TWI769423B - 一種光罩姿態監測方法、裝置及光罩顆粒度檢測設備 - Google Patents
一種光罩姿態監測方法、裝置及光罩顆粒度檢測設備 Download PDFInfo
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- TWI769423B TWI769423B TW108147934A TW108147934A TWI769423B TW I769423 B TWI769423 B TW I769423B TW 108147934 A TW108147934 A TW 108147934A TW 108147934 A TW108147934 A TW 108147934A TW I769423 B TWI769423 B TW I769423B
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- 238000012544 monitoring process Methods 0.000 title claims abstract description 35
- 239000002245 particle Substances 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title claims abstract description 24
- 238000001514 detection method Methods 0.000 claims abstract description 281
- 238000012806 monitoring device Methods 0.000 claims description 24
- 238000005286 illumination Methods 0.000 claims description 4
- 238000010521 absorption reaction Methods 0.000 claims description 3
- 239000004744 fabric Substances 0.000 claims description 3
- 238000005259 measurement Methods 0.000 claims description 2
- 238000000265 homogenisation Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 14
- 238000001459 lithography Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 3
- 238000007689 inspection Methods 0.000 description 3
- 230000001681 protective effect Effects 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 230000002159 abnormal effect Effects 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 230000035945 sensitivity Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F1/00—Originals for photomechanical production of textured or patterned surfaces, e.g., masks, photo-masks, reticles; Mask blanks or pellicles therefor; Containers specially adapted therefor; Preparation thereof
- G03F1/68—Preparation processes not covered by groups G03F1/20 - G03F1/50
- G03F1/82—Auxiliary processes, e.g. cleaning or inspecting
- G03F1/84—Inspecting
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C21/00—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00
- G01C21/005—Navigation; Navigational instruments not provided for in groups G01C1/00 - G01C19/00 with correlation of navigation data from several sources, e.g. map or contour matching
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B21/00—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant
- G01B21/22—Measuring arrangements or details thereof, where the measuring technique is not covered by the other groups of this subclass, unspecified or not relevant for measuring angles or tapers; for testing the alignment of axes
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01C—MEASURING DISTANCES, LEVELS OR BEARINGS; SURVEYING; NAVIGATION; GYROSCOPIC INSTRUMENTS; PHOTOGRAMMETRY OR VIDEOGRAMMETRY
- G01C1/00—Measuring angles
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N15/00—Investigating characteristics of particles; Investigating permeability, pore-volume or surface-area of porous materials
- G01N15/02—Investigating particle size or size distribution
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- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/20—Exposure; Apparatus therefor
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Remote Sensing (AREA)
- Radar, Positioning & Navigation (AREA)
- Engineering & Computer Science (AREA)
- Pathology (AREA)
- Dispersion Chemistry (AREA)
- General Health & Medical Sciences (AREA)
- Immunology (AREA)
- Analytical Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Health & Medical Sciences (AREA)
- Biochemistry (AREA)
- Automation & Control Theory (AREA)
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Preparing Plates And Mask In Photomechanical Process (AREA)
- Length Measuring Devices With Unspecified Measuring Means (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201811630079.0A CN111380509B (zh) | 2018-12-28 | 2018-12-28 | 一种掩模版姿态监测方法、装置及掩模版颗粒度检测设备 |
CN201811630079.0 | 2018-12-28 |
Publications (2)
Publication Number | Publication Date |
---|---|
TW202026772A TW202026772A (zh) | 2020-07-16 |
TWI769423B true TWI769423B (zh) | 2022-07-01 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW108147934A TWI769423B (zh) | 2018-12-28 | 2019-12-26 | 一種光罩姿態監測方法、裝置及光罩顆粒度檢測設備 |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP7216828B2 (ko) |
KR (1) | KR102672568B1 (ko) |
CN (1) | CN111380509B (ko) |
TW (1) | TWI769423B (ko) |
WO (1) | WO2020135557A1 (ko) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114445402B (zh) * | 2022-04-02 | 2022-06-24 | 深圳市龙图光电有限公司 | 半导体芯片用掩模版贴膜精度检测方法及检测装置 |
Citations (2)
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CN101216290A (zh) * | 2007-12-28 | 2008-07-09 | 上海微电子装备有限公司 | 高精度六轴激光测量装置及测量方法 |
CN103021898A (zh) * | 2012-12-17 | 2013-04-03 | 华中科技大学 | 测量平面角度方法、芯片与基板相对倾角测量方法及*** |
Family Cites Families (21)
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---|---|---|---|---|
JP2676933B2 (ja) * | 1988-09-05 | 1997-11-17 | キヤノン株式会社 | 位置検出装置 |
US6020964A (en) * | 1997-12-02 | 2000-02-01 | Asm Lithography B.V. | Interferometer system and lithograph apparatus including an interferometer system |
JP3640012B2 (ja) * | 1999-05-25 | 2005-04-20 | 住友重機械工業株式会社 | 露光装置におけるマスクあるいはウエハのレベリング用計測方法及び計測制御装置 |
JP2003197502A (ja) * | 2001-12-26 | 2003-07-11 | Nikon Corp | 計測方法及び露光方法、露光装置、並びにデバイス製造方法 |
JP4471704B2 (ja) * | 2003-06-13 | 2010-06-02 | 大日本スクリーン製造株式会社 | 基板検出装置、基板検出方法、基板搬送装置および基板搬送方法、基板処理装置および基板処理方法 |
JP2006201092A (ja) * | 2005-01-21 | 2006-08-03 | Yaskawa Electric Corp | 6自由度移動体の位置・姿勢計測方法および位置・姿勢計測装置 |
JP2009031169A (ja) * | 2007-07-28 | 2009-02-12 | Nikon Corp | 位置検出装置、露光装置、及びデバイスの製造方法 |
CN101221375A (zh) * | 2008-01-25 | 2008-07-16 | 上海微电子装备有限公司 | 用于步进光刻机对准***的机器视觉***及其标定方法 |
CN101975560B (zh) * | 2010-11-03 | 2012-02-08 | 中国科学院长春光学精密机械与物理研究所 | 一种面阵ccd靶面与安装定位面平行度的光学检测方法 |
CN103869627B (zh) * | 2012-12-11 | 2016-03-09 | 上海微电子装备有限公司 | 用于投影光刻机的调焦调平方法 |
JP6598421B2 (ja) * | 2013-02-22 | 2019-10-30 | キヤノン株式会社 | マスクパターンの決定方法、プログラム、情報処理装置 |
CN104007622B (zh) * | 2013-03-18 | 2015-12-09 | 哈尔滨工业大学 | 一种掩模台垂直运动分量的测量方法 |
CN104460235B (zh) * | 2013-09-18 | 2017-01-04 | 上海微电子装备有限公司 | 调焦调平光斑水平位置的测量方法 |
JP2016021008A (ja) * | 2014-07-15 | 2016-02-04 | 凸版印刷株式会社 | マルチパターニング用マスクのパターン評価方法およびパターン評価装置 |
CN107290943B (zh) * | 2016-03-31 | 2019-01-29 | 上海微电子装备(集团)股份有限公司 | 同轴掩模对准装置、光刻设备及对准方法 |
CN106502058B (zh) * | 2016-11-25 | 2018-07-27 | 天津津芯微电子科技有限公司 | 标定方法及标定装置 |
CN206282833U (zh) * | 2016-12-28 | 2017-06-27 | 上海天马微电子有限公司 | 一种掩膜板对位*** |
CN107234618A (zh) * | 2017-08-08 | 2017-10-10 | 广东工业大学 | 一种二自由度机械手臂控制方法及其装置 |
CN107957659B (zh) * | 2017-12-06 | 2021-01-19 | 江苏维普光电科技有限公司 | 掩模版和晶圆缺陷检测正交性补偿方法 |
CN108227402A (zh) * | 2017-12-29 | 2018-06-29 | 信利(惠州)智能显示有限公司 | 一种掩膜板曝光平台及掩膜板的调整方法 |
CN108489423B (zh) * | 2018-03-19 | 2020-04-10 | 苏州华兴源创科技股份有限公司 | 一种产品表面水平倾斜角度的测量方法及*** |
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2018
- 2018-12-28 CN CN201811630079.0A patent/CN111380509B/zh active Active
-
2019
- 2019-12-26 TW TW108147934A patent/TWI769423B/zh active
- 2019-12-26 KR KR1020217023774A patent/KR102672568B1/ko active IP Right Grant
- 2019-12-26 WO PCT/CN2019/128600 patent/WO2020135557A1/zh active Application Filing
- 2019-12-26 JP JP2021537801A patent/JP7216828B2/ja active Active
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101216290A (zh) * | 2007-12-28 | 2008-07-09 | 上海微电子装备有限公司 | 高精度六轴激光测量装置及测量方法 |
CN103021898A (zh) * | 2012-12-17 | 2013-04-03 | 华中科技大学 | 测量平面角度方法、芯片与基板相对倾角测量方法及*** |
Also Published As
Publication number | Publication date |
---|---|
JP7216828B2 (ja) | 2023-02-01 |
CN111380509A (zh) | 2020-07-07 |
KR102672568B1 (ko) | 2024-06-07 |
KR20210104893A (ko) | 2021-08-25 |
TW202026772A (zh) | 2020-07-16 |
JP2022515493A (ja) | 2022-02-18 |
CN111380509B (zh) | 2022-04-01 |
WO2020135557A1 (zh) | 2020-07-02 |
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