JP6441056B2 - Grinding equipment - Google Patents

Grinding equipment Download PDF

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JP6441056B2
JP6441056B2 JP2014250114A JP2014250114A JP6441056B2 JP 6441056 B2 JP6441056 B2 JP 6441056B2 JP 2014250114 A JP2014250114 A JP 2014250114A JP 2014250114 A JP2014250114 A JP 2014250114A JP 6441056 B2 JP6441056 B2 JP 6441056B2
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plate
workpiece
grinding
crack
reflected
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JP2016107389A (en
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聡 山中
聡 山中
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Disco Corp
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Disco Corp
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Priority to TW104136685A priority patent/TWI674948B/en
Priority to CN201510854878.6A priority patent/CN105690199B/en
Priority to KR1020150175039A priority patent/KR102319943B1/en
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B24B7/228—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain for grinding thin, brittle parts, e.g. semiconductors, wafers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/12—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation involving optical means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84—Systems specially adapted for particular applications
    • G01N21/88—Investigating the presence of flaws or contamination

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Chemical & Material Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Biochemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Analytical Chemistry (AREA)
  • General Health & Medical Sciences (AREA)
  • Immunology (AREA)
  • Pathology (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Computer Hardware Design (AREA)
  • Manufacturing & Machinery (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)

Description

本発明は、サファイア（Ａｌ２Ｏ３）、炭化ケイ素（ＳｉＣ）等の硬質な板状ワークを研削する研削装置に関する。 The present invention relates to a grinding apparatus for grinding a hard plate-like workpiece such as sapphire (Al 2 O 3 ) or silicon carbide (SiC).

サファイア、炭化ケイ素等の硬質な板状ワークの研削加工では、研削荷重によって板状ワークが割れる場合がある。板状ワークに割れが生じた状態で研削加工が継続されると、研削砥石に欠けが生じて研削砥石の研削力が低下する。研削力の低下により板状ワークが減厚され難くなり、板状ワークに余計な荷重が掛ることで更に割れが悪化すると共に、研削砥石に多くの欠けが生じてしまう。この結果、チャックテーブルの保持面に板状ワークの破損屑が付着すると共に正常な研削力を持たない研削砥石で後続の板状ワークが研削されるため、後続の板状ワークにも割れが生じていた。   In grinding a hard plate-like workpiece such as sapphire or silicon carbide, the plate-like workpiece may be broken by a grinding load. If the grinding process is continued in a state where the plate-like workpiece is cracked, the grinding wheel is chipped, and the grinding force of the grinding wheel is reduced. The reduction of the grinding force makes it difficult for the plate-like workpiece to be reduced in thickness, and an excessive load is applied to the plate-like workpiece, which further deteriorates cracks and causes many chips on the grinding wheel. As a result, the scraps of the plate-like workpiece adhere to the holding surface of the chuck table, and the subsequent plate-like workpiece is ground with a grinding wheel that does not have a normal grinding force. It was.

このため、板状ワークに割れが生じた状態で研削を継続させないように、定期的に板状ワークの割れを特定する方法が提案されている（例えば、特許文献１、２参照）。特許文献１に記載の方法では、板状ワークから保護テープを剥がしたときに、板状ワークの割れが保護テープに転写されることを利用して、保護テープに生じた凹凸形状から板状ワークの割れを特定している。特許文献２に記載の方法では、チャックテーブル内に設けられた発光部からチャックテーブル上の板状ワークを照射して、板状ワークの割れ目から漏れる光を撮像して板状ワークの割れを特定している。   For this reason, the method of specifying the crack of a plate-shaped workpiece regularly is proposed so that grinding may not be continued in the state where a crack occurred in a plate-shaped workpiece (for example, refer to patent documents 1 and 2). In the method described in Patent Document 1, when the protective tape is peeled off from the plate-shaped workpiece, the crack of the plate-shaped workpiece is transferred to the protective tape. Specific cracks. In the method described in Patent Document 2, a plate-like workpiece on the chuck table is irradiated from a light emitting portion provided in the chuck table, and light leaking from a crack in the plate-like workpiece is imaged to identify a crack in the plate-like workpiece. doing.

特開２０１３−１３１５３７号公報JP2013-131537A 特開２０１４−１５４７０８号公報JP 2014-154708 A

しかしながら、特許文献１、２に記載の板状ワークの割れの特定方法は、いずれも研削加工後の板状ワークの割れを判断するものである。すなわち、特許文献１に記載の方法は、板状ワークから保護テープを剥がさなければ割れを特定できず、特許文献２に記載の方法は、研削加工を停止させなければ、板状ワークの表面を撮像することができない。したがって、板状ワークの研削が完了するまでは、板状ワークが割れた状態であっても研削加工が継続されてしまうため、研削砥石の劣化が進むと共に破損屑がチャックテーブルに付着して、板状ワークに割れが発生するという問題があった。   However, any of the methods for identifying cracks in a plate-like workpiece described in Patent Documents 1 and 2 determines whether or not the plate-like workpiece is cracked after grinding. That is, the method described in Patent Document 1 cannot identify cracks unless the protective tape is peeled off from the plate-shaped workpiece. The method described in Patent Document 2 does not stop the grinding process until the surface of the plate-shaped workpiece is stopped. I can't take an image. Therefore, until the grinding of the plate workpiece is completed, the grinding process is continued even if the plate workpiece is cracked. There was a problem that cracks occurred in the plate workpiece.

本発明はかかる点に鑑みてなされたものであり、板状ワークの割れを最小限に留めて、研削砥石の劣化を抑制して後続の板状ワークの割れを防止することができる研削装置を提供することを目的とする。   The present invention has been made in view of the above points, and a grinding apparatus capable of preventing the cracking of a subsequent plate-shaped workpiece by suppressing the degradation of the grinding wheel while minimizing the cracking of the plate-shaped workpiece. The purpose is to provide.

本発明の研削装置は、板状ワークを保持するチャックテーブルと、該チャックテーブルを連続回転させる回転手段と、該チャックテーブルを該回転手段で連続回転させ保持する板状ワークを研削砥石で研削する研削手段と、を備えた研削装置であって、該研削手段で研削される該チャックテーブルが保持する板状ワークの割れを検出する割れ検出手段を備え、該割れ検出手段は、板状ワークの上方から板状ワークの上面に向って測定光を照射する照射部と、該照射部から照射される測定光が板状ワークの該上面で反射した反射光と板状ワークの下面で反射した反射光とを受光する受光部と、板状ワークの該上面及び該下面で反射した反射光から板状ワークの厚みを算出する厚み算出部と、該受光部が受光する該上面で反射した反射光または該下面で反射した反射光の受光量が予め設定した許容範囲を超えた時に割れと判断する判断部と、を備える。 The grinding apparatus of the present invention uses a grinding wheel to grind a chuck table for holding a plate-like workpiece, a rotating means for continuously rotating the chuck table, and a plate-like workpiece for holding the chuck table continuously rotated by the rotating means. A cracking means for detecting cracks in the plate-like workpiece held by the chuck table to be ground by the grinding means, the crack detection means comprising: An irradiating unit that irradiates measurement light from above toward the upper surface of the plate-like workpiece , reflected light that is reflected from the upper surface of the plate-like workpiece, and reflection that is reflected from the lower surface of the plate-like workpiece. A light receiving portion that receives light, a thickness calculating portion that calculates the thickness of the plate workpiece from the reflected light reflected from the upper surface and the lower surface of the plate workpiece, and reflected light reflected from the upper surface that the light receiving portion receives. Or the And a determination unit to determine that a crack when the amount of received reflected light reflected by the surface exceeds the permissible range set in advance.

この構成によれば、板状ワークに向けて測定光を照射して、反射光の受光量の変化から板状ワークの割れが判断される。研削加工を継続した状態で受光量の変化を監視するため、板状ワークの割れを即座に判断することができる。よって、板状ワークの割れを最小限に留めて、研削手段の研削砥石の劣化が進む前に研削加工を停止することができ、研削砥石の劣化や板状ワークの破損屑による後続の板状ワークの割れを防止することができる。   According to this configuration, the measurement light is irradiated toward the plate-shaped workpiece, and the crack of the plate-shaped workpiece is determined from the change in the amount of reflected light received. Since the change in the amount of received light is monitored while the grinding process is continued, it is possible to immediately determine the crack of the plate workpiece. Therefore, the cracking of the plate-like workpiece can be kept to a minimum, and the grinding process can be stopped before the grinding wheel of the grinding means deteriorates. It is possible to prevent the workpiece from cracking.

本発明によれば、板状ワークに向けて測定光を照射して、反射光の受光量の変化から板状ワークの割れを判断することで、板状ワークの割れを最小限に留めて、研削砥石の劣化を抑制して後続の板状ワークの割れを防止することができる。   According to the present invention, by irradiating the plate-shaped workpiece with measurement light, and judging the crack of the plate-shaped workpiece from the change in the amount of reflected light received, the crack of the plate-shaped workpiece is kept to a minimum, Deterioration of the grinding wheel can be suppressed, and the subsequent plate-like workpiece can be prevented from cracking.

本実施の形態に係る研削装置の斜視図である。It is a perspective view of the grinding device concerning this embodiment. 本実施の形態に係る研削動作の説明図である。It is explanatory drawing of the grinding operation which concerns on this Embodiment. 本実施の形態に係る厚み測定手段の模式図である。It is a schematic diagram of the thickness measurement means which concerns on this Embodiment. 本実施の形態に係る板状ワークの割れと受光量の関係を示す説明図である。It is explanatory drawing which shows the relationship between the crack of the plate-shaped workpiece | work which concerns on this Embodiment, and light-receiving amount. 本実施の形態に係る板状ワークの厚み測定及び割れ検出の説明図である。It is explanatory drawing of the thickness measurement of a plate-shaped workpiece | work which concerns on this Embodiment, and a crack detection. 変形例に係る高さ測定手段の模式図である。It is a schematic diagram of the height measurement means which concerns on a modification.

以下、添付図面を参照して、本実施の形態に係る研削装置について説明する。図１は、本実施の形態に係る研削装置の斜視図である。なお、本実施の形態に係る研削装置は、図１に示すように研削加工専用の装置構成に限定されず、例えば、研削加工、研磨加工、洗浄加工等の一連の加工が全自動で実施されるフルオートタイプの加工装置に組み込まれてもよい。なお、以下の図では、説明の便宜上、ＢＧ（Back-Grinding）テープについては記載を省略している。   Hereinafter, the grinding apparatus according to the present embodiment will be described with reference to the accompanying drawings. FIG. 1 is a perspective view of a grinding apparatus according to the present embodiment. Note that the grinding apparatus according to the present embodiment is not limited to the apparatus configuration dedicated to the grinding process as shown in FIG. 1, and for example, a series of processes such as a grinding process, a polishing process, and a cleaning process are performed fully automatically. It may be incorporated into a fully automatic type processing apparatus. In the following drawings, for convenience of explanation, the description of a BG (Back-Grinding) tape is omitted.

図１に示すように、研削装置１は、多数の研削砥石４８を円環状に並べた研削ホイール４６を用いて、チャックテーブル２１に保持された板状ワークＷを研削するように構成されている。研削装置１は、チャックテーブル２１の回転軸と研削ホイール４６の回転軸が偏心され、円環状に並んだ研削砥石４８が板状ワークＷの上面８１を通過することで板状ワークＷが円弧状に削られて薄化される。なお、板状ワークＷは、サファイア、炭化ケイ素等の硬質な板状ワークに限らず、シリコン、ガリウム砒素等の半導体基板でもよいし、樹脂や金属等で形成された基板でもよい。   As shown in FIG. 1, the grinding apparatus 1 is configured to grind the plate-like workpiece W held on the chuck table 21 by using a grinding wheel 46 in which a large number of grinding wheels 48 are arranged in an annular shape. . In the grinding apparatus 1, the rotation axis of the chuck table 21 and the rotation axis of the grinding wheel 46 are decentered, and the grinding wheel 48 arranged in an annular shape passes through the upper surface 81 of the plate-like workpiece W, so that the plate-like workpiece W has an arc shape. It is cut and thinned. The plate-like workpiece W is not limited to a hard plate-like workpiece such as sapphire or silicon carbide, but may be a semiconductor substrate such as silicon or gallium arsenide, or a substrate formed of resin or metal.

研削装置１の基台１１の上面には、Ｘ軸方向に延在する矩形状の開口が形成され、この開口はチャックテーブル２１と共に移動可能な移動板１２及び蛇腹状の防水カバー１３に覆われている。防水カバー１３の下方には、チャックテーブル２１をＸ軸方向に移動させるボールねじ式の進退手段（不図示）と、チャックテーブル２１を連続回転させる回転手段２２とが設けられている。チャックテーブル２１の表面には、多孔質のポーラス材によって板状ワークＷを吸着する保持面２３が形成されている。保持面２３は、チャックテーブル２１内の流路を通じて吸引源（不図示）に接続されており、保持面２３に生じる負圧によって板状ワークＷが吸引保持される。   A rectangular opening extending in the X-axis direction is formed on the upper surface of the base 11 of the grinding apparatus 1, and this opening is covered with a movable plate 12 that can move together with the chuck table 21 and a bellows-shaped waterproof cover 13. ing. Below the waterproof cover 13, ball screw type advance / retreat means (not shown) for moving the chuck table 21 in the X-axis direction and rotation means 22 for continuously rotating the chuck table 21 are provided. On the surface of the chuck table 21, a holding surface 23 for adsorbing the plate-like workpiece W by a porous porous material is formed. The holding surface 23 is connected to a suction source (not shown) through a flow path in the chuck table 21, and the plate-like workpiece W is sucked and held by the negative pressure generated on the holding surface 23.

基台１１上のコラム１４には、研削手段４１をチャックテーブル２１に対して研削送り方向（Ｚ軸方向）に接近及び離間させる研削送り手段３１が設けられている。研削送り手段３１は、コラム１４に配置されたＺ軸方向に平行な一対のガイドレール３２と、一対のガイドレール３２にスライド可能に設置されたモータ駆動のＺ軸テーブル３３とを有している。Ｚ軸テーブル３３の背面側には図示しないナット部が形成され、これらナット部にボールネジ３４が螺合されている。ボールネジ３４の一端部に連結された駆動モータ３５によりボールネジ３４が回転駆動されることで、研削手段４１がガイドレール３２に沿ってＺ軸方向に移動される。   The column 14 on the base 11 is provided with a grinding feed means 31 that moves the grinding means 41 toward and away from the chuck table 21 in the grinding feed direction (Z-axis direction). The grinding feed means 31 has a pair of guide rails 32 arranged in the column 14 and parallel to the Z-axis direction, and a motor-driven Z-axis table 33 slidably installed on the pair of guide rails 32. . Nut portions (not shown) are formed on the back side of the Z-axis table 33, and a ball screw 34 is screwed to these nut portions. The ball screw 34 is rotationally driven by a drive motor 35 connected to one end of the ball screw 34, whereby the grinding means 41 is moved along the guide rail 32 in the Z-axis direction.

研削手段４１は、ハウジング４２を介してＺ軸テーブル３３の前面に取り付けられており、円筒状のスピンドル４３の下端にマウント４４を設けて構成されている。スピンドル４３にはフランジ４５が設けられ、フランジ４５を介してハウジング４２に研削手段４１が支持される。マウント４４の下面には、ホイール基台４７に複数の研削砥石４８が真円の環状に装着された研削ホイール４６が保持されている。複数の研削砥石４８は、例えば、ダイヤモンド砥粒をメタルボンド等のボンド剤で固めたセグメント砥石で構成される。   The grinding means 41 is attached to the front surface of the Z-axis table 33 via a housing 42, and is configured by providing a mount 44 at the lower end of a cylindrical spindle 43. The spindle 43 is provided with a flange 45, and the grinding means 41 is supported on the housing 42 via the flange 45. The lower surface of the mount 44 holds a grinding wheel 46 in which a plurality of grinding wheels 48 are mounted on a wheel base 47 in a circular shape. The plurality of grinding wheels 48 are constituted by, for example, segment grindstones in which diamond abrasive grains are hardened with a bonding agent such as metal bond.

研削手段４１の近傍には、板状ワークＷの厚みを測定する厚み測定手段５１が設けられている。厚み測定手段５１は、例えば非接触式の干渉分光方式で板状ワークＷの厚みを測定するものであり、板状ワークＷの上面８１及び下面８２からの反射光の光路差によって板状ワークＷの厚みを測定する。また、研削装置１には、装置各部を統括制御する制御手段６１が設けられている。制御手段６１は、各種処理を実行するプロセッサやメモリ等により構成される。メモリは、用途に応じてＲＯＭ（Read Only Memory）、ＲＡＭ（Random Access Memory）等の一つ又は複数の記憶媒体で構成される。   In the vicinity of the grinding means 41, a thickness measuring means 51 for measuring the thickness of the plate-like workpiece W is provided. The thickness measuring means 51 measures the thickness of the plate-like workpiece W by, for example, a non-contact type interference spectroscopy method, and the plate-like workpiece W is determined by the optical path difference of the reflected light from the upper surface 81 and the lower surface 82 of the plate-like workpiece W. Measure the thickness. Further, the grinding apparatus 1 is provided with a control means 61 that controls each part of the apparatus. The control unit 61 includes a processor that executes various processes, a memory, and the like. The memory is composed of one or a plurality of storage media such as a ROM (Read Only Memory) and a RAM (Random Access Memory) depending on the application.

このように構成された研削装置１では、先ずチャックテーブル２１上に板状ワークＷが保持される。図１では保持面２３が平坦に描かれているが、図２に示すように、実際の保持面２３はチャックテーブル２１の回転中心を頂点とする緩傾斜の円錐状であり、板状ワークＷも保持面２３に沿って円錐状に保持される。研削砥石４８の研削面に対して円錐状の板状ワークＷの上面が平行になるようにチャックテーブル２１の傾きが調整された後、研削水が供給されながら研削砥石４８と板状ワークＷが回転接触することで研削される。研削加工中は、厚み測定手段５１によって板状ワークＷの厚みがリアルタイムに測定され、厚み測定手段５１の測定結果に基づいて研削手段４１の送り量が制御されている。   In the grinding apparatus 1 configured as described above, the plate-like workpiece W is first held on the chuck table 21. In FIG. 1, the holding surface 23 is drawn flat. However, as shown in FIG. 2, the actual holding surface 23 has a conical shape with a gentle inclination with the center of rotation of the chuck table 21 as a vertex. Is also held conically along the holding surface 23. After the inclination of the chuck table 21 is adjusted so that the upper surface of the conical plate-like workpiece W is parallel to the grinding surface of the grinding wheel 48, the grinding wheel 48 and the plate-like workpiece W are supplied while grinding water is supplied. Grinding by rotating contact. During the grinding process, the thickness of the plate-like workpiece W is measured in real time by the thickness measuring means 51, and the feed amount of the grinding means 41 is controlled based on the measurement result of the thickness measuring means 51.

ところで、硬質な板状ワークＷの研削加工では、上記の研削装置１を用いて、例えば、Ｚ１軸加工、Ｚ２軸加工、Ｚ３軸加工の３段階で徐々に研削砥石の砥粒の粒度を細かくして目標厚みに近づけられる。Ｚ２軸加工では研削荷重によって板状ワークＷの割れが生じ易く、板状ワークＷの割れに入り込んだ砥粒によって研削砥石４８が削られて、研削砥石４８に欠けが生じるおそれがある。欠けが生じた研削砥石４８で板状ワークＷの研削が継続されると、さらに板状ワークＷに割れが生じ易くなる。この板状ワークＷの割れと研削砥石４８の欠けが繰り返されることで研削砥石４８の劣化が進み、後続の板状ワークＷで割れが生じ易くなるという問題がある。   By the way, in grinding processing of the hard plate-like workpiece W, the above-described grinding apparatus 1 is used to gradually finer the grain size of the grinding stone in three stages, for example, Z1-axis processing, Z2-axis processing, and Z3-axis processing. And can be brought close to the target thickness. In the Z2 axis machining, the plate-like workpiece W is easily cracked by the grinding load, and the grinding wheel 48 may be scraped by the abrasive grains that have entered the crack of the plate-like workpiece W, and the grinding wheel 48 may be chipped. If the grinding of the plate-like workpiece W is continued with the grinding wheel 48 in which the chip has occurred, the plate-like workpiece W is more likely to crack. There is a problem in that the crack of the plate-shaped workpiece W and the chipping of the grinding wheel 48 are repeated, so that the deterioration of the grinding wheel 48 proceeds, and the subsequent plate-shaped workpiece W is likely to be cracked.

本件発明者が、板状ワークＷの受光量と板状ワークＷの割れとの関係を調べたところ、厚み測定手段５１からの測定光が板状ワークＷの割れによって拡散反射して受光量に変化が生じることを発見した。そこで、本実施の形態では、研削加工を継続させた状態で、厚み測定手段５１によって板状ワークＷの厚みを測定すると共に受光量の変化から板状ワークＷの割れを検出するようにしている。これにより、板状ワークＷの割れを即座に検出することができ、早期に研削砥石４８の劣化を抑えて後続の板状ワークＷの割れを防止することが可能になっている。   When the present inventor examined the relationship between the amount of light received by the plate-like workpiece W and the crack of the plate-like workpiece W, the measurement light from the thickness measuring means 51 is diffusely reflected by the crack of the plate-like workpiece W and becomes the amount of received light. I have found that changes occur. Therefore, in the present embodiment, the thickness of the plate-like workpiece W is measured by the thickness measuring means 51 while the grinding process is continued, and the crack of the plate-like workpiece W is detected from the change in the amount of received light. . Thereby, the crack of the plate-like workpiece W can be detected immediately, and it is possible to prevent the subsequent plate-like workpiece W from cracking by suppressing deterioration of the grinding wheel 48 at an early stage.

ここで、図３及び図４を参照して厚み測定手段について説明する。図３は、本実施の形態に係る厚み測定手段の模式図である。図４は、本実施の形態に係る板状ワークの割れと受光量の関係を示す説明図である。なお、本実施の形態に係る厚み測定手段は、図３に示す構成に限定されず、光学式で板状ワークの厚みを測定可能な構成であれば、どのように構成されてもよい。   Here, the thickness measuring means will be described with reference to FIGS. FIG. 3 is a schematic diagram of thickness measuring means according to the present embodiment. FIG. 4 is an explanatory diagram showing the relationship between the crack of the plate-like workpiece and the amount of received light according to the present embodiment. In addition, the thickness measuring unit according to the present embodiment is not limited to the configuration shown in FIG. 3, and may be configured in any manner as long as it is a configuration that can measure the thickness of the plate-like workpiece with an optical method.

図３に示すように、厚み測定手段５１には、板状ワークＷの上方から板状ワークＷの上面８１に向かって測定光を照射する照射部５２と、測定光が板状ワークＷで反射した反射光を受光する受光部５３とが設けられている。照射部５２から照射された測定光は、板状ワークＷの上面８１及び下面８２で反射されてそれぞれ受光部５３で受光される。また、厚み測定手段５１には、板状ワークＷの上面８１及び下面８２で反射した反射光から板状ワークＷの厚みを算出する厚み算出部５４が設けられている。厚み算出部５４は、板状ワークＷの上面８１及び下面８２からの反射光の光路差によって板状ワークＷの厚みを算出する。   As shown in FIG. 3, the thickness measuring unit 51 includes an irradiation unit 52 that irradiates measurement light from above the plate-like workpiece W toward the upper surface 81 of the plate-like workpiece W, and the measurement light is reflected by the plate-like workpiece W. And a light receiving portion 53 for receiving the reflected light. The measurement light emitted from the irradiation unit 52 is reflected by the upper surface 81 and the lower surface 82 of the plate-like workpiece W and received by the light receiving unit 53, respectively. Further, the thickness measuring means 51 is provided with a thickness calculating section 54 that calculates the thickness of the plate-like workpiece W from the reflected light reflected by the upper surface 81 and the lower surface 82 of the plate-like workpiece W. The thickness calculation unit 54 calculates the thickness of the plate-like workpiece W based on the optical path difference of the reflected light from the upper surface 81 and the lower surface 82 of the plate-like workpiece W.

厚み測定手段５１は、板状ワークＷの厚み測定の機能に加えて、板状ワークＷの割れを検出する機能を有している。上記したように、板状ワークＷに割れが生じると、板状ワークＷで測定光が拡散反射されるため、厚み測定手段５１は、この拡散反射による受光量の変化を利用して板状ワークＷの割れを検出している。厚み測定手段５１には、板状ワークＷの割れを検出させるために、受光部５３が受光する反射光の受光量から板状ワークＷの割れを判断する判断部５５が設けられている。判断部５５には、板状ワークＷの割れの判断基準となる受光量の許容範囲が設定されている。   The thickness measuring means 51 has a function of detecting cracks in the plate-like workpiece W in addition to the function of measuring the thickness of the plate-like workpiece W. As described above, when cracks occur in the plate-like workpiece W, the measurement light is diffusely reflected by the plate-like workpiece W. Therefore, the thickness measuring unit 51 uses the change in the amount of received light due to this diffuse reflection to obtain the plate-like workpiece. W cracking is detected. In order to detect the crack of the plate-like workpiece W, the thickness measuring unit 51 is provided with a determination unit 55 that determines the crack of the plate-like workpiece W from the amount of received light of the reflected light received by the light receiving unit 53. In the determination unit 55, an allowable range of the amount of received light that is a determination criterion for cracking of the plate-like workpiece W is set.

判断部５５は、板状ワークＷの上面８１で反射した反射光または板状ワークＷの下面８２で反射した反射光の受光量が予め設定した許容範囲を超えた時に、板状ワークＷに割れが生じたと判断する。なお、許容範囲は、例えば、事前に板状ワークＷの割れと受光量との関係を求めておくことで決定される。また、許容範囲は、板状ワークＷの上面８１からの反射光用と板状ワークＷの下面８２からの反射光用とで共通に設定されてもよいし、個々に設定されてもよい。厚み算出部５４の算出結果及び判断部５５の判断結果は、制御手段６１に出力されて研削手段４１の研削動作の制御に用いられる。   The determination unit 55 breaks into the plate-shaped workpiece W when the amount of light reflected by the upper surface 81 of the plate-shaped workpiece W or the amount of reflected light reflected by the lower surface 82 of the plate-shaped workpiece W exceeds a preset allowable range. Is determined to have occurred. The allowable range is determined, for example, by obtaining the relationship between the crack of the plate-like workpiece W and the amount of received light in advance. Further, the allowable range may be set in common for the reflected light from the upper surface 81 of the plate-like workpiece W and for the reflected light from the lower surface 82 of the plate-like workpiece W, or may be set individually. The calculation result of the thickness calculation unit 54 and the determination result of the determination unit 55 are output to the control unit 61 and used for controlling the grinding operation of the grinding unit 41.

そして、研削加工中は、厚み算出部５４による板状ワークＷの厚み算出がリアルタイムで実施され、厚み算出部５４の算出結果に基づいて板状ワークＷが目標の仕上げ厚みに近づくように研削手段４１の送り量が制御される。また、研削加工中は、判断部５５による板状ワークＷの割れ検出もリアルタイムで実施され、判断部５５の判断結果に基づいて研削手段４１の駆動と停止が制御される。判断部５５によって板状ワークＷの割れと判断されていない間は研削加工が継続され、判断部５５によって板状ワークＷの割れと判断された場合には、研削手段４１が停止されて板状ワークＷの割れがオペレータに知らされる。   During the grinding process, the thickness calculation unit 54 calculates the thickness of the plate workpiece W in real time, and the grinding means so that the plate workpiece W approaches the target finish thickness based on the calculation result of the thickness calculation unit 54. The feed amount 41 is controlled. Further, during the grinding process, the crack detection of the plate-like workpiece W by the determination unit 55 is also performed in real time, and the drive and stop of the grinding means 41 are controlled based on the determination result of the determination unit 55. Grinding is continued while the determination unit 55 does not determine that the plate-like workpiece W is cracked. If the determination unit 55 determines that the plate-like workpiece W is cracked, the grinding means 41 is stopped and the plate-like workpiece W is stopped. The operator is informed of the crack of the workpiece W.

図４Ａに示すように、板状ワークＷの割れ８３は、板状ワークの外縁から中心に向って発生し、中心を通過後、板状ワークＷの中心から径方向外側の外縁に向かって発生する傾向がある。したがって、厚み測定手段５１で板状ワークＷの径方向の所定位置に測定光を照射させた状態で板状ワークＷを回転させることで、板状ワークＷに生じた割れ８３を見落とすことなく検出することが可能になっている。なお、厚み測定手段５１は、板状ワークＷの径方向で位置を変えながら、板状ワークＷの径方向の複数の箇所で割れ８３を検出してもよい。   As shown in FIG. 4A, the crack 83 of the plate-like workpiece W occurs from the outer edge of the plate-like workpiece toward the center, passes through the center, and then occurs from the center of the plate-like workpiece W toward the outer edge of the radial direction. Tend to. Therefore, the thickness measuring means 51 detects the crack 83 generated in the plate-like workpiece W without overlooking it by rotating the plate-like workpiece W in a state where the measurement light is irradiated to a predetermined position in the radial direction of the plate-like workpiece W. It is possible to do. The thickness measuring unit 51 may detect the cracks 83 at a plurality of locations in the radial direction of the plate-like workpiece W while changing the position in the radial direction of the plate-like workpiece W.

図４Ｂに示すように、板状ワークＷの割れ８３に測定光が反射されると、測定光の拡散反射によって受光量が大きく変化する。受光量は、板状ワークＷの割れ８３が生じた角度位置において、大きく低下した後に大きく上昇するように変化する。この受光量が許容範囲を超えるか否かに応じて板状ワークＷの割れ８３が検出される。なお、受光量の変化（ピーク）は周期的に現れるため、受光量の変化が複数回にわたって表れたときに板状ワークＷの割れと検出してもよい。また、受光量が許容範囲の上限、下限の一方を超えたときに板状ワークＷの割れ８３と判断してもよいし、許容範囲の上限、下限の両方を超えたときに板状ワークＷの割れ８３と判断してもよい。   As shown in FIG. 4B, when the measurement light is reflected by the crack 83 of the plate-like workpiece W, the amount of received light changes greatly due to the diffuse reflection of the measurement light. The amount of received light changes so as to increase greatly after greatly decreasing at the angular position where the crack 83 of the plate-like workpiece W occurs. The crack 83 of the plate-like workpiece W is detected according to whether or not the amount of received light exceeds the allowable range. Since the change (peak) in the amount of received light appears periodically, it may be detected that the plate-like workpiece W is cracked when the change in the amount of received light appears multiple times. Further, when the amount of received light exceeds one of the upper limit and the lower limit of the allowable range, it may be determined as a crack 83 of the plate-like work W, or when both the upper limit and the lower limit of the allowable range are exceeded, the plate-like work W. The crack 83 may be determined.

続いて、図５を参照して、厚み測定手段による板状ワークの厚み測定及び割れ検出について説明する。図５は、本実施の形態に係る板状ワークの厚み測定及び割れ検出の説明図である。なお、図５に示す厚み測定処理及び割れ検出処理は一例を示すものであるため、この構成に限定されるものではない。また、チャックテーブルの保持面が平坦に記載されているが、実際には緩傾斜の円錐状に形成されている。さらに、説明の便宜上、Ｚ２軸用の研削装置もＺ３軸用の研削装置も同一の符号を付している。   Then, with reference to FIG. 5, the thickness measurement of a plate-shaped workpiece | work by a thickness measurement means and crack detection are demonstrated. FIG. 5 is an explanatory diagram of the thickness measurement and crack detection of the plate-like workpiece according to the present embodiment. In addition, since the thickness measurement process and the crack detection process shown in FIG. 5 show an example, it is not limited to this structure. Further, although the holding surface of the chuck table is described as being flat, it is actually formed in a slowly inclined cone shape. Further, for convenience of explanation, the Z2 axis grinding apparatus and the Z3 axis grinding apparatus are assigned the same reference numerals.

図５Ａに示すように、Ｚ１軸加工（粗研削加工）後の板状ワークＷがＺ２軸用の研削装置に搬入されて、板状ワークＷの中心がチャックテーブル２１の中心に合うように保持される。そして、研削ホイール４６がＺ軸回りに回転されながら板状ワークＷに近づけられ、研削砥石４８と板状ワークＷとが相対的に摺動されて板状ワークＷがＺ２軸加工される。Ｚ２軸加工（中研削加工）では、Ｚ１軸加工よりも粒度の細かい研削砥石４８を用いて研削加工が実施される。研削加工中は、厚み測定手段５１でエアーが噴き付けられながら、板状ワークＷの厚みの測定と板状ワークＷの割れの検出がリアルタイムで実施されている。   As shown in FIG. 5A, the plate-like workpiece W after the Z1-axis machining (coarse grinding) is carried into the Z2-axis grinding machine and held so that the center of the plate-like workpiece W is aligned with the center of the chuck table 21. Is done. Then, the grinding wheel 46 is rotated around the Z-axis and brought close to the plate-like workpiece W, and the grinding wheel 48 and the plate-like workpiece W are slid relative to each other so that the plate-like workpiece W is Z2-axis processed. In Z2-axis machining (medium grinding), grinding is performed using a grinding wheel 48 having a finer particle size than Z1-axis machining. During the grinding process, the thickness of the plate-like workpiece W is measured and the crack of the plate-like workpiece W is detected in real time while air is blown by the thickness measuring means 51.

厚み測定手段５１からの板状ワークＷの厚みに基づいて、板状ワークＷの厚みが目標の厚みに達するまで板状ワークＷが研削加工される。研削加工中に厚み測定手段５１によって板状ワークＷの割れが検出されると、研削加工が停止されてオペレータにチャックテーブル２１上の板状ワークＷの撤去が促される。このように、板状ワークＷに割れが生じたときには即座に研削加工が停止されるため、板状ワークＷが割れた状態で研削が継続されることがなく、研削砥石４８の劣化が進むこともない。よって、研削砥石４８の劣化が抑えられるため、後続の板状ワークＷの割れを防止することができる。   Based on the thickness of the plate-like workpiece W from the thickness measuring means 51, the plate-like workpiece W is ground until the thickness of the plate-like workpiece W reaches the target thickness. When the thickness measuring means 51 detects a crack in the plate workpiece W during grinding, the grinding operation is stopped and the operator is prompted to remove the plate workpiece W on the chuck table 21. As described above, when the plate-like workpiece W is cracked, the grinding process is immediately stopped. Therefore, the grinding is not continued in the state where the plate-like workpiece W is broken, and the grinding wheel 48 is further deteriorated. Nor. Therefore, since the deterioration of the grinding wheel 48 is suppressed, the subsequent plate-like workpiece W can be prevented from cracking.

一方で、研削加工中に板状ワークＷに割れが検出されない場合には、Ｚ３軸用の研削装置に搬入されて、Ｚ３軸加工（仕上げ研削加工）が実施される。Ｚ３軸加工では、チャックテーブル２１上で接触式の厚み測定装置６３で板状ワークＷが仕上げ研削される。このように、割れの無い板状ワークＷについてのみ後段の研削加工が行われる。Ｚ３軸加工では、Ｚ２軸加工よりも粒度の細かい研削砥石４８を用いて研削加工が実施される。また、本実施の形態では、板状ワークＷの厚みの測定と板状ワークＷの割れの検出を同時に実施する構成にしたが、板状ワークＷの厚みの測定中に、板状ワークＷの割れの検出を定期的に入れ込む構成にしてもよい。   On the other hand, when a crack is not detected in the plate-like workpiece W during the grinding process, it is carried into a Z3-axis grinding apparatus, and Z3-axis machining (finish grinding) is performed. In the Z3-axis machining, the plate-like workpiece W is finish-ground on the chuck table 21 by the contact-type thickness measuring device 63. In this way, the subsequent grinding process is performed only for the plate-like workpiece W having no cracks. In Z3-axis machining, grinding is performed using a grinding wheel 48 having a finer grain size than Z2-axis machining. Moreover, in this Embodiment, although it was set as the structure which implements the measurement of the thickness of the plate-shaped workpiece W, and the detection of the crack of the plate-shaped workpiece W simultaneously, You may make it the structure which inserts the detection of a crack regularly.

さらに、板状ワークＷのＺ２軸加工の終了後に板状ワークＷの割れを検出する構成にしてもよい。この場合、Ｚ２軸用の研削装置でＺ２軸加工後に続けて板状ワークＷの割れを検出してもよいし、図５Ｂに示すように、Ｚ３軸用の研削装置でＺ３軸加工前に板状ワークＷの割れを検出してもよい。この構成でも、板状ワークＷが割れた状態で後段のＺ３軸研削が実施されることがなく、研削砥石４８の劣化を抑えて、後続の板状ワークＷの割れを防止できる。なお、Ｚ２、Ｚ３軸加工のいずれかで板状ワークＷの割れを検出する構成に限らず、Ｚ１、Ｚ２、Ｚ３軸加工のすべてで板状ワークＷの割れを検出してもよい。Ｚ１軸加工においても割れが発生する場合があり、Ｚ１軸加工で板状ワークＷの外周縁にクラックが入り、Ｚ２軸研削中またはＺ３軸研削中に割れが発生することもある。このため、Ｚ１軸加工の研削装置についても割れ検出専用の光センサを取り付けるようにしてもよい。   Furthermore, it may be configured to detect a crack in the plate-like workpiece W after the Z2-axis machining of the plate-like workpiece W is completed. In this case, the crack of the plate-like workpiece W may be detected after the Z2 axis machining by the Z2 axis grinding apparatus, or the plate before the Z3 axis machining by the Z3 axis grinding apparatus as shown in FIG. 5B. A crack of the workpiece W may be detected. Even in this configuration, the subsequent Z3-axis grinding is not performed in a state where the plate-like workpiece W is cracked, and the deterioration of the grinding wheel 48 can be suppressed, and the subsequent plate-like workpiece W can be prevented from cracking. In addition, it is not restricted to the structure which detects the crack of the plate-shaped workpiece W in either Z2 or Z3-axis machining, You may detect the crack of the plate-shaped workpiece W in all of Z1, Z2, and Z3-axis machining. In Z1 axis machining, cracks may occur. In Z1 axis machining, cracks may enter the outer peripheral edge of the plate-like workpiece W, and cracks may occur during Z2 axis grinding or Z3 axis grinding. For this reason, you may make it attach the optical sensor only for a crack detection also about the grinding apparatus of Z1-axis processing.

以上のように、本実施の形態に係る研削装置１では、板状ワークＷに向けて測定光を照射して、反射光の受光量の変化から板状ワークＷの割れが判断される。研削加工を継続した状態で受光量の変化を監視するため、板状ワークＷの割れを即座に判断することができる。よって、板状ワークＷの割れを最小限に留めて、研削手段４１の研削砥石４８の劣化が進む前に研削加工を停止することができ、研削砥石４８の劣化や板状ワークＷの破損屑に起因した後続の板状ワークＷの割れを防止することができる。   As described above, in the grinding apparatus 1 according to the present embodiment, the measurement light is irradiated toward the plate-like workpiece W, and the crack of the plate-like workpiece W is determined from the change in the amount of reflected light received. Since the change in the amount of received light is monitored while grinding is continued, it is possible to immediately determine whether the plate-like workpiece W is cracked. Therefore, the crack of the plate-like workpiece W can be minimized, and the grinding process can be stopped before the grinding wheel 48 of the grinding means 41 deteriorates. It is possible to prevent the subsequent plate-like workpiece W from being cracked due to the above.

なお、本発明は上記実施の形態に限定されず、種々変更して実施することが可能である。上記実施の形態において、添付図面に図示されている大きさや形状などについては、これに限定されず、本発明の効果を発揮する範囲内で適宜変更することが可能である。その他、本発明の目的の範囲を逸脱しない限りにおいて適宜変更して実施することが可能である。   In addition, this invention is not limited to the said embodiment, It can change and implement variously. In the above-described embodiment, the size, shape, and the like illustrated in the accompanying drawings are not limited to this, and can be appropriately changed within a range in which the effect of the present invention is exhibited. In addition, various modifications can be made without departing from the scope of the object of the present invention.

例えば、上記した実施の形態においては、割れ検出手段として厚み検出手段を用いて板状ワークの割れを検出する構成にしたが、この構成には限定されない。割れ検出手段は、照射部から照射された測定光が板状ワークで反射した反射光を受光部で受光して、受光量から板状ワークの割れを検出可能な構成であれば、どのように構成されていてもよい。例えば、割れ検出手段は、板状ワークの割れ検出専用に構成された検出装置であってもよいし、図６に示すように、非接触式のハイトゲージ等の高さ測定手段７１で構成されてもよい。   For example, in the above-described embodiment, the thickness detection unit is used as the crack detection unit to detect a crack in the plate-like workpiece. However, the present invention is not limited to this configuration. If the crack detection means is configured to receive the reflected light reflected from the plate-shaped workpiece by the measurement light emitted from the irradiation section, and detect the crack of the plate-shaped workpiece from the amount of light received, how It may be configured. For example, the crack detection means may be a detection device configured exclusively for detection of cracks in a plate-like workpiece, or may be configured by a height measurement means 71 such as a non-contact type height gauge as shown in FIG. Also good.

高さ測定手段７１のヘッド内には、板状ワークＷの上面高さの測定基準となる参照反射面７６が設けられている。高さ測定手段７１は、ヘッド内の参照反射面７６からの反射光と板状ワークＷの上面８１からの反射光によって上面高さを測定するようにしている。高さ測定手段７１には、板状ワークＷの上方から測定光を照射する照射部７２と、測定光が板状ワークＷで反射した反射光を受光する受光部７３と、参照反射面７６からの反射光と板状ワークＷの上面８１からの反射光から板状ワークＷの上面高さを算出する高さ算出部７４が設けられている。   In the head of the height measuring means 71, a reference reflecting surface 76 is provided as a measurement standard for the upper surface height of the plate-like workpiece W. The height measuring means 71 measures the upper surface height by the reflected light from the reference reflecting surface 76 in the head and the reflected light from the upper surface 81 of the plate-like workpiece W. The height measuring means 71 includes an irradiation unit 72 that irradiates measurement light from above the plate-like workpiece W, a light receiving unit 73 that receives reflected light reflected by the plate-like workpiece W, and a reference reflection surface 76. A height calculation unit 74 is provided for calculating the upper surface height of the plate-like workpiece W from the reflected light of the plate-like workpiece W and the reflected light from the upper surface 81 of the plate-like workpiece W.

また、高さ算出部７４には、上記した厚み測定手段５１と同様に、受光部７３が受光する反射光の受光量から板状ワークＷの割れを判断する判断部７５が設けられている。判断部７５は、板状ワークＷの上面８１で反射した反射光の受光量が予め設定した許容範囲を超えた時に、板状ワークＷに割れが生じたと判断する。このような構成であっても、板状ワークＷの割れを即座に検出して、研削手段４１の研削砥石４８の劣化が進む前に研削加工を停止することができ、後続の板状ワークＷの割れを防止することができる。   In addition, the height calculation unit 74 is provided with a determination unit 75 that determines whether the plate-like workpiece W is cracked from the amount of reflected light received by the light receiving unit 73, as in the thickness measuring unit 51 described above. The determination unit 75 determines that a crack has occurred in the plate-like workpiece W when the amount of reflected light reflected by the upper surface 81 of the plate-like workpiece W exceeds a preset allowable range. Even with such a configuration, it is possible to immediately detect a crack in the plate-like workpiece W and stop the grinding process before the deterioration of the grinding wheel 48 of the grinding means 41 proceeds. Can be prevented.

また、上記した実施の形態においては、インフィード研削する際に板状ワークＷの割れを検出する構成について説明したが、クリープフィード研削する際に板状ワークＷの割れを検出することも可能である。   In the above-described embodiment, the configuration for detecting cracks in the plate-like workpiece W when performing in-feed grinding has been described. However, it is also possible to detect cracks in the plate-like workpiece W during creep-feed grinding. is there.

以上説明したように、本発明は、板状ワークの割れを最小限に留めて、研削砥石の劣化を抑制して後続の板状ワークの割れを防止することができるという効果を有し、特に、サファイア、炭化ケイ素等の硬質な板状ワークを研削する研削装置に有用である。   As described above, the present invention has the effect of minimizing the cracking of the plate-like workpiece, suppressing the deterioration of the grinding wheel, and preventing the subsequent plate-like workpiece from cracking. It is useful for a grinding apparatus for grinding a hard plate-like workpiece such as sapphire or silicon carbide.

１ 研削装置
２１ チャックテーブル
２２ 回転手段
４１ 研削手段
４６ 研削ホイール
４８ 研削砥石
５１ 厚み測定手段（割れ検出手段）
５２、７２ 照射部
５３、７３ 受光部
５４ 厚み算出部
５５、７５ 判断部
７１ 高さ測定手段（割れ検出手段）
７４ 高さ算出部
８１ 板状ワークの上面
８２ 板状ワークの下面
８３ 板状ワークの割れ
Ｗ 板状ワーク DESCRIPTION OF SYMBOLS 1 Grinding device 21 Chuck table 22 Rotating means 41 Grinding means 46 Grinding wheel 48 Grinding wheel 51 Thickness measuring means (crack detecting means)
52, 72 Irradiation unit 53, 73 Light receiving unit 54 Thickness calculation unit 55, 75 Judgment unit 71 Height measurement means (crack detection means)
74 Height calculator 81 Upper surface of plate workpiece 82 Lower surface of plate workpiece 83 Crack of plate workpiece W Plate workpiece

Claims (1)

板状ワークを保持するチャックテーブルと、該チャックテーブルを連続回転させる回転手段と、該チャックテーブルを該回転手段で連続回転させ保持する板状ワークを研削砥石で研削する研削手段と、を備えた研削装置であって、
該研削手段で研削される該チャックテーブルが保持する板状ワークの割れを検出する割れ検出手段を備え、
該割れ検出手段は、板状ワークの上方から板状ワークの上面に向って測定光を照射する照射部と、該照射部から照射される測定光が板状ワークの該上面で反射した反射光と板状ワークの下面で反射した反射光とを受光する受光部と、板状ワークの該上面及び該下面で反射した反射光から板状ワークの厚みを算出する厚み算出部と、該受光部が受光する該上面で反射した反射光または該下面で反射した反射光の受光量が予め設定した許容範囲を超えた時に割れと判断する判断部と、を備える研削装置。 A chuck table for holding a plate-shaped workpiece, a rotating means for continuously rotating the chuck table, and a grinding means for grinding the plate-shaped workpiece holding the chuck table by continuously rotating the chuck table with a grinding wheel. A grinding device,
A crack detecting means for detecting a crack in the plate-like workpiece held by the chuck table to be ground by the grinding means;
The crack detection means includes an irradiation unit that irradiates measurement light from above the plate-shaped workpiece toward the upper surface of the plate-shaped workpiece, and reflected light that is reflected by the upper surface of the plate-shaped workpiece. And a light receiving unit that receives the reflected light reflected from the lower surface of the plate-shaped workpiece, a thickness calculating unit that calculates the thickness of the plate-shaped workpiece from the reflected light reflected from the upper surface and the lower surface of the plate-shaped workpiece, and the light receiving unit And a judging unit that judges that the light is reflected when the reflected light reflected by the upper surface or the reflected light reflected by the lower surface exceeds a preset allowable range.
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