TWI803747B - 曝光裝置、及物品製造方法 - Google Patents

曝光裝置、及物品製造方法 Download PDF

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Publication number
TWI803747B
TWI803747B TW109114012A TW109114012A TWI803747B TW I803747 B TWI803747 B TW I803747B TW 109114012 A TW109114012 A TW 109114012A TW 109114012 A TW109114012 A TW 109114012A TW I803747 B TWI803747 B TW I803747B
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TW
Taiwan
Prior art keywords
substrate
aberration
mixing ratio
optical system
exposure device
Prior art date
Application number
TW109114012A
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English (en)
Chinese (zh)
Other versions
TW202101132A (zh
Inventor
漆原宏亮
Original Assignee
日商佳能股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 日商佳能股份有限公司 filed Critical 日商佳能股份有限公司
Publication of TW202101132A publication Critical patent/TW202101132A/zh
Application granted granted Critical
Publication of TWI803747B publication Critical patent/TWI803747B/zh

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    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/708—Construction of apparatus, e.g. environment aspects, hygiene aspects or materials
    • G03F7/70858—Environment aspects, e.g. pressure of beam-path gas, temperature
    • G03F7/70883—Environment aspects, e.g. pressure of beam-path gas, temperature of optical system
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70216—Mask projection systems
    • G03F7/70325—Resolution enhancement techniques not otherwise provided for, e.g. darkfield imaging, interfering beams, spatial frequency multiplication, nearfield lenses or solid immersion lenses
    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/70—Microphotolithographic exposure; Apparatus therefor
    • G03F7/70691—Handling of masks or workpieces
    • G03F7/70775—Position control, e.g. interferometers or encoders for determining the stage position
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/027—Making masks on semiconductor bodies for further photolithographic processing not provided for in group H01L21/18 or H01L21/34

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Health & Medical Sciences (AREA)
  • Environmental & Geological Engineering (AREA)
  • Public Health (AREA)
  • Epidemiology (AREA)
  • Toxicology (AREA)
  • Atmospheric Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Manufacturing & Machinery (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Transition And Organic Metals Composition Catalysts For Addition Polymerization (AREA)
  • Prostheses (AREA)
TW109114012A 2019-06-18 2020-04-27 曝光裝置、及物品製造方法 TWI803747B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2019-113049 2019-06-18
JP2019113049A JP7213761B2 (ja) 2019-06-18 2019-06-18 露光装置、および物品製造方法

Publications (2)

Publication Number Publication Date
TW202101132A TW202101132A (zh) 2021-01-01
TWI803747B true TWI803747B (zh) 2023-06-01

Family

ID=73749659

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109114012A TWI803747B (zh) 2019-06-18 2020-04-27 曝光裝置、及物品製造方法

Country Status (4)

Country Link
JP (1) JP7213761B2 (ja)
KR (1) KR20200144483A (ja)
CN (1) CN112099318B (ja)
TW (1) TWI803747B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102022114969A1 (de) * 2022-06-14 2023-12-14 Carl Zeiss Smt Gmbh Verfahren zum Heizen eines optischen Elements sowie optisches System

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144700A (ja) * 1991-11-22 1993-06-11 Canon Inc 投影露光装置及びそれを用いた半導体素子の製造方法
JPH05210049A (ja) * 1992-01-31 1993-08-20 Matsushita Electric Ind Co Ltd 投影レンズ倍率補正方法およびその装置
TW444270B (en) * 1997-11-12 2001-07-01 Nippon Kogaku Kk Exposure apparatus, apparatus for fabricating device and fabricating method of exposure apparatus

Family Cites Families (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213814A (ja) * 1985-03-20 1986-09-22 Hitachi Ltd 投影露光装置
JP3218631B2 (ja) * 1991-07-09 2001-10-15 株式会社ニコン 投影露光装置
JPH11195602A (ja) * 1997-10-07 1999-07-21 Nikon Corp 投影露光方法及び装置
JP3278407B2 (ja) * 1998-02-12 2002-04-30 キヤノン株式会社 投影露光装置及びデバイス製造方法
JPH11260712A (ja) * 1998-03-12 1999-09-24 Nikon Corp 露光装置及び方法
JP2001230193A (ja) * 2000-02-18 2001-08-24 Canon Inc 波面収差測定方法及び投影露光装置
KR100846439B1 (ko) * 2000-11-07 2008-07-16 에이에스엠엘 유에스, 인크. 리소그래피 툴의 굴절율 변경을 조절하는 방법 및 장치
JP2004281697A (ja) * 2003-03-14 2004-10-07 Canon Inc 露光装置及び収差補正方法
JP2005051147A (ja) * 2003-07-31 2005-02-24 Nikon Corp 露光方法及び露光装置
JP4980922B2 (ja) * 2004-11-18 2012-07-18 カール・ツァイス・エスエムティー・ゲーエムベーハー マイクロリソグラフィ投影露光装置及びマイクロリソグラフィ投影露光装置の像面湾曲を修正するための方法
JP6238580B2 (ja) * 2013-06-07 2017-11-29 キヤノン株式会社 露光装置、露光方法、それらを用いたデバイスの製造方法
JP7022531B2 (ja) * 2017-08-03 2022-02-18 キヤノン株式会社 露光方法、露光装置、および物品の製造方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05144700A (ja) * 1991-11-22 1993-06-11 Canon Inc 投影露光装置及びそれを用いた半導体素子の製造方法
JPH05210049A (ja) * 1992-01-31 1993-08-20 Matsushita Electric Ind Co Ltd 投影レンズ倍率補正方法およびその装置
TW444270B (en) * 1997-11-12 2001-07-01 Nippon Kogaku Kk Exposure apparatus, apparatus for fabricating device and fabricating method of exposure apparatus

Also Published As

Publication number Publication date
JP7213761B2 (ja) 2023-01-27
KR20200144483A (ko) 2020-12-29
CN112099318A (zh) 2020-12-18
CN112099318B (zh) 2024-01-02
JP2020204739A (ja) 2020-12-24
TW202101132A (zh) 2021-01-01

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