TWI799605B - Grinding stone sharpening method and sharpening wafer - Google Patents

Grinding stone sharpening method and sharpening wafer Download PDF

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Publication number
TWI799605B
TWI799605B TW108121290A TW108121290A TWI799605B TW I799605 B TWI799605 B TW I799605B TW 108121290 A TW108121290 A TW 108121290A TW 108121290 A TW108121290 A TW 108121290A TW I799605 B TWI799605 B TW I799605B
Authority
TW
Taiwan
Prior art keywords
sharpening
wafer
grinding stone
sharpening method
grinding
Prior art date
Application number
TW108121290A
Other languages
Chinese (zh)
Other versions
TW202000372A (en
Inventor
廣沢俊一郎
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW202000372A publication Critical patent/TW202000372A/en
Application granted granted Critical
Publication of TWI799605B publication Critical patent/TWI799605B/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/12—Dressing tools; Holders therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B53/00—Devices or means for dressing or conditioning abrasive surfaces
    • B24B53/02—Devices or means for dressing or conditioning abrasive surfaces of plane surfaces on abrasive tools
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
    • H01L21/3043—Making grooves, e.g. cutting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW108121290A 2018-06-22 2019-06-19 Grinding stone sharpening method and sharpening wafer TWI799605B (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-118723 2018-06-22
JP2018118723A JP7154690B2 (en) 2018-06-22 2018-06-22 Grinding wheel dressing method

Publications (2)

Publication Number Publication Date
TW202000372A TW202000372A (en) 2020-01-01
TWI799605B true TWI799605B (en) 2023-04-21

Family

ID=68968917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108121290A TWI799605B (en) 2018-06-22 2019-06-19 Grinding stone sharpening method and sharpening wafer

Country Status (4)

Country Link
JP (1) JP7154690B2 (en)
KR (1) KR20200000338A (en)
CN (1) CN110634737B (en)
TW (1) TWI799605B (en)

Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796460A (en) * 1993-09-27 1995-04-11 Toyo A Tec Kk Method and device for dressing grinding wheel of grinding machine
JP2005340431A (en) * 2004-05-26 2005-12-08 Renesas Technology Corp Method for manufacturing semiconductor device
JP2006015423A (en) * 2004-06-30 2006-01-19 Disco Abrasive Syst Ltd Setting method for vitrified bond grinding wheel and setting board
US20060111021A1 (en) * 2004-02-05 2006-05-25 Robert Gerber Semiconductor wafer grinder
TW201600240A (en) * 2014-04-16 2016-01-01 Disco Corp Grinding apparatus
JP2017154238A (en) * 2016-03-04 2017-09-07 株式会社ディスコ Grinding device
TW201808535A (en) * 2016-06-28 2018-03-16 日商利德股份有限公司 Blade dressing mechanism, cutting apparatus provided with the same, and blade dressing method using blade dressing mechanism
JP2018065236A (en) * 2016-10-21 2018-04-26 株式会社ディスコ Dressing board and method of application thereof

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4760668A (en) * 1986-07-02 1988-08-02 Alfred Schlaefli Surface grinding machine and method
JP2002164312A (en) 2000-11-27 2002-06-07 Sony Corp Reverse side-grinding method and apparatus
JP4977493B2 (en) * 2007-02-28 2012-07-18 株式会社ディスコ Dressing method and dressing tool for grinding wheel
JP5127270B2 (en) 2007-03-09 2013-01-23 株式会社ディスコ Dressing method and dresser board
JP2016047561A (en) * 2014-08-27 2016-04-07 株式会社ディスコ Grinding device
JP6424081B2 (en) 2014-12-12 2018-11-14 株式会社ディスコ Grinding method
JP6803187B2 (en) * 2016-10-05 2020-12-23 株式会社ディスコ Grinding wheel dressing method

Patent Citations (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0796460A (en) * 1993-09-27 1995-04-11 Toyo A Tec Kk Method and device for dressing grinding wheel of grinding machine
US20060111021A1 (en) * 2004-02-05 2006-05-25 Robert Gerber Semiconductor wafer grinder
JP2005340431A (en) * 2004-05-26 2005-12-08 Renesas Technology Corp Method for manufacturing semiconductor device
JP2006015423A (en) * 2004-06-30 2006-01-19 Disco Abrasive Syst Ltd Setting method for vitrified bond grinding wheel and setting board
TW201600240A (en) * 2014-04-16 2016-01-01 Disco Corp Grinding apparatus
JP2017154238A (en) * 2016-03-04 2017-09-07 株式会社ディスコ Grinding device
TW201808535A (en) * 2016-06-28 2018-03-16 日商利德股份有限公司 Blade dressing mechanism, cutting apparatus provided with the same, and blade dressing method using blade dressing mechanism
JP2018065236A (en) * 2016-10-21 2018-04-26 株式会社ディスコ Dressing board and method of application thereof

Also Published As

Publication number Publication date
CN110634737A (en) 2019-12-31
KR20200000338A (en) 2020-01-02
JP7154690B2 (en) 2022-10-18
TW202000372A (en) 2020-01-01
JP2019217611A (en) 2019-12-26
CN110634737B (en) 2024-03-19

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