TWI760524B - 高度測定用治具 - Google Patents

高度測定用治具 Download PDF

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Publication number
TWI760524B
TWI760524B TW107123679A TW107123679A TWI760524B TW I760524 B TWI760524 B TW I760524B TW 107123679 A TW107123679 A TW 107123679A TW 107123679 A TW107123679 A TW 107123679A TW I760524 B TWI760524 B TW I760524B
Authority
TW
Taiwan
Prior art keywords
height
measuring
work
plate member
base
Prior art date
Application number
TW107123679A
Other languages
English (en)
Chinese (zh)
Other versions
TW201911401A (zh
Inventor
服部真人
Original Assignee
日商迪思科股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商迪思科股份有限公司 filed Critical 日商迪思科股份有限公司
Publication of TW201911401A publication Critical patent/TW201911401A/zh
Application granted granted Critical
Publication of TWI760524B publication Critical patent/TWI760524B/zh

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Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/0002—Arrangements for supporting, fixing or guiding the measuring instrument or the object to be measured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B47/00—Drives or gearings; Equipment therefor
    • B24B47/22—Equipment for exact control of the position of the grinding tool or work at the start of the grinding operation
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B49/00—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation
    • B24B49/02—Measuring or gauging equipment for controlling the feed movement of the grinding tool or work; Arrangements of indicating or measuring equipment, e.g. for indicating the start of the grinding operation according to the instantaneous size and required size of the workpiece acted upon, the measuring or gauging being continuous or intermittent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/04—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor involving a rotary work-table
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B5/00—Measuring arrangements characterised by the use of mechanical techniques
    • G01B5/02—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness
    • G01B5/06—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness
    • G01B5/061—Measuring arrangements characterised by the use of mechanical techniques for measuring length, width or thickness for measuring thickness height gauges

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Constituent Portions Of Griding Lathes, Driving, Sensing And Control (AREA)
  • Grinding Of Cylindrical And Plane Surfaces (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
TW107123679A 2017-08-08 2018-07-09 高度測定用治具 TWI760524B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2017-153169 2017-08-08
JP2017153169A JP6984969B2 (ja) 2017-08-08 2017-08-08 高さ測定用冶具

Publications (2)

Publication Number Publication Date
TW201911401A TW201911401A (zh) 2019-03-16
TWI760524B true TWI760524B (zh) 2022-04-11

Family

ID=65416578

Family Applications (1)

Application Number Title Priority Date Filing Date
TW107123679A TWI760524B (zh) 2017-08-08 2018-07-09 高度測定用治具

Country Status (4)

Country Link
JP (1) JP6984969B2 (ko)
KR (1) KR102427972B1 (ko)
CN (1) CN109382762B (ko)
TW (1) TWI760524B (ko)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP7503938B2 (ja) 2020-06-04 2024-06-21 株式会社ディスコ 保持面の検査方法
CN113770913B (zh) * 2021-10-28 2022-11-04 华海清科股份有限公司 一种吸盘转台和加工***

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11123655A (ja) * 1997-10-21 1999-05-11 Nec Yamagata Ltd 半導体装置の製造装置および製造方法
US20040128849A1 (en) * 2003-01-08 2004-07-08 Navarro Joseph R. Spindle squaring device and method of operation
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6114303U (ja) * 1984-06-29 1986-01-28 日本ラインツ株式会社 シリンダヘツドガスケツトの厚さ測定用補助プレ−ト
JP4763478B2 (ja) 2006-02-23 2011-08-31 株式会社ディスコ 研削装置
DE102013108242A1 (de) * 2013-08-01 2015-02-19 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Schichtdickenmessgerät
CN204555868U (zh) * 2015-04-02 2015-08-12 闻泰通讯股份有限公司 手机壳体周孔检测治具
CN205580335U (zh) * 2016-03-14 2016-09-14 重庆市力波机械制造有限公司 惰齿轮尺寸检测的辅具
JP2018083266A (ja) * 2016-11-25 2018-05-31 株式会社ディスコ 研削装置及び粗さ測定方法

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH11123655A (ja) * 1997-10-21 1999-05-11 Nec Yamagata Ltd 半導体装置の製造装置および製造方法
US20040128849A1 (en) * 2003-01-08 2004-07-08 Navarro Joseph R. Spindle squaring device and method of operation
JP2013141725A (ja) * 2012-01-11 2013-07-22 Disco Corp 研削装置

Also Published As

Publication number Publication date
CN109382762A (zh) 2019-02-26
KR20190016440A (ko) 2019-02-18
JP2019030932A (ja) 2019-02-28
CN109382762B (zh) 2021-11-30
JP6984969B2 (ja) 2021-12-22
TW201911401A (zh) 2019-03-16
KR102427972B1 (ko) 2022-08-02

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