JP7222797B2

JP7222797B2 - Creep feed grinding method

Info

Publication number: JP7222797B2
Application number: JP2019074059A
Authority: JP
Inventors: 大輔山本
Original assignee: Disco Corp
Current assignee: Disco Corp
Priority date: 2019-04-09
Filing date: 2019-04-09
Publication date: 2023-02-15
Anticipated expiration: 2039-04-09
Also published as: JP2020171977A

Description

本発明は、板状ワークを研削するクリープフィード研削方法に関する。 The present invention relates to a creep feed grinding method for grinding a plate-like work.

電極を備えた板状ワークを保持手段で吸引保持し、該板状ワークの上面を研削砥石を環状に配設した研削ホイールを回転させクリープフィード研削する場合、所定の高さに研削砥石を位置づけ、研削砥石に向かって保持手段の保持面方向に平行なＹ軸方向に板状ワークを保持した保持手段を移動させながら研削砥石の外周面（外側面）で研削すると、大きな研削力を確保する事ができる（例えば、特許文献１又は２参照）。 When a plate-shaped workpiece having electrodes is held by suction by a holding means, and creep-feed grinding is performed by rotating a grinding wheel on which grinding wheels are arranged in an annular shape on the upper surface of the plate-shaped workpiece, the grinding wheel is positioned at a predetermined height. When the holding means holding the plate-shaped work is moved toward the grinding wheel in the Y-axis direction parallel to the direction of the holding surface of the holding means, grinding with the outer peripheral surface (outer surface) of the grinding wheel secures a large grinding force. (See, for example, Patent Documents 1 and 2).

特開２０１０－０１６１８１号公報JP 2010-016181 A 特開２００９－０６９７５９号公報JP 2009-069759 A

しかし、研削砥石の外側面による大きな研削力で研削された板状ワークの被研削面は、凹凸が大きくなってしまう。そのため、研削砥石の外側面で板状ワークを例えば仕上げ厚みまで研削すると、板状ワークの被研削面にむしれ等が発生し、被研削面が荒れることがある。 However, the surface to be ground of the plate-shaped work, which has been ground with a large grinding force by the outer surface of the grinding wheel, has large irregularities. Therefore, when the plate-like work is ground to the finish thickness, for example, by the outer surface of the grinding wheel, the surface to be ground of the plate-like work may be plucked and roughened.

したがって、クリープフィード研削方法においては、板状ワークの厚みを所望の厚みまで効率よく研削すると共に、板状ワークの研削後の被研削面をむしれ等の無い綺麗な面にするという課題がある。 Therefore, in the creep feed grinding method, there is a problem that the thickness of the plate-like work is efficiently ground to a desired thickness, and the surface to be ground of the plate-like work after grinding is a clean surface free from rips and the like. .

上記課題を解決するための本発明は、板状ワークを保持する保持面を有する保持手段と、研削砥石を環状に配置した研削ホイールをスピンドルの先端に装着し該スピンドルを回転させ該保持手段に保持された板状ワークを研削する研削手段と、該保持手段と該研削手段とを相対的に該保持面に平行なＹ軸方向に移動させるＹ軸移動手段と、該保持面に垂直な方向であるＺ軸方向に該研削手段と該保持手段とを相対的に移動させるＺ軸移動手段と、を備えた研削装置を用いて、該保持手段に保持された板状ワークの上面より下に該研削砥石の下面を位置づけ、該保持手段と該研削手段とを相対的にＹ軸方向に移動させて板状ワークを研削するクリープフィード研削方法であって、該スピンドルは、Ｚ軸方向より僅かに傾けられていて、該研削砥石の下面と該保持面との距離が最小になる方を該研削ホイールの前方とし、該研削砥石の下面と該保持面との距離が最大になる方を該研削ホイールの後方とし、該Ｚ軸移動手段を用いて、該前方の該研削砥石の下面を該保持手段に保持された板状ワークの上面より低く位置づけると共に、該Ｙ軸移動手段を用いて、該前方の該研削砥石より前方側に該保持手段を位置づける準備工程と、該準備工程の後、該Ｙ軸移動手段を用いて、該研削手段に対し該保持手段を該研削ホイールの該前方から該後方に向かって移動させ、該前方の該研削砥石の下面と外側面とで板状ワークを研削する第１研削工程と、該第１研削工程の後、該Ｚ軸移動手段を用いて、該前方の該研削砥石の下面と該保持面との距離が予め設定した板状ワークの仕上げ厚みと一致する高さに該前方の該研削砥石の下面を位置づけ、さらに該Ｙ軸移動手段を用いて、該研削手段に対し該保持手段を該研削ホイールの該後方から該前方に向かって移動させ、該前方の該研削砥石の下面と内側面とで板状ワークを研削する第２研削工程と、を備えるクリープフィード研削方法である。 In order to solve the above-mentioned problems, the present invention provides a holding means having a holding surface for holding a plate-like work, and a grinding wheel having grinding wheels arranged in an annular shape attached to the tip of a spindle. Grinding means for grinding the held plate-shaped work, Y-axis moving means for relatively moving the holding means and the grinding means in the Y-axis direction parallel to the holding surface, and the direction perpendicular to the holding surface below the upper surface of the plate-shaped workpiece held by the holding means using a grinding apparatus equipped with Z-axis moving means for relatively moving the grinding means and the holding means in the Z-axis direction A creep feed grinding method for grinding a plate-like workpiece by positioning the lower surface of the grinding wheel and relatively moving the holding means and the grinding means in the Y-axis direction, wherein the spindle is slightly larger than the Z-axis direction. and the side where the distance between the lower surface of the grinding wheel and the holding surface is the smallest is defined as the front of the grinding wheel, and the side where the distance between the lower surface of the grinding wheel and the holding surface is maximum is defined as the front of the grinding wheel. The grinding wheel is placed behind the grinding wheel, and the lower surface of the front grinding wheel is positioned lower than the upper surface of the plate-shaped work held by the holding means using the Z-axis moving means, and the Y-axis moving means is used to: a preparatory step of positioning the holding means on the front side of the front grinding wheel; and after the preparatory step, the holding means is moved from the front of the grinding wheel to the grinding means by using the Y-axis moving means. A first grinding step in which the plate-like work is ground by the lower surface and the outer surface of the grinding wheel in the front by moving toward the rear, and after the first grinding step, using the Z-axis moving means, The lower surface of the front grinding wheel is positioned at a height where the distance between the lower surface of the front grinding wheel and the holding surface matches the preset finished thickness of the plate-shaped work, and the Y-axis moving means is used. a second grinding step of moving the holding means with respect to the grinding means from the rear to the front of the grinding wheel and grinding the plate-like workpiece with the lower surface and the inner surface of the grinding wheel in the front; A creep feed grinding method comprising:

本発明に係るクリープフィード研削方法は、Ｚ軸移動手段を用いて、研削ホイールの前方の研削砥石の下面を保持手段に保持された板状ワークの上面より低く位置づけると共に、Ｙ軸移動手段を用いて、該前方の研削砥石より前方側に保持手段を位置づける準備工程と、準備工程の後、Ｙ軸移動手段を用いて、研削手段に対し保持手段を研削ホイールの前方から後方に向かって移動させ、該前方の研削砥石の下面と外側面とで板状ワークを研削する第１研削工程と、第１研削工程の後、Ｚ軸移動手段を用いて、該前方の研削砥石の下面と保持面との距離が予め設定した板状ワークの仕上げ厚みと一致する高さに該前方の研削砥石の下面を位置づけ、さらにＹ軸移動手段を用いて、研削手段に対し保持手段を研削ホイールの後方から前方に向かって移動させ、該前方の研削砥石の下面と内側面とで板状ワークを研削する第２研削工程と、を備えることで、第１研削工程において環状の研削砥石の下面の研削力と外側面による大きな研削力とで仕上げ厚み近くまで効率よく板状ワークを研削し、その後、第２研削工程において研削砥石の下面と内周面で板状ワークを仕上げ厚みまで研削することでむしれ等の無い綺麗な被研削面を形成することができる。 The creep feed grinding method according to the present invention uses the Z-axis moving means to position the lower surface of the grinding wheel in front of the grinding wheel lower than the upper surface of the plate-like workpiece held by the holding means, and uses the Y-axis moving means. a preparatory step of positioning the holding means on the front side of the front grinding wheel; , a first grinding step of grinding a plate-like work with the lower surface and the outer surface of the front grinding wheel; The lower surface of the front grinding wheel is positioned at a height at which the distance between and matches the finished thickness of the plate-shaped work set in advance, and the Y-axis moving means is used to move the holding means from the rear of the grinding wheel to the grinding means. a second grinding step of moving forward and grinding the plate-like work with the lower surface and the inner surface of the grinding wheel in the front, so that the grinding force of the lower surface of the annular grinding wheel in the first grinding step and the large grinding force of the outer surface to efficiently grind the plate-like work to near the finish thickness, and then in the second grinding step, the plate-like work is ground to the finish thickness by the lower surface and the inner peripheral surface of the grinding wheel. It is possible to form a clean surface to be ground without wrinkles or the like.

研削装置の一例を示す斜視図である。It is a perspective view which shows an example of a grinding apparatus. Ｚ軸移動手段を用いて、前方の研削砥石の下面を保持手段に保持された板状ワークの上面より低く位置づけると共に、Ｙ軸移動手段を用いて、前方の研削砥石より前方側に保持手段を位置づけた状態を示す側面図である。Using the Z-axis moving means, the lower surface of the front grinding wheel is positioned lower than the upper surface of the plate-shaped work held by the holding means, and the Y-axis moving means is used to move the holding means forward of the front grinding wheel. It is a side view which shows the positioned state. Ｙ軸移動手段を用いて、研削手段に対して保持手段を研削ホイールの前方から後方に向かって移動させていき、前方の研削砥石の下面と外側面とで板状ワークを研削し始めた状態を説明する側面図である。Using the Y-axis moving means, the holding means is moved from the front to the rear of the grinding wheel with respect to the grinding means, and the plate-like workpiece is started to be ground by the lower surface and the outer surface of the front grinding wheel. It is a side view explaining. Ｙ軸移動手段を用いて、研削手段に対して保持手段を研削ホイールの前方から後方に向かって移動させていき、前方の研削砥石の下面と外側面とで板状ワークを研削し終えた状態を説明する側面図である。Using the Y-axis moving means, the holding means is moved from the front to the rear of the grinding wheel with respect to the grinding means, and the state in which the plate-like work has been ground by the lower surface and the outer surface of the front grinding wheel. It is a side view explaining. Ｚ軸移動手段により前方の研削砥石の下面と保持面との距離が予め設定した板状ワークの仕上げ厚みと一致する高さに前方の研削砥石の下面を位置づけ、さらにＹ軸移動手段を用いて、研削手段に対し保持手段を研削ホイールの後方から前方に向かって移動させ、前方の研削砥石の下面と内側面とで板状ワークを研削し始めた状態を説明する側面図である。The lower surface of the front grinding wheel is positioned by the Z-axis moving means at a height where the distance between the lower surface of the front grinding wheel and the holding surface matches the preset finished thickness of the plate-shaped work, and the Y-axis moving means is used to position the lower surface of the front grinding wheel. 10 is a side view for explaining a state in which the holding means is moved from the rear to the front of the grinding wheel with respect to the grinding means, and the plate-like workpiece is started to be ground by the lower surface and the inner surface of the front grinding wheel; FIG. 研削手段をＺ軸方向に下降させることで、第２研削工程における仕上げクリープフィード研削後の板状ワークの厚み差を小さくする補正を行う場合を説明する側面図である。FIG. 11 is a side view for explaining a case where correction is performed to reduce the difference in thickness of the plate-like workpiece after finish creep feed grinding in the second grinding step by lowering the grinding means in the Z-axis direction. 前方の研削砥石の下面と内側面とで板状ワークの上面を仕上げクリープフィード研削し終えた状態を説明する側面図である。FIG. 11 is a side view illustrating a state in which finish creep-feed grinding of the upper surface of the plate-like work is finished by the lower surface and the inner surface of the front grinding wheel;

図１に示す研削装置１は、保持手段３０上に保持された板状ワークＷを回転する研削ホイール７４によって研削する装置であり、Ｙ軸方向に延びる装置ベース１０と、装置ベース１０上の後方（＋Ｙ方向側）に立設されたコラム１１とを備えている。
研削装置１の装置ベース１０上の前方（－Ｙ方向側）は、保持手段３０上に対して板状ワークＷの着脱が行われる着脱領域であり、装置ベース１０上の後方は、研削手段７によって保持手段３０上に保持された板状ワークＷの研削が行われる研削領域である。 A grinding apparatus 1 shown in FIG. 1 is an apparatus for grinding a plate-like workpiece W held on holding means 30 by means of a rotating grinding wheel 74 . and a column 11 erected on the (+Y direction side).
The front (−Y direction side) of the device base 10 of the grinding device 1 is an attachment/detachment area where the plate-like workpiece W is attached to and detached from the holding means 30, and the rear of the device base 10 is the grinding means 7. This is a grinding area where the plate-like workpiece W held on the holding means 30 by is ground.

図２に詳しく示す板状ワークＷは、例えば、ＰＣＢ等からなる矩形状の基板Ｗ１と、母材がシリコン等である矩形状のウェーハＷ２とを有している。基板Ｗ１の上面にはウェーハＷ２の下面が接合されている。
ウェーハＷ２の上面には、図示しないデバイスが形成されている。このデバイスの表面にはそれぞれ複数の円柱状の電極Ｅが立設している。電極Ｅは、例えば銅を主要素として構成されている。
ウェーハＷ２の上面は、エポキシ樹脂等の樹脂層Ｊによって封止されており、各電極Ｅの上端部は樹脂層Ｊによって覆われている。 The plate-like workpiece W shown in detail in FIG. 2 has, for example, a rectangular substrate W1 made of PCB or the like, and a rectangular wafer W2 whose base material is silicon or the like. The bottom surface of the wafer W2 is bonded to the top surface of the substrate W1.
Devices (not shown) are formed on the upper surface of the wafer W2. A plurality of cylindrical electrodes E are erected on the surface of this device. The electrode E is made mainly of copper, for example.
The upper surface of the wafer W2 is sealed with a resin layer J such as epoxy resin, and the upper ends of the electrodes E are covered with the resin layer J. As shown in FIG.

樹脂層Ｊの上面は、板状ワークＷの上面Ｗａとなり、基板Ｗ１の下面は板状ワークＷの下面Ｗｂとなる。板状ワークＷの下面Ｗｂは、例えば、図示しない保護テープが貼着されて保護されていてもよい。
矩形状の板状ワークＷのサイズの一例としては、縦２２０ｍｍ×横１００ｍｍである。
なお、板状ワークＷの構成は本例に限定されるものではない。 The upper surface of the resin layer J serves as the upper surface Wa of the plate-like work W, and the lower surface of the substrate W1 serves as the lower surface Wb of the plate-like work W. The lower surface Wb of the plate-shaped work W may be protected by, for example, a protective tape (not shown) adhered thereto.
An example of the size of the rectangular plate-like workpiece W is 220 mm long×100 mm wide.
The configuration of the plate-like work W is not limited to this example.

例えば、図１に示す保持手段３０は、ポーラス部材等からなり板状ワークＷを吸着する吸着部３００と、吸着部３００を支持する枠体３０１とを備える。吸着部３００は、真空発生装置等の図示しない吸引源に連通し、吸引源が吸引することで生み出された吸引力が、吸着部３００の露出面である保持面３００ａに伝達されることで、保持手段３０は保持面３００ａ上で板状ワークＷを吸引保持できる。
なお、保持面３００ａが吸引保持する板状ワークＷは、複数枚でもよい。複数枚の板状ワークＷの長手方向をＹ軸方向に平行とし、Ｙ軸方向に水平面において直交するＸ軸方向に複数枚を並べて保持面３００ａに板状ワークＷを吸引保持させてもよい。
なお、保持手段３０の保持面３００ａが、スピンドル７０が傾けられた状態で、研削砥石７４１の下面７４１ｂ（図２参照）で研削されて下面７４１ｂと保持面３００ａとが平行にされた後、保持面３００ａに板状ワークＷを保持させ研削砥石７４１の下面７４１ｂで研削していく。 For example, the holding means 30 shown in FIG. 1 includes a suction portion 300 which is made of a porous member or the like and sucks the plate-like workpiece W, and a frame 301 which supports the suction portion 300 . The adsorption unit 300 communicates with a suction source (not shown) such as a vacuum generator, and the suction force generated by the suction source is transmitted to the holding surface 300a, which is the exposed surface of the adsorption unit 300. The holding means 30 can suck and hold the plate-like workpiece W on the holding surface 300a.
It should be noted that a plurality of plate-shaped works W may be sucked and held by the holding surface 300a. The longitudinal direction of a plurality of plate-like works W may be parallel to the Y-axis direction, and a plurality of plate-like works W may be arranged in the X-axis direction perpendicular to the Y-axis direction in the horizontal plane, and the plate-like works W may be held by suction on the holding surface 300a.
Note that the holding surface 300a of the holding means 30 is ground by the lower surface 741b (see FIG. 2) of the grinding wheel 741 with the spindle 70 tilted so that the lower surface 741b and the holding surface 300a are parallel to each other. A plate-like work W is held on the surface 300 a and ground by the lower surface 741 b of the grinding wheel 741 .

保持手段３０、保持手段３０を囲繞し研削水を排水孔まで誘導するカバー３９、及びカバー３９に連結された蛇腹カバー３９ａの下方には、保持手段３０を保持面３００ａに平行なＹ軸方向に移動させるＹ軸移動手段１４が配設されている。Ｙ軸移動手段１４は、Ｙ軸方向の軸心を有するボールネジ１４０と、ボールネジ１４０と平行に配設された一対のガイドレール１４１と、ボールネジ１４０に連結しボールネジ１４０を回動させるモータ１４２と、内部に備えるナットがボールネジ１４０に螺合し底部がガイドレール１４１上を摺動する可動板１４３とを備えており、モータ１４２がボールネジ１４０を回動させると、これに伴い可動板１４３がガイドレール１４１にガイドされてＹ軸方向に移動し、可動板１４３上にテーブル基台３４を介して配設された保持手段３０が、Ｙ軸方向においては固定されている研削手段７に対して相対的にＹ軸方向に移動する。蛇腹カバー３９ａは保持手段３０の移動に伴ってＹ軸方向に伸縮する。 Below the holding means 30, a cover 39 surrounding the holding means 30 and guiding the grinding water to the drain hole, and a bellows cover 39a connected to the cover 39, the holding means 30 is arranged in the Y-axis direction parallel to the holding surface 300a. A Y-axis moving means 14 for moving is provided. The Y-axis moving means 14 includes a ball screw 140 having an axis in the Y-axis direction, a pair of guide rails 141 arranged parallel to the ball screw 140, a motor 142 connected to the ball screw 140 and rotating the ball screw 140, A ball screw 140 is screwed to a nut provided inside, and a movable plate 143 whose bottom slides on a guide rail 141 is provided. 141 to move in the Y-axis direction, and the holding means 30 disposed on the movable plate 143 via the table base 34 moves relative to the fixed grinding means 7 in the Y-axis direction. to move in the Y-axis direction. The bellows cover 39a expands and contracts in the Y-axis direction as the holding means 30 moves.

コラム１１の前面には研削手段７をＹ軸方向に直交し保持手段３０の保持面３００ａに対して垂直なＺ軸方向に移動させるＺ軸移動手段５が配設されている。Ｚ軸移動手段５は、Ｚ軸方向の軸心を有するボールネジ５０と、ボールネジ５０と平行に配設された一対のガイドレール５１と、ボールネジ５０の上端に連結しボールネジ５０を回動させるモータ５２と、内部のナットがボールネジ５０に螺合し側部がガイドレール５１に摺接する昇降板５３とを備えており、モータ５２がボールネジ５０を回動させると、これに伴い昇降板５３がガイドレール５１にガイドされてＺ軸方向に往復移動し、昇降板５３に固定された研削手段７がＺ軸方向に研削送りされる。 A Z-axis moving means 5 for moving the grinding means 7 in the Z-axis direction perpendicular to the Y-axis direction and perpendicular to the holding surface 300a of the holding means 30 is arranged on the front surface of the column 11 . The Z-axis moving means 5 includes a ball screw 50 having an axis in the Z-axis direction, a pair of guide rails 51 arranged parallel to the ball screw 50, and a motor 52 connected to the upper end of the ball screw 50 and rotating the ball screw 50. and an elevating plate 53 whose inner nut is screwed onto the ball screw 50 and whose side portion is in sliding contact with the guide rail 51. When the motor 52 rotates the ball screw 50, the elevating plate 53 moves along with the guide rail. Guided by 51, it reciprocates in the Z-axis direction, and the grinding means 7 fixed to the lifting plate 53 is fed for grinding in the Z-axis direction.

研削手段７は、軸方向がＺ軸方向より僅かに傾けられているスピンドル７０と、スピンドル７０を回転可能に支持するハウジング７１と、スピンドル７０を回転駆動するモータ７２と、スピンドル７０の先端に連結された円形板状のマウント７３と、マウント７３の下面に装着された研削ホイール７４と、ハウジング７１を支持しＺ軸移動手段５の昇降板５３にその側面が固定されたホルダ７５と、を備える。 The grinding means 7 includes a spindle 70 whose axial direction is slightly inclined from the Z-axis direction, a housing 71 that rotatably supports the spindle 70, a motor 72 that rotationally drives the spindle 70, and a tip end of the spindle 70. a circular plate-shaped mount 73 mounted on the bottom surface of the mount 73; a grinding wheel 74 attached to the lower surface of the mount 73; .

スピンドル７０がＺ軸方向より僅かに傾けられていることで、環状の研削砥石７４１もＺ軸方向より傾いた状態になる。そして、図２に示す研削砥石７４１の下面７４１ｂと保持手段３０の保持面３００ａとの距離が最小になる方（－Ｙ方向側）を研削ホイール７４の前方とする。また、研削砥石７４１の下面７４１ｂと保持面３００ａとの距離が最大となる方（図２における＋Ｙ方向側）を研削ホイール７４の後方とする。
なお、図２においては、研削装置１の各構成要素の一部を簡略化及び省略して示している。 Since the spindle 70 is slightly tilted from the Z-axis direction, the annular grinding wheel 741 is also tilted from the Z-axis direction. The front side of the grinding wheel 74 is the direction (-Y direction side) where the distance between the lower surface 741b of the grinding wheel 741 and the holding surface 300a of the holding means 30 shown in FIG. The rear of the grinding wheel 74 is the side where the distance between the lower surface 741 b of the grinding wheel 741 and the holding surface 300 a is maximum (the +Y direction side in FIG. 2 ).
In addition, in FIG. 2, some of the constituent elements of the grinding apparatus 1 are simplified and omitted.

スピンドル７０のＺ軸方向からの傾き角度は僅かな角度となっており、該角度は、例えば研削ホイール７４の直径に対応して所定の値が設定される。
スピンドル７０のＺ軸方向からの傾き角度は、例えば、研削ホイール７４の直径（ｍｍ）がΦ３００ｍｍである場合には、前方の研削砥石７４１の下面７４１ｂの高さと後方の研削砥石７４１の下面７４１ｂの高さとの差Ｌ０が例えば５μｍ～１０μｍとなる角度に設定される。 The inclination angle of the spindle 70 from the Z-axis direction is a slight angle, and the angle is set to a predetermined value corresponding to the diameter of the grinding wheel 74, for example.
For example, when the diameter (mm) of the grinding wheel 74 is Φ300 mm, the inclination angle of the spindle 70 from the Z-axis direction is The angle is set such that the height difference L0 is, for example, 5 μm to 10 μm.

図１、２に示す研削ホイール７４は、円環状のホイール基台７４０を備えており、ホイール基台７４０の底面の外周側の領域には、略直方体形状の複数の先に説明した研削砥石７４１が環状に配設されている。研削砥石７４１は、所定のボンド剤でダイヤモンド砥粒等が固着されて成形されている。また、研削砥石７４１は、例えば、銅等で構成される電極Ｅを備える板状ワークＷを研削するための砥石であり、砥石中の空孔の割合や大きさが通常の研削砥石と比較して大きいものである。研削砥石７４１中の空孔の割合や大きさが大きく設定されている理由は、電極Ｅを通常の研削砥石で研削すると電極Ｅを構成する銅が研削砥石の空孔に詰まりやすいことから、この詰まりを防ぐためである。一方、研削砥石７４１は空孔の割合や大きさが大きく設定されている砥石であるため、板状ワークＷの研削に伴う磨耗量も通常の研削砥石に比べて大きい。なお、研削砥石７４１は、上記例に限定されるものではない。 The grinding wheel 74 shown in FIGS. 1 and 2 includes a ring-shaped wheel base 740 , and a plurality of substantially rectangular parallelepiped grinding wheels 741 described above are provided on the outer peripheral side of the bottom surface of the wheel base 740 . are arranged in a circle. The grinding wheel 741 is formed by bonding diamond abrasive grains or the like with a predetermined bonding agent. The grinding wheel 741 is, for example, a grinding wheel for grinding a plate-like work W having electrodes E made of copper or the like, and the ratio and size of holes in the grinding wheel are different from those of a normal grinding wheel. It is a big one. The reason why the ratio and size of the holes in the grinding wheel 741 are set large is that when the electrode E is ground with a normal grinding wheel, the holes of the grinding wheel are likely to be clogged with the copper that constitutes the electrode E. This is to prevent clogging. On the other hand, since the grinding wheel 741 is a wheel in which the ratio and size of pores are set to be large, the amount of wear associated with the grinding of the plate-like workpiece W is greater than that of a normal grinding wheel. In addition, the grinding wheel 741 is not limited to the above example.

例えば、スピンドル７０の上端には研削水供給口７０ａが配設され、スピンドル７０の内部には、図１に示す研削水源７９に研削水供給口７０ａを介して連通し研削水の通り道となる研削水路７０ｂが、スピンドル７０の軸方向に貫通して形成されており、研削水路７０ｂは研削ホイール７４の底面において研削砥石７４１の主に内側面７４１ｃ（図２参照）に向かって研削水を噴出できるように開口している。 For example, a grinding water supply port 70a is provided at the upper end of the spindle 70, and inside the spindle 70, there is a grinding water supply port 70a which communicates with a grinding water source 79 shown in FIG. A water channel 70b is formed through the spindle 70 in the axial direction, and the grinding water channel 70b can jet grinding water from the bottom surface of the grinding wheel 74 mainly toward the inner surface 741c (see FIG. 2) of the grinding wheel 741. It is open like

図１に示すように、保持手段３０の移動経路上方には、保持手段３０に保持された板状ワークＷの上面Ｗａの高さを接触式にて測定する上面高さ測定手段３８が配設されている。上面高さ測定手段３８は、その先端に、上下方向に昇降し被測定面に接触するコンタクト３８０を備えている。コンタクト３８０はアーム部３８１によって支持されており、アーム部３８１は、その内部に内蔵したスプリングが生み出す押圧力によって、コンタクト３８０を被測定面に対して適宜の力で押し当てることができる。板状ワークＷに対するクリープフィード研削が実施されている最中において、上面高さ測定手段３８は、研削手段７の環状の研削砥石７４１の外側で板状ワークＷの上面Ｗａの高さを測定する。
なお、上面高さ測定手段は、測定光を板状ワークＷの上面Ｗａに照射する非接触式のものであってもよい。 As shown in FIG. 1, above the movement path of the holding means 30, a top surface height measuring means 38 is arranged for measuring the height of the top surface Wa of the plate-like work W held by the holding means 30 by contact. It is The top surface height measuring means 38 has a contact 380 at its tip which moves up and down and contacts the surface to be measured. The contact 380 is supported by an arm portion 381, and the arm portion 381 can press the contact 380 against the surface to be measured with an appropriate force by a pressing force generated by a spring incorporated therein. While creep feed grinding is being performed on the plate-like work W, the upper surface height measuring means 38 measures the height of the upper surface Wa of the plate-like work W outside the annular grinding wheel 741 of the grinding means 7. .
The upper surface height measuring means may be of a non-contact type that irradiates the upper surface Wa of the plate-like workpiece W with measurement light.

図１に示すように、研削装置１は、ＣＰＵとメモリ等の記憶部９１とを含み装置全体の制御を行う制御手段９を備えている。制御手段９は、図示しない配線によって、Ｚ軸移動手段５、及びＹ軸移動手段１４等に電気的に接続されており、制御手段９の制御の下で、Ｚ軸移動手段５による研削手段７のＺ軸方向への移動動作及び高さの位置づけ、並びにＹ軸移動手段１４による保持手段３０の移動速度等が制御される。 As shown in FIG. 1, the grinding apparatus 1 includes a control means 9 that includes a CPU and a storage unit 91 such as a memory and controls the entire apparatus. The control means 9 is electrically connected to the Z-axis moving means 5, the Y-axis moving means 14, etc. by wiring (not shown). Z-axis direction movement and height positioning, and the moving speed of the holding means 30 by the Y-axis moving means 14 are controlled.

例えば、Ｚ軸移動手段５のモータ５２は、図示しないパルス発振器からドライバを介して供給される駆動パルスによって動作するパルスモータである。そして、制御手段９は、モータ５２に供給される駆動パルス数をカウントすることにより、研削手段７の研削送り位置（高さ位置）を認識することが可能となる。 For example, the motor 52 of the Z-axis moving means 5 is a pulse motor operated by drive pulses supplied from a pulse oscillator (not shown) via a driver. By counting the number of driving pulses supplied to the motor 52 , the control means 9 can recognize the grinding feed position (height position) of the grinding means 7 .

例えば、Ｚ軸移動手段５のモータ５２をサーボモータとし、サーボモータにロータリエンコーダが接続された構成としてもよい。この場合、ロータリエンコーダは、サーボアンプとしての機能も有する制御手段９に接続されており、制御手段９の出力インターフェイスからサーボモータに対して動作信号が供給された後、エンコーダ信号（サーボモータの回転数）を制御手段９の入力インターフェイスに対して出力する。そして、エンコーダ信号を受け取った制御手段９によってフィードバック制御がされつつ、研削手段７の研削送り位置を認識することが可能となる。 For example, the motor 52 of the Z-axis moving means 5 may be a servomotor, and a rotary encoder may be connected to the servomotor. In this case, the rotary encoder is connected to a control means 9 that also functions as a servo amplifier. After an operation signal is supplied to the servomotor from the output interface of the control means 9, an encoder signal (servomotor rotation number) to the input interface of the control means 9. Then, it becomes possible to recognize the grinding feed position of the grinding means 7 while feedback control is performed by the control means 9 which receives the encoder signal.

以下に、図１に示す研削装置１によって板状ワークＷを仕上げ厚みまでクリープフィード研削する場合の各工程について説明する。 Each step of creep-feed grinding the plate-like workpiece W to the finish thickness by the grinding apparatus 1 shown in FIG. 1 will be described below.

（１）準備工程
まず、図１、２に示す板状ワークＷが、装置ベース１０上の着脱領域において、樹脂層Ｊを上側に向けて保持手段３０の保持面３００ａ上に載置される。そして、保持手段３０に接続された図示しない吸引源が作動して生み出された吸引力が保持面３００ａに伝達されることで、保持手段３０により板状ワークＷが吸引保持される。 (1) Preparatory Step First, the plate-like workpiece W shown in FIGS. 1 and 2 is placed on the holding surface 300a of the holding means 30 in the attachment/detachment area on the device base 10 with the resin layer J facing upward. A suction source (not shown) connected to the holding means 30 operates to generate a suction force that is transmitted to the holding surface 300a, whereby the holding means 30 sucks and holds the plate-like work W. As shown in FIG.

なお、板状ワークＷを保持面３００ａで吸引保持する前に、保持手段３０の保持面３００ａから前方（－Ｙ方向側）の研削砥石７４１の下面７４１ｂまでのＺ軸方向における相対距離を高精度に把握するセットアップがなされる。セットアップの一例としては、研削手段７を下降させて、前方（－Ｙ方向側）の研削砥石７４１の下面７４１ｂを保持手段３０の保持面３００ａに接触させて、この接触した際の研削手段７の研削送り位置から制御手段９が該相対距離を把握して記憶部９１に記憶する。 Before sucking and holding the plate-shaped workpiece W on the holding surface 300a, the relative distance in the Z-axis direction from the holding surface 300a of the holding means 30 to the lower surface 741b of the grinding wheel 741 on the front (−Y direction side) is determined with high accuracy. A set-up is made to keep track of. As an example of setup, the grinding means 7 is lowered to bring the lower surface 741b of the front (−Y direction side) grinding wheel 741 into contact with the holding surface 300a of the holding means 30. The control means 9 grasps the relative distance from the grinding feed position and stores it in the storage section 91 .

Ｙ軸移動手段１４が、板状ワークＷを吸引保持した保持手段３０を装置ベース１０上の着脱領域から研削領域内の＋Ｙ方向の所定の位置まで移動させることで、図２に示すように保持手段３０がＹ軸方向送りの開始位置に位置づけられる。即ち、研削砥石７４１の下面７４１ｂと保持面３００ａとの距離が最小になる前方（－Ｙ方向側）の研削砥石７４１より前方側（－Ｙ方向側）に保持手段３０が位置づけられる。 The Y-axis moving means 14 moves the holding means 30 sucking and holding the plate-like workpiece W from the attachment/detachment area on the device base 10 to a predetermined position in the +Y direction within the grinding area, thereby holding as shown in FIG. Means 30 is positioned at the starting position of the Y-axis feed. That is, the holding means 30 is positioned on the front side (-Y direction side) of the front (-Y direction side) grinding wheel 741 where the distance between the lower surface 741b of the grinding wheel 741 and the holding surface 300a is the smallest.

さらに、研削手段７がＺ軸移動手段５により－Ｚ方向へと送られ、制御手段９によるＺ軸移動手段５の制御の下で、研削砥石７４１の最下端となる前方側の下面７４１ｂが板状ワークＷの上面Ｗａに切り込む所定の高さに研削手段７が位置づけられる。即ち、図２に示すように、前方の研削砥石７４１の下面７４１ｂが保持手段３０に保持された板状ワークＷの上面Ｗａより低く位置づけられた状態になる。なお、研削手段７の位置づけられる高さは、例えば、前方の研削砥石７４１の下面７４１ｂと外側面７４１ｄとが樹脂層Ｊ及び電極Ｅに所定量切り込む高さであり、先に実施したセットアップで記憶した研削手段７の高さから予め把握している板状ワークＷの仕上げ厚みＴ分上の高さよりもさらに所定距離だけ上の高さである。 Further, the grinding means 7 is sent in the -Z direction by the Z-axis moving means 5, and under the control of the Z-axis moving means 5 by the control means 9, the lower surface 741b on the front side, which is the lowest end of the grinding wheel 741, is a plate. The grinding means 7 is positioned at a predetermined height to cut into the upper surface Wa of the shaped work W. As shown in FIG. That is, as shown in FIG. 2, the lower surface 741b of the front grinding wheel 741 is positioned lower than the upper surface Wa of the plate-like workpiece W held by the holding means 30. As shown in FIG. The height at which the grinding means 7 is positioned is, for example, the height at which the lower surface 741b and the outer surface 741d of the front grinding wheel 741 cut into the resin layer J and the electrode E by a predetermined amount. The height is a predetermined distance higher than the height of the plate-like workpiece W which is grasped in advance by the finished thickness T of the grinding means 7 .

（２）第１研削工程
準備工程を上記のように実施した後に、図１に示すモータ７２がスピンドル７０を、図２に示すように、例えば＋Ｚ方向から見て反時計回り方向（以下、矢印Ｒ方向とする）に回転駆動し、これに伴って研削ホイール７４が回転する。
次に、図３に示すように、Ｙ軸移動手段１４が、板状ワークＷを吸引保持した保持手段３０を＋Ｙ方向（往方向）に所定の送り速度で移動させる、即ち、研削手段７に対して保持手段３０を前方（－Ｙ方向側）の研削砥石７４１後方（＋Ｙ方向側）の研削砥石７４１に向かう方向に移動させる。そして回転する前方の研削砥石７４１の下面７４１ｂと外側面７４１ｄとで板状ワークＷの樹脂層Ｊ及び電極Ｅが研削されていく。例えば、研削される板状ワークＷの上面Ｗａに現れる樹脂層Ｊの面積と全電極Ｅの面積の合計との比率の一例は、例えば、樹脂層Ｊの面積：全電極Ｅの上面の総面積＝２０：８０である。つまり、第１研削工程で全ての電極Ｅを板状ワークＷの上面Ｗａに露出させ、後の第２研削工程で板状ワークＷの上面Ｗａの面粗さを除去するようにしてもよい。研削中には、研削水源７９から供給された研削水が研削水供給口７０ａ及び研削水路７０ｂを通って、研削砥石７４１の内側面７４１ｃに供給されると共に板状ワークＷに供給される。
なお、回転する後方（＋Ｙ方向側）の研削砥石７４１は板状ワークＷを研削していない。
なお、前方の研削砥石７４１の外側面７４１ｄが板状ワークＷに接触する部分に、図１に示す研削ホイール７４の外側に配設され研削水源７９に連通する研削水ノズル７６から研削水が供給されている。この研削水は研削ホイール７４の回転方向（矢印Ｒ方向）に沿って研削砥石７４１の外側面７４１ｄに向かって研削水ノズル７６から供給されている。また、研削水ノズル７６にエア源７８を連通させ、研削水ノズル７６から供給する研削水にエアを混合した２流体を研削ホイール７４の回転方向（矢印Ｒ方向）に沿って研削砥石７４１の外側面７４１ｄに向かって噴出させることで、研削水ノズル７６から噴出される２流体の速度を大きくし、研削屑を研削砥石７４１の外側面７４１ｄから取り除く効果を大きくする事ができる。 (2) First Grinding Process After the preparatory process has been carried out as described above, the motor 72 shown in FIG. 1 rotates the spindle 70 as shown in FIG. R direction), and the grinding wheel 74 rotates accordingly.
Next, as shown in FIG. 3, the Y-axis moving means 14 moves the holding means 30 sucking and holding the plate-shaped work W in the +Y direction (forward direction) at a predetermined feed rate. On the other hand, the holding means 30 is moved in the direction toward the front (−Y direction side) grinding wheel 741 rearward (+Y direction side) grinding wheel 741 . Then, the resin layer J and the electrode E of the plate-like workpiece W are ground by the lower surface 741b and the outer surface 741d of the rotating front grinding wheel 741 . For example, an example of the ratio of the area of the resin layer J appearing on the upper surface Wa of the plate-like workpiece W to be ground to the total area of all the electrodes E is, for example, the area of the resin layer J: the total area of the upper surface of all the electrodes E = 20:80. That is, all the electrodes E may be exposed on the upper surface Wa of the plate-like work W in the first grinding step, and the surface roughness of the upper surface Wa of the plate-like work W may be removed in the subsequent second grinding step. During grinding, grinding water supplied from the grinding water source 79 is supplied to the inner surface 741c of the grinding wheel 741 and to the plate-like workpiece W through the grinding water supply port 70a and the grinding water channel 70b.
Note that the rotating rear (+Y direction side) grinding wheel 741 does not grind the plate-like workpiece W. As shown in FIG.
Grinding water is supplied from a grinding water nozzle 76 disposed outside the grinding wheel 74 shown in FIG. It is The grinding water is supplied from the grinding water nozzle 76 toward the outer surface 741 d of the grinding wheel 741 along the rotation direction of the grinding wheel 74 (direction of arrow R). In addition, an air source 78 is connected to the grinding water nozzle 76, and two fluids in which air is mixed with the grinding water supplied from the grinding water nozzle 76 are supplied to the outside of the grinding wheel 741 along the rotation direction of the grinding wheel 74 (direction of arrow R). By jetting toward the side surface 741d, the velocity of the two fluids jetted from the grinding water nozzle 76 can be increased, and the effect of removing the grinding dust from the outer side surface 741d of the grinding wheel 741 can be increased.

そして、図４に示すように、前方の研削砥石７４１の下面７４１ｂが板状ワークＷと接触しなくなるまで＋Ｙ方向に保持手段３０を移動させ、前方の研削砥石７４１の下面７４１ｂと外側面７４１ｄとにより板状ワークＷの上面Ｗａ全面を研削する。 Then, as shown in FIG. 4, the holding means 30 is moved in the +Y direction until the lower surface 741b of the front grinding wheel 741 stops contacting the plate-like work W, and the lower surface 741b of the front grinding wheel 741 and the outer side surface 741d are moved. The entire upper surface Wa of the plate-like work W is ground by .

（３）第２研削工程
第１研削工程を上記のように実施した後に、Ｚ軸移動手段５によって、図４に示す研削手段７が－Ｚ方向に下降して、前方（－Ｙ方向）の研削砥石７４１の下面７４１ｂと保持面３００ａとの距離が予め設定した板状ワークＷの仕上げ厚みＴと一致する図４、５に示す高さＺ１に前方の研削砥石７４１の下面７４１ｂが位置づけられる。なお、本実施形態では、研削手段７を第１研削工程の高さから１０μｍ～２０μｍ下がった高さ位置に位置づけ研削する。このように僅かに下がった位置で研削して被研削面である上面Ｗａの粗さを小さくする。また、モータ７２がスピンドル７０を、例えば＋Ｚ方向から見て反時計回り方向（矢印Ｒ方向）に回転駆動し、これに伴って研削ホイール７４が回転する。また、研削手段７は、研削された板状ワークＷを所望の仕上げ厚みＴとするための高さＺ０に位置している。 (3) Second Grinding Process After the first grinding process is carried out as described above, the Z-axis moving means 5 moves the grinding means 7 shown in FIG. The lower surface 741b of the front grinding wheel 741 is positioned at the height Z1 shown in FIGS. In this embodiment, grinding is performed by positioning the grinding means 7 at a height position 10 μm to 20 μm lower than the height of the first grinding step. In this way, the roughness of the upper surface Wa, which is the surface to be ground, is reduced by grinding at a slightly lowered position. Also, the motor 72 rotates the spindle 70, for example, in the counterclockwise direction (arrow R direction) when viewed from the +Z direction, and the grinding wheel 74 rotates accordingly. Further, the grinding means 7 is positioned at a height Z0 for making the ground plate-shaped work W a desired finished thickness T. As shown in FIG.

次いで、Ｙ軸移動手段１４によって、研削手段７に対し保持手段３０を後方（＋Ｙ方向側）の研削砥石７４１から前方（－Ｙ方向側）の研削砥石７４１に向かって－Ｙ方向（復方向）に移動させ、前方の研削砥石７４１の下面７４１ｂと内側面７４１ｃとで板状ワークＷをクリープフィード研削（以下、仕上げクリープフィード研削とする）していく。仕上げクリープフィード研削中には、研削砥石７４１と板状ワークＷの上面Ｗａとの接触部位に対して研削水が供給されて、接触部位が洗浄及び冷却される。なお、回転する後方（＋Ｙ方向側）の研削砥石７４１は板状ワークＷを研削していない。
なお、研削水の供給は、図１に示す研削水源７９から研削水供給口７０ａに供給された研削水が、研削水路７０ｂを通って、板状ワークＷに供給されるとともに研削砥石７４１の内側面７４１ｃに供給される。 Next, by the Y-axis moving means 14, the holding means 30 is moved from the rear (+Y direction side) grinding wheel 741 toward the front (−Y direction side) grinding wheel 741 with respect to the grinding means 7 in the -Y direction (return direction). , and creep feed grinding (hereinafter referred to as finish creep feed grinding) is performed on the plate-like workpiece W by the lower surface 741b and the inner side surface 741c of the grinding wheel 741 in front. During the finish creep feed grinding, grinding water is supplied to the contact portion between the grinding wheel 741 and the upper surface Wa of the plate-like workpiece W to wash and cool the contact portion. Note that the rotating rear (+Y direction side) grinding wheel 741 does not grind the plate-like workpiece W. As shown in FIG.
Grinding water is supplied to the grinding water supply port 70a from the grinding water source 79 shown in FIG. It is supplied to side 741c.

本実施形態における第２研削工程においては、図５に示すように、上記仕上げクリープフィード研削が開始されるとともに、上面高さ測定手段３８のコンタクト３８０が下降し、板状ワークＷの仕上げクリープフィード研削開始直後の研削された上面Ｗａに接触してその高さを測定し始める。そして、上面高さ測定手段３８が、測定した板状ワークＷの仕上げクリープフィード研削開始直後の研削された上面Ｗａの高さ及びその後研削された上面Ｗａの高さについての情報を単位時間毎に順次図１に示す制御手段９に送る。制御手段９に送られた該情報は、制御手段９の記憶部９１に順次記憶されていく。 In the second grinding process of the present embodiment, as shown in FIG. 5, the finish creep feed grinding is started, and the contact 380 of the upper surface height measuring means 38 is lowered to perform the finish creep feed of the plate-like workpiece W. Immediately after the start of grinding, contact is made with the ground upper surface Wa to start measuring its height. Then, the upper surface height measuring means 38 provides information about the measured height of the ground upper surface Wa immediately after the start of finish creep feed grinding of the plate-like workpiece W and the height of the ground upper surface Wa after that, at every unit time. It is sequentially sent to the control means 9 shown in FIG. The information sent to the control means 9 is sequentially stored in the storage section 91 of the control means 9 .

例えば、図６に示すように、上面高さ測定手段３８が測定した板状ワークＷの研削開始直後の研削された上面Ｗａの高さは、高さＺ１として記憶部９１に記憶される。また、記憶部９１が高さＺ１を記憶した際の前方（－Ｙ方向側）の研削砥石７４１のＹ軸方向における板状ワークＷ上における位置は、例えば位置Ｙ１となる。また、研削手段７は、研削された板状ワークＷを所望の仕上げ厚みＴとするための高さＺ０に位置している。 For example, as shown in FIG. 6, the height of the ground upper surface Wa of the plate-like workpiece W measured by the upper surface height measuring means 38 immediately after the start of grinding is stored in the storage unit 91 as the height Z1. Further, the position of the front (−Y direction side) grinding wheel 741 on the plate-shaped work W in the Y-axis direction when the storage unit 91 stores the height Z1 is, for example, the position Y1. Further, the grinding means 7 is positioned at a height Z0 for making the ground plate-shaped work W a desired finished thickness T. As shown in FIG.

さらに、本実施形態においては、上面高さ測定手段３８が測定した測定値に応じて研削手段７を－Ｚ方向に移動させて仕上げクリープフィード研削後の板状ワークＷの仕上げ厚み差を小さくする補正を実施する。具体的には、図６に示すように、保持手段３０が－Ｙ方向に移動していくことで板状ワークＷの上面Ｗａの研削が行われていくとともに、制御手段９の図１に示す算出部９２が、単位時間毎に上面高さ測定手段３８から制御手段９に送られてくる板状ワークＷの上面Ｗａの高さ（測定値）から板状ワークＷの仕上げクリープフィード研削開始直後の研削された上面Ｗａの高さＺ１を引いた差分を算出する。即ち、例えば、図６に示す新たに測定された板状ワークＷの仕上げクリープフィード研削後の上面Ｗａの高さＺ２から記憶部９１が記憶する板状ワークＷの研削開始直後の研削された上面Ｗａの高さＺ１を引いた差分Ｌ１が算出される。 Furthermore, in the present embodiment, the grinding means 7 is moved in the -Z direction according to the measured value measured by the upper surface height measuring means 38, thereby reducing the finish thickness difference of the plate-like workpiece W after finish creep feed grinding. Make corrections. Specifically, as shown in FIG. 6, as the holding means 30 moves in the -Y direction, the upper surface Wa of the plate-like work W is ground, and the control means 9 shown in FIG. Immediately after the finish creep feed grinding of the plate-shaped work W is started, the calculator 92 calculates the height (measurement value) of the upper surface Wa of the plate-shaped work W sent from the upper surface height measurement means 38 to the control means 9 every unit time. The difference obtained by subtracting the height Z1 of the ground upper surface Wa of is calculated. That is, for example, from the newly measured height Z2 of the upper surface Wa of the plate-like work W after finish creep feed grinding shown in FIG. A difference L1 is calculated by subtracting the height Z1 of Wa.

算出された差分Ｌ１は、仕上げクリープフィード研削が施された板状ワークＷの厚み差であり、前方（－Ｙ方向側）の研削砥石７４１の仕上げクリープフィード研削開始当初からの磨耗量である。算出部９２が差分Ｌ１を算出すると、制御手段９による制御の下で、Ｚ軸移動手段５が研削手段７を－Ｚ方向に移動させ仕上げクリープフィード研削後の板状ワークＷの厚み差を小さくする第一回目の補正が行われる。即ち、高さＺ０にある研削手段７が、差分Ｌ１の距離だけ保持手段３０の保持面３００ａで吸引保持されている板状ワークＷに近づけられて（下降されて）研削が行われることで、本補正後に研削された板状ワークＷの上面Ｗａの高さが再び高さＺ１となり、研削された板状ワークＷが所望の仕上げ厚みＴとなる。 The calculated difference L1 is the thickness difference of the plate-like workpiece W subjected to finish creep feed grinding, and is the amount of wear of the front (−Y direction side) grinding wheel 741 from the start of finish creep feed grinding. When the calculator 92 calculates the difference L1, the Z-axis moving means 5 moves the grinding means 7 in the -Z direction under the control of the control means 9 to reduce the thickness difference of the plate-like workpiece W after finish creep feed grinding. A first correction is made. That is, the grinding means 7 at the height Z0 is brought closer (lowered) to the plate-like workpiece W sucked and held by the holding surface 300a of the holding means 30 by the distance of the difference L1, and grinding is performed. After this correction, the height of the upper surface Wa of the ground plate-like work W becomes the height Z1 again, and the ground plate-like work W has the desired finished thickness T. FIG.

上記のように仕上げクリープフィード研削工程中に、環状の研削砥石７４１の外側に配設された上面高さ測定手段３８による板状ワークＷの上面Ｗａの高さ測定と、測定値に応じた研削手段７の－Ｚ方向への移動による補正とが単位時間毎に繰り返し行われつつ、図７に示すように、前方の研削砥石７４１の下面７４１ｂが板状ワークＷと接触しなくなるまで－Ｙ方向に保持手段３０が移動し、前方の研削砥石７４１の下面７４１ｂと内側面７４１ｃとにより板状ワークＷの上面Ｗａ全面が研削された後、研削手段７が＋Ｚ方向に引き上げられて板状ワークＷから離間する。 As described above, during the finish creep feed grinding process, the height of the upper surface Wa of the plate-like workpiece W is measured by the upper surface height measuring means 38 arranged outside the annular grinding wheel 741, and the grinding according to the measured value is performed. While the correction by moving the means 7 in the −Z direction is repeated every unit time, as shown in FIG. After the entire upper surface Wa of the plate-like work W is ground by the lower surface 741b and the inner side surface 741c of the grinding wheel 741 in front, the grinding means 7 is lifted in the +Z direction and the plate-like work W move away from

本発明に係るクリープフィード研削方法は、Ｚ軸移動手段５を用いて、前方（－Ｙ方向側）の研削砥石７４１の下面７４１ｂを保持手段３０に保持された板状ワークＷの上面Ｗａより低く位置づけると共に、Ｙ軸移動手段１４を用いて、前方（－Ｙ方向側）の研削砥石７４１より前方側に保持手段３０を位置づける準備工程と、準備工程の後、Ｙ軸移動手段１４を用いて、研削手段７に対し保持手段３０を研削ホイール７４の前方（－Ｙ方向側）から後方（＋Ｙ方向側）に向かって＋Ｙ方向に移動させ、前方の研削砥石７４１の下面７４１ｂと外側面７４１ｄとで板状ワークＷを研削する第１研削工程と、第１研削工程の後、Ｚ軸移動手段５を用いて、前方の研削砥石７４１の下面７４１ｂと保持面３００ａとの距離が予め設定した板状ワークＷの仕上げ厚みＴと一致する高さＺ１に前方の研削砥石７４１の下面７４１ｂを位置づけ、さらにＹ軸移動手段１４を用いて、研削手段７に対し保持手段３０を研削ホイール７４の後方（＋Ｙ方向側）から前方（－Ｙ方向側）に向かって移動させ、前方の研削砥石７４１の下面７４１ｂと内側面７４１ｃとで板状ワークＷを研削する第２研削工程と、を備えることで、第１研削工程において環状の研削砥石７４１の下面７４１ｂの研削力と外側面７４１ｄによる大きな研削力とで仕上げ厚み近くまで効率よく板状ワークＷを研削し、その後、第２研削工程において研削砥石７４１の下面７４１ｂと内側面７４１ｃとで板状ワークＷを仕上げ厚みＴまで研削することでむしれ等の無い綺麗な被研削面を形成することができる。 In the creep feed grinding method according to the present invention, using the Z-axis moving means 5, the lower surface 741b of the front (−Y direction side) grinding wheel 741 is lower than the upper surface Wa of the plate-like workpiece W held by the holding means 30. In addition to positioning, using the Y-axis moving means 14, a preparation step of positioning the holding means 30 on the front side of the front (−Y direction side) grinding wheel 741, and after the preparation process, using the Y-axis moving means 14, The holding means 30 is moved in the +Y direction from the front (−Y direction side) of the grinding wheel 74 toward the rear (+Y direction side) of the grinding wheel 74 with respect to the grinding means 7, and the lower surface 741b and the outer side surface 741d of the front grinding wheel 741 are moved. A first grinding step of grinding the plate-like workpiece W, and after the first grinding step, using the Z-axis moving means 5, a plate-like workpiece W with a predetermined distance between the lower surface 741b of the front grinding wheel 741 and the holding surface 300a is used. The lower surface 741b of the front grinding wheel 741 is positioned at the height Z1 that matches the finished thickness T of the workpiece W, and the Y-axis moving means 14 is used to move the holding means 30 to the grinding means 7 behind the grinding wheel 74 (+Y direction side) toward the front (-Y direction side), and grinds the plate-like work W with the lower surface 741b and the inner surface 741c of the front grinding wheel 741. In the first grinding step, the plate-like workpiece W is efficiently ground to near the finished thickness by the grinding force of the lower surface 741b of the annular grinding wheel 741 and the large grinding force of the outer surface 741d. By grinding the plate-like workpiece W to the finished thickness T with the lower surface 741b and the inner surface 741c, a clean surface to be ground without rips or the like can be formed.

本実施形態においては、第１研削工程実施時に、前方の研削砥石７４１の下面７４１ｂと外側面７４１ｄとで板状ワークＷを研削している最中に、研削屑が研削砥石７４１に付着しないように研削水を板状ワークＷとの接触部位に供給しているので、研削砥石７４１の磨耗を低減させていて、第２研削工程を開始する際の、仕上げ厚みＴを考慮した研削砥石７４１の高さ位置設定を適切に行うことができる。
また、第２研削工程実施時に、前方の研削砥石７４１の下面７４１ｂと内側面７４１ｃとで板状ワークＷを研削している最中においては、研削屑が研削ホイール７４の中心側に滞留しやすい。その結果、研削砥石７４１が磨耗しやすくなるため、本実施形態のように、第２研削工程実施時に、仕上げクリープフィード研削を行いながら板状ワークＷの上面Ｗａの高さを上面高さ測定手段３８により測定する。そして、研削砥石７４１が磨耗してしまうことで板状ワークＷが仕上げ厚みＴよりも厚く仕上がるのを修正するように、前方の研削砥石７４１の高さを下げる補正を行うことで、許容値内に板状ワークＷの仕上げ厚みＴを収めることが可能となる。 In the present embodiment, during the first grinding step, while the plate-like workpiece W is being ground by the lower surface 741b and the outer surface 741d of the front grinding wheel 741, the grinding dust is prevented from adhering to the grinding wheel 741. Since grinding water is supplied to the contact portion with the plate-shaped work W at the beginning of the second grinding process, the wear of the grinding wheel 741 is reduced. Height position setting can be performed appropriately.
Further, during the second grinding process, while the plate-like workpiece W is being ground by the lower surface 741b and the inner surface 741c of the front grinding wheel 741, the grinding dust tends to stay on the center side of the grinding wheel 74. . As a result, the grinding wheel 741 is likely to be worn, so that the height of the upper surface Wa of the plate-like workpiece W is measured by the upper surface height measuring means while performing the finish creep feed grinding during the second grinding step as in the present embodiment. 38. Then, by correcting the height of the front grinding wheel 741 so as to correct the fact that the plate-like workpiece W is finished thicker than the finished thickness T due to the grinding wheel 741 being worn, It is possible to accommodate the finished thickness T of the plate-shaped work W in .

本発明に係るクリープフィード研削方法は上述の実施形態に限定されず、その技術的思想の範囲内において種々異なる形態にて実施されてよいことは言うまでもない。また、添付図面に図示されている研削装置１の構成要素についても、これに限定されず、本発明の効果を発揮できる範囲内で適宜変更可能である。 It goes without saying that the creep feed grinding method according to the present invention is not limited to the above-described embodiment, and may be implemented in various forms within the scope of the technical idea. Moreover, the constituent elements of the grinding apparatus 1 shown in the attached drawings are not limited to these, and can be changed as appropriate within the scope in which the effects of the present invention can be exhibited.

Ｗ：板状ワークＷ１：基板Ｗ２：ウェーハＥ：電極Ｊ：樹脂層
１：研削装置１０：装置ベース１１：コラム
１４：Ｙ軸移動手段１４０：ボールネジ１４１：一対のガイドレール１４２：モータ１４３：可動板
３０：保持手段３００：吸着部３００ａ：保持面３０１：枠体３４：テーブル基台３９：カバー３９ａ：蛇腹カバー
３８：上面高さ測定手段３８０：コンタクト３８１：アーム部
５：Ｚ軸移動手段５０：ボールネジ５１：一対のガイドレール５２：モータ５３：昇降板
７：研削手段７０：スピンドル７０ａ：研削水供給口７０ｂ：研削水路７９：研削水源７１：ハウジング７２：モータ７３：マウント
７４：研削ホイール７４０：ホイール基台７４１：研削砥石７５：ホルダ
７６：研削水ノズル７８：エア源
９：制御手段９１：記憶部９２：算出部 W: Plate-like work W1: Substrate W2: Wafer E: Electrode J: Resin layer 1: Grinding device 10: Device base 11: Column 14: Y-axis moving means 140: Ball screw 141: Pair of guide rails 142: Motor 143: Movable Plate 30: Holding Means 300: Suction Part 300a: Holding Surface 301: Frame 34: Table Base 39: Cover 39a: Bellows Cover 38: Upper Surface Height Measuring Means 380: Contact 381: Arm 5: Z-Axis Moving Means 50 : Ball screw 51: Pair of guide rails 52: Motor 53: Elevator plate 7: Grinding means 70: Spindle 70a: Grinding water supply port 70b: Grinding water channel 79: Grinding water source 71: Housing 72: Motor 73: Mount
74: Grinding wheel 740: Wheel base 741: Grinding wheel 75: Holder 76: Grinding water nozzle 78: Air source 9: Control means 91: Storage unit 92: Calculation unit

Claims

板状ワークを保持する保持面を有する保持手段と、研削砥石を環状に配置した研削ホイールをスピンドルの先端に装着し該スピンドルを回転させ該保持手段に保持された板状ワークを研削する研削手段と、該保持手段と該研削手段とを相対的に該保持面に平行なＹ軸方向に移動させるＹ軸移動手段と、該保持面に垂直な方向であるＺ軸方向に該研削手段と該保持手段とを相対的に移動させるＺ軸移動手段と、を備えた研削装置を用いて、該保持手段に保持された板状ワークの上面より下に該研削砥石の下面を位置づけ、該保持手段と該研削手段とを相対的にＹ軸方向に移動させて板状ワークを研削するクリープフィード研削方法であって、
該スピンドルは、Ｚ軸方向より僅かに傾けられていて、該研削砥石の下面と該保持面との距離が最小になる方を該研削ホイールの前方とし、該研削砥石の下面と該保持面との距離が最大になる方を該研削ホイールの後方とし、
該Ｚ軸移動手段を用いて、該前方の該研削砥石の下面を該保持手段に保持された板状ワークの上面より低く位置づけると共に、該Ｙ軸移動手段を用いて、該前方の該研削砥石より前方側に該保持手段を位置づける準備工程と、
該準備工程の後、該Ｙ軸移動手段を用いて、該研削手段に対し該保持手段を該研削ホイールの該前方から該後方に向かって移動させ、該前方の該研削砥石の下面と外側面とで板状ワークを研削する第１研削工程と、
該第１研削工程の後、該Ｚ軸移動手段を用いて、該前方の該研削砥石の下面と該保持面との距離が予め設定した板状ワークの仕上げ厚みと一致する高さに該前方の該研削砥石の下面を位置づけ、さらに該Ｙ軸移動手段を用いて、該研削手段に対し該保持手段を該研削ホイールの該後方から該前方に向かって移動させ、該前方の該研削砥石の下面と内側面とで板状ワークを研削する第２研削工程と、を備えるクリープフィード研削方法。 A holding means having a holding surface for holding a plate-like work, and a grinding means for grinding the plate-like work held by the holding means by mounting a grinding wheel having grinding wheels arranged in an annular shape on the tip of a spindle and rotating the spindle. Y-axis moving means for relatively moving the holding means and the grinding means in the Y-axis direction parallel to the holding surface; and the grinding means and the grinding means in the Z-axis direction perpendicular to the holding surface. Z-axis moving means for moving relative to the holding means to position the lower surface of the grinding wheel below the upper surface of the plate-shaped work held by the holding means, and and the grinding means are relatively moved in the Y-axis direction to grind a plate-like workpiece,
The spindle is slightly inclined with respect to the Z-axis direction, and the direction in which the distance between the lower surface of the grinding wheel and the holding surface is the smallest is the front of the grinding wheel. The rear of the grinding wheel is the one where the distance of
Using the Z-axis moving means, the lower surface of the front grinding wheel is positioned lower than the upper surface of the plate-shaped work held by the holding means, and the Y-axis moving means is used to position the front grinding wheel. a preparatory step of positioning the holding means more forward;
After the preparatory step, the Y-axis moving means is used to move the holding means relative to the grinding means from the front to the rear of the grinding wheel so that the lower surface and the outer surface of the grinding wheel in front of the wheel are moved. A first grinding step of grinding the plate-shaped work with
After the first grinding step, the Z-axis moving means is used to adjust the front side to a height where the distance between the lower surface of the front grinding wheel and the holding surface matches the preset finished thickness of the plate-shaped work. position the lower surface of the grinding wheel, and use the Y-axis moving means to move the holding means with respect to the grinding means from the rear side of the grinding wheel toward the front side of the grinding wheel in front of the A creep feed grinding method comprising: a second grinding step of grinding the plate-shaped work on the lower surface and the inner surface.