TWI744817B - 導電粉末及包括該導電粉末之測試用連接器 - Google Patents

導電粉末及包括該導電粉末之測試用連接器 Download PDF

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Publication number
TWI744817B
TWI744817B TW109107608A TW109107608A TWI744817B TW I744817 B TWI744817 B TW I744817B TW 109107608 A TW109107608 A TW 109107608A TW 109107608 A TW109107608 A TW 109107608A TW I744817 B TWI744817 B TW I744817B
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TW
Taiwan
Prior art keywords
conductive
polymer layer
conductive powder
particles
present
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TW109107608A
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English (en)
Chinese (zh)
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TW202040593A (zh
Inventor
鄭永倍
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韓商Ｉｓｃ 股份有限公司
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/20—Conductive material dispersed in non-conductive organic material
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/10—Metal compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L53/00—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers
    • C08L53/02—Compositions of block copolymers containing at least one sequence of a polymer obtained by reactions only involving carbon-to-carbon unsaturated bonds; Compositions of derivatives of such polymers of vinyl-aromatic monomers and conjugated dienes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B1/00—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors
    • H01B1/02—Conductors or conductive bodies characterised by the conductive materials; Selection of materials as conductors mainly consisting of metals or alloys
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/44—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins
    • H01B3/442—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes vinyl resins; acrylic resins from aromatic vinyl compounds
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/01—Magnetic additives

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  • Chemical & Material Sciences (AREA)
  • Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Health & Medical Sciences (AREA)
  • Dispersion Chemistry (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Non-Insulated Conductors (AREA)
  • Conductive Materials (AREA)
TW109107608A 2019-03-21 2020-03-09 導電粉末及包括該導電粉末之測試用連接器 TWI744817B (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020190032568A KR102113732B1 (ko) 2019-03-21 2019-03-21 도전성 분말 및 이를 포함하는 검사용 커넥터
KR10-2019-0032568 2019-03-21

Publications (2)

Publication Number Publication Date
TW202040593A TW202040593A (zh) 2020-11-01
TWI744817B true TWI744817B (zh) 2021-11-01

Family

ID=70910254

Family Applications (1)

Application Number Title Priority Date Filing Date
TW109107608A TWI744817B (zh) 2019-03-21 2020-03-09 導電粉末及包括該導電粉末之測試用連接器

Country Status (3)

Country Link
KR (1) KR102113732B1 (ko)
TW (1) TWI744817B (ko)
WO (1) WO2020189901A1 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11128072B1 (en) 2020-07-22 2021-09-21 TE Connectivity Services Gmbh Electrical connector assembly having variable height contacts
US11509080B2 (en) 2020-07-22 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11509084B2 (en) 2020-07-24 2022-11-22 Te Connectivity Solutions Gmbh Electrical connector assembly having hybrid conductive polymer contacts
US11894629B2 (en) 2021-03-09 2024-02-06 Tyco Electronics Japan G.K. Electrical interconnect with conductive polymer contacts having tips with different shapes and sizes
KR102635465B1 (ko) * 2021-12-31 2024-02-13 주식회사 아이에스시 도전성 입자 및 이를 포함하는 검사용 커넥터

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201028498A (en) * 2008-09-25 2010-08-01 Ube Nitto Kasei Co Conductive particles and method for forming metal film
TW201344703A (zh) * 2012-03-06 2013-11-01 Toyo Ink Sc Holdings Co Ltd 導電性微粒及其製造方法、導電性樹脂組成物、導電性薄片、以及電磁波屏蔽薄片
KR20160134311A (ko) * 2015-05-15 2016-11-23 주식회사 아이에스시 이방 도전성 시트
KR20170025996A (ko) * 2015-08-31 2017-03-08 삼성전자주식회사 이방성 도전 재료와 이방성 도전 재료를 포함하는 전자소자 및 그 제조방법
TW201743341A (zh) * 2016-05-11 2017-12-16 Isc股份有限公司 測試插座以及導電顆粒
TW201826290A (zh) * 2016-05-11 2018-07-16 Isc股份有限公司 測試插座以及導電顆粒

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100889256B1 (ko) * 2007-11-07 2009-03-19 주식회사 라이온켐텍 코어 쉘 구조로 이루어진 레이저 소결용 메탈 고분자복합분말 및 이의 제조방법
KR101148143B1 (ko) * 2008-12-17 2012-05-23 제일모직주식회사 절연 전도성 입자 및 이를 포함하는 이방 전도성 필름용 조성물
JP6523794B2 (ja) * 2014-06-06 2019-06-05 積水化学工業株式会社 導電材料及び接続構造体
JPWO2017179532A1 (ja) 2016-04-12 2019-02-14 積水化学工業株式会社 導電材料及び接続構造体

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW201028498A (en) * 2008-09-25 2010-08-01 Ube Nitto Kasei Co Conductive particles and method for forming metal film
TW201344703A (zh) * 2012-03-06 2013-11-01 Toyo Ink Sc Holdings Co Ltd 導電性微粒及其製造方法、導電性樹脂組成物、導電性薄片、以及電磁波屏蔽薄片
KR20160134311A (ko) * 2015-05-15 2016-11-23 주식회사 아이에스시 이방 도전성 시트
KR20170025996A (ko) * 2015-08-31 2017-03-08 삼성전자주식회사 이방성 도전 재료와 이방성 도전 재료를 포함하는 전자소자 및 그 제조방법
TW201743341A (zh) * 2016-05-11 2017-12-16 Isc股份有限公司 測試插座以及導電顆粒
TW201826290A (zh) * 2016-05-11 2018-07-16 Isc股份有限公司 測試插座以及導電顆粒

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Publication number Publication date
TW202040593A (zh) 2020-11-01
WO2020189901A1 (ko) 2020-09-24
KR102113732B1 (ko) 2020-05-21

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