TWI833693B - Polishing pad, manufacturing method of polishing pad, method of polishing the surface of optical material or semiconductor material, and method of reducing scratches when polishing the surface of optical material or semiconductor material - Google Patents
Polishing pad, manufacturing method of polishing pad, method of polishing the surface of optical material or semiconductor material, and method of reducing scratches when polishing the surface of optical material or semiconductor material Download PDFInfo
- Publication number
- TWI833693B TWI833693B TW107111097A TW107111097A TWI833693B TW I833693 B TWI833693 B TW I833693B TW 107111097 A TW107111097 A TW 107111097A TW 107111097 A TW107111097 A TW 107111097A TW I833693 B TWI833693 B TW I833693B
- Authority
- TW
- Taiwan
- Prior art keywords
- toluene diisocyanate
- polishing
- polishing pad
- component
- weight ratio
- Prior art date
Links
- 238000005498 polishing Methods 0.000 title claims abstract description 106
- 239000000463 material Substances 0.000 title claims description 28
- 239000004065 semiconductor Substances 0.000 title claims description 13
- 238000000034 method Methods 0.000 title claims description 10
- 230000003287 optical effect Effects 0.000 title claims description 9
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 238000007517 polishing process Methods 0.000 title claims 3
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 claims abstract description 55
- 229920001228 polyisocyanate Polymers 0.000 claims abstract description 26
- 239000005056 polyisocyanate Substances 0.000 claims abstract description 26
- 229920005749 polyurethane resin Polymers 0.000 claims abstract description 26
- RUELTTOHQODFPA-UHFFFAOYSA-N toluene 2,6-diisocyanate Chemical compound CC1=C(N=C=O)C=CC=C1N=C=O RUELTTOHQODFPA-UHFFFAOYSA-N 0.000 claims abstract description 25
- 239000000203 mixture Substances 0.000 claims abstract description 23
- 150000001875 compounds Chemical class 0.000 claims abstract description 13
- 239000004848 polyfunctional curative Substances 0.000 claims abstract description 12
- 238000005299 abrasion Methods 0.000 claims description 12
- 229920005862 polyol Polymers 0.000 claims description 9
- 150000003077 polyols Chemical class 0.000 claims description 9
- IBOFVQJTBBUKMU-UHFFFAOYSA-N 4,4'-methylene-bis-(2-chloroaniline) Chemical compound C1=C(Cl)C(N)=CC=C1CC1=CC=C(N)C(Cl)=C1 IBOFVQJTBBUKMU-UHFFFAOYSA-N 0.000 claims description 8
- 238000012360 testing method Methods 0.000 claims description 8
- 238000005259 measurement Methods 0.000 claims description 3
- 238000010998 test method Methods 0.000 claims description 3
- ANJPRQPHZGHVQB-UHFFFAOYSA-N hexyl isocyanate Chemical compound CCCCCCN=C=O ANJPRQPHZGHVQB-UHFFFAOYSA-N 0.000 claims 1
- 239000012948 isocyanate Substances 0.000 abstract description 6
- -1 isocyanate compound Chemical class 0.000 abstract description 3
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 description 40
- 239000010410 layer Substances 0.000 description 24
- 230000000052 comparative effect Effects 0.000 description 11
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 8
- 239000003795 chemical substances by application Substances 0.000 description 6
- KORSJDCBLAPZEQ-UHFFFAOYSA-N dicyclohexylmethane-4,4'-diisocyanate Chemical compound C1CC(N=C=O)CCC1CC1CCC(N=C=O)CC1 KORSJDCBLAPZEQ-UHFFFAOYSA-N 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 150000004985 diamines Chemical class 0.000 description 5
- 239000006260 foam Substances 0.000 description 5
- 241001112258 Moca Species 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- 150000002513 isocyanates Chemical class 0.000 description 4
- 229920000642 polymer Polymers 0.000 description 4
- 239000000758 substrate Substances 0.000 description 4
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 3
- 238000009825 accumulation Methods 0.000 description 3
- 239000003054 catalyst Substances 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 239000012530 fluid Substances 0.000 description 3
- 239000004088 foaming agent Substances 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 239000000376 reactant Substances 0.000 description 3
- 235000012431 wafers Nutrition 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- 239000004215 Carbon black (E152) Substances 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- OFBQJSOFQDEBGM-UHFFFAOYSA-N Pentane Chemical compound CCCCC OFBQJSOFQDEBGM-UHFFFAOYSA-N 0.000 description 2
- 229920005830 Polyurethane Foam Polymers 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 238000009835 boiling Methods 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- KQWGXHWJMSMDJJ-UHFFFAOYSA-N cyclohexyl isocyanate Chemical compound O=C=NC1CCCCC1 KQWGXHWJMSMDJJ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 125000005442 diisocyanate group Chemical group 0.000 description 2
- 238000005187 foaming Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 150000002334 glycols Chemical class 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 229930195733 hydrocarbon Natural products 0.000 description 2
- 150000002430 hydrocarbons Chemical class 0.000 description 2
- NNPPMTNAJDCUHE-UHFFFAOYSA-N isobutane Chemical compound CC(C)C NNPPMTNAJDCUHE-UHFFFAOYSA-N 0.000 description 2
- IQPQWNKOIGAROB-UHFFFAOYSA-N isocyanate group Chemical group [N-]=C=O IQPQWNKOIGAROB-UHFFFAOYSA-N 0.000 description 2
- QWTDNUCVQCZILF-UHFFFAOYSA-N isopentane Chemical compound CCC(C)C QWTDNUCVQCZILF-UHFFFAOYSA-N 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 125000000325 methylidene group Chemical group [H]C([H])=* 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920000768 polyamine Polymers 0.000 description 2
- 229920005906 polyester polyol Polymers 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 239000011496 polyurethane foam Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 229920005992 thermoplastic resin Polymers 0.000 description 2
- DNIAPMSPPWPWGF-VKHMYHEASA-N (+)-propylene glycol Chemical compound C[C@H](O)CO DNIAPMSPPWPWGF-VKHMYHEASA-N 0.000 description 1
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- WOGVOIWHWZWYOZ-UHFFFAOYSA-N 1,1-diisocyanatoethane Chemical compound O=C=NC(C)N=C=O WOGVOIWHWZWYOZ-UHFFFAOYSA-N 0.000 description 1
- IKYNWXNXXHWHLL-UHFFFAOYSA-N 1,3-diisocyanatopropane Chemical compound O=C=NCCCN=C=O IKYNWXNXXHWHLL-UHFFFAOYSA-N 0.000 description 1
- YPFDHNVEDLHUCE-UHFFFAOYSA-N 1,3-propanediol Substances OCCCO YPFDHNVEDLHUCE-UHFFFAOYSA-N 0.000 description 1
- ALQLPWJFHRMHIU-UHFFFAOYSA-N 1,4-diisocyanatobenzene Chemical compound O=C=NC1=CC=C(N=C=O)C=C1 ALQLPWJFHRMHIU-UHFFFAOYSA-N 0.000 description 1
- SIZPGZFVROGOIR-UHFFFAOYSA-N 1,4-diisocyanatonaphthalene Chemical compound C1=CC=C2C(N=C=O)=CC=C(N=C=O)C2=C1 SIZPGZFVROGOIR-UHFFFAOYSA-N 0.000 description 1
- CWKVFRNCODQPDB-UHFFFAOYSA-N 1-(2-aminoethylamino)propan-2-ol Chemical compound CC(O)CNCCN CWKVFRNCODQPDB-UHFFFAOYSA-N 0.000 description 1
- DTZHXCBUWSTOPO-UHFFFAOYSA-N 1-isocyanato-4-[(4-isocyanato-3-methylphenyl)methyl]-2-methylbenzene Chemical compound C1=C(N=C=O)C(C)=CC(CC=2C=C(C)C(N=C=O)=CC=2)=C1 DTZHXCBUWSTOPO-UHFFFAOYSA-N 0.000 description 1
- QLSQYTKEUVPIJA-UHFFFAOYSA-N 2-(1-aminopropan-2-ylamino)ethanol Chemical compound NCC(C)NCCO QLSQYTKEUVPIJA-UHFFFAOYSA-N 0.000 description 1
- RNLHGQLZWXBQNY-UHFFFAOYSA-N 3-(aminomethyl)-3,5,5-trimethylcyclohexan-1-amine Chemical compound CC1(C)CC(N)CC(C)(CN)C1 RNLHGQLZWXBQNY-UHFFFAOYSA-N 0.000 description 1
- SXFJDZNJHVPHPH-UHFFFAOYSA-N 3-methylpentane-1,5-diol Chemical compound OCCC(C)CCO SXFJDZNJHVPHPH-UHFFFAOYSA-N 0.000 description 1
- 239000004970 Chain extender Substances 0.000 description 1
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229920000103 Expandable microsphere Polymers 0.000 description 1
- 239000005057 Hexamethylene diisocyanate Substances 0.000 description 1
- SPTUBPSDCZNVSI-UHFFFAOYSA-N N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC Chemical compound N=C=O.N=C=O.COC1=CC=CC=C1C1=CC=CC=C1OC SPTUBPSDCZNVSI-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 125000005263 alkylenediamine group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- LHIJANUOQQMGNT-UHFFFAOYSA-N aminoethylethanolamine Chemical compound NCCNCCO LHIJANUOQQMGNT-UHFFFAOYSA-N 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 230000006399 behavior Effects 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 230000002925 chemical effect Effects 0.000 description 1
- KRGNPJFAKZHQPS-UHFFFAOYSA-N chloroethene;ethene Chemical group C=C.ClC=C KRGNPJFAKZHQPS-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- AFABGHUZZDYHJO-UHFFFAOYSA-N dimethyl butane Natural products CCCC(C)C AFABGHUZZDYHJO-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 229920001038 ethylene copolymer Polymers 0.000 description 1
- 235000019589 hardness Nutrition 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- RRAMGCGOFNQTLD-UHFFFAOYSA-N hexamethylene diisocyanate Chemical compound O=C=NCCCCCCN=C=O RRAMGCGOFNQTLD-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000004615 ingredient Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000001282 iso-butane Substances 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- DNIAPMSPPWPWGF-UHFFFAOYSA-N monopropylene glycol Natural products CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- UWJJYHHHVWZFEP-UHFFFAOYSA-N pentane-1,1-diol Chemical compound CCCCC(O)O UWJJYHHHVWZFEP-UHFFFAOYSA-N 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920001610 polycaprolactone Polymers 0.000 description 1
- 239000004632 polycaprolactone Substances 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920001451 polypropylene glycol Polymers 0.000 description 1
- 229920000166 polytrimethylene carbonate Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000013772 propylene glycol Nutrition 0.000 description 1
- AOHJOMMDDJHIJH-UHFFFAOYSA-N propylenediamine Chemical compound CC(N)CN AOHJOMMDDJHIJH-UHFFFAOYSA-N 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Polyurethanes Or Polyureas (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
Abstract
本發明提供一種修整性優異之研磨墊。 The present invention provides a polishing pad excellent in dressability.
本發明之上述研磨墊係具有包含聚胺基甲酸酯樹脂之研磨層者，上述研磨層使包含聚異氰酸酯化合物及硬化劑之聚胺基甲酸酯樹脂硬化性組合物硬化而形成，上述聚異氰酸酯化合物包含甲苯二異氰酸酯，上述甲苯二異氰酸酯中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為81：19~99：1。 The above-mentioned polishing pad of the present invention has a polishing layer containing a polyurethane resin. The above-mentioned polishing layer is formed by curing a polyurethane resin curable composition containing a polyisocyanate compound and a hardener. The above-mentioned polyurethane resin The isocyanate compound includes toluene diisocyanate, and the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the toluene diisocyanate is 81:19~99:1.
Description
本發明係關於一種用於進行光學材料、半導體晶圓、硬碟基板、液晶用玻璃基板、半導體元件等要求高度之表面平坦性之材料之研磨的研磨片及研磨墊。本發明特別適合用於研磨半導體晶圓之上形成氧化物層、金屬層等之元件。 The present invention relates to a polishing sheet and a polishing pad used for polishing materials requiring a high degree of surface flatness, such as optical materials, semiconductor wafers, hard disk substrates, liquid crystal glass substrates, and semiconductor elements. The present invention is particularly suitable for grinding components forming oxide layers, metal layers, etc. on semiconductor wafers.
光學材料、半導體晶圓、硬碟基板、液晶用玻璃基板、半導體元件要求非常精密之平坦性。又，半導體材料之表面露出金屬、有機及無機之絕緣材料等各種不同硬度之材料。為了平坦地研磨此類材料之表面，研磨墊之表面亦需要維持均勻之剛性。於研磨墊之表面之剛性於研磨作業之間變化之情形時，無法達到所需之平坦性。 Optical materials, semiconductor wafers, hard disk substrates, liquid crystal glass substrates, and semiconductor elements require extremely precise flatness. In addition, the surface of the semiconductor material exposes materials with various hardnesses such as metal, organic and inorganic insulating materials. In order to flatly polish the surface of such materials, the surface of the polishing pad also needs to maintain uniform rigidity. In situations where the rigidity of the surface of the polishing pad changes between polishing operations, the required flatness cannot be achieved.
例如，於自開始研磨至交換研磨墊及研磨液之1次研磨作業之終期，產生相當之研磨屑。由於因研磨屑之堆積而堵塞於開口部，漿料之保持惡化，產生摩擦熱，故而於1次研磨作業之間，所研磨之材料之表面之溫度自初期上升至終期，於包含20℃~70℃之較寬溫度範圍變化。又，使用於化學機械研磨之研磨液隨著溫度上升，化學作用(非研磨物之表面之腐蝕)變強。故而，藉由被研磨物或研磨液之溫度變化，藉由剛性局部降低之研磨墊之表面，無法達到精密之平坦性，又，成為容易發生僅優先研磨金屬部分之現象(凹陷)等之傾向。 For example, at the end of a polishing operation from the beginning of polishing to the exchange of polishing pads and polishing fluids, considerable polishing debris is generated. Since the openings are clogged due to the accumulation of grinding debris, the retention of the slurry deteriorates, and frictional heat is generated. Therefore, between one grinding operation, the temperature of the surface of the material being ground rises from the initial stage to the final stage, including 20°C~ A wide temperature range of 70°C. In addition, as the temperature of the polishing fluid used in chemical mechanical polishing increases, the chemical effect (corrosion of the surface of the non-abrasive object) becomes stronger. Therefore, due to the temperature change of the object to be polished or the polishing fluid, the surface of the polishing pad whose rigidity is partially reduced cannot achieve precise flatness, and a phenomenon (denting) in which only the metal portion is polished preferentially tends to easily occur. .
又，研磨屑之堆積通常藉由使用修整器粗糙化(研磨)研磨墊之表面而 消除。若該研磨所需要之時間花費過長，即若修整速度較低，則研磨效率變差。 In addition, the accumulation of grinding debris is usually caused by using a dresser to roughen (grind) the surface of the grinding pad. eliminate. If the time required for this grinding takes too long, that is, if the dressing speed is low, the grinding efficiency becomes poor.
較多之硬質研磨墊藉由使用作為多元醇成分與異氰酸酯成分之反應物之胺基甲酸酯預聚物，使添加混合二胺類或二醇類等硬化劑(鏈延長劑)、發泡劑、觸媒等所獲得之聚胺基甲酸酯組合物硬化之預聚物法而製造。於預聚物法中，作為構成胺基甲酸酯預聚物之異氰酸酯成分，較佳使用芳香族二異氰酸酯，其中最佳使用甲苯二異氰酸酯。 Many hard polishing pads use urethane prepolymers that are reactants of polyol components and isocyanate components, and add and mix hardeners (chain extenders) such as diamines or glycols, and foaming. It is manufactured by the prepolymer method of hardening the polyurethane composition obtained by using agents, catalysts, etc. In the prepolymer method, aromatic diisocyanate is preferably used as the isocyanate component constituting the urethane prepolymer, and among them, toluene diisocyanate is most preferably used.
於專利文獻1中，揭示有：藉由使異氰酸酯末端胺基甲酸酯預聚物含有不同粒子大小之2種微小中空球狀體，研磨特性提高，獲得研磨特性之差異較小之研磨墊，揭示有：使用2,4-甲苯二異氰酸酯、2,6-甲苯二異氰酸酯、4,4'-二苯基甲烷二異氰酸酯等作為異氰酸酯末端胺基甲酸酯預聚物之異氰酸酯成分。 Patent Document 1 discloses that by making an isocyanate-terminated urethane prepolymer contain two types of fine hollow spheres with different particle sizes, the polishing properties are improved and a polishing pad with a small difference in polishing properties is obtained. It is disclosed that 2,4-toluene diisocyanate, 2,6-toluene diisocyanate, 4,4'-diphenylmethane diisocyanate, etc. are used as the isocyanate component of the isocyanate-terminated urethane prepolymer.
又，於專利文獻2中，揭示有：於含有聚酯多元醇類、聚異氰酸酯類、發泡劑及觸媒之聚胺基甲酸酯發泡體中，藉由將聚異氰酸酯類中之2,4-甲苯二異氰酸酯之含量設為65~75質量%，而獲得低密度下拉伸強度、伸長率等機械物性優異之聚酯系聚胺基甲酸酯發泡體。 Furthermore, Patent Document 2 discloses that in a polyurethane foam containing polyester polyols, polyisocyanates, a foaming agent and a catalyst, two of the polyisocyanates are used. , the content of 4-toluene diisocyanate is set to 65 to 75% by mass, and a polyester-based polyurethane foam with excellent mechanical properties such as tensile strength and elongation at low density is obtained.
[專利文獻1]日本專利特開2000-344902號公報 [Patent Document 1] Japanese Patent Application Laid-Open No. 2000-344902
[專利文獻2]日本專利特開2008-156518號公報 [Patent Document 2] Japanese Patent Application Laid-Open No. 2008-156518
作為當前市售之甲苯二異氰酸酯之製品，存在2,4-甲苯二異氰酸酯為 100%者、2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之比率為80：20者、2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之比率為65：35者，若為使用該等市售之甲苯二異氰酸酯製造之研磨墊，則存在由於修整性不充分故而不表示特定之研磨性能之問題方面。 As a product of toluene diisocyanate currently on the market, there is 2,4-toluene diisocyanate. 100%, the ratio of 2,4-toluene diisocyanate to 2,6-toluene diisocyanate is 80:20, the ratio of 2,4-toluene diisocyanate to 2,6-toluene diisocyanate is 65:35, If a polishing pad made of these commercially available toluene diisocyanates is used, there is a problem that it does not show specific polishing performance due to insufficient dressability.
本發明者等人為了解決該課題，而應該提高研磨墊之修整性，對構成胺基甲酸酯預聚物之異氰酸酯成分進行銳意研究。 In order to solve this problem, the present inventors conducted intensive research on the isocyanate component constituting the urethane prepolymer in order to improve the dressability of the polishing pad.
即，本發明提供以下者。 That is, the present invention provides the following.
[1] [1]
一種上述研磨墊，其係具有包含聚胺基甲酸酯樹脂之研磨層者，上述研磨層使包含聚異氰酸酯化合物及硬化劑之聚胺基甲酸酯樹脂硬化性組合物硬化而形成，上述聚異氰酸酯化合物包含甲苯二異氰酸酯，上述甲苯二異氰酸酯中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為81：19~99：1。 The above-mentioned polishing pad has a polishing layer containing a polyurethane resin, the above-mentioned polishing layer is formed by curing a polyurethane resin curable composition containing a polyisocyanate compound and a hardener, and the above-mentioned polyurethane resin The isocyanate compound includes toluene diisocyanate, and the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the toluene diisocyanate is 81:19~99:1.
[2] [2]
如[1]之研磨墊，其中上述聚異氰酸酯化合物係藉由聚異氰酸酯成分與多元醇成分之反應所獲得之預聚物。 The polishing pad of [1], wherein the polyisocyanate compound is a prepolymer obtained by the reaction of a polyisocyanate component and a polyol component.
[3] [3]
如[1]或[2]之研磨墊，其中上述硬化劑包含3,3'-二氯-4,4'-二胺基二苯基甲烷。 The polishing pad of [1] or [2], wherein the hardener includes 3,3'-dichloro-4,4'-diaminodiphenylmethane.
[4] [4]
如[1]至[3]中任一項之研磨墊，上述聚胺基甲酸酯樹脂硬化性組合物 進而包含微小中空球體。 The polishing pad according to any one of [1] to [3], the above-mentioned polyurethane resin curable composition This in turn contains tiny hollow spheres.
[5] [5]
如[1]至[4]中任一項之研磨墊，上述研磨層由連續1000次之Taber磨耗試驗所得之磨耗質量為99mg以上。 For the polishing pad according to any one of [1] to [4], the abrasion mass of the above-mentioned polishing layer obtained from 1000 consecutive Taber abrasion tests is 99 mg or more.
[6] [6]
一種上述方法，其係如[1]至[5]中任一項之研磨墊之製造方法，其包含成形上述研磨層之步驟。 The above-mentioned method is a method for manufacturing a polishing pad according to any one of [1] to [5], which includes the step of forming the above-mentioned polishing layer.
[7] [7]
一種上述方法，其特徵在於：其係研磨光學材料或半導體材料之表面者，使用如[1]至[5]中任一項之研磨墊。 An above-mentioned method, characterized in that: it polishes the surface of an optical material or a semiconductor material, using a polishing pad according to any one of [1] to [5].
[8] [8]
一種方法，其使用如[1]至[5]中任一項之研磨墊減少研磨光學材料或半導體材料之表面之際之刮痕。 A method that uses the polishing pad according to any one of [1] to [5] to reduce scratches when polishing the surface of optical materials or semiconductor materials.
根據本發明，能夠獲得修整性優異之研磨墊。 According to the present invention, a polishing pad excellent in dressability can be obtained.
圖1係表示實施例1~8及比較例1及2之拉伸強度(kg/mm2)之圖表。 Figure 1 is a graph showing the tensile strength (kg/mm 2 ) of Examples 1 to 8 and Comparative Examples 1 and 2.
圖2係表示實施例1~8及比較例1及2之撕裂強度(kg/mm2)之圖表。 FIG. 2 is a graph showing the tear strength (kg/mm 2 ) of Examples 1 to 8 and Comparative Examples 1 and 2.
圖3係表示實施例1~8及比較例1及2之Taber磨耗量(mg)之圖表。 FIG. 3 is a graph showing the Taber abrasion amount (mg) of Examples 1 to 8 and Comparative Examples 1 and 2.
(作用) (effect)
於本發明中，使用2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為81：19~99：1之甲苯二異氰酸酯作為含於聚胺基甲酸酯樹脂硬化性 組合物之聚異氰酸酯化合物。 In the present invention, the weight ratio of 2,4-toluene diisocyanate to 2,6-toluene diisocyanate is 81:19~99:1 as the hardening agent contained in the polyurethane resin. Polyisocyanate compound of the composition.
本發明者等人意料之外發現：藉由將分子內2個異氰酸酯基具有不同反應性之2,4-甲苯二異氰酸酯與分子對稱性較高之2,6-甲苯二異氰酸酯設為特定之重量比，而一面維持於能夠容許拉伸強度等力學性質之範圍，一面獲得Taber磨耗量較高，修整性優異之研磨墊。 The inventors unexpectedly discovered that by setting 2,4-toluene diisocyanate, which has two isocyanate groups in the molecule with different reactivities, and 2,6-toluene diisocyanate, which has a higher molecular symmetry, to a specific weight ratio, while maintaining the mechanical properties such as tensile strength within the range that allows, while obtaining a polishing pad with high Taber wear and excellent dressability.
(甲苯二異氰酸酯) (toluene diisocyanate)
於本發明中，聚胺基甲酸酯樹脂硬化性組合物中包含甲苯二異氰酸酯，作為甲苯二異氰酸酯中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比，較佳為81：19~99：1，更佳為83：17~97：3，特佳為85：15~95：5。 In the present invention, the polyurethane resin curable composition contains toluene diisocyanate. As the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the toluene diisocyanate, it is preferably 81:19~99:1, the best is 83:17~97:3, the best is 85:15~95:5.
(研磨墊) (polishing pad)
本發明之研磨墊具有包含發泡聚胺基甲酸酯樹脂之研磨層。研磨層配置於直接相接於被研磨材料之位置，研磨墊之其他部分亦可包含用於支持研磨墊之材料，例如，橡膠等富有彈性之材料。根據研磨墊之剛性，能夠將全體研磨墊製成1個研磨層。 The polishing pad of the present invention has a polishing layer containing foamed polyurethane resin. The polishing layer is disposed directly in contact with the material to be polished. Other parts of the polishing pad may also include materials used to support the polishing pad, such as elastic materials such as rubber. Depending on the rigidity of the polishing pad, the entire polishing pad can be made into one polishing layer.
本發明之研磨墊若除了研磨屑之堆積時被研磨材料難以產生刮痕等缺陷，則形狀與一般的研磨墊沒有較大差異，能夠與一般的研磨墊相同地使用，例如，亦能夠一面使研磨墊旋轉，一面將研磨層壓抵於被研磨材料進行研磨，並且亦能夠一面使被研磨材料旋轉，一面壓抵於研磨層進行研磨。 If the polishing pad of the present invention is difficult to produce defects such as scratches on the material to be polished except for the accumulation of polishing chips, the shape of the polishing pad is not significantly different from that of a general polishing pad, and it can be used in the same way as a general polishing pad. For example, it can also be used while being polished. The polishing pad rotates while pressing the polishing layer against the material to be polished for polishing, and the material to be polished can also be pressed against the polishing layer for polishing while rotating.
(研磨墊之製造方法) (Manufacturing method of polishing pad)
本發明之研磨墊能夠藉由通常所知之模鑄成形、板狀成形等製造法而製作。首先，藉由該等製造法形成聚胺基甲酸酯之塊體，藉由將塊體藉 由切片等製成片狀，成形自聚胺基甲酸酯樹脂形成之研磨層，貼合於支持體等而製造。或亦能夠於支持體上直接成形研磨層。 The polishing pad of the present invention can be produced by commonly known manufacturing methods such as molding and plate forming. First, a block of polyurethane is formed through these manufacturing methods, and the block is It is produced by making a sheet from a slice, etc., molding it from a polishing layer formed of polyurethane resin, and bonding it to a support, etc. Alternatively, the polishing layer can be directly formed on the support.
更具體而言，研磨層於與研磨層之研磨面相反之面側貼附雙面膠帶，切割成特定形狀，成為本發明之研磨墊。對雙面膠帶並無特別限制，於本技術領域中能夠自公知之雙面膠帶中任意選擇使用。又，本發明之研磨墊亦可為僅包含研磨層之單層構造，亦可包含於與研磨層之研磨面相反之面側貼合了其他層(下層、支持層)之複層。 More specifically, a double-sided tape is attached to the side of the polishing layer opposite to the polishing surface of the polishing layer, and is cut into a specific shape to form the polishing pad of the present invention. There is no particular restriction on the double-sided tape, and any double-sided tape known in the art can be used. Furthermore, the polishing pad of the present invention may have a single-layer structure including only the polishing layer, or may include a multi-layer structure in which other layers (lower layer, support layer) are bonded to the opposite side of the polishing surface of the polishing layer.
研磨層藉由製備包含聚異氰酸酯化合物之聚胺基甲酸酯樹脂硬化性組合物，使上述聚胺基甲酸酯樹脂硬化性組合物硬化而成形。 The polishing layer is formed by preparing a polyurethane resin curable composition containing a polyisocyanate compound and curing the polyurethane resin curable composition.
研磨層包含發泡聚胺基甲酸酯樹脂，發泡能夠使包含微小中空球體之發泡劑分散於聚胺基甲酸酯樹脂中而進行，於該情形時，藉由製備包含聚異氰酸酯化合物、硬化劑及發泡劑之聚胺基甲酸酯樹脂發泡硬化性組合物，使聚胺基甲酸酯樹脂發泡硬化性組合物發泡硬化而成形。 The polishing layer contains foamed polyurethane resin. Foaming can be performed by dispersing a foaming agent containing tiny hollow spheres in the polyurethane resin. In this case, by preparing a polyisocyanate compound containing , a curing agent and a foaming agent for a polyurethane resin foam curable composition. The polyurethane resin foam curable composition is foamed and cured to form.
聚胺基甲酸酯樹脂硬化性組合物亦能夠設為例如混合製備包含聚異氰酸酯化合物之A液與包含除其以外之成分之B液的2液型組合物。包含除其以外之成分之B液亦能夠進一步設為分成複數種液混合3液以上之液而構成之組合物。 The polyurethane resin curable composition may be, for example, a two-pack composition prepared by mixing A liquid containing a polyisocyanate compound and B liquid containing other components. Liquid B containing other components can also be a composition obtained by dividing a plurality of liquids and mixing three or more liquids.
於此處，聚異氰酸酯化合物係指如本領域中常使用之藉由以下之聚異氰酸酯成分與多元醇成分之反應所製備之預聚物。預聚物包含未反應之異氰酸酯基之本領域中通常使用者亦能夠使用於本發明。 Here, the polyisocyanate compound refers to a prepolymer prepared by the following reaction of a polyisocyanate component and a polyol component as commonly used in this field. Prepolymers containing unreacted isocyanate groups can also be used in the present invention by those skilled in the art.
(聚異氰酸酯成分) (polyisocyanate component)
如上所述，於本發明中，能夠使用甲苯二異氰酸酯作為聚異氰酸酯成分，併用除其以外之聚異氰酸酯成分。作為能夠與甲苯二異氰酸酯併用 之聚異氰酸酯成分，可列舉：例如間苯二異氰酸酯、對苯二異氰酸酯、萘-1,4-二異氰酸酯、二苯基甲烷-4,4'-二異氰酸酯(MDI)、4,4'-亞甲基-雙(環己基異氰酸酯)(氫化MDI)、3,3'-二甲氧基-4,4'-聯苯二異氰酸酯、3,3'-二甲基二苯基甲烷-4,4'-二異氰酸酯、苯二甲基-1,4-二異氰酸酯、4,4'-二苯基丙烷二異氰酸酯、三亞甲基二異氰酸酯、六亞甲基二異氰酸酯、伸丙基-1,2-二異氰酸酯、伸丁基-1,2-二異氰酸酯、伸環己基-1,2-二異氰酸酯、伸環己基-1,4-二異氰酸酯、對苯二異氰酸酯、苯二甲基-1,4-二異氰酸酯、次乙基二異氰酸酯等。 As described above, in the present invention, toluene diisocyanate can be used as the polyisocyanate component, and other polyisocyanate components can be used in combination. Can be used together with toluene diisocyanate Examples of polyisocyanate components include: isophenylene diisocyanate, terephthalene diisocyanate, naphthalene-1,4-diisocyanate, diphenylmethane-4,4'-diisocyanate (MDI), 4,4'-phenylene diisocyanate Methyl-bis(cyclohexyl isocyanate) (hydrogenated MDI), 3,3'-dimethoxy-4,4'-biphenyl diisocyanate, 3,3'-dimethyldiphenylmethane-4,4 '-Diisocyanate, xylylene-1,4-diisocyanate, 4,4'-diphenylpropane diisocyanate, trimethylene diisocyanate, hexamethylene diisocyanate, propylene-1,2- Diisocyanate, butylene-1,2-diisocyanate, cyclohexylene-1,2-diisocyanate, cyclohexylene-1,4-diisocyanate, p-phenylene diisocyanate, xylylenedimethyl-1,4- Diisocyanate, ethylidene diisocyanate, etc.
(多元醇成分) (polyol component)
作為多元醇成分，可列舉：例如乙二醇、二乙二醇、三乙二醇、1,2-丙二醇、1,3-丙二醇、1,3-丁二 醇、1,4-丁二醇、新戊二醇、戊二醇、3-甲基-1,5-戊二醇、1,6-己二醇等二醇；聚四亞甲基二醇(PTMG)、聚乙二醇、聚丙二醇等聚醚多元醇；乙二醇與己二酸之反應物或丁二醇與己二酸之反應物等聚酯多元醇；聚碳酸酯多元醇；聚己內酯多元醇；等。 Examples of the polyol component include ethylene glycol, diethylene glycol, triethylene glycol, 1,2-propanediol, 1,3-propanediol, and 1,3-butanediol. alcohol, 1,4-butanediol, neopentyl glycol, pentanediol, 3-methyl-1,5-pentanediol, 1,6-hexanediol and other glycols; polytetramethylene glycol (PTMG), polyethylene glycol, polypropylene glycol and other polyether polyols; polyester polyols such as the reactant of ethylene glycol and adipic acid or the reactant of butanediol and adipic acid; polycarbonate polyol; Polycaprolactone polyol; etc.
(硬化劑) (hardener)
於本發明中，作為硬化劑，例如，能夠例示以下說明之胺系硬化劑。 In the present invention, examples of the curing agent include the amine-based curing agents described below.
作為聚胺，可列舉：例如二胺，其中，可列舉：乙二胺、伸丙基二胺、己二胺等伸烷基二胺；異佛爾酮二胺、二環己基甲烷-4,4'-二胺等具有脂肪族環之二胺；3,3'-二氯-4,4'-二胺基二苯基甲烷(別名：亞甲雙-鄰氯苯胺)(以下，簡稱為MOCA)等具有芳香族環之二胺；2-羥乙基乙二胺、2-羥乙基伸丙基二胺、二-2-羥乙基乙二胺、二-2-羥乙基伸丙基二胺、2-羥丙基乙二胺、二-2-羥丙基乙二胺等具有羥基之二胺、特別是羥烷基伸烷基二胺；等。又，亦能夠使用3官能之三胺化合物、4官能以上之聚胺化合物。 Examples of the polyamine include diamines, including alkylenediamines such as ethylenediamine, propylenediamine, and hexamethylenediamine; isophoronediamine, and dicyclohexylmethane-4, 4'-diamine and other diamines with aliphatic rings; 3,3'-dichloro-4,4'-diaminodiphenylmethane (alias: methylene bis-o-chloroaniline) (hereinafter referred to as MOCA) and other diamines with aromatic rings; 2-hydroxyethylethylenediamine, 2-hydroxyethylpropylenediamine, di-2-hydroxyethylethylenediamine, di-2-hydroxyethylpropylenediamine Diamines, 2-hydroxypropylethylenediamine, di-2-hydroxypropylethylenediamine and other diamines with hydroxyl groups, especially hydroxyalkyl alkylenediamine; etc. In addition, trifunctional triamine compounds and tetrafunctional or higher polyamine compounds can also be used.
特佳之硬化劑為上述MOCA，該MOCA之化學構造如下所述。 A particularly preferred hardener is the above-mentioned MOCA, whose chemical structure is as follows.
(硬化劑之使用量) (Amount of hardener used)
硬化劑整體之量使用與聚異氰酸酯化合物之當量比為0.6~1.2、較佳為0.7~0.9之量。 The equivalent ratio of the entire hardener to the polyisocyanate compound is 0.6 to 1.2, preferably 0.7 to 0.9.
(微小中空球體) (tiny hollow sphere)
能夠藉由將微小中空球體混合於聚胺基甲酸酯樹脂而形成發泡體。微小中空球體係指使包括包含熱塑性樹脂之外殼(聚合物殼)及內包於外殼之低沸點烴的未發泡之熱膨脹性微小球狀體熱膨脹者。作為上述聚合物殼，能夠使用：例如丙烯腈-偏二氯乙烯共聚物、丙烯腈-甲基丙烯酸甲酯共聚物、氯乙烯-乙烯共聚物等熱塑性樹脂。相同地，作為內包於聚合物殼之低沸點烴，能夠使用：例如異丁烷、戊烷、異戊烷、石油醚等。 A foam can be formed by mixing micro hollow spheres with polyurethane resin. The micro hollow sphere system refers to the thermal expansion of unfoamed thermally expandable micro spheres including an outer shell (polymer shell) containing a thermoplastic resin and a low-boiling point hydrocarbon enclosed in the outer shell. As the polymer shell, thermoplastic resins such as acrylonitrile-vinylidene chloride copolymer, acrylonitrile-methyl methacrylate copolymer, and vinyl chloride-ethylene copolymer can be used. Similarly, as the low boiling point hydrocarbon enclosed in the polymer shell, for example, isobutane, pentane, isopentane, petroleum ether, etc. can be used.
(其他成分) (other ingredients)
其外，亦可將本領域中通常使用之觸媒等添加於聚胺基甲酸酯樹脂硬化性組合物。 In addition, catalysts commonly used in this field may also be added to the polyurethane resin curable composition.
又，亦能夠進而將上述聚異氰酸酯成分添加於聚胺基甲酸酯樹脂硬化性組合物，相對於胺基甲酸酯預聚物與聚異氰酸酯成分之合計重量之聚異氰酸酯成分之重量比率較佳為0.1~10重量%，更佳為0.5~8重量%，特佳為1~5重量%。 Moreover, the above-mentioned polyisocyanate component can also be added to the polyurethane resin curable composition, and the weight ratio of the polyisocyanate component relative to the total weight of the urethane prepolymer and the polyisocyanate component is preferable. It is 0.1~10% by weight, more preferably 0.5~8% by weight, particularly preferably 1~5% by weight.
作為進而添加於聚胺基甲酸酯樹脂硬化性組合物之聚異氰酸酯成分，能夠不特別限定地使用上述聚異氰酸酯成分，較佳為4,4'-亞甲基-雙(環己基異氰酸酯)(氫化MDI)。 As the polyisocyanate component further added to the polyurethane resin curable composition, the above-mentioned polyisocyanate component can be used without particular limitation, and 4,4'-methylene-bis(cyclohexyl isocyanate) ( Hydrogenated MDI).
(修整性) (modification)
本發明之研磨墊中之研磨層由連續1000次之Taber磨耗試驗所得之磨耗質量較佳為99mg以上，更佳為120mg以上。若由連續1000次之Taber 磨耗試驗所得之磨耗質量之值小於99mg，則研磨墊之修整性不足，修整時間增多，研磨效率降低。 The abrasion quality of the polishing layer in the polishing pad of the present invention obtained from 1000 consecutive Taber abrasion tests is preferably 99 mg or more, and more preferably 120 mg or more. If you use Taber 1000 times in a row If the wear mass value obtained in the wear test is less than 99 mg, the dressing ability of the polishing pad is insufficient, the dressing time increases, and the grinding efficiency decreases.
(拉伸強度、撕裂強度) (tensile strength, tear strength)
使本發明之聚胺基甲酸酯樹脂硬化性組合物硬化所形成之試驗片之拉伸強度(kg/mm2)較佳為1.3~2.3(kg/mm2)，更佳為1.4~2.2(kg/mm2)，特佳為1.5~2.1(kg/mm2)。 The tensile strength (kg/mm 2 ) of the test piece formed by hardening the polyurethane resin curable composition of the present invention is preferably 1.3 to 2.3 (kg/mm 2 ), more preferably 1.4 to 2.2 (kg/mm 2 ), the best value is 1.5~2.1 (kg/mm 2 ).
又，上述試驗片之撕裂強度(kg/mm2)較佳為1.0~2.2(kg/mm2)，更佳為1.1~2.1(kg/mm2)，特佳為1.2~2.0(kg/mm2)。 In addition, the tear strength (kg/mm 2 ) of the above-mentioned test piece is preferably 1.0 to 2.2 (kg/mm 2 ), more preferably 1.1 to 2.1 (kg/mm 2 ), and particularly preferably 1.2 to 2.0 (kg/ mm 2 ).
將本發明藉由以下之例進行實驗的說明，以下之說明並不意味本發明之範圍限定於以下之例進行解釋。 The present invention is explained experimentally by the following examples. The following description does not mean that the scope of the present invention is limited to the following examples.
(材料) (Material)
列舉以下之例所使用之材料。 List the materials used in the following examples.
‧胺基甲酸酯預聚物： ‧Urethane prepolymer:
第1預聚物‧‧‧將包含2,4-甲苯二異氰酸酯100重量%之甲苯二異氰酸酯設為主成分之NCO當量460之胺基甲酸酯預聚物 The first prepolymer‧‧‧A urethane prepolymer with an NCO equivalent of 460 containing 100% by weight of 2,4-toluene diisocyanate as the main component.
第2預聚物‧‧‧將包含2,4-甲苯二異氰酸酯80重量%、2,6-甲苯二異氰酸酯20重量%之甲苯二異氰酸酯設為主成分之NCO當量460之胺基甲酸酯預聚物 The second prepolymer‧‧‧is a urethane prepolymer with an NCO equivalent of 460 containing 80% by weight of 2,4-toluene diisocyanate and 20% by weight of 2,6-toluene diisocyanate as the main component. Polymer
‧硬化劑： ‧Hardening agent:
MOCA‧‧‧3,3'-二氯-4,4'-二胺基二苯基甲烷(別名：亞甲雙-鄰氯苯胺) MOCA‧‧‧3,3'-dichloro-4,4'-diaminodiphenylmethane (alias: methylene bis-o-chloroaniline)
‧微小中空球體之商品名： ‧Trade name of tiny hollow spheres:
日本Fillite公司製造EXPANCEL 551DE40d42 EXPANCEL 551DE40d42 manufactured by Japan Fillite Company
(實施例1) (Example 1)
分別準備以將包含2,4-甲苯二異氰酸酯100重量%之甲苯二異氰酸酯設為主成分之NCO當量460之胺基甲酸酯預聚物(第1預聚物)與將包含2,4-甲苯二異氰酸酯80重量%、2,6-甲苯二異氰酸酯20重量%之甲苯二異氰酸酯設為主成分之NCO當量460之胺基甲酸酯預聚物(第2預聚物)之重量比5：95進行混合者100g為A成分、準備作為硬化劑之MOCA(NH當量=133.5)30g為B成分、準備微小中空球體(EXPANCEL 551DE40d42)1g為C成分、準備4,4'-亞甲基-雙(環己基異氰酸酯)(氫化MDI)2g為D成分(追加之成分)。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為81：19。又，相對於A成分之胺基甲酸酯預聚物與D成分之氫化MDI之合計重量的D成分之氫化MDI之重量比率約2重量%。 A urethane prepolymer (first prepolymer) with an NCO equivalent of 460 containing 100% by weight of toluene diisocyanate as the main component and a urethane prepolymer containing 2,4-toluene diisocyanate were prepared respectively. The weight ratio of a urethane prepolymer (second prepolymer) with an NCO equivalent of 460, with toluene diisocyanate as the main component: 80% by weight of toluene diisocyanate and 20% by weight of 2,6-toluene diisocyanate: 95 Mix 100g of component A, prepare 30g of MOCA (NH equivalent = 133.5) as a hardener as component B, prepare 1g of micro hollow spheres (EXPANCEL 551DE40d42) as component C, and prepare 4,4'-methylene-bis 2g of (cyclohexyl isocyanate) (hydrogenated MDI) is component D (additional component). Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 81:19. Moreover, the weight ratio of the hydrogenated MDI of the component D to the total weight of the urethane prepolymer of the component A and the hydrogenated MDI of the component D is about 2% by weight.
混合A成分與C成分與D成分，分別減壓消泡A成分與C成分與D成分之混合物及B成分之後，將A成分與C成分與D成分之混合物及B成分供給至混合機。 After mixing component A, component C, and component D, and defoaming component A, the mixture of component C, component D, and component B respectively, the mixture of component A, component C, component D, and component B are supplied to the mixer.
將獲得之混合液澆鑄成型於加熱至80℃之模框(200mm×300mm之正方形)，加熱硬化1小時之後，自模框抽出形成之樹脂發泡體，其後於120℃固化5小時。將該發泡體切片為1.3mm厚製作胺基甲酸酯片，獲得研磨墊。 The obtained mixed liquid was cast into a mold frame (200 mm × 300 mm square) heated to 80°C. After heating and hardening for 1 hour, the formed resin foam was extracted from the mold frame, and then cured at 120°C for 5 hours. The foam was sliced into 1.3 mm thick pieces to prepare urethane sheets to obtain polishing pads.
(實施例2) (Example 2)
準備以重量比20：80混合第1預聚物與第2預聚物者100g來代替實施例1之A成分之胺基甲酸酯預聚物。再者，A成分之胺基甲酸酯預聚物中之 2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為84：16。 Prepare 100 g of the first prepolymer and the second prepolymer mixed in a weight ratio of 20:80 to replace the urethane prepolymer of component A in Example 1. Furthermore, in the urethane prepolymer of component A, The weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate is 84:16.
之後，與實施例1相同地製作胺基甲酸酯片，獲得研磨墊。 Thereafter, a urethane sheet was produced in the same manner as in Example 1 to obtain a polishing pad.
(實施例3) (Example 3)
準備以重量比50：50混合第1預聚物與第2預聚物者100g來代替實施例1之A成分之胺基甲酸酯預聚物。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為90：10。 Prepare 100 g of the first prepolymer and the second prepolymer mixed in a weight ratio of 50:50 to replace the urethane prepolymer of component A in Example 1. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 90:10.
之後，與實施例1相同地製作胺基甲酸酯片，獲得研磨墊。 Thereafter, a urethane sheet was produced in the same manner as in Example 1 to obtain a polishing pad.
(實施例4) (Example 4)
準備以重量比80：20混合第1預聚物與第2預聚物者100g來代替實施例1之A成分之胺基甲酸酯預聚物。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為96：4。 Prepare 100 g of the first prepolymer and the second prepolymer mixed in a weight ratio of 80:20 to replace the urethane prepolymer of component A in Example 1. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 96:4.
之後，與實施例1相同地製作胺基甲酸酯片，獲得研磨墊。 Thereafter, a urethane sheet was produced in the same manner as in Example 1 to obtain a polishing pad.
(比較例1) (Comparative example 1)
準備第2預聚物100g來代替實施例1之A成分之胺基甲酸酯預聚物。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為80：20。 100 g of the second prepolymer was prepared instead of the urethane prepolymer of component A in Example 1. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 80:20.
之後，與實施例1相同地製作胺基甲酸酯片，獲得研磨墊。 Thereafter, a urethane sheet was produced in the same manner as in Example 1 to obtain a polishing pad.
(實施例5) (Example 5)
除不使用D成分以外，與實施例2相同地製作胺基甲酸酯片，獲得研磨墊。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為84：16。 Except not using component D, a urethane sheet was produced in the same manner as in Example 2 to obtain a polishing pad. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 84:16.
(實施例6) (Example 6)
除不使用D成分以外，與實施例3相同地製作胺基甲酸酯片，獲得研 磨墊。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為90：10。 Except that component D is not used, a urethane sheet is prepared in the same manner as in Example 3 to obtain a ground product. Sanding pad. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 90:10.
(實施例7) (Example 7)
除不使用D成分以外，與實施例4相同地製作胺基甲酸酯片，獲得研磨墊。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為96：4。 Except not using component D, a urethane sheet was produced in the same manner as in Example 4 to obtain a polishing pad. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 96:4.
(實施例8) (Example 8)
準備以重量比95：5混合第1預聚物與第2預聚物者100g來代替實施例1之A成分之胺基甲酸酯預聚物。又，與實施例1不同，不使用D成分。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為99：1。 Prepare 100 g of the first prepolymer and the second prepolymer mixed in a weight ratio of 95:5 to replace the component A of Example 1 for the urethane prepolymer. In addition, unlike Example 1, component D is not used. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 99:1.
之後，與實施例1相同地製作胺基甲酸酯片，獲得研磨墊。 Thereafter, a urethane sheet was produced in the same manner as in Example 1 to obtain a polishing pad.
(比較例2) (Comparative example 2)
除不使用D成分以外，與比較例1相同地製作胺基甲酸酯片，獲得研磨墊。再者，A成分之胺基甲酸酯預聚物中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為80：20。 Except not using component D, a urethane sheet was produced in the same manner as in Comparative Example 1 to obtain a polishing pad. Furthermore, the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate in the urethane prepolymer of component A is 80:20.
(試驗方法) (Test method)
(拉伸強度、撕裂強度) (tensile strength, tear strength)
將實施例1~8及比較例1及2之各個胺基甲酸酯片藉由日本工業標準(JIS6550)之拉伸強度之測定切成規定之啞鈴狀，於拉伸速度100mm/分、試驗溫度20℃按照日本工業標準(JIS6550)測定拉伸強度(kg/mm2)。 Each urethane sheet of Examples 1 to 8 and Comparative Examples 1 and 2 was cut into a specified dumbbell shape according to the tensile strength measurement of Japanese Industrial Standard (JIS6550), and tested at a tensile speed of 100 mm/min. The tensile strength (kg/mm 2 ) was measured at a temperature of 20° C. in accordance with Japanese Industrial Standards (JIS6550).
又，將實施例1~8及比較例1及2之各個胺基甲酸酯片藉由日本工業標準(JIS6550)之撕裂強度之測定切成具有規定之切口之長方形狀，於撕 裂速度100mm/分、試驗溫度20℃按照日本工業標準(JIS6550)測定撕裂強度(kg/mm2)。 In addition, each of the urethane sheets of Examples 1 to 8 and Comparative Examples 1 and 2 was cut into a rectangular shape with prescribed incisions according to the tear strength measurement of Japanese Industrial Standard (JIS6550). The tear strength (kg/mm 2 ) was measured in accordance with Japanese Industrial Standards (JIS6550) at 100 mm/min and a test temperature of 20°C.
(Taber磨耗) (Taber wear)
對於實施例1~8及比較例1及2之各個研磨墊，按照遵循日本工業標準(JIS K 6902)之Taber磨耗試驗之方法，使用320粒度號數之砂紙進行測定。 Each of the polishing pads of Examples 1 to 8 and Comparative Examples 1 and 2 was measured using 320-grit sandpaper in accordance with the Taber abrasion test method of Japanese Industrial Standard (JIS K 6902).
以上之結果示於表1及圖1~3。 The above results are shown in Table 1 and Figures 1 to 3.
如表1、圖1~3之實施例1~8以及比較例1及2所示，關於拉伸強度，隨著甲苯二異氰酸酯中之2,4-甲苯二異氰酸酯之重量比率上升，存在變小之傾向，另一方面，關於撕裂強度，於甲苯二異氰酸酯中之2,4-甲苯二異氰酸酯之重量比率為81：19~99：1之實施例1~8中，可知與除其以外之重量比率之比較例1及2相比顯示大致較低之撕裂強度。 As shown in Table 1, Examples 1 to 8 in Figures 1 to 3, and Comparative Examples 1 and 2, the tensile strength decreases as the weight ratio of 2,4-toluene diisocyanate in toluene diisocyanate increases. On the other hand, regarding the tear strength, it can be seen that in Examples 1 to 8 in which the weight ratio of 2,4-toluene diisocyanate in toluene diisocyanate is 81:19 to 99:1, it is better than that of the other examples. Comparative Examples 1 and 2 showed substantially lower tear strength in terms of weight ratio.
又，甲苯二異氰酸酯中之2,4-甲苯二異氰酸酯與2,6-甲苯二異氰酸酯之重量比為81：19~99：1之實施例1~8之Taber磨耗量較大地為99mg以 上，可知修整性優異。 In addition, the Taber abrasion amount of Examples 1 to 8 in which the weight ratio of 2,4-toluene diisocyanate and 2,6-toluene diisocyanate is 81:19~99:1 is 99 mg or more. Above, it can be seen that the dressability is excellent.
通常，考慮到拉伸強度與撕裂強度有關聯之物性，可知於使甲苯二異氰酸酯中之2,4-甲苯二異氰酸酯之重量比率變化之情形時，拉伸強度與撕裂強度表示不同之行為。並不束縛於理論表示此類特異的拉伸強度及撕裂強度，從而結果推測出：與先前技術比較，作為研磨墊之修整性之指標之Taber磨耗量變大。 In general, considering the physical properties related to tensile strength and tear strength, it can be seen that when the weight ratio of 2,4-toluene diisocyanate in toluene diisocyanate is changed, tensile strength and tear strength show different behaviors. . Without being bound by theory, it is inferred that the amount of Taber abrasion, which is an indicator of the dressability of the polishing pad, becomes larger compared to the prior art.
Claims (10)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2017070277A JP7323265B2 (en) | 2017-03-31 | 2017-03-31 | polishing pad |
| JP2017-070277 | 2017-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201842004A TW201842004A (en) | 2018-12-01 |
| TWI833693B true TWI833693B (en) | 2024-03-01 |
Family
ID=64108082
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW107111097A TWI833693B (en) | 2017-03-31 | 2018-03-30 | Polishing pad, manufacturing method of polishing pad, method of polishing the surface of optical material or semiconductor material, and method of reducing scratches when polishing the surface of optical material or semiconductor material |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP7323265B2 (en) |
| TW (1) | TWI833693B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102197481B1 (en) * | 2019-06-27 | 2020-12-31 | 에스케이씨 주식회사 | Polishing pad and preparation method thereof |
| CN115247378A (en) * | 2021-04-25 | 2022-10-28 | 苏州三鼎纺织科技有限公司 | Composition containing wear-resistant auxiliary and polishing skin for optical glass prepared by using same |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003171433A (en) * | 2001-12-07 | 2003-06-20 | Toyo Tire & Rubber Co Ltd | Method for producing expanded polyurethane polishing pad |
| TWI488876B (en) * | 2009-06-29 | 2015-06-21 | Dainippon Ink & Chemicals | Two liquid-type urethane resin composition for polishing pad, polyurethane polishing pad, and method for producing polyurethane polishing pad |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3445371B2 (en) * | 1994-07-25 | 2003-09-08 | 保土谷化学工業株式会社 | Method for producing cold-setting waterproof coating film |
| JP3675945B2 (en) * | 1996-04-17 | 2005-07-27 | 保土谷化学工業株式会社 | Method for producing room temperature curable waterproofing membrane |
| GB9827367D0 (en) | 1998-12-11 | 1999-02-03 | Dow Deutschland Inc | Adhesive resin composition |
| JP5236150B2 (en) * | 2005-07-08 | 2013-07-17 | 東洋ゴム工業株式会社 | Blade for image forming apparatus and method for manufacturing the same |
| JP5242322B2 (en) * | 2008-09-30 | 2013-07-24 | 富士紡ホールディングス株式会社 | Polishing pad and manufacturing method thereof |
| JP5687118B2 (en) | 2011-04-15 | 2015-03-18 | 富士紡ホールディングス株式会社 | Polishing pad and manufacturing method thereof |
| JP6498498B2 (en) | 2015-04-03 | 2019-04-10 | 富士紡ホールディングス株式会社 | Polishing pad |
-
2017
- 2017-03-31 JP JP2017070277A patent/JP7323265B2/en active Active
-
2018
- 2018-03-30 TW TW107111097A patent/TWI833693B/en active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2003171433A (en) * | 2001-12-07 | 2003-06-20 | Toyo Tire & Rubber Co Ltd | Method for producing expanded polyurethane polishing pad |
| TWI488876B (en) * | 2009-06-29 | 2015-06-21 | Dainippon Ink & Chemicals | Two liquid-type urethane resin composition for polishing pad, polyurethane polishing pad, and method for producing polyurethane polishing pad |
Also Published As
| Publication number | Publication date |
|---|---|
| JP7323265B2 (en) | 2023-08-08 |
| JP2018171675A (en) | 2018-11-08 |
| TW201842004A (en) | 2018-12-01 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP6311183B2 (en) | Polishing pad and manufacturing method thereof | |
| JP7197330B2 (en) | High Removal Rate Chemical Mechanical Polishing Pads from Amine Initiated Polyol Containing Hardeners | |
| JP6600149B2 (en) | Polishing pad and manufacturing method thereof | |
| TWI488712B (en) | Polishing pad and manufacturing method thereof | |
| JP2019012817A (en) | Chemical mechanical polishing pad for improved removal speed and flattening | |
| WO2019188577A1 (en) | Polishing pad and method for producing same | |
| JP2017132012A (en) | Manufacturing method for polishing pad | |
| TWI833693B (en) | Polishing pad, manufacturing method of polishing pad, method of polishing the surface of optical material or semiconductor material, and method of reducing scratches when polishing the surface of optical material or semiconductor material | |
| TWI822861B (en) | Polishing pad and method of manufacturing same | |
| JP7349774B2 (en) | Polishing pad, method for manufacturing a polishing pad, method for polishing the surface of an object to be polished, method for reducing scratches when polishing the surface of an object to be polished | |
| TWI833924B (en) | Polishing pads, methods for polishing the surface of optical materials or semiconductor materials, and methods for reducing scratches when polishing the surface of optical materials or semiconductor materials | |
| CN111212705B (en) | Polishing pad and method for manufacturing the same | |
| JP2017185563A (en) | Polishing pad | |
| WO2019188476A1 (en) | Polishing pad, polishing pad production method, and method for polishing surface of optical material or semiconductor material | |
| JP6855202B2 (en) | Abrasive pad | |
| JP6803712B2 (en) | Abrasive pad | |
| JP6498498B2 (en) | Polishing pad | |
| JP7405500B2 (en) | Polishing pad, method for manufacturing polishing pad, and method for polishing the surface of optical or semiconductor material | |
| JP7191749B2 (en) | Polishing pad, method for manufacturing polishing pad, and method for polishing surface of optical material or semiconductor material | |
| KR102677377B1 (en) | Polishing pad and method of manufacturing the same | |
| JP2019034385A (en) | Polishing pad | |
| JP6691658B2 (en) | Polishing pad | |
| JP6513455B2 (en) | Polishing pad | |
| JP6765204B2 (en) | Polishing method | |
| JP2023049623A (en) | Polishing pad, method for manufacturing polishing pad, and method for polishing surface of optical material or semiconductor material |