TW201947180A - Loop vapor chamber conducive to separation of liquid and gas - Google Patents

Loop vapor chamber conducive to separation of liquid and gas Download PDF

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Publication number
TW201947180A
TW201947180A TW107115225A TW107115225A TW201947180A TW 201947180 A TW201947180 A TW 201947180A TW 107115225 A TW107115225 A TW 107115225A TW 107115225 A TW107115225 A TW 107115225A TW 201947180 A TW201947180 A TW 201947180A
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Taiwan
Prior art keywords
groove
extension
capillary
capillary layer
liquid
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TW107115225A
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Chinese (zh)
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曾惓祺
廖文靖
崔明全
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泰碩電子股份有限公司
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Priority to TW107115225A priority Critical patent/TW201947180A/en
Priority to JP2018129062A priority patent/JP2019194514A/en
Priority to US16/042,134 priority patent/US20190339020A1/en
Publication of TW201947180A publication Critical patent/TW201947180A/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure

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  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Separating Particles In Gases By Inertia (AREA)

Abstract

A loop vapor chamber conducive to separation of liquid and gas includes a base, an upper lid, a wick structure and a working fluid. The base includes a first recess, a second recess, a first extension channel and a second extension channel. The first recess and the second recess are in communication with each other through the first extension channel and the second extension channel. The upper lid is coupled to the base. The first recess, the second recess, the first extension channel and the second extension channel together form a closed space. The wick structure is disposed in the closed space and thus corresponds in position to the first recess, the second recess and the first extension channel.

Description

液、汽分離之迴路均溫板Liquid and steam separation circuit equalizing plate

本發明係與均溫板(Vapor Chamber)有關，特別是指一種液、汽分離之迴路均溫板。The invention relates to a temperature equalizing plate (Vapor Chamber), in particular to a circuit temperature equalizing plate for liquid and vapor separation.

按，目前習知的迴路型均溫板，請參閱美國第US 2016/0128234A1號專利，該專利主要係揭露一種冷卻裝置與電子設備，其主要係以二均溫板的其一板作為受熱板，另一板作為散熱板，並藉由一汽管及一液管將受熱板與散熱板二板相連接，形成一個液汽分離的迴路均溫板，此種習用迴路均溫板將汽管與液管連接於二板的方式，是以焊接的方式進行加工。According to the current conventional circuit type temperature equalizing plate, please refer to US Patent No. US 2016 / 0128234A1. This patent mainly discloses a cooling device and electronic equipment, which mainly uses one of the two temperature equalizing plates as a heating plate The other plate is used as a heat sink, and the heat receiving plate and the heat sink are connected by a steam pipe and a liquid pipe to form a liquid-vapor-separated circuit temperature equalizing plate. This conventional circuit temperature equalizing plate connects the steam tube and the The method of connecting the liquid pipe to the second plate is processed by welding.

然而，藉由焊接加工會有產品良率下降的問題，而且焊接處的結構也較為脆弱，因此，焊接處容易受到碰撞或長時間的使用下而發生損壞，進而減少產品的使用壽命。However, there is a problem that the product yield is reduced by welding processing, and the structure of the welding place is also relatively fragile. Therefore, the welding place is easily damaged by collision or prolonged use, thereby reducing the service life of the product.

因此，本申請人認為，若能減少焊接加工，能夠有效提升產品良率。Therefore, the applicant believes that if the welding process can be reduced, the product yield can be effectively improved.

以及，若能減少焊接加工，能夠有效提升連接處的強度，進而延長產品的使用壽命。And, if the welding process can be reduced, the strength of the connection can be effectively improved, thereby extending the service life of the product.

本發明之主要目的乃在於提供一種液、汽分離之迴路均溫板，其可減少焊接加工，使得產品良率提升。The main purpose of the present invention is to provide a circuit temperature equalizing plate for liquid and vapor separation, which can reduce welding processing and improve product yield.

本發明之另一主要目的在於提供一種液、汽分離之迴路均溫板，其可減少焊接加工，能夠延長產品的使用壽命。Another main object of the present invention is to provide a circuit temperature equalizing plate for liquid and vapor separation, which can reduce welding processing and prolong the service life of the product.

為了達成上述之目的，本發明提供之一種液、汽分離之迴路均溫板，包含有：一底座，形成有一第一凹槽、一第二凹槽、一第一延伸槽以及一第二延伸槽，該第一凹槽與該第二凹槽藉由該第一延伸槽以及該第二延伸槽相連通；一上蓋，結合該底座，並於該第一凹槽、該第二凹槽、該第一延伸槽以及該第二延伸槽形成一密閉空間；一毛細結構，位於該密閉空間，而對應於該第一凹槽、該第二凹槽及該第一延伸槽；以及一作動液，填充於該密閉空間且涵容於該毛細結構內。In order to achieve the above object, the present invention provides a liquid-vapor separation circuit temperature equalizing plate, which includes: a base formed with a first groove, a second groove, a first extension groove, and a second extension Groove, the first groove and the second groove communicate with each other through the first extension groove and the second extension groove; an upper cover is combined with the base, and the first groove, the second groove, The first extension groove and the second extension groove form a closed space; a capillary structure is located in the closed space and corresponds to the first groove, the second groove, and the first extension groove; and an actuating fluid , Filled in the closed space and contained in the capillary structure.

藉此，本發明之一種液、汽分離之迴路均溫板，其可減少焊接加工，能夠有效提升產品良率。Therefore, a liquid-vapor separation circuit temperature equalizing plate of the present invention can reduce welding processing and can effectively improve product yield.

另外，本發明之一種液、汽分離之迴路均溫板，其可減少焊接加工，能有效提升產品連接處的強度，進而延長產品的使用壽命。In addition, the liquid-vapor separation circuit temperature equalizing plate of the present invention can reduce welding processing, can effectively improve the strength of the product connection, and then prolong the service life of the product.

為了詳細說明本發明之技術特點所在，茲舉以下之第一實施例並配合圖式說明如後，其中：In order to explain the technical features of the present invention in detail, the following first embodiment is described below with reference to the drawings, wherein:

如第1圖至第4圖所示，本發明之第一實施例提供之一種液、汽分離之迴路均溫板10，主要由一底座11、一上蓋21、一毛細結構31以及一作動液所組成(作動液乃所屬技術領域通常知識者習知技術，故不顯示於各圖中)，其中：As shown in FIGS. 1 to 4, a liquid-vapor separation circuit temperature isolating plate 10 provided by the first embodiment of the present invention is mainly composed of a base 11, an upper cover 21, a capillary structure 31, and an operating fluid. The composition (action fluid is a technique commonly known to those skilled in the art, so it is not shown in each figure), where:

該底座11，形成有一第一凹槽13、一第二凹槽15、一第一延伸槽17以及一第二延伸槽19，該第一凹槽13與該第二凹槽15藉由該第一延伸槽17以及該第二延伸槽19相連通。於本實施例中，請參閱如第1圖至第4圖所示，該第一延伸槽17與該第二延伸槽19之間相隔一第一預定距離，並且分別於該第一凹槽13、該第二凹槽15之周緣依序定義一第一邊131、一第二邊133、一第三邊135及一第四邊137；該第一延伸槽17係連接於該第一凹槽13之第三邊135及該第二凹槽15之第一邊131，而該第二延伸槽19係連接於該第一凹槽13之第三邊135及該第二凹槽15之第一邊131。The base 11 is formed with a first groove 13, a second groove 15, a first extension groove 17 and a second extension groove 19. The first groove 13 and the second groove 15 pass through the first groove 13. An extension groove 17 and the second extension groove 19 communicate with each other. In this embodiment, as shown in FIG. 1 to FIG. 4, the first extension groove 17 and the second extension groove 19 are separated by a first predetermined distance, and are respectively located in the first groove 13. The peripheral edge of the second groove 15 sequentially defines a first side 131, a second side 133, a third side 135, and a fourth side 137. The first extension groove 17 is connected to the first groove. The third side 135 of 13 and the first side 131 of the second groove 15, and the second extension groove 19 is connected to the third side 135 of the first groove 13 and the first side of the second groove 15. Edge 131.

該上蓋21，結合該底座11，並於該第一凹槽13、該第二凹槽15、該第一延伸槽17以及該第二延伸槽19形成一密閉空間18。於本實施例中，該第一凹槽13、該第二凹槽15、該第一延伸槽17及該第二延伸槽19之底面，係形成於同一水平面，該上蓋21係呈平板狀，且係對應該第一凹槽13、該第二凹槽15、該第一延伸槽17及該第二延伸槽19之輪廓所設置。The upper cover 21 is combined with the base 11, and forms a closed space 18 in the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19. In this embodiment, the bottom surfaces of the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19 are formed on the same horizontal plane, and the upper cover 21 is flat. It is arranged corresponding to the contours of the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19.

該毛細結構31，於本實施例中，該毛細結構31包含一第一毛細層32、一第二毛細層34、一第三毛細層36、一第四毛細層38及一毛細體39。The capillary structure 31 includes a first capillary layer 32, a second capillary layer 34, a third capillary layer 36, a fourth capillary layer 38, and a capillary body 39 in this embodiment.

該第一毛細層32，係由銅粉燒結而成，該第一毛細層32形成於該上蓋21，且位於該上蓋21所面對該第一凹槽13之區域，且該第一毛細層32不影響該第一凹槽13、該第一延伸槽17及該第二延伸槽19之間的連通。The first capillary layer 32 is sintered from copper powder. The first capillary layer 32 is formed on the upper cover 21 and is located in an area of the upper cover 21 facing the first groove 13. 32 does not affect the communication between the first groove 13, the first extension groove 17, and the second extension groove 19.

該第二毛細層34，係由銅粉燒結而成，該第二毛細層34形成於該上蓋21，並位於該上蓋21所面對該第二凹槽15之區域，且該第二毛細層34不影響該第二凹槽15、該第一延伸槽17及該第二延伸槽19之間的連通。The second capillary layer 34 is sintered from copper powder. The second capillary layer 34 is formed on the upper cover 21 and is located in an area where the upper cover 21 faces the second groove 15. 34 does not affect the communication between the second groove 15, the first extension groove 17, and the second extension groove 19.

該第三毛細層36，係由銅粉燒結而成，該第三毛細層36形成於該底座11，並位於該第一凹槽13內，且該第三毛細層36不影響該第一凹槽13、該第一延伸槽17及該第二延伸槽19之間的連通。The third capillary layer 36 is sintered from copper powder. The third capillary layer 36 is formed on the base 11 and is located in the first groove 13. The third capillary layer 36 does not affect the first recess. The communication between the groove 13, the first extension groove 17, and the second extension groove 19.

該第四毛細層38，係由銅粉燒結而成，該第四毛細層38形成於該底座11，並位該第二凹槽15內，且該第四毛細層38不影響該第二凹槽15、該第一延伸槽17及該第二延伸槽19之間的連通。The fourth capillary layer 38 is sintered from copper powder. The fourth capillary layer 38 is formed on the base 11 and is positioned in the second groove 15. The fourth capillary layer 38 does not affect the second recess. The communication between the groove 15, the first extension groove 17 and the second extension groove 19 is established.

該毛細體39，設於該第一延伸槽17並填滿該第一延伸槽17，且與該第一、二、三、四毛細層32、34、36、38有接觸。於本實施例中，該毛細體39係以銅粉燒結而成，該毛細體39係延伸於該第一凹槽13及該第二凹槽15內，藉此增加該毛細體39接觸該第一、二、三、四毛細層32、34、36、38的面積，進而增加該作動液的傳輸量，可以提升散熱效率。The capillary body 39 is disposed in the first extension groove 17 and fills the first extension groove 17, and is in contact with the first, second, third, and fourth capillary layers 32, 34, 36, and 38. In this embodiment, the capillary body 39 is sintered with copper powder, and the capillary body 39 extends in the first groove 13 and the second groove 15, thereby increasing the contact of the capillary body 39 with the first groove. The areas of the first, second, third, and fourth capillary layers 32, 34, 36, and 38, thereby increasing the transmission amount of the working fluid, can improve heat dissipation efficiency.

該第一毛細層32、該第二毛細層34、該第三毛細層36及該第四毛細層38，其材質可選用其他材質，例如可由織網所構成；或者該第一、二毛細層32、34由銅粉燒結而成，而該第三、四毛細層36、38由織網所構成；或者該第一、二毛細層32、34由織網所構成，而該第三、四毛細層36、38由銅粉燒結而成；此外，該毛細體39也可以改為纖維束材質，因此，該第一、二、三、四毛細層32、34、36、38及該毛細體39之組成，不以銅粉燒結為限。The first capillary layer 32, the second capillary layer 34, the third capillary layer 36, and the fourth capillary layer 38 may be made of other materials, such as a woven mesh; or the first and second capillary layers 32, 34 are sintered from copper powder, and the third and fourth capillary layers 36, 38 are composed of a woven mesh; or the first and second capillary layers 32, 34 are composed of a woven mesh, and the third and fourth The capillary layers 36 and 38 are sintered from copper powder; in addition, the capillary body 39 can also be changed to a fiber bundle material. Therefore, the first, second, third, and fourth capillary layers 32, 34, 36, 38 and the capillary body The composition of 39 is not limited to sintering of copper powder.

該第一凹槽13及該第二凹槽15與所對應的該上蓋21之間具有複數凸部33，各該凸部33由毛細材所構成，於本實施例中，可以是銅粉燒結而成，各該凸部33頂抵於該第一毛細層32與該第三毛細層36之間，以及該第二毛細層34與該第四毛細層38之間，各該凸部33彼此相隔有一第二預定距離，該複數凸部33呈圓柱狀，且為矩陣排列；藉此，可增加該作動液的傳輸效率，以及可增加本發明的支撐性。There are a plurality of convex portions 33 between the first groove 13 and the second groove 15 and the corresponding upper cover 21, and each of the convex portions 33 is made of a capillary material. In this embodiment, copper powder sintering may be used. Thus, each of the convex portions 33 abuts between the first capillary layer 32 and the third capillary layer 36, and between the second capillary layer 34 and the fourth capillary layer 38, each of the convex portions 33 each other. There is a second predetermined distance apart, the plurality of convex portions 33 are cylindrical and arranged in a matrix; thereby, the transmission efficiency of the working fluid can be increased, and the supportability of the present invention can be increased.

該複數凸部33亦可為其他柱狀(例如：三角柱、方形柱...等)，而該複數凸部33亦可為分散排列；另外，當該第一、二、三、四毛細層32、34、36、38由銅粉燒結而成時，各該凸部33可改由實心金屬塊所構成，因為該作動液容易由該第一、二、三、四毛細層32、34、36、38中脫離，仍然可於該第一毛細層32與該第三毛細層36或該第二毛細層34與該第四毛細層38之間傳輸，並不會影響到該作動液的循環，亦有可增加本發明的支撐性之優點；因此，該複數凸部33的實施型態並不僅以本實施例為限。不過，若沒有支撐性不足的問題，即可省略該複數凸部33之設置，因此，該複數凸部33並非本發明之必要元件。The plurality of convex portions 33 may also have other columnar shapes (for example, a triangular column, a square column, etc.), and the plurality of convex portions 33 may also be dispersedly arranged. In addition, when the first, second, third, and fourth capillary layers When 32, 34, 36, and 38 are sintered from copper powder, each of the convex portions 33 may be composed of a solid metal block, because the working fluid is easily composed of the first, second, third, and fourth capillary layers 32, 34, Disengagement in 36, 38 can still be transmitted between the first capillary layer 32 and the third capillary layer 36 or the second capillary layer 34 and the fourth capillary layer 38 without affecting the circulation of the working fluid. There is also an advantage that the supportability of the present invention can be increased; therefore, the implementation form of the plurality of convex portions 33 is not limited to this embodiment only. However, if there is no problem of insufficient support, the arrangement of the plurality of convex portions 33 can be omitted, and therefore, the plurality of convex portions 33 is not an essential element of the present invention.

該作動液，填充於該密閉空間18且涵容於該毛細結構31內。The working fluid is filled in the closed space 18 and contained in the capillary structure 31.

值得一提的是，本第一實施例，請參閱如第5圖所示，亦可以將該第一延伸槽17改成連接於該第一凹槽13之第二邊133及該第二凹槽15之第二邊133，而該第二延伸槽19改成連接於該第一凹槽13之第四邊137及該第二凹槽15之第四邊137。It is worth mentioning that in the first embodiment, as shown in FIG. 5, the first extension groove 17 may also be changed to be connected to the second side 133 of the first groove 13 and the second recess. The second side 133 of the groove 15 is changed, and the second extension groove 19 is changed to be connected to the fourth side 137 of the first groove 13 and the fourth side 137 of the second groove 15.

或者，請參閱如第6圖所示，可以將該第一延伸槽17改成連接於該第一凹槽13之第三邊135及該第二凹槽15之第一邊131，該第二延伸槽19改成連接於該第一凹槽13之第四邊137及該第二凹槽15之第四邊137。Alternatively, as shown in FIG. 6, the first extension groove 17 may be changed to be connected to the third side 135 of the first groove 13 and the first side 131 of the second groove 15. The extension groove 19 is changed to be connected to the fourth side 137 of the first groove 13 and the fourth side 137 of the second groove 15.

由此可知，本發明可隨著使用需求，來改變該第一凹槽13與該第二凹槽15之間形成的該第一延伸槽17及該第二延伸槽19位置，以及該第一延伸槽17及該第二延伸槽19的槽道形狀，因此，該第一延伸槽17與該第二延伸槽19連接於該第一凹槽13及該第二凹槽15的位置，不以本實施例為限。It can be known that the present invention can change the positions of the first extension groove 17 and the second extension groove 19 formed between the first groove 13 and the second groove 15 as well as the first The channel shapes of the extension groove 17 and the second extension groove 19, therefore, the positions where the first extension groove 17 and the second extension groove 19 are connected to the first groove 13 and the second groove 15 are not based on This embodiment is limited.

另外，值得注意的是，如第7圖至第8圖所示，該第一凹槽13、該第二凹槽15、該第一延伸槽17及該第二延伸槽19之底面，亦可形成於不同水平面，此外，該上蓋21亦可設置呈非平板狀(例如：配合該第一凹槽13、該第二凹槽15、該第一延伸槽17或該第二延伸槽19之底面設置為有高低起伏的狀態，此結構變化並未顯示於圖中)。因此，該第一凹槽13、該第二凹槽15、該第一延伸槽17、該第二延伸槽19之底面以及該上蓋21之實施態樣，不以本實施例為限。In addition, it is worth noting that, as shown in FIGS. 7 to 8, the bottom surfaces of the first groove 13, the second groove 15, the first extension groove 17 and the second extension groove 19 may also be It is formed on different horizontal planes. In addition, the upper cover 21 may also be provided in a non-flat plate shape (for example, the bottom surface of the first groove 13, the second groove 15, the first extension groove 17 or the second extension groove 19 is matched). It is set in a state of high and low fluctuations. This structural change is not shown in the figure). Therefore, the embodiments of the first groove 13, the second groove 15, the first extension groove 17, the bottom surface of the second extension groove 19, and the upper cover 21 are not limited to this embodiment.

還有，如第9圖所示，雖然僅有部分的該第一延伸槽17被該毛細體39填滿，但只要該第三毛細層36及該第四毛細層38仍與該毛細體39有接觸，即不影響該作動液的循環，仍然具有散熱效果。因此，該毛細體39之配置，不以本實施例為限。In addition, as shown in FIG. 9, although only part of the first extension groove 17 is filled with the capillary body 39, as long as the third capillary layer 36 and the fourth capillary layer 38 are still connected to the capillary body 39 There is contact, that is, it does not affect the circulation of the working fluid, and still has a heat dissipation effect. Therefore, the arrangement of the capillaries 39 is not limited to this embodiment.

上述說明了本創作第一實施例之結構型態，接下來提出使用狀態之說明。The structure of the first embodiment of the present invention has been described above, and a description of the use state is provided next.

請參閱第1至3圖所示，本發明係配合一熱源及一散熱器所使用(圖未示)，本實施例的使用狀態，係將該熱源設置於該第一凹槽13所對應的該上蓋21，而該散熱器設置於該第二凹槽15所對應的該上蓋21為例。當該熱源開始加熱，會導致該第一毛細層32之作動液蒸發於該第一凹槽13內，汽態的該作動液會通過該第二延伸槽19而進入到該第二凹槽15內，當接觸到設有該散熱器的該上蓋21經降溫後，汽態的該作動液會重新凝結為液態的該作動液，且重新涵容於該第二凹槽15的該第二毛細層34，然後再藉由該第二凹槽15內的各該凸部33將液態的該作動液傳輸至該第二凹槽15內的該第四毛細層38，接著液態的該作動液會再藉由該毛細體39通過該第一延伸槽17，傳輸至該第一凹槽13內的該第三毛細層36，最後，該第一凹槽13內之第三毛細層36所涵容的該作動液會藉由該第一凹槽13內的各該凸部33將該液態的該作動液傳輸至該第一毛細層32，藉此提供降溫並進行再次的循環。Please refer to FIG. 1 to FIG. 3. The present invention is used with a heat source and a heat sink (not shown). The use state of this embodiment is that the heat source is disposed in the first groove 13 correspondingly. The upper cover 21 and the heat sink disposed in the upper cover 21 corresponding to the second groove 15 are taken as an example. When the heat source starts to heat, the working fluid of the first capillary layer 32 will evaporate in the first groove 13, and the working fluid in the vapor state will enter the second groove 15 through the second extension groove 19. Inside, when the upper cover 21 provided with the radiator is cooled, the working fluid in a vapor state will condense into the working fluid in a liquid state and be contained in the second capillary layer of the second groove 15 again. 34, and then the liquid working fluid is transmitted to the fourth capillary layer 38 in the second groove 15 through the convex portions 33 in the second groove 15, and then the liquid working fluid will be The capillary body 39 passes through the first extension groove 17 to the third capillary layer 36 in the first groove 13, and finally, the third capillary layer 36 in the first groove 13 contains the The operating fluid will transfer the liquid operating fluid to the first capillary layer 32 through the convex portions 33 in the first groove 13, thereby providing temperature reduction and recirculation.

據此，本發明可減少焊接加工，使得產品良率得以提升。Accordingly, the present invention can reduce welding processing, so that the product yield can be improved.

另外，本發明可減少焊接加工，能夠延長產品的使用壽命。In addition, the invention can reduce welding processing and can prolong the service life of the product.

接著，請參閱第10圖所示，本發明之第二實施例之結構及功效，主要概同於第一實施例，其不同之處在於：Next, referring to FIG. 10, the structure and effects of the second embodiment of the present invention are mainly the same as those of the first embodiment, and the differences are as follows:

本發明之第二實施例提供之一種液、汽分離之迴路均溫板10’，該底座11’係形成有二個該第一延伸槽17’及二個該第二延伸槽19’，於本實施例中，係將二個該第一延伸槽17’及二個該第二延伸槽19’設於該第一凹槽13’之第三邊135’與該第二凹槽15’之第一邊131’之間為例，藉此，可使該作動液的回流量增加，有效提升散熱效果。然而，於其他實施例中，亦可依據使用需求，而進行該第一延伸槽17’與該第二延伸槽19’數量上以及連接位置的改變，因此，該第一延伸槽17’與該第二延伸槽19’之實施型態，不以本實施例為限。According to a second embodiment of the present invention, a liquid-vapor separation circuit temperature equalizing plate 10 'is provided. The base 11' is formed with two first extension grooves 17 'and two second extension grooves 19'. In this embodiment, two first extension grooves 17 ′ and two second extension grooves 19 ′ are provided on the third side 135 ′ of the first groove 13 ′ and the second groove 15 ′. Taking the first side 131 ′ as an example, the return flow of the working fluid can be increased, and the heat dissipation effect can be effectively improved. However, in other embodiments, the number of the first extension grooves 17 ′ and the second extension grooves 19 ′ and the connection positions may be changed according to usage requirements. Therefore, the first extension grooves 17 ′ and the The implementation form of the second extension groove 19 'is not limited to this embodiment.

據此，本發明之第二實施例，可增加該作動液的回流量，藉此使得本發明的散熱效果得以提升。Accordingly, the second embodiment of the present invention can increase the return flow of the working fluid, thereby improving the heat dissipation effect of the present invention.

本發明之第二實施例其餘之結構及功效均概同於前第一實施例，故不再予贅述。The remaining structures and functions of the second embodiment of the present invention are the same as those of the first embodiment, so they will not be described again.

請再參閱第11圖所示，本發明之第三實施例之結構及功效，主要概同於第一實施例，其不同之處在於：Please refer to FIG. 11 again, the structure and effect of the third embodiment of the present invention are mainly similar to the first embodiment, and the differences are as follows:

本發明之第三實施例提供之一種液、汽分離之迴路均溫板10’’，該毛細結構31’’，係包含一第二毛細層34’’及一第三毛細層36’’，其省略了第一實施例之第2圖所示的該第一毛細層32及該第四毛細層38，同樣可達到該工作液循環的效果。因此，該毛細結構31’’也可以是其他配置，不以本實施例為限。A third embodiment of the present invention provides a liquid-vapor separation circuit temperature isolating plate 10 ", and the capillary structure 31" includes a second capillary layer 34 "and a third capillary layer 36", It omits the first capillary layer 32 and the fourth capillary layer 38 shown in FIG. 2 of the first embodiment, and the effect of circulating the working fluid can also be achieved. Therefore, the capillary structure 31 '' may have other configurations, and is not limited to this embodiment.

本發明之第三實施例其餘之結構及功效均概同於前第一實施例，故不再予贅述。The remaining structures and functions of the third embodiment of the present invention are the same as those of the first embodiment, so they will not be described again.

10‧‧‧液、汽分離之迴路均溫板10‧‧‧Circular temperature equalizing plate for liquid and vapor separation

11‧‧‧底座11‧‧‧ base

13‧‧‧第一凹槽13‧‧‧first groove

15‧‧‧第二凹槽15‧‧‧Second groove

131‧‧‧第一邊131‧‧‧first side

133‧‧‧第二邊133‧‧‧Second side

135‧‧‧第三邊135‧‧‧ Third side

137‧‧‧第四邊137‧‧‧ Fourth side

17‧‧‧第一延伸槽17‧‧‧first extension slot

18‧‧‧密閉空間18‧‧‧ confined space

19‧‧‧第二延伸槽19‧‧‧Second extension slot

21‧‧‧上蓋21‧‧‧ Upper cover

31‧‧‧毛細結構31‧‧‧ Capillary structure

32‧‧‧第一毛細層32‧‧‧ first capillary layer

33‧‧‧凸部33‧‧‧ convex

34‧‧‧第二毛細層34‧‧‧Second capillary layer

36‧‧‧第三毛細層36‧‧‧ third capillary layer

38‧‧‧第四毛細層38‧‧‧ fourth capillary layer

39‧‧‧毛細體39‧‧‧ Capillary

10’‧‧‧液、汽分離之迴路均溫板10’‧‧‧Circuit temperature equalization board for liquid and vapor separation

11’‧‧‧底座11’‧‧‧ base

13’‧‧‧第一凹槽13’‧‧‧first groove

131’‧‧‧第一邊131’‧‧‧ the first side

15’‧‧‧第二凹槽15’‧‧‧second groove

135’‧‧‧第三邊135’‧‧‧ the third side

17’‧‧‧第一延伸槽17’‧‧‧first extension groove

19’‧‧‧第二延伸槽19’‧‧‧second extension slot

10’’‧‧‧液、汽分離之迴路均溫板10’’‧‧‧Circuit temperature equalization board for liquid and vapor separation

31’’‧‧‧毛細結構31’’‧‧‧ Capillary structure

34’’‧‧‧第二毛細層34’’‧‧‧ second capillary layer

36’’‧‧‧第三毛細層36’’‧‧‧ third capillary layer

第1圖係本發明第一實施例之立體圖。 第2圖係本發明第一實施例之第一***圖。 第3圖係沿第1圖3-3剖線之剖視圖。 第4圖係沿第1圖4-4剖線之剖視圖。 第5圖係本發明第一實施例之第二***圖，顯示第一延伸槽及第二延伸槽於位於不同位置的變化。 第6圖係本發明第一實施例之第三***圖，顯示第一延伸槽及第二延伸槽於位於不同位置的變化。 第7圖係本發明第一實施例之第四***圖，顯示第一凹槽、第二凹槽、第一延伸槽及第二延伸槽之底面，形成於不同水平面時之內部情況。 第8圖係第7圖僅顯示部分之前視圖，顯示第一凹槽、第二凹槽、第一延伸槽及第二延伸槽之底面，係形成於不同水平面之情況。 第9圖係本發明第一實施例之第五***圖，顯示部分的第一延伸槽被毛細體填滿之情況。 第10圖係本發明第二實施例之***圖。 第11圖係本發明第三實施例之***圖。Fig. 1 is a perspective view of a first embodiment of the present invention. Fig. 2 is a first exploded view of the first embodiment of the present invention. FIG. 3 is a cross-sectional view taken along line 3-3 of FIG. 1. Fig. 4 is a sectional view taken along the line 4-4 of Fig. 1; FIG. 5 is a second exploded view of the first embodiment of the present invention, showing changes of the first extension groove and the second extension groove at different positions. FIG. 6 is a third exploded view of the first embodiment of the present invention, showing changes of the first extension groove and the second extension groove at different positions. FIG. 7 is a fourth exploded view of the first embodiment of the present invention, showing the internal conditions when the bottom surfaces of the first groove, the second groove, the first extension groove, and the second extension groove are formed at different levels. Figure 8 and Figure 7 only show a part of the front view, showing the bottom surfaces of the first groove, the second groove, the first extension groove and the second extension groove, which are formed at different levels. FIG. 9 is a fifth exploded view of the first embodiment of the present invention, showing the case where the first extension groove of the portion is filled with the capillaries. Fig. 10 is an exploded view of the second embodiment of the present invention. FIG. 11 is an exploded view of the third embodiment of the present invention.

Claims (14)

汽分離之迴路均溫板，包含有： 一底座，形成有一第一凹槽、一第二凹槽、一第一延伸槽以及一第二延伸槽，該第一凹槽與該第二凹槽藉由該第一延伸槽以及該第二延伸槽相連通； 一上蓋，結合該底座，並於該第一凹槽、該第二凹槽、該第一延伸槽以及該第二延伸槽形成一密閉空間； 一毛細結構，位於該密閉空間，而對應於該第一凹槽、該第二凹槽及該第一延伸槽；以及 一作動液，填充於該密閉空間且涵容於該毛細結構內。The steam isolating circuit temperature isolating plate includes: a base formed with a first groove, a second groove, a first extension groove, and a second extension groove; the first groove and the second groove The first extension groove and the second extension groove communicate with each other. An upper cover is combined with the base and forms a first groove, the second groove, the first extension groove, and the second extension groove. A confined space; a capillary structure located in the confined space, corresponding to the first groove, the second groove, and the first extension groove; and a working fluid filled in the confined space and contained in the capillary structure . 依據申請專利範圍第1項之液、汽分離之迴路均溫板，其中：該第一凹槽、該第二凹槽、該第一延伸槽及該第二延伸槽之底面，係形成於同一水平面，該上蓋係呈平板狀。The liquid-temperature and vapor-separation circuit isothermal plate according to item 1 of the scope of the patent application, wherein the bottom surfaces of the first groove, the second groove, the first extension groove, and the second extension groove are formed on the same surface. The horizontal surface is flat. 依據申請專利範圍第1項之液、汽分離之迴路均溫板，其中：該第一延伸槽與該第二延伸槽之間相隔一第一預定距離。The liquid temperature and vapor separation circuit isothermal plate according to item 1 of the patent application scope, wherein the first extension groove and the second extension groove are separated by a first predetermined distance. 依據申請專利範圍第1項之液、汽分離之迴路均溫板，其中：分別於該第一凹槽、該第二凹槽之周緣依序定義一第一邊、一第二邊、一第三邊及一第四邊；該第一延伸槽係連接於該第一凹槽之第三邊及該第二凹槽之第一邊，而該第二延伸槽係連接於該第一凹槽之第三邊及該第二凹槽之第一邊。According to the liquid-temperature and vapor-separation circuit equalizing plate of the first patent application scope, wherein: the first groove, the second groove, and the first groove are sequentially defined on the periphery of the first groove and the second groove, respectively. Three sides and a fourth side; the first extension groove is connected to the third side of the first groove and the first side of the second groove, and the second extension groove is connected to the first groove A third side and a first side of the second groove. 依據申請專利範圍第1項之液、汽分離之迴路均溫板，其中：分別於該第一凹槽、該第二凹槽之周緣依序定義一第一邊、一第二邊、一第三邊及一第四邊；該第一延伸槽係連接於該第一凹槽之第二邊及該第二凹槽之第二邊，而該第二延伸槽係連接於該第一凹槽之第四邊及該第二凹槽之第四邊。According to the liquid-temperature and vapor-separation circuit equalizing plate of the first patent application scope, wherein: the first groove, the second groove, and the first groove are sequentially defined on the periphery of the first groove and the second groove, respectively. Three sides and a fourth side; the first extension groove is connected to the second side of the first groove and the second side of the second groove, and the second extension groove is connected to the first groove A fourth side and a fourth side of the second groove. 依據申請專利範圍第1項之液、汽分離之迴路均溫板，其中：分別於該第一凹槽、該第二凹槽之周緣依序定義一第一邊、一第二邊、一第三邊及一第四邊；該第一延伸槽係連接於該第一凹槽之第三邊及該第二凹槽之第一邊，該第二延伸槽係連接於該第一凹槽之第四邊及該第二凹槽之第四邊。According to the liquid-temperature and vapor-separation circuit equalizing plate of the first patent application scope, wherein: the first groove, the second groove, and the first groove are sequentially defined on the periphery of the first groove and the second groove, respectively. Three sides and a fourth side; the first extension groove is connected to the third side of the first groove and the first side of the second groove, and the second extension groove is connected to the first groove A fourth side and a fourth side of the second groove. 依據申請專利範圍第1項之液、汽分離之迴路均溫板，其中：該毛細結構包含一第一毛細層、一第二毛細層、一第三毛細層、一第四毛細層及一毛細體，該第一毛細層形成於該上蓋，並位於該上蓋所面對該第一凹槽之區域，且該第一毛細層不影響該第一凹槽、該第一延伸槽及該第二延伸槽之間的連通；該第二毛細層形成於該上蓋，並位於該上蓋所面對該第二凹槽之區域，且該第二毛細層不影響該第二凹槽、該第一延伸槽及該第二延伸槽之間的連通；該第三毛細層形成於該底座，並位於該第一凹槽內，且該第三毛細層不影響該第一凹槽、該第一延伸槽及該第二延伸槽之間的連通；該第四毛細層形成於該底座，並位於該第二凹槽內，且該第四毛細層不影響該第二凹槽、該第一延伸槽及該第二延伸槽之間的連通；該毛細體設於該第一延伸槽，且至少部分的該第一延伸槽被該毛細體填滿。The liquid temperature and vapor separation circuit isothermal plate according to item 1 of the patent application scope, wherein the capillary structure includes a first capillary layer, a second capillary layer, a third capillary layer, a fourth capillary layer, and a capillary. The first capillary layer is formed on the upper cover and is located in an area where the upper cover faces the first groove, and the first capillary layer does not affect the first groove, the first extension groove, and the second The communication between the extension grooves; the second capillary layer is formed on the upper cover and is located in the area where the upper cover faces the second groove, and the second capillary layer does not affect the second groove and the first extension Communication between the groove and the second extension groove; the third capillary layer is formed on the base and is located in the first groove, and the third capillary layer does not affect the first groove and the first extension groove And the second extension groove; the fourth capillary layer is formed on the base and located in the second groove, and the fourth capillary layer does not affect the second groove, the first extension groove and Communication between the second extension grooves; the capillary body is provided in the first extension grooves, and at least part of The first extension groove is filled with the capillary body. 依據申請專利範圍第7項之液、汽分離之迴路均溫板，其中：該第一毛細層、該第二毛細層、該第三毛細層及該第四毛細層由銅粉或織網所構成，該毛細體由銅粉或纖維束所構成。The liquid-temperature and vapor-separation circuit isothermal plate according to item 7 of the patent application scope, wherein: the first capillary layer, the second capillary layer, the third capillary layer, and the fourth capillary layer are made of copper powder or a woven mesh. The capillaries are made of copper powder or fiber bundles. 依據申請專利範圍第7項之液、汽分離之迴路均溫板，其中：該毛細體係延伸於該第一凹槽內以及該第二凹槽內。The liquid-temperature and vapor-separation circuit isothermal plate according to item 7 of the patent application scope, wherein: the capillary system extends into the first groove and the second groove. 依據申請專利範圍第7項之液、汽分離之迴路均溫板，其中：該第一凹槽及該第二凹槽與所對應的該上蓋之間具有複數凸部，各該凸部頂抵於該第一毛細層與該第三毛細層之間，以及該第二毛細層與該第四毛細層之間，且各該凸部彼此相隔有一第二預定距離。The liquid temperature and vapor separation circuit temperature isolating plate according to item 7 of the scope of patent application, wherein: the first groove and the second groove have a plurality of convex portions between the corresponding upper cover, and each of the convex portions abuts against Between the first capillary layer and the third capillary layer, and between the second capillary layer and the fourth capillary layer, each convex portion is separated from each other by a second predetermined distance. 依據申請專利範圍第10項之液、汽分離之迴路均溫板，其中：各該凸部由毛細材或實心金屬塊所構成。The liquid-temperature and steam-separation circuit temperature equalizing plate according to item 10 of the patent application scope, wherein each of the convex portions is composed of a capillary material or a solid metal block. 依據申請專利範圍第10項之液、汽分離之迴路均溫板，其中：該複數凸部呈圓柱狀。The circuit temperature equalizing plate for liquid and vapor separation according to item 10 of the scope of patent application, wherein: the plurality of convex portions are cylindrical. 依據申請專利範圍第10項之液、汽分離之迴路均溫板，其中：該複數凸部為矩陣排列。The circuit temperature equalizing plate for liquid and vapor separation according to item 10 of the scope of patent application, wherein the plurality of convex portions are arranged in a matrix. 依據申請專利範圍第1項之液、汽分離之迴路均溫板，其中：該第一凹槽、該第二凹槽、該第一延伸槽及該第二延伸槽之底面，係形成於不同水平面。According to the scope of the patent application, the liquid and vapor separation circuit temperature isolating plate, wherein: the first groove, the second groove, the first extension groove and the bottom surface of the second extension groove are formed in different level.
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