TWI832861B - Printed circuit board and manufacturing method for the same - Google Patents
Printed circuit board and manufacturing method for the same Download PDFInfo
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- TWI832861B TWI832861B TW108118293A TW108118293A TWI832861B TW I832861 B TWI832861 B TW I832861B TW 108118293 A TW108118293 A TW 108118293A TW 108118293 A TW108118293 A TW 108118293A TW I832861 B TWI832861 B TW I832861B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 14
- 238000000034 method Methods 0.000 claims abstract description 23
- 239000002184 metal Substances 0.000 claims abstract description 22
- 229910052751 metal Inorganic materials 0.000 claims abstract description 22
- 239000010410 layer Substances 0.000 claims description 245
- 230000002787 reinforcement Effects 0.000 claims description 21
- 239000012790 adhesive layer Substances 0.000 claims description 16
- 238000010030 laminating Methods 0.000 claims description 7
- 238000013532 laser treatment Methods 0.000 claims description 3
- 238000011282 treatment Methods 0.000 claims description 3
- 238000005530 etching Methods 0.000 claims 2
- 239000000758 substrate Substances 0.000 abstract description 8
- 238000010586 diagram Methods 0.000 description 8
- 239000000463 material Substances 0.000 description 8
- 238000007747 plating Methods 0.000 description 5
- 239000003822 epoxy resin Substances 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000000654 additive Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 239000012792 core layer Substances 0.000 description 2
- 239000000835 fiber Substances 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 230000000717 retained effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000005540 biological transmission Effects 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 235000015096 spirit Nutrition 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/0278—Rigid circuit boards or rigid supports of circuit boards locally made bendable, e.g. by removal or replacement of material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0277—Bendability or stretchability details
- H05K1/028—Bending or folding regions of flexible printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
- H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4688—Composite multilayer circuits, i.e. comprising insulating layers having different properties
- H05K3/4691—Rigid-flexible multilayer circuits comprising rigid and flexible layers, e.g. having in the bending regions only flexible layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/01—Dielectrics
- H05K2201/0137—Materials
- H05K2201/0154—Polyimide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
本申請案是有關於一種印刷電路板與其製造方法。 This application relates to a printed circuit board and its manufacturing method.
隨著5G通訊服務市場對高容量及高速傳輸的需求增長，愈來愈需要低損耗的剛撓印刷電路板(rigid-flex printed circuit board)。 As the demand for high-capacity and high-speed transmission in the 5G communication service market grows, there is an increasing need for low-loss rigid-flex printed circuit boards.
然而，5G通訊所需的剛撓印刷電路板需要一種方法(諸如，經修改的半加成製程(Modified Semi-Additive Process，MSAP))來實施精細的電路，且亦需要剛性基底部件與可撓性基底部件之間所存在的大的高度差，這導致難以實施產品並保證良率。 However, the rigid-flex printed circuit boards required for 5G communications require a method (such as a modified semi-additive process (MSAP)) to implement fine circuits, and also require rigid base components and flexible The large height differences between the base components make it difficult to implement the product and maintain yield.
韓國專利第10-1319808號中揭露了一種製造剛性可撓性印刷電路板(rigid-flexible printed circuit board)的方法。 Korean Patent No. 10-1319808 discloses a method of manufacturing a rigid-flexible printed circuit board.
根據本發明的態樣，提供一種印刷電路板，所述印刷電 路板包括：可撓性基底部件，包括具有可撓性的第一可撓性膜層；以及剛性基底部件，連接至所述可撓性基底部件且形成為較所述可撓性基底部件厚，其中所述剛性基底部件包括多個金屬層，所述多個金屬層自面向所述可撓性基底部件的側表面暴露於外部，設置於所述可撓性基底部件的一個表面上，彼此間隔開且形成於不同的層中。 According to an aspect of the present invention, a printed circuit board is provided, the printed circuit board The circuit board includes: a flexible base component including a first flexible film layer having flexibility; and a rigid base component connected to the flexible base component and formed to be thicker than the flexible base component , wherein the rigid base member includes a plurality of metal layers, the plurality of metal layers are exposed to the outside from a side surface facing the flexible base member, and are disposed on one surface of the flexible base member, mutually spaced apart and formed in separate layers.
根據本發明的另一態樣，提供一種製造印刷電路板的方法，所述方法包括：形成具有面向彼此的第一終止元件層(stopper layer)與第二終止元件層的剛性層壓板，所述第一終止元件層及所述第二終止元件層分別位於所述剛性層壓板的一個表面及另一表面上；藉由在所述剛性層壓板的一個表面上層壓可撓性電路層來形成可撓性層壓部件，且藉由在所述剛性層壓板的另一表面上層壓剛性電路層來形成剛性層壓部件；以及藉由通過第一處理(processing)移除所述剛性層壓部件直至所述第二終止元件層且接著通過第二處理移除所述剛性層壓部件直至所述第一終止元件層來暴露出所述可撓性層壓部件。 According to another aspect of the invention, a method of manufacturing a printed circuit board is provided, the method comprising forming a rigid laminate having a first stopper layer and a second stopper layer facing each other, the The first termination element layer and the second termination element layer are respectively located on one surface and the other surface of the rigid laminate; a flexible circuit layer is formed by laminating a flexible circuit layer on one surface of the rigid laminate. a flexible laminated component, and forming a rigid laminated component by laminating a rigid circuit layer on another surface of the rigid laminate; and by removing the rigid laminated component by first processing until The second terminating element layer and then the flexible laminate is exposed by a second process that removes the rigid laminate up to the first terminating element layer.
100、100’:印刷電路板 100, 100’: printed circuit board
110:可撓性層壓部件 110: Flexible laminated components
112:黏合層 112: Adhesive layer
114:第一可撓性膜層 114: First flexible film layer
120:剛性層壓部件 120: Rigid laminated components
120a、120b:側表面 120a, 120b: side surface
121:第一終止元件層/金屬層 121: First termination component layer/metal layer
121’:第一終止元件層 121’: first termination element layer
122:第二終止元件層/金屬層 122: Second termination element layer/metal layer
122’:第二終止元件層 122’: Second termination element layer
123、123’:第三終止元件層 123, 123’: third termination element layer
125:增強層 125: Enhancement layer
126:階梯部件 126:Ladder parts
127:第二可撓性膜層 127: Second flexible film layer
129:阻焊劑層 129: Solder resist layer
130:剛性層壓部件 130: Rigid laminated components
F:可撓性基底部件 F: Flexible base component
R1:剛性基底部件/第一剛性基底部件 R1: Rigid base member/first rigid base member
R2:剛性基底部件/第二剛性基底部件 R2: Rigid base member/second rigid base member
圖1是說明根據本發明實施例的印刷電路板的圖。 FIG. 1 is a diagram illustrating a printed circuit board according to an embodiment of the present invention.
圖2是放大影像，其說明根據本發明實施例的印刷電路板的第一終止元件層及第二終止元件層。 2 is an enlarged image illustrating a first termination element layer and a second termination element layer of a printed circuit board according to an embodiment of the invention.
圖3是說明根據本發明的另一實施例的印刷電路板的圖。 3 is a diagram illustrating a printed circuit board according to another embodiment of the present invention.
圖4至圖11是說明製造根據本發明實施例的印刷電路板的方法的圖。 4 to 11 are diagrams illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.
圖12是說明製造根據本發明的另一實施例的印刷電路板的方法的圖。 12 is a diagram illustrating a method of manufacturing a printed circuit board according to another embodiment of the present invention.
下文將參考附圖更詳細地闡述本發明的某些實施例，在附圖中，無論圖編號如何，相同或對應的該些組件將以相同的參考編號來表示，且不予贅述。 Certain embodiments of the present invention will be explained in more detail below with reference to the accompanying drawings. In the accompanying drawings, regardless of the figure number, the same or corresponding components will be designated with the same reference numbers and will not be described again.
雖然可使用諸如「第一」及「第二」等用語來闡述各種組件，但該些組件未必受以上用語限制。以上用語僅用於將一個組件與另一組件區分開。 Although terms such as "first" and "second" may be used to describe various components, these components are not necessarily limited by the above terms. The above terms are only used to distinguish one component from another component.
當將一個元件闡述為「連接」或「接達」至另一元件時，所述元件應被視為直接連接或接達至所述另一元件，但亦可能在其之間具有另一元件。 When an element is referred to as being "connected" or "accessed" to another element, it should be deemed to be directly connected or connected to the other element, although other elements may also be present therebetween. .
在後文中，將闡述印刷電路板的各種實施例，但此並不排除對任一個實施例的說明可適用於其他實施例。只要關係相容，對任一個實施例的說明可適用於其他實施例。 In the following, various embodiments of printed circuit boards will be described, but this does not exclude that the description of any one embodiment may be applicable to other embodiments. Descriptions of any one embodiment may be applied to other embodiments as long as the relationships are compatible.
圖1是說明根據本發明實施例的印刷電路板的圖。 FIG. 1 is a diagram illustrating a printed circuit board according to an embodiment of the present invention.
參考圖1，根據本發明實施例的印刷電路板100包括可撓 性基底部件F以及剛性基底部件R1及R2，其中剛性基底部件R1及R2包括暴露於側表面120a及120b的多個金屬層121及122。 Referring to FIG. 1 , a printed circuit board 100 according to an embodiment of the present invention includes a flexible The rigid base member F and the rigid base members R1 and R2 include a plurality of metal layers 121 and 122 exposed on the side surfaces 120a and 120b.
可撓性基底部件F是印刷電路板的可彎曲部分，且包括具有可撓性的第一可撓性膜層114。可撓性基底部件F可包括其中電路圖案形成於第一可撓性膜層114上的可撓性電路層。 The flexible base member F is a bendable portion of the printed circuit board and includes a first flexible film layer 114 having flexibility. The flexible base member F may include a flexible circuit layer in which a circuit pattern is formed on the first flexible film layer 114 .
參考圖1，此實施例的可撓性基底部件F可形成為連接一對剛性基底部件R1與R2。在此，構成可撓性基底部件F的第一可撓性膜層114具有延伸至剛性基底部件R1及R2中的結構，且形成剛性基底部件R1及R2的一部分。此實施例的第一可撓性膜層114包括聚醯亞胺膜層且藉由黏合層112接合。 Referring to FIG. 1 , the flexible base member F of this embodiment may be formed to connect a pair of rigid base members R1 and R2. Here, the first flexible film layer 114 constituting the flexible base member F has a structure extending into the rigid base members R1 and R2, and forms a part of the rigid base members R1 and R2. The first flexible film layer 114 of this embodiment includes a polyimide film layer and is joined by an adhesive layer 112 .
剛性基底部件R1及R2不預期在印刷電路板中發生彎曲，且剛性基底部件R1及R2具有由硬材料製成的絕緣層。剛性基底部件R1及R2連接至可撓性基底部件F，以使得此實施例的印刷電路板具有剛撓印刷電路板結構。剛性基底部件R1及R2可較可撓性基底部件F厚。 The rigid base members R1 and R2 are not expected to bend in the printed circuit board and have an insulating layer made of a hard material. The rigid base members R1 and R2 are connected to the flexible base member F, so that the printed circuit board of this embodiment has a rigid-flex printed circuit board structure. Rigid base components R1 and R2 may be thicker than flexible base component F.
舉例而言，由諸如聚醯亞胺膜等的可撓性膜層及銅箔組成的可撓性覆銅層壓體(flexible copper clad laminate，FCCL)是層壓而成，且所述銅箔可被圖案化以形成可撓性電路層，其因此能夠彎曲。諸如環氧樹脂預浸體等的剛性絕緣層(其是較可撓性膜層更具剛性的絕緣層)可另外部分地形成於所述可撓性電路層上，以形成由比可撓性電路層更具剛性的材料製成的剛性電路層。因此，具有剛撓結構的印刷電路板可被形成為其中可撓性基 底所保留的部分成為能夠彎曲的可撓性基底部件F，且其餘部分成為剛性基底部件R1及R2。本文中的用語「可撓性(flexibility)」及「剛性(rigidity)」意指相對與彼此而言的相對差異。根據使用者的意圖，具有能夠彎曲的強度的材料被稱為可撓性材料，且不可發生此彎曲的材料被稱為剛性材料。 For example, a flexible copper clad laminate (FCCL) composed of a flexible film layer such as a polyimide film and a copper foil is laminated, and the copper foil Can be patterned to form a flexible circuit layer, which can therefore be bent. A rigid insulating layer such as an epoxy resin prepreg, which is an insulating layer that is more rigid than the flexible film layer, may be additionally partially formed on the flexible circuit layer to form a circuit layer composed of more rigid insulating layers than the flexible film layer. A rigid circuit layer made of a more rigid material. Therefore, a printed circuit board having a rigid-flex structure can be formed in which the flexible base The remaining portion of the bottom becomes the flexible base member F that can be bent, and the remaining portions become the rigid base members R1 and R2. The terms "flexibility" and "rigidity" used herein mean relative differences with respect to each other. Materials that have the strength to be bent according to the user's intention are called flexible materials, and materials that are incapable of such bending are called rigid materials.
在此實施例中，剛性基底部件R1及R2可具有第一剛性基底部件R1及第二剛性基底部件R2的兩個基底區。第一剛性基底部件R1與第二剛性基底部件R2可間隔開且通過可撓性基底部件F連接。因此，第一剛性基底部件R1、可撓性基底部件F及第二剛性基底部件R2可被連續地連接。 In this embodiment, the rigid base members R1 and R2 may have two base regions of a first rigid base member R1 and a second rigid base member R2. The first rigid base member R1 and the second rigid base member R2 may be spaced apart and connected by the flexible base member F. Therefore, the first rigid base member R1, the flexible base member F, and the second rigid base member R2 can be continuously connected.
確切而言，此實施例的剛性基底部件R1及R2可包括多個金屬層121及122，所述多個金屬層121及122自面向可撓性基底部件F的側表面暴露於外部。在剛性基底部件R1及R2的側表面上的所述多個金屬層121及122設置於可撓性基底部件F的一個表面上，彼此間隔開且形成於不同的層中。所述多個金屬層121及122全部皆在基於可撓性基底部件F的一個方向上，形成於不同的層中且在基底的厚度方向上間隔開。 Specifically, the rigid base members R1 and R2 of this embodiment may include a plurality of metal layers 121 and 122 that are exposed to the outside from the side surface facing the flexible base member F. The plurality of metal layers 121 and 122 on the side surfaces of the rigid base members R1 and R2 are provided on one surface of the flexible base member F, spaced apart from each other and formed in different layers. The plurality of metal layers 121 and 122 are all formed in different layers in one direction based on the flexible base component F and are spaced apart in the thickness direction of the base.
參考圖1，此實施例的剛性基底部件R1及R2形成為較可撓性基底部件F厚，且相對於可撓性基底部件F，一側(圖1中的向上方向)在厚度方向上具有較另一側(圖1中的向下方向)大的高度差。所述多個金屬層121及122形成為暴露於剛性基底部件R1及R2中具有較大高度差的一側的側表面。 Referring to FIG. 1 , the rigid base members R1 and R2 of this embodiment are formed thicker than the flexible base member F, and relative to the flexible base member F, one side (the upward direction in FIG. 1 ) has a thickness in the thickness direction. A larger height difference than the other side (downward direction in Figure 1). The plurality of metal layers 121 and 122 are formed to be exposed to the side surface of a side having a larger height difference among the rigid base members R1 and R2.
在此實施例中，所述多個金屬層可包括第一終止元件層121及第二終止元件層122。第一終止元件層121可形成為鄰近可撓性基底部件F，且第二終止元件層122可形成為與可撓性基底部件F隔開。 In this embodiment, the plurality of metal layers may include a first termination element layer 121 and a second termination element layer 122 . The first termination element layer 121 may be formed adjacent to the flexible base member F, and the second termination element layer 122 may be formed spaced apart from the flexible base member F.
舉例而言，在剛性基底部件R1及R2中，第一終止元件層121可形成於黏合層112上，黏合層112形成於延伸至剛性基底部件R1及R2中的第一可撓性膜層114上，且第二終止元件層122可形成於絕緣層上以隔開且位於第一終止元件層121上方。第一終止元件層121及第二終止元件層122兩者皆嵌入於剛性基底部件R1及R2中，且第一終止元件層121及第二終止元件層122的端表面暴露於剛性基底部件R1及R2的側表面(面向可撓性基底部件F的側表面)。 For example, in the rigid base components R1 and R2, the first termination element layer 121 may be formed on the adhesive layer 112 formed on the first flexible film layer 114 extending into the rigid base components R1 and R2. on the insulation layer, and the second termination element layer 122 may be formed on the insulating layer to be spaced apart and located above the first termination element layer 121 . Both the first termination element layer 121 and the second termination element layer 122 are embedded in the rigid base members R1 and R2, and the end surfaces of the first termination element layer 121 and the second termination element layer 122 are exposed to the rigid base members R1 and R2. The side surface of R2 (the side surface facing the flexible base member F).
在此實施例中，剛性基底部件R1及R2包括藉由可撓性基底部件F連接的第一剛性板部分R1與第二剛性板部分R2，且形成於剛性基底部件R1及R2中的所述多個金屬層121及122中的每一者可被設置成面向彼此。 In this embodiment, the rigid base members R1 and R2 include a first rigid plate portion R1 and a second rigid plate portion R2 connected by a flexible base member F, and the rigid base members R1 and R2 are formed in Each of the plurality of metal layers 121 and 122 may be disposed facing each other.
參考圖1，第一剛性基底部件R1的面向可撓性基底部件F的側表面120a與第二剛性基底部件R2的面向可撓性基底部件F的側表面120b可被設置成面向彼此。第一終止元件層121與第二終止元件層122可被設置成面向彼此，第一終止元件層121與第二終止元件層122分別是形成於側表面上的所述多個金屬層121及122。 Referring to FIG. 1 , a side surface 120 a of the first rigid base member R1 facing the flexible base member F and a side surface 120 b of the second rigid base member R2 facing the flexible base member F may be disposed to face each other. The first termination element layer 121 and the second termination element layer 122 may be disposed to face each other. The first termination element layer 121 and the second termination element layer 122 are the plurality of metal layers 121 and 122 formed on the side surfaces, respectively. .
第三終止元件層123可在另一側中形成於剛性基底部件R1及R2的相對於可撓性基底部件F具有較小高度差的側表面上。 The third termination element layer 123 may be formed on side surfaces of the rigid base members R1 and R2 having a smaller height difference with respect to the flexible base member F in the other side.
剛性基底部件R1及R2可包括用於提高基底的強度的核心層。 Rigid base components R1 and R2 may include a core layer for increasing the strength of the base.
參考圖1，剛性基底部件R1及R2可包括增強層125，增強層125設置於就厚度方向而言的中心部分處以形成所述核心層。增強層125可由液態合成樹脂(諸如，環氧樹脂)滲入至纖維增強材料(諸如，碳纖維或玻璃纖維)中的複合材料製成。 Referring to FIG. 1 , the rigid base members R1 and R2 may include a reinforcing layer 125 disposed at a central portion in a thickness direction to form the core layer. The reinforcement layer 125 may be made of a composite material in which liquid synthetic resin, such as epoxy resin, is infiltrated into fiber reinforcement materials, such as carbon fiber or glass fiber.
增強層125可設置於第一終止元件層121與第二終止元件層122之間。舉例而言，第一終止元件層121形成於延伸於剛性基底部件R1及R2內的第一可撓性膜層114上，且第二終止元件層122形成於增強層125上。 The reinforcement layer 125 may be disposed between the first termination element layer 121 and the second termination element layer 122 . For example, the first termination element layer 121 is formed on the first flexible film layer 114 extending within the rigid base members R1 and R2 , and the second termination element layer 122 is formed on the reinforcement layer 125 .
剛性基底部件R1及R2可更包括第二可撓性膜層127，第二可撓性膜層127被設置成基於增強層125而與第一可撓性膜層114對應。 The rigid base members R1 and R2 may further include a second flexible film layer 127 disposed to correspond to the first flexible film layer 114 based on the reinforcement layer 125 .
參考圖1，第一可撓性膜層114與第二可撓性膜層127可具有基於形成於這兩者之間的增強層125對稱的結構。此結構允許剛性基底部件R1與R2具有關於中心層對稱的結構，藉此將翹曲最小化。 Referring to FIG. 1 , the first flexible film layer 114 and the second flexible film layer 127 may have a symmetrical structure based on the reinforcement layer 125 formed therebetween. This structure allows the rigid base components R1 and R2 to have a symmetrical structure with respect to the central layer, thereby minimizing warpage.
階梯部件126可形成於剛性基底部件R1及R2的側表面上。 Step parts 126 may be formed on the side surfaces of the rigid base parts R1 and R2.
圖2是放大影像，其說明根據本發明實施例的印刷電路 板的第一終止元件層及第二終止元件層。 Figure 2 is an enlarged image illustrating a printed circuit according to an embodiment of the present invention; A first termination element layer and a second termination element layer of the board.
參考圖2，橫向邊界線可在絕緣層中形成階梯部，第二終止元件層122形成於所述絕緣層上。亦即，階梯部件126可階梯式地形成於剛性基底部件R1及R2的側表面上，且第二終止元件層122可設置於階梯部件126的上表面上。 Referring to FIG. 2 , the lateral boundary lines may form steps in the insulating layer on which the second termination element layer 122 is formed. That is, the stepped part 126 may be formed in a stepped manner on the side surfaces of the rigid base members R1 and R2 , and the second termination element layer 122 may be provided on the upper surface of the stepped part 126 .
另一方面，此實施例的可撓性基底部件F可包括黏合層112作為最外層。 On the other hand, the flexible base member F of this embodiment may include the adhesive layer 112 as the outermost layer.
參考圖1，在可撓性基底部件F的一個表面上的最外層可以是黏合層112。由於黏合層112的硬度根據固化程度而變化，因此可藉由調整作為最外層的黏合層112的固化程度來調整可撓性基底部件F的可撓性。 Referring to FIG. 1 , the outermost layer on one surface of the flexible base member F may be an adhesive layer 112 . Since the hardness of the adhesive layer 112 changes according to the degree of curing, the flexibility of the flexible base member F can be adjusted by adjusting the degree of curing of the adhesive layer 112 as the outermost layer.
另外，黏合層112可不形成於可撓性基底部件F的最外層上。 In addition, the adhesive layer 112 may not be formed on the outermost layer of the flexible base member F.
圖3是說明根據本發明的另一實施例的印刷電路板的圖。 3 is a diagram illustrating a printed circuit board according to another embodiment of the present invention.
參考圖3，此實施例的印刷電路板100'的黏合層112可僅形成於剛性基底部件R1及R2中，且可撓性膜層可在可撓性基底部件F中形成為最外層。 Referring to FIG. 3 , the adhesive layer 112 of the printed circuit board 100 ′ of this embodiment can be formed only in the rigid base components R1 and R2 , and the flexible film layer can be formed as the outermost layer in the flexible base component F.
圖4至圖11是說明製造根據本發明實施例的印刷電路板的方法的圖。 4 to 11 are diagrams illustrating a method of manufacturing a printed circuit board according to an embodiment of the present invention.
參考圖4至圖11，製造根據本發明實施例的印刷電路板的方法包括：形成剛性層壓板；形成可撓性層壓部件110及剛性 層壓部件120；以及暴露出可撓性層壓部件110。 Referring to FIGS. 4 to 11 , a method of manufacturing a printed circuit board according to an embodiment of the present invention includes: forming a rigid laminate; forming a flexible laminate component 110 and a rigid laminate. laminate component 120; and exposing flexible laminate component 110.
在形成所述剛性層壓板的步驟中，所述剛性層壓板形成為具有面向彼此的第一終止元件層121’與第二終止元件層122'，第一終止元件層121’及第二終止元件層122'分別位於一個表面及另一表面上。 In the step of forming the rigid laminate, the rigid laminate is formed with a first termination element layer 121 ′ and a second termination element layer 122 ′ facing each other, the first termination element layer 121 ′ and the second termination element layer 121 ′ facing each other. Layers 122' are respectively located on one surface and the other surface.
參考圖4及圖5，可在增強層125的兩個表面上形成第一終止元件層121’及第二終止元件層122'，以形成所述剛性層壓板。增強層125可由液態合成樹脂(諸如，環氧樹脂)滲入至纖維增強材料中的複合物製成。 Referring to Figures 4 and 5, a first termination element layer 121' and a second termination element layer 122' may be formed on both surfaces of the reinforcement layer 125 to form the rigid laminate. The reinforcement layer 125 may be made of a composite in which liquid synthetic resin, such as epoxy resin, is infiltrated into fiber reinforcement materials.
參考圖4，可在增強層125的一個表面上形成包括第二終止元件層122’的鍍覆層。第二終止元件層122’形成為較形成有可撓性基底部件F的區域寬。 Referring to FIG. 4, a plating layer including a second termination element layer 122' may be formed on one surface of the reinforcement layer 125. The second termination element layer 122' is formed wider than the area where the flexible base member F is formed.
參考圖5，可在增強層125的另一表面上形成包括第一終止元件層121’的另一鍍覆層。第一終止元件層121’形成為與第二終止元件層122'對應，且形成為較形成有可撓性基底部件F的區域寬。在此，第一終止元件層121’可直接形成於增強層125的另一表面上，或可形成於堆疊在增強層125上的另一表面上的絕緣層上。 Referring to FIG. 5, another plating layer including the first termination element layer 121' may be formed on the other surface of the reinforcement layer 125. The first termination element layer 121' is formed corresponding to the second termination element layer 122', and is formed wider than the area where the flexible base member F is formed. Here, the first termination element layer 121' may be directly formed on the other surface of the reinforcement layer 125, or may be formed on an insulating layer stacked on the other surface of the reinforcement layer 125.
形成第一終止元件層121’及/或第二終止元件層122’的鍍覆層的一部分亦可以是剛性基底部件R1及R2的電路圖案。 A part of the plating layer forming the first termination element layer 121' and/or the second termination element layer 122' may also be the circuit pattern of the rigid base components R1 and R2.
在形成可撓性層壓部件110及剛性層壓部件120的步驟中，可撓性電路層被層壓於剛性層壓板的一個表面上以形成可撓 性層壓部件110，且剛性電路層被層壓於剛性層壓板的另一表面上以形成剛性層壓部件120。 In the step of forming the flexible laminate component 110 and the rigid laminate component 120, the flexible circuit layer is laminated on one surface of the rigid laminate to form a flexible circuit layer. The rigid laminate component 110 is formed, and the rigid circuit layer is laminated on the other surface of the rigid laminate to form the rigid laminate component 120 .
參考圖6，可在剛性層壓板的上面形成有第一終止元件層121’的一個表面上層壓具有可撓性的第一可撓性膜層114。可在第一可撓性膜層114上形成電路圖案以形成可撓性電路層。在此，由可撓性電路層形成的可撓性層壓部件110形成於基底的前表面上，且可撓性層壓部件110的設置於剛性基底部件R1及R2上的部分可以是剛性基底部件R1及R2的一部分。另外，第一可撓性膜層114可包括聚醯亞胺膜層且可藉由黏合層112黏合。 Referring to FIG. 6, a first flexible film layer 114 having flexibility may be laminated on one surface of the rigid laminate on which the first termination element layer 121' is formed. A circuit pattern may be formed on the first flexible film layer 114 to form a flexible circuit layer. Here, the flexible laminated part 110 formed of the flexible circuit layer is formed on the front surface of the base, and the portion of the flexible laminated part 110 provided on the rigid base members R1 and R2 may be a rigid base Part of components R1 and R2. In addition, the first flexible film layer 114 may include a polyimide film layer and may be adhered by the adhesive layer 112 .
可在剛性層壓板的上面形成有第二終止元件層122’的一個表面上層壓諸如環氧樹脂預浸體等剛性絕緣層(較可撓性膜層更具剛性的絕緣層)。剛性基底部件R1及R2的電路圖案可形成在剛性絕緣層上以作為剛性電路層。在此，由於將形成有可撓性基底部件F的區中的剛性絕緣層是待被移除的一部分，因此可不形成電路圖案等。 A rigid insulating layer (an insulating layer that is more rigid than the flexible film layer) such as an epoxy resin prepreg may be laminated on one surface of the rigid laminate on which the second termination element layer 122' is formed. The circuit patterns of the rigid base components R1 and R2 may be formed on the rigid insulating layer as a rigid circuit layer. Here, since the rigid insulating layer in the area where the flexible base member F is to be formed is a part to be removed, a circuit pattern or the like may not be formed.
剛性層壓部件120更可包括第二可撓性膜層127，第二可撓性膜層127被設置成基於增強層125而與第一可撓性膜層114對應。第一可撓性膜層114與第二可撓性膜層127可具有基於設置於這兩者之間的增強層125對稱的結構。此結構允許剛性基底部件R1及R2具有關於中心層對稱的結構，藉此將翹曲最小化。 The rigid laminate component 120 may further include a second flexible film layer 127 disposed to correspond to the first flexible film layer 114 based on the reinforcement layer 125 . The first flexible film layer 114 and the second flexible film layer 127 may have a symmetrical structure based on the reinforcement layer 125 disposed between them. This structure allows the rigid base components R1 and R2 to have a symmetrical structure about the central layer, thereby minimizing warpage.
可在可撓性電路層上另外形成第三終止元件層123，且可另外形成剛性層壓部件130。 A third termination element layer 123 may be additionally formed on the flexible circuit layer, and a rigid laminate component 130 may be additionally formed.
在暴露出可撓性層壓部件110的步驟中，通過第一處理移除剛性層壓部件120直至第二終止元件層122’，且接著通過第二處理移除剛性層壓部件120直至第一終止元件層121’。 In the step of exposing the flexible laminate component 110, the rigid laminate component 120 is removed by a first process up to the second terminating element layer 122', and then the rigid laminate component 120 is removed by a second process up to the first Terminate element layer 121'.
參考圖7，通過第一處理移除位於剛性層壓板的一個表面上的剛性層壓部件120直至第二終止元件層122’。所述第一處理包括雷射處理，且沿著可撓性基底部件F的邊界對剛性層壓部件120進行切割直至第二終止元件層122’。因此，在可撓性基底部件F的區中的剛性層壓部件120被切割並移除直至第二終止元件層122’。第二終止元件層122’是由金屬形成的鍍覆層且形成為較可撓性基底部件F的區域寬，以使得其能夠用作停止雷射處理的終止元件。 Referring to Figure 7, the rigid laminate component 120 on one surface of the rigid laminate is removed by a first process up to the second termination element layer 122'. The first process includes laser processing and cutting the rigid laminate component 120 along the boundaries of the flexible base component F up to the second terminating element layer 122'. Therefore, the rigid laminate component 120 in the area of the flexible base component F is cut and removed up to the second terminating element layer 122'. The second termination element layer 122' is a plating layer formed of metal and is formed wider than the area of the flexible base member F so that it can function as a termination element for stopping the laser process.
在此，藉由雷射處理移除形成於第三終止元件層123’上的剛性電路層。藉由雷射處理沿著可撓性基底部件F的邊界對形成於第三終止元件層123’上的剛性層壓部件130進行切割直至第三終止元件層123'。 Here, the rigid circuit layer formed on the third termination element layer 123' is removed by laser processing. The rigid laminated component 130 formed on the third terminating element layer 123' is cut along the boundary of the flexible base component F up to the third terminating element layer 123' by laser processing.
參考圖8，在進行雷射處理之後，蝕刻第二終止元件層122’的暴露出的部分。可在可撓性基底部件F的區中移除第二終止元件層122’，以使得能夠對可撓性基底部件F的區進行第二處理。由於第二終止元件層122’形成為較可撓性基底部件F大，因此第二終止元件層122’的設置於剛性基底部件R1及R2中的部分保留下來且嵌入於剛性基底部件R1及R2的絕緣層中，且端表面暴露於剛性基底部件R1及R2的切割表面。 Referring to Figure 8, after performing the laser treatment, the exposed portion of the second termination element layer 122' is etched. The second terminating element layer 122' may be removed in the area of the flexible base member F to enable a second treatment of the area of the flexible base member F. Since the second termination element layer 122' is formed larger than the flexible base component F, the portion of the second termination element layer 122' provided in the rigid base components R1 and R2 remains and is embedded in the rigid base components R1 and R2 in the insulating layer, and the end surfaces are exposed to the cut surfaces of the rigid base components R1 and R2.
亦可蝕刻第三終止元件層123’的暴露出的部分。當移除了第三終止元件層123’的暴露出的部分時，會暴露出在第三終止元件層123’下方的可撓性層壓部件110。第三終止元件層123’的在剛性基底部件R1及R2中的部分被保留下來且嵌入於剛性基底部件R1及R2的絕緣層中。第三終止元件層123’的端表面暴露於剛性基底部件R1及R2的切割表面。 The exposed portion of the third termination element layer 123' may also be etched. When the exposed portion of the third termination element layer 123' is removed, the flexible laminate component 110 underneath the third termination element layer 123' is exposed. Portions of the third termination element layer 123' in the rigid base components R1 and R2 are retained and embedded in the insulating layers of the rigid base components R1 and R2. The end surfaces of the third termination element layer 123' are exposed to the cut surfaces of the rigid base members R1 and R2.
參考圖9，藉由第二處理移除剛性層壓部件120直至第一終止元件層121’。所述第二處理包括雷射處理，且沿著可撓性基底部件F的邊界對剛性層壓部件120進行切割直至第一終止元件層121’。亦可對增強層125進行切割。因此，在可撓性基底部件F的區中的剛性層壓部件120被切割並移除直至第一終止元件層121’。第一終止元件層121’是由金屬形成的鍍覆層且形成為較可撓性基底部件F的區域大，以使得其能夠用作停止雷射處理的終止元件。 Referring to Figure 9, the rigid laminate component 120 is removed by a second process up to the first termination element layer 121'. The second process includes a laser process and cuts the rigid laminate component 120 along the boundaries of the flexible base component F up to the first terminating element layer 121'. The reinforcement layer 125 may also be cut. Therefore, the rigid laminate component 120 in the area of the flexible base component F is cut and removed up to the first terminating element layer 121'. The first termination element layer 121' is a plating layer formed of metal and is formed larger than the area of the flexible base member F so that it can be used as a termination element for stopping the laser process.
參考圖10，在進行雷射處理之後，蝕刻第一終止元件層121’的暴露出的部分以暴露出可撓性層壓部件110。由於第一終止元件層121’形成為較可撓性基底部件F大，因此第一終止元件層121’的設置於剛性基底部件R1及R2中的部分被保留下來且嵌入於剛性基底部件R1及R2的絕緣層中。第一終止元件層121’的端表面暴露於剛性基底部件R1及R2的切割表面。 Referring to FIG. 10 , after performing the laser treatment, the exposed portion of the first termination element layer 121′ is etched to expose the flexible laminate component 110 . Since the first termination element layer 121' is formed larger than the flexible base component F, the portion of the first termination element layer 121' provided in the rigid base components R1 and R2 is retained and embedded in the rigid base components R1 and R2. in the insulation layer of R2. The end surfaces of the first termination element layer 121' are exposed to the cut surfaces of the rigid base members R1 and R2.
參考圖11，更可將阻焊劑層129層壓於剛性基底部件的外層上。 Referring to FIG. 11 , a solder resist layer 129 may be laminated on the outer layer of the rigid base component.
如上文所述，根據本發明實施例，藉由在可撓性基底部件F的區域上執行雷射處理兩次來提供在剛性基底部件R1及R2與可撓性基底部件F之間具有大的高度差的剛撓印刷電路板。因此，進一步允許實現要求剛性基底部件R1及R2與可撓性基底部件F之間存在大的高度差的5G通訊天線模組基底。 As mentioned above, according to embodiments of the present invention, a large gap between the rigid base members R1 and R2 and the flexible base member F is provided by performing laser processing twice on the area of the flexible base member F. Rigid-flex printed circuit boards with different heights. Therefore, it is further allowed to realize a 5G communication antenna module substrate that requires a large height difference between the rigid base components R1 and R2 and the flexible base component F.
另外，由於根據本發明的製造方法在層壓絕緣層時不需要預處理部分，因此可將絕緣層的平坦度維持於高的水準上。因此，可執行諸如經修改的半加成製程(MSAP)等方法來實施精細的電路。 In addition, since no preprocessing part is required when laminating the insulating layer according to the manufacturing method of the present invention, the flatness of the insulating layer can be maintained at a high level. Therefore, methods such as modified semi-additive processing (MSAP) can be performed to implement fine circuits.
圖12是說明製造根據本發明的另一實施例的印刷電路板的方法的圖。圖12示出形成可撓性基底部件F的製造方法，所述可撓性基底部件F在圖2中所示的外層上不具有黏合層112。 12 is a diagram illustrating a method of manufacturing a printed circuit board according to another embodiment of the present invention. FIG. 12 illustrates a manufacturing method for forming a flexible base member F without the adhesive layer 112 on the outer layer shown in FIG. 2 .
參考圖12，當將第一可撓性膜層114層壓於第一終止元件層121’上時，可提前移除在可撓性基底部件F中黏合至第一終止元件層121'的黏合層112。因此，在移除第一終止元件層121’之後，黏合層112不可能保留於可撓性基底部件F的最外層上。此外在此種情形中，由於在第二終止元件層122’之後所層壓的剛性層壓部件120由增強層125支撐，因此無論黏合層112被處理與否，絕緣層的平坦度皆可維持於高的水準上。 Referring to FIG. 12 , when the first flexible film layer 114 is laminated on the first termination element layer 121 ′, the adhesive bonded to the first termination element layer 121 ′ in the flexible base member F can be removed in advance. Layer 112. Therefore, after removing the first termination element layer 121', the adhesive layer 112 cannot remain on the outermost layer of the flexible base member F. Furthermore, in this case, since the rigid laminate 120 laminated after the second termination element layer 122' is supported by the reinforcement layer 125, the flatness of the insulating layer can be maintained whether the adhesive layer 112 is processed or not. at a high level.
上文中已通過舉例闡述了本發明的精神，且熟習本發明相關技術者可在不背離本發明的本質特徵的情況下對本發明做出各種修改、改動及替代。因此，本發明中所揭露的示例性實施例 及附圖不是限制而是闡述本發明的精神，且本發明的範疇不受示例性實施例及附圖限制。本發明的範疇應由以下申請專利範圍來解釋，且與以下申請專利範圍等效的所有精神應被解釋為皆在本發明的範疇內。 The spirit of the present invention has been illustrated above through examples, and those skilled in the art may make various modifications, changes and substitutions to the present invention without departing from the essential characteristics of the present invention. Therefore, the exemplary embodiments disclosed in the present invention and the accompanying drawings do not limit but illustrate the spirit of the present invention, and the scope of the present invention is not limited by the exemplary embodiments and the accompanying drawings. The scope of the present invention should be interpreted by the following patent claims, and all spirits equivalent to the following claims should be construed as being within the scope of the present invention.
100:印刷電路板 100:Printed circuit board
110:可撓性層壓部件 110: Flexible laminated components
112:黏合層 112: Adhesive layer
114:第一可撓性膜層 114: First flexible film layer
120:剛性層壓部件 120: Rigid laminated components
120a、120b:側表面 120a, 120b: side surface
121:第一終止元件層/金屬層 121: First termination component layer/metal layer
122:第二終止元件層/金屬層 122: Second termination element layer/metal layer
123:第三終止元件層 123:Third termination component layer
125:增強層 125: Enhancement layer
127:第二可撓性膜層 127: Second flexible film layer
130:剛性層壓部件 130: Rigid laminated components
F:可撓性基底部件 F: Flexible base component
R1:剛性基底部件/第一剛性基底部件 R1: Rigid base member/first rigid base member
R2:剛性基底部件/第二剛性基底部件 R2: Rigid base member/second rigid base member
Claims (11)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2019-0024744 | 2019-03-04 | ||
| KR1020190024744A KR20200106342A (en) | 2019-03-04 | 2019-03-04 | Printed Circuit Board and manufacturing method for the same |
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| Publication Number | Publication Date |
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| TW202034751A TW202034751A (en) | 2020-09-16 |
| TWI832861B true TWI832861B (en) | 2024-02-21 |
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| TW108118293A TWI832861B (en) | 2019-03-04 | 2019-05-27 | Printed circuit board and manufacturing method for the same |
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| JP (1) | JP7463654B2 (en) |
| KR (1) | KR20200106342A (en) |
| TW (1) | TWI832861B (en) |
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- 2019-03-04 KR KR1020190024744A patent/KR20200106342A/en not_active Application Discontinuation
- 2019-05-27 TW TW108118293A patent/TWI832861B/en active
- 2019-06-04 JP JP2019104887A patent/JP7463654B2/en active Active
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| TWI400015B (en) * | 2005-05-13 | 2013-06-21 | Tatsuta Densen Kk | Shielding film, shielded printed circuit board, shielded flexible printed circuit board, method of manufacturing shielding film, and method of manufacturing shielded printed circuit board |
| TWI400013B (en) * | 2008-02-22 | 2013-06-21 | Vishay Intertechnology Inc | Surface mounted chip resistor with flexible leads and manufacturing method thereof |
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Also Published As
| Publication number | Publication date |
|---|---|
| JP7463654B2 (en) | 2024-04-09 |
| KR20200106342A (en) | 2020-09-14 |
| TW202034751A (en) | 2020-09-16 |
| JP2020145395A (en) | 2020-09-10 |
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