4443 6 9 a? B7 五、發明説明（I ) 本發明係關於，被用以冷卻，簡稱為IC、CPU及MPU 等之半導體等之發熱体，或其他有發熱部分之各種電子 零件之散熱器’及該散熱器之製造方法，以及，在該數 熱器組合風扇等冷卻構件’以冷卻發熱体之冷卻裝置β 近年來，由於在電子機器之半導體等電子零件之高 積体化，動作時脈之高頻化等造成發熱量之增大，致使 為了保持電子零件之正常動作，如何將各電子零件之接 點溫度保持在動作溫度範圍内，成為很大之問題β尤其 是微處理單元（以下簡稱為MPU)之高積体化、高頻率化非 常快速’從動作之穩定性或確保動作壽命等各方面，散 熱對策也已經成為重要之課題。一般而言，電子機器之 散熱係由散熱器與風扇組合之冷卻裝置為之。 茲參照第12圖、第13圊及第14圖，說明傳統之散熱 器之例子如下。 第12圖係表示傳統之散熱器之斜視圖，第π圖係傳 統之冷卻裝置乞上面圓及裁面囷，第14圖係傳統之其他 散熱器之斜視圖及侧面圖。此等散熱器可分成，如第12a 圖所示，在傳熱部之基板2b上排列多數由薄板構成之板 狀散熱片lc之板型；如第12b圖所示，在傳熱部之基板2b 上排列多數散熱片lc之梢型；如第12c圖所示，在支柱2之 軸垂直方向排列多數由薄板構成之板狀散熱片lc之塔型 。此等散熱器主要由鋁或銅等具有高熱傳導率之材料製 成’以擠壓成形（或稱作抽拉成形），冷間鍛造，模鑄及薄 板積層等方法製成。 本紙張尺度適用中闺國家標準（CNS ) A4規格（ 210X297公釐） {請先閱讀背面之注意事項再填寫本頁) 訂 經濟部智慧財產局員工消費合作社印製 4 經濟部智慧財產局員工消費合作社印製 A7 ------ B7 五、發明説明（2 ) 要將這種散熱器安裝到發熱体時，梢型之散熱器有 如第13a圖所示之直接將散熱器搭載在發熱体3上，及如 第13b圖所示在發熱体3與散熱器之間配設熱量擴散板2(； 之方式。熱量擴散板之作用是將發熱体3之熱量傳至散熱 器，使熱量擴散’同時保護發熱体。實際之冷卻裝置之 冷卻原理係如第13a圖所示’發熱体3所產生之熱量經由 銘等之具有高傳熱性之基板2b傳至梢形散熱片1，熱量則 在散熱片1之表面熱傳導至由冷卻扇4送來之空氣，而散 發至空氣中。 要提高冷卻裝置之性能，最好是能夠使執蚤均匀分 散到整個傳熱部，並成能夠從所有之散熱用之散熱片散 熱之狀態。惟在板型或梢型之散熱器則有，發熱体3之熱 量容易集中傳至發熱体3直上方之散熱片，而周邊部之散 熱片則相對地熱量較不易傳到之傾向。其原因是，發熱 体3本身較傳熱部小很多’接觸面積报λ!、。結果是，在板 型或梢型之散熱器，其散熱片1整体多未有效發揮功能。 若散熱片1周圍之風量相同’則增加散熱片數加大表面積 後’必可以提高散熱能力。惟實際上是，以單位面積來 考量時’當散熱 H .勒面錄增加時W流入空氣之部分，例 如第13a圖之斜線標示之部分等之空氣流入面積7e減少， 流入總風量本身也減少。因此’其結果是，有時散熱能 力反而降低。亦即’單純地增加散熱片也不會有效果。 勒熱時最重要之要素是，儘可能將發熱体3之熱量有效傳 至廣大範圍之散熱片c 本紙張尺歧财_家標21[29爾- ---------於衣------.-IT------0 f請先閱讀背面之注意事項再填寫本頁} 4 44 3 6 9 Α7 Β7 五、發明説明（3 ) (請先閲讀背面之注意事項再填寫本頁) 上述課題之改善對策有第14圖所示之塔型散熱器》 從發熱体產生之熱量由中央之支柱直接傳到散熱器之上 方部’再由支柱之軸之垂直方向形成之板狀散熱片1£；展 開成面狀。面狀展開之薄板兩面之熱量，一般是藉自然 冷卻而散發到空氣中。對此種塔型散熱器，也在研發提 高散熱性能之改良方法。例如日本國實開昭62-182600號 公報所揭示’係建議切開豎起薄板而形成薄板上散熱片 ’藉此形成貫穿薄板兩面之通風孔，通過通風孔使空氣 較易在支柱之轴平行方向流通之構造。 然而’半導體等之電子零件因高速化之進展快速， 其發熱量有愈來愈大之趨勢，使用傳統之冷卻裝置時， 已無法獲得充分之冷卻效果。尤其是MPU等之高發熱量 電子零件，已無法充分發揮其性能。有時甚至於會發生 MPU等之熱暴衝，使電子機器產生異常等之問題《也考 慮隨著發熱量之增加，相對加大冷卻裝置，以提高冷卻 能力之方法’但因電子機器本身之大小，冷卻裝置之大 小或重量自然受到限制。 經濟部智慧財產局員工消費合作社印製 對此般來講’塔型散熱器在構造上其熱傳導之 效率較好，但卻在構造上·較容亭滞。同時，要 在塔型散熱器之上部設置冷卻扇很困難，因此，塔型散 熱器係將冷卻扇設在其側面β如此，散熱器之高度卻需 要與冷卻扇之寬度同一大小，冷卻裝置本身之形狀會變 很大’不僅如此，其散熱效果之提昇卻與其大小不成比 例0 本纸張从適用β國家標準（CNS) Α4規格（2數297公康） 6 五、發明説明（4 A7 B7 經濟部智慧財產局員工消費合作社印製 本發明在解決上述課題’其目的在提供，小型、高 性能之散熱器，及使用該散熱器之小型而冷卻性能優異 之冷卻裝置。同時，本發明之目的是在提供，能夠以良 好之生產性廉價製成高性能之散熱器之散熱器之製造方 法。 本發明之散熱器備有，具有接觸在發熱体之受熱面 之傳熱板部之支柱。其特徵是，支柱之側面有跟受熱面 大体平行之多數第丨開縫’支柱之側面有跟受熱面交叉之 多數第2開縫，藉此等開縫形成多數柱狀突起，此突起可 發揮冷卻用散熱片之功能。以下，將上述柱狀突起稱作 散熱片。 本發明之另一散熱器設有，具有接觸在發熱体之 熱面之傳熱板部，及向該傳熱板部之受熱面之相反側 出而成為傳熱部之支柱，支柱之至少一個方向之截面 狀呈矩形、台形、三角形或支柱之裁面寬度從受熱面 大致垂直方向慢慢變小之形狀。在支柱之側面沿受熱 形成有多數之散熱片。 本發明之散熱器雖然小型，但能夠將發熱体產生 熱量有效傳導至整個散熱器，具有报高之散熱特性。 在此’散熱片之中心線配置成與大致上垂直於受 面之基準線成直角者，或各散熱片之中心線配置成與 直於叉熱面之基準線成一定之角度者，以及，散熱片 中心線對垂直於受熱面之基準線成一定之角度，多數 述散熱片之前端部延伸至與支柱之上面同一高度者等 受 突 形 向 面 之 垂 之 上 ---------装------1T------0 (讀先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標窣（ 4 44 3 6 9 A7 B7 五、發明説明（5 ) 其散熱性十分優異，尤其是在多數散熱片之表面有凹陷 或突起時，向空氣中之散熱效果很高。 (讀先閱讀背面之注意事項再填寫本頁) 而本發明之散熱器之製造方法係，包括有：藉使用 擠壓成形加工等，成形支柱及上述支柱之長度方向之多 數金屬製板狀散熱片，配設第1開缝之第1製程；以及， 在大致垂直於上述板狀散熱之長度方向之方向，配設 第2開縫之第2製程；之形成散熱片之散熱器之製造方法 。而由於在配設第2開缝之製程使用專用之工模，能夠以 非常高之效率製造很多散熱片》 藉此，能夠以很高之生產性，廉償製造高性能之散 熱器。 而且，本發明之冷卻裝置之特徵是，在本發明之散 熱器配設風扇等之冷卻構件。由於在散熱器之上面配設 面向受熱面之風扇等之送風構件，本發明之冷卻裝置之 冷卻性能優異，為可以小型化之冷卻裝置》 茲參照附圖，說明本發明之實施形態如下。 實施形態1 經濟部智慧財產局員工消費合作社印製4443 6 9 a? B7 V. Description of the Invention (I) The present invention relates to a heat sink used to cool semiconductors, such as ICs, CPUs, and MPUs, or other electronic components that have heat-generating parts. 'And a manufacturing method of the radiator, and a cooling member such as a fan combined with the number of heat sinks' cooling device for cooling the heating element β In recent years, due to the increase in the accumulation of electronic components such as semiconductors in electronic devices, The increase in heat generation caused by high-frequency pulses, etc. In order to maintain the normal operation of electronic parts, how to maintain the contact temperature of each electronic part within the operating temperature range has become a great problem. Β Especially the microprocessing unit ( (Hereinafter referred to as MPU) high accumulation and high frequency are very fast. From the stability of the operation and ensuring the operation life, heat dissipation measures have also become important issues. Generally speaking, the heat dissipation of electronic equipment is a cooling device that combines a radiator and a fan. Examples of conventional heat sinks are described below with reference to Figs. 12, 13 and 14. Fig. 12 is a perspective view of a conventional radiator, Fig. Π is a circle view and a cut surface of a conventional cooling device, and Fig. 14 is a perspective view and a side view of another conventional radiator. These heat sinks can be divided into, as shown in Fig. 12a, a plate type in which a plurality of plate-like heat sinks lc made of thin plates are arranged on the substrate 2b of the heat transfer portion; as shown in Fig. 12b, the substrate in the heat transfer portion The tip type of most fins lc is arranged on 2b; as shown in FIG. 12c, the tower type of most plate-shaped fins lc made of thin plates is arranged in the vertical direction of the axis of the pillar 2. These radiators are mainly made of materials with high thermal conductivity, such as aluminum or copper, and are made by extrusion molding (also known as drawing forming), cold forging, die casting, and lamination of thin plates. This paper size is applicable to the China National Standard (CNS) A4 specification (210X297 mm) {Please read the precautions on the back before filling this page) Order printed by the Intellectual Property Bureau's Consumer Cooperatives of the Ministry of Economy 4 Printed by the cooperative A7 ------ B7 V. Description of the invention (2) To install this type of radiator on a heating element, the tip type radiator can be mounted directly on the heating element as shown in Figure 13a 3, and as shown in FIG. 13b, a heat diffusion plate 2 (is arranged between the heating body 3 and the radiator. The function of the heat diffusion plate is to transfer the heat of the heating body 3 to the radiator, so that the heat is diffused. 'At the same time protect the heating element. The cooling principle of the actual cooling device is as shown in Figure 13a' The heat generated by the heating element 3 is transmitted to the tip-shaped heat sink 1 through the substrate 2b with high heat transfer properties such as Ming. On the surface of the heat sink 1, heat is conducted to the air sent by the cooling fan 4, and is dissipated into the air. To improve the performance of the cooling device, it is best to make the flea uniformly distributed to the entire heat transfer part, so that Heat dissipation The state of heat dissipation of the fin. Only in the plate or tip type radiator, the heat of the heating element 3 is easily concentrated to the heat sink directly above the heating element 3, and the heat sink of the peripheral part is relatively difficult to transfer. The reason is that the heating element 3 itself is much smaller than the heat transfer portion, and the contact area is reported as λ !. As a result, in the plate-type or tip-type heat sink, the heat sink 1 as a whole does not function effectively. The same amount of air flow around the heat sink 1 will increase the heat dissipation capacity after increasing the number of heat sinks and increasing the surface area. However, in fact, when considering the unit area, when the heat dissipation is H. The part of the W flowing into the air when the face recording is increased. For example, the air inflow area 7e of the part indicated by the oblique line in FIG. 13a decreases, and the total inflow air volume itself also decreases. Therefore, 'the result is that sometimes the heat dissipation capacity is reduced. That is,' the mere increase of the heat sink will not The most important element in the heat is to transfer the heat of the heating element 3 to a wide range of heat sinks as much as possible. C This paper ruler Qi Cai_ 家 标 21 [29 尔---------- Yu Yi ------.- IT ------ 0 f Please read Note on the back page, please fill in this page again} 4 44 3 6 9 Α7 Β7 V. Description of the invention (3) (Please read the notes on the back page before filling out this page) The improvement measures for the above problems include the tower type shown in Figure 14 Radiator》 The heat generated from the heating body is directly transmitted from the central pillar to the upper part of the radiator, and then the plate-shaped heat sink 1 £ formed by the vertical direction of the axis of the pillar; unfolded into a plane. Both sides of the expanded plate The heat is generally radiated into the air by natural cooling. For this type of tower radiator, improved methods to improve the heat dissipation performance are also being developed. For example, disclosed in Japanese National Publication No. 62-182600, 'It is recommended to be cut open and erected A thin plate is formed to form a thin plate heat sink ', thereby forming a ventilation hole penetrating both sides of the thin plate, and the structure through which the air is easier to circulate in the direction parallel to the axis of the pillar. However, electronic components such as semiconductors have been progressing rapidly due to high speed, and their heat generation tends to increase. When using conventional cooling devices, sufficient cooling effects have not been obtained. In particular, high-heat-generation electronic components such as MPU have been unable to give full play to their performance. Sometimes even thermal storms such as MPU can cause problems such as abnormalities in electronic equipment. "Also consider the method of relatively increasing the cooling device to increase the cooling capacity with the increase of heat generation." The size, size or weight of the cooling device is naturally limited. Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs In this regard, the tower type heat sink has a better heat transfer efficiency in structure, but is more structurally lagging. At the same time, it is difficult to install a cooling fan on the upper part of the tower radiator. Therefore, the tower radiator is provided with the cooling fan on its side β so that the height of the radiator needs to be the same as the width of the cooling fan. The cooling device itself The shape will become very large. Not only that, but the improvement of its heat dissipation effect is not proportional to its size. 0 This paper has adopted the β National Standard (CNS) A4 specification (2 numbers 297 public health) 6 V. Description of the invention (4 A7 B7 Economy The Ministry of Intellectual Property Bureau employee consumer cooperative printed this invention to solve the above-mentioned problem, and its purpose is to provide a small, high-performance radiator, and a small and excellent cooling device using the radiator. At the same time, the purpose of the invention The present invention provides a method for manufacturing a heat sink capable of producing a high-performance heat sink at a low cost with good productivity. The heat sink of the present invention includes a pillar having a heat transfer plate portion contacting a heating surface of a heating element. The feature is that the side of the pillar has a majority of second slits that are substantially parallel to the heating surface. The side of the pillar has a majority of second slits that intersect with the heating surface. The slits form a plurality of columnar protrusions, and this protrusions can function as cooling fins. Hereinafter, the above-mentioned columnar protrusions are referred to as fins. Another heat sink of the present invention is provided and has a heat transfer contacting the heat surface of the heating element. The hot plate portion and the pillars which become the heat transfer portion on the opposite side of the heat receiving surface of the heat transfer plate portion. The cross section of at least one direction of the pillar is rectangular, mesa, triangle, or the width of the pillar is approximately from the heat receiving surface. The shape gradually becomes smaller in the vertical direction. Many heat sinks are formed along the side of the pillar when heated. Although the heat sink of the present invention is small, it can effectively conduct heat generated by the heating element to the entire heat sink, and has high heat dissipation characteristics Here, the center line of the heat sink is arranged at a right angle to the reference line that is substantially perpendicular to the receiving surface, or the center line of each heat sink is arranged at a certain angle to the reference line that is straight to the hot surface of the fork, and The center line of the heat sink is at an angle to the reference line perpendicular to the heating surface. Most of the front ends of the heat sink extend to the same height as the top of the pillar. Above the vertical --------- installation ----- 1T ------ 0 (read the precautions on the back before filling this page) This paper size applies to Chinese national standard ( 4 44 3 6 9 A7 B7 V. Description of the invention (5) The heat dissipation is very good, especially when the surface of most heat sinks has depressions or protrusions, the heat dissipation effect into the air is very high. (Read the note on the back first. Please fill in this page for more details.) The manufacturing method of the heat sink of the present invention includes: forming a pillar and most of the metal plate-shaped heat sinks in the length direction of the pillar by using extrusion molding, etc. The first manufacturing process of the seam; and the second manufacturing process of the second slot in the direction substantially perpendicular to the longitudinal direction of the plate-like heat radiation; the manufacturing method of the heat sink forming the heat sink. 2 The slitting process uses special molds, which can produce a lot of heat sinks with very high efficiency. "By this, it is possible to manufacture high-performance heat sinks with high productivity and low cost. The cooling device of the present invention is characterized in that a cooling member such as a fan is provided in the radiator of the present invention. Since the air-supplying member such as a fan facing the heat-receiving surface is arranged on the radiator, the cooling device of the present invention is excellent in cooling performance and can be miniaturized. The embodiment of the present invention will be described below with reference to the drawings. Implementation Form 1 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs
第1圖係本發明實施形態1之散熱器之主要部分斜視 圊及側面圖。第1 a園係本發明實施形態1之散熱器之斜視 圖’第lb圖係以搭載冷卻扇4之狀態下從支柱2之長度方 向（以下稱作Y轴方向）所視之發熱体3直上方之本發明冷卻 裝置之截面圖，第lc圖係以搭載冷卻扇4之狀態下從支柱 2之寬度方向（以下稱作X轴方向）所視之本發明冷卻裝置之 側面圖C 本紙張尺度遗用中國國家捸率（CNS ) A4規格（210X297公釐） 經濟部智慧財產局8工消費合作社印製 A7 B7_ 五'發明説明（6) 第2圖係表示本發明實施形態丨之散熱器之外形之斜 視圖及支柱之截面形狀圖。第2a圖係表示本發明實施形 態1之散熱器之外形（以虛線表示）之斜視圖，第2b至2e圖 係表示使本發明實施形態1之散熱器之支柱2之截面形狀 變化時之各散熱器之平面圖及側面圖。 在第la至lc圖，支柱（即傳熱部）2設有多數散熱片i。 發熱体3設在支柱2之下部方向（以下稱作負之z轴方向 而散熱器之上部則安裝有洽卻扇4。 亦即’本實施形態之散熱器係由散熱片丨及支柱2構 成。在此所指之發熱体3，係包括1C、LSI、MPU等之半 導體或電晶体等之會發熱之電子零件。 再者，為了使說明較容易，以下之敘述將併用如上 述之支柱2之寬度方向為X轴方向，支柱2之長度方向為γ 轴方向，支柱2之高度方向為Z軸方向之稱呼。 在第1圖，支柱2之形狀是Y軸方向截面呈三角开彡之r 角柱’因此可以使支柱2與發熱体3接觸時之密接性良好 ’並且可以避免使用之材料被浪費。尤其是，使支柱2之 形狀呈二角柱形狀，便可以獲得實裝性或熱傳導性上十 分優異之散熱器。此支柱2安裝有散熱片丨，第〖圖上之散 熱片1係設在支柱2之兩側面。 如採用本發明之散熱器之架構，便可以實現熱傳遞 與散熱特性優異，且小型之冷卻裝置。 在第1圖所示之本實施形態1之散熱器，發熱体3之熱 量係由接觸發熱面之三角柱之支柱2底面（即受熱面）受熱 本好 度適用中囤ΐ^標準（CNS〉八4規格210χ 297公餐）— ----------- ---------t------π------# (讀先閱讀背面之注意事項再填寫本頁) Λ 43 b ϋ Α7 Β7 五、發明説明（7 ) (請先閲讀背面之注意事項再填寫本頁) ，而從支柱2之底面立体（即X軸、γ軸及z轴之各方向）擴 散。這時因為支柱2係呈三角柱之構造，因此較之傳統之 板型或梢型之散熱器之板狀傳熱部，可以在支柱内之太 很多之範圍内實現穩定之本球体狀溫度分布。從發熱体3 散發之熱量則依其半球体狀溫度分布傳導，擴散到具有 散熱功能之散熱片1之範圍。其結果，若是相同大小，便 可以獲得較傳統之散熱器高很多之散熱特性。同時，在 較難獲得這種球体狀溫度分布之之靠近散熱器之兩端面 之部位，也因支柱2本身之截面積較大，可以將傳熱之熱 阻力抑制在較低值，因此周邊部之散熱片1也可以有充分 之散熱功能。 經濟部智«財產局員工消費合作杜印製 第2b至2c圖表示改變第1圖之散熱器之支柱2之載面 形狀時之多數其他實施形態。在第2b至2c圖，因散熱器 之支柱2之載面形狀之差異’在各個形狀，支检2之載面 浐’與開口於上部之冷卻扇側之空氣流入部之截面積分 別不相同。第2a圖表示，第1圖之支柱裁面呈三角形時之 支柱2之狀態，而與熱量擴散有直接關係之支柱2之裁面 積，係依第2b圖之四角形、第2c圖之台形、第2d圖之三 角形及第2e圖之鐘形（亦即具有曲率半徑R之曲面之形狀） 之順序變小。而為了將熱量僅可能傳至f即熱量之擴散）更 廣大之範圍，最好能儘量確保較大之支柱2之截面積。 對此’跟將熱量發散到外部之空氣量有關之空氣流 入部之截面積，係如第2b至2c圖所示，開口於散熱器上 部之侧邊A與側邊B之尺寸愈大愈寬，依第2b圖之四角形 本紙張尺度適用中國國家標準（CNS ) Α4規格（210 X 29?公釐） 10 A7 B7 五、 經濟部智慧財產局員工消費合作社印製 發明説明（8) 第2c圖之台形、第2d圖之三角形及第26圖之鐘形之順序 變大。為了確保有充分之流入空氣量，此空氣流入部之 面積也是最好能儘量確保較寬之面積。 因此，最好是從發熱体3傳熱之傳熱部之支柱2之載 面積最大’且為了獲得散熱所需之最大空氣量，空氣流 入面積也是最大較為理想。亦即，此兩者之關係互為相 反，但應一方面確保散熱所需之充分之空氣量所要之最 大空氣流入面#，同時，儘可能選擇廣大之支柱2之裁面 積形狀。在第2b至2e圖巾’如第2d圏及第以圈所示，空氣 流入部之寬度（即側邊八與側邊B之合計長度）大，支柱2之 載面積大之形狀最理想。 此等散熱器之散熱片】端面，或支柱2之下部角偶， 最好呈圓弧形狀。如此可以防止因缺落而產生細屑。若 是呈銳角’則在將散熱器安裝於電子零件上時，也有可 能因碰觸其他零件等而破壞其他零件。而且，若從角偶 部產生細屑，也可能掉落配線等之上面，引起短路等事 故，成為電子機器之動作不良之原因。 支柱2與散熱片！可以形成為—整体，或在支柱2用接 合劑接合散熱片卜也可以在支柱2設孔部，而將散熱月丨 壓入固定在該孔部。 將支柱2與散熱片1形成為一整体時’生產性較佳， 而且因為在支柱2與散熱片！之間不存在有成為熱阻力之 部分’傳熱性會較佳。另—方面，藉接合錢人將散献 片1固定在支柱2時，則可以分別以適當之材料製造支柱2 μ氏張尺度朝悄 ---------装------"------^ (請先閱讀背面之注意事項再填鸡本頁) (210X 297公釐 11 A7 B7 4443 6 9 五、發明説明（9 )Fig. 1 is an oblique view 侧面 and a side view of a main part of a heat sink according to Embodiment 1 of the present invention. The first a is a perspective view of the radiator of the first embodiment of the present invention. The first lb is a view of the heating element 3 viewed from the longitudinal direction of the pillar 2 (hereinafter referred to as the Y-axis direction) with the cooling fan 4 installed. The upper cross-sectional view of the cooling device of the present invention. Figure lc is a side view of the cooling device of the present invention viewed from the width direction of the support 2 (hereinafter referred to as the X-axis direction) with the cooling fan 4 installed. C Paper size Legacy China National Standard (CNS) A4 specification (210X297 mm) Printed by A8 B7_ Cooperative Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7_ Description of the invention (6) Figure 2 shows the radiator of the embodiment of the invention 丨External oblique view and cross-sectional shape of the pillar. Fig. 2a is a perspective view showing an external shape (indicated by a dashed line) of the heat sink according to the first embodiment of the present invention, and Figs. 2b to 2e are views each showing a change in the cross-sectional shape of the pillar 2 of the heat sink according to the first embodiment of the present invention. Plan and side views of the radiator. In FIGS. 1a to 1c, the pillar (ie, the heat transfer portion) 2 is provided with a plurality of fins i. The heating element 3 is provided in the direction of the lower part of the pillar 2 (hereinafter referred to as the negative z-axis direction, and the upper part of the radiator is provided with a cooling fan 4. That is, 'the radiator of this embodiment is composed of a heat sink and the pillar 2' The heating element 3 referred to here is a semiconductor or transistor such as 1C, LSI, MPU and other electronic components that generate heat. Furthermore, in order to make the description easier, the following description will use the same pillar 2 as above The width direction is the X-axis direction, the length direction of the pillar 2 is the γ-axis direction, and the height direction of the pillar 2 is the name of the Z-axis direction. In Figure 1, the shape of the pillar 2 is a triangular opening in the Y-axis direction. The corner post 'so that the adhesion between the support post 2 and the heating element 3 is good' and the material used can be avoided. In particular, if the shape of the support post 2 is a square post, it can be installed or thermally conductive. Very good heat sink. The pillar 2 is equipped with heat sinks. The heat sink 1 in the figure is located on both sides of the pillar 2. If the structure of the heat sink of the present invention is adopted, the heat transfer and heat dissipation characteristics can be realized. Excellent, and Small cooling device. In the radiator of the first embodiment shown in Fig. 1, the heat of the heating element 3 is from the bottom surface (that is, the heating surface) of the pillar 2 of the triangular column that contacts the heating surface. Standard (CNS> 8 4 210 210 297 meals) — ----------- --------- t ------ π ------ # (read Read the precautions on the back before filling this page) Λ 43 b ϋ Α7 Β7 V. Description of the invention (7) (Please read the precautions on the back before filling out this page), and three-dimensionally from the bottom surface of the pillar 2 (ie X axis, γ axis and z axis in each direction) diffusion. At this time, because the pillar 2 is a triangular column structure, it can be in a much larger range than the traditional plate-type or tip-type radiator heat plate. The sphere-like temperature distribution is stable inside. The heat dissipated from the heating element 3 is conducted according to its hemispherical temperature distribution and diffuses to the range of the heat sink 1 with heat dissipation function. As a result, if the same size, it can be obtained The traditional heat sink has much higher heat dissipation characteristics. At the same time, it is difficult to obtain such a spherical temperature distribution near the heat sink. Due to the larger cross-sectional area of the pillar 2 itself, the heat resistance of the heat transfer can be suppressed to a low value, so the fins 1 in the peripheral portion can also have sufficient heat dissipation function. Bureau's consumer cooperation du printed Figures 2b to 2c shows most other implementations when the shape of the bearing surface of the radiator 2 of Figure 1 is changed. In Figures 2b to 2c, due to the bearing surface of the radiator 2 The difference in shape 'in each shape, the cross-sectional area of the supporting surface 支 of the inspection 2' and the air inflow part of the cooling fan side opened at the upper part are different. Figure 2a shows that when the pillar cut surface of Figure 1 is triangular The state of pillar 2 and the cutting area of pillar 2 which is directly related to heat diffusion are according to the quadrilateral shape of Fig. 2b, the table shape of Fig. 2c, the triangle of Fig. 2d, and the bell shape of Fig. 2e (that is, The shape of the surface of the curvature radius R) becomes smaller. In order to transfer heat only to f, which is the spread of heat), it is better to ensure the larger cross-sectional area of pillar 2 as much as possible. In this regard, the cross-sectional area of the air inflow portion related to the amount of air that radiates heat to the outside is as shown in Figures 2b to 2c. The larger the side A and side B openings on the upper part of the radiator, the wider the width. In accordance with the quadrangular paper size shown in Figure 2b, the Chinese paper standard (CNS) A4 (210 X 29? Mm) is applicable. 10 A7 B7 5. The invention description printed by the Consumers ’Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (8) The order of the platform shape, the triangle in Figure 2d, and the bell shape in Figure 26 becomes larger. In order to ensure a sufficient amount of inflow air, the area of the air inflow portion should preferably be as wide as possible. Therefore, it is desirable that the load area of the pillars 2 of the heat transfer section where the heat is transferred from the heating element 3 is the largest, and in order to obtain the maximum amount of air required for heat dissipation, the area where the air flows in is also the largest. That is, the relationship between the two is opposite to each other, but on the one hand, it should ensure the maximum air inflow surface # required for a sufficient amount of air for heat dissipation, and at the same time, choose the shape of the large pillar 2 as much as possible. At 2b to 2e, as shown in 2d 圏 and 1st circle, the width of the air inflow portion (that is, the total length of the side 8 and the side B) is large, and the shape with a large load area of the pillar 2 is ideal. The heat sink fins of these heat sinks, or the corner corners of the lower part of the pillar 2, preferably have an arc shape. This can prevent fine debris from being generated due to chipping. If it is at an acute angle ', when the heat sink is mounted on an electronic component, it may be damaged by touching other components. In addition, if fine chips are generated from the corner coupler, it may fall on the wiring and the like, causing a short circuit or the like, which may cause malfunction of the electronic device. Pillar 2 with heat sink! It can be formed as a whole, or the heat sink can be joined to the pillar 2 with an adhesive, or a hole portion can be provided in the pillar 2 so that the heat sink can be pressed into and fixed in the hole portion. When the pillar 2 and the heat sink 1 are integrated, productivity is better, and because the pillar 2 and the heat sink are integrated! If there is no portion that becomes thermal resistance, the heat transfer property is better. On the other hand, when the borrower fixes the scattered piece 1 on the pillar 2, they can manufacture the pillar with appropriate materials, respectively. -" ------ ^ (Please read the notes on the back before filling the chicken page) (210X 297mm 11 A7 B7 4443 6 9 V. Description of the invention (9)
或散熱片1，散熱器之設計較容易D 散熱片1之架構可以採用第1圖等所示之四角柱狀者 ，或圓柱狀，或者多角柱狀，橢圓形狀等。特別是使散 熱片1成四角栓狀時，可以提高散熱片1之安裝密度等， 可以提高散熱性。 而在本實施形態，散熱片1之粗細大致上是一定，但 也可以採’例如散熱片1 ’由前端愈接近支柱2愈粗之形 狀’散熱片1由前端愈接近支柱2愈細之形狀，散熱片1之 中間部較其他部分粗或細之形狀。 而使散熱片1上所形成之角部成圓弧狀，則與上述同 樣’可以防止因缺落等所產生之細屑。 而散熱片1以第1圖所示成周期式配置，其散熱性或 安全性上較佳。亦即，若將散熱片1周期式配置，空氣之 對流會較好，散熱器之製造也較容易。 散熱器之構成材料最好使用，1 0〇〇C之熱傳導率在1 〇 0欠/灰· •尺以上之材料。具体材料可以使用從鋅、 鋁、黃銅、金、銀、鎢、銅、鋇、鎂、鉬（以下簡稱材料 群）中選出之材料單体，從上述材料群中選出之多數材料 之合金’或從上述材料群中選出之至少一種材料，與上 述材料群以外之至少一種材料之合金等。本實施形態係 考慮加工性或成本面，而由鋁單体或鋁與其他從上述材 料群中選出之至少一種之合金等構成。 實施形態2 第3圖、第4圖表示改變本發明實施形態2之散熱器之 本紙張尺度適财國@^準（CNS ) Μ規格（Ζ1()χ297公羞〉 (讀先閲讀背面之注意事項再填寫本頁)Or the heat sink 1, the design of the heat sink is easier. D The structure of the heat sink 1 can be a quadrangular column like the one shown in Figure 1 or a column, or a polygonal column, an ellipse, etc. In particular, when the heat sink 1 is formed into a quadrangular pin shape, the mounting density and the like of the heat sink 1 can be increased, and the heat dissipation can be improved. In this embodiment, the thickness of the heat sink 1 is approximately constant, but it may also adopt a shape such as' the heat sink 1 'becomes thicker from the front end to the pillar 2' and the shape of the heat sink 1 becomes closer to the pillar 2 from the front end. The middle part of the heat sink 1 is thicker or thinner than the other parts. By making the corners formed on the heat sink 1 into an arc shape, the same as the above-mentioned can prevent fine chips caused by chipping and the like. The heat sink 1 is arranged in a periodic manner as shown in FIG. 1 and has better heat dissipation or safety. That is, if the heat sinks are arranged in a periodic manner, the convection of air will be better, and the manufacture of the heat sink will be easier. The material of the heat sink is preferably used. The material with a thermal conductivity of 1000 ° C is less than 1000 ash / ash · • foot. Specific materials can be selected from zinc, aluminum, brass, gold, silver, tungsten, copper, barium, magnesium, molybdenum (hereinafter referred to as the material group) monomers, alloys of most materials selected from the above material group ' Or an alloy of at least one material selected from the above-mentioned material group and at least one material other than the above-mentioned material group. This embodiment is formed of aluminum alone or an alloy of aluminum and at least one selected from the above-mentioned group of materials in consideration of workability and cost. Embodiment 2 FIG. 3 and FIG. 4 show that the paper size of the radiator of Embodiment 2 of the present invention is changed to a suitable country @ ^ 准 （CNS） M specifications (Z1 () × 297 public shame> (Read the first note on the back) (Fill in this page again)
、1T 經濟部智慧財產局員工消費合作社印製 12 經濟部智慧財產局員工消費合作社印製 A7 ___ B7 五、發明説明（l〇 ) 支柱與散熱片之架構時之平面圖與侧面圖。 第3a圖表示散熱片1之轴線與垂直於支柱2之發熱面 之基準線9a成直角狀配置時。如此，在中央之支柱2之兩 側面配設散熱片1，便可以一面硿保作為畨熱面之充分大 之表面積，同時可以降低散熱器之高度。 冷卻扇搭載在散熱器之上部，送風之空氣係通過斜 線所示之空氣流入部7a (散熱片空隙），如空氣流5a，從散 熱器之上部穿過下部，使散熱片1之熱量發散。 此架構維一有一點不利的是，與散熱器上部之尺寸 相同之傳統之第13a圖所示之散熱器比較時，每一單位面 積之空氣流入面積會減少。亦即，如第133圖之斜線所示 ’傳統型之散熱器之空氣流入面積7e是散熱器上面之全 面積減掉全散熱片1之面積之面積。對此，本發明之架構 係如上述，散熱器上部之面積之約50%前後被散熱片1之 側面所覆蓋’因此空氣流入面積便會減少這個份量。 惟，縱使空氣流入面積會減少，若本發明是在略呈 三角形狀之支柱之兩側面配設散熱片1之架構時，因為支 柱之充分之熱擴散效果，與空氣之順暢之流動，可以獲 得較傳統之散熱器高出很多之散熱特性。 而如第3b圈所示之散熱器，其散熱片1之轴線對基準 線9 a有一疋之角度0。如此’在支柱2之兩側面以角度θ配 設散熱片1 ’將其端面平行對準散熱器上面之基準線9b t 即可一面維持與第3a圖同樣之散熱片表面積及散熱器之 高度，同時可以使空氣流入部7b較傳統之第13&圖時更寬 本紙崁尺廋適用中國囷家梯準（CNS ) A4規狢（2Κ)Χ297公釐） ---------裝------、玎------^ {請先聞讀背面之注意事項再填寫本頁) 13 4 __B7____ 五、發明説明（11 ) 0 第3b圖所示之散熱器，較第13a圖時之空氣流入部7a 可以確保近兩倍之面積，可以獲得更高之散熱特性。而 且，因為散熱片1是以角度Θ傾斜配設之，從散熱器上部 流入之空氣流成為空氣流5a，與沿散熱片1上面被引至支 柱2表面之空氣流5b，可以更進一步提高散熱特性。 第4a圖係以基準線9a上之一點為基點，放射狀配置散 熱片1之散熱器。這時也與第3b圖一樣，可以使空氣流入 面積較第3a囷増加很多，可以獲得更高之散熱特性。 第4b圖表示第3a圖之散熱片1在中間彎折90度之散熱 器。這時也可以期待獲得與第3b圖，或第4a圖同樣之效 果。 實施形態3 第5圖係本發明實施形態1及2之散熱器之散熱片之斜 視圖。如該圓所示之散熱片1之表面形狀，在散熱器之散 熱片1之表面形成突起或凹部以增加表面積，可以進一舟 提高散熱能力。再者，散熱片1之突起或凹部可以形成在 散熱片1中之一部分’不在所有之散熱片1形成突起或凹 部也可以獲得同樣之效果。散熱片1之表面形狀可以是酒 渦狀等。同時’散熱片1之戴面可以是如第5圖之la所示 ，從根部到前端同一厚度。或如第5圊之lb所示，前端部 分較根部薄。也可以相反地，前端部分較根部厚。 實施形態4 茲再參照第6圖及第7圖’說明本發明之冷卻裝置。 本紙張尺度適用中國國家標準（CNS ) Α4規格（2丨0Χ297公釐} (請先閱讀背面之注意事項再填寫本頁) 丨"1T Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs 12 Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs A7 ___ B7 V. Description of the Invention (10) Plan and side views of the structure of the pillar and heat sink. Fig. 3a shows the case where the axis of the heat sink 1 and the reference line 9a perpendicular to the heating surface of the support 2 are arranged at right angles. In this way, by arranging the fins 1 on both sides of the central pillar 2, it is possible to protect a sufficiently large surface area as a hot surface while reducing the height of the radiator. The cooling fan is mounted on the upper part of the radiator, and the air for supplying air passes through the air inflow part 7a (the fin gap) shown by the oblique line, such as the air flow 5a, passes from the upper part of the radiator to the lower part to dissipate the heat of the fin 1. One disadvantage of this architecture is that compared with the conventional radiator shown in Figure 13a, which has the same size as the upper part of the radiator, the air inflow area per unit area will be reduced. That is, as shown by the slanted line in Fig. 133, the air inflow area 7e of the conventional radiator is the area of the entire area above the radiator minus the area of the full heat sink 1. In this regard, the structure of the present invention is as described above. About 50% of the area of the upper part of the heat sink is covered by the side surface of the heat sink 1 ', so the air inflow area will reduce this amount. However, even if the air inflow area will be reduced, if the present invention is a structure in which heat sinks 1 are provided on both sides of a slightly triangular pillar, due to the sufficient heat diffusion effect of the pillar and the smooth flow of air, it can be obtained Compared with traditional radiators, it has much better heat dissipation characteristics. For the heat sink shown in circle 3b, the axis of the heat sink 1 has an angle of 0 to the reference line 9a. In this way, 'the heat sinks 1 are arranged on both sides of the pillar 2 at an angle θ' and the end faces of the heat sinks are aligned parallel to the reference line 9b t on the heat sink to maintain the same surface area and height of the heat sink as in Figure 3a At the same time, the air inflow portion 7b can be made wider than the traditional 13 & drawing. The paper size is applicable to the Chinese standard (CNS) A4 (2K) × 297 mm. --------- installation ------ 、 玎 ------ ^ {Please read the precautions on the back before filling this page) 13 4 __B7____ V. Description of the invention (11) 0 The radiator shown in Figure 3b, compared with The air inflow portion 7a in FIG. 13a can secure almost twice the area and can obtain higher heat dissipation characteristics. Moreover, since the heat sink 1 is arranged at an angle Θ, the airflow flowing from the upper part of the heat sink becomes the air stream 5a, and the air stream 5b guided along the upper surface of the heat sink 1 to the surface of the pillar 2 can further improve the heat dissipation. characteristic. Fig. 4a shows a heat sink in which the heat radiating sheet 1 is radially arranged with one point on the reference line 9a as a base point. At this time, as in Fig. 3b, the air inflow area can be increased much more than that in Fig. 3a, and higher heat dissipation characteristics can be obtained. Fig. 4b shows the heat sink in which the heat sink 1 of Fig. 3a is bent by 90 degrees in the middle. At this time, it is expected that the same effect as that of Fig. 3b or Fig. 4a can be obtained. Embodiment 3 Fig. 5 is a perspective view of a heat sink of a heat sink according to Embodiments 1 and 2 of the present invention. As the surface shape of the heat sink 1 shown by the circle, protrusions or recesses are formed on the surface of the heat sink 1 of the heat sink to increase the surface area, which can improve the heat dissipation ability. Furthermore, the protrusions or recesses of the heat sink 1 can be formed in a part of the heat sink 1 '. The same effect can be obtained without forming the protrusions or recesses on all the heat sinks 1. The surface shape of the fins 1 may be a vortex shape or the like. At the same time, the wearing surface of the heat sink 1 may be the same thickness from the root to the front end as shown in la in FIG. 5. Or as shown in lb of 5th, the front end portion is thinner than the root portion. Conversely, the front end portion may be thicker than the root portion. Embodiment 4 The cooling device of the present invention will be described with reference to Figs. 6 and 7 'again. This paper size applies to Chinese National Standard (CNS) Α4 specifications (2 丨 0 × 297 mm) (Please read the precautions on the back before filling this page) 丨 "
*1T 經濟部智慧財產局員工消費合作社印製 14* 1T Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 14
經濟部智慧財產局員工消費合作社印製 X 29 7公釐） A7 B7 五、發明説明（12 ) 第6a、6b圖係本發明實施形態1及2之散熱器及冷卻 裝置之正面圖與側面圖。第7a、7b圖係表示本發明實施 形態1及2之散熱器及冷卻裝置之空氣流之狀態之側面圖Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs (X 29 7 mm) A7 B7 V. Description of the Invention (12) Figures 6a and 6b are front and side views of the radiator and cooling device of Embodiments 1 and 2 of the present invention . Figures 7a and 7b are side views showing the state of the air flow of the radiator and cooling device according to the first and second embodiments of the present invention.
Q 本實施形態係如第6a、6b圖所示，在支柱2之發熱体 安裝部之整体，或至少其一部分形成***之傳熱板部2a 。由於形成傳熱板部2a，可以在受熱面與受熱面附近之 散熱片1間形成空隙，藉此，可以有效率地將冷卻扇4之 空氣流送到受熱面附折气,靶#戶1 *令•傳熱板部2a之發 熱体安裝部形成有受熱面。 其次’再參照第7a、7b及7c圖’具体說明空氣之流動 。如苐7a圖所示’因為有支柱2之傳熱板部2a存在，從洽 卻扇4之空氣流5a會從散熱器之上部直接流到下部。換言 之’如上述，因為可以將空氣流5a送到受熱面附近之散 熱片1表面，因此散熱片之功能提昇，可以提高散熱器之 散熱特性。 同樣地’第7b與7c圖係比較，*有哼熱板部2a及無傳 熱板部2a之支柱2配設熱量擴散板2C與發熱体3之狀態。在 第7b圖之架構，因為無傳熱板部2a，受熱面附近之散熱 片1係直接接觸在熱量擴散板2C，無法將空氣送到下部之 散熱片1。對此在第7c圖之架構，在支柱2有傳熱板部2a。 若使傳埶板部2a之官摩L〗較勒熱器之寬度L2袅狹窜，則 可以在與熱量擴散楣2c之間形成空隙，可以將空氣送到 受熱面附近之下部之散熱片1。 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇 裝 訂 I 線 (請先閱讀背面之注意事項再填寫本頁) 15 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（l3 ) 實施形態5 再參照第8圖、第9圖及第1〇圖，說明本發明之散熱 器之製造方向。 第8a圖表示傳熱性素材6之初期狀態，第朴囷表示藉 切削加工、擠出加工或抽拉加工，在支柱2之長度方向成 形多數板狀散熱片lc之第1製程。接著，藉第8(;圖所示， 在垂直於板狀散熱片lc之長度方向之方向施加開縫之第2 製程’在支柱2之兩側面形成多數之散熱片i。 第1製程係利用切削加工、撥出加工或柚拉加工，在 此，擬說明利用擠出加工製造時之例子。 第9a圖係從圖中之箭頭方向，將高溫狀態之傳熱性 素材6擠壓在擠出加工用工模10之狀態a然後如該圖（|^)所 示’將傳熱性素材6塑性變形與模具之模腔同一形狀，而 擠出。這時是同時形成第8b圖所示之支柱2與板狀散熱片 lc。而如第9c圖所示’將擠出之傳熱性素材6切斷成一定 長度而結束第1製程。 第2製程係藉切削加工，形成如第！ 〇a圖所示，具有 多數散熱片之散熱器形狀之製程。本實施形態係如第l〇b 圖所示’使用切削加工用工具11並排傾斜工模i2a，同時 對多數散熱器實施開縫加工’在多數散熱片I形成單侧之 板狀散熱片1。接著如第l〇c圈所示，對另一側之板狀散 熱片1 c同時實施開縫加’形成另一侧之散熱片1。 在上述第2製程，因為平行設置多台切削工具進行加 工，可以縮短加工時間》 本紙張尺度適用中國國家揉準（CNS ) A4規格（210X297公釐） --- - —I 1 - I - - H. I--衣 - -1 I _ I '11 {請先閲請背面之注意事項再填寫本頁} 經濟部智慧財產局員工消費合作社印製 A7 ________ B7 五、發明説明（I4 ) 而且’上述第2加工也可以藉雷射加工等之手段實施 〇 可以藉本實施形態以高效率而廉價製造，具有小型 而多數散熱片之高性能之散熱器D以本實施形態之製造 方法製造之散熱器，係完全之一体構造，因此散熱性能 非常優異。 實施形態6 第11圖係在本發明實施形態1及2之散熱器上部，搭 載冷卻扇之冷卻裝置之斜視圖。第1丨3圖表示在本發明之 散熱器搭載1具冷卻扇之冷卻裝置，第ilb圖表示在本發 明之散熱器搭載2具冷卻扇之冷卻裝置。冷卻扇*可以使^ 用螺栓、接合劑、夹子、帶子、夾梢等安裝在散熱器上 部。 本發明之散熱器，因為可以一面維持高冷卻性能， 同時降低高度，因此在搭載冷卻扇4之狀態下，仍可抑制 整体之高度，其結果，可以很容易實現小型之冷卻裝置 〇 再者，本實施形態之冷卻裝置之冷卻手段是使用冷 卻扇4，但也可以使用珀而帖（Peltier)元件等之熱交換元 件作為其他冷卻手段。另外，也可以使用熱導管等，將 散熱器之熱量引導至其他位置進行冷卻。而且，可以將 上述散熱器浸泡在液体中進行冷卻。 如以上所述，構成本實施形態之冷卻裝置之本發明 散熱器，具有在傳熱部之支柱2兩側面配設散熱片之構造 本纸張尺度適用中國國家標準< CNS ) Λ4規格:：210Χ 297公釐） ---------装------、1T------0 (請先閲讀背面之注意事碩再填寫本頁) -17 443Q In this embodiment, as shown in Figs. 6a and 6b, a raised heat transfer plate portion 2a is formed on the whole of the heating element mounting portion of the pillar 2 or at least a part thereof. Due to the formation of the heat transfer plate portion 2a, a gap can be formed between the heat receiving surface and the heat sink 1 near the heat receiving surface, whereby the air of the cooling fan 4 can be efficiently sent to the heat receiving surface with a deflection, target # 户 1 * Let the heating body mounting portion of the heat transfer plate portion 2a have a heat receiving surface. Next, 'the flow of air will be described in detail with reference to Figs. 7a, 7b, and 7c'. As shown in Fig. 7a ', because the heat transfer plate portion 2a of the pillar 2 exists, the air flow 5a from the cooling fan 4 flows directly from the upper portion to the lower portion of the radiator. In other words, as described above, since the air flow 5a can be sent to the surface of the heat sink 1 near the heat receiving surface, the function of the heat sink is improved, and the heat dissipation characteristics of the heat sink can be improved. Similarly, in comparison between the 7th and 7c drawings, the state in which the heat spreading plate 2C and the heat generating body 3 are arranged on the pillars 2 having the humming plate portion 2a and the non-heat transmitting plate portion 2a. In the structure of Fig. 7b, because there is no heat transfer plate portion 2a, the heat sink 1 near the heat receiving surface directly contacts the heat diffusion plate 2C, and air cannot be sent to the lower heat sink 1. In contrast, in the structure shown in FIG. 7c, a heat transfer plate portion 2a is provided on the pillar 2. If the official motor L of the transfer plate portion 2a is narrower than the width L2 of the heat sink, a gap can be formed between the heat spreader 2c and air can be sent to the heat sink 1 near the heating surface. . This paper size is in accordance with Chinese National Standard (CNS) A4 specification (21 ° binding I line (please read the precautions on the back before filling this page) 15 Printed by the Consumers ’Cooperative of Intellectual Property Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Description (l3 ) Embodiment 5 Referring to FIG. 8, FIG. 9 and FIG. 10, the manufacturing direction of the heat sink of the present invention will be described. FIG. 8 a shows the initial state of the heat transfer material 6, and FIG. Extrusion process or drawing process, the first process of forming a large number of plate-shaped heat sinks lc in the length direction of the pillar 2. Then, according to No. 8 (; The second process of applying a slit is to form a plurality of fins i on both sides of the pillar 2. The first process uses cutting processing, drawing processing, or grapefruit drawing processing. Here, an example of manufacturing by extrusion processing is described. Fig. 9a shows the state a of the high-temperature heat transfer material 6 from the direction of the arrow in the figure on the extrusion processing die 10, and then the heat transfer material 6 is shown in the figure (| ^). The plastic deformation is the same shape as the cavity of the mold, And extrusion. At this time, the pillar 2 and the plate-shaped heat sink lc shown in Fig. 8b are formed at the same time. As shown in Fig. 9c, the extruded heat-transmitting material 6 is cut to a certain length to end the first process. The second process is a cutting process to form a heat sink shape with a large number of fins as shown in Fig. 〇a. This embodiment is shown in Fig. 10b. 'Using cutting tools 11 side by side Tilt the die i2a and perform slitting processing on most of the radiators at the same time to form a single-sided plate-shaped fin 1 on most of the fins I. Then, as shown in circle 10c, the plate-shaped fin 1 on the other side c Simultaneous slitting and 'forming the heat sink 1 on the other side. In the second process mentioned above, because multiple cutting tools are set in parallel for processing, the processing time can be shortened.' This paper size applies to the Chinese National Standard (CNS) A4 (210X297mm) ------I 1-I--H. I--Yi--1 I _ I '11 {Please read the notes on the back before filling this page} Employees of Intellectual Property Bureau, Ministry of Economic Affairs Printed by Consumer Cooperatives A7 ________ B7 V. Description of Invention (I4) and 'The 2nd processing mentioned above It can also be implemented by means of laser processing, etc. It can be manufactured with high efficiency and low cost by this embodiment, and a high-performance heat sink D with small and many heat sinks. The heat sink manufactured by the manufacturing method of this embodiment is completely It has a one-body structure, so it has excellent heat dissipation performance. Embodiment 6 Figure 11 is a perspective view of a cooling device equipped with a cooling fan on the upper part of the radiators according to Embodiments 1 and 2 of the present invention. Figures 1 and 3 show the structure of the present invention. The radiator is equipped with a cooling device with one cooling fan. Figure ilb shows the cooling device equipped with two cooling fans in the radiator of the present invention. The cooling fan * can be installed with bolts, cement, clips, tapes, clip tips, etc. Above the radiator. The radiator of the present invention can maintain high cooling performance while reducing the height, so the overall height can be suppressed even when the cooling fan 4 is installed. As a result, a small cooling device can be easily realized. Furthermore, The cooling means of the cooling device of this embodiment uses the cooling fan 4, but a heat exchange element such as a Peltier element may be used as another cooling means. Alternatively, a heat pipe or the like may be used to direct the heat of the radiator to another location for cooling. Furthermore, the heat sink may be immersed in a liquid for cooling. As described above, the radiator of the present invention, which constitutes the cooling device of this embodiment, has a structure in which heat sinks are arranged on both sides of the pillar 2 of the heat transfer section. The paper size is applicable to Chinese national standards < CNS) Λ4 specifications :: 210 × 297 mm) --------- install ------, 1T ------ 0 (Please read the cautions on the back before filling this page) -17 443
Q A7 B7 五、發明説明（l5 ) 。本實施形態之這種冷卻裝置，較之傳统之冷卻裝置， 同一体積可以獲得更優異之冷卻性能。換言之，若是同 —性能，本實施形態之冷卻器可以實現最小、最輕量之 冷卻裝置。 如以上所說明*本發明之散熱器，因為傳熱部採柱 狀構造之支柱’以提高從發熱体擴散熱量之效果，並且 在支柱之侧面配設散熱，而得確保充分大之散熱面積， 因此散熱性能很高，而且可以實現小型化。 同時，本發明之冷卻裝置，因為使用上述本發明之 散熱器，較之傳統者’成形高性能而可以實現小型化之 冷卻裝置。 而且，本發明之散熱器之製造方法，係能夠以高生 產性’廉價製造高性能之散熱器之方法。 圖式之簡單說明 第la至lc圖係本發明實施形態1之散熱器之主要部分 斜視圖及側面圖》 第2a至2e圖係表示本發明實施形態1之散熱器之外形 之斜視圖及支柱之裁面形狀圖。 第3a至3b圖係本發明實施形態2之散熱器之平面圖及 側面圖。 第4a至4b圖係本發明實施形態2之散熱器之平面圓及 側面圖。 第5圖係本發明實施形態1及2之散熱器之散熱片之斜 視圖。 本紙張尺度適用中國國家榇準（CNS ) A4規格（210X297公楚） (請先閱讀背面之注意Ϋ項再填寫本頁) 策- 、ίτ 經濟部智慧財產局員工消費合作社印製 18 經濟部智慧財產局員工消費合作社印製 A7 B7 五、發明説明（丨6) 第6a至6b圖係本發明實施形態1 ' 2之散熱器及冷卻 裝置之正面圖與側面圖。 第7a至7c圖係表示本發明實施形態1、2之散熱器及冷 卻裝置之空氣流之狀態之側面圖。 第8a至8c圖係表示本發明實施形態1、2之散熱器之製 造方法之斜視圊。 第9a至9c圖係表示本發明實施形態1、2之散熱器之製 造方法之擠壓加工之狀態之斜視圖。 第1 Oa至1 〇c圖係表示本發明實施形態！、2之散熱器之Q A7 B7 5. Description of the invention (l5). Compared with the conventional cooling device, the cooling device of this embodiment can obtain more excellent cooling performance in the same volume. In other words, with the same performance, the cooler of this embodiment can realize the smallest and lightest cooling device. As explained above, the heat sink of the present invention uses pillars with a columnar structure to increase the effect of diffusing heat from the heating element, and heat dissipation is provided on the side of the pillar to ensure a sufficiently large heat dissipation area. Therefore, the heat dissipation performance is high, and miniaturization can be achieved. At the same time, the cooling device of the present invention uses the above-described heat sink of the present invention, and has a higher-performance and more compact cooling device than conventional ones. Furthermore, the method for manufacturing a heat sink of the present invention is a method capable of manufacturing a high-performance heat sink at low cost with high productivity. Brief Description of the Drawings Figures 1a to 1c are perspective views and side views of the main part of the heat sink according to Embodiment 1 of the present invention. Figures 2a to 2e are perspective views and pillars showing the outer shape of the heat sink according to Embodiment 1 of the present invention. Cut shape illustration. Figures 3a to 3b are a plan view and a side view of a heat sink according to a second embodiment of the present invention. Figures 4a to 4b are plan circle and side views of a heat sink according to Embodiment 2 of the present invention. Fig. 5 is a perspective view of a heat sink of a heat sink according to Embodiments 1 and 2 of the present invention. This paper size applies to China National Standards (CNS) A4 specifications (210X297). (Please read the note on the back before filling out this page.) Printed by A7, B7, Consumer Cooperatives of the Property Bureau. 5. Description of the Invention (丨 6) Figures 6a to 6b are front and side views of the radiator and cooling device according to Embodiment 1 '2 of the present invention. Figures 7a to 7c are side views showing states of air flow of the radiator and the cooling device according to the first and second embodiments of the present invention. Figures 8a to 8c are squint views showing a method for manufacturing a heat sink according to Embodiments 1 and 2 of the present invention. Figures 9a to 9c are perspective views showing the state of extrusion processing of the method for manufacturing a heat sink according to Embodiments 1 and 2 of the present invention. The first Oa to 10c diagrams show the embodiment of the present invention! 2 of the radiator
斜視圖及其製造方法之切削加工時，固定在工模之散熱 器之側面之圖D 第11a至lib圖係在本發明實施形態[、2之散熱器上部 搭載冷卻扇之冷卻裝置之斜視圖。 第12a至12b圖係表示傳統之散熱器之架構之平面圖 第13a至13b圖係表示傳統之冷卻裝置之架構之平面 圖及截面圖。 第14a至〗4b圖係表示傳統之其他散熱器之架構之斜 視圖及側面囷。 ’ 冬紙乐尺度適用中國國家標準（CNS ) A4規格（2丨Ox 297公着） ---------1------ΐτ------0 (請先閲讀背面之注意事項再填{¾本頁) 19 13 6 9 A7 B7 五、發明説明（17 元件標號對照 1.. .散熱片 1C...板狀散熱片 2.. .支柱 2a...傳熱板部 2b...基板 3.. .發熱体 4.. .冷卻扇 6…傳熱性素材 10…擠出加工用工模 11…切削加工用工具 2c...熱量擴散板 經濟部智慧財產局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁)Oblique view and diagram of the manufacturing method during cutting, Figure D fixed to the side of the radiator of the mold. Figures 11a to 11b are perspective views of the cooling device equipped with a cooling fan in the upper part of the radiator of the embodiment [2, 2]. . Figures 12a to 12b are plan views showing the structure of a conventional radiator. Figures 13a to 13b are plan views and sectional views showing the structure of a conventional cooling device. Figures 14a to 4b are perspective views and side views showing the structure of other conventional radiators. '' Winter Paper Music scale is applicable to Chinese National Standard (CNS) A4 specification (2 丨 Ox 297) --------- 1 ------ ΐτ ------ 0 (Please read first Note on the back (¾ page) 19 13 6 9 A7 B7 V. Description of the invention (17 Component number comparison 1... Heat sink 1C ... Plate heat sink 2.... Pillar 2a ... Biography Hot plate part 2b ... Substrate 3. Heat generating body 4. Cooling fan 6 ... Heat transfer material 10 ... Extrusion tool 11 ... Cutting tool 2c ... Heat diffusion plate Printed by the Bureau's Consumer Cooperative (please read the precautions on the back before filling this page)
本紙張尺度適用中國國家標隼（CNS ) A<4規格（210X 297公釐） 20This paper size applies to China National Standard (CNS) A < 4 (210X 297 mm) 20