TWI800533B - Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法 - Google Patents

Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法 Download PDF

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Publication number
TWI800533B
TWI800533B TW107133749A TW107133749A TWI800533B TW I800533 B TWI800533 B TW I800533B TW 107133749 A TW107133749 A TW 107133749A TW 107133749 A TW107133749 A TW 107133749A TW I800533 B TWI800533 B TW I800533B
Authority
TW
Taiwan
Prior art keywords
efem system
gas supply
supply method
efem
gas
Prior art date
Application number
TW107133749A
Other languages
English (en)
Chinese (zh)
Other versions
TW201939655A (zh
Inventor
河合俊宏
小倉源五郎
Original Assignee
日商昕芙旎雅股份有限公司
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Application filed by 日商昕芙旎雅股份有限公司 filed Critical 日商昕芙旎雅股份有限公司
Publication of TW201939655A publication Critical patent/TW201939655A/zh
Application granted granted Critical
Publication of TWI800533B publication Critical patent/TWI800533B/zh

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • H01L21/67034—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for drying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67389—Closed carriers characterised by atmosphere control
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67739—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations into and out of processing chamber
    • H01L21/67742—Mechanical parts of transfer devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
    • H01L21/67766—Mechanical parts of transfer devices

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Robotics (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Separation By Low-Temperature Treatments (AREA)
TW107133749A 2018-03-15 2018-09-26 Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法 TWI800533B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-048072 2018-03-15
JP2018048072A JP7125589B2 (ja) 2018-03-15 2018-03-15 Ｅｆｅｍシステム及びｅｆｅｍシステムにおけるガス供給方法

Publications (2)

Publication Number Publication Date
TW201939655A TW201939655A (zh) 2019-10-01
TWI800533B true TWI800533B (zh) 2023-05-01

Family

ID=67958161

Family Applications (2)

Application Number Title Priority Date Filing Date
TW112112454A TW202343648A (zh) 2018-03-15 2018-09-26 Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法
TW107133749A TWI800533B (zh) 2018-03-15 2018-09-26 Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法

Family Applications Before (1)

Application Number Title Priority Date Filing Date
TW112112454A TW202343648A (zh) 2018-03-15 2018-09-26 Ｅｆｅｍ系統及ｅｆｅｍ系統之氣體供給方法

Country Status (4)

Country Link
JP (3) JP7125589B2 (ja)
KR (1) KR20190109244A (ja)
CN (1) CN110277331A (ja)
TW (2) TW202343648A (ja)

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7379042B2 (ja) * 2019-09-20 2023-11-14 東京エレクトロン株式会社 真空搬送装置および真空搬送装置の制御方法
KR102276150B1 (ko) * 2019-09-27 2021-07-12 시너스텍 주식회사 오븐 챔버
KR102310953B1 (ko) * 2019-12-20 2021-10-12 멜콘 주식회사 건조 공기 공급 장치 및 방법
CN111090295A (zh) * 2019-12-31 2020-05-01 北京海岚科技有限公司 Efem中环境参数的控制方法及控制***
JP2023048293A (ja) * 2021-09-28 2023-04-07 株式会社Kokusai Electric 基板処理装置、半導体装置の製造方法、基板処理方法およびプログラム
US20240125491A1 (en) * 2022-10-13 2024-04-18 Applied Materials, Inc. Filter isolation for equipment front end module

Citations (2)

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TW511169B (en) * 2000-02-01 2002-11-21 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
JP2016527732A (ja) * 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ファクトリインターフェースの環境制御を伴う基板処理のシステム、装置、及び方法

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JPH113867A (ja) * 1997-06-11 1999-01-06 Kokusai Electric Co Ltd 半導体製造装置
JP2000353738A (ja) * 1999-06-11 2000-12-19 Sony Corp 密閉コンテナ、保管装置および電子部品搬送システム、ならびに電子部品の保管および搬送方法
JP2002056643A (ja) * 2000-08-04 2002-02-22 Matsushita Electric Ind Co Ltd 磁気ディスク装置とその製造方法
JP2002359180A (ja) * 2001-06-01 2002-12-13 Toshiba Corp ガス循環システム
JP2004160444A (ja) * 2002-09-20 2004-06-10 Tokyo Electron Ltd 乾燥空気供給装置及び処理装置
JP4344593B2 (ja) * 2002-12-02 2009-10-14 ローツェ株式会社 ミニエンバイロメント装置、薄板状物製造システム及び清浄容器の雰囲気置換方法
JP2005101185A (ja) * 2003-09-24 2005-04-14 Dainippon Screen Mfg Co Ltd 基板洗浄乾燥装置
JP2005142185A (ja) * 2003-11-04 2005-06-02 Canon Inc 露光装置及びその環境制御方法
DE102006013997B4 (de) * 2006-03-27 2009-05-07 Rm Michaelides Software & Elektronik Gmbh Trockenlager zur Aufbewahrung feuchtigkeitsempfindlicher Materialien, Verfahren zum Beeinflussen der Atmosphärenfeuchte
JP2010072624A (ja) * 2008-08-18 2010-04-02 Nec Electronics Corp レチクル収納装置およびレチクル保管方法
JP5631011B2 (ja) * 2010-01-25 2014-11-26 高砂熱学工業株式会社 クリーンルームシステム及びその運転方法
JP5925474B2 (ja) * 2011-12-06 2016-05-25 株式会社日立ハイテクマニファクチャ＆サービス ウエハ処理装置
JP2013171757A (ja) * 2012-02-22 2013-09-02 Ngk Insulators Ltd 不活性ガスパージ方法
JP2014038888A (ja) * 2012-08-10 2014-02-27 Hitachi High-Tech Control Systems Corp ミニエンバイロメント装置及びその内部雰囲気置換方法
JP6268425B2 (ja) * 2013-07-16 2018-01-31 シンフォニアテクノロジー株式会社 Ｅｆｅｍ、ロードポート、ウェーハ搬送方法
JP6292835B2 (ja) * 2013-11-20 2018-03-14 オリンパス株式会社 光学素子製造装置および光学素子製造方法
JP6349750B2 (ja) * 2014-01-31 2018-07-04 シンフォニアテクノロジー株式会社 Ｅｆｅｍ
JP2016015435A (ja) * 2014-07-03 2016-01-28 株式会社アマダホールディングス ファイバレーザ発振器，ファイバレーザ加工装置，及びファイバレーザ発振器の除湿方法
CN204011459U (zh) * 2014-07-09 2014-12-10 无锡易比达半导体科技有限公司 一种硅片的轻便洁净周转箱

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW511169B (en) * 2000-02-01 2002-11-21 Tokyo Electron Ltd Substrate processing apparatus and substrate processing method
JP2016527732A (ja) * 2013-08-12 2016-09-08 アプライド マテリアルズ インコーポレイテッドＡｐｐｌｉｅｄ Ｍａｔｅｒｉａｌｓ，Ｉｎｃｏｒｐｏｒａｔｅｄ ファクトリインターフェースの環境制御を伴う基板処理のシステム、装置、及び方法

Also Published As

Publication number Publication date
JP7125589B2 (ja) 2022-08-25
JP7477785B2 (ja) 2024-05-02
JP2024091775A (ja) 2024-07-05
TW202343648A (zh) 2023-11-01
JP2022160598A (ja) 2022-10-19
TW201939655A (zh) 2019-10-01
CN110277331A (zh) 2019-09-24
JP2019161097A (ja) 2019-09-19
KR20190109244A (ko) 2019-09-25

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