TWI760551B - Grinding method - Google Patents

Grinding method Download PDF

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TWI760551B
TWI760551B TW107128811A TW107128811A TWI760551B TW I760551 B TWI760551 B TW I760551B TW 107128811 A TW107128811 A TW 107128811A TW 107128811 A TW107128811 A TW 107128811A TW I760551 B TWI760551 B TW I760551B
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grinding
workpiece
holding
holding surface
grinding wheel
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TW107128811A
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TW201912306A (en
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立石俊幸
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日商迪思科股份有限公司
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B1/00—Processes of grinding or polishing; Use of auxiliary equipment in connection with such processes

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  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

[課題] 適當吸引保持具有翹曲的工件並進行研削。[解決手段] 一種研削方法，研削具有谷狀翹曲的工件，具備：檢測步驟，檢測進行研削的工件的形狀；保持面研削步驟，基於該工件的形狀而使旋轉軸從鉛直方向傾斜至預定角度的研削輪旋轉，並使具有保持面的保持台在與該保持面平行的方向上移動，藉此以該研削輪研削該保持面且在該保持面形成谷狀的彎曲形狀；保持步驟，將該工件承載到該保持台的保持面上，以該保持台吸引保持工件；以及研削步驟，基於在該檢測步驟中所檢測的工件的形狀，而使旋轉軸從垂直方向傾斜的該研削輪旋轉，並使該保持台在沿著該保持面研削步驟中的該保持台的移動方向之方向上移動，以研削工件。[Problem] Appropriate suction and holding of a warped workpiece and grinding. [Solution] A grinding method for grinding a workpiece having valley-like warpage, comprising: a detection step of detecting the shape of the workpiece to be ground; and a holding surface grinding step of inclining a rotation axis from a vertical direction to a predetermined level based on the shape of the workpiece The angular grinding wheel is rotated and the holding table having the holding surface is moved in a direction parallel to the holding surface, whereby the holding surface is ground with the grinding wheel and a valley-like curved shape is formed on the holding surface; the holding step, the workpiece is carried on the holding surface of the holding table, and the workpiece is attracted and held by the holding table; and a grinding step is a grinding wheel whose rotation axis is inclined from a vertical direction based on the shape of the workpiece detected in the detecting step The workpiece is ground by rotating and moving the holding table in a direction along the moving direction of the holding table in the holding surface grinding step.

Description

研削方法Grinding method

本發明係關於一種研削具有翹曲的工件的研削方法。The present invention relates to a grinding method for grinding a workpiece having warpage.

在封裝基板或半導體晶圓等的板狀的基板上設有多個元件。當薄化該基板並切斷時，形成一個個薄化的元件晶片。在薄化元件晶片的步驟中使用研削裝置，其具備：保持該基板的保持台，以及研削該基板的研削單元。在該研削裝置中，該保持台上保持的該基板藉由該研削單元進行研削。該保持台的上表面為保持該基板的保持面。A plurality of elements are provided on a plate-shaped substrate such as a package substrate or a semiconductor wafer. When the substrate is thinned and cut, thinned element wafers are formed one by one. In the step of thinning the element wafer, a grinding apparatus including a holding table for holding the substrate and a grinding unit for grinding the substrate is used. In the grinding apparatus, the substrate held on the holding table is ground by the grinding unit. The upper surface of the holding table is a holding surface for holding the substrate.

研削該基板時，以研削的該基板為均一厚度的方式，例如，使用具有圓錐的側面的形狀的保持面之保持台，該圓錐具有極小斜度的該側面（參閱專利文獻1）。若使用該保持台，可抑制在該基板的被研削面上研削痕殘留的研削燒傷或該基板的損傷。When grinding the substrate, for example, a holding table having a holding surface in the shape of a conical side surface with the side surface having an extremely small slope is used so that the ground substrate has a uniform thickness (see Patent Document 1). By using this holding table, it is possible to suppress grinding burns that remain on the surface to be ground of the substrate from grinding scratches or damage to the substrate.

該研削單元具備：主軸，在鉛直方向大致平行；輪架，配置於該主軸的下端；以及研削輪，裝設於該輪架的下表面。在該研削輪的下表面配設有沿著外周排列的研削磨石。The grinding unit includes: a main shaft that is substantially parallel to the vertical direction; a wheel carrier disposed at the lower end of the main shaft; and a grinding wheel mounted on the lower surface of the wheel carrier. On the lower surface of the grinding wheel, grinding stones arranged along the outer circumference are arranged.

在該基板的研削時，例如，旋轉該主軸使該研削輪旋轉且同時使該保持台旋轉，使該研削單元在鉛直方向下方移動。此外，當該研削輪所裝設的該研削磨石接觸該基板時，研削該基板。如此，使在保持台上方配置的加工單元下降並研削工件的手法稱之為進給（infeed）研削。During grinding of the substrate, for example, by rotating the main shaft to rotate the grinding wheel and simultaneously rotating the holding table, the grinding unit is moved downward in the vertical direction. In addition, when the grinding stone mounted on the grinding wheel contacts the substrate, the substrate is ground. In this way, the method of lowering the machining unit arranged above the holding table and grinding the workpiece is called infeed grinding.

在該研削裝置的該保持台的上部，例如，配置有多孔質構件。該保持台在內部具有一端通過該多孔質構件的吸引路徑，且該吸引路徑的另一端連接吸引源。在該多孔質構件的上方承載該基板等的工件，當作動該吸引源並通過該吸引路徑及該多孔質構件在該工件上作用負壓，則該工件被吸引保持在保持台上。 [習知技術文獻] [專利文獻]On the upper part of the holding table of the grinding device, for example, a porous member is arranged. The holding table has an internal suction path whose one end passes through the porous member, and the other end of the suction path is connected to a suction source. The workpiece such as the substrate is supported on the porous member, and when the suction source is actuated and a negative pressure acts on the workpiece through the suction path and the porous member, the workpiece is sucked and held on the holding table. [Prior Art Documents] [Patent Documents]

[專利文獻1]日本特開2000-288881號公報[Patent Document 1] Japanese Patent Laid-Open No. 2000-288881

[發明所欲解決的課題] 例如，包含以樹脂覆蓋的多個元件的封裝基板，存在以該樹脂所形成側為內側而呈谷狀翹曲的情況。為了將具有谷狀翹曲的該封裝基板作為工件研削該樹脂，若將該樹脂以在上方露出的方式在該保持面承載該封裝基板，則該保持面與該封裝基板之間產生間隙。[Problem to be Solved by the Invention] For example, a package substrate including a plurality of elements covered with a resin may warp in a valley shape with the side where the resin is formed as the inner side. In order to grind the resin with the encapsulation substrate having valley-like warpage as a workpiece, if the encapsulation substrate is supported on the holding surface so that the resin is exposed above, a gap is generated between the holding surface and the encapsulation substrate.

為了在該保持面上適當地吸引保持該工件，需在該工件上適當地作用負壓。但是，如此在該保持面與該工件之間產生間隙，則負壓從該間隙洩漏而難以吸引保持。若無法將該工件適當吸引保持，則難以適當實施研削。In order to properly attract and hold the workpiece on the holding surface, it is necessary to appropriately apply a negative pressure to the workpiece. However, when a gap is formed between the holding surface and the workpiece in this way, negative pressure leaks from the gap, making it difficult to suck and hold the workpiece. If the workpiece cannot be properly sucked and held, it will be difficult to properly perform grinding.

本發明鑒於上述的問題點，其目的為提供一種研削方法，能適當吸引保持具有翹曲的工件並進行研削。In view of the above-mentioned problems, the present invention has an object to provide a grinding method which can properly suck and hold a workpiece having warpage and perform grinding.

[解決課題的技術手段] 根據本發明的一態樣，提供一種研削方法，研削具有谷狀翹曲的工件，其特徵在於具備：檢測步驟，檢測進行研削的工件的形狀；保持面研削步驟，基於在該檢測步驟中所檢測的工件的形狀，而使旋轉軸從鉛直方向傾斜至預定角度的研削輪旋轉並同時定位於預定高度位置，並使具有保持工件的保持面的保持台以從該研削輪的外周側通過該研削輪的正下方的方式，在相對於該保持面平行的方向上移動，藉此以該研削輪研削該保持面且在該保持面形成谷狀的彎曲形狀；保持步驟，實施了該保持面研削步驟後，以使所形成的該保持面的彎曲形狀與該工件的形狀重合的方式將該工件承載到該保持面上，以該保持台吸引保持工件；以及研削步驟，實施了該保持步驟後，基於在該檢測步驟中所檢測的工件的形狀，而使旋轉軸從鉛直方向傾斜的該研削輪旋轉並同時定位於預定高度位置，並使保持該工件的該保持台以從該研削輪的外周側通過該研削輪的正下方的方式，在相對於沿著該保持面研削步驟中的該保持台的移動方向之方向上移動，以研削工件。[Technical Means for Solving the Problem] According to an aspect of the present invention, there is provided a grinding method for grinding a workpiece having valley-like warpage, characterized by comprising: a detection step of detecting the shape of the workpiece to be ground; and a holding surface grinding step, Based on the shape of the workpiece detected in this detection step, the grinding wheel whose rotation axis is inclined to a predetermined angle from the vertical direction is rotated while being positioned at a predetermined height position, and the holding table having the holding surface for holding the workpiece is rotated from the vertical direction. The outer peripheral side of the grinding wheel moves in a direction parallel to the holding surface so as to pass directly below the grinding wheel, thereby grinding the holding surface with the grinding wheel and forming a valley-like curved shape on the holding surface; holding step of carrying out the holding surface grinding step, carrying the workpiece on the holding surface in such a way that the formed curved shape of the holding surface coincides with the shape of the workpiece, and sucking and holding the workpiece with the holding table; and grinding step, after the holding step is carried out, based on the shape of the workpiece detected in the detection step, the grinding wheel whose rotation axis is inclined from the vertical direction is rotated and positioned at a predetermined height position, and the workpiece holding the workpiece is rotated. The holding table is moved in the direction along the moving direction of the holding table in the holding surface grinding step so as to pass directly below the grinding wheel from the outer peripheral side of the grinding wheel to grind the workpiece.

另外，根據本發明的另一態樣，提供一種研削方法，研削具有谷狀翹曲的工件，其特徵在於具備：檢測步驟，檢測進行研削的工件的形狀；保持面研削步驟，基於在該檢測步驟中所檢測的工件的形狀，而使旋轉軸從鉛直方向傾斜至預定角度的保持面用研削輪旋轉並同時定位於預定高度位置，並使具有保持工件的該保持面的保持台以從該保持面用研削輪的外周側通過該保持面用研削輪的正下方的方式，在相對於該保持面平行的方向上移動，藉此以該保持面用研削輪研削該保持面且在該保持面形成谷狀的彎曲形狀；保持步驟，實施了該保持面研削步驟後，以使所形成的該保持面的彎曲形狀與該工件的形狀重合的方式將該工件承載到該保持面上，以該保持台吸引保持工件；以及研削步驟，實施了該保持步驟後，基於在該檢測步驟中所檢測的工件的形狀，而使旋轉軸從鉛直方向傾斜的該工件用研削輪旋轉並同時定位於預定高度位置，並使保持該工件的該保持台以從該工件用研削輪的外周側通過該工件用研削輪的正下方的方式，在相對於沿著該保持面研削步驟中的該保持台的移動方向之方向上移動，以研削工件。In addition, according to another aspect of the present invention, there is provided a grinding method for grinding a workpiece having valley-like warpage, characterized by comprising: a detection step of detecting the shape of the workpiece to be ground; and a holding surface grinding step based on the detection According to the shape of the workpiece detected in the step, the holding surface whose rotation axis is inclined to a predetermined angle from the vertical direction is rotated by the grinding wheel and is positioned at a predetermined height position at the same time, and the holding table having the holding surface holding the workpiece is rotated from the holding surface. The outer peripheral side of the grinding wheel for the holding surface is moved in a direction parallel to the holding surface so that the outer peripheral side of the grinding wheel for the holding surface passes directly below the grinding wheel for the holding surface, thereby grinding the holding surface with the grinding wheel for the holding surface and grinding the holding surface with the grinding wheel for the holding surface. The surface is formed into a valley-like curved shape; in the holding step, after the holding surface grinding step is performed, the workpiece is carried on the holding surface in such a way that the formed curved shape of the holding surface coincides with the shape of the workpiece, so as to The holding table attracts and holds the workpiece; and a grinding step, after the holding step is performed, the workpiece whose rotation axis is inclined from the vertical direction is rotated and positioned on the grinding wheel based on the shape of the workpiece detected in the detection step. A predetermined height position, and the holding table holding the workpiece is made to pass from the outer peripheral side of the workpiece grinding wheel directly below the workpiece grinding wheel relative to the holding table in the grinding step along the holding surface. Move in the direction of the moving direction to grind the workpiece.

[發明功效] 使研削輪從鉛直方向傾斜，若以使該保持台通過旋轉的該研削輪的下方的方式相對移動，則保持台的保持面被研削，形成將該研削輪的最下點所通過的區域作為谷底的谷狀的彎曲形狀。在本發明的一態樣的研削方法中，檢測具有谷狀的翹曲的工件的形狀，且因為基於該工件的形狀設定研削輪的傾斜，在該保持面所形成的該谷狀的彎曲形狀成為接近該工件的形狀之形狀。[Effect of the Invention] When the grinding wheel is inclined from the vertical direction, and the holding table is relatively moved so that the holding table passes under the rotating grinding wheel, the holding surface of the holding table is ground, and the lowermost point of the grinding wheel is formed. The passing area is the valley-like curved shape of the valley bottom. In the grinding method of one aspect of the present invention, the shape of a workpiece having valley-like warpage is detected, and the valley-like curved shape is formed on the holding surface because the inclination of the grinding wheel is set based on the shape of the workpiece. become a shape close to the shape of the workpiece.

若以該工件的形狀與該保持面的形狀重合的方式在該保持面上承載該工件，則該保持面與該工件之間的間隙極小。如此，因以該保持台對該工件進行吸引保持時負壓不易洩漏，故該工件在保持台上被適當地吸引保持。If the workpiece is supported on the holding surface in such a way that the shape of the workpiece coincides with the shape of the holding surface, the gap between the holding surface and the workpiece is extremely small. In this way, since the negative pressure is less likely to leak when the workpiece is sucked and held by the holding table, the workpiece is appropriately sucked and held on the holding table.

之後，與形成該保持面時相同地，使該研削輪從鉛直方向傾斜並旋轉，使保持台以通過該研削輪的下方的方式相對移動，則該工件沿著保持面的形狀被適當研削。再者，使保持台以如此般通過該研削輪的下方的方式相對移動並研削工件的手法，稱之為深進緩給（creep feed）研削。Then, the grinding wheel is tilted and rotated from the vertical direction in the same manner as when the holding surface is formed, and the holding table is relatively moved so as to pass under the grinding wheel, so that the workpiece is properly ground along the shape of the holding surface. Furthermore, the method of relatively moving the holding table so as to pass under the grinding wheel to grind the workpiece is called deep feed grinding.

因此，根據本發明的一態樣，提供一種能適當吸引保持具有翹曲的工件並進行研削的研削方法。Therefore, according to one aspect of the present invention, there is provided a grinding method that can properly suck and hold a workpiece having warpage and perform grinding.

參閱隨附圖式，說明本發明一態樣的實施方式。本實施方式的研削方法的工件，例如為由矽、SiC（碳化矽）或其他半導體等的材料，或者由藍寶石、玻璃、石英等的材料所組成的基板。另外，該工件為以樹脂覆蓋元件的封裝基板。Referring to the accompanying drawings, embodiments of one aspect of the present invention are described. The workpiece of the grinding method of the present embodiment is, for example, a substrate made of materials such as silicon, SiC (silicon carbide), or other semiconductors, or materials such as sapphire, glass, and quartz. In addition, the workpiece is a package substrate in which the element is covered with resin.

在該工件中，例如，設定有格子狀的切斷預定線，在以該切斷預定線劃分的各區域上設有元件。將形成元件的工件藉由本實施方式的研削方法進行研削並薄化，並沿著該切斷預定線切斷該工件，則能形成一個個薄型的元件晶片。In this workpiece, for example, grid-like planned cutting lines are set, and components are provided in respective regions divided by the planned cutting lines. Thin element wafers can be formed one by one by grinding and thinning the workpiece forming the element by the grinding method of the present embodiment, and cutting the workpiece along the line to cut.

以下，以封裝基板為工件的情況為例針對本實施方式進行說明。圖1（A）係示意性表示封裝基板的正面的俯視圖，圖1（B）係表示封裝基板的背面的俯視圖。圖1（C）係示意性表示封裝基板的側視圖。封裝基板1包含俯視形成為大致矩形狀的金屬框體3。金屬框體3例如由42合金（鐵與鎳的合金）或銅等的金屬所構成。Hereinafter, the present embodiment will be described by taking a case where the package substrate is a workpiece as an example. FIG. 1(A) is a plan view schematically showing the front surface of the package board, and FIG. 1(B) is a plan view showing the back surface of the package board. FIG. 1(C) is a side view schematically showing the package substrate. The package substrate 1 includes a metal frame 3 formed in a substantially rectangular shape in plan view. The metal frame 3 is made of, for example, a 42 alloy (an alloy of iron and nickel) or a metal such as copper.

如圖1（B）所示，在封裝基板1的背面1b側配置有多個的台座5。在台座5的表側（封裝基板1的正面1a側），設有與各台座5重合的IC（Integrated Circuit，積體電路）、LSI（Large Scale Integration，大型積體電路）等的元件（未圖示）。在封裝基板1配設密封該元件的樹脂9。樹脂9形成預定的厚度，從金屬框體3在厚度方向突出。在各台座5上，元件由樹脂9覆蓋。As shown in FIG. 1(B) , a plurality of pedestals 5 are arranged on the back surface 1 b side of the package substrate 1 . Components (not shown) such as IC (Integrated Circuit), LSI (Large Scale Integration, Large Scale Integration) and the like are provided on the front side of the pedestal 5 (the front surface 1 a side of the package substrate 1 ) that overlap with each pedestal 5 . Show). The resin 9 for sealing the element is arranged on the package substrate 1 . The resin 9 has a predetermined thickness and protrudes from the metal frame 3 in the thickness direction. On each pedestal 5 , the elements are covered with resin 9 .

在各台座5的周圍行列狀配設多個電極墊7。各電極墊7由樹脂9覆蓋表側並同時露出背側。該電極墊7在形成樹脂9之前以金屬線路（未圖示）等連接各元件的各電極。在相鄰的2個元件所夾持的位置的電極墊7，與該相鄰的2個元件連接。將封裝基板1切削形成一個個的元件晶片時，該電極墊7被切斷為分別的元件晶片的電極端子。A plurality of electrode pads 7 are arranged in a matrix around each pedestal 5 . The front side of each electrode pad 7 is covered with resin 9 while the back side is exposed. This electrode pad 7 is connected to each electrode of each element by a metal line (not shown) or the like before the resin 9 is formed. The electrode pad 7 at the position sandwiched by the two adjacent elements is connected to the two adjacent elements. When the package substrate 1 is cut into individual element wafers, the electrode pads 7 are cut into electrode terminals of the individual element wafers.

在封裝基板1的背面1b側形成有標記11。該標記11作為在切斷封裝基板1時為了將加工單元重合至預定位置的記號而使用。若在一對的標記11之間切斷電極墊7和樹脂9，則形成一個個的元件晶片。換言之，多個電極墊7並列的各行各列為切斷預定線。A mark 11 is formed on the back surface 1 b side of the package substrate 1 . This mark 11 is used as a mark for superimposing the processing unit to a predetermined position when cutting the package substrate 1 . When the electrode pad 7 and the resin 9 are cut between the pair of marks 11, individual element wafers are formed. In other words, the rows and columns in which the plurality of electrode pads 7 are arranged in parallel are the planned cutting lines.

接著，用圖2針對研削裝置進行說明，該研削裝置係為了形成薄型的元件晶片而將封裝基板1從正面1a側研削。圖2係示意性表示研削裝置的一例的立體圖。Next, a grinding apparatus for grinding the package substrate 1 from the front 1a side in order to form a thin element wafer will be described with reference to FIG. 2 . FIG. 2 is a perspective view schematically showing an example of a grinding apparatus.

在研削裝置2的裝置基台4的上表面設置開口4a。在該開口4a內，吸引保持工件的保持台6具備承載於上表面的X軸移動台8。該X軸移動台8藉由未圖示的X軸方向移動機構而能在X軸方向移動。該X軸移動台8定位於藉由該X軸方向移動機構在保持台6上裝卸工件的搬出入區域10，以及研削加工該保持台6上所吸引保持的工件的加工區域12。An opening 4 a is provided on the upper surface of the device base 4 of the grinding device 2 . Inside the opening 4a, the holding table 6 that sucks and holds the workpiece includes an X-axis moving table 8 mounted on the upper surface. The X-axis moving stage 8 is movable in the X-axis direction by an X-axis direction moving mechanism not shown. The X-axis moving table 8 is positioned in a carry-in area 10 where workpieces are loaded and unloaded from the holding table 6 by the X-axis direction moving mechanism, and a machining area 12 where the workpiece sucked and held on the holding table 6 is ground and processed.

在該保持台6的上表面配設具有對應該工件的平面形狀的上表面的多孔質構件，該多孔質構件的該上表面為保持該工件的保持面6a。該保持台6在內部具備一端通過該多孔質構件而另一端連接於未圖示的吸引源的吸引路徑6b（參閱圖4（A）等）。當使該吸引源作動，則負壓作用在該保持面6a上承載的工件，該工件在保持台6上被吸引保持。另外，該保持台6能繞著垂直於該保持面6a的軸旋轉。A porous member having an upper surface corresponding to the planar shape of the workpiece is disposed on the upper surface of the holding table 6, and the upper surface of the porous member is a holding surface 6a for holding the workpiece. The holding table 6 is internally provided with a suction path 6b (see FIG. 4(A) and the like) through which one end passes through the porous member and the other end is connected to a suction source (not shown). When the suction source is actuated, a negative pressure acts on the workpiece carried on the holding surface 6 a, and the workpiece is sucked and held on the holding table 6 . In addition, the holding table 6 is rotatable about an axis perpendicular to the holding surface 6a.

在該加工區域12的上方配設加工該工件的研削單元14。在裝置基台4的後方側立設支撐部16，藉由該支撐部16支撐研削單元14。在支撐部16的前面設置在Z軸方向延伸的一對Z軸導軌18，各Z軸導軌18上安裝有能滑動的Z軸移動板20。A grinding unit 14 for machining the workpiece is arranged above the machining area 12 . A support portion 16 is erected on the rear side of the apparatus base 4 , and the grinding unit 14 is supported by the support portion 16 . A pair of Z-axis guide rails 18 extending in the Z-axis direction are provided on the front surface of the support portion 16 , and a Z-axis moving plate 20 is slidably attached to each Z-axis guide rail 18 .

在Z軸移動板20的背面側（後面側）設置螺帽部（未圖示），該螺帽部和與Z軸導軌18平行的Z軸滾珠螺桿22螺合。在Z軸滾珠螺桿22的一端部連結Z軸脈衝馬達24。若以 Z軸脈衝馬達24使Z軸滾珠螺桿22旋轉，則Z軸移動板20沿著Z軸導軌18在Z軸方向移動。On the rear side (rear side) of the Z-axis moving plate 20 , a nut portion (not shown) is provided, and the nut portion is screwed with the Z-axis ball screw 22 parallel to the Z-axis guide rail 18 . The Z-axis pulse motor 24 is connected to one end of the Z-axis ball screw 22 . When the Z-axis ball screw 22 is rotated by the Z-axis pulse motor 24 , the Z-axis moving plate 20 moves in the Z-axis direction along the Z-axis guide rail 18 .

在Z軸移動板20的前面側下部固定著研削單元14，其實施工件的研削加工。若使Z軸移動板20在Z軸方向移動，則研削單元14能在Z軸方向移動。A grinding unit 14 is fixed to the lower part of the front side of the Z-axis moving plate 20, and performs grinding processing of the workpiece. When the Z-axis moving plate 20 is moved in the Z-axis direction, the grinding unit 14 can be moved in the Z-axis direction.

研削單元14具備：主軸28，藉由連接在基端側的馬達旋轉；研削輪30，裝設在該主軸28的前端部且隨著主軸28的轉動而轉動；以及研削磨石32，具備於該研削輪30的下表面。在主軸外殼26內具備該馬達。The grinding unit 14 includes: a main shaft 28 that is rotated by a motor connected to the base end side; a grinding wheel 30 that is attached to the front end of the main shaft 28 and rotates with the rotation of the main shaft 28; and a grinding stone 32 that is provided on The lower surface of the grinding wheel 30 . This motor is provided in the spindle housing 26 .

該研削單元14連接輪傾斜變更機構30a。該輪傾斜變更機構30a具有將該研削單元14的主軸28與研削輪30在XZ平面（包含X軸方向及Z軸方向的平面）內以預定角度傾斜的功能。例如，將主軸28沿著Z軸（鉛直方向）的狀態作為初期狀態，該輪傾斜變更機構30a將該主軸28向X軸方向傾斜。The grinding unit 14 is connected to the wheel inclination changing mechanism 30a. The wheel inclination changing mechanism 30a has a function of inclining the main shaft 28 of the grinding unit 14 and the grinding wheel 30 at a predetermined angle in the XZ plane (a plane including the X-axis direction and the Z-axis direction). For example, the wheel inclination changing mechanism 30a inclines the main shaft 28 in the X-axis direction, taking the state in which the main shaft 28 is along the Z-axis (vertical direction) as the initial state.

在該研削裝置2的研削加工時，首先，在定位於搬出入區域10的保持台6的保持面6a上承載工件，在該保持台6吸引保持，並使保持台6移動至加工區域12。接著，藉由輪傾斜變更機構30a將該研削單元14（主軸28及研削輪30）從鉛直方向傾斜至預定的角度，使Z軸移動板20在Z軸方向移動並將研削輪30定位於預定的高度位置。In the grinding process of the grinding device 2 , first, the workpiece is placed on the holding surface 6 a of the holding table 6 positioned in the carry-in area 10 , the holding table 6 is sucked and held, and the holding table 6 is moved to the processing area 12 . Next, the grinding unit 14 (spindle 28 and grinding wheel 30 ) is tilted from the vertical direction to a predetermined angle by the wheel inclination changing mechanism 30 a, the Z-axis moving plate 20 is moved in the Z-axis direction, and the grinding wheel 30 is positioned at a predetermined angle. height position.

此外，使該主軸28旋轉並使研削輪30旋轉，使該保持台6以通過研削輪30的下方的方式沿著X軸方向移動至研削裝置2的支撐部16側。當研削磨石32的下端接觸工件時，則研削該工件。如此般使該保持台6以通過該研削輪30的下方的方式相對移動並研削工件的手法稱之為深進緩給研削。Further, the spindle 28 is rotated to rotate the grinding wheel 30 , and the holding table 6 is moved to the support portion 16 side of the grinding device 2 in the X-axis direction so as to pass under the grinding wheel 30 . When the lower end of the grinding stone 32 contacts the workpiece, the workpiece is ground. Such a method of relatively moving the holding table 6 so as to pass under the grinding wheel 30 to grind the workpiece is called deep feed grinding.

在此，以封裝基板1的短邊方向為第1方向1d，長邊方向為第2方向1c時，如圖1（C）所示，封裝基板1為從包含該第1方向1d的側面側看去，將正面1a側視為內側會具有谷狀翹曲的情況。Here, when the short-side direction of the package substrate 1 is the first direction 1d and the long-side direction is the second direction 1c, as shown in FIG. The front 1a side is viewed as a case where the inner side may have valley-like warpage.

在該封裝基板1具有翹曲的情況下，該封裝基板1作為工件以研削裝置2從正面1a側進行研削時，不容易在保持台6適當吸引保持該封裝基板1。將具有翹曲的該封裝基板1承載在保持台6上時，因保持面6a與該封裝基板1之間產生間隙，即使作動保持台6的吸引源，負壓亦從該間隙洩漏。When the package substrate 1 has warpage, when the package substrate 1 is ground as a workpiece from the front 1 a side by the grinding device 2 , it is not easy to properly suck and hold the package substrate 1 on the holding table 6 . When the warped package substrate 1 is placed on the holding table 6 , a gap is created between the holding surface 6 a and the package substrate 1 . Even if the suction source of the holding table 6 is actuated, negative pressure leaks from the gap.

因此，本實施方式的研削方法中，預先對保持台6的保持面6a實施深進緩給研削，並將保持面6a加工成與封裝基板1的翹曲重合的形狀。以下說明關於本實施方式的研削方法。Therefore, in the grinding method of the present embodiment, the holding surface 6 a of the holding table 6 is subjected to deep feed and slow feed grinding in advance, and the holding surface 6 a is processed into a shape overlapping the warpage of the package substrate 1 . The grinding method according to the present embodiment will be described below.

本實施方式的研削方法中，實施檢測步驟，檢測進行研削的工件的形狀。圖3（A）係示意性表示檢測作為工件的封裝基板1的正面1a側的形狀的檢測步驟的側視圖，圖3（B）係示意性表示檢測作為工件的封裝基板1的背面1b側的形狀的檢測步驟的側視圖。檢測步驟由具有檢測承載於載置面36的工件的形狀之功能的距離測量器34實施。In the grinding method of the present embodiment, a detection step is implemented to detect the shape of the workpiece to be ground. 3(A) is a side view schematically showing a detection step for detecting the shape of the package substrate 1 as a workpiece on the front 1a side, and FIG. 3(B) is a side view schematically showing a process for detecting the shape of the package substrate 1 as a workpiece on the back 1b side. Side view of the shape detection step. The detection step is implemented by the distance measuring device 34 having a function of detecting the shape of the workpiece placed on the placement surface 36 .

該載置面36為平坦面，該載置面36承載由該距離測量器34檢測形狀的被測量物。該距離測量器34例如為雷射距離測量器。該距離測量器34對承載於載置面36的被測量物照射雷射光束，並檢測被該被測量物反射而到達該距離測量器34的雷射光束。基於從開始光束的照射至該雷射光束到達該距離測量器34的時間，能測量該距離測量器34至被測量物的距離。The placing surface 36 is a flat surface, and the placing surface 36 supports an object whose shape is detected by the distance measuring device 34 . The distance measuring device 34 is, for example, a laser distance measuring device. The distance measuring device 34 irradiates the object to be measured carried on the mounting surface 36 with a laser beam, and detects the laser beam reflected by the object to be measured and reaches the distance measuring device 34 . Based on the time from the start of the irradiation of the beam until the laser beam reaches the distance measurer 34, the distance from the distance measurer 34 to the object to be measured can be measured.

在該被測量物的上表面全體掃描雷射光束，能藉由求得該上表面的各點的高度（距該距離測量器34的距離）而檢測該被測量物的上表面的形狀。The laser beam is scanned over the entire upper surface of the object to be measured, and the shape of the upper surface of the object to be measured can be detected by obtaining the height of each point on the upper surface (the distance from the distance measuring device 34 ).

再者，該距離測量器亦可為接觸式的高度測量量規。在該距離測量器為接觸式的高度測量量規的情況下，若使在該距離測量器的下端配置的量規頭（未圖示）接觸被測量物的上表面，即能測量被接觸定點的高度。Furthermore, the distance measuring device can also be a contact-type height measuring gauge. When the distance measuring device is a contact-type height measuring gauge, if the gauge head (not shown) arranged at the lower end of the distance measuring device is brought into contact with the upper surface of the object to be measured, the fixed point to be contacted can be measured. the height of.

研削裝置2亦可具有距離測量器34，此情況下，檢測步驟以研削裝置2實施。另外，在研削裝置2不具備距離測量器34的情況下，該檢測步驟在研削裝置2的外部實施。The grinding device 2 may have the distance measuring device 34 , and in this case, the detection step is carried out by the grinding device 2 . In addition, in the case where the grinding device 2 does not include the distance measuring device 34 , this detection step is performed outside the grinding device 2 .

檢測步驟中，如圖3（A）所示，首先，將背面1b側面向下方，使正面1a在上方露出的方式，將作為工件的封裝基板1承載於載置面36。此外，該封裝基板1的上方以距離測量器34掃描，藉由該距離測量器34檢測該封裝基板1的正面1a的各點高度。如此，能檢測該封裝基板1的正面1a的形狀。In the detection step, as shown in FIG. 3(A) , first, the package substrate 1 as a workpiece is placed on the mounting surface 36 so that the side surface of the back surface 1 b is turned downward and the front surface 1 a is exposed upward. In addition, the top of the package substrate 1 is scanned with a distance measuring device 34 , and the height of each point on the front surface 1 a of the package substrate 1 is detected by the distance measuring device 34 . In this way, the shape of the front surface 1a of the package substrate 1 can be detected.

再者，檢測步驟中，如圖3（B）所示，亦可將正面1a側面向下方，使背面1b在上方露出的方式，將封裝基板1承載於載置面36，藉由該距離測量器34檢測該封裝基板1的背面1b的形狀。Furthermore, in the detection step, as shown in FIG. 3(B) , the package substrate 1 may be supported on the mounting surface 36 in such a manner that the side surface of the front surface 1a is turned downward and the back surface 1b is exposed upward, and the distance can be measured by measuring the distance. The detector 34 detects the shape of the back surface 1 b of the package substrate 1 .

本實施方式的研削方法中，以研削輪30對研削裝置2的保持台6進行研削，並實施保持面研削步驟，起在該保持面6a形成接近該封裝基板1的形狀之谷狀的彎曲形狀。圖4（A）係示意性表示保持面研削步驟的剖面圖，圖4（B）係示意性表示保持面研削步驟的上視圖。In the grinding method of the present embodiment, the holding table 6 of the grinding device 2 is ground with the grinding wheel 30 , and the holding surface grinding step is performed to form a valley-like curved shape close to the shape of the package substrate 1 on the holding surface 6 a . FIG. 4(A) is a cross-sectional view schematically showing the holding surface grinding step, and FIG. 4(B) is a top view schematically showing the holding surface grinding step.

後述的保持步驟中，將該封裝基板1承載於保持台6之上。該保持面研削步驟中，在保持步驟以該封裝基板1與該保持面6a之間不產生間隙的方式，在該保持面6a形成接近該封裝基板1的形狀之谷狀的彎曲形狀。In the holding step described later, the package substrate 1 is placed on the holding table 6 . In the holding surface grinding step, a valley-like curved shape close to the shape of the package substrate 1 is formed on the holding surface 6a so that a gap is not generated between the package substrate 1 and the holding surface 6a in the holding step.

該保持面研削步驟中，基於以該檢測步驟檢測到的封裝基板1的形狀，藉由輪傾斜變更機構30a將該研削輪30傾斜至預定的角度。亦即，使主軸28從垂直方向（Z軸方向）傾斜。接著，將該研削輪30定位於預定的高度位置，使該主軸28旋轉以使該研削輪30旋轉。此外，使該保持台6以通過該研削輪30的正下方的方式在相對於該保持面6a平行的方向（X軸方向）上移動，並研削保持面6a。In the holding surface grinding step, the grinding wheel 30 is inclined to a predetermined angle by the wheel inclination changing mechanism 30a based on the shape of the package substrate 1 detected in the detection step. That is, the main shaft 28 is inclined from the vertical direction (Z-axis direction). Next, the grinding wheel 30 is positioned at a predetermined height position, and the spindle 28 is rotated to rotate the grinding wheel 30 . Further, the holding table 6 is moved in a direction (X-axis direction) parallel to the holding surface 6 a so as to pass directly below the grinding wheel 30 , and the holding surface 6 a is ground.

圖4（C）係示意性表示以保持面研削步驟研削的保持面6a的剖面圖。在主軸28從Z軸方向（鉛直方向）傾斜的狀態下研削保持面6a，則在保持面6a形成將該研削輪的最下點所通過的區域作為谷底的谷狀的彎曲形狀。形成的彎曲形狀由主軸28的傾斜大小決定。因此，在保持面研削步驟中，基於在該檢測步驟檢測的封裝基板1的形狀，決定該主軸28的傾斜角度。FIG. 4(C) is a cross-sectional view schematically showing the holding surface 6 a ground in the holding surface grinding step. When the holding surface 6a is ground with the spindle 28 inclined from the Z-axis direction (vertical direction), the holding surface 6a forms a valley-like curved shape in which the region through which the lowermost point of the grinding wheel passes is the bottom of the valley. The resulting curved shape is determined by the magnitude of the inclination of the main shaft 28 . Therefore, in the holding surface grinding step, the inclination angle of the spindle 28 is determined based on the shape of the package substrate 1 detected in the detection step.

在該檢測步驟中檢測到該封裝基板1的背面1b側的形狀之情況下，以在保持面6a形成接近檢測到的該形狀之谷狀的彎曲形狀的方式，算出該主軸28的傾角。另外，在具有谷狀的翹曲的該封裝基板1中，正面1a側亦為與背面1b側相同的彎曲。因此，在該檢測步驟中檢測到該封裝基板1的正面1a側的形狀之情況下，亦能以在保持面6a形成接近該檢測到的形狀之谷狀的彎曲形狀的方式，算出該主軸28的傾角。When the shape on the back surface 1b side of the package substrate 1 is detected in this detection step, the inclination angle of the spindle 28 is calculated so that a curved shape close to the detected shape is formed on the holding surface 6a. Moreover, in this package board|substrate 1 which has a valley-shaped curvature, the front surface 1a side also has the same curvature as the back surface 1b side. Therefore, even when the shape on the front 1a side of the package substrate 1 is detected in the detection step, the main axis 28 can be calculated so that a valley-like curved shape close to the detected shape is formed on the holding surface 6a. the inclination angle.

接著說明關於本實施方式的研削方法的保持步驟。圖5（A）係示意性表示保持步驟的剖面圖。在該保持步驟中，將背面1b側面向下方，使被研削面的正面1a側在上方露出的狀態下，將作為工件的該封裝基板1承載於該保持台6的該保持面6a。此時，將藉由保持面研削步驟形成的該保持面6a的谷狀的彎曲形狀與該封裝基板1的形狀重合的方式，將該封裝基板1承載於該保持面6a。Next, the holding procedure of the grinding method of the present embodiment will be described. FIG. 5(A) is a cross-sectional view schematically showing a holding step. In this holding step, the package substrate 1 as a workpiece is placed on the holding surface 6 a of the holding table 6 with the back side 1 b facing downward and the front 1 a side of the ground surface exposed upward. At this time, the package substrate 1 is placed on the holding surface 6 a so that the valley-like curved shape of the holding surface 6 a formed by the holding surface grinding step overlaps the shape of the package substrate 1 .

接著，作動保持台6的吸引源（未圖示），通過吸引路徑6b在該封裝基板1上作用負壓，並以該保持台6吸引保持封裝基板1。因該封裝基板1的背面1b與該保持面6a之間的間隙變為極小，故能不洩漏該負壓地適當吸引保持該封裝基板1。Next, the suction source (not shown) of the holding table 6 is actuated, and a negative pressure is applied to the package substrate 1 through the suction path 6 b , and the package substrate 1 is sucked and held by the holding table 6 . Since the gap between the back surface 1b of the package substrate 1 and the holding surface 6a is extremely small, the package substrate 1 can be properly sucked and held without leaking the negative pressure.

接著說明關於本實施方式的研削方法的研削步驟。圖5（B）係示意性表示研削步驟的剖面圖。該研削步驟中，基於在該檢測步驟檢測到的封裝基板1的形狀，以該研削輪30研削該封裝基板1的正面1a側。Next, the grinding steps of the grinding method of the present embodiment will be described. FIG. 5(B) is a cross-sectional view schematically showing a grinding step. In the grinding step, based on the shape of the package substrate 1 detected in the detection step, the front surface 1 a side of the package substrate 1 is ground with the grinding wheel 30 .

該研削步驟中，基於在該檢測步驟檢測到的封裝基板1的形狀，藉由輪傾斜變更機構30a將該研削輪30傾斜至預定的角度。亦即，使主軸28從垂直方向（Z軸方向）傾斜。接著，將該研削輪30定位於預定的高度位置，使該主軸28旋轉以使該研削輪30旋轉。此外，使該保持台6以通過該研削輪30的正下方的方式相對於該保持面6a平行的方向（X軸方向）上移動，並研削封裝基板1。In this grinding step, based on the shape of the package substrate 1 detected in this detection step, the grinding wheel 30 is inclined to a predetermined angle by the wheel inclination changing mechanism 30a. That is, the main shaft 28 is inclined from the vertical direction (Z-axis direction). Next, the grinding wheel 30 is positioned at a predetermined height position, and the spindle 28 is rotated to rotate the grinding wheel 30 . Furthermore, the package substrate 1 is ground by moving the holding table 6 in a direction (X-axis direction) parallel to the holding surface 6 a so as to pass directly below the grinding wheel 30 .

亦即，在該研削步驟中，將研削輪30傾斜至與該保持面研削步驟相同的角度。另外，在該保持面研削步驟中，將該研削輪30定位於能研削該保持面6a的高度位置。相對於此，在該保持面研削步驟中，研削在該保持面6a上所吸引保持的研削基板1，並將該研削輪30定位於能薄化成預定的厚度的高度位置。若實施該研削步驟，則具有谷狀的翹曲的該封裝基板1被適當研削，以跨過全域沿著該保持面6a的形狀成為大致均一的厚度。That is, in the grinding step, the grinding wheel 30 is inclined to the same angle as the holding surface grinding step. In addition, in the holding surface grinding step, the grinding wheel 30 is positioned at a height position capable of grinding the holding surface 6a. On the other hand, in the holding surface grinding step, the grinding substrate 1 sucked and held by the holding surface 6a is ground, and the grinding wheel 30 is positioned at a height position capable of being thinned to a predetermined thickness. When this grinding step is carried out, the package substrate 1 having the valley-like warpage is appropriately ground to have a substantially uniform thickness along the shape of the holding surface 6a over the entire area.

如以上說明，根據本實施方式的研削方法，能適當吸引保持具有翹曲的工件並進行研削。As described above, according to the grinding method of the present embodiment, it is possible to appropriately suck and hold a workpiece having warpage and perform grinding.

再者，本發明不限定於上述實施方式之記載，可進行各式各樣變更並實施。例如，在上述的實施方式中，該研削裝置2具有一個研削單元14，雖以一個研削輪30研削保持台6的保持面6a及封裝基板1兩者的情況進行了說明，但本發明的一態樣並不限定於此。例如，使用本發明的一態樣的研削方法的該研削裝置亦可具備2個研削單元。In addition, this invention is not limited to the description of the said embodiment, Various changes can be made and implemented. For example, in the above-mentioned embodiment, the grinding apparatus 2 has one grinding unit 14, and the case where one grinding wheel 30 grinds both the holding surface 6a of the holding table 6 and the package substrate 1 has been described. The aspect is not limited to this. For example, the grinding apparatus using the grinding method of one aspect of the present invention may include two grinding units.

亦即，該研削裝置亦可具備2個研削輪：研削保持台的保持面的保持面用研削輪，以及研削該工件的工件用研削輪。此種情況，使用保持面用研削輪實施保持面研削步驟，並使用工件用研削輪實施研削步驟。藉由使用2個研削輪，能分別使用適合於保持面的研削的研削輪與適合於工件的研削的研削輪。That is, the grinding apparatus may include two grinding wheels: a grinding wheel for a holding surface for grinding the holding surface of the holding table, and a grinding wheel for a workpiece for grinding the workpiece. In this case, the holding surface grinding step is performed using the grinding wheel for holding surfaces, and the grinding step is performed using the grinding wheel for workpieces. By using two grinding wheels, the grinding wheel suitable for grinding the holding surface and the grinding wheel suitable for grinding the workpiece can be used, respectively.

另外，在上述的實施方式中，雖以工件沿著短邊方向谷狀翹曲的情況為例說明，本發明並非限定於此。根據本發明的一態樣，即使在沿著長邊方向工件為谷狀翹曲的情況中，亦能藉由將保持台的保持面與該工件的翹曲重合以研削輪進行研削，藉此將該工件適當保持於保持台並實施研削。In addition, in the above-mentioned embodiment, although the case where a workpiece|work is valley-like warped along the short-side direction was demonstrated as an example, this invention is not limited to this. According to one aspect of the present invention, even when the workpiece is warped in a valley shape along the longitudinal direction, the grinding wheel can perform grinding by overlapping the holding surface of the holding table with the warping of the workpiece, thereby performing grinding. The workpiece is appropriately held on the holding table and ground.

另外，將多個相同的工件依序研削的情況，不必要對全部的該工件實施檢測步驟，配合各個工件的形狀實施研削保持面的保持面研削步驟。當該些工件的製造方法相同時，全部工件的翹曲具有同樣程度的傾向。In addition, when a plurality of identical workpieces are sequentially ground, it is not necessary to perform the detection step on all the workpieces, and the holding surface grinding step of grinding the holding surface is performed according to the shape of each workpiece. When the manufacturing methods of the workpieces are the same, all the workpieces tend to have the same degree of warpage.

因此，在研削該些工件時，以檢測步驟檢測最初的工件的形狀，且只要基於該形狀實施保持面研削步驟，第2個以後的該工件亦能以保持台6適當吸引保持。亦即，在本發明的一態樣的研削方法中，與檢測步驟及保持面研削步驟有關係之工件以及與保持步驟及研削步驟有關係之工件亦可不為同一的工件，在此種情況亦能達到適當保持工件並實施研削的效果。Therefore, when grinding these workpieces, the shape of the first workpiece is detected in the detection step, and as long as the holding surface grinding step is performed based on the shape, the second and subsequent workpieces can be properly sucked and held by the holding table 6 . That is, in the grinding method of one aspect of the present invention, the workpiece related to the detection step and the holding surface grinding step and the workpiece related to the holding step and the grinding step may not be the same workpiece, and in this case, It can achieve the effect of properly holding the workpiece and carrying out grinding.

其他，上述實施方式的構造、方法等，在不脫離本發明目的之範圍內可進行適當變更。In addition, the structure, method, etc. of the above-mentioned embodiment can be suitably changed in the range which does not deviate from the objective of this invention.

1‧‧‧封裝基板1a‧‧‧正面1b‧‧‧背面1c‧‧‧第2方向1d‧‧‧第1方向3‧‧‧金屬框體5‧‧‧台座7‧‧‧電極墊9‧‧‧樹脂11‧‧‧標記2‧‧‧研削裝置4‧‧‧裝置基台4a‧‧‧開口6‧‧‧卡盤台6a‧‧‧保持面6b‧‧‧吸引路徑8‧‧‧X軸移動台10‧‧‧搬出入區域12‧‧‧加工區域14‧‧‧研削單元16‧‧‧支撐部18‧‧‧Z軸導軌20‧‧‧Z軸移動板22‧‧‧Z軸滾珠螺桿24‧‧‧Z軸脈衝馬達26‧‧‧主軸外殼28‧‧‧主軸28a‧‧‧輪架30‧‧‧研削輪30a‧‧‧輪傾斜變更機構32‧‧‧研削磨石34‧‧‧距離測量器36‧‧‧載置面1‧‧‧Packaging substrate 1a‧‧‧Front 1b‧‧‧Back 1c‧‧Second direction 1d‧‧‧First direction 3‧‧‧Metal frame 5‧‧‧Pedestal 7‧‧‧Electrode pad 9‧ ‧‧Resin 11‧‧‧Marking 2‧‧‧Grinding Device 4‧‧‧Device Base 4a‧‧‧Opening 6‧‧‧Chuck Table 6a‧‧‧Retaining Surface 6b‧‧‧Suction Path 8‧‧‧X Axis moving table 10‧‧‧Loading and unloading area 12‧‧‧Machining area 14‧‧‧Grinding unit 16‧‧‧Support part 18‧‧‧Z axis guide 20‧‧‧Z axis moving plate 22‧‧‧Z axis ball Screw 24‧‧‧Z-axis pulse motor 26‧‧‧Spindle housing 28‧‧‧Spindle 28a‧‧‧Wheel carrier 30‧‧‧Grinding wheel 30a‧‧‧Wheel tilt changing mechanism 32‧‧‧Grinding stone 34‧‧ ‧Distance measuring device 36‧‧‧Mounting surface

圖1（A）係示意性表示封裝基板的正面側的俯視圖，圖1（B）係示意性表示封裝基板的背面側的俯視圖，圖1（C）係示意性表示該封裝基板的側視圖。 圖2係示意性表示研削裝置的立體圖。 圖3（A）係示意性表示檢測封裝基板的正面側的形狀的檢測步驟的側視圖，圖3（B）係示意性表示檢測封裝基板的背面側的形狀的檢測步驟的側視圖。 圖4（A）係示意性表示保持面研削步驟的剖面圖，圖4（B）係示意性表示保持面研削步驟的上視圖，圖4（C）係示意性表示以保持面研削步驟研削的保持面的剖面圖。 圖5（A）係示意性表示保持步驟的剖面圖，圖5（B）係示意性表示研削步驟的剖面圖。1(A) is a plan view schematically showing the front side of the package board, FIG. 1(B) is a plan view schematically showing the back side of the package board, and FIG. 1(C) is a side view schematically showing the package board. FIG. 2 is a perspective view schematically showing a grinding apparatus. 3(A) is a side view schematically showing a detection step of detecting the shape of the front side of the package substrate, and FIG. 3(B) is a side view schematically showing a detection step of detecting the shape of the back side of the package substrate. 4(A) is a cross-sectional view schematically showing a grinding step of the holding surface, FIG. 4(B) is a top view schematically showing the grinding step of the holding surface, and FIG. Keep a profile of the face. FIG. 5(A) is a cross-sectional view schematically showing a holding step, and FIG. 5(B) is a cross-sectional view schematically showing a grinding step.

6‧‧‧卡盤台 6‧‧‧Chuck table

6a‧‧‧保持面 6a‧‧‧Maintaining surface

6b‧‧‧吸引路徑 6b‧‧‧Path of attraction

28‧‧‧主軸 28‧‧‧Spindle

28a‧‧‧輪架 28a‧‧‧Wheel frame

30‧‧‧研削輪 30‧‧‧grinding wheel

32‧‧‧研削磨石 32‧‧‧grinding stone

Claims (2)

一種研削方法，研削具有谷狀翹曲的工件，其特徵在於具備：檢測步驟，檢測進行研削的該工件的形狀；保持面研削步驟，基於在該檢測步驟中所檢測的該工件的形狀，而使旋轉軸從鉛直方向傾斜至預定角度的研削輪旋轉並同時定位於預定高度位置，並使具有保持該工件的保持面的保持台以從該研削輪的外周側通過該研削輪的正下方的方式，在相對於該保持面平行的方向上移動，藉此以該研削輪研削該保持面且在該保持面形成谷狀的彎曲形狀；保持步驟，實施了該保持面研削步驟後，以使所形成的該保持面的彎曲形狀與該工件的形狀重合的方式將該工件承載到該保持面上，以該保持台吸引保持該工件；以及研削步驟，實施了該保持步驟後，基於在該檢測步驟中所檢測的該工件的形狀，而使該旋轉軸從鉛直方向傾斜的該研削輪旋轉並同時定位於預定高度位置，並使保持該工件的該保持台以從該研削輪的外周側通過該研削輪的正下方的方式，在相對於沿著該保持面研削步驟中的該保持台的移動方向之方向上移動，以研削該工件。 A grinding method for grinding a workpiece having valley-like warpage, characterized by comprising: a detection step of detecting the shape of the workpiece to be ground; and a holding surface grinding step of, based on the shape of the workpiece detected in the detection step, and The grinding wheel whose rotation axis is inclined to a predetermined angle from the vertical direction is rotated while being positioned at a predetermined height position, and the holding table having the holding surface for holding the workpiece is made to pass from the outer peripheral side of the grinding wheel directly below the grinding wheel. manner, moving in a direction parallel to the holding surface, thereby grinding the holding surface with the grinding wheel and forming a valley-like curved shape on the holding surface; in the holding step, after the holding surface grinding step is performed, The formed curved shape of the holding surface and the shape of the workpiece are carried on the holding surface in such a manner that the workpiece is attracted and held by the holding table; and a grinding step, after the holding step is carried out, based on the The shape of the workpiece detected in the detection step is rotated, the grinding wheel whose rotation axis is inclined from the vertical direction is rotated while being positioned at a predetermined height position, and the holding table holding the workpiece is rotated from the outer peripheral side of the grinding wheel. The workpiece is ground by moving in a direction relative to the moving direction of the holding table in the holding surface grinding step by being directly below the grinding wheel. 一種研削方法，研削具有谷狀翹曲的工件，其特徵在於具備：檢測步驟，檢測進行研削的該工件的形狀；保持面研削步驟，基於在該檢測步驟中所檢測的該工件的形狀，而使旋轉軸從鉛直方向傾斜至預定角度的保持面用研削輪旋轉並同時定位於預定高度位置，並使具有保持該工件的保持面的保持台以從該保持面用研削輪的外周側通過該保持面用研削輪的正下方的方式，在相對於該保持面平行的方向上移動，藉此以該保持面用研削輪研削該保持面且在該保持面形成谷狀的彎曲形狀；保持步驟，實施了該保持面研削步驟後，以使所形成的該保持面的彎曲形狀與該工件的形狀重合的方式將該工件承載到該保持面上，以該保持台吸引保持該工件；以及研削步驟，實施了該保持步驟後，基於在該檢測步驟中所檢測的該工件的形狀，而使該旋轉軸從鉛直方向傾斜的工件用研削輪旋轉並同時定位於預 定高度位置，並使保持該工件的該保持台以從該工件用研削輪的外周側通過該工件用研削輪的正下方的方式，在相對於沿著該保持面研削步驟中的該保持台的移動方向之方向上移動，以研削該工件。 A grinding method for grinding a workpiece having valley-like warpage, characterized by comprising: a detection step of detecting the shape of the workpiece to be ground; and a holding surface grinding step of, based on the shape of the workpiece detected in the detection step, and The grinding wheel for the holding surface whose rotation axis is inclined to a predetermined angle from the vertical direction is rotated and positioned at a predetermined height position, and the holding table having the holding surface for holding the workpiece is passed through the outer peripheral side of the grinding wheel for the holding surface. The holding surface grinding wheel moves in a direction parallel to the holding surface so as to be directly below the holding surface grinding wheel, thereby grinding the holding surface with the holding surface grinding wheel and forming a valley-like curved shape on the holding surface; holding step , after carrying out the grinding step of the holding surface, carry the workpiece on the holding surface in such a way that the formed curved shape of the holding surface coincides with the shape of the workpiece, and use the holding table to attract and hold the workpiece; and grinding step, after the holding step is carried out, based on the shape of the workpiece detected in the detection step, the workpiece whose rotation axis is inclined from the vertical direction is rotated with a grinding wheel while being positioned at a predetermined position. The height position is fixed, and the holding table holding the workpiece is made to pass from the outer peripheral side of the workpiece grinding wheel to directly below the workpiece grinding wheel relative to the holding table in the grinding step along the holding surface. move in the direction of the moving direction to grind the workpiece.
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