TWI794436B - 黏著薄板 - Google Patents

黏著薄板 Download PDF

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Publication number
TWI794436B
TWI794436B TW108107541A TW108107541A TWI794436B TW I794436 B TWI794436 B TW I794436B TW 108107541 A TW108107541 A TW 108107541A TW 108107541 A TW108107541 A TW 108107541A TW I794436 B TWI794436 B TW I794436B
Authority
TW
Taiwan
Prior art keywords
adhesive sheet
adhesive layer
adhesive
base material
length
Prior art date
Application number
TW108107541A
Other languages
English (en)
Chinese (zh)
Other versions
TW201938731A (zh
Inventor
稲男洋一
也
山田忠知
Original Assignee
日商琳得科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商琳得科股份有限公司 filed Critical 日商琳得科股份有限公司
Publication of TW201938731A publication Critical patent/TW201938731A/zh
Application granted granted Critical
Publication of TWI794436B publication Critical patent/TWI794436B/zh

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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J175/00—Adhesives based on polyureas or polyurethanes; Adhesives based on derivatives of such polymers
    • C09J175/04—Polyurethanes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C09J7/22—Plastics; Metallised plastics
    • C09J7/25—Plastics; Metallised plastics based on macromolecular compounds obtained otherwise than by reactions involving only carbon-to-carbon unsaturated bonds
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
TW108107541A 2018-03-07 2019-03-07 黏著薄板 TWI794436B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2018-040796 2018-03-07
JP2018040796 2018-03-07

Publications (2)

Publication Number Publication Date
TW201938731A TW201938731A (zh) 2019-10-01
TWI794436B true TWI794436B (zh) 2023-03-01

Family

ID=67846180

Family Applications (1)

Application Number Title Priority Date Filing Date
TW108107541A TWI794436B (zh) 2018-03-07 2019-03-07 黏著薄板

Country Status (3)

Country Link
JP (1) JP7256788B2 (ja)
TW (1) TWI794436B (ja)
WO (1) WO2019172220A1 (ja)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7377723B2 (ja) * 2020-01-21 2023-11-10 タキロンシーアイ株式会社 ダイシングテープ用基材フィルム
WO2023047592A1 (ja) * 2021-09-27 2023-03-30 株式会社レゾナック 半導体装置の製造方法
WO2024063122A1 (ja) * 2022-09-22 2024-03-28 リンテック株式会社 電子部品又は半導体装置の製造方法
WO2024063124A1 (ja) * 2022-09-22 2024-03-28 リンテック株式会社 粘着シート

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201803042A (zh) * 2016-06-30 2018-01-16 琳得科股份有限公司 半導體加工用板片

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4822885B2 (ja) * 2006-03-14 2011-11-24 日東電工株式会社 半導体用粘着シート
WO2012124389A1 (ja) * 2011-03-17 2012-09-20 リンテック株式会社 エネルギー線硬化型粘着剤および粘着シート

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201803042A (zh) * 2016-06-30 2018-01-16 琳得科股份有限公司 半導體加工用板片

Also Published As

Publication number Publication date
WO2019172220A1 (ja) 2019-09-12
JPWO2019172220A1 (ja) 2021-03-04
TW201938731A (zh) 2019-10-01
JP7256788B2 (ja) 2023-04-12

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