TWI745398B - 玻璃基板之時間差分斷方法 - Google Patents

玻璃基板之時間差分斷方法 Download PDF

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Publication number
TWI745398B
TWI745398B TW106123516A TW106123516A TWI745398B TW I745398 B TWI745398 B TW I745398B TW 106123516 A TW106123516 A TW 106123516A TW 106123516 A TW106123516 A TW 106123516A TW I745398 B TWI745398 B TW I745398B
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TW
Taiwan
Prior art keywords
glass substrate
suction
stage
adsorption
area
Prior art date
Application number
TW106123516A
Other languages
English (en)
Chinese (zh)
Other versions
TW201805252A (zh
Inventor
趙漢準
Original Assignee
日商三星鑽石工業股份有限公司
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日商三星鑽石工業股份有限公司 filed Critical 日商三星鑽石工業股份有限公司
Publication of TW201805252A publication Critical patent/TW201805252A/zh
Application granted granted Critical
Publication of TWI745398B publication Critical patent/TWI745398B/zh

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Classifications

    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/0222—Scoring using a focussed radiation beam, e.g. laser
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/033—Apparatus for opening score lines in glass sheets
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/22—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by cutting, e.g. incising
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D5/00—Fine working of gems, jewels, crystals, e.g. of semiconductor material; apparatus or devices therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D7/00—Accessories specially adapted for use with machines or devices of the preceding groups
    • B28D7/04—Accessories specially adapted for use with machines or devices of the preceding groups for supporting or holding work or conveying or discharging work
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/03—Glass cutting tables; Apparatus for transporting or handling sheet glass during the cutting or breaking operations
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/02—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor
    • C03B33/023—Cutting or splitting sheet glass or ribbons; Apparatus or machines therefor the sheet or ribbon being in a horizontal position
    • C03B33/037—Controlling or regulating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
TW106123516A 2016-08-05 2017-07-13 玻璃基板之時間差分斷方法 TWI745398B (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
KR10-2016-0099917 2016-08-05
??10-2016-0099917 2016-08-05
KR1020160099917A KR101826235B1 (ko) 2016-08-05 2016-08-05 글래스기판 시간차 분단방법

Publications (2)

Publication Number Publication Date
TW201805252A TW201805252A (zh) 2018-02-16
TWI745398B true TWI745398B (zh) 2021-11-11

Family

ID=61153109

Family Applications (1)

Application Number Title Priority Date Filing Date
TW106123516A TWI745398B (zh) 2016-08-05 2017-07-13 玻璃基板之時間差分斷方法

Country Status (4)

Country Link
JP (1) JP6864354B2 (ja)
KR (1) KR101826235B1 (ja)
CN (1) CN107686232B (ja)
TW (1) TWI745398B (ja)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109437536B (zh) * 2018-11-30 2021-01-15 武汉华星光电技术有限公司 切割裂片装置及切割裂片方法
CN112858326B (zh) * 2019-11-28 2024-06-07 英泰克普拉斯有限公司 柔性显示器检查装置及利用此的柔性显示器检查方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4902631B2 (ja) * 2001-06-28 2012-03-21 三星ダイヤモンド工業株式会社 ブレイク装置、ブレイク方法及びマザー貼合基板の分断システム
JP2012092010A (ja) * 2011-11-10 2012-05-17 Semiconductor Energy Lab Co Ltd ガラス加工装置
TW201623170A (zh) * 2014-12-02 2016-07-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法及加工裝置

Family Cites Families (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3031384B2 (ja) * 1991-03-08 2000-04-10 旭硝子株式会社 硝子板の切断方法及びその装置
JP2001206728A (ja) * 2000-01-21 2001-07-31 Nakamura Tome Precision Ind Co Ltd ガラス基板のブレーク装置
KR100978259B1 (ko) * 2005-06-20 2010-08-26 엘지디스플레이 주식회사 액정패널 절단시스템 및 이를 이용한 액정표시소자제조방법
JP2008094666A (ja) * 2006-10-12 2008-04-24 Seiko Epson Corp 吸着テーブルおよびこれを備えたブレイク装置
JP2010232603A (ja) * 2009-03-30 2010-10-14 Mitsuboshi Diamond Industrial Co Ltd 基板固定装置
KR20120107722A (ko) * 2011-03-22 2012-10-04 삼성디스플레이 주식회사 기판 절단 장치 및 그것을 이용한 기판 절단 방법
JP5437333B2 (ja) * 2011-08-30 2014-03-12 三星ダイヤモンド工業株式会社 ガラス基板のスクライブ方法及び加工装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4902631B2 (ja) * 2001-06-28 2012-03-21 三星ダイヤモンド工業株式会社 ブレイク装置、ブレイク方法及びマザー貼合基板の分断システム
JP2012092010A (ja) * 2011-11-10 2012-05-17 Semiconductor Energy Lab Co Ltd ガラス加工装置
TW201623170A (zh) * 2014-12-02 2016-07-01 Mitsuboshi Diamond Ind Co Ltd 脆性材料基板之分斷方法及加工裝置

Also Published As

Publication number Publication date
CN107686232B (zh) 2021-12-03
JP6864354B2 (ja) 2021-04-28
CN107686232A (zh) 2018-02-13
KR101826235B1 (ko) 2018-02-06
JP2018020954A (ja) 2018-02-08
TW201805252A (zh) 2018-02-16

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