive coefficient (200) height, layer adopts the scolding tin material, conductive coefficient reaches 60, exceeds much than aluminium base oxide layer layer conductive coefficient (10), and radiating effect obviously improves.
2, because the LED tubular construction is directly welded in employing on the copper pedestal, improve the radiating effect when the LED plumber makes state, prolonged the useful life of LED.
Four, description of drawings
Accompanying drawing is a structure cross-sectional schematic of the present invention.
Number in the figure explanation: 1-ceramic packaging LED pipe, 2-electrode, 3-backflow layer, 4-copper pedestal, 5-printed circuit board (PCB) (pcb board).
Five, embodiment
Referring to accompanying drawing, in the copper base high power LED encapsulation, the bonding printed circuit board (PCB) (pcb board) 5 that has square hole on copper pedestal 4, the base bottom metal heat-conducting layer of ceramic packaging LED pipe 1 directly is welded on middle part, copper pedestal 4 surface by this square hole and forms backflow layer 3, and the positive and negative electrode 2 that ceramic packaging LED manages 1 bottom applies on the copper sheet at printed circuit board (PCB) 5 by reflow soldering.Copper pedestal 4 can be the circle, also can the side of being or polygonal.
Claims (2)
1. copper base high power LED encapsulation, form by fixed printed circuit board on the pedestal (5) and ceramic packaging LED pipe (1), it is characterized in that: pedestal is made with copper material, the bonding printed circuit board (PCB) (5) that has square hole on copper pedestal (4) surface, this square hole of ceramic packaging LED pipe (1) underrun directly is welded on middle part, copper pedestal (4) surface, and the positive and negative electrode (2) of ceramic packaging LED pipe (1) is welded on the printed circuit board (PCB) (5).
2. copper base high power LED encapsulation according to claim 1, it is characterized in that: the base bottom metal heat-conducting layer of ceramic packaging LED pipe (1) directly is welded on middle part, copper pedestal (4) surface by this square hole and forms backflow layer (3), and the positive and negative electrode (2) of ceramic packaging LED pipe (1) bottom applies on the copper sheet at printed circuit board (PCB) (5) by reflow soldering.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100190487A CN101159300B (en) | 2007-11-12 | 2007-11-12 | Copper base high power LED packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2007100190487A CN101159300B (en) | 2007-11-12 | 2007-11-12 | Copper base high power LED packaging |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101159300A CN101159300A (en) | 2008-04-09 |
| CN101159300B true CN101159300B (en) | 2010-11-10 |
Family
ID=39307291
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2007100190487A Active CN101159300B (en) | 2007-11-12 | 2007-11-12 | Copper base high power LED packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN101159300B (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100998010B1 (en) * | 2008-04-28 | 2010-12-03 | 삼성엘이디 주식회사 | Light emitting device package and method of manufacturing the same |
| CN101414654B (en) * | 2008-11-28 | 2010-10-27 | 淄博市临淄银河高技术开发有限公司 | Technique for preparing high-power LED ceramic heat-dissipating substrate |
| WO2010139116A1 (en) * | 2009-06-04 | 2010-12-09 | He Zhongliang | Light emitting diode lamp heat dissipation method |
| CN101576210B (en) * | 2009-06-15 | 2011-06-08 | 金子荔 | High power LED chip modularized flat lamp |
| CN101964391A (en) * | 2010-08-12 | 2011-02-02 | 刘雪峰 | Novel integrated waterproof high-power LED radiation and light emission integrated tube |
| CN101980388A (en) * | 2010-09-07 | 2011-02-23 | 浙江西子光电科技有限公司 | Radiator package-based LED device and manufacturing process for LED device |
-
2007
- 2007-11-12 CN CN2007100190487A patent/CN101159300B/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN101159300A (en) | 2008-04-09 |
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| C14 | Grant of patent or utility model | ||
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