US20120111541A1 - Plate type heat pipe and heat sink using the same - Google Patents
Plate type heat pipe and heat sink using the same Download PDFInfo
- Publication number
- US20120111541A1 US20120111541A1 US12/977,088 US97708810A US2012111541A1 US 20120111541 A1 US20120111541 A1 US 20120111541A1 US 97708810 A US97708810 A US 97708810A US 2012111541 A1 US2012111541 A1 US 2012111541A1
- Authority
- US
- United States
- Prior art keywords
- heat pipe
- section
- wick structures
- wick
- plate type
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Definitions
- the disclosure relates to heat dissipation and, more particularly, to a plate type heat pipe and a heat sink using the plate type heat pipe.
- a plate type heat pipe with dissipating fins mounted thereon is a common type of heat sink.
- the heat pipe is a hollow tube receiving working fluid therein, and has a wick structure formed on an inner face thereof for drawing back the working fluid.
- the working fluid contained in the heat pipe at a hotter section of the heat pipe vaporizes into vapor.
- the vapor moves to a cooler section of the heat pipe, and releases its latent heat and condenses to fluid again.
- the condensate returns to the hotter section via capillary force provided by the wick structure. Thereafter, the fluid repeatedly vaporizes and condenses to form a circulation system which continually removes the heat generated by the electronic device.
- the plate type heat pipe of the heat sink is prone to deformation when subjected to an inner or an outer pressure during use. For example, internal vapor pressure or accidental impact may distort the heat pipe. Such deformation may result in disengagement of the wick structure from the inner face of the heat pipe, adversely affecting the performance of the heat pipe.
- FIG. 1 is a perspective view of a heat sink in accordance with an embodiment of the disclosure, together with a heat source, the heat sink including a plate type heat pipe in accordance with a first embodiment of the disclosure.
- FIG. 2 is a cross sectional view of the plate type heat pipe of the heat sink of FIG. 1 , taken along line II-II thereof.
- FIG. 3 is a perspective view of a plurality of wick structures of the plate type heat pipe of FIG. 2 .
- FIGS. 4-7 are views similar to FIG. 3 , showing alternative wick structures which can replace the wick structures of FIG. 3 .
- FIG. 8 is an exploded, perspective view of a plate type heat pipe in accordance with a second embodiment of the disclosure.
- FIG. 9 is an exploded, perspective view of a plate type heat pipe in accordance with a third embodiment of the disclosure.
- FIG. 1 shows a heat sink in accordance with an embodiment of the disclosure.
- the heat sink includes a plate type heat pipe 20 , and a fin assembly 10 thermally attached to the heat pipe 20 .
- the heat pipe 20 is elongated. A length of the heat pipe 20 is much greater than a width of the heat pipe 20 , and a height of the heat pipe 20 is much less than the width of the heat pipe 20 .
- the heat pipe 20 includes an evaporating section 21 thermally contacting a heat source 30 , an intermediate section (not labeled), and a condensing section 23 thermally contacting the fin assembly 10 .
- the fin assembly 10 includes a plurality of spaced fins (not labeled).
- the plate type heat pipe 20 includes a sealed, elongated shell 25 , and a plurality of elongated wick structures 26 each disposed on opposite inner faces of the shell 25 .
- the shell 25 includes a substrate 24 , and a cover 22 covering the substrate 24 .
- An edge of the cover 22 hermetically engages an edge of the substrate 24 , thereby forming a vapor chamber 28 between the substrate 24 and the cover 22 .
- a working fluid (not labeled) is filled in the vapor chamber 28 , and can flow from the condensing section 23 to the evaporating section 21 via capillary force provided by the wick structures 26 .
- the wick structures 26 are arranged in the shell 25 in a parallel and spaced manner.
- Each wick structure 26 extends from the condensing section 23 to the evaporating section 21 , and two opposite ends of each wick structure 26 are respectively located at the evaporating section 21 and the condensing section 23 .
- Top and bottom faces of each wick structure 26 respectively contact inner faces of the substrate 24 and the cover 22 of the shell 25 .
- a plurality of channels 280 for vapor flow are formed between the wick structures 26 , each channel 280 extending along the longitudinal direction of the heat pipe 20 .
- the wick structures 26 are made of sintered metal powder or sintered ceramic powder, and have a high strength to support the substrate 24 and the cover 22 of the shell 25 and prevent the shell 25 from deforming.
- the evaporating section 21 of the plate type heat pipe 20 thermally contacts the heat source 30 to absorb heat generated therefrom.
- the working fluid at the evaporating section 21 is heated and vaporized to flow through the channels 280 to the condensing section 23 .
- the vaporized working fluid exchanges heat with the fin assembly 10 at the condensing section 23 and is condensed to liquid.
- the condensed working fluid returns to the evaporating section 21 via the wick structures 26 .
- FIG. 4 shows a plurality of alternative wick structures 26 a , which can replace the above-described wick structures 26 .
- the wick structures 26 a are similar to the wick structures 26 , except for the following. Ends of the wick structures 26 a corresponding to the condensing section of the heat pipe 20 are connected with each other, by sintered metal powder when the wick structures 26 a are made of sintered metal powder, or by sintered ceramic powder when the wick structures 26 a are made of sintered ceramic powder.
- the condensed working fluid can flow from one wick structure 26 a to another.
- FIG. 5 shows a plurality of alternative wick structures 26 b , which can replace the above-described wick structures 26 a .
- the difference between the two wick structures 26 b , 26 a is as follows. Not only are ends of the wick structures 26 b corresponding to the condensing section 23 of the heat pipe 20 connected with each other by sintered metal powder or sintered ceramic powder, but also ends of the wick structures 26 b corresponding to the evaporating section 21 of the heat pipe 20 are connected with each other by sintered metal powder or sintered ceramic powder.
- FIG. 6 shows a plurality of alternative wick structures 26 c , which can replace the above-described wick structures 26 a .
- the wick structures 26 c are similar to the wick structures 26 a , except for the following. Besides being connected with each other by sintered metal powder or sintered ceramic powder, ends of the wick structures 26 c corresponding to the condensing section of the heat pipe 20 define two passages 282 along the width direction of the heat pipe 20 . That is, each of the passages 282 is substantially perpendicular to the channels 280 , and communicates with the channels 280 . Thereby, not only can the condensed working fluid flow from one wick structure 26 c to another, but also the vaporized working fluid can flow from one channel 280 to another to cause heat to be more evenly distributed at the condensing section.
- FIG. 7 shows a plurality of alternative wick structures 26 d , which can replace the above-described wick structures 26 b .
- the wick structures 26 d are similar to the wick structures 26 b , except for the following. Besides being connected with each other by sintered metal powder or sintered ceramic powder, ends of the wick structures 26 d corresponding to each of the evaporating section 21 and the condensing section 23 of the heat pipe 20 define two passages 282 a along the width direction of the heat pipe 20 . That is, each of the passages 282 a is substantially perpendicular to the channels 280 , and communicates with the channels 280 .
- FIG. 8 shows a plate type heat pipe 20 a in accordance with a second embodiment of the disclosure.
- the heat pipe 20 a of the second embodiment is similar to the heat pipe 20 of the first embodiment, except for the following.
- the heat pipe 20 a is bent at an intermediate section thereof, so that an evaporating section 21 a and a condensing section 23 a are respectively located at different levels.
- wick structures 26 e each have a profile similar to a profile of a shell 25 a .
- a middle portion of each wick structure 26 e is curved, such that an end of the wick structure 26 e at the evaporating section 21 a is higher than an end of the wick structure 26 e at the condensing section 23 a.
- FIG. 9 shows a plate type heat pipe 20 b in accordance with a third embodiment of the disclosure.
- the heat pipe 20 b of the third embodiment is similar to the heat pipe 20 of the first embodiment, except for the following.
- the heat pipe 20 a is bent at an intermediate section thereof, so that an evaporating section 21 b and a condensing section 23 b are perpendicular to each other and at the same level.
- wick structures 26 f each have a profile similar to a profile of a shell 25 b .
- a middle portion of each wick structure 26 f is curved, and an end of the wick structure 26 f at the evaporating section 21 b is perpendicular to an end of the wick structure 26 f at the condensing section 23 b.
- the wick structures disposed in the plate type heat pipes 20 , 20 a , 20 b are able to not only provide capillary force acting on the working fluid, but also can support the shells 25 , 25 a , 25 b to prevent the shells 25 , 25 a , 25 b from deforming when subjected to internal vapor pressure or external impact or vibration.
Abstract
Description
- 1. Technical Field
- The disclosure relates to heat dissipation and, more particularly, to a plate type heat pipe and a heat sink using the plate type heat pipe.
- 2. Description of Related Art
- Nowadays, numerous types of heat sinks are used to dissipate heat generated by electronic devices. A plate type heat pipe with dissipating fins mounted thereon is a common type of heat sink. The heat pipe is a hollow tube receiving working fluid therein, and has a wick structure formed on an inner face thereof for drawing back the working fluid. When the heat pipe is maintained in thermal contact with an electronic device, the working fluid contained in the heat pipe at a hotter section of the heat pipe vaporizes into vapor. The vapor moves to a cooler section of the heat pipe, and releases its latent heat and condenses to fluid again. The condensate returns to the hotter section via capillary force provided by the wick structure. Thereafter, the fluid repeatedly vaporizes and condenses to form a circulation system which continually removes the heat generated by the electronic device.
- However, the plate type heat pipe of the heat sink is prone to deformation when subjected to an inner or an outer pressure during use. For example, internal vapor pressure or accidental impact may distort the heat pipe. Such deformation may result in disengagement of the wick structure from the inner face of the heat pipe, adversely affecting the performance of the heat pipe.
- What is needed, therefore, is a plate type heat pipe and a heat sink using the plate type heat pipe which can overcome the limitations described.
- Many aspects of the present embodiments can be better understood with reference to the following drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, like reference numerals designate corresponding parts throughout the several views, and all the views are schematic.
-
FIG. 1 is a perspective view of a heat sink in accordance with an embodiment of the disclosure, together with a heat source, the heat sink including a plate type heat pipe in accordance with a first embodiment of the disclosure. -
FIG. 2 is a cross sectional view of the plate type heat pipe of the heat sink ofFIG. 1 , taken along line II-II thereof. -
FIG. 3 is a perspective view of a plurality of wick structures of the plate type heat pipe ofFIG. 2 . -
FIGS. 4-7 are views similar toFIG. 3 , showing alternative wick structures which can replace the wick structures ofFIG. 3 . -
FIG. 8 is an exploded, perspective view of a plate type heat pipe in accordance with a second embodiment of the disclosure. -
FIG. 9 is an exploded, perspective view of a plate type heat pipe in accordance with a third embodiment of the disclosure. -
FIG. 1 shows a heat sink in accordance with an embodiment of the disclosure. The heat sink includes a platetype heat pipe 20, and afin assembly 10 thermally attached to theheat pipe 20. Theheat pipe 20 is elongated. A length of theheat pipe 20 is much greater than a width of theheat pipe 20, and a height of theheat pipe 20 is much less than the width of theheat pipe 20. Along a longitudinal direction of theheat pipe 20, theheat pipe 20 includes anevaporating section 21 thermally contacting aheat source 30, an intermediate section (not labeled), and acondensing section 23 thermally contacting thefin assembly 10. Thefin assembly 10 includes a plurality of spaced fins (not labeled). - Also referring to
FIGS. 2-3 , the platetype heat pipe 20 includes a sealed,elongated shell 25, and a plurality ofelongated wick structures 26 each disposed on opposite inner faces of theshell 25. Theshell 25 includes asubstrate 24, and acover 22 covering thesubstrate 24. An edge of thecover 22 hermetically engages an edge of thesubstrate 24, thereby forming avapor chamber 28 between thesubstrate 24 and thecover 22. A working fluid (not labeled) is filled in thevapor chamber 28, and can flow from thecondensing section 23 to the evaporatingsection 21 via capillary force provided by thewick structures 26. Thewick structures 26 are arranged in theshell 25 in a parallel and spaced manner. Eachwick structure 26 extends from thecondensing section 23 to theevaporating section 21, and two opposite ends of eachwick structure 26 are respectively located at theevaporating section 21 and thecondensing section 23. Top and bottom faces of eachwick structure 26 respectively contact inner faces of thesubstrate 24 and thecover 22 of theshell 25. Thereby, a plurality ofchannels 280 for vapor flow are formed between thewick structures 26, eachchannel 280 extending along the longitudinal direction of theheat pipe 20. Thewick structures 26 are made of sintered metal powder or sintered ceramic powder, and have a high strength to support thesubstrate 24 and thecover 22 of theshell 25 and prevent theshell 25 from deforming. - In use, the
evaporating section 21 of the platetype heat pipe 20 thermally contacts theheat source 30 to absorb heat generated therefrom. The working fluid at the evaporatingsection 21 is heated and vaporized to flow through thechannels 280 to thecondensing section 23. The vaporized working fluid exchanges heat with thefin assembly 10 at thecondensing section 23 and is condensed to liquid. The condensed working fluid returns to the evaporatingsection 21 via thewick structures 26. -
FIG. 4 shows a plurality ofalternative wick structures 26 a, which can replace the above-describedwick structures 26. Thewick structures 26 a are similar to thewick structures 26, except for the following. Ends of thewick structures 26 a corresponding to the condensing section of theheat pipe 20 are connected with each other, by sintered metal powder when thewick structures 26 a are made of sintered metal powder, or by sintered ceramic powder when thewick structures 26 a are made of sintered ceramic powder. Thus, the condensed working fluid can flow from onewick structure 26 a to another. -
FIG. 5 shows a plurality ofalternative wick structures 26 b, which can replace the above-describedwick structures 26 a. The difference between the twowick structures wick structures 26 b corresponding to thecondensing section 23 of theheat pipe 20 connected with each other by sintered metal powder or sintered ceramic powder, but also ends of thewick structures 26 b corresponding to theevaporating section 21 of theheat pipe 20 are connected with each other by sintered metal powder or sintered ceramic powder. -
FIG. 6 shows a plurality ofalternative wick structures 26 c, which can replace the above-describedwick structures 26 a. Thewick structures 26 c are similar to thewick structures 26 a, except for the following. Besides being connected with each other by sintered metal powder or sintered ceramic powder, ends of thewick structures 26 c corresponding to the condensing section of theheat pipe 20 define twopassages 282 along the width direction of theheat pipe 20. That is, each of thepassages 282 is substantially perpendicular to thechannels 280, and communicates with thechannels 280. Thereby, not only can the condensed working fluid flow from onewick structure 26 c to another, but also the vaporized working fluid can flow from onechannel 280 to another to cause heat to be more evenly distributed at the condensing section. -
FIG. 7 shows a plurality ofalternative wick structures 26 d, which can replace the above-describedwick structures 26 b. Thewick structures 26 d are similar to thewick structures 26 b, except for the following. Besides being connected with each other by sintered metal powder or sintered ceramic powder, ends of thewick structures 26 d corresponding to each of theevaporating section 21 and thecondensing section 23 of theheat pipe 20 define two passages 282 a along the width direction of theheat pipe 20. That is, each of the passages 282 a is substantially perpendicular to thechannels 280, and communicates with thechannels 280. -
FIG. 8 shows a platetype heat pipe 20 a in accordance with a second embodiment of the disclosure. Theheat pipe 20 a of the second embodiment is similar to theheat pipe 20 of the first embodiment, except for the following. Theheat pipe 20 a is bent at an intermediate section thereof, so that an evaporatingsection 21 a and a condensingsection 23 a are respectively located at different levels. In this embodiment,wick structures 26 e each have a profile similar to a profile of ashell 25 a. A middle portion of eachwick structure 26 e is curved, such that an end of thewick structure 26 e at the evaporatingsection 21 a is higher than an end of thewick structure 26 e at the condensingsection 23 a. -
FIG. 9 shows a platetype heat pipe 20 b in accordance with a third embodiment of the disclosure. Theheat pipe 20 b of the third embodiment is similar to theheat pipe 20 of the first embodiment, except for the following. Theheat pipe 20 a is bent at an intermediate section thereof, so that an evaporatingsection 21 b and a condensingsection 23 b are perpendicular to each other and at the same level. In this embodiment,wick structures 26 f each have a profile similar to a profile of ashell 25 b. A middle portion of eachwick structure 26 f is curved, and an end of thewick structure 26 f at the evaporatingsection 21 b is perpendicular to an end of thewick structure 26 f at the condensingsection 23 b. - According to the disclosure, the wick structures disposed in the plate
type heat pipes shells shells - It is believed that the disclosure and its advantages will be understood from the foregoing description, and it will be apparent that various changes may be made thereto without departing from the spirit and scope of the invention or sacrificing all of its material advantages, the examples hereinbefore described merely being preferred or exemplary embodiments of the invention.
Claims (20)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105381463A CN102469744A (en) | 2010-11-09 | 2010-11-09 | Flat plate type heat pipe |
CN201010538146.3 | 2010-11-09 |
Publications (1)
Publication Number | Publication Date |
---|---|
US20120111541A1 true US20120111541A1 (en) | 2012-05-10 |
Family
ID=46018506
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
US12/977,088 Abandoned US20120111541A1 (en) | 2010-11-09 | 2010-12-23 | Plate type heat pipe and heat sink using the same |
Country Status (2)
Country | Link |
---|---|
US (1) | US20120111541A1 (en) |
CN (1) | CN102469744A (en) |
Cited By (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120175084A1 (en) * | 2011-01-09 | 2012-07-12 | Chin-Hsing Horng | Heat pipe with a radial flow shunt design |
US20130233518A1 (en) * | 2012-03-12 | 2013-09-12 | Cooler Master Co., Ltd. | Flat heap pipe structure |
US20140165401A1 (en) * | 2011-06-07 | 2014-06-19 | Asia Vital Components Co., Ltd. | Thin heat pipe structure and manufacturing method thereof |
US20160131436A1 (en) * | 2014-11-12 | 2016-05-12 | Asia Vital Components Co., Ltd. | Heat pipe structure |
CN105592664A (en) * | 2014-10-23 | 2016-05-18 | 奇鋐科技股份有限公司 | Heat tube structure |
US20160223267A1 (en) * | 2015-02-02 | 2016-08-04 | Asia Vital Components Co., Ltd. | Flat-plate heat pipe structure |
US20170350657A1 (en) * | 2016-06-02 | 2017-12-07 | Tai-Sol Electronics Co., Ltd. | Heat spreader with a liquid-vapor separation structure |
US20190204018A1 (en) * | 2018-01-03 | 2019-07-04 | Asia Vital Components Co., Ltd. | Anti-pressure structure of heat dissipation device |
CN109982550A (en) * | 2019-04-01 | 2019-07-05 | Oppo广东移动通信有限公司 | The manufacturing method of heat sink, radiating subassembly, electronic device and heat sink |
CN110012643A (en) * | 2019-04-04 | 2019-07-12 | Oppo广东移动通信有限公司 | Radiating subassembly, preparation method and electronic equipment |
US10408509B2 (en) * | 2013-09-13 | 2019-09-10 | Denso Corporation | Adsorber |
CN110234212A (en) * | 2019-04-01 | 2019-09-13 | Oppo广东移动通信有限公司 | The preparation method of heat sink, radiating subassembly, electronic device and heat sink |
US20190339021A1 (en) * | 2018-05-04 | 2019-11-07 | Tai-Sol Electronics Co., Ltd. | Joint vapor chamber assembly with vapor chambers connected by extension wick layer |
JP2020008275A (en) * | 2018-06-29 | 2020-01-16 | 大日本印刷株式会社 | Vapor chamber and electronic apparatus |
US11131511B2 (en) | 2018-05-29 | 2021-09-28 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
JPWO2022107479A1 (en) * | 2020-11-19 | 2022-05-27 | ||
US11454454B2 (en) | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103846366A (en) * | 2012-11-30 | 2014-06-11 | 象水国际股份有限公司 | Uniform-temperature plate and method for manufacturing same |
CN107979962B (en) * | 2018-01-09 | 2024-02-20 | 无锡巨日电子科技有限公司 | Water-cooled circuit board heat abstractor |
CN114894016B (en) * | 2022-04-29 | 2023-09-15 | 广州大学 | Metal wire array wick unidirectional heat pipe and manufacturing method thereof |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427174A (en) * | 1993-04-30 | 1995-06-27 | Heat Transfer Devices, Inc. | Method and apparatus for a self contained heat exchanger |
US7100680B2 (en) * | 1999-05-12 | 2006-09-05 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US20070163755A1 (en) * | 2003-12-16 | 2007-07-19 | Hyun-Tae Kim | Flat plate heat transfer device and method for manufacturing the same |
US7278469B2 (en) * | 2002-05-08 | 2007-10-09 | The Furukawa Electric Co., Ltd. | Thin sheet type heat pipe |
US20070267179A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick and method of making the same |
-
2010
- 2010-11-09 CN CN2010105381463A patent/CN102469744A/en active Pending
- 2010-12-23 US US12/977,088 patent/US20120111541A1/en not_active Abandoned
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5427174A (en) * | 1993-04-30 | 1995-06-27 | Heat Transfer Devices, Inc. | Method and apparatus for a self contained heat exchanger |
US7100680B2 (en) * | 1999-05-12 | 2006-09-05 | Thermal Corp. | Integrated circuit heat pipe heat spreader with through mounting holes |
US7278469B2 (en) * | 2002-05-08 | 2007-10-09 | The Furukawa Electric Co., Ltd. | Thin sheet type heat pipe |
US20070163755A1 (en) * | 2003-12-16 | 2007-07-19 | Hyun-Tae Kim | Flat plate heat transfer device and method for manufacturing the same |
US20070267179A1 (en) * | 2006-05-19 | 2007-11-22 | Foxconn Technology Co., Ltd. | Heat pipe with composite capillary wick and method of making the same |
Cited By (27)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20120175084A1 (en) * | 2011-01-09 | 2012-07-12 | Chin-Hsing Horng | Heat pipe with a radial flow shunt design |
US9802240B2 (en) * | 2011-06-07 | 2017-10-31 | Asia Vital Components Co., Ltd. | Thin heat pipe structure and manufacturing method thereof |
US20140165401A1 (en) * | 2011-06-07 | 2014-06-19 | Asia Vital Components Co., Ltd. | Thin heat pipe structure and manufacturing method thereof |
US20130233518A1 (en) * | 2012-03-12 | 2013-09-12 | Cooler Master Co., Ltd. | Flat heap pipe structure |
US11454454B2 (en) | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
US10598442B2 (en) * | 2012-03-12 | 2020-03-24 | Cooler Master Development Corporation | Flat heat pipe structure |
US10408509B2 (en) * | 2013-09-13 | 2019-09-10 | Denso Corporation | Adsorber |
CN105592664A (en) * | 2014-10-23 | 2016-05-18 | 奇鋐科技股份有限公司 | Heat tube structure |
US10082340B2 (en) * | 2014-11-12 | 2018-09-25 | Asia Vital Components Co., Ltd. | Heat pipe structure |
US20160131436A1 (en) * | 2014-11-12 | 2016-05-12 | Asia Vital Components Co., Ltd. | Heat pipe structure |
US20160223267A1 (en) * | 2015-02-02 | 2016-08-04 | Asia Vital Components Co., Ltd. | Flat-plate heat pipe structure |
US20170350657A1 (en) * | 2016-06-02 | 2017-12-07 | Tai-Sol Electronics Co., Ltd. | Heat spreader with a liquid-vapor separation structure |
US10739082B2 (en) * | 2018-01-03 | 2020-08-11 | Asia Vital Components Co., Ltd. | Anti-pressure structure of heat dissipation device |
US20190204018A1 (en) * | 2018-01-03 | 2019-07-04 | Asia Vital Components Co., Ltd. | Anti-pressure structure of heat dissipation device |
US20190339021A1 (en) * | 2018-05-04 | 2019-11-07 | Tai-Sol Electronics Co., Ltd. | Joint vapor chamber assembly with vapor chambers connected by extension wick layer |
US11680752B2 (en) | 2018-05-29 | 2023-06-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11131511B2 (en) | 2018-05-29 | 2021-09-28 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
US11448470B2 (en) | 2018-05-29 | 2022-09-20 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
JP2020008275A (en) * | 2018-06-29 | 2020-01-16 | 大日本印刷株式会社 | Vapor chamber and electronic apparatus |
JP7434735B2 (en) | 2018-06-29 | 2024-02-21 | 大日本印刷株式会社 | vapor chamber, electronic equipment |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
CN109982550A (en) * | 2019-04-01 | 2019-07-05 | Oppo广东移动通信有限公司 | The manufacturing method of heat sink, radiating subassembly, electronic device and heat sink |
CN110234212A (en) * | 2019-04-01 | 2019-09-13 | Oppo广东移动通信有限公司 | The preparation method of heat sink, radiating subassembly, electronic device and heat sink |
CN110012643A (en) * | 2019-04-04 | 2019-07-12 | Oppo广东移动通信有限公司 | Radiating subassembly, preparation method and electronic equipment |
JPWO2022107479A1 (en) * | 2020-11-19 | 2022-05-27 | ||
JP7222448B2 (en) | 2020-11-19 | 2023-02-15 | 株式会社村田製作所 | heat spreading device |
WO2022107479A1 (en) * | 2020-11-19 | 2022-05-27 | 株式会社村田製作所 | Heat spreading device |
Also Published As
Publication number | Publication date |
---|---|
CN102469744A (en) | 2012-05-23 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20120111541A1 (en) | Plate type heat pipe and heat sink using the same | |
US8316921B2 (en) | Plate type heat pipe and heat sink using the same | |
US10077945B2 (en) | Heat dissipation device | |
US7484553B2 (en) | Heat pipe incorporating outer and inner pipes | |
US10119766B2 (en) | Heat dissipation device | |
US20100139894A1 (en) | Heat sink with vapor chamber | |
US7331379B2 (en) | Heat dissipation device with heat pipe | |
TWI722736B (en) | Heat sink | |
US8377214B2 (en) | Vapor chamber and method for manufacturing the same | |
US9721869B2 (en) | Heat sink structure with heat exchange mechanism | |
US8459340B2 (en) | Flat heat pipe with vapor channel | |
US20070107878A1 (en) | Heat pipe with a tube therein | |
US7451806B2 (en) | Heat dissipation device with heat pipes | |
US20070000646A1 (en) | Heat dissipation device with heat pipe | |
US20080093052A1 (en) | Heat dissipation device with heat pipes | |
US20090151906A1 (en) | Heat sink with vapor chamber | |
US10451355B2 (en) | Heat dissipation element | |
US20070051498A1 (en) | Heat dissipation device with a heat pipe | |
KR20080025365A (en) | Heat transfer device | |
US7537046B2 (en) | Heat dissipation device with heat pipe | |
US9273909B2 (en) | Heat pipe structure, and thermal module and electronic device using same | |
TW201947180A (en) | Loop vapor chamber conducive to separation of liquid and gas | |
US20130233520A1 (en) | Flat heat pipe | |
JP2006284020A (en) | Heat pipe | |
US20080314554A1 (en) | Heat dissipation device with a heat pipe |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
AS | Assignment |
Owner name: FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD., Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YAN, QING-PING;WANG, DE-YU;HU, JIANG-JUN;REEL/FRAME:025565/0436 Effective date: 20101220 Owner name: FOXCONN TECHNOLOGY CO., LTD., TAIWAN Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:YAN, QING-PING;WANG, DE-YU;HU, JIANG-JUN;REEL/FRAME:025565/0436 Effective date: 20101220 |
|
STCB | Information on status: application discontinuation |
Free format text: ABANDONED -- FAILURE TO RESPOND TO AN OFFICE ACTION |