TWI834766B - Method for manufacturing optical laminate with adhesive layer processed by cutting - Google Patents

Method for manufacturing optical laminate with adhesive layer processed by cutting Download PDF

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TWI834766B
TWI834766B TW108143233A TW108143233A TWI834766B TW I834766 B TWI834766 B TW I834766B TW 108143233 A TW108143233 A TW 108143233A TW 108143233 A TW108143233 A TW 108143233A TW I834766 B TWI834766 B TW I834766B
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adhesive layer
manufacturing
workpiece
surface protection
optical laminate
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TW202043816A (en
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高瀨裕太
麓弘明
横内正
池內能滿
伊崎章典
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日商日東電工股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C3/00—Milling particular work; Special milling operations; Machines therefor
    • B23C3/12—Trimming or finishing edges, e.g. deburring welded corners
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C3/00—Milling particular work; Special milling operations; Machines therefor
    • B23C3/16—Working surfaces curved in two directions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/02—Milling-cutters characterised by the shape of the cutter
    • B23C5/10—Shank-type cutters, i.e. with an integral shaft
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23C—MILLING
    • B23C5/00—Milling-cutters
    • B23C5/02—Milling-cutters characterised by the shape of the cutter
    • B23C5/12—Cutters specially designed for producing particular profiles
    • G—PHYSICS
    • G02—OPTICS
    • G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
    • G02B5/00—Optical elements other than lenses
    • G02B5/30—Polarising elements

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Polarising Elements (AREA)
  • Laminated Bodies (AREA)
  • Milling Processes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)

Abstract

本發明提供一種可簡便低價製造表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體的方法。本發明之經切削加工之附黏著劑層光學積層體的製造方法包含：將多片附黏著劑層光學積層體疊合而形成工件；及，使用具有螺旋刃之端銑刀來切削工件之外周面。附黏著劑層光學積層體包含光學薄膜、黏著劑層、分離件及表面保護薄膜，該黏著劑層配置於光學薄膜之一側，該分離件係以可剝離之狀態配置暫時黏著於黏著劑層，而表面保護薄膜係以可剝離之狀態暫時黏著於光學薄膜之另一側。本發明的製造方法係以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件。The present invention provides a method for manufacturing an optical laminate with an adhesive layer by cutting, in which peeling defects of a surface protection film are suppressed, easily and at low cost. The method of manufacturing a machined optical laminate with an adhesive layer of the present invention includes: stacking a plurality of optical laminates with an adhesive layer to form a workpiece; and using an end mill with a spiral blade to cut the outer periphery of the workpiece. noodle. The optical laminate with an adhesive layer includes an optical film, an adhesive layer, a separator and a surface protection film. The adhesive layer is disposed on one side of the optical film. The separator is disposed in a peelable state and is temporarily adhered to the adhesive layer. , and the surface protection film is temporarily adhered to the other side of the optical film in a peelable state. The manufacturing method of the present invention forms a workpiece by stacking the adhesive layer optical laminate in such a manner that the separator is located in the chip discharge direction of the end mill.

Description

經切削加工之附黏著劑層光學積層體的製造方法Method for manufacturing optical laminate with adhesive layer processed by cutting

本發明涉及一種經切削加工之附黏著劑層光學積層體的製造方法。The present invention relates to a method for manufacturing an optical laminate with an adhesive layer that is processed by cutting.

手機、筆記型個人電腦等影像顯示裝置為了實現影像顯示及/或提高該影像顯示性能，而使用各種光學積層體(例如偏光板)。代表上，係於光學積層體設置黏著劑層作為最外層，而可將光學積層體貼合至影像顯示裝置。在實際使用時，於該黏著劑層上以可剝離之狀態暫時黏著有分離件，可於至實際使用前之期間保護黏著劑層。並且，於光學積層體之與黏著劑層相反之側代表上以可剝離之狀態暫時黏著有表面保護薄膜。近年來，期望將光學積層體之形狀加工成所期望之形狀。所述加工方法可舉例如使用端銑刀之端面切削加工。Image display devices such as mobile phones and notebook personal computers use various optical laminates (such as polarizing plates) in order to realize image display and/or improve the image display performance. Typically, an adhesive layer is provided as the outermost layer on an optical laminate, so that the optical laminate can be bonded to an image display device. During actual use, a separable piece is temporarily adhered to the adhesive layer in a peelable state, which can protect the adhesive layer until actual use. Furthermore, a surface protection film is temporarily adhered in a releasable state to the side representative of the optical laminate opposite to the adhesive layer. In recent years, it has been desired to process the shape of an optical laminate into a desired shape. The processing method includes, for example, end face cutting using an end mill.

先前技術文獻 專利文獻 專利文獻1：日本專利特開2018-22140號公報Prior technical literature patent documents Patent document 1: Japanese Patent Application Publication No. 2018-22140

發明欲解決之課題 在此，將光學積層體與其他光學構件貼合時，係要求表面保護薄膜之易剝離性(以下有時僅稱剝離性)。本發明係為了解決所述課題而成者，其主要目在於提供一種可簡便低價製造表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體的方法。The problem to be solved by the invention Here, when the optical laminate is bonded to other optical members, the surface protective film is required to have easy peelability (hereinafter, it may only be referred to as peelability). The present invention was made in order to solve the above-mentioned problems, and its main object is to provide a method for manufacturing an optical laminate with an adhesive layer by cutting, which can easily and cheaply produce a surface protection film with suppressed peeling defects.

用以解決課題之手段 本發明之經切削加工之附黏著劑層光學積層體的製造方法包含：將多片附黏著劑層光學積層體疊合而形成工件；及，使用具有螺旋刃之端銑刀來切削該工件之外周面。該附黏著劑層光學積層體包含光學薄膜、黏著劑層、分離件及表面保護薄膜，該黏著劑層配置於該光學薄膜之一側，該分離件係以可剝離之狀態配置暫時黏著於該黏著劑層，而該表面保護薄膜係以可剝離之狀態暫時黏著於該光學薄膜之另一側。本發明的製造方法係以使該分離件位於該端銑刀之切屑排出方向的方式疊合該附黏著劑層光學積層體而形成該工件。 在一實施形態中，上述端銑刀為右刃右螺旋或左刃左螺旋，並且係以使上述分離件位於上側之方式疊合上述附黏著劑層光學積層體，而形成工件。在另一實施形態中，上述端銑刀為右刃左螺旋或左刃右螺旋，並且係以使上述分離件位於下側之方式疊合上述附黏著劑層光學積層體，而形成工件。 在一實施形態中，上述分離件與上述黏著劑層之剝離力較上述光學薄膜與上述表面保護薄膜之剝離力更小。更具體而言，上述分離件與上述黏著劑層之剝離力為0.001N/10mm~1.0N/10mm，上述光學薄膜與上述表面保護薄膜之剝離力為0.01N/10mm~5.0N/10mm。 在一實施形態中，上述表面保護薄膜之厚度較上述分離件之厚度更大。 在一實施形態中，上述表面保護薄膜具有基材與黏著劑層，且該黏著劑層在25℃下之儲存彈性模數G’為0.5×106 (Pa)~3.0×106 (Pa)。 在一實施形態中，上述製造方法藉由上述切削使上述表面保護薄膜產生浮凸。在一實施形態中，上述表面保護薄膜之浮凸量為1μm~1000μm。 在一實施形態中，上述製造方法包含：將上述工件之外周面進行非直線切削。在一實施形態中，上述非直線切削包含：形成在俯視上述附黏著劑層光學積層體時包含曲線部之凹部。在一實施形態中，上述曲線部的半徑在5mm以下。 在一實施形態中，上述光學薄膜為偏光件或偏光板。Means for Solving the Problems The method of manufacturing a machined optical laminate with an adhesive layer according to the present invention includes: superposing a plurality of optical laminates with an adhesive layer to form a workpiece; and using an end mill with a spiral blade. The tool is used to cut the outer peripheral surface of the workpiece. The adhesive layer-attached optical laminate includes an optical film, an adhesive layer, a separator and a surface protection film. The adhesive layer is disposed on one side of the optical film, and the separator is disposed in a peelable state and is temporarily adhered to the optical film. An adhesive layer is provided, and the surface protection film is temporarily adhered to the other side of the optical film in a peelable state. The manufacturing method of the present invention is to form the workpiece by stacking the adhesive layer optical laminate in such a manner that the separator is located in the chip discharge direction of the end mill. In one embodiment, the end mill has a right-edge right-edge helix or a left-edge helix, and the adhesive layer optical laminate is laminated so that the separator is on the upper side to form a workpiece. In another embodiment, the end mill has a right-edge left-hand spiral or a left-edge right-edge spiral, and the adhesive layer optical laminate is laminated so that the separator is located on the lower side to form a workpiece. In one embodiment, the peeling force between the separation member and the adhesive layer is smaller than the peeling force between the optical film and the surface protection film. More specifically, the peeling force between the above-mentioned separator and the above-mentioned adhesive layer is 0.001N/10mm~1.0N/10mm, and the peeling force between the above-mentioned optical film and the above-mentioned surface protection film is 0.01N/10mm~5.0N/10mm. In one embodiment, the thickness of the surface protection film is greater than the thickness of the separation member. In one embodiment, the above-mentioned surface protection film has a base material and an adhesive layer, and the storage elastic modulus G' of the adhesive layer at 25°C is 0.5×10 6 (Pa) ~ 3.0×10 6 (Pa) . In one embodiment, the above-mentioned manufacturing method causes the above-mentioned surface protection film to be embossed by the above-mentioned cutting. In one embodiment, the embossment amount of the surface protection film is 1 μm to 1000 μm. In one embodiment, the manufacturing method includes non-linear cutting of the outer peripheral surface of the workpiece. In one embodiment, the non-linear cutting includes forming a recessed portion including a curved portion when the adhesive layer optical laminate is viewed from above. In one embodiment, the radius of the curved portion is 5 mm or less. In one embodiment, the optical film is a polarizer or polarizing plate.

發明效果 根據本發明，係一種附黏著劑層光學積層體的製造方法，該方法包含：將多片附黏著劑層光學積層體疊合而形成工件，並使用具有螺旋刃之端銑刀來切削該工件之外周面；並且，以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件，藉此可實現一種可簡便低價製造表面保護薄膜之剝離不良經抑制的經切削加工之附黏著劑層光學積層體的方法。Invention effect According to the present invention, there is a method for manufacturing an optical laminate with an adhesive layer. The method includes: stacking a plurality of optical laminates with an adhesive layer to form a workpiece, and using an end mill with a spiral blade to cut the workpiece. The outer peripheral surface; and, by stacking the adhesive layer optical laminate in such a way that the separator is located in the chip discharge direction of the end mill to form a workpiece, a surface protection film can be easily and cheaply produced without peeling defects. A method of suppressing the cutting process of an optical laminate with an adhesive layer.

以下參照圖式針對本發明具體實施形態進行說明，惟本發明不受該等實施形態限定。此外，為了便於觀看而示意顯示圖式，並且圖式中之長度、寬度、厚度等比率、以及角度等與實際有所差異。Specific embodiments of the present invention will be described below with reference to the drawings, but the present invention is not limited to these embodiments. In addition, the drawings are shown schematically for ease of viewing, and ratios such as length, width, thickness, and angles in the drawings may differ from the actual ones.

本發明附黏著劑層光學積層體的製造方法包含：將多片附黏著劑層光學積層體疊合而形成工件；及，使用具有螺旋刃之端銑刀來切削該工件之外周面。附黏著劑層光學積層體包含光學薄膜、黏著劑層、分離件及表面保護薄膜，該黏著劑層配置於光學薄膜之一側，該分離件係以可剝離之狀態配置暫時黏著於黏著劑層，而保護薄膜係以可剝離之狀態暫時黏著於光學薄膜之另一側。本發明之實施形態中，係以使分離件位於端銑刀之切屑排出方向的方式疊合該附黏著劑層光學積層體而形成該工件。為求方便，首先說明可用於本發明附黏著劑層光學積層體的製造方法之附黏著劑層光學積層體之具體構成，接著再針對本發明附黏著劑層光學積層體的製造方法進行說明。The manufacturing method of the adhesive layer-attached optical laminate of the present invention includes: stacking multiple adhesive layer-attached optical laminates to form a workpiece; and using an end mill with a spiral blade to cut the outer peripheral surface of the workpiece. The optical laminate with an adhesive layer includes an optical film, an adhesive layer, a separator and a surface protection film. The adhesive layer is disposed on one side of the optical film. The separator is disposed in a peelable state and is temporarily adhered to the adhesive layer. , and the protective film is temporarily adhered to the other side of the optical film in a peelable state. In an embodiment of the present invention, the adhesive layer optical laminate is stacked so that the separator is located in the chip discharge direction of the end mill to form the workpiece. For convenience, the specific structure of the adhesive layer optical laminate that can be used in the manufacturing method of the adhesive layer optical laminate of the present invention will be described first, and then the manufacturing method of the adhesive layer optical laminate of the present invention will be described.

A.附黏著劑層光學積層體 圖1係說明可用於本發明製造方法之附黏著劑層光學積層體之一例的概略截面圖。圖式例之附黏著劑層光學積層體100包含光學薄膜10、黏著劑層20、分離件30及表面保護薄膜40，黏著劑層20配置於光學薄膜10之一側，分離件30係以可剝離之狀態配置暫時黏著於黏著劑層20，而表面保護薄膜40係以可剝離之狀態暫時黏著於光學薄膜10之另一側。附黏著劑層光學積層體應用於影像顯示裝置時，代表上分離件30係配置於影像顯示單元側。附黏著劑層光學積層體在實際使用時會將分離件30剝離去除，而黏著劑層20可用於將附黏著劑層光學積層體貼合至影像顯示裝置(實質上為影像顯示單元)。表面保護薄膜40代表上具有基材41與黏著劑層42。此外，為區別黏著劑層20，有時會將表面保護薄膜之黏著劑層42稱為「PF黏著劑層」。表面保護薄膜40亦會在實際使用附黏著劑層光學積層體時被剝離去除。本發明實施形態中，藉由採用如後述的製造方法，可實現表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。即，根據本發明實施形態可抑制包含黏著劑層、分離件與表面保護薄膜之附黏著劑層光學積層體特有的課題，亦即可抑制表面保護薄膜之剝離不良。A. Optical laminate with adhesive layer FIG. 1 is a schematic cross-sectional view illustrating an example of an optical laminate with an adhesive layer that can be used in the manufacturing method of the present invention. The optical laminate 100 with an adhesive layer in the illustrated example includes an optical film 10, an adhesive layer 20, a separator 30 and a surface protection film 40. The adhesive layer 20 is disposed on one side of the optical film 10, and the separator 30 is removable. The peelable state is temporarily adhered to the adhesive layer 20, and the surface protection film 40 is temporarily adhered to the other side of the optical film 10 in a peelable state. When the optical laminate with an adhesive layer is used in an image display device, it means that the upper separation member 30 is disposed on the image display unit side. When the optical laminate with an adhesive layer is actually used, the separator 30 will be peeled off and removed, and the adhesive layer 20 can be used to bond the optical laminate with an adhesive layer to an image display device (essentially, an image display unit). The surface protection film 40 is representatively provided with a base material 41 and an adhesive layer 42 . In addition, in order to distinguish the adhesive layer 20, the adhesive layer 42 of the surface protection film is sometimes called a "PF adhesive layer". The surface protection film 40 will also be peeled off and removed when the adhesive layer optical laminate is actually used. In an embodiment of the present invention, by adopting a manufacturing method as described below, it is possible to realize a cut-processed optical laminate with an adhesive layer in which peeling failure of the surface protective film is suppressed. That is, according to the embodiment of the present invention, it is possible to suppress the problems unique to the adhesive layer-attached optical laminate including the adhesive layer, the separator and the surface protective film, that is, it is possible to suppress the peeling failure of the surface protective film.

光學薄膜10可舉可用於需進行切削加工(尤其非直線加工)之用途上之任意適當之光學薄膜。光學薄膜可為單層構成之薄膜亦可為積層體。單層構成之光學薄膜的具體例可舉如偏光件、相位差薄膜。以積層體形式構成之光學薄膜的具體例可舉偏光板(代表上為偏光件與保護薄膜之積層體)、觸控面板用導電性薄膜、表面處理薄膜、以及因應目的將由該等單層構成之光學薄膜及/或以積層體形式構成的光學薄膜適當積層而成之積層體(例如抗反射用圓偏光板、附觸控面板用導電層之偏光板)。The optical film 10 can be any suitable optical film that can be used for applications requiring cutting processing (especially non-linear processing). The optical film may be a single-layer film or a laminated body. Specific examples of optical films composed of a single layer include polarizers and retardation films. Specific examples of optical films composed of laminates include polarizing plates (typically, laminates of polarizers and protective films), conductive films for touch panels, surface treatment films, and single layers composed of these depending on the purpose. The optical film and/or the optical film in the form of a laminate is appropriately laminated to form a laminate (for example, a circular polarizing plate for anti-reflection, a polarizing plate with a conductive layer for touch panels).

黏著劑層20可採用任意適當之構成。構成黏著劑層之黏著劑之具體例可舉丙烯酸系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、胺甲酸酯系黏著劑、環氧系黏著劑及聚醚系黏著劑。藉由調整形成黏著劑的基底樹脂之單體種類、數量、組合及摻混比、以及交聯劑的摻混量、反應溫度、反應時間等，可調製出具有因應目的之所期望特性的黏著劑。黏著劑的基底樹脂可單獨使用亦可組合2種以上來使用。由透明性、加工性及耐久性等觀點宜為丙烯酸系黏著劑。構成黏著劑層之黏著劑的詳細內容例如記載於日本特開2014-115468號公報，本說明書即援用該公報之記載作為參考。黏著劑層20之厚度可為例如10μm~100μm。黏著劑層20在25℃下之儲存彈性模數G’例如可為1.0×104 (Pa)~1.0×106 (Pa)。此外，儲存彈性模數例如可由動態黏彈性測定求得。The adhesive layer 20 can adopt any suitable structure. Specific examples of the adhesive constituting the adhesive layer include acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, urethane adhesives, epoxy adhesives and polyester adhesives. Ether adhesive. By adjusting the monomer type, quantity, combination and blending ratio of the base resin that forms the adhesive, as well as the blending amount of the cross-linking agent, reaction temperature, reaction time, etc., an adhesive with desired characteristics corresponding to the purpose can be prepared. agent. The base resin of the adhesive can be used alone or in combination of two or more types. An acrylic adhesive is suitable from the viewpoint of transparency, processability, and durability. Details of the adhesive constituting the adhesive layer are described in, for example, Japanese Patent Application Laid-Open No. 2014-115468, and the description of this publication is used as a reference in this specification. The thickness of the adhesive layer 20 may be, for example, 10 μm ~ 100 μm. The storage elastic modulus G' of the adhesive layer 20 at 25°C may be, for example, 1.0×10 4 (Pa) to 1.0×10 6 (Pa). In addition, the storage elastic modulus can be obtained by dynamic viscoelasticity measurement, for example.

分離件30可採用任意適當之分離件。具體例可舉藉由剝離劑進行過表面塗佈之塑膠薄膜、不織布或紙。剝離材之具體例可舉聚矽氧系剝離劑、氟系剝離劑、長鏈烷基丙烯酸酯系剝離劑。塑膠薄膜之具體例可舉聚對苯二甲酸乙二酯(PET)薄膜、聚乙烯薄膜、聚丙烯薄膜。分離件之厚度例如可為10μm~100μm。The separation member 30 may be any suitable separation member. Specific examples include plastic films, nonwoven fabrics, or paper surface-coated with a release agent. Specific examples of the release material include silicone release agents, fluorine release agents, and long-chain alkyl acrylate release agents. Specific examples of the plastic film include polyethylene terephthalate (PET) film, polyethylene film, and polypropylene film. The thickness of the separation member may be, for example, 10 μm ~ 100 μm.

表面保護薄膜40如上述，代表上具有基材41與黏著劑層42。基材41的形成材料可舉例如聚對苯二甲酸乙二酯系樹脂等酯系樹脂、降莰烯系樹脂等環烯烴系樹脂、聚丙烯等烯烴系樹脂、聚醯胺系樹脂、聚碳酸酯系樹脂及其等之共聚物樹脂等。較理想的是酯系樹脂(尤為聚對苯二甲酸乙二酯系樹脂)。只要為所述材料，便具有彈性模數夠高且即便於輸送及/或貼合時加諸張力亦不易發生變形之優點。The surface protection film 40 is representatively provided with a base material 41 and an adhesive layer 42 as described above. Examples of materials for forming the base material 41 include ester resins such as polyethylene terephthalate resin, cycloolefin resins such as norbornene resin, olefin resins such as polypropylene, polyamide resins, and polycarbonate. Ester resin and its copolymer resin, etc. More preferred are ester resins (especially polyethylene terephthalate resins). As long as it is the above-mentioned material, it has the advantage of having a sufficiently high elastic modulus and not easily deforming even if tension is applied during transportation and/or lamination.

基材41之彈性模數例如可為2.2kN/mm2 ~4.8kN/mm2 。基材之彈性模數只要為所述範圍，便具有即便於輸送及/或貼合時加諸張力亦不易發生變形之優點。此外，彈性模數係依循JIS K 6781來測定。The elastic modulus of the base material 41 may be, for example, 2.2kN/mm 2 ~4.8kN/mm 2 . As long as the elastic modulus of the base material is within the above range, it has the advantage that it is less likely to deform even if tension is applied during transportation and/or lamination. In addition, the elastic modulus is measured in accordance with JIS K 6781.

基材41之厚度例如為30μm~70μm。The thickness of the base material 41 is, for example, 30 μm to 70 μm.

黏著劑層(PF黏著劑層)42可採用任意適當之構成。具體例可舉丙烯酸系黏著劑、橡膠系黏著劑、聚矽氧系黏著劑、聚酯系黏著劑、胺甲酸酯系黏著劑、環氧系黏著劑及聚醚系黏著劑。藉由調整形成黏著劑的基底樹脂之單體種類、數量、組合及摻混比、以及交聯劑的摻混量、反應溫度、反應時間等，可調製出具有因應目的之所期望特性的黏著劑。黏著劑的基底樹脂可單獨使用亦可組合2種以上來使用。構成PF黏著劑層之黏著劑具有以下特徵：基底樹脂包含具有含活性氫之官能基的聚合物。只要為所述基底樹脂，便可獲得具有所期望儲存彈性模數之PF黏著劑層。構成PF黏著劑層之黏著劑的詳細內容例如記載於日本特開2018-123281號公報，本說明書即援用該公報之記載作為參考。PF黏著劑層42之厚度可為例如10μm~100μm。PF黏著劑層42在25℃下之儲存彈性模數G’例如可為0.5×106 (Pa)~3.0×106 (Pa)。只要儲存彈性模數為所述範圍，便可獲得黏著性與剝離性之平衡優異之黏著劑層(結果為表面保護薄膜)。並且，透過後述製造方法，可使表面保護薄膜產生浮凸，結果可以浮凸部分作為抓握緣而輕易使應力集中於剝離點，因此可在維持可容許之黏著性的同時實現更優異之剝離性。The adhesive layer (PF adhesive layer) 42 may have any appropriate structure. Specific examples include acrylic adhesives, rubber adhesives, silicone adhesives, polyester adhesives, urethane adhesives, epoxy adhesives, and polyether adhesives. By adjusting the monomer type, quantity, combination and blending ratio of the base resin that forms the adhesive, as well as the blending amount of the cross-linking agent, reaction temperature, reaction time, etc., an adhesive with desired characteristics corresponding to the purpose can be prepared. agent. The base resin of the adhesive can be used alone or in combination of two or more types. The adhesive constituting the PF adhesive layer has the following characteristics: the base resin contains a polymer having a functional group containing active hydrogen. As long as the base resin is used, a PF adhesive layer with a desired storage elastic modulus can be obtained. Details of the adhesive constituting the PF adhesive layer are described in, for example, Japanese Patent Application Laid-Open No. 2018-123281, and the description of this publication is used as a reference in this specification. The thickness of the PF adhesive layer 42 may be, for example, 10 μm ~ 100 μm. The storage elastic modulus G' of the PF adhesive layer 42 at 25°C may be, for example, 0.5×10 6 (Pa) to 3.0×10 6 (Pa). As long as the storage elastic modulus is within the above range, an adhesive layer (resulting in a surface protective film) with excellent balance between adhesiveness and peelability can be obtained. In addition, the surface protection film can be embossed through the manufacturing method described below. As a result, the embossed portion can be used as a gripping edge to easily concentrate stress on the peeling point. Therefore, better peeling can be achieved while maintaining acceptable adhesion. sex.

表面保護薄膜40之厚度例如可為40μm~120μm。此外，表面保護薄膜之厚度係指基材與PF黏著劑層之合計厚度。The thickness of the surface protection film 40 may be, for example, 40 μm ~ 120 μm. In addition, the thickness of the surface protection film refers to the total thickness of the base material and PF adhesive layer.

在一實施形態中，分離件30與黏著劑層20之剝離力(以下亦稱分離件之剝離力)較光學薄膜10與表面保護薄膜40(實質上為PF黏著劑層42)之剝離力(以下亦稱表面保護薄膜之剝離力)更小。大多情況，表面保護薄膜之剝離力較分離件之剝離力更大，而易發生表面保護薄膜之剝離不良，但依據後述製造方法，可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。更具體而言，分離件之剝離力宜為0.001N/10mm~1.0N/10mm，表面保護薄膜之剝離力宜為0.01N/10mm~5.0N/10mm。分離件之剝離力宜為0.001~0.1N/10mm，更宜為0.005~0.03N/10mm。表面保護薄膜之剝離力宜為0.01~0.5N/10mm，更宜為0.035~0.1N/10mm。分離件之剝離力與表面保護薄膜之剝離力之差(表面保護薄膜之剝離力-分離件之剝離力)宜為0.01N/10mm~1.0N/10mm。依據後述的製造方法，即便剝離力有所述之差，仍可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。In one embodiment, the peeling force of the separator 30 and the adhesive layer 20 (hereinafter also referred to as the peeling force of the separator) is greater than the peeling force of the optical film 10 and the surface protection film 40 (essentially the PF adhesive layer 42) ( (hereinafter also referred to as the peeling force of the surface protection film) is smaller. In most cases, the peeling force of the surface protection film is greater than the peeling force of the separator, and peeling failure of the surface protection film is likely to occur. However, according to the manufacturing method described below, it is possible to obtain a machined attachment in which peeling failure of the surface protection film is suppressed. Adhesive layer optical laminate. More specifically, the peeling force of the separation part should be 0.001N/10mm~1.0N/10mm, and the peeling force of the surface protection film should be 0.01N/10mm~5.0N/10mm. The peeling force of the separation part should be 0.001~0.1N/10mm, more preferably 0.005~0.03N/10mm. The peeling force of the surface protection film should be 0.01~0.5N/10mm, more preferably 0.035~0.1N/10mm. The difference between the peeling force of the separation element and the peeling force of the surface protection film (peeling force of the surface protection film - the peeling force of the separation element) should be 0.01N/10mm~1.0N/10mm. According to the manufacturing method described below, even if the peeling force has the above-described difference, it is possible to obtain a cutting-processed adhesive layer optical laminate in which peeling failure of the surface protective film is suppressed.

在一實施形態中，表面保護薄膜40之厚度較分離件30之厚度更大。藉由所述製造方法，即便是在如所述般表面保護薄膜之厚度很厚需要很大的剝離力時，仍可實現優異剝離性。表面保護薄膜之厚度與分離件之厚度之差(表面保護薄膜之厚度-分離件之厚度)宜為5μm~60μm。依據後述的製造方法，即便厚度有所述之差，仍可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。In one embodiment, the thickness of the surface protection film 40 is greater than the thickness of the separation member 30 . According to the manufacturing method, excellent peelability can be achieved even when the thickness of the surface protection film is very thick and requires a large peeling force. The difference between the thickness of the surface protection film and the thickness of the separation piece (thickness of the surface protection film - thickness of the separation piece) is preferably 5 μm ~ 60 μm. According to the manufacturing method described below, even if there is the above-mentioned difference in thickness, it is possible to obtain a cutting-processed adhesive layer optical laminate in which peeling failure of the surface protective film is suppressed.

B.附黏著劑層光學積層體的製造方法 以下，說明附黏著劑層光學積層體的製造方法的代表例。首先，說明本發明之特徴部分的端銑刀之構成與工件之積層狀態之關係，再說明製造方法之概略。B. Manufacturing method of optical laminate with adhesive layer Hereinafter, a typical example of a method of manufacturing an optical laminate with an adhesive layer will be described. First, the relationship between the structure of the end mill and the lamination state of the workpiece, which is a characteristic part of the present invention, is explained, and then the outline of the manufacturing method is explained.

B-1.端銑刀之構成與工件之積層狀態之關係 本發明之實施形態中，係如同上述，以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件，再切削該工件之外周面。參照圖2及圖3來具體說明。圖2係說明可用於本發明製造方法之端銑刀之構成的代表例的概略圖。圖3係說明端銑刀為右刃時與為左刃時切削方向的不同的概略俯視圖。如圖2所示，端銑刀之構成大致分成右刃右螺旋、右刃左螺旋、左刃右螺旋、左刃左螺旋。如圖2所示，所謂右刃係指從上側(柄側)看去可在順時針旋轉時切削的構成；所謂左刃則係指從上側(柄側)看去可在逆時針旋轉時切削的構成。如圖2進一步所示，所謂右螺旋係指刀鋒從側邊看去沿右斜上方延伸的構成；所謂左螺旋則係指刀鋒從側邊看去沿左斜上方延伸的構成。右刃右螺旋及左刃左螺旋之切屑的排出方向為上方；右刃左螺旋及左刃右螺旋之切屑的排出方向為下方。此外，如圖3所示，右刃之切削方向代表上為逆時針旋轉，左刃之切削方向代表上為順時針旋轉。B-1. The relationship between the structure of the end mill and the lamination state of the workpiece In an embodiment of the present invention, as described above, the adhesive layer optical laminate is stacked so that the separator is located in the chip discharge direction of the end mill to form a workpiece, and then the outer peripheral surface of the workpiece is cut. Detailed description will be given with reference to FIGS. 2 and 3 . FIG. 2 is a schematic diagram illustrating a representative example of the structure of an end mill that can be used in the manufacturing method of the present invention. FIG. 3 is a schematic plan view illustrating the difference in cutting direction between when the end mill has a right-edge edge and when it has a left-edge edge. As shown in Figure 2, the structure of the end mill is roughly divided into right-edge right-edge helix, right-edge left-edge helix, left-edge right-edge helix, and left edge left-edge helix. As shown in Figure 2, the so-called right blade refers to a structure that can be cut when rotated clockwise when viewed from the upper side (shank side); the so-called left blade refers to a structure that can be cut counterclockwise when viewed from the upper side (shank side). composition. As further shown in Figure 2, the so-called right-hand spiral refers to the structure in which the blade extends obliquely upward when viewed from the side; the so-called left-hand spiral refers to the structure in which the blade extends obliquely upward leftward when viewed from the side. The discharge direction of chips for right-edge right-edge helix and left-edge left-edge helix is upward; for right-edge left-edge helix and left edge right-edge helix, the discharge direction of chips is downward. In addition, as shown in Figure 3, the cutting direction of the right blade is represented by counterclockwise rotation, and the cutting direction of the left blade is represented by clockwise rotation.

本發明之實施形態中，係如同上述，以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件，再切削該工件之外周面。例如在端銑刀為右刃右螺旋或左刃左螺旋時，係如圖4(a)所示，以使分離件位於上側之方式疊合附黏著劑層光學積層體而形成工件W。另一方面，在端銑刀為右刃左螺旋或左刃右螺旋時，係如圖4(b)所示，以使分離件位於下側之方式疊合附黏著劑層光學積層體而形成工件W。本發明人等發現：依具有螺旋刃之端銑刀的切屑排出方向與工件中附黏著劑層光學積層體的表面保護薄膜之配置的關係，會有表面保護薄膜會產生浮凸的情形與不會產生浮凸的情形；並且，藉由使表面保護薄膜產生浮凸，可解決表面保護薄膜之剝離不良的問題。只要為如上述之構成，就會將附黏著劑層光學積層體從表面保護薄膜側往分離件側削起(或削下)，結果可使在斜向被賦予強勁切削力的表面保護薄膜產生浮凸。藉此可獲得表面保護薄膜之剝離不良經抑制之經切削加工之附黏著劑層光學積層體。表面保護薄膜之浮凸量宜為1μm以上，且宜為20μm以上，更宜為50μm以上。另一方面，浮凸量宜為1000μm以下，更宜為500μm以下。只要浮凸量在所述範圍內，便可在不造成其他不良情況且將外觀品質維持在可容許範圍內的同時，實現表面保護薄膜的良好剝離性。浮凸會降低外觀品質，故在本業界會盡可能避免其產生，但根據本發明之實施形態，藉由積極使表面保護薄膜產生浮凸此一完全違背本業界技術常識的技術思想，可獲得一種剝離不良經抑制的經切削加工之附黏著劑層光學積層體。另外，若將端銑刀之構成與工件之積層狀態的關係顛倒(亦即若在端銑刀為右刃右螺旋或左刃左螺旋時如圖4(b)所示形成工件，而在端銑刀為右刃左螺旋或左刃右螺旋時如圖4(a)所示形成工件)，則分離件會產生浮凸但表面保護薄膜卻不會產生浮凸。結果，會有無法消除表面保護薄膜之剝離不良之問題的情形。In an embodiment of the present invention, as described above, the adhesive layer optical laminate is stacked so that the separator is located in the chip discharge direction of the end mill to form a workpiece, and then the outer peripheral surface of the workpiece is cut. For example, when the end mill has a right-edge right-edge helix or a left-edge helical edge, as shown in Figure 4(a) , the adhesive layer optical laminate is stacked so that the separator is on the upper side to form the workpiece W. On the other hand, when the end mill has a right-edge left-hand spiral or a left-edge right-edge spiral, the adhesive layer optical laminate is stacked so that the separator is on the lower side as shown in Figure 4(b). Artifact W. The present inventors have discovered that depending on the relationship between the chip discharge direction of an end mill with a spiral blade and the arrangement of the surface protection film of the adhesive layer optical laminate in the workpiece, there may be cases where the surface protection film becomes embossed or not. Embossing will occur; and by embossing the surface protective film, the problem of poor peeling of the surface protective film can be solved. As long as it is configured as described above, the adhesive layer optical laminate will be shaved (or shaved) from the surface protection film side toward the separator side. As a result, a surface protection film that is given strong cutting force in an oblique direction can be produced. embossed. This makes it possible to obtain a cutting-processed optical laminate with an adhesive layer in which peeling failure of the surface protective film is suppressed. The amount of relief of the surface protection film is preferably 1 μm or more, more preferably 20 μm or more, and more preferably 50 μm or more. On the other hand, the amount of relief is preferably 1000 μm or less, more preferably 500 μm or less. As long as the amount of relief is within the above range, good peelability of the surface protective film can be achieved without causing other problems and maintaining the appearance quality within an acceptable range. Embossing will reduce the appearance quality, so the industry tries to avoid its occurrence as much as possible. However, according to the embodiment of the present invention, by actively embossing the surface protection film, which is a technical idea that completely goes against the technical common sense of the industry, it is possible to obtain An optical laminate with an adhesive layer that has been machined and has suppressed peeling defects. In addition, if the relationship between the structure of the end mill and the lamination state of the workpiece is reversed (that is, if the workpiece is formed as shown in Figure 4(b) when the end mill is a right-edge right-edge spiral or a left-edge left-edge spiral, and the end mill is When the milling cutter has a right-edge left-hand spiral or a left-edge right-edge spiral (the workpiece is formed as shown in Figure 4(a)), the separation part will be embossed but the surface protection film will not be embossed. As a result, the problem of poor peeling of the surface protective film may not be eliminated.

B-2.形成工件 接著，說明切削加工之概略。圖5係用以說明本發明製造方法之切削加工的概略立體圖，於本圖係顯示工件W。如圖5所示，係形成疊合有多片附黏著劑層光學積層體而成之工件W。如在B-1項所說明，係因應端銑刀之構成而如圖4(a)或圖4(b)所示來設定工件W之積層狀態。附黏著劑層光學積層體在形成工件時，代表上係裁切成任意適當之形狀。具體而言，附黏著劑層光學積層體可裁切成矩形形狀，亦可裁切成類似矩形形狀之形狀，而亦可裁切成因應目的之適當形狀(例如圓形)。工件W具有彼此相對向的外周面(切削面)1a、1b及與該等正交的外周面(切削面)1c、1d。工件W宜被鉗夾機構(未圖示)從上下鉗著。工件的總厚度宜為8mm~20mm，且宜為9mm~15mm，更宜為約10mm。只要為所述厚度，便可防止鉗夾機構之擠壓或切削加工時之衝撃造成損傷。附黏著劑層光學積層體係疊合成使工件成為所述之總厚度。構成工件之附黏著劑層光學積層體的片數例如可為10片~50片。鉗夾機構(例如夾具)可以軟質材料構成亦可以硬質材料構成。以軟質材料構成時，其硬度(JIS A)宜為60°~80°。若硬度過高，則會有鉗夾機構所造成之壓痕殘留的情形。若硬度過低，則會因夾具之變形造成位置偏移，而有切削精度不足之情形。B-2. Form workpiece Next, the outline of cutting processing will be explained. FIG. 5 is a schematic perspective view for explaining the cutting process of the manufacturing method of the present invention. In this figure, the workpiece W is shown. As shown in FIG. 5 , a workpiece W is formed in which a plurality of optical laminates with adhesive layers are laminated. As explained in Section B-1, the lamination state of the workpiece W is set as shown in Figure 4(a) or Figure 4(b) according to the structure of the end mill. When the optical laminate with an adhesive layer is formed into a workpiece, it is typically cut into any appropriate shape. Specifically, the adhesive layer optical laminate can be cut into a rectangular shape, a shape similar to a rectangular shape, or an appropriate shape (for example, a circle) according to the purpose. The workpiece W has outer peripheral surfaces (cutting surfaces) 1a and 1b facing each other and outer peripheral surfaces (cutting surfaces) 1c and 1d orthogonal to these. The workpiece W should be clamped from top to bottom by a clamping mechanism (not shown). The total thickness of the workpiece should be 8mm~20mm, and preferably 9mm~15mm, and more preferably about 10mm. As long as it is the above thickness, damage caused by extrusion of the clamp mechanism or impact during cutting can be prevented. The adhesive layer optical lamination system is laminated so that the workpiece has the stated total thickness. The number of sheets of the adhesive layer-attached optical laminate constituting the workpiece may be, for example, 10 to 50 sheets. The clamping mechanism (such as a clamp) can be made of soft material or hard material. When made of soft material, its hardness (JIS A) should be 60°~80°. If the hardness is too high, there will be residual indentations caused by the clamping mechanism. If the hardness is too low, the position will shift due to deformation of the fixture, resulting in insufficient cutting accuracy.

B-3.切削加工 接著，利用端銑刀60來切削工件W的外周面。切削代表上係藉由使端銑刀之切削刃抵接工件W之外周面來進行。切削可涵蓋工件之外周面的全周進行，而亦可僅於預定之位置進行。B-3. Cutting processing Next, the outer peripheral surface of the workpiece W is cut using the end mill 60 . Cutting is typically performed by bringing the cutting edge of the end mill into contact with the outer peripheral surface of the workpiece W. Cutting can cover the entire outer circumference of the workpiece, or it can only be done at a predetermined position.

端銑刀60如圖6所示，具有：旋轉軸61，係沿工件W之積層方向(鉛直方向)延伸；及切削刃62，係構成為以旋轉軸61為中心旋轉的本體之最外徑。在圖式例中，切削刃62係構成為沿旋轉軸61扭轉之最外徑，顯示為右刃右螺旋。切削刃62包含刀鋒62a、前刀面62b與後刀面62c。切削刃62的刃數可因應目的適當設定。圖示例中之切削刃為3片構成，但刃數可為連續的1片，可為2片，可為4片，亦可為5片以上。端銑刀的刃角度(圖式例中的切削刃之螺旋角θ)宜為20°~60°，且30°~45°更佳。只要為所述刃角度，便可藉由切削使表面保護薄膜良好地產生浮凸。切削刃之後刀面宜經粗面化處理。粗面化處理可採用任意適當之處理。代表例可舉噴砂處理。藉由對後刀面施行粗面化處理，可抑制黏著劑附著至切削刃，結果可抑制黏結。端銑刀之外徑宜為3mm~20mm。另外，本說明書中所謂「黏結」係指工件之附黏著劑層光學積層體彼此因端面之黏著劑接著之現象，附著於端面的黏著劑之切屑會助長附黏著劑層光學積層體彼此接著。又，所謂「端銑刀之外徑」係指將旋轉軸61至刀鋒62a的距離乘以2倍而得者。端銑刀可為一端(上端)經固定之單側固定端銑刀，亦可為兩端(上端與下端)經固定之雙側固定端銑刀。As shown in FIG. 6 , the end mill 60 has: a rotation axis 61 extending in the lamination direction (vertical direction) of the workpiece W; and a cutting edge 62 configured to rotate around the rotation axis 61 as the center of the outermost diameter of the body. . In the illustrated example, the cutting edge 62 is configured as the outermost diameter twisted along the rotation axis 61, and is shown as a right-edge right-hand helix. The cutting edge 62 includes a cutting edge 62a, a rake surface 62b and a flank surface 62c. The number of cutting edges 62 can be appropriately set according to the purpose. In the illustrated example, the cutting blades are composed of 3 blades, but the number of blades can be 1 continuous blade, 2 blades, 4 blades, or 5 or more blades. The edge angle of the end mill (the helix angle θ of the cutting edge in the example in the figure) is preferably 20°~60°, and 30°~45° is better. As long as the blade angle is as described above, the surface protective film can be well embossed by cutting. The surface behind the cutting edge should be roughened. Any suitable treatment may be used for the roughening treatment. A representative example is sandblasting. By roughening the flank surface, the adhesion of adhesive to the cutting edge can be suppressed, and as a result, sticking can be suppressed. The outer diameter of the end mill should be 3mm~20mm. In addition, the so-called "adhesion" in this specification refers to the phenomenon that the optical laminates with adhesive layers on the workpiece are connected to each other due to the adhesive on the end surfaces. The chips of the adhesive attached to the end surfaces will promote the adhesion of the optical laminates with adhesive layers to each other. In addition, the "outer diameter of the end mill" means multiplying the distance from the rotation axis 61 to the blade edge 62a by twice. The end mill can be a single-sided fixed end mill with one end (upper end) fixed, or a double-sided fixed end mill with both ends (upper end and lower end) fixed.

在一實施形態中，本發明製造方法包含：將工件之外周面進行非直線切削。非直線切削例如如圖7所示，包含：形成在俯視附黏著劑層光學積層體時包含曲線部之凹部4c。要製作圖7所示之俯視形狀的附黏著劑層光學積層體時，係將工件之外周進行直線切削，同時於工件外周的兩個隅部形成去角部4a、4b，並於形成有去角部4a、4b的外周面之中央部形成凹部(包含曲線部之凹部)4c。藉由形成所述凹部，可使表面保護薄膜在凹部附近產生浮凸。結果，可提升從凹部剝離去除表面保護薄膜時之剝離性。針對所述切削加工之一例，參照圖8(a)~圖8(c)進行說明。首先，如圖8(a)所示，將要形成圖7之去角部4a之部分進行去角加工，接著如圖8(b)所示，將要形成去角部4b之部分進行去角加工。最後，如圖8(c)所示，切削形成凹部(包含曲線部之凹部)4c。曲線部的半徑宜為5mm以下，且宜為4mm以下，更宜為3mm以下。另外，去角部4a及4b以及凹部4c的形成順序(切削順序)無限定，該等可以任意適當之順序形成。In one embodiment, the manufacturing method of the present invention includes: non-linear cutting of the outer peripheral surface of the workpiece. The non-linear cutting includes, for example, as shown in FIG. 7 , forming a recessed portion 4 c including a curved portion when the adhesive layer optical laminate is viewed from above. To produce an adhesive layer optical laminate with a plan view shape as shown in Figure 7, the outer periphery of the workpiece is linearly cut, and chamfered portions 4a and 4b are formed at two corners of the outer periphery of the workpiece, and then the chamfered portions 4a and 4b are formed. A concave portion (a concave portion including a curved portion) 4c is formed in the center of the outer peripheral surface of the corner portions 4a and 4b. By forming the recessed portion, the surface protection film can be embossed near the recessed portion. As a result, the peelability when peeling and removing the surface protective film from the recessed portion can be improved. An example of the cutting process will be described with reference to Figures 8(a) to 8(c). First, as shown in FIG. 8(a) , the part where the chamfered part 4a of FIG. 7 is to be formed is chamfered, and then as shown in FIG. 8(b) , the part where the chamfered part 4b is to be formed is chamfered. Finally, as shown in FIG. 8(c) , a concave portion (a concave portion including a curved portion) 4c is formed by cutting. The radius of the curved portion is preferably 5 mm or less, more preferably 4 mm or less, and more preferably 3 mm or less. In addition, the formation order (cutting order) of the chamfered portions 4a and 4b and the recessed portion 4c is not limited, and they can be formed in any appropriate order.

切削加工的條件可因應所期望之形狀適當設定。端銑刀的旋轉數宜為1000rpm~60000rpm，且宜為10000rpm~40000rpm。端銑刀的進給速度宜為500mm/分鐘~10000mm/分鐘，更宜為500mm/分鐘~2500mm/分鐘。切削處的切削次數可削1次、削2次、削3次或其以上。The cutting conditions can be appropriately set according to the desired shape. The rotation number of the end mill should be 1000rpm~60000rpm, and the number of rotation should be 10000rpm~40000rpm. The feed speed of the end mill should be 500mm/min~10000mm/min, and more preferably 500mm/min~2500mm/min. The number of cuts at the cutting point can be 1 cut, 2 cuts, 3 cuts or more.

依上述方式，可獲得經切削加工之附黏著劑層光學積層體。藉由本發明製造方法獲得之附黏著劑層光學積層體，其表面保護薄膜之剝離不良經抑制。 實施例In the above manner, an optical laminate with an adhesive layer that has been processed by cutting can be obtained. In the optical laminate with an adhesive layer obtained by the manufacturing method of the present invention, peeling failure of the surface protective film is suppressed. Example

以下，以實施例來具體說明本發明，惟本發明不受該等實施例限定。實施例之評估項目如下。Hereinafter, the present invention will be specifically described with reference to examples, but the present invention is not limited by these examples. The evaluation items of the examples are as follows.

(1)表面保護薄膜之浮凸發生率 準備任意數量(宜為100以上)的切削加工後之附黏著劑層光學積層體，並使用放大鏡或顯微鏡觀察表面保護薄膜之浮凸。觀察每個附黏著劑層光學積層體的全周圍，若觀察到1μm以上的浮凸，該附黏著劑層光學積層體便計為有浮凸試樣，並由「(有浮凸試樣/觀察數量)×100」來算出浮凸產生率。 (2)剝離成功率 隨機抽出50片實施例及比較例所得經切削加工之附黏著劑層光學積層體，並對各片分別進行表面保護薄膜之剝離(起始剝離力2.9N)。以百分率表示在50次剝離之中成功剝離而無問題的次數，以其作為剝離成功率。 (3)浮凸量 以放大鏡或顯微鏡測定實施例及比較例所得經切削加工之附黏著劑層光學積層體中表面保護薄膜之浮凸量。將一工件之浮凸量的最大值作為浮凸量。(1) The incidence of embossment on the surface protection film Prepare any number (preferably more than 100) of optical laminates with adhesive layers after cutting, and use a magnifying glass or microscope to observe the relief of the surface protective film. Observe the entire circumference of each optical laminate with an adhesive layer. If embossments of more than 1 μm are observed, the optical laminate with an adhesive layer will be counted as a embossed sample and shall be determined by "(sample with embossment/ Observation number) × 100" to calculate the embossing production rate. (2) Peeling success rate Fifty pieces of the cut adhesive layer optical laminates obtained in Examples and Comparative Examples were randomly extracted, and the surface protective film was peeled off from each piece (initial peeling force 2.9N). The number of successful peelings without problems among 50 peelings is expressed as a percentage and is used as the peeling success rate. (3) Amount of relief The amount of relief of the surface protective film in the cut adhesive layer optical laminate obtained in Examples and Comparative Examples was measured using a magnifying glass or microscope. The maximum value of the relief amount of a workpiece is regarded as the relief amount.

>實施例1> 依常規方法，製出從視辨側起依序具有表面保護薄膜(60μm)/環烯烴系保護薄膜(47μm)/偏光件(5μm)/環烯烴系保護薄膜(24μm)/黏著劑層(20μm)/分離件之構成的附黏著劑層之偏光板。另外，表面保護薄膜係製作具有PET基材(50μm)/PF黏著劑層(10μm)之構成的表面保護薄膜，並進行驗證。此時，黏著劑層(黏著劑)之儲存彈性模數係調整成0.5MPa~3.0MPa。將依上述方式獲得之附黏著劑層之偏光板沖裁成5.7吋尺寸(長140mm及寬65mm左右)後，疊合多片經沖裁之偏光板製成工件(總厚度約10mm)。在將所得工件以鉗夾(夾具)夾住的狀態下，藉由端銑刀加工於工件之外周的兩個隅部形成去角部，並於形成有去角部的外周面之中央部形成凹部(包含曲線部之凹部)，而獲得如圖7所示之經切削加工之附黏著劑層之偏光板。端銑刀的進給速度為500mm/分鐘~2000mm/分鐘，旋轉數為5000rpm~30000rpm。且，端銑刀係使用右刃右螺旋且螺旋角30°者。該端銑刀之切屑的排出方向為上方。附黏著劑層之偏光板係以使分離件位於上側之方式疊合而形成工件。利用切削所得表面保護薄膜之浮凸發生率為100%。針對所得經切削加工之附黏著劑層之偏光板進行上述(2)及(3)之評估。將結果列於表1。>Example 1> According to the conventional method, a surface protective film (60μm)/cycloolefin-based protective film (47μm)/polarizer (5μm)/cycloolefin-based protective film (24μm)/adhesive layer (20μm) is produced from the viewing side. )/A polarizing plate with an adhesive layer composed of a separable component. In addition, a surface protection film composed of a PET base material (50 μm)/PF adhesive layer (10 μm) was produced and verified. At this time, the storage elastic modulus of the adhesive layer (adhesive) is adjusted to 0.5MPa~3.0MPa. After the polarizing plate with the adhesive layer obtained in the above method is punched into a size of 5.7 inches (about 140mm long and 65mm wide), multiple pieces of the punched polarizing plate are laminated to make a workpiece (total thickness is about 10mm). With the obtained workpiece clamped in a vise (clamp), chamfered portions are formed on two corners of the outer circumference of the workpiece using an end mill, and chamfered portions are formed in the center of the outer circumferential surface where the chamfered portion is formed. The concave portion (the concave portion including the curved portion) is obtained to obtain a polarizing plate with an adhesive layer attached through cutting as shown in Figure 7 . The feed speed of the end mill is 500mm/min~2000mm/min, and the rotation speed is 5000rpm~30000rpm. In addition, the end mill uses a right-edge right-hand helix with a helix angle of 30°. The chip discharge direction of this end mill is upward. The polarizing plates with the adhesive layer are laminated so that the separator is on the upper side to form a workpiece. The embossing rate of the surface protection film obtained by cutting is 100%. The above-mentioned evaluations (2) and (3) were performed on the obtained polarizing plate with an adhesive layer that was processed by cutting. The results are listed in Table 1.

>比較例1> 以使附黏著劑層之偏光板的分離件位於下側之方式疊合而形成工件，除此之外依與實施例1相同方式進行切削加工。將所得經切削加工之附黏著劑層之偏光板供於進行與實施例1相同之評估。將結果列於表1。>Comparative Example 1> The workpiece is formed by stacking the separate parts of the polarizing plate with the adhesive layer on the lower side. Except for this, the cutting process is performed in the same manner as in Example 1. The obtained polarizing plate with the adhesive layer attached thereto was subjected to the same evaluation as in Example 1. The results are listed in Table 1.

>實施例2> 除了使用右刃右螺旋且螺旋角45°之端銑刀外，依與實施例1相同方式進行切削加工。將所得經切削加工之附黏著劑層之偏光板供於進行與實施例1相同之評估。將結果列於表1。>Example 2> Cutting was performed in the same manner as in Example 1 except that a right-edge right-hand helical end mill with a helix angle of 45° was used. The obtained polarizing plate with the adhesive layer attached thereto was subjected to the same evaluation as in Example 1. The results are listed in Table 1.

>比較例2> 以使附黏著劑層之偏光板的分離件位於下側之方式疊合而形成工件，除此之外依與實施例2相同方式進行切削加工。將所得經切削加工之附黏著劑層之偏光板供於進行與實施例1相同之評估。將結果列於表1。>Comparative example 2> The workpiece is formed by stacking the separate parts of the polarizing plate with the adhesive layer on the lower side. Except for this, the cutting process is performed in the same manner as in Example 2. The obtained polarizing plate with the adhesive layer attached thereto was subjected to the same evaluation as in Example 1. The results are listed in Table 1.

[表1] [Table 1]

>評估> 由表1可知，根據本發明之實施例，藉由以使分離件位於端銑刀之切屑排出方向的方式疊合附黏著劑層光學積層體而形成工件，可簡便低價實現表面保護薄膜之剝離不良經抑制的經切削加工之附黏著劑層光學積層體。>Assessment> As can be seen from Table 1, according to the embodiment of the present invention, by laminating the adhesive layer optical laminate to form a workpiece in such a manner that the separator is located in the chip discharge direction of the end mill, the surface protection film can be realized easily and at low cost. An optical laminate with an adhesive layer that has been machined and has suppressed peeling defects.

產業上之可利用性 本發明製造方法可適用於製造需進行切削加工(尤其非直線加工)之附黏著劑層光學積層體。藉由本發明製造方法獲得之附黏著劑層光學積層體可適用於以汽車儀表面板或智慧手錶為代表之異形影像顯示部。industrial availability The manufacturing method of the present invention can be applied to manufacturing optical laminates with adhesive layers that require cutting processing (especially non-linear processing). The adhesive layer optical laminate obtained by the manufacturing method of the present invention can be applied to special-shaped image display parts represented by automobile instrument panels or smart watches.

W:工件 10:光學薄膜 20:黏著劑層 30:分離件 40:表面保護薄膜 41:基材 42:黏著劑層(PF黏著劑層) 60:端銑刀 61:旋轉軸 62:切削刃 62a:刀鋒 62b:前刀面 62c:後刀面 100:附黏著劑層光學積層體 1a,1b,1c,1d:外周面(切削面) θ:螺旋角 4a,4b:去角部 4c:凹部(包含曲線部之凹部)W: workpiece 10: Optical film 20: Adhesive layer 30: Separate parts 40:Surface protection film 41:Substrate 42: Adhesive layer (PF adhesive layer) 60:End mill 61:Rotation axis 62:Cutting edge 62a:Blade 62b:Rake face 62c: flank surface 100: Optical laminate with adhesive layer 1a, 1b, 1c, 1d: outer peripheral surface (cutting surface) θ:Helix angle 4a,4b: Corner removal 4c: Concave part (concave part including curved part)

圖1係說明可用於本發明製造方法之附黏著劑層光學積層體之一例的概略截面圖。 圖2係說明可用於本發明製造方法之端銑刀之構成的代表例的概略圖。 圖3係說明可用於本發明製造方法之端銑刀為右刃時與為左刃時切削方向的不同的概略俯視圖。 圖4(a)係說明本發明之一實施形態的工件之形成方法的重要部分概略前視圖；(b)係說明另一實施形態的工件之形成方法的重要部分概略前視圖。 圖5係用以說明本發明製造方法中之切削加工的概略立體圖。 圖6係用以說明本發明製造方法中切削加工所用端銑刀之結構的概略圖。 圖7係顯示可利用本發明製造方法獲得之經切削加工之附黏著劑層光學積層體之形狀一例的概略俯視圖。 圖8(a)~(c)係說明本發明製造方法中切削加工之一連串程序的概略俯視圖。FIG. 1 is a schematic cross-sectional view illustrating an example of an optical laminate with an adhesive layer that can be used in the manufacturing method of the present invention. FIG. 2 is a schematic diagram illustrating a representative example of the structure of an end mill that can be used in the manufacturing method of the present invention. 3 is a schematic plan view illustrating the difference in cutting direction between when the end mill that can be used in the manufacturing method of the present invention has a right-edge edge and when it has a left-edge edge. 4(a) is a schematic front view of important parts illustrating a method of forming a workpiece according to one embodiment of the present invention; (b) is a schematic front view of important parts illustrating a method of forming a workpiece according to another embodiment of the present invention. FIG. 5 is a schematic perspective view for explaining the cutting process in the manufacturing method of the present invention. FIG. 6 is a schematic diagram illustrating the structure of an end mill used for cutting in the manufacturing method of the present invention. 7 is a schematic plan view showing an example of the shape of a cut adhesive layer optical laminate that can be obtained by the manufacturing method of the present invention. 8(a) to (c) are schematic top views illustrating a series of cutting processes in the manufacturing method of the present invention.

W:工件 W: workpiece

10:光學薄膜 10: Optical film

20:黏著劑層 20: Adhesive layer

30:分離件 30: Separate parts

40:表面保護薄膜 40:Surface protection film

100:附黏著劑層光學積層體 100: Optical laminate with adhesive layer

Claims (12)

一種經切削加工之附黏著劑層光學積層體的製造方法，包含：將多片附黏著劑層光學積層體疊合而形成工件；及，使用具有螺旋刃之端銑刀來切削該工件之外周面；該附黏著劑層光學積層體包含光學薄膜、黏著劑層、分離件及表面保護薄膜，該黏著劑層配置於該光學薄膜之一側，該分離件係以可剝離之狀態暫時黏著於該黏著劑層，而該表面保護薄膜係以可剝離之狀態暫時黏著於該光學薄膜之另一側；並且該製造方法係以使該分離件位於該端銑刀之切屑排出方向的方式疊合該附黏著劑層光學積層體而形成該工件；且其藉由前述切削使前述表面保護薄膜產生浮凸。 A method of manufacturing an optical laminate with an adhesive layer that has been processed by cutting, including: stacking multiple optical laminates with an adhesive layer to form a workpiece; and using an end mill with a spiral blade to cut the outer periphery of the workpiece. surface; the adhesive layer-attached optical laminate includes an optical film, an adhesive layer, a separator and a surface protection film. The adhesive layer is disposed on one side of the optical film. The separator is temporarily adhered to the surface in a peelable state. The adhesive layer, and the surface protection film is temporarily adhered to the other side of the optical film in a peelable state; and the manufacturing method is such that the separation member is positioned in the chip discharge direction of the end mill. The adhesive layer optical laminate forms the workpiece; and the surface protection film is embossed through the cutting. 如請求項1的製造方法，其中前述端銑刀為右刃右螺旋或左刃左螺旋；並且該製造方法係以使前述分離件位於上側之方式疊合前述附黏著劑層光學積層體，而形成工件。 The manufacturing method of claim 1, wherein the end mill is a right-edge right-edge helical or a left-edge left-edge helical; and the manufacturing method is to stack the adhesive layer optical laminate in such a manner that the separation member is located on the upper side, and form an artifact. 如請求項1的製造方法，其中前述端銑刀為右刃左螺旋或左刃右螺旋；並且該製造方法係以使前述分離件位於下側之方式疊合前述附黏著劑層光學積層體，而形成工件。 The manufacturing method of claim 1, wherein the end mill is a right-edge left-hand spiral or a left-edge right-edge spiral; and the manufacturing method is to stack the adhesive layer optical laminate in such a manner that the separation member is located on the lower side, And form the workpiece. 如請求項1至3中任一項的製造方法，其中前述分離件與前述黏著劑層之剝離力較前述光學薄膜與前述表面保護薄膜之剝離力更小。 The manufacturing method according to any one of claims 1 to 3, wherein the peeling force between the separator and the adhesive layer is smaller than the peeling force between the optical film and the surface protection film. 如請求項4的製造方法，其中前述分離件與前述黏著劑層之剝離力為0.001N/10mm~1.0N/10mm，前述光學薄膜與前述表面保護薄膜之剝離力為0.01N/10mm~5.0N/10mm。 Such as the manufacturing method of claim 4, wherein the peeling force of the aforementioned separator and the aforementioned adhesive layer is 0.001N/10mm~1.0N/10mm, and the peeling force of the aforementioned optical film and the aforementioned surface protection film is 0.01N/10mm~5.0N /10mm. 如請求項1至3中任一項的製造方法，其中前述表面保護薄膜之厚度較前述分離件之厚度更大。 The manufacturing method of any one of claims 1 to 3, wherein the thickness of the surface protection film is greater than the thickness of the separation member. 如請求項1至3中任一項的製造方法，其中前述表面保護薄膜具有基材與黏著劑層，且該黏著劑層在25℃下之儲存彈性模數G’為0.5×106(Pa)~3.0×106(Pa)。 The manufacturing method of any one of claims 1 to 3, wherein the aforementioned surface protection film has a base material and an adhesive layer, and the storage elastic modulus G' of the adhesive layer at 25°C is 0.5×10 6 (Pa )~3.0×10 6 (Pa). 如請求項1至3中任一項的製造方法，其中前述表面保護薄膜之浮凸量為1μm~1000μm。 The manufacturing method of any one of claims 1 to 3, wherein the embossment amount of the surface protection film is 1 μm ~ 1000 μm. 如請求項1至3中任一項的製造方法，其包含：將前述工件之外周面進行非直線切削。 The manufacturing method of any one of claims 1 to 3, which includes: non-linear cutting of the outer peripheral surface of the workpiece. 如請求項9的製造方法，其中前述非直線切削包含：形成在俯視前述附黏著劑層光學積層體時包含曲線部之凹部。 The manufacturing method of claim 9, wherein the non-linear cutting includes forming a recessed portion including a curved portion when the adhesive layer optical laminate is viewed from above. 如請求項10的製造方法，其中前述曲線部的半徑在5mm以下。 The manufacturing method of claim 10, wherein the radius of the aforementioned curved portion is less than 5 mm. 如請求項1至3中任一項的製造方法，其中前述光學薄膜為偏光件或偏光板。 The manufacturing method according to any one of claims 1 to 3, wherein the aforementioned optical film is a polarizer or a polarizing plate.
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