CN114828538A

CN114828538A - Heat-conducting adhesion structure and electronic device

Info

Publication number: CN114828538A
Application number: CN202110125591.5A
Authority: CN
Inventors: 魏松烟; 郑嘉晋
Original assignee: Sulfurscience Technology Co ltd
Current assignee: Sulfurscience Technology Co ltd
Priority date: 2021-01-29
Filing date: 2021-01-29
Publication date: 2022-07-29

Abstract

The invention discloses a heat conduction adhesion structure and an electronic device. The heat-conducting adhesion structure comprises a metal layer, a carbon nanotube layer and a first adhesion layer. The carbon nanotube layer is arranged on the metal layer and comprises a plurality of carbon nanotubes; the first adhesion layer is arranged on the carbon nanotube layer, and the material of the first adhesion layer is positioned in the gaps of the carbon nanotubes. The heat-conducting adhesion structure not only has an adhesion function, but also can assist in heat conduction and improve the heat dissipation efficiency of the electronic device.

Description

Heat-conducting adhesion structure and electronic device

Technical Field

The present invention relates to a heat conductive adhesive structure, and more particularly, to a heat conductive adhesive structure and an electronic device using the same.

Background

In recent years, the degree of integration of flat display devices or apparatuses (such as mobile phones, tablet computers, notebook computers, or servers) has become higher due to the development of process technologies, and thus, "heat dissipation" has been an indispensable function required for these devices or apparatuses. Particularly, in the case of high power components, the temperature of the electronic device may rapidly rise due to the large increase of heat energy generated during operation, and when the electronic device is subjected to an excessive temperature, the components or the device may be permanently damaged, or the lifetime of the electronic device may be greatly reduced.

Taking a flat panel display such as an Organic Light Emitting Diode (OLED) display or a Liquid Crystal Display (LCD) as an example, it is known to attach a heat dissipation structure to the back surface of the display or a heat generating component (such as a CPU) by using, for example, a double-sided tape, so as to dissipate heat generated by the display or the heat generating component to the outside through the heat dissipation structure. However, the double-sided adhesive tape in the prior art generally cannot assist the conduction of heat energy, thereby indirectly affecting the heat dissipation performance.

Disclosure of Invention

The present invention is directed to a heat conductive adhesive structure and an electronic device using the same, which not only have an adhesive function, but also can help to improve heat dissipation efficiency.

The invention provides a heat conduction adhesion structure, which comprises a metal layer, a carbon nanotube layer and a first adhesion layer. The carbon nanotube layer is arranged on the metal layer and comprises a plurality of carbon nanotubes; the first adhesion layer is arranged on the carbon nanotube layer, and the material of the first adhesion layer is positioned in the gaps of the carbon nanotubes.

In one embodiment, the thermally conductive adhesive structure further comprises a graphene layer disposed between the metal layer and the carbon nanotube layer.

In one embodiment, the graphene layer covers at least a portion of the surface of the metal layer.

In one embodiment, the included angle between the axial direction of the carbon nanotubes and the graphene layer or the metal layer is greater than 0 degree and less than or equal to 90 degrees.

In one embodiment, the thermally conductive adhesive structure further includes another carbon nanotube layer disposed on a side of the metal layer away from the graphene layer, the another carbon nanotube layer includes a plurality of carbon nanotubes, and a second adhesive layer disposed on a side of the another carbon nanotube layer away from the metal layer, the second adhesive layer is made of a material located in a gap between the carbon nanotubes of the another carbon nanotube layer.

In one embodiment, the thermally conductive adhesive structure further comprises another graphene layer disposed between the metal layer and the another carbon nanotube layer.

In one embodiment, the thermally conductive adhesive structure further includes a second adhesive layer disposed on a side of the metal layer away from the carbon nanotube layer,

in one embodiment, the first adhesive layer or the second adhesive layer includes a glue material and a heat conductive material mixed in the glue material.

In one embodiment, the thermal adhesion structure further includes another carbon nanotube layer disposed on a side of the metal layer away from the carbon nanotube layer, the another carbon nanotube layer includes a plurality of carbon nanotubes, and the material of the second adhesion layer is located in a gap between the carbon nanotubes of the another carbon nanotube layer.

In one embodiment, the heat conductive adhesive structure further includes two release layers, one of the release layers is disposed on a side of the first adhesive layer away from the metal layer, and the other of the release layers is disposed on a side of the second adhesive layer away from the metal layer.

The invention also provides a heat conduction adhesion structure, which comprises a carbon nanotube layer, a first adhesion layer and a second adhesion layer. The carbon nanotube layer includes a plurality of carbon nanotubes; the first adhesion layer is arranged on the carbon nanotube layer, and the material of the first adhesion layer is positioned in the gaps of the carbon nanotubes; the second adhesion layer is arranged on one side of the carbon nanotube layer far away from the first adhesion layer.

In one embodiment, the first adhesion layer covers the carbon nanotube layer.

In one embodiment, the thermally conductive adhesive structure further includes a metal layer disposed between the carbon nanotube layer and the second adhesive layer, and a graphene layer disposed between the metal layer and the carbon nanotube layer.

In one embodiment, the thermally conductive adhesive structure further comprises a graphene layer disposed between the carbon nanotube layer and the second adhesive layer.

The invention further provides an electronic device, which includes a heat source, the heat-conducting adhesion structure and the heat dissipation structure. The heat conduction adhesion structure is arranged on the heat source; the heat dissipation structure is connected with the heat source through the heat conduction adhesion structure.

In summary, in the heat conductive adhesive structure and the electronic device of the present invention, the carbon nanotube layer is disposed on the metal layer and includes a plurality of carbon nanotubes, and the first adhesive layer is disposed on the carbon nanotube layer and the material of the first adhesive layer is located in the gaps between the carbon nanotubes; or, the carbon nanotube layer includes a plurality of carbon nanotubes, the first adhesion layer is disposed on the carbon nanotube layer, and the material of the first adhesion layer is located in the gap between the carbon nanotubes, and the second adhesion layer is disposed on the carbon nanotube layer and away from the structural design of the first adhesion layer, when the heat-conducting adhesion structure is connected to the heat source of the electronic device, the heat-conducting adhesion structure can assist in conducting the heat energy of the heat source, thereby improving the heat dissipation performance of the electronic device.

Drawings

Fig. 1 is a schematic view of a thermal conductive adhesive structure according to an embodiment of the invention.

Fig. 2A to fig. 2L are schematic views of a thermal conductive adhesive structure according to different embodiments of the invention.

Fig. 3 is a schematic diagram of an electronic device according to an embodiment of the invention.

Detailed Description

The thermally conductive adhesive structure and the electronic device according to some embodiments of the present invention will be described with reference to the accompanying drawings, wherein like elements are denoted by like reference numerals. The following examples are presented to illustrate relative relationships and are not intended to represent actual component ratios or sizes.

The heat-conducting adhesion structure not only has the adhesion (adhesion and bonding) function, but also can assist in improving the heat dissipation efficiency of the electronic device when being applied to the electronic device. The heat source of the electronic device may be, but is not limited to, a battery, a control chip, a motherboard, a Central Processing Unit (CPU), a memory, a display adapter, a display panel, or a planar light source of the electronic device, or other components or units that generate heat.

Fig. 1 is a schematic view of a thermal conductive adhesive structure according to an embodiment of the invention. As shown in fig. 1, the heat conductive adhesive structure 1 of the present embodiment may be, for example, a single-sided tape, which may include a metal layer 11, a carbon nanotube layer 12, and a first adhesive layer 13.

The carbon nanotube layer 12 is disposed on the metal layer 11. The metal layer 11 is, for example, but not limited to, a high thermal conductivity metal sheet, a metal foil, or a metal film, and the material thereof may, for example, but not limited to, include gold, silver, copper, aluminum, platinum, or a combination thereof. The carbon nanotube layer 12 includes a plurality of carbon nanotubes 121, and an included angle between an axial direction of the carbon nanotubes 121 and the metal layer 11 may be greater than 0 degree and less than or equal to 90 degrees. The carbon nanotubes 121 of this embodiment have an axial direction perpendicular to the surface 111 of the metal layer 11. In some embodiments, the axial direction of the carbon nanotubes 121 may be perpendicular or similar to the surface 111 of the perpendicular metal layer 11; alternatively, the included angle between the axial direction of the carbon nanotube 121 and the surface 111 of the metal layer 11 may be between 0 degree and 90 degrees, which is not limited in the present invention.

The first adhesion layer 13 is disposed on the carbon nanotube layer 12, and the material of the first adhesion layer 13 is located in the gap between the carbon nanotubes 121 of the carbon nanotube layer 12. Specifically, the material of the first adhesive layer 13 having fluidity, such as gel or paste, may be disposed on the carbon nanotube layer 12 by, for example, coating, printing, or other suitable methods, so that the material of the first adhesive layer 13 fills the gaps of the carbon nanotubes 121 (preferably fills all the gaps) to form the first adhesive layer 13. The first adhesive layer 13 of the present embodiment not only fills the gaps between the carbon nanotubes 121, but also covers the surface of the carbon nanotube layer 12 away from the metal layer 11 (i.e. completely covers the carbon nanotubes 121), thereby improving the heat conduction effect. Of course, the gaps of the carbon nanotubes 121 may not be completely filled with the material of the first adhesion layer 13 due to the process or other factors.

The first adhesive layer 13 is a heat conductive adhesive, which may include an adhesive material and a heat conductive material mixed in the adhesive material. Therefore, the first adhesive layer 13 can assist in the heat conduction in addition to the adhesive function. Specifically, since the first adhesive layer 13 includes a glue material and has viscosity, the heat conductive adhesive structure 1 including the metal layer 11, the carbon nanotube layer 12 and the first adhesive layer 13 can be adhered to the heat source through the first adhesive layer 13 (the heat conductive adhesive structure 1 can also be adhered to the heat source directly or indirectly (for example, through an adhesive) through the metal layer 11). In addition, the first adhesive layer 13 also includes a heat conductive material, so that the conduction of heat energy can be assisted. The thermally conductive material may include, for example, graphene, artificial graphite, natural graphite, carbon black, thermally conductive metal particles, or combinations thereof. The material of the heat conductive metal particles may include, but is not limited to, gold, silver, copper, aluminum, platinum, or a combination thereof.

The heat conductive material of the present embodiment is a graphene microchip. In some embodiments, a portion of the graphene micro-sheets is located inside the first adhesive layer 13, but a portion of the graphene micro-sheets may protrude from the surface of the first adhesive layer 13. In addition, the graphene nanoplatelets may comprise an overall content of greater than 0 and less than or equal to 15% (0< graphene nanoplatelet content ≦ 15%), such as 1.5%, 3.2%, 5%, 7.5%, 11%, 13%, or others. In addition, the aforementioned plastic material can be, for example, but not limited to, a Pressure Sensitive Adhesive (PSA), and the material thereof can include, for example, a rubber system, an acrylic system, or a silicon-based system, or a combination thereof; the chemical composition may be rubber, acrylic, silicone, or a combination thereof, and the present invention is not limited thereto.

In summary, the heat conductive adhesive structure 1 of the present embodiment includes the metal layer 11 with high thermal conductivity, the carbon nanotube layer 12 includes a plurality of carbon nanotubes 121, the carbon nanotubes 121 have excellent thermal conductivity (thermal conductivity >3000W/m-K), the first adhesive layer 13 also has a heat conductive material (e.g., graphene) with high thermal conductivity, and the material of the first adhesive layer 13 is located in the gap between the carbon nanotubes 121 of the carbon nanotube layer 12, so that when the heat conductive adhesive structure 1 is connected to a heat source of an electronic device, the heat conductive adhesive structure 1 can assist in conducting heat generated by the heat source of the electronic device, in addition to having an adhesive function, thereby improving heat dissipation performance. In addition, the graphene nanoplatelets in the first adhesive layer 13 of the present embodiment have a high Young's modulus (Young's modulus), so that the overall strength of the thermal conductive adhesive structure 1 can be increased. In addition, since the first adhesive layer 13 has the graphene microchip capable of absorbing electromagnetic waves, the heat conductive adhesive structure 1 of the embodiment can also have the function of shielding electromagnetic waves.

Fig. 2A to fig. 2L are schematic views of a thermal conductive adhesive structure according to different embodiments of the present invention.

As shown in fig. 2A, the heat conductive adhesive structure 1a of the present embodiment is substantially the same as the heat conductive adhesive structure 1 of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the thermal adhesive structure 1a of the embodiment may further include a graphene layer 14, and the graphene layer 14 includes a plurality of graphene micro-sheets and is disposed between the metal layer 11 and the carbon nanotube layer 12. The graphene layer 14 may cover at least a portion of the surface 111 of the metal layer 11. Specifically, the graphene layer 14 may cover the entire surface 111 of the metal layer 11, or may be aggregated into island shapes and separated from each other to cover a portion of the surface 111 of the metal layer 11. The graphene layer 14 of the present embodiment is entirely coated on the surface 111 of the metal layer 11. In addition, an included angle between the axial direction of the carbon nanotubes 121 of the carbon nanotube layer 12 and the graphene layer 14 may be greater than 0 degree and equal to or less than 90 degrees. The axial direction of the carbon nanotubes 121 in this embodiment is perpendicular to the surface of the graphene layer 14. In some embodiments, the axial direction of the carbon nanotubes 121 may be perpendicular or similar to perpendicular to the surface of the graphene layer 14; alternatively, the included angle between the axial direction of the carbon nanotube 121 and the surface of the graphene layer 14 may be between 0 degree and 90 degrees, which is not limited in the present invention.

In some embodiments, if the graphene layers 14 are agglomerated in island shapes and are separated from each other and cover part of the surface 111 of the metal layer 11, the axial direction of some portions of the carbon nanotubes 121 is substantially perpendicular or similar to the perpendicular graphene layer 14, but the axial direction of another portion of the carbon nanotubes 121 is substantially perpendicular or similar to the surface 111 of the metal layer 11 of perpendicular material, such as aluminum. It should be noted that if the material of the metal layer 11 is copper, the carbon nanotubes 121 will only grow on the graphene layer 14 (i.e. the axial direction is substantially vertical or similar to the vertical graphene layer 14), and will not grow on the metal layer 11 made of copper, depending on the material of the metal layer 11, the existence of the graphene layer 14 and the coverage rate thereof, the axial direction of the carbon nanotubes 121 is determined. In some embodiments, the thickness of the aforementioned graphene nanoplatelets may be greater than or equal to 0.3 nanometers (nm) and less than or equal to 3 nanometers (0.3nm ≦ thickness ≦ 3nm), while the sheet diameter (i.e., maximum width) of each graphene nanoplatelet may be greater than or equal to 1 micrometer and less than or equal to 30 micrometers (1 μm ≦ sheet diameter ≦ 30 μm).

In addition, as shown in fig. 2B, the heat conductive adhesive structure 1B of the present embodiment is substantially the same as the heat conductive adhesive structure 1 of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the heat conductive adhesive structure 1b of the present embodiment further includes a second adhesive layer 15, and the second adhesive layer 15 is disposed on a side of the metal layer 11 away from the carbon nanotube layer 12. Here, the second adhesion layer 15 is disposed on the surface 112 (i.e. the lower surface, the surface 112 and the surface 111 are opposite surfaces) of the metal layer 11, and the material thereof may be the same as or different from that of the first adhesion layer 13. The material of the second adhesive layer 15 in this embodiment is the same as the material of the first adhesive layer 13. In some embodiments, the second adhesive layer 15 can be an adhesive tape, or can be formed after the adhesive is cured, and is not limited. The upper and lower sides of the heat-conducting adhesive structure 1b of the present embodiment are respectively provided with an adhesive layer (13, 15), so that the heat-conducting adhesive structure 1b can be similar to a double-sided tape, and therefore, the first adhesive layer 13 or the second adhesive layer 15 can be used to connect with a heat source.

In addition, as shown in fig. 2C, the heat conductive adhesive structure 1C of the present embodiment is substantially the same as the heat conductive adhesive structure 1 of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the thermal conductive adhesive structure 1c of the present embodiment may further include a graphene layer 14 and a second adhesive layer 15, and the second adhesive layer 15 may be disposed on a side of the carbon nanotube layer 12 away from the first adhesive layer 13. Here, since the metal layer 11 is located between the carbon nanotube layer 12 and the second adhesion layer 15, the second adhesion layer 15 is disposed on the surface 112 of the metal layer 11 away from the carbon nanotube layer 12. In addition, the graphene layer 14 is disposed between the metal layer 11 and the carbon nanotube layer 12.

In addition, as shown in fig. 2D, the heat conductive adhesive structure 1D of the present embodiment is substantially the same as the heat conductive adhesive structure 1c of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the thermal conductive adhesive structure 1d of the present embodiment further includes at least one release layer disposed on one side of the first adhesive layer 13 or the second adhesive layer 15 away from the carbon nanotube layer 12. In this embodiment, two

release layers

16a and 16b are taken as an example. The release layer 16a is disposed on a side of the first adhesive layer 13 away from the metal layer 11, and the release layer 16b is disposed on a side of the second adhesive layer 15 away from the metal layer 11. Here, the release layer 16a is disposed on the upper surface of the first adhesive layer 13 to protect the first adhesive layer 13, and the release layer 16b is disposed on the lower surface of the second adhesive layer 15 to protect the second adhesive layer 15, thereby protecting the whole thermal conductive adhesive structure 1 d. The material of the release layers 16a, 16b may be, for example, but not limited to, paper, cloth, or polyester (e.g., polyethylene terephthalate, PET), or a combination thereof. Therefore, when the heat conductive adhesive structure 1d is to be used, the release layer 16a or the release layer 16b can be removed, and then the heat conductive adhesive structure is adhered to the heat source through one of the first adhesive layer 13 and the second adhesive layer 15, and the heat dissipation structure is adhered to the heat source through the other one of the first adhesive layer 13 and the second adhesive layer 15. It is specifically noted that the release layers 16a, 16b can also be applied to all the above or below embodiments of the present invention.

The heat conductive adhesive structures 1a to 1d of the above embodiments are all provided with the metal layer 11, and in applications of different embodiments, the metal layer 11 may not be provided according to the thickness and operation or heat dissipation requirements of the whole heat conductive adhesive structure (as in the following embodiments of fig. 2E and 2F).

For example, as shown in fig. 2E, the heat conductive adhesive structure 1E of the present embodiment is substantially the same as the heat conductive adhesive structure 1c of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the heat conductive adhesive structure 1e of the present embodiment does not include the metal layer 11, the graphene layer 14 is disposed between the carbon nanotube layer 12 and the second adhesive layer 15, and the second adhesive layer 15 is directly disposed on the surface of the graphene layer 14 away from the carbon nanotube layer 12.

In addition, as shown in fig. 2F, the heat conductive adhesive structure 1F of the present embodiment is substantially the same as the heat conductive adhesive structure 1c of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the thermal conductive adhesive structure 1f of the present embodiment does not have the graphene layer 14, except for the metal layer 11. Here, the second adhesive layer 15 is used as a growth substrate of the carbon nanotube layer 12, so that the carbon nanotubes 121 are directly formed on the second adhesive layer 15. Therefore, in the heat conductive adhesive structure 1f of the embodiment, the carbon nanotube layer 12 includes a plurality of carbon nanotubes 121, the first adhesive layer 13 is disposed on the carbon nanotube layer 12 and covers the carbon nanotube layer 12, the material of the first adhesive layer 13 is located in the gap between the carbon nanotubes 121 of the carbon nanotube layer 12, and the second adhesive layer 15 is disposed on a side of the carbon nanotube layer 12 away from the first adhesive layer 13.

In addition, as shown in fig. 2G, the heat conductive adhesive structure 1G of the present embodiment is substantially the same as the heat conductive adhesive structure 1 of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the heat conductive adhesive structure 1g of the present embodiment further includes another carbon nanotube layer 12a and a second adhesive layer 15, wherein the carbon nanotube layer 12a is disposed on a side of the metal layer 11 away from the carbon nanotube layer 12. Here, the carbon nanotube layer 12a is disposed on the surface 112 of the metal layer 11. The carbon nanotube layer 12a may include a plurality of carbon nanotubes 121a, and the second adhesion layer 15 is disposed on a side of the carbon nanotube layer 12a away from the metal layer 11. Here, the second adhesion layer 15 covers the carbon nanotube layer 12a, and the material of the second adhesion layer 15 is also located in the gap between the carbon nanotubes 12a of the carbon nanotube layer 12 a.

In addition, as shown in fig. 2H, the heat conductive adhesive structure 1H of the present embodiment is substantially the same as the heat conductive adhesive structure 1a of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the heat conductive adhesive structure 1h of the present embodiment further includes another carbon nanotube layer 12a and a second adhesive layer 15, wherein the carbon nanotube layer 12a is disposed on a side of the metal layer 11 away from the graphene layer 14 (i.e., disposed on the surface 112 of the metal layer 11). The carbon nanotube layer 12a includes a plurality of carbon nanotubes 121a, and the second adhesive layer 15 is disposed on a side of the carbon nanotube layer 12a away from the metal layer 11. Here, the second adhesion layer 15 covers the carbon nanotube layer 12a, and the material of the second adhesion layer 15 is located in the gap between the carbon nanotubes 121 of the carbon nanotube layer 12 a.

In addition, as shown in fig. 2I, the heat conductive adhesive structure 1I of the present embodiment is substantially the same as the heat conductive adhesive structure 1h of the previous embodiment in terms of component composition and connection relationship of the components. The difference is that the thermal adhesive structure 1i of the embodiment further includes another graphene layer 14a, the graphene layer 14a is disposed between the metal layer 11 and the carbon nanotube layer 12a, and an included angle between the axial direction of the carbon nanotubes 121a of the graphene layer 14a and the graphene layer 14a may be greater than 0 degree and less than or equal to 90 degrees. Here, it is taken as an example that an included angle between the axial direction of the carbon nanotubes 121a and the graphene layer 14a is substantially equal to 90 degrees.

In addition, the release layers 16a, 16b described above can also be applied to the thermal

adhesive structures

1g, 1i and 1h to obtain the thermal adhesive structures 1J, 1K and 1L shown in fig. 2J, 2K and 2L.

In addition, fig. 3 is a schematic view of an electronic device according to an embodiment of the present invention. As shown in fig. 3, the present invention further provides an electronic device 2, wherein the electronic device 2 may include a heat source 21, a heat conductive adhesive structure 22 and a heat dissipation structure 23. The heat conductive adhesive structure 22 is disposed on the heat source 21, and the heat dissipation structure 23 is connected to the heat source 21 through the heat conductive adhesive structure 22. The thermal adhesive structure 22 may be one of the above thermal adhesive structures 1, 1a to 1l, or a variation thereof, and the detailed technical contents are described in detail above and will not be further described herein. It is noted that, if the thermal conductive adhesive structure has a release layer, the release layer needs to be removed before the adhesion.

Therefore, in the electronic device 2, the heat dissipation structure 23 can be connected to the heat source 21 through the heat conductive adhesive structure 22, and the heat generated by the heat source 21 can be rapidly conducted to the heat dissipation structure 23 with the aid of the heat conductive adhesive structure 22, so that the heat generated by the electronic device 2 is dissipated to the outside through the heat dissipation structure 23, thereby enhancing the heat dissipation performance. In some embodiments, the heat dissipation structure 23 may be, for example, a heat dissipation Film, such as but not limited to Graphene Thermal Film (GTF); alternatively, the heat dissipation structure 23 may be an existing heat dissipation device or structure, such as a fan, a fin, a thermal grease, a heat sink, …, or other types of heat dissipation components, heat dissipation units or heat dissipation devices, or combinations thereof, and the invention is not limited thereto.

The electronic device 2 may be, for example, but not limited to, a flat panel display or a flat panel light source, such as, but not limited to, a mobile phone, a notebook computer, a tablet computer, a television, a display, a backlight module, or a lighting module, or other flat type electronic devices. The heat source may be, but is not limited to, a battery, a control chip, a motherboard, a Central Processing Unit (CPU), a memory, a display adapter, a display panel, or a planar light source of an electronic device, or other components or units that generate heat. In some embodiments, when the electronic device 2 is a flat panel display, such as but not limited to a Light Emitting Diode (LED) display, an Organic Light Emitting Diode (OLED) display, or a Liquid Crystal Display (LCD), the heat source 21 may be a display panel having a display surface, and the heat conductive adhesive structure 22 may be directly or indirectly (e.g., by an adhesive material) attached to the surface opposite to the display surface, so as to connect the heat dissipation structure 23 and the heat source 21 through the heat conductive adhesive structure 22, thereby assisting heat conduction and heat dissipation, and improving the heat dissipation performance of the flat panel display. In other embodiments, when the electronic device 2 is a planar light source, such as but not limited to a backlight module, an LED lighting (LED lighting) module, or an OLED lighting (OLED lighting) module, the heat source 21 may be a light emitting unit having a light emitting surface, and the heat conductive adhesive structure 22 may be directly or indirectly (e.g., by an adhesive material) attached to the surface opposite to the light emitting surface, so as to connect the heat dissipation structure 23 and the heat source 21 through the heat conductive adhesive structure 22, thereby assisting heat conduction and heat dissipation and improving the heat dissipation performance of the planar light source.

The foregoing is by way of example only, and not limiting. It is intended that all equivalent modifications or variations without departing from the spirit and scope of the present invention shall be included in the appended claims.

Claims

1. A thermally conductive adhesive structure, comprising:

a metal layer;

the carbon nanotube layer is arranged on the metal layer and comprises a plurality of carbon nanotubes; and

and the first adhesion layer is arranged on the carbon nanotube layer, and the material of the first adhesion layer is positioned in the gap of the carbon nanotube.

2. The thermally conductive adhesive structure of claim 1, further comprising:

and the graphene layer is arranged between the metal layer and the carbon nanotube layer.

3. The thermally conductive adhesive structure of claim 2, wherein the graphene layer covers at least a portion of the surface of the metal layer.

4. The thermally conductive adhesive structure of claim 2, wherein the carbon nanotubes have an angle between the axial direction and the graphene layer or the metal layer of greater than 0 degree and less than or equal to 90 degrees.

5. The thermally conductive adhesive structure of claim 2, further comprising:

the other carbon nanotube layer is arranged on one side of the metal layer, which is far away from the graphene layer, and comprises a plurality of carbon nanotubes; and

and the second adhesion layer is arranged on one side of the other carbon nanotube layer far away from the metal layer, and the material of the second adhesion layer is positioned in the gap of the carbon nanotubes on the other carbon nanotube layer.

6. The thermally conductive adhesive structure of claim 5, further comprising:

and the other graphene layer is arranged between the metal layer and the other nano carbon tube layer.

7. The thermally conductive adhesive structure of claim 1, further comprising:

and the second adhesion layer is arranged on one side of the metal layer far away from the carbon nanotube layer.

8. The thermally conductive adhesive structure of claim 5 or 7, wherein the first adhesive layer or the second adhesive layer comprises a glue and a thermally conductive material, the thermally conductive material being mixed in the glue.

9. The thermally conductive adhesive structure of claim 7, further comprising:

another carbon nanotube layer, set up in the metal level is kept away from one side of carbon nanotube layer, another carbon nanotube layer includes a plurality of carbon nanotubes, the material of second adhesion layer is located another carbon nanotube layer the clearance of carbon nanotubes.

10. The thermally conductive adhesive structure of any one of claims 5, 6, and 9, further comprising:

two from the type layer, one of them from the type layer set up in first adhesion layer keeps away from one side of metal level, wherein another one from the type layer set up in the second adhesion layer keeps away from one side of metal level.

11. A thermally conductive adhesive structure, comprising:

a carbon nanotube layer including a plurality of carbon nanotubes;

the first adhesion layer is arranged on the carbon nanotube layer, and the material of the first adhesion layer is positioned in the gap of the carbon nanotube; and

and the second adhesion layer is arranged on one side of the carbon nanotube layer far away from the first adhesion layer.

12. The thermally conductive adhesive structure of claim 11, wherein the first adhesive layer covers the carbon nanotube layer.

13. The thermally conductive adhesive structure of claim 11, wherein the first adhesive layer or the second adhesive layer comprises a glue and a thermally conductive material, the thermally conductive material being mixed in the glue.

14. The thermally conductive adhesive structure of claim 11, further comprising:

the metal layer is arranged between the carbon nanotube layer and the second adhesion layer; and

15. The thermally conductive adhesive structure of claim 14, wherein the graphene layer covers at least a portion of the surface of the metal layer.

16. The thermally conductive adhesive structure of claim 14, wherein the carbon nanotubes have an angle between the axial direction and the graphene layer of greater than 0 degree and less than or equal to 90 degrees.

17. The thermally conductive adhesive structure of claim 14, further comprising:

18. The thermally conductive adhesive structure of claim 11, further comprising:

and the graphene layer is arranged between the carbon nanotube layer and the second adhesion layer.

19. An electronic device, comprising:

a heat source;

the thermally conductive adhesive structure of any one of claims 1-18, which is disposed on the heat source; and

and the heat dissipation structure is connected with the heat source through the heat conduction adhesion structure.