TWI832861B - 印刷電路板與其製造方法 - Google Patents

印刷電路板與其製造方法 Download PDF

Info

Publication number: TWI832861B
Authority: TW; Taiwan
Prior art keywords: layer; rigid; flexible; base member; termination element
Prior art date: 2019-03-04

Application number

TW108118293A

Other languages

English (en)

Chinese (zh)

Other versions

TW202034751A (zh

Inventor

李亮制

張晶勛

朴賢耕

趙基殷

Original Assignee

南韓商三星電機股份有限公司

Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)

2019-03-04

Filing date

2019-05-27

Publication date

2024-02-21

2019-05-27 Application filed by 南韓商三星電機股份有限公司 filed Critical 南韓商三星電機股份有限公司

2020-09-16 Publication of TW202034751A publication Critical patent/TW202034751A/zh

2024-02-21 Application granted granted Critical

2024-02-21 Publication of TWI832861B publication Critical patent/TWI832861B/zh

Links

238000004519 manufacturing process Methods 0.000 title claims abstract description 14
238000000034 method Methods 0.000 claims abstract description 23
239000002184 metal Substances 0.000 claims abstract description 22
229910052751 metal Inorganic materials 0.000 claims abstract description 22
239000010410 layer Substances 0.000 claims description 245
230000002787 reinforcement Effects 0.000 claims description 21
239000012790 adhesive layer Substances 0.000 claims description 16
238000010030 laminating Methods 0.000 claims description 7
238000013532 laser treatment Methods 0.000 claims description 3
238000011282 treatment Methods 0.000 claims description 3
238000005530 etching Methods 0.000 claims 2
239000000758 substrate Substances 0.000 abstract description 8
238000010586 diagram Methods 0.000 description 8
239000000463 material Substances 0.000 description 8
238000007747 plating Methods 0.000 description 5
239000003822 epoxy resin Substances 0.000 description 4
229920000647 polyepoxide Polymers 0.000 description 4
RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
238000004891 communication Methods 0.000 description 3
229920001721 polyimide Polymers 0.000 description 3
239000000654 additive Substances 0.000 description 2
239000002131 composite material Substances 0.000 description 2
239000011889 copper foil Substances 0.000 description 2
239000012792 core layer Substances 0.000 description 2
239000000835 fiber Substances 0.000 description 2
238000009413 insulation Methods 0.000 description 2
239000007788 liquid Substances 0.000 description 2
230000000717 retained effect Effects 0.000 description 2
229910000679 solder Inorganic materials 0.000 description 2
229920003002 synthetic resin Polymers 0.000 description 2
239000000057 synthetic resin Substances 0.000 description 2
229920000049 Carbon (fiber) Polymers 0.000 description 1
239000000853 adhesive Substances 0.000 description 1
230000001070 adhesive effect Effects 0.000 description 1
238000005452 bending Methods 0.000 description 1
230000005540 biological transmission Effects 0.000 description 1
239000004917 carbon fiber Substances 0.000 description 1
229910052802 copper Inorganic materials 0.000 description 1
239000010949 copper Substances 0.000 description 1
239000003365 glass fiber Substances 0.000 description 1
VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
238000012986 modification Methods 0.000 description 1
230000004048 modification Effects 0.000 description 1
238000007781 pre-processing Methods 0.000 description 1
230000003014 reinforcing effect Effects 0.000 description 1
235000015096 spirit Nutrition 0.000 description 1
238000006467 substitution reaction Methods 0.000 description 1

Classifications

- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide

Landscapes

Engineering & Computer Science (AREA)
Microelectronics & Electronic Packaging (AREA)
Manufacturing & Machinery (AREA)
Physics & Mathematics (AREA)
Optics & Photonics (AREA)
Production Of Multi-Layered Print Wiring Board (AREA)
Structure Of Printed Boards (AREA)

TW108118293A 2019-03-04 2019-05-27 印刷電路板與其製造方法 TWI832861B (zh)

Applications Claiming Priority (2)

Application Number	Priority Date	Filing Date	Title
KR10-2019-0024744		2019-03-04
KR1020190024744A KR20200106342A (ko)	2019-03-04	2019-03-04	인쇄회로기판 및 그 제조방법

Publications (2)

Publication Number	Publication Date
TW202034751A TW202034751A (zh)	2020-09-16
TWI832861B true TWI832861B (zh)	2024-02-21

Family

ID=72353763

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
TW108118293A TWI832861B (zh)	2019-03-04	2019-05-27	印刷電路板與其製造方法

Country Status (3)

Country	Link
JP (1)	JP7463654B2 (ja)
KR (1)	KR20200106342A (ja)
TW (1)	TWI832861B (ja)

Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
CN102131348A (zh) *	2010-01-20	2011-07-20	奥特斯(中国)有限公司	用于制造刚性-柔性的印刷电路板的方法
TWI400015B (zh) *	2005-05-13	2013-06-21	Tatsuta Densen Kk	遮蔽膜、遮蔽印刷電路板、遮蔽柔性印刷電路板、製造遮蔽膜的方法與製造遮蔽印刷電路板的方法
TWI400013B (zh) *	2008-02-22	2013-06-21	Vishay Intertechnology Inc	具可撓性引線之表面安裝晶片電阻及其製法
CN104735899A (zh) *	2013-12-19	2015-06-24	富葵精密组件(深圳)有限公司	可挠式电路板及其制作方法
CN105722317A (zh) *	2014-12-03	2016-06-29	珠海方正科技高密电子有限公司	刚挠结合印刷电路板及其制作方法
TWI573499B (zh) *	2015-12-03	2017-03-01	Nat Kaohsiung First Univ Of Science And Tech	Flexible thin printed circuit board manufacturing method

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
JP2004031682A (ja)	2002-06-26	2004-01-29	Sony Corp	プリント配線基板の製造方法
JP4852979B2 (ja)	2005-10-31	2012-01-11	ソニー株式会社	フレックスリジッド基板、光送受信モジュール及び光送受信装置
US20100155109A1 (en)	2008-12-24	2010-06-24	Ibiden Co., Ltd.	Flex-rigid wiring board and method for manufacturing the same
AT12321U1 (de)	2009-01-09	2012-03-15	Austria Tech & System Tech	Multilayer-leiterplattenelement mit wenigstens einem laserstrahl-stoppelement sowie verfahren zum anbringen eines solchen laserstrahl- stoppelements in einem multilayer- leiterplattenelement
CN103096647B (zh)	2011-10-31	2016-01-13	健鼎（无锡）电子有限公司	弯折式印刷电路板的制造方法
KR101319808B1 (ko)	2012-02-24	2013-10-17	삼성전기주식회사	경연성 인쇄회로기판 제조 방법

2019
- 2019-03-04 KR KR1020190024744A patent/KR20200106342A/ko not_active Application Discontinuation
- 2019-05-27 TW TW108118293A patent/TWI832861B/zh active
- 2019-06-04 JP JP2019104887A patent/JP7463654B2/ja active Active

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number	Priority date	Publication date	Assignee	Title
TWI400015B (zh) *	2005-05-13	2013-06-21	Tatsuta Densen Kk	遮蔽膜、遮蔽印刷電路板、遮蔽柔性印刷電路板、製造遮蔽膜的方法與製造遮蔽印刷電路板的方法
TWI400013B (zh) *	2008-02-22	2013-06-21	Vishay Intertechnology Inc	具可撓性引線之表面安裝晶片電阻及其製法
CN102131348A (zh) *	2010-01-20	2011-07-20	奥特斯(中国)有限公司	用于制造刚性-柔性的印刷电路板的方法
CN104735899A (zh) *	2013-12-19	2015-06-24	富葵精密组件(深圳)有限公司	可挠式电路板及其制作方法
CN105722317A (zh) *	2014-12-03	2016-06-29	珠海方正科技高密电子有限公司	刚挠结合印刷电路板及其制作方法
TWI573499B (zh) *	2015-12-03	2017-03-01	Nat Kaohsiung First Univ Of Science And Tech	Flexible thin printed circuit board manufacturing method

Also Published As

Publication number	Publication date
JP2020145395A (ja)	2020-09-10
TW202034751A (zh)	2020-09-16
KR20200106342A (ko)	2020-09-14
JP7463654B2 (ja)	2024-04-09

Publication	Publication Date	Title
KR101156751B1 (ko)	2012-07-03	리지드 플렉서블 프린트 배선판 및 리지드 플렉서블 프린트배선판의 제조방법
JP4914474B2 (ja)	2012-04-11	多層印刷回路基板の製造方法
US20090026168A1 (en)	2009-01-29	Method for manufacturing a rigid-flex circuit board
KR20140033177A (ko)	2014-03-17	리지드 플렉시블 인쇄회로기판의 제작 방법 및 리지드 플렉시블 인쇄회로기판
JP4147298B2 (ja)	2008-09-10	フレックスリジッドプリント配線板およびフレックスリジッドプリント配線板の製造方法
KR20120092050A (ko)	2012-08-20	배선기판 및 그 제조방법
CN102573278A (zh)	2012-07-11	多层布线基板
KR20130079197A (ko)	2013-07-10	다층 배선기판 및 그 제조방법
TWI446848B (zh)	2014-07-21	彎折式印刷電路板之製造方法
US8288662B2 (en)	2012-10-16	Circuit structure
KR102078009B1 (ko)	2020-02-17	인쇄회로기판 및 그 제조방법
KR20130051424A (ko)	2013-05-20	다층 배선기판의 제조방법
US11081368B2 (en)	2021-08-03	Method of dicing wiring substrate, and packaging substrate
TWI832861B (zh)	2024-02-21	印刷電路板與其製造方法
US20160073505A1 (en)	2016-03-10	Manufacturing method of multilayer flexible circuit structure
JP5293692B2 (ja)	2013-09-18	フレックスリジッド配線基板及びその製造方法
KR101167422B1 (ko)	2012-07-19	캐리어 부재 및 이를 이용한 인쇄회로기판의 제조방법
JP4926676B2 (ja)	2012-05-09	多層プリント配線板の製造方法
TWI501706B (zh)	2015-09-21	線路板及其製作方法
JP2010056373A (ja)	2010-03-11	プリント配線板の製造方法およびプリント配線板
KR102494343B1 (ko)	2023-02-01	인쇄회로기판
TWI755556B (zh)	2022-02-21	載體基板以及使用該基板製造的印刷電路板
KR20140032674A (ko)	2014-03-17	리지드 플렉시블 기판 제조방법
KR101519153B1 (ko)	2015-05-11	인쇄회로기판 및 그 제조방법
KR101966322B1 (ko)	2019-04-08	금속 적층판 및 그 제조방법