TWI811772B - Vapor chamber and working fluid used therefor - Google Patents
Vapor chamber and working fluid used therefor Download PDFInfo
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- TWI811772B TWI811772B TW110131464A TW110131464A TWI811772B TW I811772 B TWI811772 B TW I811772B TW 110131464 A TW110131464 A TW 110131464A TW 110131464 A TW110131464 A TW 110131464A TW I811772 B TWI811772 B TW I811772B
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- 239000012530 fluid Substances 0.000 title claims abstract description 47
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 claims abstract description 62
- 239000007788 liquid Substances 0.000 claims abstract description 23
- 238000009833 condensation Methods 0.000 claims abstract description 10
- 230000005494 condensation Effects 0.000 claims abstract description 10
- 238000001704 evaporation Methods 0.000 claims abstract description 10
- 230000008020 evaporation Effects 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000007789 gas Substances 0.000 claims description 20
- RIQRGMUSBYGDBL-UHFFFAOYSA-N 1,1,1,2,2,3,4,5,5,5-decafluoropentane Chemical compound FC(F)(F)C(F)C(F)C(F)(F)C(F)(F)F RIQRGMUSBYGDBL-UHFFFAOYSA-N 0.000 claims description 18
- 238000005530 etching Methods 0.000 claims description 10
- 238000000034 method Methods 0.000 claims description 6
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 claims 1
- 229930195733 hydrocarbon Natural products 0.000 claims 1
- 150000002430 hydrocarbons Chemical class 0.000 claims 1
- 229910000040 hydrogen fluoride Inorganic materials 0.000 claims 1
- 230000017525 heat dissipation Effects 0.000 description 10
- 238000009835 boiling Methods 0.000 description 9
- 238000012546 transfer Methods 0.000 description 9
- 238000003466 welding Methods 0.000 description 9
- 230000000052 comparative effect Effects 0.000 description 8
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 4
- 238000001816 cooling Methods 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- YGSFNCRAZOCNDJ-UHFFFAOYSA-N propan-2-one Chemical compound CC(C)=O.CC(C)=O YGSFNCRAZOCNDJ-UHFFFAOYSA-N 0.000 description 4
- 229910001220 stainless steel Inorganic materials 0.000 description 4
- 239000010935 stainless steel Substances 0.000 description 4
- 229910052782 aluminium Inorganic materials 0.000 description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 238000002474 experimental method Methods 0.000 description 3
- 239000000835 fiber Substances 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- 229910021529 ammonia Inorganic materials 0.000 description 2
- 238000009529 body temperature measurement Methods 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000012153 distilled water Substances 0.000 description 2
- 239000001257 hydrogen Substances 0.000 description 2
- 229910052739 hydrogen Inorganic materials 0.000 description 2
- 239000008188 pellet Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 238000012790 confirmation Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Diaphragms For Electromechanical Transducers (AREA)
- Fluid-Damping Devices (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)
Abstract
本發明提供一種均熱板及用於該均熱板的工作流體，包括：上板，具有第一結構面；下板，具有第二結構面，所述第二結構面與所述第一結構面相互面對；氣態通道，形成在所述第一結構面及所述第二結構面中的至少一個上，並且形成氣態的工作流體通過熱能從蒸發部向冷凝部流動的通道；以及液態通道，形成在所述第一結構面及所述第二結構面中的至少一個上，並且形成液態的工作流體通過毛細力從所述冷凝部向所述蒸發部移動的通道；其中，所述工作流體包含丙酮和氫氟烴(HydroFluoroCarbon)的混合物。The invention provides a vapor chamber and a working fluid used for the vapor chamber, including: an upper plate having a first structural surface; a lower plate having a second structural surface, and the second structural surface is in contact with the first structural surface. The surfaces face each other; a gas channel is formed on at least one of the first structural surface and the second structural surface, and forms a channel through which the gaseous working fluid flows from the evaporation part to the condensation part through thermal energy; and a liquid channel , is formed on at least one of the first structural surface and the second structural surface, and forms a channel through which the liquid working fluid moves from the condensation part to the evaporation part through capillary force; wherein, the working The fluid contains a mixture of acetone and hydrofluorocarbon (HydroFluoroCarbon).
Description
本發明涉及均熱板及用於該均熱板的工作流體。The present invention relates to vapor chambers and working fluids for use in vapor chambers.
通常，均熱板的導熱性優異，因此可用於各種領域，冷卻諸如電腦CPU的特定位置的發熱部或回收特定熱的情況等。該均熱板由使用金屬材料製成的管狀外殼和容納於外殼內部的工作流體構成。據此，在殼體一側加熱時，工作流體在該加熱部的內部空間中蒸發，蒸發的蒸汽迅速移動到不加熱的另一側冷凝，從而產生將加熱部（蒸發部）的熱以潛熱(latent heat)的形式傳遞於冷凝部的作用。Generally, vapor chambers have excellent thermal conductivity and are therefore used in various fields, such as cooling a heat-generating part at a specific location of a computer CPU or recovering specific heat. The vapor chamber is composed of a tubular casing made of metal material and a working fluid contained inside the casing. According to this, when one side of the housing is heated, the working fluid evaporates in the internal space of the heating part, and the evaporated vapor quickly moves to the other side that is not heated and condenses, thereby converting the heat of the heating part (evaporation part) into latent heat. (Latent heat) is transmitted to the condensation part.
不銹鋼及銅材料的均熱板通常使用潛熱優異並且環保的蒸餾水作為工作流體，但是在鋁的情況下，因為蒸餾水的腐蝕問題而無法使用。Stainless steel and copper vapor chambers usually use distilled water, which has excellent latent heat and is environmentally friendly, as the working fluid. However, in the case of aluminum, it cannot be used because of the corrosion problem of distilled water.
通常在鋁的情況下使用的工作流體係使用氨和丙酮等，但由於毒性和易燃性問題，除了特殊環境條件以外，HFO和HFE系非易燃性工作流體是目前正在商業化使用的。然而，這些非易燃性流體的缺點是蒸發潛熱明顯低於丙酮，因此傳熱效率非常低，需要使用相對大量的流體。The working flow system usually used in the case of aluminum uses ammonia, acetone, etc. However, due to toxicity and flammability issues, except for special environmental conditions, HFO and HFE-based non-flammable working fluids are currently being used commercially. However, the disadvantage of these non-flammable fluids is that the latent heat of vaporization is significantly lower than acetone, so the heat transfer efficiency is very low, requiring the use of relatively large amounts of fluid.
另外，存在如下的問題：相比於使用氨和丙酮的情況，需要將均熱板內部空間增加2~3倍以上才能夠保障最大傳熱。In addition, there is the following problem: compared with the use of ammonia and acetone, the internal space of the vapor chamber needs to be increased by more than 2 to 3 times to ensure maximum heat transfer.
《要解決的問題》"Problems to be Solved"
本發明的一目的在於提供一種均熱板及用於該均熱板的工作流體，以保持丙酮的高熱特性的同時解決易燃性問題，進而更加安全且有效地適用於通用電子設備類和工業領域。 《解決問題的手段》 An object of the present invention is to provide a vapor chamber and a working fluid used for the vapor chamber to maintain the high thermal characteristics of acetone while solving the flammability problem, thereby being more safely and effectively applicable to general electronic equipment and industry field. "Methods to Solve Problems"
用於實現上述目的的本發明一態樣的均熱板可包括：一上板，具有一第一結構面；一下板，具有一第二結構面，所述第二結構面與所述第一結構面相互面對；一氣態通道，形成在所述第一結構面及所述第二結構面中的至少一個上，並且形成氣態的工作流體通過熱能從一蒸發部向一冷凝部流動的通道；以及一液態通道，形成在所述第一結構面及所述第二結構面中的至少一個上，並且形成液態的工作流體通過毛細力從所述冷凝部向所述蒸發部移動的通道，其中，所述工作流體包含丙酮和氫氟烴(HydroFluoroCarbon)的混合物。A vapor chamber of one aspect of the present invention used to achieve the above object may include: an upper plate having a first structural surface; a lower plate having a second structural surface, the second structural surface being in contact with the first structural surface. The structural surfaces face each other; a gaseous channel is formed on at least one of the first structural surface and the second structural surface, and forms a channel for the gaseous working fluid to flow from an evaporation part to a condensation part through thermal energy. ; And a liquid channel is formed on at least one of the first structural surface and the second structural surface, and forms a channel through which the liquid working fluid moves from the condensation part to the evaporation part through capillary force, Wherein, the working fluid contains a mixture of acetone and hydrofluorocarbon (HydroFluoroCarbon).
在此，所述氫氟烴可包含十氟戊烷。Here, the hydrofluorocarbon may include decafluoropentane.
在此，所述工作流體為相對於所述丙酮100重量份可包含17至25重量份的十氟戊烷。Here, the working fluid may contain 17 to 25 parts by weight of decafluoropentane relative to 100 parts by weight of the acetone.
在此，所述氣態通道和所述液態通道中的至少一個可包括通過對所述第一結構面或所述第二結構面執行蝕刻製程而形成的溝槽。Here, at least one of the gas channel and the liquid channel may include a trench formed by performing an etching process on the first structural surface or the second structural surface.
本發明另一態樣的均熱板用工作流體，係作為在均熱板內汽化後重新液化的同時冷卻熱能時使用的工作流體，包含丙酮及氫氟烴(HydroFluoroCarbon)，其中，所述氫氟烴在一個大氣壓狀態下沸點可在50℃至60℃範圍內。A working fluid for a vapor chamber according to another aspect of the present invention is used as a working fluid for cooling thermal energy while re-liquefying after vaporization in the vapor chamber, and contains acetone and hydrofluorocarbon (HydroFluoroCarbon), wherein the hydrogen The boiling point of fluorocarbons can range from 50°C to 60°C at one atmospheric pressure.
在此，所述氫氟烴可包含十氟戊烷。Here, the hydrofluorocarbon may include decafluoropentane.
在此，所述工作流體為相對於所述丙酮100重量份可包含17至25重量份的十氟戊烷。 《發明的效果》 Here, the working fluid may contain 17 to 25 parts by weight of decafluoropentane relative to 100 parts by weight of the acetone. "The Effect of Invention"
根據如上述構成之本發明的均熱板及用於該均熱板的工作流體，在形成於上板與下板之間的液態通道及氣態通道流動的同時傳遞熱的工作流體由丙酮和氫氟烴的混合而成，因此保持丙酮的高熱特性的同時可解決易燃性問題。據此，均熱板可更加安全且有效地使用於通用電子設備類和工業領域。According to the vapor chamber of the present invention configured as described above and the working fluid used for the vapor chamber, the working fluid that transfers heat while flowing through the liquid channel and the gas channel formed between the upper plate and the lower plate is composed of acetone and hydrogen. It is a mixture of fluorocarbons, so it can solve the flammability problem while maintaining the high heat properties of acetone. Accordingly, the vapor chamber can be used more safely and effectively in general electronic equipment and industrial fields.
以下，參照附圖詳細說明本發明較佳實施例的均熱板及用於該均熱板的工作流體。在本說明書中，即使是相互不同的實施例，對於相同及類似的結構賦予相同及類似的元件符號，並且說明也是由最初的說明代替。Hereinafter, the vapor chamber and the working fluid used in the vapor chamber according to the preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings. In this specification, even in mutually different embodiments, the same or similar components are assigned the same or similar reference numerals, and the description is replaced by the original description.
參照圖1，均熱板100大致由上板110和下板130結合而成。Referring to FIG. 1 , the vapor chamber 100 is generally composed of an upper plate 110 and a lower plate 130 .
上板110和下板130分別由直角四邊形形狀的板件構成。例如，可用鋁、不銹鋼、鈦、銅等製作。上板110和下板130是相互層疊結合的，可具有相同的尺寸和形狀。The upper plate 110 and the lower plate 130 are each composed of a right-angled square-shaped plate member. For example, it can be made of aluminum, stainless steel, titanium, copper, etc. The upper plate 110 and the lower plate 130 are stacked and combined with each other, and may have the same size and shape.
在上板110和下板130中相互面對的面分別為第一結構面111和第二結構面131。其中，在至少一個可通過衝壓、蝕刻(etching)等方式形成氣態通道150（參照圖2）。在上板110和下板130中暴露在外部的面可分別稱為第一暴露面112和第二暴露面132。另外，在上板110和下板130的一角落凸出形成注入口形成部113、133。這種注入口形成部113、133在將工作流體注入於氣態通道150等之後被切掉。The surfaces facing each other in the upper plate 110 and the lower plate 130 are the first structural surface 111 and the second structural surface 131 respectively. Among them, the gas channel 150 can be formed in at least one by stamping, etching, etc. (see FIG. 2 ). The surfaces exposed to the outside in the upper plate 110 and the lower plate 130 may be referred to as the first exposed surface 112 and the second exposed surface 132, respectively. In addition, injection port forming portions 113 and 133 are formed to protrude from one corner of the upper plate 110 and the lower plate 130 . Such injection port forming portions 113 and 133 are cut off after the working fluid is injected into the gas passage 150 and the like.
參照圖2，將說明這種均熱板100的具體結構。Referring to Figure 2, the specific structure of this vapor chamber 100 will be described.
參照圖2，為了接合上板110和下板130，沿著第一暴露面112和第二暴露面132的邊緣形成有焊接槽114、134。焊接槽114、134可通過蝕刻上板110和下板130等方式形成。通過對這種焊接槽114、134照射紅外線，上板110和下板130彼此之間可通過焊接接合。通過這種焊接接合，將焊接點和周邊的熱變形最小化來提高焊接性的同時抑制因為熱變形導致上板110及下板130的塑性變形（軟化），使薄片型均熱板100的剛性保持不變，因此相比於以往可保持更大的張力。Referring to FIG. 2 , in order to join the upper plate 110 and the lower plate 130 , welding grooves 114 , 134 are formed along the edges of the first exposed surface 112 and the second exposed surface 132 . The welding grooves 114 and 134 may be formed by etching the upper plate 110 and the lower plate 130 . By irradiating such welding grooves 114 and 134 with infrared rays, the upper plate 110 and the lower plate 130 can be welded to each other. Through this welding joint, the thermal deformation of the welding point and the periphery is minimized to improve weldability, and the plastic deformation (softening) of the upper plate 110 and the lower plate 130 due to thermal deformation is suppressed, thereby improving the rigidity of the sheet-type vapor chamber 100 remains unchanged, thus maintaining greater tension than before.
通過蝕刻第一結構面111和第二結構面131可形成氣態通道150和液態通道170。氣態通道150和液態通道170能夠以相互並列的狀態交替排列。在本實施例中，氣態通道150為四個，液態通道170為在一對氣態通道150之間各配置三個。The gas channel 150 and the liquid channel 170 can be formed by etching the first structural surface 111 and the second structural surface 131 . The gas channels 150 and the liquid channels 170 can be alternately arranged in parallel with each other. In this embodiment, there are four gas channels 150 and three liquid channels 170 are arranged between a pair of gas channels 150 .
氣態通道150是通過對第一結構面111和第二結構面131進行蝕刻而形成的空間。對於第一結構面111和第二結構面131的蝕刻深度可相同。該空間是氣態的工作流體通過熱能從蒸發部EZ（參照圖3）向冷凝部CZ（參照圖3）流動的通道。The gas channel 150 is a space formed by etching the first structural surface 111 and the second structural surface 131 . The etching depths for the first structural surface 111 and the second structural surface 131 may be the same. This space is a passage through which the gaseous working fluid flows from the evaporation part EZ (see FIG. 3 ) to the condensation part CZ (see FIG. 3 ) using thermal energy.
在氣態通道150內可形成有間隔保持凸起115、135。間隔保持凸起115、135在氣態通道150的蝕刻製程中，可由未被蝕刻的部分形成。間隔保持凸起115、135分別形成在上板110或下板130，並且彼此可具有相同的高度。間隔保持凸起115、135限制因為氣態通道150內部的真空而向內部作用的外力導致上板110和下板130向彼此壓縮，以使氣態通道150能夠穩定地保持形狀。在附圖中的間隔保持凸起115、135是概念性表示的，其具體形狀可參照圖3。Spacing retaining protrusions 115, 135 may be formed in the gas channel 150. The spacing-maintaining protrusions 115 and 135 may be formed from unetched portions during the etching process of the gas channel 150 . The spacing retaining protrusions 115 and 135 are formed on the upper plate 110 or the lower plate 130 respectively, and may have the same height as each other. The spacing retaining protrusions 115 and 135 limit the external force acting inward due to the vacuum inside the gas channel 150 causing the upper plate 110 and the lower plate 130 to compress toward each other, so that the gas channel 150 can stably maintain its shape. The spacing-maintaining protrusions 115 and 135 in the drawings are conceptually represented, and their specific shapes can be referred to FIG. 3 .
在氣態通道150中，最外廓通道可稱為外廓散熱通道155。在外廓散熱通道155中氣態的工作流體可有效向外部散發熱能，為了將這種散熱最大化，外廓散熱通道155至少可佔據最外廓通道的一部分。Among the gas channels 150, the outermost channel may be called the outer heat dissipation channel 155. The gaseous working fluid in the outer heat dissipation channel 155 can effectively dissipate heat energy to the outside. In order to maximize this heat dissipation, the outer heat dissipation channel 155 can occupy at least a part of the outermost channel.
液態通道170也是通過蝕刻第一結構面111和第二結構面131而形成的空間。對於液態通道170的情況，蝕刻第一結構面111和第二結構面131的深度也可相同。該空間形成為液態的工作流體通過毛細力從冷凝部CZ返回蒸發部EZ的通道。為使這種毛細力順利產生作用，相比於氣態通道150具有寬度更小的溝槽。通過這種毛細力，液態的工作流體可不受重力影響地移動於溝槽內。在本實施例中，在一個液態通道170形成有二個至五個溝槽。The liquid channel 170 is also a space formed by etching the first structural surface 111 and the second structural surface 131 . In the case of the liquid channel 170 , the etching depths of the first structural surface 111 and the second structural surface 131 may also be the same. This space is formed as a passage for the liquid working fluid to return from the condensation part CZ to the evaporation part EZ by capillary force. In order to allow this capillary force to work smoothly, the grooves 150 have a smaller width than the gas channel 150 . Through this capillary force, the liquid working fluid can move in the groove without being affected by gravity. In this embodiment, two to five grooves are formed in one liquid channel 170 .
圖3舉例實際製作之產品的均熱板100’以說明附加性的結構。Figure 3 illustrates the vapor chamber 100' of the actual manufactured product to illustrate the additional structure.
參照圖3，在上板110和下板130分別為具有四個邊的四邊形時，外廓散熱通道155對於上板110或下板130的四個邊可將最外廓通道全部佔據。據此，液態通道170像島一樣存在於被外廓散熱通道155包圍的區域內。因此，在位於各個邊的外廓散熱通道155可向外部有效散發氣態的工作流體的熱能。Referring to FIG. 3 , when the upper plate 110 and the lower plate 130 are each in a quadrilateral shape with four sides, the outer heat dissipation channel 155 can occupy all the outermost channels on the four sides of the upper plate 110 or the lower plate 130 . Accordingly, the liquid channel 170 exists like an island in the area surrounded by the outer heat dissipation channel 155 . Therefore, the outer heat dissipation channels 155 located on each side can effectively dissipate the thermal energy of the gaseous working fluid to the outside.
在氣態通道150內可具有多個間隔保持凸起115、135。間隔保持凸起115、135大致可具有圓柱形狀、四邊形柱形狀、半球形狀等的形狀。這種間隔保持凸起115、135可單向排列成鋸齒形狀或網格狀。據此，氣態的工作流體不受氣態通道150延伸的方向的限制，而且也能夠以與該方向交叉的方向擴散。另外，間隔保持凸起115、135具有圓柱等的斷續性的形狀，而不是連續延伸的壁，因此相比於形成壁的方式還可確保更多的空間。There may be a plurality of spacer retaining protrusions 115, 135 within the gas channel 150. The space maintaining protrusions 115 and 135 may generally have a shape such as a cylindrical shape, a quadrangular column shape, a hemispherical shape, or the like. The spacing maintaining protrusions 115, 135 may be arranged in a zigzag shape or a grid shape in one direction. According to this, the gaseous working fluid is not limited by the direction in which the gaseous passage 150 extends, and can also diffuse in a direction crossing this direction. In addition, since the spacing retaining protrusions 115 and 135 have an intermittent shape such as a cylinder rather than a continuously extending wall, more space can be secured compared to the method of forming a wall.
與上述不同，液態通道170也可通過吸液芯(wick)形成。參照圖4，吸液芯可具有纖維、燒結芯塊或網格形狀。作為纖維可使用二氧化矽纖維或芳綸纖維。作為網格可使用不銹鋼。不銹鋼也可作為燒結芯塊。Different from the above, the liquid channel 170 may also be formed by a wick. Referring to Figure 4, the absorbent wick may have a fiber, sintered pellet or mesh shape. Silica fibers or aramid fibers can be used as fibers. Stainless steel can be used as the grid. Stainless steel is also available as sintered pellets.
參照圖5至圖8，說明在氣態通道150和液態通道170內流動來散熱的工作流體。Referring to FIGS. 5 to 8 , the working fluid flowing in the gas channel 150 and the liquid channel 170 to dissipate heat will be described.
工作流體是基於丙酮(C 3H 6O)的混合物。對丙酮混合的物質為氫氟烴(HydroFluoroCarbon)。具體地說，在氫氟烴中十氟戊烷(Decafluoropentane, C 5H 2F 10)可與丙酮混合。 The working fluid is a mixture based on acetone (C 3 H 6 O). The substance mixed with acetone is HydroFluoroCarbon. Specifically, among hydrofluorocarbons, decafluoropentane (C 5 H 2 F 10 ) can be mixed with acetone.
選擇十氟戊烷也是考慮了其沸點。較佳為，待與丙酮混合成分與丙酮的沸點相近。這使混合物在預定溫度下一同被汽化，也可一同被液化。具體地說，丙酮的沸點在一個大氣壓狀態下是55至57℃。考慮到這一點，氫氟烴的沸點較佳為在一個大氣壓狀態在50至60℃範圍內。較佳為，氫氟烴的沸點可以是丙酮沸點的5%範圍以內。十氟戊烷的沸點為55℃，符合該標準。Decafluoropentane was also chosen based on its boiling point. Preferably, the boiling point of the component to be mixed with acetone is close to that of acetone. This allows the mixture to be vaporized together at a predetermined temperature, and may also be liquefied together. Specifically, the boiling point of acetone is 55 to 57°C at one atmospheric pressure. Taking this into consideration, the boiling point of hydrofluorocarbon is preferably in the range of 50 to 60°C at atmospheric pressure. Preferably, the boiling point of the hydrofluorocarbon can be within 5% of the boiling point of acetone. The boiling point of decafluoropentane is 55°C, which meets this standard.
作為十氟戊烷，具體地可使用Vertrel XF（以下，也稱為「XF」）。Vertrel XF是由作為美國材料化學公司的Chemours Company製造的特殊溶液。XF最少含有99.9重量%的十氟戊烷，沸點為55℃，表面張力為0.0141 N/m。As decafluoropentane, Vertrel XF (hereinafter, also referred to as "XF") can be used specifically. Vertrel XF is a special solution manufactured by Chemours Company, an American materials chemical company. XF contains a minimum of 99.9% by weight decafluoropentane, has a boiling point of 55°C and a surface tension of 0.0141 N/m.
對於工作流體，丙酮和十氟戊烷的成分比如下。具體地說，相對於丙酮100重量份，混合十氟戊烷17至25重量份。在混合超過26重量份的十氟戊烷的情況下，工作流體可能出現易燃性的問題，對此本發明人已進行了確認。For working fluids, the composition ratios of acetone and decafluoropentane are as follows. Specifically, 17 to 25 parts by weight of decafluoropentane is mixed with 100 parts by weight of acetone. The present inventors have confirmed that when more than 26 parts by weight of decafluoropentane is mixed, a problem of flammability may occur in the working fluid.
對於上述成分比的工作流體的工作特性已通過實驗確認。具體地說，實施例的工作流體是相對於丙酮100重量份混合十氟戊烷20重量份。與此相反地，在比較例中，相對於丙酮100重量份混合十氟戊烷16重量份。The operating characteristics of the working fluid for the above composition ratios have been confirmed experimentally. Specifically, the working fluid of the Example is a mixture of 20 parts by weight of decafluoropentane with respect to 100 parts by weight of acetone. On the other hand, in the comparative example, 16 parts by weight of decafluoropentane was mixed with 100 parts by weight of acetone.
表1及表2顯示將這些分別注入於均熱板內進行散熱實驗的結果。表1是實施例的實驗結果，表2是比較例的實驗結果。如圖5所示，在各個表顯示了在均熱板100”的上板110對應的15個測量點(1至15)的溫度測量值。在此，均熱板100”與上述實施例的均熱板100大致相同，但是與適用對象相對應形成長條形狀。在下表中，自然對流是指均熱板100”處於冷卻扇未工作的狀態下的情況，與此相反地強制對流是指處於冷卻扇工作的環境下的狀態。
表1
參照表1及圖6，在實施例中相比於工作流體只由丙酮本身構成的情況，相對於丙酮100重量份混合XF 20重量份的情況下，得出了在14個點降低溫度的結果。對此，自然對流和強制對流都顯示相同的結果。但是在15號點則與這些點不同，出現溫度上升，這是因為1至14號點的熱有效移動至15號點而升高了溫度。
表2
參照表2及圖7，在比較例中相比於工作流體只由丙酮本身構成的情況，在丙酮100重量份混合XF 16重量份的情況下，得出在15個點測量溫度全部上升的結果。對此，自然對流和強制對流都顯示相同的結果。對於比較例的情況，工作流體在非易燃性方面是較佳的，但是存在熱性能降低了10至15%的問題。Referring to Table 2 and Figure 7, in the comparative example, when 100 parts by weight of acetone was mixed with 16 parts by weight of XF, compared to the case where the working fluid was composed only of acetone itself, the result was that all temperatures measured at 15 points increased. . In this regard, both natural and forced convection show the same results. In the case of the comparative example, the working fluid is better in terms of non-flammability, but there is a problem that the thermal performance is reduced by 10 to 15%.
從以上的實驗中，如圖8所示計算實施例和比較例的最大傳熱量。From the above experiments, the maximum heat transfer amounts of the examples and comparative examples were calculated as shown in FIG. 8 .
最大傳熱量是指在均熱板內部的工作流體蒸發/冷凝的同時能夠將發熱元件的熱傳遞到周圍的最大傳熱量。確認的常用方法是確認熱阻急劇變化的點。熱阻(Thermal Resistance)是用發熱元件和均熱板表面的溫度除以發熱量W的值表示。Maximum heat transfer refers to the maximum amount of heat that can be transferred from the heating element to the surroundings while the working fluid inside the vapor chamber evaporates/condenses. A common method of confirmation is to confirm the point where the thermal resistance changes drastically. Thermal resistance (Thermal Resistance) is expressed by dividing the temperature of the surface of the heating element and the vapor chamber by the value of the heat W.
均熱板的熱阻值幾乎是恆定值，但若輸入熱量過高，工作流體全部汽化全部變為氣體，就會出現熱阻值急劇變化的點。該點表示為乾透點，將之前一階段的值表示為最大傳熱值。The thermal resistance value of the vapor chamber is almost constant, but if the input heat is too high and all the working fluid vaporizes and turns into gas, there will be a point where the thermal resistance value changes sharply. This point is expressed as the dry-out point, and the value of the previous stage is expressed as the maximum heat transfer value.
從圖8中可以看出，丙酮的最大傳熱量最高，是1,500 W/m 2。實施例的最大傳熱量是1,200至1,300 W/m 2水準，相反地確認到比較例的最大傳熱量為降低約50%的700 W/m 2水準。 As can be seen from Figure 8, acetone has the highest maximum heat transfer, which is 1,500 W/m 2 . The maximum heat transfer amount of the Example was on the 1,200 to 1,300 W/m 2 level. On the contrary, it was confirmed that the maximum heat transfer amount of the Comparative Example was about 50% lower than the 700 W/m 2 level.
再者，實施例相比於丙酮本身具有更大的毛細力。實驗結果，丙酮的毛細力高度為300 mm，相反地在實施例測量出350至400 mm。Furthermore, the examples have greater capillary force than acetone itself. As a result of the experiment, the capillary force height of acetone was 300 mm, whereas in the examples, it was measured to be 350 to 400 mm.
如上所述的均熱板不限於在以上說明的實施例的結構和工作方式。所述實施例也可選擇性組合各個實施例的全部或者一部分以實現各種變化。The vapor chamber as described above is not limited to the structure and working mode of the embodiment described above. The described embodiments may also be selectively combined with all or part of each embodiment to achieve various changes.
1〜15:測量點 100,100’,100”:均熱板 110:上板 111:第一結構面 112:第一暴露面 113:注入口形成部 114:焊接槽 115:間隔保持凸起 130:下板 131:第二結構面 132:第二暴露面 133:注入口形成部 134:焊接槽 135:間隔保持凸起 150:氣態通道 155:外廓散熱通道 170:液態通道 EZ:蒸發部 CZ:冷凝部 1~15: Measuring point 100,100’,100”:Vapor chamber 110:On the board 111: First structural plane 112: First exposure 113: Injection port forming part 114:Welding tank 115: The interval remains raised 130: Lower board 131:Second structural plane 132:Second exposure 133: Injection port forming part 134:Welding tank 135: The interval remains raised 150: Gaseous channel 155:Outer heat dissipation channel 170:Liquid channel EZ: evaporation section CZ: condensation section
圖1是本發明一實施例之均熱板的概略的分解立體圖； 圖2是圖1之均熱板的組裝狀態下的具體剖面圖； 圖3是根據圖2之均熱板的一變化例製作的均熱板的分解圖片； 圖4是顯示用於形成液態通道的燈芯種類的圖片； 圖5是根據圖2之均熱板的另一變化例製作的均熱板中的溫度測量位置的相關概念圖； 圖6是顯示在圖5的均熱板注入實施例的工作流體測量的溫度分佈的曲線圖； 圖7是顯示對圖5的均熱板注入比較例的工作流體測量的溫度分佈的曲線圖；以及 圖8是顯示實施例及比較例中根據功率的熱阻的曲線圖。 Figure 1 is a schematic exploded perspective view of a vapor chamber according to an embodiment of the present invention; Figure 2 is a specific cross-sectional view of the vapor chamber in Figure 1 in an assembled state; Figure 3 is an exploded picture of a vapor chamber made according to a variation of the vapor chamber in Figure 2; Figure 4 is a picture showing the types of wicks used to form liquid channels; Figure 5 is a conceptual diagram of the temperature measurement position in the vapor chamber made according to another variation of the vapor chamber in Figure 2; Figure 6 is a graph showing measured temperature distribution of the working fluid in the vapor chamber injection embodiment of Figure 5; Figure 7 is a graph showing the temperature distribution measured for the working fluid of the vapor chamber injection comparative example of Figure 5; and FIG. 8 is a graph showing thermal resistance according to power in Examples and Comparative Examples.
100:均熱板 100:Vapor chamber
110:上板 110:On the board
111:第一結構面 111: First structural plane
112:第一暴露面 112: First exposure
114:焊接槽 114:Welding tank
115:間隔保持凸起 115: The interval remains raised
130:下板 130: Lower board
131:第二結構面 131:Second structural plane
132:第二暴露面 132:Second exposure
134:焊接槽 134:Welding tank
135:間隔保持凸起 135: The interval remains raised
150:氣態通道 150: Gaseous channel
155:外廓散熱通道 155:Outer heat dissipation channel
170:液態通道 170:Liquid channel
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