TWI783234B - 加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法 - Google Patents
加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法 Download PDFInfo
- Publication number
- TWI783234B TWI783234B TW109119397A TW109119397A TWI783234B TW I783234 B TWI783234 B TW I783234B TW 109119397 A TW109119397 A TW 109119397A TW 109119397 A TW109119397 A TW 109119397A TW I783234 B TWI783234 B TW I783234B
- Authority
- TW
- Taiwan
- Prior art keywords
- output
- temperature
- control
- mentioned
- circuit
- Prior art date
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
- H01L21/67109—Apparatus for thermal treatment mainly by convection
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F27—FURNACES; KILNS; OVENS; RETORTS
- F27B—FURNACES, KILNS, OVENS, OR RETORTS IN GENERAL; OPEN SINTERING OR LIKE APPARATUS
- F27B17/00—Furnaces of a kind not covered by any preceding group
- F27B17/0016—Chamber type furnaces
- F27B17/0025—Especially adapted for treating semiconductor wafers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67248—Temperature monitoring
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Physics & Mathematics (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Control Of Resistance Heating (AREA)
- Chemical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019-109838 | 2019-06-12 | ||
JP2019109838 | 2019-06-12 | ||
JP2020073076A JP7101718B2 (ja) | 2019-06-12 | 2020-04-15 | 加熱部、温度制御システム、処理装置および半導体装置の製造方法 |
JP2020-073076 | 2020-04-15 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202105644A TW202105644A (zh) | 2021-02-01 |
TWI783234B true TWI783234B (zh) | 2022-11-11 |
Family
ID=73838045
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW109119397A TWI783234B (zh) | 2019-06-12 | 2020-06-10 | 加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法 |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP7101718B2 (ja) |
KR (1) | KR102472671B1 (ja) |
SG (1) | SG10202005542RA (ja) |
TW (1) | TWI783234B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102584448B1 (ko) | 2020-10-29 | 2023-10-04 | 주식회사 케이디파인켐 | 열안정성이 향상된 열전달 유체 조성물 |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000339039A (ja) * | 1999-05-25 | 2000-12-08 | Tokyo Electron Ltd | 加熱手段の温度制御方法、その装置及び熱処理装置 |
TW200718263A (en) * | 2005-08-19 | 2007-05-01 | Mrl Ind Inc | Fault tolerant element and combination with fault tolerant circuit |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS55159584A (en) * | 1979-05-31 | 1980-12-11 | Canon Kk | Heater controller |
JP2004288775A (ja) * | 2003-03-20 | 2004-10-14 | Hitachi Kokusai Electric Inc | 半導体製造装置 |
KR100849012B1 (ko) * | 2005-02-17 | 2008-07-30 | 도쿄엘렉트론가부시키가이샤 | 열처리 장치 및 열처리 방법 |
JP5098806B2 (ja) * | 2008-05-21 | 2012-12-12 | 東京エレクトロン株式会社 | 電力使用系の断線予測装置及び熱処理装置 |
JP2013062361A (ja) * | 2011-09-13 | 2013-04-04 | Tokyo Electron Ltd | 熱処理装置、温度制御システム、熱処理方法、温度制御方法及びその熱処理方法又はその温度制御方法を実行させるためのプログラムを記録した記録媒体 |
EP3893567B1 (en) | 2016-01-25 | 2022-12-07 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Methods and devices for controlling detachment of mobile terminal |
JP6611666B2 (ja) * | 2016-05-16 | 2019-11-27 | 東京エレクトロン株式会社 | 載置台システム、基板処理装置及び温度制御方法 |
JP2018125439A (ja) * | 2017-02-01 | 2018-08-09 | 株式会社国際電気セミコンダクターサービス | 半導体装置の製造方法、基板冷却方法および基板処理装置 |
KR20180100826A (ko) | 2017-03-02 | 2018-09-12 | 정상준 | 그래파이트 기반 발열체를 이용한 발열 시스템 |
-
2020
- 2020-04-15 JP JP2020073076A patent/JP7101718B2/ja active Active
- 2020-06-10 KR KR1020200070213A patent/KR102472671B1/ko active IP Right Grant
- 2020-06-10 TW TW109119397A patent/TWI783234B/zh active
- 2020-06-11 SG SG10202005542RA patent/SG10202005542RA/en unknown
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000339039A (ja) * | 1999-05-25 | 2000-12-08 | Tokyo Electron Ltd | 加熱手段の温度制御方法、その装置及び熱処理装置 |
TW200718263A (en) * | 2005-08-19 | 2007-05-01 | Mrl Ind Inc | Fault tolerant element and combination with fault tolerant circuit |
Also Published As
Publication number | Publication date |
---|---|
JP2020205406A (ja) | 2020-12-24 |
KR102472671B1 (ko) | 2022-12-01 |
KR20200142462A (ko) | 2020-12-22 |
JP7101718B2 (ja) | 2022-07-15 |
SG10202005542RA (en) | 2021-01-28 |
TW202105644A (zh) | 2021-02-01 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JP6170847B2 (ja) | 断熱構造体、加熱装置、基板処理装置および半導体装置の製造方法 | |
JP6752851B2 (ja) | クーリングユニット、基板処理装置、および半導体装置の製造方法 | |
JP6306151B2 (ja) | 基板処理装置、断熱構造体及び半導体装置の製造方法 | |
US20230383411A1 (en) | Substrate processing apparatus and non-transitory computer-readable recording medium | |
TWI669411B (zh) | Substrate processing apparatus, cooling unit, heat insulating structure, and method of manufacturing semiconductor device | |
US11043402B2 (en) | Cooling unit, heat insulating structure, and substrate processing apparatus | |
TWI783234B (zh) | 加熱部、溫度控制系統、處理裝置及半導體裝置之製造方法 | |
TW201351078A (zh) | 熱處理設備及控制該設備之方法 | |
JP2004119804A (ja) | 半導体製造装置 | |
US20200393197A1 (en) | Heater, temperature control system, and processing apparatus | |
JP2008166321A (ja) | 基板処理装置および半導体装置の製造方法 | |
CN112466775A (zh) | 基板处理装置、半导体器件的制造方法及记录介质 | |
US20230416919A1 (en) | Substrate processing apparatus and temperature regulation method | |
WO2022070310A1 (ja) | 基板処理装置、温度制御プログラム、半導体装置の製造方法及び温度制御方法 | |
KR20050088989A (ko) | 열처리 장치 및 열처리 방법 |