TWI793891B - Heat conduction module and electronic device - Google Patents

Heat conduction module and electronic device Download PDF

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TWI793891B
TWI793891B TW110145221A TW110145221A TWI793891B TW I793891 B TWI793891 B TW I793891B TW 110145221 A TW110145221 A TW 110145221A TW 110145221 A TW110145221 A TW 110145221A TW I793891 B TWI793891 B TW I793891B
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heat
heat conduction
magnetic
heat sink
electronic device
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TW110145221A
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TW202325103A (en
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陳鈞彥
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和碩聯合科技股份有限公司
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Priority to CN202211540918.6A priority patent/CN116234234A/en
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
    • Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management

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  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)

Abstract

The present invention discloses a heat conduction module and an electronic device. The heat conduction module is suitable for cooperating with a first heat dissipation element and a second heat dissipation element. The heat conduction module includes a heat conduction element and two first magnetic elements. The two first magnetic elements are respectively disposed at opposite ends of the heat conduction element, and the two first magnetic elements are magnetically attracted to the first heat dissipation element and the second heat dissipation element, respectively, so as to conduct the heat of the first heat dissipation element to the second heat dissipation element through the heat conduction element.

Description

熱傳導模組與電子裝置Thermal Conduction Modules and Electronic Devices

本揭露關於一種熱傳導模組，特別關於一種能夠將廢熱由熱區導引至涼區的熱傳導模組與電子裝置。The disclosure relates to a heat conduction module, in particular to a heat conduction module and an electronic device capable of guiding waste heat from a hot area to a cool area.

在要求高速運算的情況下，電子裝置運作時不可避免地將產生較以往更多的廢熱，因此，“散熱”已經是電子裝置不可或缺的需求功能。特別是對高功率元件來說，由於工作時產生的廢熱大幅增加，使得電子產品的溫度會急速上升，當電子產品受到過高的溫度時，可能會造成元件或裝置的永久性損壞，或是使壽命大幅地降低。Under the condition of requiring high-speed computing, electronic devices will inevitably generate more waste heat than before. Therefore, "heat dissipation" has become an indispensable function of electronic devices. Especially for high-power components, due to the substantial increase in waste heat generated during work, the temperature of electronic products will rise rapidly. When electronic products are subjected to excessive temperatures, it may cause permanent damage to components or devices, or significantly reduce lifespan.

在電子裝置的設計過程中，受限於產品的外觀和形狀，導致內部元件在空間的限制下，廢熱會傾向於電子裝置的某一邊（側），在這種情況下，設計者通常會想要將廢熱從較熱區域（熱區）導引至較涼區域（涼區），以提高整體的散熱效能，然而，卻礙於空間上的限制而沒有辦法執行。In the design process of electronic devices, limited by the appearance and shape of the product, the waste heat tends to one side (side) of the electronic device due to the space constraints of internal components. In this case, the designer usually thinks It is necessary to guide the waste heat from the hotter area (hot area) to the cooler area (cooler area) to improve the overall heat dissipation performance. However, due to the limitation of space, there is no way to implement it.

傳統的一個解決方法是利用鎖附或黏貼的方式固定熱傳導結構，以將熱區的廢熱導引至涼區，但是，受限於螺絲的位置，採用鎖附方式往往會對元件或結構造成擠壓而破壞其特性；若以黏貼的方式進行固定的話，則可能無法重工，而且黏貼方式也容易有脫落的風險。A traditional solution is to fix the heat conduction structure by locking or pasting to guide the waste heat from the hot zone to the cool zone. However, limited by the position of the screw, the locking method often causes the components or structures to be squeezed. If it is fixed by sticking, it may not be possible to rework, and the sticking method is also prone to the risk of falling off.

有鑑於上述課題，本揭露的目的為提供一種熱傳導模組與包括該熱傳導模組的電子裝置，除了可將電子裝置所產生的廢熱快速地由熱區導引至涼區，提升整體的散熱效能外，還可以解決先前技術利用鎖附或黏貼的方式固定熱傳導結構所造成的問題。In view of the above problems, the purpose of this disclosure is to provide a heat conduction module and an electronic device including the heat conduction module, which can not only guide the waste heat generated by the electronic device from the hot area to the cool area quickly, but also improve the overall heat dissipation performance In addition, it can also solve the problems caused by fixing the heat conduction structure by means of locking or sticking in the prior art.

本揭露提出一種熱傳導模組與一第一散熱件及一第二散熱件配合應用。熱傳導模組包括一熱傳導件以及兩第一磁性件，兩第一磁性件分別設置於熱傳導件的相反兩端部，且兩第一磁性件分別磁吸於第一散熱件與第二散熱件，以將第一散熱件的熱量透過熱傳導件傳導至第二散熱件。The present disclosure proposes a heat conduction module used in conjunction with a first heat dissipation element and a second heat dissipation element. The heat conduction module includes a heat conduction element and two first magnetic elements, the two first magnetic elements are respectively arranged at opposite ends of the heat conduction element, and the two first magnetic elements are magnetically attracted to the first heat sink and the second heat sink respectively, The heat of the first heat dissipation element is conducted to the second heat dissipation element through the heat conduction element.

本揭露還提出一種電子裝置，包括一殼體、一第一電子元件、一第二電子元件、一第一散熱件、一第二散熱件以及熱傳導模組。第一電子元件、第二電子元件、第一散熱件及第二散熱件皆設置於殼體內，第一散熱件與第一電子元件連接，第二散熱件與第二電子元件連接。熱傳導模組設置於殼體內，並包括一熱傳導件及兩個第一磁性件，兩第一磁性件分別設置於熱傳導件的相反兩端部，且兩第一磁性件分別磁吸於第一散熱件與第二散熱件，以將第一散熱件的熱量透過熱傳導件傳導至第二散熱件。The present disclosure also provides an electronic device, which includes a housing, a first electronic component, a second electronic component, a first heat sink, a second heat sink, and a heat conduction module. The first electronic component, the second electronic component, the first heat sink and the second heat sink are all arranged in the housing, the first heat sink is connected to the first electronic component, and the second heat sink is connected to the second electronic component. The heat conduction module is arranged in the casing, and includes a heat conduction element and two first magnetic elements, the two first magnetic elements are respectively arranged at opposite ends of the heat conduction element, and the two first magnetic elements are magnetically attracted to the first heat dissipation element respectively. The heat dissipation element and the second heat dissipation element are used to conduct the heat of the first heat dissipation element to the second heat dissipation element through the heat conduction element.

在一實施例中，熱傳導件的材料包括金屬、石墨片、石墨烯微片、奈米碳管、稀土金屬、或其組合。In one embodiment, the material of the heat conduction element includes metal, graphite sheet, graphene micro-sheet, carbon nanotube, rare earth metal, or a combination thereof.

在一實施例中，熱傳導件具有可撓曲性。In one embodiment, the heat conducting element is flexible.

在一實施例中，熱傳導模組更包括兩個第二磁性件，其分別設置於第一散熱件及第二散熱件並對應於兩第一磁性件。In one embodiment, the heat conduction module further includes two second magnetic elements, which are respectively disposed on the first heat dissipation element and the second heat dissipation element and correspond to the two first magnetic elements.

在一實施例中，熱傳導模組更適於與一第三散熱件配合應用，熱傳導模組更包括一第三磁性件，其設置於熱傳導件並位於兩第一磁性件之間，第三磁性件磁吸於第三散熱件。In one embodiment, the heat conduction module is more suitable for use with a third heat sink, and the heat conduction module further includes a third magnetic part, which is arranged on the heat conduction part and located between the two first magnetic parts, and the third magnetic The component is magnetically attracted to the third cooling component.

在一實施例中，熱傳導模組更包括一第四磁性件，其設置於第三散熱件且對應於第三磁性件。In one embodiment, the heat conduction module further includes a fourth magnetic element disposed on the third heat dissipation element and corresponding to the third magnetic element.

在一實施例中，電子裝置更包括一第一電路板及一第二電路板，其設置於殼體內並沿第一電路板表面的法線方向間隔排列，第一電子元件設置於第一電路板上，第二電子元件設置於第二電路板上。In one embodiment, the electronic device further includes a first circuit board and a second circuit board, which are disposed in the casing and arranged at intervals along the normal direction of the surface of the first circuit board, and the first electronic component is disposed on the first circuit board. On the board, the second electronic component is arranged on the second circuit board.

在一實施例中，電子裝置更包括一蓋體單元。蓋體單元可移動地設置於殼體；其中，熱傳導模組更包括一第三磁性件，第三磁性件設置於熱傳導件並位於兩第一磁性件之間，且磁吸於蓋體單元。In one embodiment, the electronic device further includes a cover unit. The cover unit is movably disposed on the casing; wherein, the heat conduction module further includes a third magnetic component, the third magnetic component is disposed on the heat conduction component and is located between the two first magnetic components, and is magnetically attracted to the cover unit.

在一實施例中，蓋體單元包括一第三散熱件，第三散熱件與熱傳導件連接，以將熱傳導件的熱量傳導至蓋體單元。In one embodiment, the cover unit includes a third heat dissipation element, and the third heat dissipation element is connected to the heat conduction element to conduct heat from the heat conduction element to the cover body unit.

在一實施例中，熱傳導模組更包括一第四磁性件，第四磁性件設置於第三散熱件且對應於第三磁性件。In one embodiment, the heat conduction module further includes a fourth magnetic component, which is disposed on the third heat dissipation component and corresponds to the third magnetic component.

承上所述，在本揭露的熱傳導模組及電子裝置中，透過兩個第一磁性件分別設置於熱傳導件的相反兩端部，且這兩個第一磁性件分別磁吸於第一散熱件與第二散熱件，以將第一散熱件的熱量透過熱傳導件傳導至第二散熱件的結構設計，使本揭露具有以下優點：1、利用磁吸固定減少固定熱傳導結構所需的空間，解決因電子裝置內部空間限制而無法將廢熱由熱區轉移至涼區的問題。2、利用磁吸方式連接熱傳導結構轉移廢熱，因此可以多次重覆使用，易於重工。3、相較於傳統以黏貼的方式固定熱傳導結構來說，本揭露利用磁吸方式的固定性更好，可以避免架橋掉落的風險。4、傳統以鎖螺絲方式固定熱傳導結構，容易對電子元件造成擠壓而破壞其特性，本揭露的電子裝置除了可達到熱量轉移的目的之外，還可避免元件擠壓的問題。As mentioned above, in the heat conduction module and electronic device of the present disclosure, the two first magnetic parts are respectively arranged on opposite ends of the heat conduction part, and the two first magnetic parts are respectively magnetically attracted to the first heat sink. The structural design of conducting the heat of the first heat dissipation element to the second heat dissipation element through the heat conduction element makes this disclosure have the following advantages: 1. The space required for fixing the heat conduction structure is reduced by using magnetic attraction, Solve the problem that the waste heat cannot be transferred from the hot area to the cool area due to the limitation of the internal space of the electronic device. 2. Use magnetic attraction to connect the heat conduction structure to transfer waste heat, so it can be reused many times and is easy to rework. 3. Compared with the traditional way of fixing the heat conduction structure by sticking, the magnetic attraction method of the present disclosure is better in fixing, which can avoid the risk of the bridge falling off. 4. Traditionally, the heat conduction structure is fixed by locking screws, which is easy to squeeze the electronic components and destroy their characteristics. The electronic device disclosed in this disclosure can not only achieve the purpose of heat transfer, but also avoid the problem of component extrusion.

以下將參照相關圖式，說明依本揭露一些實施例之熱傳導模組與電子裝置，其中相同的元件將以相同的參照符號加以說明。以下實施例出現的各元件只是用以說明其相對關係，並不代表真實元件的比例或尺寸。The heat conduction module and electronic device according to some embodiments of the present disclosure will be described below with reference to related drawings, wherein the same elements will be described with the same reference symbols. The components in the following embodiments are only used to illustrate their relative relationship, and do not represent the proportion or size of real components.

本揭露的熱傳導模組可將電子裝置內部電子元件運作時所產生的廢熱由熱區導引至涼區，藉此提升整體的散熱效能。電子裝置例如可為手機、平板、筆記型電腦、電子系統、或其他會產生廢熱的電子設備，而會產生廢熱的電子元件例如可為電池、控制晶片（例如中央控制單元(CPU)）、驅動晶片、記憶體（例如但不限於SSD，固態硬碟）、主機板、顯示卡或顯示面板，或其他運作時會產生廢熱的元件、單元或模組，並不限制。The heat conduction module of the present disclosure can guide the waste heat generated by the electronic components inside the electronic device from the hot area to the cool area, thereby improving the overall heat dissipation performance. Electronic devices can be, for example, mobile phones, tablets, notebook computers, electronic systems, or other electronic devices that generate waste heat, and electronic components that generate waste heat can be, for example, batteries, control chips (such as central control unit (CPU)), drive Chip, memory (such as but not limited to SSD, solid state drive), motherboard, graphics card or display panel, or other components, units or modules that generate waste heat during operation are not limited.

圖1A為本揭露一實施例之電子裝置俯視示意圖，圖1B為圖1A的電子裝置的立體剖視示意圖，而圖1C至圖1F分別為圖1A的電子裝置中，不同實施態樣的區域A的放大示意圖。在此，圖1A及圖1B的電子裝置1是以具有圓弧表面的立式電子系統為例。FIG. 1A is a schematic top view of an electronic device according to an embodiment of the present disclosure, FIG. 1B is a schematic three-dimensional cross-sectional view of the electronic device in FIG. 1A , and FIG. 1C to FIG. 1F are regions A of different implementations of the electronic device in FIG. 1A magnified schematic diagram. Here, the electronic device 1 shown in FIG. 1A and FIG. 1B is an example of a vertical electronic system with a circular arc surface.

請參閱圖1A及圖1B，本實施例的熱傳導模組15包括一熱傳導件151及兩個第一磁性件152a、152b，第一磁性件152a、152b分別設置於熱傳導件151的相反兩端部E1、E2。Please refer to FIG. 1A and FIG. 1B , the heat conduction module 15 of this embodiment includes a heat conduction element 151 and two first magnetic elements 152a, 152b, and the first magnetic elements 152a, 152b are respectively arranged on opposite ends of the heat conduction element 151. E1, E2.

熱傳導模組15適於與第一散熱件14a及第二散熱件14b配合應用。第一磁性件152a、152b分別磁吸於第一散熱件14a與第二散熱件14b，以將第一散熱件14a的熱量透過熱傳導件151傳導至第二散熱件14b。The heat conduction module 15 is suitable for cooperating with the first heat sink 14a and the second heat sink 14b. The first magnetic parts 152a and 152b are magnetically attracted to the first heat sink 14a and the second heat sink 14b respectively, so as to transfer the heat of the first heat sink 14a to the second heat sink 14b through the heat conduction part 151 .

上述的熱傳導模組15、第一散熱件14a及第二散熱件14b可整合於電子裝置1中。在本實施例中，電子裝置1除了包括上述的熱傳導模組15、第一散熱件14a及第二散熱件14b，亦可包括一殼體11、一第一電子元件13a及一第二電子元件13b。另外，本實施例之電子裝置1還可包括一第一電路板12a、一第二電路板12b及一支撐件16。The above-mentioned heat conduction module 15 , the first heat dissipation element 14 a and the second heat dissipation element 14 b can be integrated into the electronic device 1 . In this embodiment, the electronic device 1 may also include a casing 11, a first electronic component 13a and a second electronic component in addition to the above-mentioned heat conduction module 15, the first heat sink 14a and the second heat sink 14b. 13b. In addition, the electronic device 1 of this embodiment may further include a first circuit board 12 a , a second circuit board 12 b and a supporting member 16 .

殼體11為圓弧狀，其材料可包括金屬或塑膠，而第一電路板12a、第二電路板12b、第一電子元件13a、第二電子元件13b、第一散熱件14a、第二散熱件14b、熱傳導模組15及支撐件16皆設置於殼體11內。第一電路板12a及第二電路板12b可沿垂直第一電路板12a表面的法線方向彼此間隔排列。第一電子元件13a、第二電子元件13b可例如為晶片，並分別對應設置於第一電路板12a、第二電路板12b上。另外，第一散熱件14a與第一電子元件13a連接，以將第一電子元件13a運作時所產生的廢熱快速導引出。第二散熱件14b與第二電子元件13b連接，以將第二電子元件13b運作時所產生的廢熱快速導引出。The housing 11 is arc-shaped, and its material may include metal or plastic, while the first circuit board 12a, the second circuit board 12b, the first electronic component 13a, the second electronic component 13b, the first heat sink 14a, the second heat sink The element 14b, the heat conduction module 15 and the supporting element 16 are all disposed in the casing 11 . The first circuit board 12a and the second circuit board 12b can be arranged at intervals along a normal direction perpendicular to the surface of the first circuit board 12a. The first electronic component 13a and the second electronic component 13b may be chips, for example, and are correspondingly disposed on the first circuit board 12a and the second circuit board 12b. In addition, the first heat sink 14a is connected to the first electronic component 13a, so as to quickly guide out the waste heat generated by the first electronic component 13a during operation. The second heat sink 14b is connected to the second electronic component 13b to quickly conduct waste heat generated by the second electronic component 13b during operation.

本實施例的第一電路板12a、第二電路板12b例如但不限於為印刷電路板，其對應設置於支撐件16的相反兩側，而兩個第一電子元件13a則設置於第一電路板12a遠離支撐件16的表面，且分別透過例如導熱膏Pa與第一散熱件14a連接；第二電子元件13b設置於第二電路板12b遠離支撐件16的表面，且透過例如導熱膏Pb與第二散熱件14b連接。第一電子元件13a、第二電子元件13b運作時會產生廢熱，經由導熱膏Pa、導熱膏Pb可對應傳導至第一散熱件14a、第二散熱件14b，藉此降低第一電子元件13a、第二電子元件13b的溫度。本實施例的第一散熱件14a與第二散熱件14b例如但不限於為具有散熱鰭片的散熱器（Heatsink）為例，然並不以此為限，在不同的實施例中，第一散熱件14a與第二散熱件14b也可為導熱膜或散熱膜，本揭露不限制。The first circuit board 12a and the second circuit board 12b of this embodiment are, for example but not limited to, printed circuit boards, which are correspondingly arranged on opposite sides of the support member 16, and the two first electronic components 13a are arranged on the first circuit board. The board 12a is away from the surface of the support member 16, and is respectively connected to the first heat sink 14a through, for example, thermal paste Pa; The second heat sink 14b is connected. The first electronic component 13a and the second electronic component 13b will generate waste heat during operation, which can be transferred to the first heat sink 14a and the second heat sink 14b through the thermal conductive paste Pa and thermal conductive paste Pb, thereby reducing the temperature of the first electronic component 13a, The temperature of the second electronic component 13b. The first heat dissipation element 14a and the second heat dissipation element 14b of this embodiment are, for example but not limited to, heatsinks with heat dissipation fins as an example, but it is not limited thereto. In different embodiments, the first The heat dissipation element 14 a and the second heat dissipation element 14 b can also be a heat conduction film or a heat dissipation film, which is not limited in the present disclosure.

在本實施例中，第一電子元件13a與第一散熱件14a的所在區域例如可為熱區，其溫度較高，第二電子元件13b與第二散熱件14b的所在區域例如可為涼區，其溫度較低，因此，可透過熱傳導模組15將熱區的熱量導引至涼區，藉此平衡電子裝置1運作時所產生的廢熱，提高整體的散熱效能。In this embodiment, the area where the first electronic component 13a and the first heat sink 14a are located may be, for example, a hot area with a relatively high temperature, and the area where the second electronic component 13b and the second heat sink 14b are located may be, for example, a cool area. , its temperature is relatively low, therefore, the heat from the hot area can be directed to the cool area through the heat conduction module 15, thereby balancing the waste heat generated during the operation of the electronic device 1 and improving the overall heat dissipation performance.

熱傳導件151可為高導熱係數的材料製成，其材料例如但不限於包括金屬、石墨片、石墨烯微片、奈米碳管、稀土金屬、或其組合。在一些實施例中，金屬例如但不限於包括銅、鋁、銅合金（銅和其他金屬的合金）、鋁合金（鋁和其他金屬的合金）、或其組合，並製作成金屬薄片、金屬箔或金屬膜的型式；在一些實施例中，熱傳導件151也可為石墨片、石墨烯微片、奈米碳管、或其組合所製成導熱膜或散熱膜；或者，熱傳導件151也可為導熱金屬與導熱膜（或散熱膜）的組合，例如鋁金屬箔與石墨烯層的疊層結構，本揭露不限制。The heat conducting member 151 can be made of a material with high thermal conductivity, such as but not limited to metal, graphite sheet, graphene micro-sheet, carbon nanotube, rare earth metal, or a combination thereof. In some embodiments, metals include, but are not limited to, copper, aluminum, copper alloys (copper and other metal alloys), aluminum alloys (aluminum and other metal alloys), or combinations thereof, and are made into metal sheets, metal foils or The type of metal film; in some embodiments, the heat conduction member 151 can also be a heat conduction film or a heat dissipation film made of graphite sheets, graphene microsheets, carbon nanotubes, or a combination thereof; or, the heat conduction member 151 can also be The combination of heat-conducting metal and heat-conducting film (or heat-dissipating film), such as the laminated structure of aluminum metal foil and graphene layer, is not limited in this disclosure.

在一些實施例中，石墨片可為人造石墨或天然石墨；石墨烯的片徑(D 50)例如可介於1微米(μm)～30 μm之間，厚度例如可介於1奈米(nm)～70 nm之間；而單壁或多壁奈米碳管的管徑例如可介於5 nm～30 nm之間，長度例如可介於5 μm～30 μm之間。另外，第一磁性件152a、152b可為薄型強力磁鐵，其可依據第一散熱件14a、第二散熱件14b的形狀及想要搭接的位置調整其位置及大小。 In some embodiments, the graphite flakes can be artificial graphite or natural graphite; the diameter (D 50 ) of graphene, for example, can be between 1 micron (μm) and 30 μm, and the thickness can be, for example, between 1 nanometer (nm) ) to 70 nm; and the diameter of the single-wall or multi-wall carbon nanotubes may be between 5 nm to 30 nm, and the length may be between 5 μm to 30 μm, for example. In addition, the first magnetic parts 152a and 152b can be thin and strong magnets, and their positions and sizes can be adjusted according to the shape of the first heat sink 14a and the second heat sink 14b and the desired overlapping positions.

為了在有限空間內將廢熱由熱區導引至涼區，本實施例的熱傳導件151具有可撓曲性（柔性件），熱傳導件151形狀及長度可配合殼體11內有限的空間進行搭接空間的設計，透過架橋搭接，使熱傳導件151的相反兩端部E1、E2可分別透過第一磁性件152a、152b磁吸於第一散熱件14a與第二散熱件14b，以將第一散熱件14a的（熱區）熱量透過熱傳導件151傳導至第二散熱件14b（涼區），提高整體的散熱效能。在此，第一磁性件152a、152b可以埋入或嵌入的方式設置於熱傳導件151中。其中，「埋入」是指：第一磁性件152a、152b完全被熱傳導件151包覆而不外露；而「嵌入」是指：熱傳導件151的兩端部E1、E2具有尺寸與第一磁性件152a、152b實質上相同的凹槽，第一磁性件152a、152b設於凹槽內，不易移位。「嵌入」可為「部分嵌入」或「完全嵌入」。「部分嵌入」指的是，第一磁性件152a、152b嵌入熱傳導件151的凹槽時，有一部分的第一磁性件152a、152b會露出凹槽之外；而「完全嵌入」指的是，第一磁性件152a、152b嵌入凹槽時，第一磁性件152a、152b的表面與熱傳導件151的表面齊平。In order to guide the waste heat from the hot area to the cool area in a limited space, the heat conduction member 151 of this embodiment has flexibility (flexible member), and the shape and length of the heat conduction member 151 can match the limited space in the housing 11 for overlapping. The design of the connection space, through bridging, makes the opposite ends E1, E2 of the heat conducting element 151 magnetically attract the first heat dissipation element 14a and the second heat dissipation element 14b through the first magnetic elements 152a, 152b respectively, so that the second heat dissipation element 14b The heat of the first heat sink 14a (hot area) is transferred to the second heat sink 14b (cool area) through the heat conduction element 151 , so as to improve the overall heat dissipation performance. Here, the first magnetic elements 152a, 152b may be embedded or embedded in the heat conducting element 151 . Wherein, "embedded" means: the first magnetic member 152a, 152b is completely covered by the heat conduction member 151 without being exposed; The parts 152a, 152b are substantially in the same groove, and the first magnetic parts 152a, 152b are disposed in the groove, which is not easy to be displaced. "Embedded" may be "Partially Embedded" or "Fully Embedded". "Partially embedded" means that when the first magnetic elements 152a, 152b are embedded in the grooves of the heat conducting element 151, a part of the first magnetic elements 152a, 152b will be exposed outside the grooves; and "completely embedded" means that, When the first magnetic parts 152a, 152b are inserted into the grooves, the surfaces of the first magnetic parts 152a, 152b are flush with the surface of the heat conducting part 151 .

如圖1C所示，本實施例的第一磁性件152a、152b是以分別埋入熱傳導件151的相反兩端部E1、E2為例，因此，相對於熱傳導件151的中間部分，端部E1、E2較厚。第一散熱件14a及第二散熱件14b可由磁吸的金屬材料（例如鐵、鈷、鎳）製成，使熱傳導件151的兩端部E1、E2可以分別吸附且固定在第一散熱件14a及第二散熱件14b的表面，讓廢熱可以經由熱傳導件151由第一散熱件14a傳導至第二散熱件14b。As shown in FIG. 1C, the first magnetic members 152a and 152b of this embodiment are respectively embedded in the opposite ends E1 and E2 of the heat conduction member 151 as an example. Therefore, relative to the middle part of the heat conduction member 151, the end E1 , E2 is thicker. The first heat sink 14a and the second heat sink 14b can be made of magnetic metal materials (such as iron, cobalt, nickel), so that the two ends E1 and E2 of the heat conduction member 151 can be respectively adsorbed and fixed on the first heat sink 14a and the surface of the second heat sink 14b, so that waste heat can be conducted from the first heat sink 14a to the second heat sink 14b via the heat conduction element 151 .

另外，如圖1D所示，如果熱傳導模組15需要加強固定其搭接位置、防止移位的話，則可以對第一散熱件14a及第二散熱件14b進行內銑製程，使第一散熱件14a及第二散熱件14b分別具有一凹部141a、141b（圖1D只繪示凹部141a），熱傳導件151的各端部E1、E2則可以對應嵌入各凹部141a、141b，使熱傳導模組15不易移位。In addition, as shown in FIG. 1D, if the thermal conduction module 15 needs to strengthen and fix its overlapping position to prevent displacement, the first heat sink 14a and the second heat sink 14b can be internally milled to make the first heat sink 14a and the second heat sink 14b 14a and the second heat sink 14b respectively have a concave portion 141a, 141b (only the concave portion 141a is shown in FIG. 1D ), and the ends E1, E2 of the heat conduction element 151 can be correspondingly embedded in the respective concave portions 141a, 141b, so that the heat conduction module 15 is not easily shift.

在一些實施例中，也可利用膠材黏貼方式，將第一磁性件152a、152b分別黏貼於熱傳導件151的相反兩端部E1、E2，使第一磁性件152a、152b可位於熱傳導件151面向或遠離第一散熱件14a與第二散熱件14b的表面。如圖1E所示，本實施例是以第一磁性件152a、152b分別黏貼於熱傳導件151遠離第一散熱件14a與第二散熱件14b的表面為例（黏貼用膠材未繪示）。In some embodiments, the first magnetic parts 152a, 152b can also be glued to the opposite ends E1, E2 of the heat conduction part 151 by using adhesive materials, so that the first magnetic parts 152a, 152b can be positioned on the heat conduction part 151. Surfaces facing or away from the first heat sink 14a and the second heat sink 14b. As shown in FIG. 1E , in this embodiment, the first magnetic elements 152 a and 152 b are respectively pasted on the surface of the heat conducting element 151 away from the first heat dissipation element 14 a and the second heat dissipation element 14 b as an example (adhesive materials are not shown).

在一些實施例中，第一散熱件14a及第二散熱件14b如果為不可磁吸的材料製成（例如鋁、銅、銀、金），則可分別加設一磁性件在第一散熱件14a及第二散熱件14b，才能與第一磁性件152a、152b對應磁吸。如圖1F所示，本實施例是以第二磁性件153a嵌入第一散熱件14a的凹部142a，使第一磁性件152a與第二磁性件153a對應磁吸為例。當然，在不同的實施例中，第二磁性件153a也可黏貼於第一散熱件14a的表面。In some embodiments, if the first heat sink 14a and the second heat sink 14b are made of non-magnetic materials (such as aluminum, copper, silver, gold), a magnetic piece can be added to the first heat sink respectively. 14a and the second heat dissipation element 14b can be magnetically attracted to the first magnetic elements 152a and 152b. As shown in FIG. 1F , in this embodiment, the second magnetic member 153 a is inserted into the concave portion 142 a of the first heat dissipation member 14 a so that the first magnetic member 152 a and the second magnetic member 153 a are magnetically attracted to each other as an example. Of course, in different embodiments, the second magnetic element 153a can also be pasted on the surface of the first heat dissipation element 14a.

承上，本實施例的電子裝置1中，透過兩個第一磁性件152a、152b分別設置於熱傳導件151的相反兩端部E1、E2，使熱傳導件151的相反兩端部E1、E2可分別透過第一磁性件152a、152b磁吸於第一散熱件14a與第二散熱件14b，以將第一散熱件14a的熱量透過熱傳導件151傳導至第二散熱件14b的結構設計，使本實施例的電子裝置1具有以下優點：1、利用磁吸固定減少固定熱傳導結構所需的空間，解決因電子裝置1內部空間限制而無法將廢熱由熱區轉移至涼區的問題。2、利用磁吸方式連接熱傳導結構轉移廢熱，因此可以多次重覆使用，易於重工。3、相較於傳統以黏貼的方式固定熱傳導結構來說，本實施例利用磁吸方式的固定性更好，可以避免架橋掉落的風險。4、傳統以鎖螺絲方式固定熱傳導結構，容易對電子元件造成擠壓而破壞其特性，本實施例的電子裝置1除了可達到熱量轉移的目的之外，還可避免元件擠壓的問題。As mentioned above, in the electronic device 1 of this embodiment, the two first magnetic members 152a, 152b are respectively arranged on the opposite ends E1, E2 of the heat conduction member 151, so that the opposite ends E1, E2 of the heat conduction member 151 can be The first heat sink 14a and the second heat sink 14b are magnetically attracted to the first heat sink 14a and the second heat sink 14b through the first magnetic parts 152a and 152b respectively, so as to conduct the heat of the first heat sink 14a to the second heat sink 14b through the heat conduction part 151. The electronic device 1 of the embodiment has the following advantages: 1. The space required for fixing the heat conduction structure is reduced by using magnetic fixation, which solves the problem that the waste heat cannot be transferred from the hot area to the cool area due to the limitation of the internal space of the electronic device 1 . 2. Use magnetic attraction to connect the heat conduction structure to transfer waste heat, so it can be reused many times and is easy to rework. 3. Compared with the traditional way of fixing the heat conduction structure by sticking, the fixation of the magnetic attraction method in this embodiment is better, which can avoid the risk of the bridge falling off. 4. The traditional way of fixing the heat conduction structure by locking screws is easy to squeeze the electronic components and destroy their characteristics. The electronic device 1 of this embodiment can not only achieve the purpose of heat transfer, but also avoid the problem of component extrusion.

請參照圖2A至圖2C所示，其分別為本揭露另一實施例的電子裝置的示意圖。其中，圖2B為圖2A之電子裝置的蓋體單元蓋合時的示意圖，而圖2C為圖2A之電子裝置的蓋體單元局部打開的示意圖。Please refer to FIG. 2A to FIG. 2C , which are schematic diagrams of an electronic device according to another embodiment of the present disclosure. 2B is a schematic view of the cover unit of the electronic device shown in FIG. 2A when it is closed, and FIG. 2C is a schematic view of the cover unit of the electronic device shown in FIG. 2A partially opened.

本實施例的電子裝置1a與前述實施例的電子裝置1其元件組成及各元件的連接關係大致相同，電子裝置1a同樣包括殼體11、第一電子元件13a、第二電子元件13b、第一散熱件14a、第二散熱件14b、熱傳導模組15及支撐件16。與電子裝置1主要的不同之處在於，本實施例的電子裝置1a為滑蓋型的電子裝置，其包括由支撐件16支撐的三層重疊結構的電路板12，最靠近熱傳導模組15的電路板12的同一側（上表面）設置有第一電子元件13a及第二電子元件13b。另外，本實施例的第一散熱件14a與第二散熱件14b例如可為導熱金屬片、導熱膜、或其組合，其設置於電路板12（及支撐件16）的同一側。在此，第一電子元件13a透過導熱膏Pa與第一散熱件14a連接，第二電子元件13b透過導熱膏Pb與第二散熱件14b連接，而熱傳導件151的相反兩端部E1、E2分別透過第一磁性件152a、152b磁吸於第一散熱件14a與第二散熱件14b，以將第一散熱件14a（熱區）的熱量透過熱傳導件151傳導至第二散熱件14b（涼區），藉此平衝第一電子元件13a與第二電子元件13b的溫度。本實施例的熱傳導模組15形成拱橋狀，中間部分拱起且與一第三散熱件172連接，且兩端部E1、E2分別連接第一散熱件14a與第二散熱件14b。另外，與電子裝置1相同，本實施例的第一磁性件152a、152b分別埋入熱傳導件151的兩端部E1、E2。此外，與電子裝置1相同，熱傳導模組15還可包括兩個第二磁性件（未繪示），其分別設置於第一散熱件14a及第二散熱件14b，且各第二磁性件在第一散熱件14a與第二散熱件14b的設置位置對應於各第一磁性件152a、152b。The electronic device 1a of the present embodiment is substantially the same as the electronic device 1 of the foregoing embodiment in that its component composition and the connection relationship of each component are substantially the same, and the electronic device 1a also includes a housing 11, a first electronic component 13a, a second electronic component 13b, a first The heat sink 14 a , the second heat sink 14 b , the heat conduction module 15 and the support 16 . The main difference from the electronic device 1 is that the electronic device 1a of this embodiment is a slide-type electronic device, which includes a circuit board 12 with a three-layer overlapping structure supported by a support member 16, and the circuit board 12 closest to the heat conduction module 15 The first electronic component 13 a and the second electronic component 13 b are provided on the same side (upper surface) of the circuit board 12 . In addition, the first heat dissipation element 14 a and the second heat dissipation element 14 b of this embodiment can be, for example, a heat-conducting metal sheet, a heat-conducting film, or a combination thereof, which are disposed on the same side of the circuit board 12 (and the supporting element 16 ). Here, the first electronic component 13a is connected to the first heat sink 14a through the thermally conductive paste Pa, the second electronic component 13b is connected to the second heat sink 14b through the thermally conductive paste Pb, and the opposite ends E1 and E2 of the heat conductive member 151 are respectively The first heat sink 14a and the second heat sink 14b are magnetically attracted to the first heat sink 14a and the second heat sink 14b through the first magnetic parts 152a and 152b, so as to transfer the heat of the first heat sink 14a (hot area) to the second heat sink 14b (cool area) through the heat conduction part 151 ), thereby balancing the temperatures of the first electronic component 13 a and the second electronic component 13 b. The heat conduction module 15 of this embodiment is in the shape of an arch bridge, the middle portion is arched and connected to a third heat sink 172 , and the two ends E1 and E2 are respectively connected to the first heat sink 14 a and the second heat sink 14 b. In addition, similar to the electronic device 1 , the first magnetic members 152 a , 152 b of this embodiment are respectively embedded in the two ends E1 , E2 of the heat conduction member 151 . In addition, the same as the electronic device 1, the thermal conduction module 15 can also include two second magnetic parts (not shown), which are respectively arranged on the first heat dissipation part 14a and the second heat dissipation part 14b, and each second magnetic part is on the The positions of the first heat dissipation element 14a and the second heat dissipation element 14b correspond to the respective first magnetic elements 152a, 152b.

本實施例的電子裝置1a還包括一蓋體單元17。蓋體單元17可移動地設置於殼體11上，且蓋體單元17能夠相對殼體11往復滑動，進而蓋合在殼體11（圖2B）；或者蓋體單元17相對殼體11為打開的狀態（圖2C）。在此，蓋體單元17的兩側分別具有一凸部171，而殼體11具有對應於兩個凸部171的兩個滑軌111，使蓋體單元17在殼體11上相對滑動。The electronic device 1 a of this embodiment further includes a cover unit 17 . The cover unit 17 is movably arranged on the housing 11 , and the cover unit 17 can slide back and forth relative to the housing 11 , and then cover the housing 11 ( FIG. 2B ); or the cover unit 17 is opened relative to the housing 11 state (Figure 2C). Here, two sides of the cover unit 17 respectively have a protrusion 171 , and the housing 11 has two sliding rails 111 corresponding to the two protrusions 171 , so that the cover unit 17 slides relatively on the housing 11 .

另外，本實施例的熱傳導模組15更可包括一第三磁性件18，第三磁性件18設置於熱傳導件151，並位於第一磁性件152a、152b之間，且熱傳導件151透過第三磁性件18磁吸於蓋體單元17。第三磁性件18可埋入或嵌入熱傳導件151中。本實施例的第三磁性件18是以埋入熱傳導件151中為例，且第三磁性件18磁吸於蓋體單元17（因此形成拱橋狀）。另外，本實施例的蓋體單元17包括一第三散熱件172，第三散熱件172（例如可以黏貼方式）面向熱傳導件151的表面並與熱傳導件151連接。在此，第三散熱件172例如但不限於為導熱金屬片、散熱膜、導熱膜、或其組合，以將熱傳導件151的熱量傳導至蓋體單元17，協助將廢熱散逸至外界。因此，本實施例的熱傳導模組15可搭配滑蓋式蓋體單元17，將電子裝置1內部電子元件所產生的熱能經由熱傳導模組15傳導至蓋體單元17，以透過蓋體單元17協助將廢熱散運至外界，提升電子裝置1a的整體散熱效能，同時，第三磁性件18的設置也可作為蓋體單元17與殼體11組裝時的固定與對位之用，並且在蓋體單元17與殼體11組裝後，使熱傳導件151透過磁力自動吸附於蓋體單元17，解決蓋體單元17組裝後無法對殼體11內之熱傳導件151施行固定加工的問題。In addition, the heat conduction module 15 of this embodiment may further include a third magnetic member 18, the third magnetic member 18 is disposed on the heat conduction member 151, and is located between the first magnetic members 152a, 152b, and the heat conduction member 151 passes through the third magnetic member 151. The magnetic component 18 is magnetically attracted to the cover unit 17 . The third magnetic element 18 can be buried or embedded in the heat conducting element 151 . The third magnetic member 18 in this embodiment is embedded in the heat conduction member 151 as an example, and the third magnetic member 18 is magnetically attracted to the cover unit 17 (thus forming an arch bridge shape). In addition, the cover unit 17 of this embodiment includes a third heat sink 172 , and the third heat sink 172 (for example, can be pasted) faces the surface of the heat conduction element 151 and is connected to the heat conduction element 151 . Here, the third heat sink 172 is, for example but not limited to, a heat-conducting metal sheet, a heat-dissipating film, a heat-conducting film, or a combination thereof, so as to conduct heat from the heat-conducting member 151 to the cover unit 17 to help dissipate waste heat to the outside. Therefore, the heat conduction module 15 of this embodiment can be used with the sliding cover unit 17 to conduct the heat energy generated by the electronic components inside the electronic device 1 to the cover unit 17 through the heat conduction module 15, so as to assist through the cover unit 17. Dissipate waste heat to the outside to improve the overall heat dissipation performance of the electronic device 1a. At the same time, the setting of the third magnetic part 18 can also be used for fixing and aligning the cover unit 17 and the housing 11 when assembling, and the cover body After the unit 17 is assembled with the housing 11, the heat conduction member 151 is automatically attracted to the cover unit 17 through magnetic force, which solves the problem that the heat conduction member 151 in the housing 11 cannot be fixed after the cover unit 17 is assembled.

在一些實施例中，如果蓋體單元17為非磁吸材料製成，同樣可在蓋體單元17上再設置另一磁性件（埋入或嵌入皆可），使熱傳導件151可透過第三磁性件18及該磁性件吸附於蓋體單元17。例如圖2D所示，熱傳導模組15更可包括一第四磁性件19，第四磁性件19可設置於第三散熱件172的內部且位置對應於第三磁性件18，使熱傳導件151可透過第三磁性件18及第四磁性件19吸附於蓋體單元17。In some embodiments, if the cover unit 17 is made of non-magnetic material, another magnetic member (embedded or embedded) can also be provided on the cover unit 17, so that the heat conduction member 151 can pass through the third The magnetic component 18 and the magnetic component are attracted to the cover unit 17 . For example, as shown in FIG. 2D, the heat conduction module 15 can further include a fourth magnetic member 19, and the fourth magnetic member 19 can be arranged inside the third heat dissipation member 172 and its position corresponds to the third magnetic member 18, so that the heat conduction member 151 can Adsorbed to the cover unit 17 through the third magnetic piece 18 and the fourth magnetic piece 19 .

綜上所述，在本揭露的熱傳導模組及電子裝置中，透過兩個第一磁性件分別設置於熱傳導件的相反兩端部，且這兩個第一磁性件分別磁吸於第一散熱件與第二散熱件，以將第一散熱件的熱量透過熱傳導件傳導至第二散熱件的結構設計，使本揭露具有以下優點：1、利用磁吸固定減少固定熱傳導結構所需的空間，解決因電子裝置內部空間限制而無法將廢熱由熱區轉移至涼區的問題。2、利用磁吸方式連接熱傳導結構轉移廢熱，因此可以多次重覆使用，易於重工。3、相較於傳統以黏貼的方式固定熱傳導結構來說，本揭露利用磁吸方式的固定性更好，可以避免架橋掉落的風險。4、傳統以鎖螺絲方式固定熱傳導結構，容易對電子元件造成擠壓而破壞其特性，本揭露的電子裝置除了可達到熱量轉移的目的之外，還可避免元件擠壓的問題。To sum up, in the heat conduction module and electronic device of the present disclosure, the two first magnetic parts are respectively arranged on opposite ends of the heat conduction part, and the two first magnetic parts are respectively magnetically attracted to the first heat sink. The structural design of conducting the heat of the first heat dissipation element to the second heat dissipation element through the heat conduction element makes this disclosure have the following advantages: 1. The space required for fixing the heat conduction structure is reduced by using magnetic attraction, Solve the problem that the waste heat cannot be transferred from the hot area to the cool area due to the limitation of the internal space of the electronic device. 2. Use magnetic attraction to connect the heat conduction structure to transfer waste heat, so it can be reused many times and is easy to rework. 3. Compared with the traditional way of fixing the heat conduction structure by sticking, the magnetic attraction method of the present disclosure is better in fixing, which can avoid the risk of the bridge falling off. 4. Traditionally, the heat conduction structure is fixed by locking screws, which is easy to squeeze the electronic components and destroy their characteristics. The electronic device disclosed in this disclosure can not only achieve the purpose of heat transfer, but also avoid the problem of component extrusion.

以上所述僅為舉例性，而非為限制性者。任何未脫離本發明之精神與範疇，而對其進行之等效修改或變更，均應包含於後附之申請專利範圍中。The above descriptions are illustrative only, not restrictive. Any equivalent modification or change made without departing from the spirit and scope of the present invention shall be included in the scope of the appended patent application.

1,1a, 1b:電子裝置 11:殼體 111:滑軌 12:電路板 12a:第一電路板 12b:第二電路板 13a:第一電子元件 13b:第二電子元件 14a:第一散熱件 141a,142a:凹部 14b:第二散熱件 15:熱傳導模組 151:熱傳導件 152a,152b:第一磁性件 153a:第二磁性件 16:支撐件 17:蓋體單元 171:凸部 172:第三散熱件 18:第三磁性件 19:第四磁性件 A:區域 E1,E2:端部 Pa,Pb:導熱膏 1, 1a, 1b: Electronic devices 11: shell 111: slide rail 12: Circuit board 12a: The first circuit board 12b: Second circuit board 13a: The first electronic component 13b: Second electronic component 14a: the first radiator 141a, 142a: recessed part 14b: Second heat sink 15: Heat conduction module 151: heat conduction parts 152a, 152b: first magnetic member 153a: second magnetic piece 16: Support 17: Cover unit 171: convex part 172: The third radiator 18: The third magnetic piece 19: The fourth magnetic piece A: area E1, E2: end Pa,Pb: thermal paste

圖1A為本揭露一實施例之電子裝置俯視示意圖。 圖1B為圖1A的電子裝置的立體剖視示意圖。 圖1C至圖1F分別為圖1A的電子裝置中，不同實施態樣的區域A的放大示意圖。 圖2A至圖2C分別為本揭露另一實施例的電子裝置的示意圖。 圖2D為本揭露又一實施例的電子裝置的示意圖。 FIG. 1A is a schematic top view of an electronic device according to an embodiment of the present disclosure. FIG. 1B is a schematic three-dimensional cross-sectional view of the electronic device in FIG. 1A . FIG. 1C to FIG. 1F are enlarged schematic diagrams of regions A of different implementations in the electronic device of FIG. 1A . 2A to 2C are schematic diagrams of an electronic device according to another embodiment of the present disclosure. FIG. 2D is a schematic diagram of an electronic device according to another embodiment of the present disclosure.

1:電子裝置 1: Electronic device

11:殼體 11: Housing

12a:第一電路板 12a: The first circuit board

12b:第二電路板 12b: Second circuit board

13a:第一電子元件 13a: The first electronic component

13b:第二電子元件 13b: Second electronic component

14a:第一散熱件 14a: the first radiator

14b:第二散熱件 14b: Second heat sink

15:熱傳導模組 15: Heat conduction module

151:熱傳導件 151: heat conduction parts

152a,152b:第一磁性件 152a, 152b: first magnetic member

16:支撐件 16: Support

A:區域 A: area

E1,E2:端部 E1, E2: end

Pa,Pb:導熱膏 Pa,Pb: thermal paste

Claims (9)

一種熱傳導模組，適於與一第一散熱件、一第二散熱件及一第三散熱件配合應用，該熱傳導模組包括：一熱傳導件，具有可撓曲性；兩第一磁性件，分別設置於該熱傳導件的相反兩端部，且該兩第一磁性件分別磁吸於該第一散熱件與該第二散熱件，以將該第一散熱件的熱量透過該熱傳導件傳導至該第二散熱件；以及一第三磁性件，設置於該熱傳導件並位於該兩第一磁性件之間，該第三磁性件磁吸於該第三散熱件。 A heat conduction module, suitable for use in cooperation with a first heat sink, a second heat sink, and a third heat sink, the heat conduction module includes: a heat conduction element with flexibility; two first magnetic elements, The two first magnetic parts are respectively arranged on the opposite ends of the heat conduction part, and the two first magnetic parts are respectively magnetically attracted to the first heat sink and the second heat sink, so that the heat of the first heat sink can be conducted to the heat sink through the heat conduction part. the second heat dissipation element; and a third magnetic element disposed on the heat conducting element and between the two first magnetic elements, and the third magnetic element is magnetically attracted to the third heat dissipation element. 如請求項1所述的熱傳導模組，其中該熱傳導件的材料包括金屬、石墨片、石墨烯微片、奈米碳管、稀土金屬、或其組合。 The heat conduction module according to claim 1, wherein the material of the heat conduction member includes metal, graphite sheet, graphene microflake, carbon nanotube, rare earth metal, or a combination thereof. 如請求項1所述的熱傳導模組，更包括：兩第二磁性件，分別設置於該第一散熱件及該第二散熱件並對應於該兩第一磁性件。 The thermal conduction module as claimed in claim 1, further comprising: two second magnetic elements respectively disposed on the first heat dissipation element and the second heat dissipation element and corresponding to the two first magnetic elements. 如請求項1所述的熱傳導模組，更包括：一第四磁性件，設置於該第三散熱件且對應於該第三磁性件。 The thermal conduction module as claimed in claim 1 further includes: a fourth magnetic element disposed on the third heat sink and corresponding to the third magnetic element. 一種電子裝置，包括：一殼體；一第一電子元件、一第二電子元件、一第一散熱件及一第二散熱件，皆設置於該殼體內，該第一散熱件與該第一電子元件連接，該第二散熱件與該第二電子元件連接；一蓋體單元，可移動地設置於該殼體，該蓋體單元包括一第三散熱件；以及一熱傳導模組，設置於該殼體內，該熱傳導模組包括：一熱傳導件，具有可撓曲性；兩第一磁性件，分別設置於該熱傳導件的相反兩端部，該兩第一磁性件分別磁吸於該第一散熱件與該第二散熱件，以將該第一散熱件的熱量透過該熱傳導件傳導至該第二散熱件；及 一第三磁性件，設置於該熱傳導件並位於該兩第一磁性件之間，且磁吸於該蓋體單元；其中，該第三散熱件與該熱傳導件連接，以將該熱傳導件的熱量傳導至該蓋體單元。 An electronic device, comprising: a shell; a first electronic component, a second electronic component, a first heat sink and a second heat sink, all of which are arranged in the shell, the first heat sink and the first heat sink The electronic component is connected, and the second heat sink is connected with the second electronic component; a cover unit is movably arranged on the housing, and the cover unit includes a third heat sink; and a heat conduction module is set on the In the casing, the heat conduction module includes: a heat conduction element, which has flexibility; two first magnetic elements are respectively arranged at opposite ends of the heat conduction element, and the two first magnetic elements are respectively magnetically attracted to the second end of the heat conduction element. a heat sink and the second heat sink, so that the heat of the first heat sink is conducted to the second heat sink through the heat conduction element; and A third magnetic part is arranged on the heat conduction part and is located between the two first magnetic parts, and is magnetically attracted to the cover unit; wherein, the third heat dissipation part is connected with the heat conduction part, so that the heat conduction part Heat is conducted to the cover unit. 如請求項5所述的電子裝置，其中該熱傳導件的材料包括金屬、石墨片、石墨烯微片、奈米碳管、稀土金屬、或其組合。 The electronic device as claimed in claim 5, wherein the material of the heat conducting member includes metal, graphite sheet, graphene micro-sheet, carbon nanotube, rare earth metal, or a combination thereof. 如請求項5所述的電子裝置，其中該熱傳導模組更包括：兩第二磁性件，分別設置於該第一散熱件及該第二散熱件並對應於該兩第一磁性件。 The electronic device as claimed in claim 5, wherein the heat conduction module further includes: two second magnetic elements respectively disposed on the first heat dissipation element and the second heat dissipation element and corresponding to the two first magnetic elements. 如請求項5所述的電子裝置，更包括：一第一電路板及一第二電路板，設置於該殼體內並沿該第一電路板表面的法線方向間隔排列，該第一電子元件設置於該第一電路板，該第二電子元件設置於該第二電路板。 The electronic device as described in claim 5, further comprising: a first circuit board and a second circuit board, arranged in the casing and arranged at intervals along the normal direction of the surface of the first circuit board, the first electronic component It is arranged on the first circuit board, and the second electronic component is arranged on the second circuit board. 如請求項5所述的電子裝置，其中該熱傳導模組更包括一第四磁性件，該第四磁性件設置於該第三散熱件且對應於該第三磁性件。 The electronic device according to claim 5, wherein the heat conduction module further includes a fourth magnetic element, the fourth magnetic element is disposed on the third heat dissipation element and corresponds to the third magnetic element.
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CN111913550A (en) * 2020-09-10 2020-11-10 周登青 Pluggable heat dissipation system
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